TWI409588B - Photo-sensitivity resin composition - Google Patents

Abstract

A photo-sensitivity resin composition is provided. The photo-sensitivity resin composition includes (A) polymer having three or more blocks, where the blocks are polymerized by following monomers: (a1) 0.1% to 10% of ethylenically unsaturated monomer of phosphoric acid having an unsaturated reactive group at one side or two sides, (a2) ethylenically unsaturated monomer containing acid group and (a3) ethylenically unsaturated monomer except (a1) and (a2); (B) compound having at least one ethylenically unsaturated double bond; (C) organic acid anhydride; (D) photopolymerization initiator; and (E) organic solvent.

Description

Photosensitive resin composition

The present invention relates to a photo-sensitivity resin composition, and more particularly to a photosensitive resin composition having good metal adhesion and high hardness.

In order to achieve more convenience, lighter weight and more humane purposes, many information products have been converted from traditional keyboards or mice to devices that use touch devices as input. The touch device can be assembled on a wide variety of flat-panel displays, so that the flat-panel display has both a display screen and input operation information. For the current common touch devices, capacitive touch panels and resistive touch panels are the most popular.

In a general touch panel process, a photosensitive resin composition (photoresist) is generally used as a dielectric layer between metal electrodes or a protective layer covering a metal electrode. Therefore, the above-mentioned photosensitive resin composition must have good metal adhesion and high hardness to avoid the problem of scratching and peeling during the process. However, the photosensitive resin composition generally used as a dielectric layer or a protective layer does not have good metal adhesion, and is often scratched due to insufficient hardness in the process, thereby causing a problem of low yield.

The present invention provides a photosensitive resin composition which has good metal adhesion and high hardness.

The present invention provides a photosensitive resin composition comprising (A) a polymer having three or more blocks, and these copolymer blocks are polymerized from the following monomers: (a1) 0.1% to 10 One or two sides of the ethylenically unsaturated monomer having a phosphoric acid which does not saturate the reactive functional group, (a2) an ethylenically unsaturated monomer having an acid group, and (a3) except for (a1) and (a2) An ethylenically unsaturated monomer; (B) a compound having at least one ethylenically unsaturated double bond; (C) an organic acid anhydride; (D) a photopolymerization initiator; (E) an organic solvent.

According to the photosensitive resin composition of the embodiment of the invention, the above (a1) is represented by the formula (1), for example.

Wherein R ₁ is H or CH ₃ ; x≧1; m+n=3, and m and n are not zero.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (A) is, for example, between 10% by weight and 40% by weight based on the total weight of the photosensitive resin composition.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (a1) is, for example, 0.1 parts by weight to 10 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3). Between parts by weight.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (a2) is, for example, 10 parts by weight to 90 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3). Between parts by weight.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (a3) is, for example, 10 parts by weight to 90 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3). Between parts by weight.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (B) is, for example, between 1 part by weight and 250 parts by weight based on 100 parts by weight of (A).

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (C) is, for example, between 0.1 part by weight and 100 parts by weight based on 100 parts by weight of (A).

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (D) is, for example, between 0.1 part by weight and 100 parts by weight based on 100 parts by weight of (A).

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (E) is, for example, between 10% by weight and 90% by weight based on the total weight of the photosensitive resin composition.

The photosensitive resin composition according to an embodiment of the present invention may further include (F) a functional silane coupling agent.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (F) is, for example, from 0.01 wt% to 5 wt%, based on the total weight of (A), (B) and (C) between.

According to the photosensitive resin composition of the embodiment of the invention, the photosensitive resin composition described above can be applied to a dielectric layer between metal electrodes or a protective layer covering a metal electrode in a touch panel.

Based on the above, the photosensitive resin composition of the present invention has good adhesion to the metal and has high hardness, so that in the touch panel, it can serve as a dielectric layer between the metal electrodes to avoid the dielectric layer. The phenomenon of peeling off from the metal electrode or as a protective layer covering the metal electrode to avoid scratching of the protective layer causes a problem of low yield.

The above described features and advantages of the present invention will be more apparent from the following description.

