TWI495686B - A stabilized polyene-polythiol-based hardening resin composition - Google Patents
A stabilized polyene-polythiol-based hardening resin composition Download PDFInfo
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
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Description
本發明係關於一種可使用於印刷版或顏色比對樣票(colorproof)、彩色濾光片、阻焊劑、光硬化油墨等之領域且可改善保存安定性之聚烯-聚硫醇系光硬化性樹脂組成物。The present invention relates to a polyene-polythiol photocuring which can be used in the fields of printing plates or color comparison color proofs, color filters, solder resists, photo-curing inks and the like and which can improve storage stability. Resin composition.
光硬化性樹脂組成物係在印刷版或顏色比對樣票、彩色濾光片、阻焊劑、光硬化油墨等各種方面被使用。尤其,近年,從包含此等之用途,環境問題、省能源、作業安全性、生產成本等之觀點,著眼光硬化性樹脂組成物最特徵之常溫硬化性、速乾性、無溶劑等,對於感光性組成物正進行許多研究、開發。在彩色濾光片之開發中係以生產性之提昇或高精密化作為目的而研究彩色濾光片用顏料分散型光阻劑。又,顏色比對樣票或印刷版係以製版之高速化、高精細化作為目的而進行開發。又,亦研究印刷基板用之阻焊劑。The photocurable resin composition is used in various aspects such as a printing plate, a color matching sample ticket, a color filter, a solder resist, and a photocurable ink. In particular, in recent years, from the viewpoints of such applications, environmental problems, energy saving, work safety, production costs, etc., the most characteristic of the photocurable resin composition is room temperature hardenability, quick-drying property, solvent-free, etc. The sex composition is undergoing many research and development. In the development of color filters, pigment-dispersed photoresists for color filters have been studied for the purpose of improving productivity or high precision. In addition, the color comparison sample ticket or the printing plate was developed for the purpose of speeding up the plate making and high definition. Moreover, solder resists for printed substrates have also been studied.
在此等之用途中對於光硬化系樹脂組成物之要求正在昇高,尋求以更低之能量硬化者,更快速硬化者,可形成更精細之圖型者,具有更深之硬化深度者,保存性能更高者已被要求。光硬化系樹脂組成物主要係由光聚合起始劑組成物、具有藉聚合反應進行硬化之乙烯性不飽和鍵之化合物及各種添加物所構成,依用途而可使用各種之種類者。In these applications, the requirements for the photohardenable resin composition are increasing, and those who seek to harden with lower energy, those who harden more quickly, can form finer patterns, have deeper depth of hardening, and preserve Those with higher performance have been asked. The photocurable resin composition is mainly composed of a photopolymerization initiator composition, a compound having an ethylenically unsaturated bond which is cured by a polymerization reaction, and various additives, and various types can be used depending on the application.
此等光硬化性組成物係從高感度、高密著性等之理由,可使用季戊四醇四(3-氫硫基丙酸酯)(商品名:QX40,三菱化學(股)製)等之硫醇化合物。The photocurable composition is a mercaptan such as pentaerythritol tetrakis(3-hydrothiopropionate) (trade name: QX40, manufactured by Mitsubishi Chemical Corporation) for reasons of high sensitivity and high adhesion. Compound.
但使用硫醇化合物之光硬化性樹脂組成物係高感度,反之,因反應性太高,有犧牲保存安定性之問題。However, the photocurable resin composition using a thiol compound is highly sensitive, and conversely, since the reactivity is too high, there is a problem of sacrificing preservation stability.
於特開2010-024255號公報(專利文獻1)中係記載含有:於分子內具有3個以上乙烯性不飽和基之胺基甲酸酯(甲基)丙烯酸酯系化合物、硫醇化合物及二氧化矽之活性能量線硬化型樹脂組成物,顯示塗膜硬度或硬化性優異,但有關保存安定性未被研究。Japanese Patent Publication No. 2010-024255 (Patent Document 1) discloses a urethane (meth)acrylate compound having three or more ethylenically unsaturated groups in a molecule, a thiol compound, and two The active energy ray-curable resin composition of cerium oxide showed excellent hardness or hardenability of the coating film, but the preservation stability was not investigated.
於特開2009-051936號公報(專利文獻2)係揭示一種使含有:二烯化合物與含氫硫基之有機矽烷化合物反應所得到的化合物(A)、與硫醇化合物(B)之硬化性組成物,記載可提供一種具有良好的硬化性,且貯存安定性優異之硬化物,但為得到長期之保存安定性係不充分者。JP-A-2009-051936 (Patent Document 2) discloses a curable property of a compound (A) obtained by reacting a diene compound with a hydrogen sulfhydryl group-containing organodecane compound and a thiol compound (B). In the composition, it is described that a cured product having excellent curability and excellent storage stability can be provided, but it is insufficient in obtaining long-term storage stability.
於特開2008-184514號公報(專利文獻3)中係記載含有:使烷氧基矽烷類水解及縮合所得到之縮合物、與具有二級硫醇基之化合物的紫外線硬化性樹脂組成物,但保存安定性之評估在室溫、30日與溫和的條件下進行。為得到高溫且長期之保存安定性係不充分者。JP-A-2008-184514 (Patent Document 3) discloses an ultraviolet curable resin composition containing a condensate obtained by hydrolyzing and condensing an alkoxysilane, and a compound having a secondary thiol group. However, the assessment of preservation stability was carried out at room temperature, 30 days and mild conditions. In order to obtain high temperature and long-term preservation stability is not sufficient.
於特表平8-504879號公報(專利文獻4、W09500579)中係揭示具有安定化系統之硫醇-烯組成物,該安定化系統之選擇項之一係已記載使用4-甲氧基酚、氫醌、氫醌之單烷基酯、苯醌、萘醌等之游離自由基捕捉劑。進一步,適宜的游離自由基捕捉劑係記載為4-甲氧基酚,但實用化時,在4-甲氧基酚與萘醌係安定化效果低,在高溫下無法得到長期之保存安定性。A thiol-ene composition having a stabilization system is disclosed in JP-A-8-504879 (Patent Document 4, WO09500579), and one of the options for the stabilization system has been described using 4-methoxyphenol. A free radical scavenger such as hydroquinone or a monoalkyl ester of hydroquinone, benzoquinone or naphthoquinone. Further, a suitable free radical scavenger is described as 4-methoxyphenol, but in practical use, the effect of stabilization of 4-methoxyphenol and naphthoquinone is low, and long-term preservation stability cannot be obtained at high temperatures. .
