1291254 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種發光二極體封裝結構，特別是有 關於一種具有多個反射杯之發光二極體封裝結構。 【先前技術】 發光二極體由於具有體積小、效率高、省電等優點 因此逐漸取代耗電量大、使用壽命短的鎢絲燈及具有污$ • 性的水銀燈管，成為新一代的發光與照明設備。目前，^ 光一極體已被大篁應用於交通號諸燈、汽車車燈、芒主看 板及投射燈等產品上。 ' σ 習知的發光二極體封裝結構，為了產生更大功率的單 ; 一光源，因此將多個發光二極體晶片封裝在一起。然而， - 將多個發光二極體晶片設置在同一發光二極體封裝锋構， 因為相鄰發光二極體晶片相互遮蔽，將造成整體發光效率 的下降。此外，將越多的發光二極體晶片封裝在一起，所 • 產生的熱也越多，因此散熱亦成為發光二極體封裝結構擊 造的一大挑戰。 為了使發光二極體封裝結構整體的發光效率及散熱效 率增加，發光二極體光電組件的製造商莫不極力的尋求解 決方式，以克服上述的問題。 【發明内容】 本發明之目的就是在提供一種發光二極體封裝結構， 解決習知發光二極體封裝結構因為相鄰發光二極體晶片相 5 1291254 互遮蔽，造成整體發光效率下降的問題。 本發明另一目的就是在提供一種發光二極體封裝結 構，解決習知發光二極體封裝結構將多個發光二極體晶片 封裝在一起，產生散熱效率不佳的問題。 根據以上所述之目的，提出一種發光二極體封裝結構 包括有-印刷電路板、一散熱基座、複數個發光單元以及 一封膠。其中散熱基座設置於印刷電路板上。發光單元設 置於散熱基座上，每-發光單元包括—反射杯及—發光二 ® 極體晶片，發光二極體晶片設置於反射杯内且電性連接印 刷電路板。封膠覆蓋發光單元。 本發明之發光二極體封裝結構，每一發光二極體晶片 . 具有獨立的反射杯，相鄰發光二極體晶片以反射杯分隔， 不會產生相互遮蔽、相互照射及熱量蓄積的現象，因此可 以提鬲發光二極體封裝結構的發光效率及散熱效率。 【實施方式】 # 為了增加發光二極體封裝結構的發光效率及散熱效 率’本發明提出一種具有複數個反射杯的發光二極體封裝 結構，每一反射杯僅設置一發光二極體晶片，因此可以提 供發光二極體晶片良好的反射面，使得此發光二極體封裝 結構的發光效率及散熱效率更佳。 第1圖繪示依照本發明一較佳實施例之發光二極體封 裝結構100的上視圖。第2圖繪示第1圖中發光二極體封 裝結構100的A-A’剖面圖。同時參照第1圖及第2圖，發 光二極體封裝結構1〇〇包括有一印刷電路板11〇、一散熱基 6 1291254 座120、複數個發光單元13〇以及一封膠ι4〇。其中散熱基 座120設置於印刷電路板11〇上。發光單元13〇設置於散 熱基座120上，每一發光單元130包括一反射杯132及一 發光二極體晶片134,發光二極體晶片134設置於反射杯 132内且電性連接印刷電路板11〇。封膠14〇覆蓋全部發光 單元130。 參^弟2圖’發光二極體封裝結構1 〇〇是以印刷電路 板110為基材，散熱基座12〇嵌入印刷電路板11〇中或設 | 置於印刷電路板11 〇上。散熱基座12〇的材料可以是金、 銀、銅、鉑、鋁、鎳、錫鎂或陶瓷。散熱基座12()藉由粘 合材料固定於印刷電路板11 〇。粘合材料可以是環氧樹脂、 壓克力、矽膠或上述材料的組合。發光二極體封裝結構1〇〇 具有複數個發光單元130,每一發光單元130是由一反射杯 ' 132及一發光二極體晶片134組成。每一反射杯132例如是 散熱基座120之一凹陷部或突出於散熱基座12〇之一杯狀 結構。值得一提的是，當反射杯132是散熱基座120之凹 , 卩曰部’可以細小散熱基座12Q之體積。每一反射杯I]〗設 置一發光一極體晶片134’反射杯132具有平坦的底面136 及傾斜的側壁138。反射杯132之杯深（d)與散熱基座12〇 之厚度（D)比例例如是約3:4 ’反射杯132開口角度（A)例如 是約60度’底面136及側壁138表面可以電鍍一反射層 139(例如金或銀），使反射杯132具有較佳的反射效果。 發光一極體晶片13 4經打線製程連接到印刷電路板 110。當發光二極體晶片134受到印刷電路板11〇之驅動而 發光，由於每一發光二極體晶片134具有獨立的反射杯 7 1291254 132，相鄰發光二極體晶片134之發光面以反射杯132分 隔，不會產生發光面相互遮蔽的現象，因此可以提高發光 一極體封裝結構100的發光效率。此外，相鄰發光二極體 晶片134以反射杯132分隔，不會產生相互照射及熱量蓄 積的現象，因此可以提高發光二極體封裝結構1〇〇的散熱 效率。 繼續參照第1圖及第2圖，封膠140覆蓋全部發光單 元130形成單一封裝結構，此封膠140之材料例如是環氧 樹脂、壓克力或矽膠。光學透鏡150設置於封膠14〇上， 用以增加發光二極體封裝結構1〇〇發光的亮度及調整發光 的角度。光學透鏡150的材料可以是高透光性的熱塑性樹 脂’例如PS(聚笨乙烯）、ABS(苯乙烯-丁二烯-丙稀酯）、 PMMA(聚曱基丙烯曱酯）、pc(聚碳酸酯）、環氧樹脂或玻璃。 值得一提的是，本發明之發光二極體封裝結構1〇〇，由 於具有較佳的散熱效率，因此可藉由表面粘著技術及印刷 電路板精密的佈線技術，結合較大面積的金屬散熱基座 120,將更多的發光二極體晶片134封裝於單一發光二極體 封裝結構100。進而提高發光二極體封裝結構1 〇〇之亮度， 相較於習知在一個反射杯内設置多個發光二極體晶片，本 發明可以增加發光二極體封裝結構10〇之亮度達25%以上。 弟3 A圖至第3E圖繪示依照本發明其他較佳實施例之 散熱基座之上視圖。參照第3A圖，散熱基座31〇具有三個 反射杯132,此些反射杯132於散熱基座310上係呈一三角 形分佈。參照第3B圖，散熱基座320具有四個反射杯132， 此些反射杯132於該散熱基座320上係呈一矩形分佈。參 81291254 IX. Description of the Invention: [Technical Field] The present invention relates to a light emitting diode package structure, and more particularly to a light emitting diode package structure having a plurality of reflective cups. [Prior Art] Due to its small size, high efficiency, and power saving, the LED has gradually replaced the tungsten lamp with high power consumption and short service life and the mercury lamp with fouling, making it a new generation of illuminating light. With lighting equipment. At present, the photo-polar body has been used in traffic lights, car lights, man-view boards and projection lamps. ' σ conventional light-emitting diode package structure, in order to generate a single unit of higher power; thus, a plurality of light-emitting diode chips are packaged together. However, a plurality of light-emitting diode chips are disposed in the same light-emitting diode package, and the adjacent light-emitting diode wafers are shielded from each other, resulting in a decrease in overall luminous efficiency. In addition, the more light-emitting diode chips are packaged together, the more heat is generated, so heat dissipation is also a major challenge in the