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TWI360187B - Method and device for encapsulating electronic com - Google Patents

Method and device for encapsulating electronic com Download PDF

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Publication number
TWI360187B
TWI360187B TW093126868A TW93126868A TWI360187B TW I360187 B TWI360187 B TW I360187B TW 093126868 A TW093126868 A TW 093126868A TW 93126868 A TW93126868 A TW 93126868A TW I360187 B TWI360187 B TW I360187B
Authority
TW
Taiwan
Prior art keywords
carrier
electronic component
mold
pressure
encapsulant
Prior art date
Application number
TW093126868A
Other languages
Chinese (zh)
Other versions
TW200514175A (en
Inventor
Vries Franciscus Bernardus Antonius De
Hendrikus Johannes Bernardus Peters
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200514175A publication Critical patent/TW200514175A/en
Application granted granted Critical
Publication of TWI360187B publication Critical patent/TWI360187B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

1360187 九、發明說明： 【發明所屬之技術領域】 如申請專利範圍第1項之序文，本發明係關於一種包 封方法’其利用包封劑來部份包封一和電子元件相連之載 體的裝配件。如申請專利範圍第6項之序文，本發明還關 於一種套用此方法的裝置。 【先前技術】 利用包封劑來包封安裝於一載體上的電子元件係一種 常用的技術。此處，具有尚未包封之電子元件的載體通常 係夾在兩個鑄模部件之間，其方式係會在該等電子元件附 近形成複數個鑄模腔穴，用以進行包封（尤其是但不限於包 封半導體元件）。接著，會藉由常用的方式，利用一活塞系 統，透過滑槽將經過加熱的（液態）包封劑輸送至該等鑄模 腔穴中’致使該等鑄模腔穴充滿該包封劑。於至少部份固 化該包封劑之後，便可移開該等鑄模部件，以便可從該等 鑄模部件中解除具有現在被包封劑覆蓋之電子元件的載 體。此種方法亦稱為轉移鑄造。 另外也需要藉由轉移鑄造位於一載體上之電子元件來 進行部份包封，也就是將其埋植於包封劑中，致使該電子 元件其中一部份仍未受到包封。藉此，舉例來說，便可僅 部份包封電子元件，致使該電子元件中未受到包封的部份 可形成感測器（舉例來說，對光、壓力、溫度及/或化學物 質敏感的感測器）、形成熱交換器、或是可作為光學資料的 1360187 輸入或輸出。於WO 03/028086中所揭示之利用包封劑來 包封—晶片的方法與裝置中，該晶片表面的其中一部份必 須，持毫無任何包封劑。可於封閉一鑄模之後，利用位於 。玄曰曰片该部份及該鑄模其中一部份之間的材料來覆蓋此晶 片表面中必須維持未包封的部份。部份覆蓋該晶片之該表 面的材料較佳的係由比較軟的抗熱材料所製成。部份覆蓋 /表面之材料上方的適當壓力係來自作用於部份覆蓋該表 面之材料所接觸那—側的該晶片相對側上的包封劑。上面 所揭示之方法的問題係，其所提供之做法所適用的晶片係 僅在和該晶片必須維持未包封表面的相對側上由包封劑所 覆蓋。然而，此類型的產品未必全然符合市場需求。 【發明内容】 本發明的目的係'以簡單方式提供—種方法與裝置，其 可讓和電子元件相連之載體的裝配件能部份維持毫無任何 ^封鈉’纟中’與該電子元件遠離的一側會毫無任何包封 為達此目#本發明提供—種如中請專利範圍第1項 的方法。利用此方法，便可包封位於n㈣+元n 同時留下一部份未覆蓋的表面，該載體中與該等電子元件 遠離的—㈣仍然會維持未被包封劑包封。可達成此目的 的原因係，該電子元件鱼今厫 、佳…… 力分散主體間的連接係利用 ::厂一載體間的包封劑來部份實現。施加於該包 封劑上㈣力還可以作為《力分散主體上之電子元件的 U60187 適應性連接作用力，而不會如慣常令人討厭地出現在該載 體中和該電子元件遠離之側上的包封劑封裝的末端產品。 舉例來說，該電子元件與該載體間的空間會出現在所謂的 「覆晶」中。於此等覆晶中，電子元件（晶片）係藉由焊劑 凸塊而置放於一載體（電路板、引線框架）上。此處的焊劑 凸塊可於該載體與該電子元件間提供電連接效果，所以非 常重要。當施加於覆晶和該載體遠離的那一側上的負載過 大日守，#玄等焊劑凸塊將會變形，而此結果則是吾人不樂見 且無法接受的情況。根據本發明之方法現在便可於供給該 包封劑之前將該等覆晶上的壓力限制在不會讓該等焊劑凸 塊變形（或是幾乎不會變形）的程度，同時於供給該包封劑 期間’由於該包封劑施加於該壓力分散主體上之壓力的關 係，仍可防止流經該電子元件與該載體之間之包封劑所施 加的壓力讓該電子元件脫離（擠壓）該載體。 吾人所瞭解的壓力分散主體係代表一由可變形介質所 製成的主體，舉例來說，亦可稱為膠體，就所有膠體而言， 市面上販售的有商標名稱為r Gei_pak®」的膠體。此種材 料（舉例來說，製成一膠體層或膠體膜）所具有非常重要的 優點係局部施加於該電子元件及/或該載體上的負載可藉此 文到限制。於開始供給該包封劑給該鑄模腔穴以前，此負 载會特別受到限制。同時隨著該等鑄模部件的位移，該可 撓性壓力分散主體便可擠壓該電子元件中遠離該載體的那 一侧。使用一或多個壓力分散主體（至少一個壓力分散主體） 的重要優點係，可以利用該壓力分散主體來補償要包封的 1360187 電子7C件及/或其上安裝該電子元件的載體的維度變化情 形。因此，該等電子元件與該用於包封之載體的裝配件便 可獲得良好的連接效果（均勻地分散施加於該等電子元件與 -亥載體之裝配件上的封閉作用力），其中，該等元件(載體 與電子疋件）比較大的維度變化將不會造成干擾。 於根據本發明之方法的較佳變化例中，該可撓性壓力 刀政主體_透過一可撓性材料層擠壓其上安裝著該電子元 件之載體的裝配件。舉例來說，&塑膠所製成的箔片此處 可形成-保護性中間層。如此便可避免其上安裝著該電子 兀件的載體裝配件與該壓力分散主體間發生不必要的接 觸’舉例來說’從而可避免對該電子元件及/或該載體造成 負面效應，及/或可延長該壓力分散主體的使用壽命。 必要時，可將該可撓性壓力分散主體以可拆除的方式 置放於該反鑄模部件上。可藉由將個別的壓力分散主體置 放於該鎮模中，亦可排列位於層之上的壓力分散主 體’或疋其中該「落片」可能传—；十加Α β ; 曰门」J月b係凡全或部份具有一「膠體 層」或「膠體主體」。因此，*肱兮哲 」u此馮將该4壓力分散主體置放 於該鑄模中，舉例來說，可以利用 J用匕知的自動箔片材料供 給機。 於根據本發明之方法的另—應用變化中，該可撓㈣ 力分散主體會至少部份㈣該裝配件的載體，舉例來說， ㈣該載體中遠離該電子元件的那一側。