[專利文獻1]特開2010-024255號公報[Patent Document 1] JP-A-2010-024255
[專利文獻2]特開2009-051936號公報[Patent Document 2] JP-A-2009-051936
[專利文獻3]特開2008-184514號公報[Patent Document 3] JP-A-2008-184514
[專利文獻4]特表平8-504879號公報[Patent Document 4] Japanese Patent Publication No. 8-504879
本發明之課題在於提供一種高感度、保存安定性優異且可以聚烯、聚硫醇之寬廣的摻合比率使用之光硬化性樹脂組成物。An object of the present invention is to provide a photocurable resin composition which is excellent in high sensitivity and storage stability and which can be used in a wide blending ratio of a polyolefin or a polythiol.
本發明人等係經專心研究之結果,發現藉由含有:硫醇化合物、含乙烯性不飽和雙鍵之化合物、具有特定之萘骨架作為安定劑之化合物的光硬化性樹脂組成物,直接維持聚烯-聚硫醇系光硬化性樹脂組成物的特徵之光硬化時的高感度特性,可抑制保存中之烯-硫醇反應而防止凝膠化,可得到良好的保存安定性,終完成本發明。As a result of intensive research, the present inventors have found that a photocurable resin composition containing a thiol compound, a compound containing an ethylenically unsaturated double bond, and a compound having a specific naphthalene skeleton as a stabilizer is directly maintained. The high-sensitivity characteristic of the polyene-polythiol-based photocurable resin composition during photocuring can suppress the olefin-thiol reaction during storage and prevent gelation, and can obtain good storage stability and finish. this invention.
亦即,本發明係關於以下之[1]~[10]記載的聚烯-聚硫醇系光硬化性樹脂組成物。In other words, the present invention relates to the polyene-polythiol-based photocurable resin composition according to any one of [1] to [10] below.
[1]一種硬化性樹脂組成物,其特徵係含有:硫醇化合物、具有2個以上不飽和雙鍵基之含有乙烯性不飽和雙鍵的化合物、與以通式(1)[1] A curable resin composition comprising: a thiol compound, a compound having an ethylenically unsaturated double bond having two or more unsaturated double bond groups, and a formula (1)
(式中,R5 ~R8 係分別獨立表示氫原子、碳數1~10的烷基、羥基或碳數1~3的烷氧基,R5 ~R8 之中至少2個係羥基或碳數1~3的烷氧基)(wherein R 5 to R 8 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group or an alkoxy group having 1 to 3 carbon atoms; and at least 2 of R 5 to R 8 are a hydroxyl group or Alkoxy group having 1 to 3 carbon atoms)
所示之化合物。The compound shown.
[2]如前述[1]項之硬化性樹脂組成物,其中以前述通式(1)所示之化合物中的R5 ~R8 分別獨立表示氫原子、甲基、羥基或甲氧基,R5 ~R8 之中至少2個為羥基或甲氧基。[2] The curable resin composition according to the above [1], wherein R 5 to R 8 in the compound represented by the above formula (1) each independently represent a hydrogen atom, a methyl group, a hydroxyl group or a methoxy group. At least two of R 5 to R 8 are a hydroxyl group or a methoxy group.
[3]如前述[1]或[2]項之硬化性樹脂組成物,其中以前述通式(1)所示之化合物為由4-甲氧基-1-萘酚、1,4-二甲氧基萘、1,4-二羥基萘、4-甲氧基-2-甲基-1-萘酚、4-甲氧基-3-甲基-1-萘酚、1,4-二甲氧基-2-甲基萘、1,2-二羥基萘、1,2-二羥基-4-甲氧基萘、1,3-二羥基-4-甲氧基萘、1,4-二羥基-2-甲氧基萘、1,4-二甲氧基-2-萘酚、及1,4-二羥基-2-甲基萘選出之1種或2種以上之化合物。[3] The curable resin composition according to the above [1] or [2], wherein the compound represented by the above formula (1) is 4-methoxy-1-naphthol, 1,4-two Methoxynaphthalene, 1,4-dihydroxynaphthalene, 4-methoxy-2-methyl-1-naphthol, 4-methoxy-3-methyl-1-naphthol, 1,4-two Methoxy-2-methylnaphthalene, 1,2-dihydroxynaphthalene, 1,2-dihydroxy-4-methoxynaphthalene, 1,3-dihydroxy-4-methoxynaphthalene, 1,4- One or two or more compounds selected from the group consisting of dihydroxy-2-methoxynaphthalene, 1,4-dimethoxy-2-naphthol, and 1,4-dihydroxy-2-methylnaphthalene.
[4]如前述[1]~[3]項中任一項之硬化性樹脂組成物,其中以前述通式(1)所示之化合物為4-甲氧基-1-萘酚。[4] The curable resin composition according to any one of the above [1], wherein the compound represented by the above formula (1) is 4-methoxy-1-naphthol.
[5]如前述[1]~[4]項中任一項之硬化性樹脂組成物,其中以前述通式(1)所示之化合物的含量相對於硫醇化合物與含有乙烯性不飽和雙鍵的化合物之總質量為1~20000wtppm。[5] The curable resin composition according to any one of the above [1] to [4] wherein the content of the compound represented by the above formula (1) is relative to the thiol compound and the ethylenically unsaturated double The total mass of the bond compound is from 1 to 20000 wtppm.
[6]如前述[1]~[5]項中任一項之硬化性樹脂組成物,其中前述硫醇化合物為具有2個以上以通式(2)[6] The curable resin composition according to any one of [1] to [5] wherein the thiol compound has two or more of the formula (2)
(式中,R1 及R2 分別獨立表示氫原子、碳數1~10之烷基或碳數6~10之芳香族基,m為0~2之整數,n為0或1)所示之基的硫醇化合物,前述含有乙烯性不飽和雙鍵的化合物為具有2個以上以通式(3)(wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aromatic group having 6 to 10 carbon atoms, m is an integer of 0 to 2, and n is 0 or 1) a thiol compound based on the above, wherein the compound containing an ethylenically unsaturated double bond has two or more formula (3)
(式中,R3 及R4 分別獨立表示氫原子、碳數1~10之烷基或碳數6~10之芳香族基)所示之基的含有乙烯性不飽和雙鍵的化合物。(In the formula, R 3 and R 4 each independently represent a compound containing an ethylenically unsaturated double bond represented by a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aromatic group having 6 to 10 carbon atoms).