The present invention proposes a photosensitive resin composition which has good adhesion to metals and has high hardness. Therefore, the photosensitive resin composition of the present invention can be applied to a touch panel process, and after exposure and development, is formed as a dielectric layer between the metal electrodes to improve adhesion between the dielectric layer and the metal electrode. The phenomenon that the dielectric layer and the metal electrode are peeled off is avoided, or the protective layer covering the metal electrode is formed to avoid the problem that the protective layer is scratched in the process and the low yield is caused.

The photosensitive resin composition of the present invention comprises (A) a polymer having three or more co-blocks, (B) a compound having at least one ethylenically unsaturated double bond, (C) an organic acid anhydride, and (D) light-emitting Starting agent, (E) organic solvent.

In (A) a polymer having three or more co-blocks, these co-blocks are polymerized from the following monomers: (a1) 0.1% to 10% of one or both sides have unsaturated reactive functionalities An ethylenically unsaturated monomer of a phosphoric acid group, (a2) an ethylenically unsaturated monomer having an acid group, and (a3) an ethylenically unsaturated monomer other than (a1) and (a2). That is, (A) is obtained by polymerizing monomers such as (a1), (a2), and (a3). The content of (A) is, for example, between 10% by weight and 40% by weight based on the total weight of the photosensitive resin composition.

(a1) 0.1% to 10% of an ethylenically unsaturated monomer having one or two sides of phosphoric acid having a non-saturated reactive functional group may be represented by the formula (1).

Wherein R ₁ is H or CH ₃ ; x≧1; m+n=3, and m and n are not zero. (a1) The photosensitive resin composition of the present invention can have good adhesion to metals. The content of (a1) is, for example, between 0.1 part by weight and 10 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3).

(a2) The acid group-containing ethylenically unsaturated monomer may be an unsaturated monobasic acid such as (meth)acrylic acid, crotonic acid, α-chloro(meth)acrylic acid, or (ethyl)acrylic acid. Cinnamic acid or the like; an unsaturated dibasic acid such as maleic acid, maleic anhydride, fumaric acid, itaconic acid , itaconic anhydride, citraconic acid, citraconic anhydride, mesaconic acid, mesaconic anhydride, etc.; or more than three or more unsaturated Anhydride class. The content of (a2) is, for example, between 10 parts by weight and 90 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3). The above (a2) may be used singly or in combination of several kinds.

(a3) The ethylenically unsaturated monomer other than (a1) and (a2) may be a vinyl compound containing an allyl group, such as allyl (meth)acrylate; a vinyl compound containing two acrylic groups, such as ethylene glycol di(meth)acrylate, dicyclopentenyl di(meth)acrylate, propylene glycol Propylene glycol di(meth)acrylate, 2,2-dimethyl-1,3-propylene glycol di(meth)acrylate , triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tris(2-hydroxyethyl)isocyanate Tri(2-hydroxyethyl)isocyanate di(meth)acrylate, etc.; nitrileated vinyl compounds such as (meth)acrylonitrile (meth)acrylonitrile, alpha-chloro(meth)acrylonitrile (α -chloro(meth)acrylonitrile); aromatic vinyl compounds such as styrene, methyl styrene, methoxy styrene, etc. Other vinyl compounds such as C6-C12 alkyl cyclic (meth) acrylate and the like. (a3) is preferably dicyclopentanylmethacrylate, styrene, iso-octylacrylate, allylmethacrylate, methacrylonitrile, 2,2-dimethyl-1,3-propylene glycoldiacrylate. When (a3) is styrene, the heat resistance and chemical resistance of the photosensitive resin composition of the present invention can be further improved. The content of (a3) is, for example, between 10 parts by weight and 90 parts by weight based on 100 parts by weight of the total of (a1), (a2) and (a3). The above (a3) may be used singly or in combination of several kinds.

The weight average molecular weight (Mw) obtained by (A) polystyrene conversion by gel permeation chromatography is preferably between 2 × 10 ³ and 1 × 10 ⁵ , more preferably between 5 × 10 ³ and 5 × 10 Between ⁴ . When the weight average molecular weight of (A) is less than 2 × 10 ³ , the dielectric layer or the protective layer formed of the photosensitive resin composition of the present invention may cause a problem of pattern inaccuracy, and the dielectric layer or the protective layer passes through After the high-temperature process, there is a problem that the thickness becomes thin, which means that the pattern shape and heat resistance of the dielectric layer or the protective layer are deteriorated. When the weight average molecular weight of (A) is more than 1 × 10 ⁵ , the photosensitive resin composition of the present invention causes a problem of a decrease in sensitivity, and also reduces the accuracy of the dielectric layer or the protective layer pattern.