本方法的此類應 用提供-種製造上述「無引線封裝」的解決方式，"並 無須使用覆蓋…該方式並不會如先前方式般地施以該 1360187 覆蓋箔片’反而是可利用一或多個可撓性壓力分散主體來 留下载體無任何覆蓋的部份。 本發明還提供一種如申請專利範圍第6項所述的裝 置，用以利用包封劑來部份包封安裝於一載體上的電子元 件。此裝置和既有的包封裝置僅略為不同，因此，將既有 的裝置轉換/修改為本發明之裝置非常簡單。利用根據本發 明之裝置便可實現上面參考根據本發明之方法所述的優 點。於該裝置的較佳實施例中，用於接收一可撓性壓力分 散主體的支托機構係至少部份形成在凹陷於該鑄模腔穴之 濩壁中的空間内。因此，便可以簡單的方式來固定該壓力 $散主體的位置。該裝置還可具備供該壓力分散主體及/或 箔片材料來使用的供應機構及釋放機構，其係位於該等鑄 模部件的侧邊。如上面所述般，5以分別利用此供應機構 及釋放機構將-壓力分散主體置放於該等鑄模部件之間並 且將其從該等鑄模部件中移除。 【實施方式】 現在將參考下面圖式中所示之非限制性示範實施例來 進一步闡述本發明。 圖1A所不的係一（覆晶）晶片1，其透過複數個焊劑凸 免2連接至-載體3。載體3係位於一鎮模部件*之上， 致使載體3的平扫側舍宗今址搞a 丁一惻會兀王被鑄槟部件4支撐。連 模部件4之上 蚜 鑄模邛件5，其會留下一空的鑄模 腔八6以包圍晶片1。膜和士钟 膠體主體7(壓力分散主體）係位於反 禱模部件5及晶片1之間，致使膠體主體7會施壓於晶片 1之上，不過，該壓力相當有限，致使於膠體主體7施壓 的影響下，焊劑凸塊2實質上不會變形。有一凹口 8位於 反鑄模部件5之令，用以定位該膠體主體。 圖1B中，鑄模部件4及反鑄模部件5包圍的鑄模腔 穴ό會填滿液態包封劑9。包封劑9上比較高的壓力亦會 存在於晶片1與載體3間的空間1〇之中，該空間中同時 係複數個焊劑凸塊2的所在。不過，相同的壓力亦會藉由 包封劑9而施加於膠體主體7之上，因此於晶片1上仍然 會有壓力差（於晶片1中面向反鑄模部件5的那一側至晶片 1中鄰接空間ίο的那一邊上會有壓力差），理論上該壓力 差大小如同圖1Α中所示的情況。雖然此壓力差並不會維 持相同大小，不過好處係，利用圖1A所示情況中晶片i 上的有限壓力，仍然可利用如同圖1B所示情況中足夠大 的生成作用力將晶片1擠壓於載體3之上。鑄模腔穴6中 的包封劑9會包圍晶片1，致使晶片丨中保持沒有任何包 封劑9的那一側的高度或多或少等於已固化包封劑9中遠 離載體3的那一側。施加該包封劑之後，舉例來說，可以 簡單的方式將一冷卻構件（圖中未顯示）固定至晶片！中。 圖1C所禾的係一（覆晶）晶片1，如同前面圖式般，其 透過複數個焊劑凸塊2連接至一載體3 ^載體3係位於一 鑄模部件4之中。連接於鑄模部件4之上的係一反鑄模部 件25,其會留下一空的鑄模腔穴26以包圍晶片i。不同 於圖1A與1B中所示的鑄模腔穴6及膠體主體7，圖 ίο lb 1360187 1360187 ^斤示的_腔穴26及膠體主體27構成後並非讓膠體主 僅耦口曰曰片1其中-側。膠體主體27會耦合於晶片 1上，致使㈣欲施加的包封劑不僅可於W 1中留下空 的一侧’而且該晶片1還可伸出該包封齊卜 圖2所示的係一截體 一 戰骽12的俯視圖，其部份被包封劑11 覆蓋，並且其上安裝四個保留立々 饰4 〇|5份未包封的晶片13。舉例 來說，可於後續的作業中切開該等晶片13。 圖3Α戶斤示的係用於套用本發明之方法的膠體主體 15。圖3Β所示的係一膠號士脚^ 胗體主體16，該膠體主體其中一側 具有-Η層η用以保護該膠體㈣18，使其與（部份） 週遭區域隔離。圖3C，的剖面圖所示的係一夥體主體19, 其膠體材料20的各側被—保護性落片層21包圍。於膠體 主體的此變化實施例中，除了膠體材料2()之外，亦可 應用其它材料’以滿足將該材料固定在一起的方面比較寬 鬆的要求。因A ’亦可利用液體（視情況可為黏滯性液體） 來取代膠體材料20。目3D所示的係、—箱片層22，舉例來 說，利用既有的機構（圖中未顯示）便可輕易地將其置入一 鑄模中或是從-鑄模中將其移除。於箔片I 22之上則置 放複數個膠體主體23。 【圖式簡單說明】 圖1A所示的係—位於一鑄模中之具有覆晶的載體於 供給包封劑以前的剖面圖，其中該覆晶係與一壓力分散主 體產生耦合’ 11 丄 圖1B所示的係對應圖 間的剖面圖， 1A所示之部份於供給包封劑期 圖1C所示的係一位於一轉模中之具有覆晶的裁體於 供給包封劑以前的剖面圖，纟中該覆晶係與一壓力分散主 體的替代變化實施例產生耦合， …圖2所示的係一具有四個包封晶片之載體的俯視圖， 该等晶片其中一部份毫無任何包封劑， 圖3A所示的係一配合本發明之方法來使用的壓力分 散主體的立體圖， 圖3B所示的係一具備一塑膠羯片層之壓力分散主體 的替代變化實施例的立體圖， 圖3C戶斤示的係一被塑膠羯片層包圍的壓力分散主體 的第一替代變化實施例的剖面圖，以及 圖3D所不的係一具備複數個壓力分散主體的箔片層 的立體圖。1360187 IX. Description of the Invention: [Technical Field of the Invention] As claimed in the first paragraph of the patent application, the present invention relates to an encapsulation method which utilizes an encapsulant to partially encapsulate a carrier connected to an electronic component. Assembly accessories. The invention is also directed to a device for applying the method, as set forth in the sixth paragraph of the patent application. [Prior Art] It is a common technique to encapsulate an electronic component mounted on a carrier with an encapsulant. Here, a carrier having an electronic component that has not been encapsulated is usually sandwiched between two mold parts in such a manner that a plurality of mold cavities are formed in the vicinity of the electronic components for encapsulation (especially but not Limited to encapsulation of semiconductor components). The heated (liquid) encapsulant is then delivered through the chute to the mold cavities by a conventional method using a piston system to cause the mold cavities to fill the encapsulant. After at least partially curing the encapsulant, the mold parts can be removed so that the carrier having the electronic component now covered by the encapsulant can be released