[7]如前述[6]項之硬化性樹脂組成物,其中前述以通式(2)所示之基中的R1 及R2 之一者表示碳數1~10的烷基,另一者表示氫原子。[7] The curable resin composition according to the above [6], wherein one of R 1 and R 2 in the group represented by the formula (2) represents an alkyl group having 1 to 10 carbon atoms, and the other The person represents a hydrogen atom.
[8]如前述[1]~[7]項中任一項之硬化性樹脂組成物,其中前述硫醇化合物為以通式(4)[8] The curable resin composition according to any one of [1] to [7] wherein the aforementioned thiol compound is represented by the formula (4)
(式中,R1 、R2 、m及n係與上述同意義)(wherein R 1 , R 2 , m and n are in the same meaning as above)
所示之含有氫硫基的羧酸與多官能醇之酯化合物。An ester compound of a thiol group-containing carboxylic acid and a polyfunctional alcohol is shown.
[9]如前述[8]項之硬化性樹脂組成物,其中前述多官能醇為由可分枝之碳數2~10的伸烷基二醇、二乙二醇、二丙二醇、甘油、三羥甲基丙烷、季戊四醇、二季戊四醇、環己烷二醇、環己烷二甲醇、降莰基二甲醇、2,2-雙[4-(2-羥乙基氧)苯基]丙烷、氫化雙酚A、4,4’-(9-亞茀基)雙(2-苯氧基乙醇)及參(2-羥乙基)三聚異氰酸酯選出之化合物。[9] The curable resin composition according to the above [8], wherein the polyfunctional alcohol is an alkylene glycol having a branched carbon number of 2 to 10, diethylene glycol, dipropylene glycol, glycerin, or the like. Hydroxymethylpropane, pentaerythritol, dipentaerythritol, cyclohexanediol, cyclohexanedimethanol, norbornyl dimethanol, 2,2-bis[4-(2-hydroxyethyloxy)phenyl]propane, hydrogenation A compound selected from the group consisting of bisphenol A, 4,4'-(9-fluorenylene)bis(2-phenoxyethanol) and gin(2-hydroxyethyl)trimeric isocyanate.
[10]如前述[6]項之硬化性樹脂組成物,其中具有2個以上以前述通式(3)所示之基的含有乙烯性不飽和雙鍵的化合物為由丙烯酸基、甲基丙烯酸基、乙烯基及烯丙基化合物所選擇的1種以上之具有反應性雙鍵的化合物。[10] The curable resin composition according to the above [6], wherein the compound having an ethylenically unsaturated double bond having two or more groups represented by the above formula (3) is an acrylic group or a methacrylic acid. One or more compounds having a reactive double bond selected from the group consisting of a vinyl group and an allyl compound.
本發明之聚烯-聚硫醇系光硬化性樹脂組成物係具有非常優異之保存安定性,即使藉由安定劑之添加,亦不阻礙組成物之反應性,可以聚烯、聚硫醇之寬廣的摻合比率使用,故可於印刷版或顏色比對樣票(colorproof)、彩色濾光片、阻焊劑、光硬化油墨等多方面的用途中使用。The polyene-polythiol-based photocurable resin composition of the present invention has excellent storage stability, and even if it is added by a stabilizer, it does not inhibit the reactivity of the composition, and can be a polyene or a polythiol. The wide blending ratio is used, so it can be used in many applications such as printing plates or color proofs, color filters, solder resists, photo-curing inks, and the like.
以下,具體說明有關用以實施本發明之形態。Hereinafter, the form for carrying out the invention will be specifically described.
本發明所使用之硫醇化合物係具有-SH基的化合物,較佳係具有-SH基2個以上化合物,更佳係具有-SH基2~4個的化合物。The thiol compound used in the present invention is a compound having a -SH group, and preferably has two or more compounds of -SH group, and more preferably has 2 to 4 groups of -SH groups.
本發明所使用之硫醇化合物係並無特別限定,但宜為具有以通式(2)The thiol compound used in the present invention is not particularly limited, but preferably has the formula (2)
所示之基2個以上的硫醇化合物。Two or more thiol compounds are shown.
上述通式(2)中,R1 及R2 係分別獨立表示氫原子、碳數1~10的烷基或碳數6~10之芳香族基。In the above formula (2), R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aromatic group having 6 to 10 carbon atoms.
R1 及R2 表示之碳數1~10的烷基係可為直鏈狀,亦可為分枝狀,可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正己基、正辛基等,宜為甲基或乙基。The alkyl group having 1 to 10 carbon atoms represented by R 1 and R 2 may be linear or branched, and may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group or an n-butyl group. Isobutyl, tert-butyl, n-hexyl, n-octyl and the like are preferably a methyl group or an ethyl group.
R1 及R2 表示之碳數6~10的芳香族基,可舉例如苯基、甲苯基、二甲苯基、乙基苯基、1,3,5-三甲基苯基、萘基。Examples of the aromatic group having 6 to 10 carbon atoms represented by R 1 and R 2 include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a 1,3,5-trimethylphenyl group, and a naphthyl group.
m表示0~2之整數,宜為0或1。m represents an integer from 0 to 2, preferably 0 or 1.
n表示0或1,宜為0。n represents 0 or 1, and is preferably 0.
進一步,宜為m+n為1。Further, it is preferable that m+n is 1.
本發明所使用之硫醇化合物係宜為R1 及R2 之中至少一者為碳數1~10的烷基之2級或3級硫醇化合物。進一步,從使光感度或保存安定性調整於希望的範圍等觀點,更宜R1 及R2 之一者為氫原子,另一者為碳數1~10的烷基之2級硫醇化合物。The thiol compound used in the present invention is preferably a secondary or tertiary thiol compound in which at least one of R 1 and R 2 is an alkyl group having 1 to 10 carbon atoms. Further, from the viewpoint of adjusting the light sensitivity or the storage stability to a desired range, it is more preferable that one of R 1 and R 2 is a hydrogen atom, and the other is a 2-stage thiol compound having an alkyl group having 1 to 10 carbon atoms. .
本發明所使用之硫醇化合物係宜為以通式(4)The thiol compound used in the present invention is preferably of the formula (4)
所示之含有氫硫基的羧酸與多官能醇之酯化合物。An ester compound of a thiol group-containing carboxylic acid and a polyfunctional alcohol is shown.