fabrication of light-emitting diode packages. In order to increase the luminous efficiency and heat dissipation efficiency of the entire LED package structure, the manufacturer of the light-emitting diode optoelectronic component is eager to find a solution to overcome the above problems. SUMMARY OF THE INVENTION The object of the present invention is to provide a light emitting diode package structure, which solves the problem that the conventional light emitting diode package structure is shielded by the adjacent light emitting diode wafer phase 5 1291254, resulting in a decrease in overall luminous efficiency. Another object of the present invention is to provide a light emitting diode package structure that solves the problem that a conventional light emitting diode package structure packages a plurality of light emitting diode chips together, resulting in poor heat dissipation efficiency. According to the above object, a light emitting diode package structure includes a printed circuit board, a heat sink base, a plurality of light emitting units, and a glue. The heat dissipation base is disposed on the printed circuit board. The light-emitting unit is disposed on the heat-dissipating base, and each of the light-emitting units includes a reflective cup and a light-emitting diode, and the light-emitting diode chip is disposed in the reflective cup and electrically connected to the printed circuit board. The sealant covers the light unit. The LED package structure of the present invention has a separate reflector cup, and the adjacent LED chips are separated by a reflective cup without mutual shielding, mutual illumination and heat accumulation. Therefore, the luminous efficiency and the heat dissipation efficiency of the LED package structure can be improved. [Embodiment] # In order to increase the luminous efficiency and heat dissipation efficiency of the LED package structure, the present invention provides a light-emitting diode package structure having a plurality of reflector cups, and each reflector cup is provided with only one LED chip. Therefore, a good reflective surface of the LED chip can be provided, so that the luminous efficiency and heat dissipation efficiency of the LED package structure are better. 1 is a top plan view of a light emitting diode package structure 100 in accordance with a preferred embodiment of the present invention. Fig. 2 is a cross-sectional view showing the A-A' of the light emitting diode package structure 100 in Fig. 1. Referring to Figures 1 and 2, the light-emitting diode package structure 1A includes a printed circuit board 11A, a heat-dissipating base 6 1291254, 120, a plurality of light-emitting units 13A, and a glue 〇4. The heat dissipation base 120 is disposed on the printed circuit board 11A. The light-emitting unit 13 is disposed on the heat-dissipating base 120. Each of the light-emitting units 130 includes a reflective cup 132 and a light-emitting diode wafer 134. The light-emitting diode wafer 134 is disposed in the reflective cup 132 and electrically connected to the printed circuit board. 11〇. The sealant 14 〇 covers all of the light-emitting units 130. The light-emitting diode package structure 1 is based on the printed circuit board 110, and the heat-dissipating susceptor 12 is embedded in the printed circuit board 11 or placed on the printed circuit board 11 。. The material of the heat dissipation base 12〇 may be gold, silver, copper, platinum, aluminum, nickel, tin magnesium or ceramic. The heat sink base 12 () is fixed to the printed circuit board 11 by an adhesive material. The bonding material may be epoxy, acryl, silicone or a combination of the above. The light