from the mold parts. This method is also known as transfer casting. It is also necessary to partially encapsulate the electronic component on the carrier by transfer casting, i.e., embedding it in the encapsulant such that a portion of the electronic component remains unencapsulated. By way of example, the electronic component can only be partially encapsulated, such that the unencapsulated portion of the electronic component can form a sensor (for example, for light, pressure, temperature, and/or chemicals) Sensitive sensors), forming heat exchangers, or 1360187 inputs or outputs that can be used as optical data. In the method and apparatus for encapsulating a wafer using an encapsulant as disclosed in WO 03/028086, a portion of the surface of the wafer must be held without any encapsulant. It can be used after closing a mold. The material between the portion of the Xuanqi film and a portion of the mold covers the unencapsulated portion of the surface of the wafer. The material partially covering the surface of the wafer is preferably made of a relatively soft heat resistant material. The appropriate pressure above the portion of the cover/surface material is from the encapsulant on the opposite side of the wafer that is applied to the side that is in contact with the material covering the surface. The problem with the method disclosed above is that the wafers to which it is applied are covered by the encapsulant only on the opposite side of the wafer from which the unencapsulated surface must be maintained. However, this type of product may not be fully compliant with market demand. SUMMARY OF THE INVENTION The object of the present invention is to provide a method and apparatus in a simple manner that allows the assembly of a carrier connected to an electronic component to be partially maintained without any sealing of the electronic component. The side that is far away will have no enveloping for this purpose. The invention provides a method of the first item of the patent scope. With this method, it is possible to enclose an n (four) + element n while leaving a portion of the uncovered surface in which the (4) away from the electronic components will remain unencapsulated. The reason for this can be achieved by the fact that the electronic component is well connected to the main body by means of an encapsulant between the carrier and the carrier. The force applied to the encapsulant (4) can also serve as the U60187 adaptive connection force of the electronic component on the force dispersion body, and does not appear in the carrier and the side away from the electronic component as usual. The end product of the encapsulant package. For example, the space between the electronic component and the carrier can occur in so-called "flip-chip". In such flip chip, electronic components (wafers) are placed on a carrier (circuit board, lead frame) by solder bumps. The solder bumps herein are of great importance in providing electrical connection between the carrier and the electronic component. When the load applied to the side of the flip chip and the carrier is too large, the flux bumps such as #玄 will be deformed, and the result is unpleasant and unacceptable. The method according to the present invention can now limit the pressure on the flip chip to a degree that does not cause the