(B) The compound having at least one ethylenically unsaturated double bond may be ethylene glycol di(meth)acrylate; having from 2 to 14 ethylene oxide groups Polyethylene glycol di(meth)acrylate; trimethylol propane di(meth)acrylate; trimethylol propane tri(trimethylol propane tri(trimethylol propane tri) Meth)acrylate); pentaerythritol tri(meth)acrylate; pentaerythritol tetra(meth)acrylate; having 2 to 14 propylene oxides Propylene oxide group propyleneglycol di(meth)acrylate; dipentaerythritol penta(meth)acrylate; dipentaerythritol hexa(dipentaerythritol hexa(dipentaerythritol hexa(meth) acrylate) Meth)acrylate, DPHA); trimethylolpropanetriglycidylether acrylic acid additive; bisphenol A diglycidyl ether propylene Bisphenol A diglycidylether acrylic acid additives; phthalate diesters of β-hydroxyethyl (meth) acrylate; toluene dihydrogen acid ester additive (toluene diisocyanate) (for example, β-hydroxyethyl (meth)acrylate; a polymeric compound having an ethylenically unsaturated bond, wherein the ethylenically unsaturated bond is Ditrimethylol propanetetraacrylate, tris(2-acryloxyethylisococururate), ethoxylated pentaerythritol tetraacrylate (option) Ethoxylated pentaerylthritoltetraacrylate) (EO 4 mol), pentaerythrit0ltetraacrylate (EO 35 mol), ethoxylated trimethylolpropanetriacrylate (EO 9 mol), ethoxylated Trimethylolpropane triacrylate (EO 3 mol), propxylated pentaerythritoltetraacrylate (PO 4 m Ol), nonaethylene glycol diacrylate, dipentaerythritol hexaacrylate-modified caprolactone, trimethylolpropane propoxylate triacrylate The group formed. In addition, (B) may also be a general commercial product such as KAYARAD DPHA-40H (sold by Nippon Kayaku Co., Ltd.); U-4HA, U-6HA, U-6LPA, U-15HA, UA-32P, U-324A, U-4H, U-6H (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.); UN-9000H, UN-3320HA, UN-3320HB, UN-3320HC, UN-901, UN-1200TPK, UN-904 ( Roots Industrial Co., Ltd.). The content of (B) is, for example, between 1 part by weight and 250 parts by weight based on 100 parts by weight of (A). The above (B) may be used singly or in combination of several kinds.

(C) The organic acid anhydride may be maleic anhydride (MA), itaconic anhydride, tetrahydrophthalic anhydride, citraconic anhydride, mesaconic anhydride. )Wait. The content of (C) is, for example, between 0.1 part by weight and 100 parts by weight based on 100 parts by weight of (A). The above (C) may be used singly or in combination of several kinds.

(D) The photoinitiator may be selected from a phosphine oxide compound, a carbonyl compound, an aminocarbonyl compound, a triazine compound, an oxime compound, and an amine. A group consisting of an amine compound, an alkoxyantharcene compound, and a thioxanthone compound. The content of (D) is, for example, between 0.1 part by weight and 100 parts by weight based on 100 parts by weight of (A). The above (D) may be used singly or in combination of several kinds.

The phosphine oxide-based compound is, for example, arylphosphine oxide, acylphosphine oxide, bisacylphosphine oxide, 2,4,6-trimethylbenzimidyl-diphenylphosphine oxide ( 2,6,6-trimethylbenzoyldiphenylphosphine oxide (TPO)), 2,6-diethylbenzoyldiphenylphosphine oxide, 2,6-dimethylbenzylidene -2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,3,5,6-tetramethyl Benzoyldi(2,6-dimethylphenyl)phosphonate, 2,3,5,6-tetramethylbenzoyldiphenylphosphine oxide , 2,4,6-trimethylbenzoylethoxyphenylphosphine oxide, bis(2,4,6-trimethylbenzylidene)phenyl oxide (bis(2,4,6-trimethylbenzoyl)phenylphosphine, I-819), bis(2,6-methoxybenzhydryl)-2,4,4-trimethylphenylphosphine oxide (bis) 2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide))