上述通式(4)中,R1 、R2 、m及n係與上述同意義。In the above formula (4), R 1 , R 2 , m and n have the same meanings as described above.
多官能醇為具有羥基2個以上之化合物。The polyfunctional alcohol is a compound having two or more hydroxyl groups.
多官能醇之具體例可舉例如1,4-丁二醇、二乙二醇、二丙二醇等分枝的碳數2~10之伸烷基甘醇、甘油、三羥甲基丙烷、季戊四醇、二季戊四醇、環己烷二醇、環己烷二甲醇、降莰基二甲醇、2,2-雙[4-(2-羥基乙基氧)苯基]丙烷、氫化雙醇A、4,4’-(9-亞茀基)雙(2-苯氧基乙醇)及參(2-羥基乙基)三聚異氰酯。Specific examples of the polyfunctional alcohol include branched alkylene glycol having 2 to 10 carbon atoms such as 1,4-butanediol, diethylene glycol, and dipropylene glycol, glycerin, trimethylolpropane, and pentaerythritol. Dipentaerythritol, cyclohexanediol, cyclohexanedimethanol, norbornyl dimethanol, 2,2-bis[4-(2-hydroxyethyloxy)phenyl]propane, hydrogenated diol A, 4, 4 '-(9-Amidino) bis(2-phenoxyethanol) and ginseng (2-hydroxyethyl) trimeric isocyanate.
較佳之多官能醇為2~4官能的醇,更佳係1,4-丁二醇、三(2-羥乙基)三聚異氰酸酯、季戊四醇、三羥甲基丙烷。The preferred polyfunctional alcohol is a 2 to 4 functional alcohol, more preferably 1,4-butanediol, tris(2-hydroxyethyl)trimeric isocyanate, pentaerythritol or trimethylolpropane.
本發明所使用之硫醇化合物係之具體例可舉例如乙二醇雙(3-氫硫基丙酸酯)、1,2-丙二醇(3-氫硫基丙酸酯)、三羥甲基丙烷三(3-氫硫基丙酸酯)、乙二醇雙(3-氫硫基丁酸酯)、1,2-丙二醇(3-氫硫基丁酸酯)、三羥甲基丙烷三(3-氫硫基丁酸酯)、乙二醇雙(2-氫硫基丁酸酯)、1,2-丙二醇雙(2-氫硫基異丁酸酯)或三羥甲基丙烷三(2-氫硫基異丁酸酯)、季戊四醇四(3-氫硫基丁酸酯)、1,3,5-三(3-氫硫基丁基氧乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、1,4-雙(3-氫硫基丁基氧)丁烷、雙酚A雙(3-氫硫基丙酸酯)、雙酚A雙(3-氫硫基丁酸酯)、三酚甲烷三(3-氫硫基丙酸酯)、三酚甲烷三(3-氫硫基丁酸酯),但本發明係不限定於此等。以很少的曝光量易硬化,且藉本發明所得到之安定性的效果大等之理由,可適宜使用季戊四醇四(3-氫硫基丁酸酯)、1,3,5-三(3-氫硫基丁基氧乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮、1,4-雙(3-氫硫基丁基氧)丁烷。Specific examples of the thiol compound used in the present invention include, for example, ethylene glycol bis(3-hydrothiopropionate), 1,2-propanediol (3-hydrothiopropionate), and trimethylol. Propane tris(3-hydrothiopropionate), ethylene glycol bis(3-hydrothiobutyrate), 1,2-propanediol (3-hydrothiobutyrate), trimethylolpropane III (3-Hydroxythiobutyrate), ethylene glycol bis(2-hydrothiobutyrate), 1,2-propanediol bis(2-hydrothioisobutyrate) or trimethylolpropane (2-Hexylthioisobutyrate), pentaerythritol tetrakis(3-hydrothiobutyrate), 1,3,5-tris(3-hydrothiobutyloxyethyl)-1,3,5 -Triazine-2,4,6(1H,3H,5H)-trione, 1,4-bis(3-hydrothiobutyloxy)butane, bisphenol A bis(3-hydrothiopropionic acid Ester), bisphenol A bis(3-hydrothiobutyrate), trisphenol methane (3-hydrothiopropionate), trisphenol methane (3-hydrothiobutyrate), but The invention is not limited to this. It is easy to harden with a small amount of exposure, and pentaerythritol tetrakis(3-hydrothiobutyrate) and 1,3,5-tri (3) can be suitably used for the reason that the effect of the stability obtained by the present invention is large. -Hexylthiobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,4-bis(3-hydrothiobutyloxy) ) Butane.
本發明所使用之硫醇化合物係亦可容易取自市售品。就市售品可取得之硫醇化合物係季戊四醇四(3-氫硫基丙酸酯)(商品名:QX40、三菱化學(股)製)、商品名:QE-340M、Toray Fine Chemical(股)製、醚系一級硫醇(商品名:Capcure 3-800 Cognis公司製)、1,4-雙(3-氫硫基丁基氧)丁烷(商品名:Karenz MT BD1,昭和電工(股)製)、季戊四醇四(3-氫硫基丁酸酯)(商品名:Karenz MT PE1,昭和電工(股)製)、1,3,5-三(3-氫硫基丁基氧乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮(商品名:Karenz MT NR1,昭和電工(股)製)等。The thiol compound used in the present invention can also be easily obtained from a commercially available product. The thiol compound which is commercially available is pentaerythritol tetrakis(3-hydrothiopropionate) (trade name: QX40, manufactured by Mitsubishi Chemical Corporation), trade name: QE-340M, Toray Fine Chemical (share) , ether-based first-grade mercaptan (trade name: Capcure 3-800 Cognis), 1,4-bis(3-hydrothiobutyloxy) butane (trade name: Karenz MT BD1, Showa Denko) , pentaerythritol tetrakis(3-hydroxythiobutyrate) (trade name: Karenz MT PE1, manufactured by Showa Denko), 1,3,5-tris(3-hydrothiobutyloxyethyl) -1,3,5-triazine-2,4,6(1H,3H,5H)-trione (trade name: Karenz MT NR1, manufactured by Showa Denko).
具有本發明使用之乙烯性不飽和鍵的化合物係具有以通式(3)A compound having an ethylenically unsaturated bond used in the present invention has a formula (3)
所示之基2個以上的含乙烯性不飽和鍵之化合物。Two or more compounds containing an ethylenically unsaturated bond are shown.