solder bumps to deform (or hardly deform) before supplying the encapsulant, while supplying the package During the sealing period, due to the pressure exerted by the encapsulant on the pressure-dispersing body, the pressure exerted by the encapsulant flowing between the electronic component and the carrier can be prevented from being detached (squeezing) ) the vector. The pressure-dispersing main system that we understand represents a body made of a deformable medium. For example, it can also be called a colloid. For all colloids, the trademark "r Gei_pak®" is commercially available. colloid. A very important advantage of such a material (for example, forming a colloidal layer or a colloidal film) is that the load applied locally to the electronic component and/or the carrier can be limited by this. This load is particularly limited before the supply of the encapsulant to the mold cavity begins. At the same time, with the displacement of the mold parts, the flexible pressure dispersing body can squeeze the side of the electronic component remote from the carrier. An important advantage of using one or more pressure-dispersing bodies (at least one pressure-dispersing body) is that the pressure-dispersing body can be utilized to compensate for dimensional variations of the 1360187 electronic 7C member to be encapsulated and/or the carrier on which the electronic component is mounted. situation. Therefore, the electronic components and the assembly for the carrier for encapsulation can obtain a good connection effect (to uniformly disperse the sealing force applied to the components of the electronic components and the carrier), wherein Larger dimensional variations of these components (carriers and electronic components) will not cause interference. In a preferred variant of the method according to the invention, the flexible pressure knife body - the assembly of the carrier on which the electronic component is mounted is extruded through a layer of flexible material. For example, a foil made of & plastic can form a protective intermediate layer here. In this way, unnecessary contact between the carrier assembly on which the electronic component is mounted and the pressure-dispersing body can be avoided, for example, to avoid negative effects on the electronic component and/or the carrier, and/ Or it can extend the service life of the pressure dispersion body. The flexible pressure-dispersing body can be removably placed on the reverse mold part if necessary. The individual pressure dispersion bodies can be placed in the town mold, or the pressure dispersion body located above the layer can be arranged or the "drop film" can be transmitted - ten plus Α β; The month b has a "colloidal layer" or a "colloidal body" in whole or in part. Therefore, *肱兮哲 u von puts the 4 pressure dispersion body in the mold, for example, it can be supplied to the machine by using a known automatic foil material. In a further application variant of the method according to the invention, the flexible (four) force dispersing body will at least partially (d) the carrier of the assembly, for example, (iv) the side of the carrier remote from the electronic component. Such an application of the method provides a solution for the manufacture of the above-mentioned "leadless package", " no need to use coverage... this