The carbonyl compound, the amine carbonyl compound, the triazine compound, and the oxime compound are, for example, acetophenone, benzophenone, biphenylketone, 1-hydroxy-1-cyclohexyl. Phenyldimethylketal 2,2-dimethoxy- 1,2-diphenylethane-1-one, I-651), 1-benzyl-1-dimethyl-tert-amine-1-(4-morpholine-benzamide)propane (1-benzyl-1-dimethylamino-) 1-(4-morpholino-benzoyl)propane, I-369), 2-morpholyl-2-(4-methylmercapto)benzoylpropane, I- 907), ethylantraquinone, 4-benzoyl-4-methyldiphenylsulfide, benzoinbutylether, 2-hydroxyl 2-hydroxy-2-benzoylpropane, 2-hydroxy-2-(4-isopropyl)benzoylpropane, 4 -4-butylbenzoyltrichloromethane, 4-phenoxybenzoyldichloromethane (4-phenoxybenzoyldi) Chloromethane), benzoylmethylformate, 1,7-bis(9-acridinyl)heptane, 9-n-butyl-3, 6-N-(2-morpho-isobutyl) carbazole, 10-butyl-2-triphenyl carbazole, 10-butyl-2-triphenyl ketone (10-butyl-2-triphenyl) -butyl-2-chloroacridone), 2-[2-(4-methoxy-phenyl)-vinyl]-4,6-bis-trichloromethyl-[1,3,5]triazine (2 -[2-(4-methoxy-phenyl)-vinyl]-4,6-bis-trichloromethyl-[1,3,5]triazine), 2-(4-methoxy-naphthalen-1-yl)-4 ,6-bis-trichloromethyl-[1,3,5]triazine (2-(4-methoxy-naphthalen-1-yl)-4,6-bis-trichloromethyl-[1,3,5]triazine , 2-toluene[1,3]dioxol-5-yl-4,6-bis-trichloromethyl-[1,3,5]triazine (2-benzo[1,3] Dioxol-5-yl-4,6-bis-trichloromethyl-[1,3,5]triazine), 2-methyl-4,6-bis(trichloromethyl)-s-triazine (2-methyl-) 4,6-bis(trichloromethyl)-s-triazine), 2-phenyl-4,6-bis(trichloromethyl)-s-triazine (2-phenyl-4,6-bis(trichloromethyl)-s -triazine), 2-naphthyl-4,6-bis(trichloromethyl)-s-triazine, 1-[9-B -6-(2-methylbenzhydryl)-9 .H-carbazol-3-yl]-bicycloheptylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzylidene)-9 .H-carbazol-3-yl]-bicycloheptyl-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzhydryl)-9. H-carbazol-3-yl]-adamantyl methane-1-ketooxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzhydryl)-9. H-carbazol-3-yl]-adamantyl methane-1-ketooxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzhydryl)-9.H -oxazol-3-yl]-tetrahydrofuranylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzhydryl)-9.H- Oxazol-3-yl]-tetrahydrofuranylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzylidene)-9.H-carbazole -3-yl]-sialylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzylidene)-9.H-carbazole -3-yl]-sialylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzylidene)-9.H-carbazole- 3-yl]-code phenylmethane-1-one oxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzylidene)-9.H-carbazole- 3-yl]-code phenylmethane-1-one oxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzylidene)-9.H-carbazole-3 -yl]-ethane-1-one -O-bicyclobutanoate, 1-[9-ethyl-6-(2-methylbenzomethyl)-9.H-carbazol-3-yl]-ethane-1-one oxime -O-tricyclodecanoate, 1-[9-ethyl-6-(2-methylbenzylidenyl)-9.H-carbazol-3-yl]-ethane-1-one oxime -O-adamantanate, 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzhydrylhydrazine), 1,2-butanedione- 1-[4-(phenylthio)phenyl]-2-(O-benzylidene hydrazide), 1,2-butanedione-1-[4-(phenylthio)phenyl]-2- (O-acetinyl), 1,2-octanedione-1-[4-(methylthio)phenyl]-2-(O-benzhydrylhydrazine), 1,2-octanedione 1-[4-(phenylthio)phenyl]-2-(O-methylbenzhydrylhydrazine).