上述通式(3)中,R3 及R4 係分別獨立表示氫原子、碳數1~10的烷基或碳數6~10之芳香族基。In the above formula (3), R 3 and R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aromatic group having 6 to 10 carbon atoms.
R3 及R4 表示之碳數1~10的烷基係可為直鏈狀,亦可為分枝狀,可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正己基、正辛基等,宜為甲基。The alkyl group having 1 to 10 carbon atoms represented by R 3 and R 4 may be linear or branched, and may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group or an n-butyl group. Isobutyl, tert-butyl, n-hexyl, n-octyl and the like are preferably a methyl group.
R3 及R4 表示之碳數6~10的芳香族基,可舉例如苯基、甲苯基、二甲苯基、乙基苯基、1,3,5-三甲基苯基、萘基。Examples of the aromatic group having 6 to 10 carbon atoms represented by R 3 and R 4 include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a 1,3,5-trimethylphenyl group, and a naphthyl group.
具有本發明使用之乙烯性不飽和鍵的化合物一般係稱為單體或寡聚物者,可藉由自由基聚合(或交聯)反應硬化之化合物。具體上係可舉例如乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、三羥甲基乙烷二(甲基)丙烯酸酯、四羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷環氧乙烷加成三(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、甘油環氧丙烷加成三(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇二(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、山梨糖醇三(甲基)丙烯酸酯、山梨糖醇四(甲基)丙烯酸酯、山梨糖醇五(甲基)丙烯酸酯、山梨糖醇六(甲基)丙烯酸酯、季戊四醇三烯丙基醚、三烯丙基三聚異氰酸酯、雙酚A環氧烷加成物之(甲基)丙烯酸酯、三酚甲烷環氧烷加成物之(甲基)丙烯酸酯等,但本發明係不限定於此等。從曝光感度及硬化後之各耐性,宜為多官能(甲基)丙烯酸酯系單體。此等具有乙烯性不飽和鍵之化合物係可單獨或組合2種以上而使用。又,所謂「(甲基)丙烯酸酯」亦意指「甲基丙烯酸酯」、「丙烯酸酯」之任一者。The compound having an ethylenically unsaturated bond used in the present invention is generally referred to as a monomer or oligomer, and a compound which can be hardened by a radical polymerization (or crosslinking) reaction. Specific examples thereof include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene glycol di(methyl). Acrylate, propylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, hexanediol di( Methyl) acrylate, trimethylolethane di(meth) acrylate, tetramethylolethane tri(meth) acrylate, trimethylolpropane di(meth) acrylate, trishydroxyl Propane tri(meth)acrylate, trimethylolpropane ethylene oxide addition tris(meth)acrylate, glycerol di(meth)acrylate, glycerol tri(meth)acrylate, glycerol epoxy Propane addition tris(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol Tris(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol (meth) acrylate, sorbitol tri(meth) acrylate, sorbitol tetra (meth) acrylate, sorbitol penta (meth) acrylate, sorbitol hexa (meth) acrylate , pentaerythritol triallyl ether, triallyl isocyanurate, (meth) acrylate of bisphenol A alkylene oxide adduct, (meth) acrylate of trisphenol methane alkylene oxide adduct, etc. However, the present invention is not limited to this and the like. From the exposure sensitivity and the respective resistance after curing, a polyfunctional (meth)acrylate monomer is preferred. These compounds having an ethylenically unsaturated bond may be used singly or in combination of two or more. Moreover, "(meth) acrylate" also means any of "methacrylate" and "acrylate".
在本發明中係就防止保存時之聚合的目的,添加安定化劑。未添加安定化劑時係無法得到反應性高之聚烯-聚硫醇系硬化性樹脂組成物的保存安定性。In the present invention, a stabilizer is added for the purpose of preventing polymerization during storage. When the stabilizer is not added, the storage stability of the highly reactive polyene-polythiol-based curable resin composition cannot be obtained.
在本發明中,安定化劑係使用以通式(1)In the present invention, the stabilizer is used in the formula (1)
所示之化合物。The compound shown.
上述通式(1)中,R5 ~R8 係分別獨立表示氫原子、碳數1~10的烷基、羥基或碳數1~3之烷氧基。In the above formula (1), R 5 to R 8 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group or an alkoxy group having 1 to 3 carbon atoms.
R5 ~R8 表示之碳數1~10的烷基係可為直鏈狀,亦可為分枝狀,可舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正己基、正辛基等,宜為甲基。The alkyl group having 1 to 10 carbon atoms represented by R 5 to R 8 may be linear or branched, and may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group or an n-butyl group. Isobutyl, tert-butyl, n-hexyl, n-octyl and the like are preferably a methyl group.
R5 ~R8 表示之碳數1~3的烷氧基係可舉例如甲氧基、乙氧基、丙氧基、異丙氧基,宜為甲氧基。The alkoxy group having 1 to 3 carbon atoms represented by R 5 to R 8 may, for example, be a methoxy group, an ethoxy group, a propoxy group or an isopropoxy group, and is preferably a methoxy group.
R5 ~R8 之中至少2個係羥基或碳數1~3之烷氧基,更佳係R5 ~R8 之中至少2個係羥基或碳數1~3之烷氧基。At least two of R 5 to R 8 are a hydroxyl group or an alkoxy group having 1 to 3 carbon atoms, and more preferably at least two of R 5 to R 8 are a hydroxyl group or an alkoxy group having 1 to 3 carbon atoms.
以通式(1)所示之化合物係羥基或碳數1~3之烷氧基在於1,4位、2,3位、或1,2位之化合物可得到自由基共振構造,故佳。上述化合物係表示芳香族性,化合物單體之安定性亦高。從化合物取得之觀點,取代位置更宜為1,4位。It is preferred that the compound represented by the formula (1) is a hydroxyl group or an alkoxy group having 1 to 3 carbon atoms in the 1,4, 2, 3 or 1,2 position to obtain a radical resonance structure. The above compound is aromatic, and the stability of the compound monomer is also high. From the point of view of the compound, the substitution position is preferably 1,4.