method does not apply the 1360187 cover foil as in the previous manner' instead Or a plurality of flexible pressure-dispersing bodies to leave a portion of the carrier without any coverage. The invention also provides a device as claimed in claim 6 for partially encapsulating an electronic component mounted on a carrier with an encapsulant. This device is only slightly different from the existing encapsulation device, and therefore it is very simple to convert/modify the existing device to the device of the present invention. The advantages described above with reference to the method according to the invention can be achieved by means of the device according to the invention. In a preferred embodiment of the apparatus, the support mechanism for receiving a flexible pressure-dispersing body is at least partially formed in a space recessed in the wall of the mold cavity. Therefore, the position of the pressure body can be fixed in a simple manner. The apparatus may also be provided with a supply mechanism and a release mechanism for use with the pressure-dispersing body and/or foil material, which are located on the sides of the mold members. As described above, 5 is used to separate the pressure-dispersing body between the mold members and to remove them from the mold members, respectively, using the supply mechanism and the release mechanism. [Embodiment] The present invention will now be further elucidated with reference to the non-limiting exemplary embodiments shown in the drawings below. What is shown in Fig. 1A is a (flip-chip) wafer 1 which is connected to the carrier 3 through a plurality of solder bumps 2. The carrier 3 is located above a town mold part*, so that the flat side of the carrier 3 is placed on the site of the shovel. On top of the mold member 4, a mold member 5 is formed which leaves an empty mold cavity 8 to surround the wafer 1. The film and the body of the gum body 7 (pressure-dispersing body) are located between the counter-molding mold member 5 and the wafer 1, so that the colloidal body 7 is pressed against the wafer 1, but the pressure is rather limited, resulting in the colloidal body 7 Under the influence of the pressure, the solder bumps 2 are substantially not deformed. A recess 8 is located in the reverse mold part 5 for positioning the colloid body. In Fig. 1B, the cavity of the mold surrounded by the mold member 4 and the reverse mold member 5 is filled with the liquid encapsulant 9. A relatively high pressure on the encapsulant 9 will also be present in the space 1 between the wafer 1 and the carrier 3, in which a plurality of solder bumps 2 are simultaneously located. However, the same pressure is also applied to the colloid body 7 by the encapsulant 9, so that there is still a pressure difference on the wafer 1 (on the side of the wafer 1 facing the reverse mold part 5 to the wafer 1) There is a pressure difference on the side of the adjacent space ίο, which is theoretically the same as shown in Figure 1Α. Although this pressure difference does not maintain the same size, the advantage is that, with the limited pressure on the wafer i in the case shown in Fig. 1A, the wafer 1 can still be squeezed by a generating force large enough as in the case shown in Fig. 1B. Above the carrier 3. The encapsulant 9 in the mold cavity 6 will surround the wafer 