The amine compound is, for example, triethanolamine, methyldiethanolamine, triisopropylamine, 4-dimethylaminomethyl benzoate, 4- 4-dimethylaminoethyl benzoate, 4-methylaminoisoamyl benzoate, 2-methylaminoethyl benzoate 2-methylaminoethyl benzoate, 4-dimethylamino-2-ethylhexyl benzoate, N,N-methyl-p-toluidine (N, N -methylparatoluidine), 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone Ketone (4,4'-bis(diethylamino)benzophenone), 4,4'-bis(ethylmethylamino)benzophenone.

The alkoxy ruthenium compound is, for example, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl 9,10 2-ethyl-9,10-dimethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene.

The thioxantane compounds are, for example, 2-isopropylthioxanthone, 4-isopropylthioxanthone (IPTX), 2,4-diethylthioxanthone (2, 4-diethylthioxanthone (DETX)), 2,4-trichlorothioxanthone, 1-chloro-4-propoxythioxanthone.

(E) The organic solvent may be benzene, toluene, xylene, methanol, ethanol, ethylene glycol monopropyl ether, diethylene glycol dimethyl Diethylene glycol dimethyl ether, diethylene glycol methyl ether, methyl methoxypropionate, ethyl ethoxypropionate, ethyl lactate ), tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate ), diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol methyl ether acetate (PGMEA) ), propylene glycol ethyl ether acetate, propylene glycol propyl eth Er acetate), methyl isobutyl ketone, methyl ether ketone, ketone, cyclohexanone, dimethyl formamide (DMF), N, N-N-dimethylacetamide (DMAc), N-Methyl pyrrolidone (NMP), γ-butyrolactone. The content of the above (E) is, for example, between 10% by weight and 90% by weight, preferably between 60% by weight and 80% by weight based on the total weight of the photosensitive resin composition. The above (E) may be used singly or in combination of several kinds.

Further, in another embodiment, the photosensitive resin composition of the present invention may further comprise (F) a functional decane coupling agent. The (F) functional decane coupling agent may be a fluorenyl functional group-containing oxirane monomer having a fluorenyl acrylate monomer, and is, for example, γ-glycidoxypropyltrimethoxydecane. (F) The photosensitive resin composition of the present invention can have good adhesion to a metal, a metal oxide or a glass substrate. Further, since (F) has a hydrophobic property, the photosensitive resin composition of the present invention can have high oxidation resistance when subjected to the reliability test. The content of the above (F) is, for example, between 0.01 wt% and 5 wt% based on the total weight of (A), (B) and (C). The above (F) may be used singly or in combination of several kinds.

As described above, since the photosensitive resin composition of the present invention has good adhesion to metal and has high hardness, it can be applied to a process of a touch panel. When the photosensitive resin composition of the present invention is exposed and developed, it can be formed as a dielectric layer between the metal electrodes to improve the adhesion between the dielectric layer and the metal electrode to avoid the dielectric layer and the metal electrode. The peeling phenomenon may occur or may be formed to cover the protective layer of the metal electrode to avoid the problem that the protective layer is scratched in the process to cause a low yield.

The photosensitive resin composition of the present invention will be described below by way of experimental examples.

Experimental example 1, 2

Synthesis of polymer X having three or more co-blocks (containing (a1)): First, 3200 ml of γ-butyrolactone was added to a reaction flask as a solvent. Then, nitrogen gas was passed through and stirred and heated to 100 °C. Next, 693 grams of dicyclopentanyl methacrylate, 580.5 grams of methacrylic acid, 56.7 grams of propylene methyl acrylate, 80.4 grams of methacrylonitrile, 312 grams of styrene, 55.2 g of 2-hydroxyethyl 2-methylpropenoate (HEMA) phosphate (as shown in formula (2)) and 73 g of 2,2'-azobisisobutyronitrile (2 2'-azobisisobutyronitrile, AIBN) was dissolved in 1700 ml of γ-butyrolactone. Then, the above two were respectively dropped into a reaction bottle at 100 ° C for reaction within 1 hour. The stirring reaction was continued for 4 hours after the above two were dropped. Thereafter, the temperature of the reaction flask was lowered back to 80 ° C, and nitrogen gas was stopped, and 640 g of glycidyl methacrylate and 29.5 g of 1-methylimidazole (catalyst) were added. 1.8 g of 4-methoxyphenol (inhibitor) was stirred in air for 19 hours. The obtained resin solution product had a solid content of 24 wt.%, a viscosity of 33.5 cps/25 ° C, an acidity of 108 mgKOH/g, and a weight average molecular weight (Mw) of 10,000.