具體例係可舉例如4-甲氧基-1-萘酚、1,4-二甲氧基萘、1,4-二羥基萘、4-甲氧基-2-甲基-1-萘酚、4-甲氧基-3-甲基-1-萘酚、1,4-二甲氧基-2-甲基萘、1,2-二羥基萘、1,2-二羥基-4-甲氧基萘、1,3-二羥基-4-甲氧基萘、1,4-二羥基-2-甲氧基萘、1,4-二甲氧基-2-萘酚、1,4-二羥基-2-甲基萘,但不限定於此等。其中,4-甲氧基-1-萘酚、1,4-二羥基萘從組成物之保存安定性及反應性的觀點,佳。Specific examples include 4-methoxy-1-naphthol, 1,4-dimethoxynaphthalene, 1,4-dihydroxynaphthalene, and 4-methoxy-2-methyl-1-naphthol. , 4-methoxy-3-methyl-1-naphthol, 1,4-dimethoxy-2-methylnaphthalene, 1,2-dihydroxynaphthalene, 1,2-dihydroxy-4-methyl Oxynaphthalene, 1,3-dihydroxy-4-methoxynaphthalene, 1,4-dihydroxy-2-methoxynaphthalene, 1,4-dimethoxy-2-naphthol, 1,4- Dihydroxy-2-methylnaphthalene, but is not limited thereto. Among them, 4-methoxy-1-naphthol and 1,4-dihydroxynaphthalene are preferred from the viewpoints of storage stability and reactivity of the composition.
硫醇化合物與含有乙烯性不飽和雙鍵之化合物的摻合比率並無特別限定,但相對於含有乙烯性不飽和雙鍵之化合物之C=C雙鍵基總量,硫醇化合物之硫醇基總量的莫耳比宜為0.0001~1,更宜為0.001~0.5,最宜為0.01~0.1。The blending ratio of the thiol compound to the compound containing an ethylenically unsaturated double bond is not particularly limited, but the thiol of the thiol compound is relative to the total amount of the C=C double bond group of the compound containing an ethylenically unsaturated double bond. The molar ratio of the base is preferably 0.0001 to 1, more preferably 0.001 to 0.5, and most preferably 0.01 to 0.1.
安定化劑之量係相對於硫醇化合物與含有乙烯性不飽和雙鍵之化合物的總質量,宜為1~20000 wtppm,更宜為10~10000 wtppm,最宜為50~5000 wtppm。相較於一級硫醇化合物,反應性低、二級或三級硫醇化合物之時,宜為1~2000 wtppm,更宜為10~1000 wtppm,最宜為50~500 wtppm。又,一級硫醇化合物時係宜為10~20000 wtppm,更宜為100~10000 wtppm,最宜為500~5000 wtppm。若安定化劑之量少於1 wtppm,安定化效果不充分,保存中凝膠化,若安定化劑之量多於20000 wtppm,有光硬化時之硬化性惡化的傾向。The amount of the stabilizer is preferably from 1 to 20,000 wtppm, more preferably from 10 to 10,000 wtppm, most preferably from 50 to 5,000 wtppm, based on the total mass of the thiol compound and the compound containing an ethylenically unsaturated double bond. Compared with the primary thiol compound, when the reactivity is low, the secondary or tertiary thiol compound is preferably from 1 to 2000 wtppm, more preferably from 10 to 1000 wtppm, most preferably from 50 to 500 wtppm. Further, the primary thiol compound is preferably from 10 to 20,000 wtppm, more preferably from 100 to 10,000 wtppm, most preferably from 500 to 5,000 wtppm. When the amount of the stabilizer is less than 1 wtppm, the stabilization effect is insufficient, and gelation occurs during storage. If the amount of the stabilizer is more than 20,000 wtppm, the hardenability tends to deteriorate during photohardening.
以下,舉出實施例及比較例而說明本發明之硬化性樹脂組成物,但本發明係不限定於以下之例。Hereinafter, the curable resin composition of the present invention will be described by way of examples and comparative examples, but the present invention is not limited to the following examples.
使季戊四醇四(3-氫硫基丁酸酯)(PE1,昭和電工(股)製,SH當量139g/eq)5.9g、與三羥甲基丙烷三丙烯酸酯(lightacrylate,TMPA,共榮社化學(股)製,C=C雙鍵當量99g/eq)4.1g,相對於含有乙烯性不飽和雙鍵之化合物之C=C雙鍵基總量,混合成硫醇化合物之硫醇基的莫耳比為1。進一步,就安定化劑,添加4-甲氧基-1-萘酚(東京化成工業(股)製)0.02g(2000 wtppm)。使此組成物加熱至60℃,測定至凝膠化之日數後,120日間不凝膠化。Pentaerythritol tetrakis(3-hydroxythiobutyrate) (PE1, manufactured by Showa Denko Co., Ltd., SH equivalent 139 g/eq) 5.9 g, and trimethylolpropane triacrylate (light acrylate, TMPA, Kyoeisha Chemical Co., Ltd.) (stock) system, C=C double bond equivalent: 99 g/eq) 4.1 g, mixed with the total amount of C=C double bond groups of the compound containing an ethylenically unsaturated double bond, and mixed into a thiol group of the thiol compound The ear ratio is 1. Further, to the stabilizer, 0.02 g (2000 wtppm) of 4-methoxy-1-naphthol (manufactured by Tokyo Chemical Industry Co., Ltd.) was added. The composition was heated to 60 ° C, and after measurement to the number of days of gelation, it did not gel for 120 days.
凝膠化之判定方法係傾斜保存之瓶,若可看到堆積物,判斷為凝膠化。The gelation determination method is a bottle which is stored obliquely, and if the deposit is visible, it is judged to be gelatinized.
除使用4-甲氧基-1-萘酚0.003g(300 wtppm)以外,其餘係進行與實施例1同樣的安定性試驗後,90日以上未凝膠化。The same stability test as in Example 1 was carried out except that 0.003 g (300 wtppm) of 4-methoxy-1-naphthol was used, and it was not gelled for 90 days or more.
使用1,4-二羥基萘0.02g(2000 wtppm)取代4-甲氧基-1-萘酚以外,其餘係進行與實施例1同樣的安定性試驗後,30日以上未凝膠化。The same stability test as in Example 1 was carried out except that 1,4-dihydroxynaphthalene 0.02 g (2000 wtppm) was used instead of 4-methoxy-1-naphthol, and the gelation was not carried out for 30 days or more.
