TWI416993B - Alternate current light emitting diode module and light source apparatus using the same and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an AC light-emitting diode module containing a substrate and two or more light emitting diodes. <P>SOLUTION: The substrate includes two or more circular recessed grooves arranged in matrix on the surface thereof, and further the substrate has wire structure of a bridge rectifier circuit. Two or more electric connection points in the wire structure are installed inside the circular recessed grooves according to the matrix arrangement. Each light emitting diode is welded to the electric connection point of the wire structure, respectively to complete the connection of the bridge rectifier circuit. In this way, while receiving AC, the bridge rectifier circuit performs function of emitting light by changing AC into DC through the light emitting diode. Then, the purpose of reducing the number of manufacturing steps and raising a yield of product is achieved. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

AC light emitting diode module and light source device thereof and manufacturing method thereof

The invention relates to a light-emitting diode module, in particular to an AC light-emitting diode module and a light source device and a manufacturing method thereof, which are manufactured under a module packaging process.

In recent years, due to the rapid growth of light-emitting diodes, the related application design has gradually expanded. In addition, the light-emitting diodes have the advantages of small size, power saving, and easy design. Therefore, in various industries, the LEDs have been integrated as a function of indication or illumination.

As we all know, the light-emitting diode can only be unidirectionally conductive, that is, it can only be driven by direct current. Therefore, when applied to various products, it is necessary to additionally design an AC-to-DC rectifier circuit on the circuit board, or additionally through an external rectifier to achieve the rectification effect. However, this will not only increase the cost of the product, but also reduce the volume of the product as a whole.

Therefore, the current conventional technology has proposed the design of an alternating current light emitting diode, which is packaged after the wafer processing stage is completed. In the process of wafer fabrication, it is necessary to combine the design of the rectifier circuit, and collect dozens of LEDs together, and finally cut the wafer according to the brightness requirement, and then package it to make it. Alternating current LEDs.

However, since the forward voltage drop of the light-emitting diode affects the yield, if all the light-emitting diode grains are clustered and integrated in order to complete the wafer process, only one of the light-emitting diode grains is generated. The problem will cause the whole cluster to be bad. Therefore, for a wafer process that can be mass-produced, the risk of manufacturing will be increased, and the yield of the product will be lowered.

In view of the above, the technical problem to be solved by the present invention is that the entire process is implemented in the module packaging stage of the LED module, so that the LEDs can be wire-bonded after the screening is completed, and then The simple architecture of the invention is designed to greatly reduce the production process and effectively improve the yield of the product.

In order to achieve the above object, according to one aspect of the present invention, an AC LED module includes: a substrate and a plurality of LEDs. Wherein, an upper surface of the substrate has a plurality of circular grooves arranged in a matrix arrangement, and the substrate further has a wire structure of a bridge rectifier circuit, and the plurality of electrical contacts of the wire structure are respectively The circular grooves are arranged corresponding to the matrix arrangement. The light emitting diode systems are respectively soldered to the electrical contacts of the wire structure to complete the connection of the bridge rectifier circuit. Thereby, the bridge rectifier circuit receives the alternating current, and transmits the alternating current to the direct current and the illuminating effect through the light emitting diodes.

In order to achieve the above object, according to another aspect of the present invention, a light source device includes: a circuit board, a power connector, and a plurality of alternating current illuminating diode modules provided by the foregoing solutions. Wherein, the power connector is connected to the circuit board and is used for receiving an alternating current, and the alternating current light emitting diode module is disposed on the circuit board and connected to the power connector to receive the alternating current for illumination.

In order to achieve the above object, according to still another aspect of the present invention, a method for manufacturing an alternating current light emitting diode module is provided as a module packaging process, and the steps of the manufacturing method include: first, through a substrate processing method Integrating a wire structure of a bridge rectifier circuit to form a substrate, wherein an upper surface of the substrate has a plurality of circular grooves arranged in a matrix, and the plurality of wire structures of the bridge rectifier circuit The electrical contacts are respectively disposed in the circular grooves. Then, a plurality of light-emitting diodes are respectively adhered to the circular grooves on the upper surface, and the electrical contacts of the light-emitting diodes in the circular grooves are respectively soldered to make the bridge The rectifier circuit completes the connection. Finally, a coating is applied to the upper surface of the substrate to fill the circular grooves.