1 such that the height of the side of the wafer which is free of any encapsulant 9 is more or less equal to the one of the cured encapsulant 9 remote from the carrier 3. side. After application of the encapsulant, for example, a cooling member (not shown) can be fixed to the wafer in a simple manner! in. The flip-chip wafer 1 of Fig. 1C, as in the previous figure, is connected to a carrier through a plurality of solder bumps 2. The carrier 3 is placed in a mold member 4. Attached to the mold member 4 is a reverse mold portion 25 which leaves an empty mold cavity 26 to surround the wafer i. Different from the mold cavity 6 and the colloid body 7 shown in FIGS. 1A and 1B, the cavity 26 and the colloid body 27 of FIG. 1 lb 1360187 1360187 are not configured to allow the colloid main body to only couple the cymbal 1 -side. The colloid body 27 is coupled to the wafer 1 such that (4) the encapsulant to be applied can not only leave an empty side in W 1 ' but the wafer 1 can also extend the envelope as shown in Figure 2. A top view of the first warhead 12 is partially covered by an encapsulant 11 and has four remaining enamels and five unencapsulated wafers 13 mounted thereon. For example, the wafers 13 can be cut in subsequent operations. Figure 3 shows the colloid body 15 used to apply the method of the present invention. Figure 3A shows a body of a slinger body, the body of which has a Η layer η on one side to protect the body (4) 18 from the (partial) surrounding area. 3C is a cross-sectional view of a body 19 in which the sides of the colloidal material 20 are surrounded by a protective falling sheet layer 21. In this variant embodiment of the colloidal body, in addition to the colloidal material 2(), other materials may be applied to meet the requirements for loosening the material together. The colloidal material 20 can also be replaced by a liquid (as the case may be a viscous liquid) because of A'. The system shown in Fig. 3D, the box layer 22, for example, can be easily placed in a mold or removed from a mold by using an existing mechanism (not shown). Above the foil I 22, a plurality of colloid bodies 23 are placed. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1A is a cross-sectional view of a flip-chip carrier in a mold prior to supply of an encapsulant, wherein the flip-chip is coupled to a pressure-dispersing body. 11 Figure 1B The figure shows a cross-sectional view between the drawings, and the portion shown in FIG. 1A is in the section of the supply encapsulant period shown in FIG. 1C, and the section having the flip chip in the mold is supplied before the supply of the encapsulant. In the drawing, the flip-chip is coupled to an alternative embodiment of a pressure-dispersing body, ... a top view of a carrier having four encapsulated wafers, one of which has no part of the wafer The encapsulant, FIG. 3A is a perspective view of a pressure-dissipating body used in conjunction with the method of the present invention, and FIG. 3B is a perspective view of an alternative embodiment of a pressure-dispersing body having a plastic sheet layer. 3C is a cross-sectional view showing a first alternative embodiment of a pressure-dispersing body surrounded by a plastic sheet layer, and FIG. 3D is a perspective view of a foil layer having a plurality of pressure-dispersing bodies.