取代4-甲氧基-1-萘酚,添加作為安定化劑之表1所示的2,2’-亞甲基雙(6-第三丁基-對甲酚)(比較例1)、2,6-二第三丁基-4-羥基甲苯(比較例2)、4-甲氧基酚(比較例3)、甲基氫醌(比較例4)、酚嗪(比較例5)、N-硝基苯基羥基胺銨鹽(比較例6)、及2,2,6,6-四甲基六氫吡啶基-1-氧(比較例7)0.02g(2000wtppm),或不使安定化劑(比較例8)以外,其餘係進行與實施例1同樣的安定性試驗。其結果表示於表1。表中,「○」意指「未凝膠化」,「×」意指「凝膠化」,「-」意指「未測定」。In place of 4-methoxy-1-naphthol, 2,2'-methylenebis(6-t-butyl-p-cresol) shown in Table 1 as a stabilizer was added (Comparative Example 1), 2,6-di-t-butyl-4-hydroxytoluene (Comparative Example 2), 4-methoxyphenol (Comparative Example 3), methylhydroquinone (Comparative Example 4), phenolazine (Comparative Example 5), N-nitrophenylhydroxylamine ammonium salt (Comparative Example 6), and 2,2,6,6-tetramethylhexahydropyridinyl-1-oxo (Comparative Example 7) 0.02 g (2000 wtppm), or not The same stability test as in Example 1 was carried out except for the stabilizer (Comparative Example 8). The results are shown in Table 1. In the table, "○" means "ungelatinized", "X" means "gelation", and "-" means "not determined".
使季戊四醇四(3-氫硫基丁酸酯)(PE1)5.9g與三羥甲基丙烷三丙烯酸酯(TMPA)4.1g相對於含有乙烯性不飽和雙鍵之化合物之C=C雙鍵基總量,混合成硫醇化合物之硫醇基總量的莫耳比為1。就安定化劑,添加4-甲氧基-1-萘酚0.003g(300 wtppm)。進一步就自由基起始劑,添加IRG184(Ciha Specialty Chemicals(股)製)0.1g。再於NaCl板以膜厚30μm塗佈後,照射曝光量360mJ/cm2 而成形薄膜。測定其薄膜之丙烯酸反應率。測定方法係使用FT-IR,依丙烯酸基之譜峰的810cm-1 之面積變化率,測定丙烯酸的反應率。其結果,丙烯酸反應率為94%。5.9 g of pentaerythritol tetrakis(3-hydrothiobutyrate) (PE1) and 4.1 g of trimethylolpropane triacrylate (TMPA) relative to a C=C double bond group of a compound containing an ethylenically unsaturated double bond The total amount, the molar ratio of the total amount of thiol groups mixed into the thiol compound is 1. For the stabilizer, 0.003 g (300 wtppm) of 4-methoxy-1-naphthol was added. Further, 0.1 g of IRG184 (manufactured by Ciha Specialty Chemicals Co., Ltd.) was added as a radical initiator. After coating with a film thickness of 30 μm on a NaCl plate, the film was formed by irradiating an exposure amount of 360 mJ/cm 2 . The acrylic acid reaction rate of the film was measured. The measurement method was carried out by using FT-IR, and the reaction rate of acrylic acid was measured based on the area change ratio of the peak of the acrylic group of 810 cm -1 . As a result, the acrylic acid reaction rate was 94%.
除不添加實施例4之4-甲氧基-1-萘酚以外,其餘係以相同的方法,測定丙烯酸的反應率。其結果,丙烯酸反應率為92%,與實施例4同程度。The reaction rate of acrylic acid was measured in the same manner except that 4-methoxy-1-naphthol of Example 4 was not added. As a result, the acrylic acid reaction rate was 92%, which was the same as in Example 4.
如表2所示般,改變摻合比率而混合PE1與TMPA,進一步添加4-甲氧基-1-萘酚作為安定化劑,以40℃進行安定性試驗。安定性試驗及凝膠化之判定係與實施例1同樣地進行。其結果表示於表2。表中,「○」意指「未凝膠化」,「×」意指「凝膠化」,「-」意指「未測定」。As shown in Table 2, PE1 and TMPA were mixed while changing the blending ratio, and 4-methoxy-1-naphthol was further added as a stabilizer to carry out a stability test at 40 °C. The stability test and the gelation were determined in the same manner as in Example 1. The results are shown in Table 2. In the table, "○" means "ungelatinized", "X" means "gelation", and "-" means "not determined".
如表3所示般,改變摻合比率而混合PE1與TMPA,進一步添加4-甲氧基-1-萘酚作為安定化劑。加熱此組成物至80℃,進行安定性試驗。安定性試驗及凝膠化之判定係與實施例1同樣地進行。表中,「○」意指「未凝膠化」,「×」意指「凝膠化」,「-」意指「未測定」。As shown in Table 3, PE1 and TMPA were mixed while changing the blending ratio, and 4-methoxy-1-naphthol was further added as a stabilizer. The composition was heated to 80 ° C and subjected to a stability test. The stability test and the gelation were determined in the same manner as in Example 1. In the table, "○" means "ungelatinized", "X" means "gelation", and "-" means "not determined".
如表4所示般改變季戊四醇四(3-氫硫基丁酸酯)(PE1)、與三羥甲基丙烷三甲基丙烯酸酯(lightester TMP,共榮社化學(股)製,C=C雙鍵當量113g/eq)(TMP)之摻合比率而添加,混合,進一步,就安定化劑,添加4-甲氧基-1-萘酚(東京化成工業(股)製),以40℃進行安定性試驗。安定性試驗及凝膠化之判定係與實施例1同樣地進行。其結果表示於表4。表中,「○」意指「未凝膠化」,「×」意指「凝膠化」,「-」意指「未測定」。The pentaerythritol tetrakis(3-hydroxythiobutyrate) (PE1) and trimethylolpropane trimethacrylate (lightester TMP, Kyoritsu Chemical Co., Ltd., C=C) were changed as shown in Table 4. Addition, mixing, and further, to the stabilizer, 4-methoxy-1-naphthol (manufactured by Tokyo Chemical Industry Co., Ltd.) at 40 ° C in a blending ratio of a double bond equivalent of 113 g/eq (TMP) Conduct a stability test. The stability test and the gelation were determined in the same manner as in Example 1. The results are shown in Table 4. In the table, "○" means "ungelatinized", "X" means "gelation", and "-" means "not determined".