Comparative example

Synthesis of polymer Y having three or more co-blocks (excluding (a1)): First, 3200 ml of γ-butyrolactone was added to the reaction flask as a solvent. Then, nitrogen gas was passed through and stirred and heated to 100 °C. Next, 693 g of dicyclopentanyl methacrylate, 580.5 g of methacrylic acid, 56.7 g of propylene methyl acrylate, 80.4 g of methacrylonitrile, 312 g of styrene, 73 g of 2 2'-Azobisisobutyronitrile was dissolved in 1700 ml of γ-butyrolactone. Then, the above two were respectively dropped into a reaction bottle at 100 ° C for reaction within 1 hour. The stirring reaction was continued for 4 hours after the above two were dropped. Thereafter, the temperature of the reaction flask was lowered back to 80 ° C, and the nitrogen gas was stopped, and 640 g of glycidyl methacrylate, 29.5 g of 1-methylimidazole (catalyst), and 1.8 g of 4-methoxyl were added. Benzene (inhibitor) was stirred in air for 19 hours. The obtained resin solution product had a solid content of 23 wt.%, a viscosity of 28 cps/25 ° C, an acid value of 105 mgKOH/g, and a weight average molecular weight (Mw) of 13,500.

In the photosensitive resin compositions of Experimental Examples 1 and 2 and Comparative Examples, the components other than the above polymers X and Y are shown in Table 1.

The photosensitive resin compositions of Experimental Examples 1, 2 and Comparative Examples were subjected to a pencil hardness test and a metal adhesion test, and the results are shown in Table 2.

As is clear from Table 2, the photosensitive resin compositions (Experimental Examples 1 and 2) of the present invention have good metal adhesion and high hardness as compared with the general photosensitive resin composition (Comparative Example).

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

Claims (12)

A photosensitive resin composition comprising: (A) a polymer having three or more co-blocks which are polymerized from the following monomers: (a1) 0.1% to 10% of one side or two An ethylenically unsaturated monomer having a phosphoric acid which does not saturate a reactive functional group; (a2) an ethylenically unsaturated monomer having an acid group; and (a3) an ethylenic group other than (a1) and (a2) An unsaturated monomer; (B) a compound having at least one ethylenically unsaturated double bond; (C) an organic acid anhydride; (D) a photoinitiator; and (E) an organic solvent, wherein (a1) is represented by the formula (1) Said that Wherein R ₁ is H or CH ₃ ; x≧1; m+n=3, and m and n are not zero. The photosensitive resin composition according to claim 1, wherein the content of (A) is between 10% by weight and 40% by weight based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to claim 1, wherein the total of (a1), (a2) and (a3) is 100 parts by weight, (a1) The content is between 0.1 part by weight and 10 parts by weight. The photosensitive resin composition according to claim 1, wherein the content of (a2) is from 10 parts by weight to 90% by weight based on 100 parts by total of (a1), (a2) and (a3). Between the shares. The photosensitive resin composition according to claim 1, wherein the content of (a3) is from 10 parts by weight to 90% by weight based on 100 parts by total of (a1), (a2) and (a3). Between the shares. The photosensitive resin composition according to claim 1, wherein the content of (B) is from 1 part by weight to 250 parts by weight based on 100 parts by weight of (A). The photosensitive resin composition according to claim 1, wherein the content of (C) is from 0.1 part by weight to 100 parts by weight based on 100 parts by weight of (A). The photosensitive resin composition according to claim 1, wherein the content of (D) is from 0.1 part by weight to 100 parts by weight based on 100 parts by weight of (A). The photosensitive resin composition according to claim 1, wherein the content of (E) is between 10% by weight and 90% by weight based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to claim 1, further comprising (F) a functional decane coupling agent. The photosensitive resin composition according to claim 10, wherein the content of (F) is between 0.01 wt% and 5 wt% based on the total weight of (A), (B) and (C) . The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition is applied to a dielectric layer between metal electrodes in a touch panel or a protective layer covering the metal electrode.