【主要元件符號說明】 1 晶片 2 焊劑凸塊 3 載體 4 鑄模部件 5 反鑄模部件 6 鑄模腔穴 7 膠體主體（壓力分散主體） 12 1360187 8 凹口 9 包封劑 10 空間 11 包封劑 12 載體 13 晶片 15 膠體主體 16 膠體主體 17 箔片層 18 膠體材.料 19 膠體主體 20 膠體材料 21 箔片層 22 箔片層 23 膠體主體 25 反鑄模部件 26 鑄模腔穴 27 膠體主體[Main component symbol description] 1 Wafer 2 Solder bump 3 Carrier 4 Mold part 5 Reverse mold part 6 Mold cavity 7 Colloid body (pressure dispersion main body) 12 1360187 8 Notch 9 Encapsulant 10 Space 11 Encapsulant 12 Carrier 13 Wafer 15 Colloid body 16 Colloid body 17 Foil layer 18 Colloid material 19. Material body 21 Colloid material 21 Foil layer 22 Foil layer 23 Colloid body 25 Reverse mold part 26 Mold cavity 27 Colloid body

1313

Claims (1)

丄 丄丄 丄 十、申請專利範圍： I -種包封方法，其利用包封 -件相連之載體的袈配件，該；…和電子 次乃在a祜如下的處拽牛 A) 將該载體以及安裝其上之電子元件的至*二. ㈣於—鑄模部件及—反鑄模部件之間 二了伤 鑄模腔穴以包圍該電子元件， 便也成至少一 B) 於該鑄模腔穴中引人液態包封劑，以及 ^於至少部份固化該包封劑之後從該㈣模 除该具有經包封之電子元件的載體， 其中於根據處理步驟（B)供仏 '、。該液^、包封劑給該.鑄模腔 八之…可撓性壓力分散主體擠塵 體的那一側，以及 仟m離，亥載 件 該載體遠離該電子元件的那一側係置放靠著一鑄模部 該反鑄模部件會擠屬該載體攜載該電子元件的那 側，以及 丨 至）於處理步驟⑻期間，位於該載體及該電子元件門 之空間會充滿包封劑’其中該載體遠離該電子元件的那二 側會保持沒有包封劑， 該方法特徵為： 4壓力分散主體是由—可變形介f所組成，且該壓力 分：主體置放在該反鑄模部件中的一凹口之中，由於由該 液態包封劑所施加的壓力’使得該壓力分散主體施加壓： 於該電子元件的那—侧之上。 14 Ι36Θ187 2·如t請專利範圍第1項之方法，其 塵力分散主體係夹放於該電子元件遠離該載體的ΓΓ 及該反鑄模部件之間。 力丨—側以 3. 如_ #專利範圍第^或2項之方净，其特 撓性壓力分散主體透過一可挽性材料層擠愿上^可 子元件之载體的裝配件。 文褒有電 4. 如_請專利範圍第1或2項之方法，並特 撓性壓力分散主體係以可拆除 八、徵為该可 中。 斥除的方式置放於該反鑄模部件 於性邀：：：專利乾圍弟1或2項之方法，其特徵為該可 力…體至少部份擠屢該載體遠離該電子元件的 那一側。 电卞凡件的 _ 6·-種包封裝置’其利用包㈣來部份 -載體上的電子元件，該裝置包括： 女裝於 數個可彼此位移的鑄模部件，而且該等禱模部件適合 二，、間至少部份接收該载體，其中第一鑄模部件具備心 一和該載體相連的鑄模腔穴， 、包封劑供給機構.，用以將包封劑連接至該鑄模腔穴， 以及 支托機構，其係至少部份形成在凹陷於該鑄模腔穴之 中的二間内’用以接收一可撓性壓力分散主體， 件特徵為·該褒置具備第二鑄模部件’該第二鑄模部 呈肖卩支撐該載冑遠離該電子元件的那叫則，且該骏 也”備供位於該等鑄模部件的側邊之猪片材料來使用的 15 1360187 ----— 100年7月18日修正替換頁 供應機構， °亥壓力分散主體是由一可變形介質所組成，且 分散主, 金刀 置放在該第一鑄模部件中的一凹口之中， 該包封劑戶斤1 @ ^ J所知加的屋力，使得該壓力分散主體施加壓力於 該電子元件的那一側之上。 、 ⑽二：專利範圍“項之裝置，其特徵為該裳置還 a I釋放機構，其係位於該等鑄模部件的側邊。 如中請專利範圍第6或7項之裝置，其特徵為 置還具備壓力分散主體供應機構。 Z、 十 •、圖式： 如次頁 16X. Patent application scope: I-type encapsulation method, which utilizes the 袈 fitting of the carrier-enclosed carrier, the yak and the electronic sub-in the yak as follows: A) the carrier and the installation thereof The upper part of the electronic component is up to *2. (4) between the mold part and the back mold part, the mold cavity is wound to surround the electronic component, and at least one B) is introduced into the cavity of the mold cavity. a sealant, and after at least partially curing the encapsulant, the carrier having the encapsulated electronic component is removed from the (4), wherein it is supplied according to process step (B). The liquid and the encapsulant are given to the side of the mold cavity, wherein the flexible pressure disperses the side of the main body, and the side of the carrier is away from the electronic component. The back mold part is forced against the side of the carrier carrying the electronic component by a mold portion, and during the processing step (8), the space between the carrier and the electronic component door is filled with the encapsulant ' The carrier is kept away from the two sides of the electronic component and has no encapsulant. The method is characterized in that: 4 the pressure dispersion body is composed of a deformable medium f, and the pressure component is placed in the reverse mold part. Among the notches, the pressure disperses the body to apply pressure due to the pressure applied by the liquid encapsulant: above the side of the electronic component. 