The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings.

The AC LED module of the present invention is mainly designed through a simple module architecture to complete the integrated LED and rectifier circuit during the module packaging process, instead of using a wafer process, that is, It is not implemented in an integrated circuit or semiconductor process architecture. In order to reduce production risks and increase production yield.

Please refer to the first figure at the same time, which is a perspective view of an embodiment of the alternating current light emitting diode module of the present invention. As shown in the figure, the embodiment provides an AC LED module 1 that directly receives an AC power as a power source for driving. The AC LED module 1 includes a substrate 11 and a plurality of LEDs 12 . Wherein, an upper surface 111 of the substrate 11 has a plurality of circular grooves 1110, and all of the circular grooves 1110 are arranged in a matrix arrangement. In addition, when the substrate 11 is formed, a wire structure (not shown) of a bridge rectifier circuit is integrated, and a plurality of electrical contacts (not shown) of the wire structure are exposed on the upper surface 111 of the substrate 11. And arranged in the circular grooves 1110 corresponding to the matrix arrangement, respectively, as a joint for wire bonding. Those skilled in the art should be able to understand that the wire structure corresponding to each of the circular grooves 1110 is provided with two electrical contacts (electrode (+) and electrode (-)). The substrate 11 may be, for example, a ceramic substrate, a glass substrate, an epoxy substrate (FR-4), or a BT substrate.

The light-emitting diodes 12 are respectively soldered to the electrical contacts of the wire structure, so that the bridge rectifier circuit can complete the connection and function of the bridge rectifier circuit after the wire-bonding of the light-emitting diode 12 is completed. It should be noted that the LED 12 can be soldered to the electrical connection of the wire structure through a bonding wire, or can be soldered to the wire by Flip-Chip Bonding. The electrical contacts of the architecture are not limited here. In this way, the bridge rectifier circuit in the AC LED module 1 can realize the simultaneous conversion of AC to DC and the illumination by the LEDs 12 .

It should be noted that, in the actual design of the bridge rectifier circuit described in this embodiment, it is preferably designed, for example, as a full-wave rectifier circuit, and the bridge rectifier circuit calculates the design according to the size of the received AC power. In order to determine the required number of light-emitting diodes 12, the wire structure can be designed and connected. Among them, in terms of the number of the light-emitting diodes 12, the current experimentally preferred data is that 30 to 100 light-emitting diodes 12 are designed on the substrate 11 per square centimeter. In other words, the density of the circular groove 1110 formed on the substrate 11 is 30 to 100 per square centimeter.

Please refer to the second figure again, which is a circuit diagram of the first embodiment of the bridge rectifier circuit of the present invention. As shown, the bridge rectifier circuit 112 includes a four-arm circuit 1121 and a load circuit 1122 when designed as a full-wave rectifier circuit. Moreover, the bridge rectifier circuit 112 completely rectifies and emits light through the light-emitting diode 12. Wherein, the electrical contacts of the four-arm circuit 1121 are respectively soldered with a first light-emitting diode group LED 1, a second light-emitting diode group LED 2, a third light-emitting diode group LED3 and a fourth light-emitting diode. Body group LED4. The electrical contact of the load circuit 1122 is soldered with a fifth LED group LED5.

It is assumed that the present embodiment is for receiving 110 volts, 60 Hz alternating current, so that the first light emitting diode group LED1 to the fourth light emitting diode group LED4 soldered on the four arm circuit 1121 are respectively designed and calculated as 14 LEDs 12, and the fifth LED group 5 soldered to the load circuit 1122 is designed as 16 LEDs 12 for a total of 72 LEDs 12.

Therefore, when the bridge rectifier circuit 112 operates in the positive half-pass, the first LED group LED1, the fifth LED group LED5, and the third LED group LED3 are driven to be lit, thereby 44 light-emitting diodes 12 will operate to generate a light source; conversely, when the bridge rectifier circuit 112 operates in a negative half cycle, it is a second light-emitting diode group LED 2, a fifth light-emitting diode group LED 5 and a fourth The LED group 4 of the LED group is driven to illuminate, and similarly, 44 LEDs 12 operate to generate a light source.