如表5所示般,改變摻合比率而混合PE1與TMPA,進一步添加4-甲氧基-1-萘酚作為安定化劑。加熱此組成物至80℃,進行安定性試驗。將測定此組成物之混合後的初期黏度與1日後之黏度的結果表示於表5中。黏度係使用E型旋轉黏度計(Digital Rheometer型式DV-III ULTRA,BROOKFIELD公司製),使用半徑24mm、角度3°之CP-41型圓錐型感測器而以旋轉數0.5~30rpm(依黏度而改變),測定在25.0℃之黏度。表中,「×」意指「凝膠化」,數值意指「黏度」。As shown in Table 5, PE1 and TMPA were mixed while changing the blending ratio, and 4-methoxy-1-naphthol was further added as a stabilizer. The composition was heated to 80 ° C and subjected to a stability test. The results of measuring the initial viscosity after mixing of the composition and the viscosity after one day are shown in Table 5. The viscosity is an E-type rotational viscometer (Digital Rheometer type DV-III ULTRA, manufactured by BROOKFIELD), and a CP-41 cone sensor with a radius of 24 mm and an angle of 3° is used, and the number of rotations is 0.5 to 30 rpm (depending on the viscosity). Change), the viscosity at 25.0 ° C was measured. In the table, "X" means "gelation" and the value means "viscosity".
如表6所示般改變季戊四醇四(3-氫硫基丁酸酯)(PE1)、與三烯丙基三聚異氰酸酯(TAIC,東京化成工業(股)製,C=C雙鍵當量83g/eq)(TAIC)之摻合比率而添加混合,進一步,就安定化劑,添加4-甲氧基-1-萘酚(東京化成工業(股)製),以40℃進行安定性試驗。安定性試驗及凝膠化之判定係與實施例1同樣地進行。其結果表示於表6。表中,「○」意指「未凝膠化」,「×」意指「凝膠化」,「-」意指「未測定」。The pentaerythritol tetrakis(3-hydrothiobutyrate) (PE1) and triallyl isocyanurate (TAIC, manufactured by Tokyo Chemical Industry Co., Ltd., C=C double bond equivalent 83 g/) were changed as shown in Table 6. The blending ratio of eq) (TAIC) was added and mixed, and further, a stabilizer was added, and 4-methoxy-1-naphthol (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and the stability test was carried out at 40 °C. The stability test and the gelation were determined in the same manner as in Example 1. The results are shown in Table 6. In the table, "○" means "ungelatinized", "X" means "gelation", and "-" means "not determined".
如表7所示般,改變摻合比率而混合PE1與TAIC,添加4-甲氧基-1-萘酚作為安定化劑。加熱此組成物至80℃,進行安定性試驗。測定此組成物之混合後的初期黏度與14日與40日後之黏度。黏度係使用E型旋轉黏度計(Digital Rheometer型式DV-III ULTRA,BROOKFIELD公司製),使用半徑24mm、角度3°之CP-41型圓錐型感測器而以旋轉數0.5~30rpm(依黏度而改變),測定在25.0℃之黏度。表中,數值意指「黏度」。As shown in Table 7, the blending ratio was changed while PE1 and TAIC were mixed, and 4-methoxy-1-naphthol was added as a stabilizer. The composition was heated to 80 ° C and subjected to a stability test. The initial viscosity after mixing of the composition was measured and the viscosity after 14 days and 40 days. The viscosity is an E-type rotational viscometer (Digital Rheometer type DV-III ULTRA, manufactured by BROOKFIELD), and a CP-41 cone sensor with a radius of 24 mm and an angle of 3° is used, and the number of rotations is 0.5 to 30 rpm (depending on the viscosity). Change), the viscosity at 25.0 ° C was measured. In the table, the value means "viscosity".
本發明之聚烯-聚硫醇系硬化性樹脂組成物係高感度且具有非常優異之保存安定性,可於印刷版或顏色比對樣票(colorproof)、彩色濾光片、阻焊劑、光硬化油墨等多方面的用途中使用。The polyene-polythiol-based curable resin composition of the present invention has high sensitivity and excellent storage stability, and can be used in a printing plate or a color matching color proof, a color filter, a solder resist, and a light. Used in many applications such as hardening inks.
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08504879A (en) * | 1993-06-22 | 1996-05-28 | ロックタイト コーポレイション | Stabilization system for thiol-ene and thiol-nene compositions |
TW200734364A (en) * | 2006-01-26 | 2007-09-16 | Showa Denko Kk | Curable composition containing thiol compound |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US5270439A (en) * | 1988-10-20 | 1993-12-14 | Sumitomo Seika Chemicals Co., Ltd. | Method of producing a curable composition containing 4,4'-bis(methacryloylthio)diphenylsulfide |
JPH0751631B2 (en) * | 1989-07-21 | 1995-06-05 | 住友精化株式会社 | Curable composition and method for producing the same |
EP0428342B1 (en) * | 1989-11-13 | 1997-01-15 | LOCTITE (IRELAND) Ltd. | Stable thiol-ene compositions |
JPH0625417A (en) * | 1990-10-30 | 1994-02-01 | Loctite Ireland Ltd | Stabilized thiol-ene composition |
JP2007269969A (en) * | 2006-03-31 | 2007-10-18 | Nof Corp | Photocurable resin composition |
US8569538B2 (en) * | 2006-06-30 | 2013-10-29 | Johnson & Johnson Vision Care, Inc. | Acryloyl materials for molded plastics |
JP5311744B2 (en) * | 2007-01-29 | 2013-10-09 | 地方独立行政法人 大阪市立工業研究所 | Ultraviolet curable resin composition, the cured product, and various articles derived therefrom |
CN101679635A (en) * | 2007-07-13 | 2010-03-24 | 昭和电工株式会社 | Curable composition and cured product thereof |
JP2009051936A (en) * | 2007-08-27 | 2009-03-12 | Mitsubishi Rayon Co Ltd | Curable composition and cured product |
JP2010024255A (en) * | 2008-07-15 | 2010-02-04 | Nippon Synthetic Chem Ind Co Ltd:The | Active energy ray-curing resin composition and coating agent composition |
JP2011032351A (en) * | 2009-07-31 | 2011-02-17 | Showa Denko Kk | Polymerizable composition |
-
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08504879A (en) * | 1993-06-22 | 1996-05-28 | ロックタイト コーポレイション | Stabilization system for thiol-ene and thiol-nene compositions |
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