14 Ι36Θ187 2. The method of claim 1, wherein the dust-dispersing main system is sandwiched between the cymbal of the electronic component away from the carrier and the counter-mold part.丨 侧 侧 侧 侧 侧 侧 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利Wenhao has electricity. 4. For example, please refer to the method of the first or second patent range, and the special flexible pressure dispersion system is detachable. The method of disposing the method in the reverse casting mold part::: patent dry brother 1 or 2, characterized in that the body is at least partially squeezed from the carrier away from the electronic component side. The _ 6·-type encapsulation device of the electronic device uses the package (4) to partially-the electronic components on the carrier, and the device comprises: a woman wearing a plurality of mold parts that can be displaced from each other, and the prayer parts Suitably, at least partially receiving the carrier, wherein the first mold part has a mold cavity connected to the carrier, and an encapsulant supply mechanism for connecting the encapsulant to the mold cavity And a supporting mechanism formed at least partially in two of the cavities recessed in the cavity for receiving a flexible pressure-dispersing body, the member being characterized by the second molded part The second mold portion supports the name of the carrier away from the electronic component, and the Jun is also provided with 15 1360187 for use on the side of the pig piece material of the mold parts. Corrected the replacement page supply mechanism on July 18, 100, the ° Hai pressure dispersion body is composed of a deformable medium, and the main body is dispersed, and the gold knife is placed in a notch in the first mold part, the package Sealing agent 1 @ ^ J knows the addition of house power, so that The pressure-dispersing body is applied with pressure on the side of the electronic component. (10) 2: The device of the patent scope, characterized in that the skirt is also provided with a release mechanism, which is located on the side of the mold member side. The apparatus of claim 6 or 7, wherein the apparatus further comprises a pressure dispersion main body supply mechanism. Z, ten •, schema: as the next page 16
TW093126868A 2003-09-09 2004-09-06 Method and device for encapsulating electronic com TWI360187B (en)

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CN105917451B (en) * 2014-01-14 2018-07-06 山田尖端科技株式会社 Resin molded mold and resin molding method
NL2015091B1 (en) * 2015-07-06 2017-01-30 Besi Netherlands Bv Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
DE102017131110A1 (en) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh METHOD FOR EMBEDDING OPTOELECTRONIC COMPONENTS INTO A LAYER

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NL9500238A (en) * 1995-02-09 1996-09-02 Fico Bv Casing device with compensation element.
NL1000777C2 (en) * 1995-07-11 1997-01-14 3P Licensing Bv Method of encapsulating an electronic component, electronic component suitable for use in performing this method and encapsulated component obtained using the method.
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