Therefore, with the AC LED module 1 of the bridge rectifier circuit 112 provided in this embodiment, the utilization ratio of the LED 12 during operation is 44/72=61%.

Please refer to the third figure again, which is a schematic circuit diagram of a second embodiment of the bridge rectifier circuit of the present invention. As shown, the present embodiment is substantially the same in design as the first embodiment. The main difference is that the load circuit 1122 in the bridge rectifier circuit 112 is further designed in parallel, that is, the electrical contact of the load circuit 1122 is soldered with a fifth one of the LED groups 5 -1 and a fifth bis LED group 5-2.

However, if it is assumed that 110 volts, 60 Hz alternating current is received, the first light emitting diode group LED1 to the fourth light emitting diode group LED4 soldered on the four arm circuit 1121 are respectively designed to be 13 after calculation. The light emitting diode 12, and the fifth one of the light emitting diode group LED 5-1 and the fifth one of the light emitting diode group LEDs 5-2 soldered on the load circuit 1122 are respectively designed as 14 light emitting diodes 12 There are a total of 80 light-emitting diodes 12.

Therefore, when the bridge rectifier circuit 112 operates in the positive half cycle, the first light emitting diode group LED1, the fifth two light emitting diode group LED 5-2, and the third light emitting diode group LED3 are driven to be driven. Bright, so that 50 LEDs 12 will operate to generate a light source; conversely, when the bridge rectifier circuit 112 operates in the negative half cycle, it is the second LED group 2 and the fifth one. The polar body group LED 5-1 and the fourth light emitting diode group LED 4 are driven to illuminate, and similarly, 50 light emitting diodes 12 operate to generate a light source.

Therefore, with the AC LED module 1 of the bridge rectifier circuit 112 provided in this embodiment, the utilization ratio of the LED 12 during operation is 50/80=67.5%.

Please refer to FIG. 4A again, which is a circuit diagram of a third embodiment of the bridge rectifier circuit of the present invention. As shown in the figure, this embodiment is used to indicate that the AC LED module 1 can further include four rectifying diodes D1 to D4, and cooperate with the LEDs 12 to achieve rectification and illumination. The four rectifier diodes D1 to D4 are respectively soldered to the electrical contacts of the four-arm circuit 1121 of the bridge rectifier circuit 112, and the first LED group LED1 composed of the LEDs 12 is The forward series is soldered to the electrical contacts of the load circuit 1122.

Since the main rectification operation is performed by the rectifying diodes D1 to D4 in this embodiment, the first LED group LED1 is soldered to the load circuit 1122. Therefore, regardless of whether the bridge rectifier circuit 112 operates in the positive half cycle or the negative half cycle, the first light emitting diode group LED1 will be in a constant light state. Therefore, with the AC LED module 1 of the bridge rectifier circuit 112 provided in this embodiment, the utilization ratio of the LED 12 during operation is 100%.

In addition, please refer to FIG. 4B for a matrix arrangement diagram corresponding to the bridge rectifier circuit of the third embodiment. This embodiment is used to illustrate one of the circuit connections designed by the bridge rectifier circuit 112 under the matrix arrangement formed by the circular recess 1110 of the substrate 11. As shown in the figure, the rectifying diodes D1 to D4 corresponding to the fourth A diagram are connected to the four-arm circuit 1121 of the bridge rectifier circuit 112, respectively. All of the LEDs 12 are connected in series to the load circuit 1122 of the bridge rectifier circuit 112, that is, connected in series between the electrodes (+) and the electrodes (-) to form a matrix-shaped arrangement.

In the embodiment mentioned above, since the forward voltage drop of the actual light-emitting diode 12 is different, the wire structure of the bridge rectifier circuit 112 designed therein and the light-emitting diode used therein The number of bodies 12 may vary depending on the amount of AC power received during actual design. The above description is not intended to limit the invention.

In order to explain the architectural composition of the AC LED module 1 of the present invention, it is further described by its manufacturing method. Please refer to the fifth figure, which is a flow chart of an embodiment of a method for manufacturing an alternating current illuminating diode module according to the present invention. As shown in the figure, the embodiment provides a method for manufacturing an AC LED module 1. The steps include: first, designing a bridge rectifier according to the size of the AC power required to be received and the characteristics of the LED 12 The circuit 112 (S501) further integrates the wire structure of the bridge rectifier circuit 112 through the substrate processing method to form the substrate 11 (S503). After the substrate 11 is formed, the upper surface 111 of the substrate 11 is formed by a plurality of circular grooves 1110 corresponding to the wire structure of the integrated bridge rectifier circuit 112, and arranged in a matrix arrangement, and the bridge rectifier circuit 112 The electrical contacts of the wire structure are respectively disposed in the circular grooves 1110.

Then, the LEDs 12 are respectively adhered to the circular recesses 1110 on the upper surface 111, and the electrical contacts of the LEDs 12 in the circular recesses 1110 are respectively soldered (S505), so that The bridge rectifier circuit 112 completes the connection. In addition, if the utilization ratio of the overall light-emitting diode 12 is to be better, and the rectification effect of the bridge rectifier circuit 112 is better, the LED diode 12 can be further combined to perform the adhesion rectification diode in the bridge rectifier. The circular recess 1110 corresponding to the four-arm circuit 1121 of the circuit 112 is electrically connected to the electrical contact in the circular recess 1110 (S507). Finally, a colloid is applied on the upper surface 111 of the substrate 11 (S509) to fill all the circular grooves 1110, thereby completing the fabrication of the AC LED module 1. Wherein, the above-mentioned colloid is designed to be, for example, a transparent colloid or a colloid (for white light emitting diode) which is blended with phosphor powder, and the colloid is made of a curable polymer or an epoxy resin. Epoxy) and one of silicone (Silicone).

In order to further illustrate the practical application of the AC LED module 1 of the present invention, please refer to the sixth figure for a schematic diagram of an embodiment of the light source device of the present invention. As shown in the figure, a light source device 2 provided in this embodiment belongs to a light bulb, that is, the light source device 2 designed in the embodiment is a light bulb with the light emitting diode 12 as a light source.

The light source device 2 includes a circuit board 201, a power connector 202, and a plurality of AC LED modules 1. The circuit board 201 can be further connected to a heat sink (not shown) for dissipating heat through the heat sink. The power connector 202 is connected to the circuit board 201 and is used to be plugged into a light bulb holder (not shown) to receive an alternating current. The AC LED module 1 is soldered to the circuit board 201 and is used to receive AC power to directly perform an AC to DC conversion operation and to emit light.

In addition, the actual aspect of the light source device 2 is not limited to the bulb, and may be designed as a lamp tube of different lengths according to the requirements of the use, and is not limited herein.

In summary, the present invention can realize the process of the entire AC light-emitting diode module in the module packaging stage, so that the light-emitting diodes used therein can be wire-bonded after the screening is completed, and then borrowed. The simple architecture of the present invention is designed to greatly reduce the production process and effectively increase the yield of the product.

However, the above description is only for the purpose of illustration and illustration of the embodiments of the present invention, and is not intended to limit the scope of the invention. Variations or modifications that may be readily conceived within the scope of the invention may be covered by the scope of the invention as defined in the following.

1. . . AC light emitting diode module

11. . . Substrate

111. . . Upper surface

1110. . . Circular groove

112. . . Bridge rectifier circuit

1121. . . Four arm circuit

1122. . . Load circuit

12. . . Light-emitting diode

2. . . Light source device

201. . . Circuit board

202. . . Power connector

D1, D2, D3, D4. . . Rectifier diode

LED1. . . First light emitting diode group

LED2. . . Second light emitting diode group

LED3. . . Third light-emitting diode group

LED4. . . Fourth LED group

LED5. . . Fifth light-emitting diode group

LED5-1. . . The fifth one of the light-emitting diode groups

LED5-2. . . Fifth bis light-emitting diode group

The first figure is a perspective view of an embodiment of an alternating current light emitting diode module of the present invention;

2 is a circuit diagram of a first embodiment of a bridge rectifier circuit of the present invention;

The third figure is a circuit diagram of a second embodiment of the bridge rectifier circuit of the present invention;

4A is a circuit diagram of a third embodiment of the bridge rectifier circuit of the present invention;

4B is a schematic diagram of a matrix arrangement of a bridge rectifier circuit according to a third embodiment of the present invention;

FIG. 5 is a flow chart of an embodiment of a method for manufacturing an alternating current light emitting diode module of the present invention; and

Figure 6 is a schematic view of an embodiment of a light source device of the present invention.

1. . . AC light emitting diode module

11. . . Substrate

111. . . Upper surface

1110. . . Circular groove

12. . . Light-emitting diode

Claims (19)

An AC OLED module includes: a substrate having an upper surface having a plurality of circular grooves arranged in a matrix, and the substrate having a wire structure of a bridge rectifier circuit, and a plurality of electrical contacts of the wire structure are respectively arranged in the circular grooves corresponding to the matrix arrangement; and a plurality of light emitting diodes are respectively soldered to the electrical contacts of the wire structure to make the bridge The rectifier circuit completes the connection; each of the circular grooves is further filled with a colloid, and the glue system is a transparent colloid or a colloid of phosphor powder; whereby the bridge rectifier circuit receives AC power, and Through the light-emitting diodes, the conversion of AC to DC and the function of illumination are achieved. The AC LED module of claim 1, wherein the bridge rectifier circuit is a full-wave rectifier circuit and is designed according to the size of the received AC power. The AC LED module of claim 2, wherein the full-wave rectifier circuit comprises a four-arm circuit and a load circuit. The alternating current light emitting diode module according to claim 3, wherein the load circuit is designed in a parallel manner. The AC LED module of claim 3, wherein the AC LED module further includes four rectifying diodes for soldering the wires to the LEDs. The electrical contacts of the architecture. The AC LED module of claim 5, wherein the four rectifying diode systems are respectively soldered to electrical contacts of the four-arm circuit of the full-wave rectifying circuit, and the two-pole system is The electrical contacts of the load circuit of the full-wave rectifier circuit are serially serially soldered. The alternating current light emitting diode module according to claim 1, wherein the substrate is a ceramic substrate, a glass substrate, an epoxy substrate or a BT substrate. The alternating current light emitting diode module of claim 1, wherein the circular grooves are formed on the substrate in a density of 30 to 100 per square centimeter. The ac diode module of claim 1, wherein the illuminating two-pole system is soldered to the electrical contact of the wire structure through a bonding wire. The alternating current light emitting diode module of claim 1, wherein the light emitting diode systems are soldered to the electrical contacts of the wire structure by using a flip chip assembly technique. The alternating current illuminating diode module according to claim 1, wherein the adhesive system uses one of a polymer glue, an epoxy resin and a silicone rubber. A light source device comprising: a circuit board; a power connector connected to the circuit board and configured to receive an alternating current; And a plurality of alternating current light emitting diode modules as described in claim 1 are disposed on the circuit board and connected to the power connector to receive the alternating current for illumination. A method for manufacturing an alternating current light emitting diode module according to claim 1 is a module packaging process, the method comprising the steps of: integrating the bridge rectifier circuit through a substrate processing method; a wire structure for forming the substrate; bonding the light-emitting diodes to the circular grooves, and wire-welding the electrical contacts of the light-emitting diodes in the circular grooves, respectively The bridge rectifier circuit completes the connection; and applies a colloid on the upper surface of the substrate to fill the circular grooves. The method for manufacturing an alternating current light emitting diode module according to claim 13, wherein the bridge rectifier circuit is a full wave rectifier circuit and is designed according to the size of the received alternating current. The method of manufacturing an alternating current light emitting diode module according to claim 14, wherein the full wave rectifier circuit comprises a four arm circuit and a load circuit. The method for manufacturing an alternating current light emitting diode module according to claim 15, wherein the manufacturing method further comprises: providing four rectifying diodes for wire bonding to the electric circuit of the four arm circuit of the bridge rectifier circuit contact. The method of manufacturing an alternating current light emitting diode module according to claim 13, wherein the substrate is a ceramic substrate, a glass substrate, an epoxy substrate or a BT substrate. The method for manufacturing an alternating current light emitting diode module according to claim 13, wherein the glue system is a colloid of a transparent colloid or a blend of phosphor powder. The method for manufacturing an alternating current light emitting diode module according to claim 13, wherein the glue system uses one of a polymer glue, an epoxy resin and a silicone rubber.