emitting diode package structure 1 has a plurality of light emitting units 130, and each of the light emitting units 130 is composed of a reflective cup '132 and a light emitting diode wafer 134. Each of the reflective cups 132 is, for example, a recessed portion of the heat sink base 120 or protrudes from the heat sink base 12 into a cup-like structure. It is worth mentioning that when the reflective cup 132 is concave of the heat dissipation base 120, the crotch portion can finely dissipate the volume of the base 12Q. Each of the reflector cups has a flat bottom surface 136 and a sloped side wall 138. The ratio of the depth of the cup (d) of the reflector cup 132 to the thickness (D) of the heat sink base 12 is, for example, about 3:4 'the angle of the opening of the reflector cup 132 (A) is, for example, about 60 degrees. The surface of the bottom surface 136 and the side wall 138 can be plated. A reflective layer 139 (e.g., gold or silver) provides a reflective effect to the reflective cup 132. The light-emitting one-pole wafer 13 4 is connected to the printed circuit board 110 via a wire bonding process. When the LED chip 134 is driven by the printed circuit board 11 to emit light, since each of the LED chips 134 has a separate reflective cup 7 1291254 132, the light emitting surface of the adjacent LED wafer 134 is a reflective cup. Since the 132 is separated, the phenomenon that the light-emitting surfaces are shielded from each other is not generated, so that the light-emitting efficiency of the light-emitting monopole package structure 100 can be improved. Further, the adjacent light-emitting diode wafers 134 are separated by the reflective cups 132, so that mutual radiation and heat accumulation do not occur, so that the heat-dissipating efficiency of the light-emitting diode package structure 1 can be improved. Continuing with reference to Figures 1 and 2, the encapsulant 140 covers all of the light-emitting units 130 to form a single package structure, such as epoxy, acrylic or silicone. The optical lens 150 is disposed on the encapsulant 14 , to increase the brightness of the illuminating diode package structure and adjust the angle of illumination. The material of the optical lens 150 may be a highly transparent thermoplastic resin such as PS (polystyrene), ABS (styrene-butadiene-propyl ester), PMMA (poly(alkylene acrylate), pc (poly) Carbonate), epoxy or glass. It is worth mentioning that the LED package structure of the present invention has a better heat dissipation efficiency, and can be combined with a large area of metal by surface adhesion technology and precise wiring technology of a printed circuit board. The heat dissipation base 120 encapsulates more LED chips 134 in the single LED package structure 100. Further, the brightness of the LED package structure is improved. Compared with the conventional arrangement of a plurality of LEDs in a reflective cup, the present invention can increase the brightness of the LED package structure by 25%. the above. 3A through 3E are views showing the upper side of the heat sink base in accordance with other preferred embodiments of the present invention. Referring to Fig. 3A, the heat dissipation base 31 has three reflective cups 132, and the reflective cups 132 are distributed in a triangular shape on the heat dissipation base 310. Referring to FIG. 3B, the heat dissipation base 320 has four reflective cups 132. The reflective cups 132 are distributed in a rectangular shape on the heat dissipation base 320. Reference 8
1291254 照第3C圖，散熱基座330具有五個反射杯132，此些反射 杯132其中四個於散熱基座33〇上係呈一矩形分佈，另一 個反射杯132a位於矩形中心。參照第3D圖，散熱基座34〇 具有六個反射杯132,此些反射杯132其中五個於散熱基座 340上係呈一正五邊形分佈，另一個反射杯13沘位於正五 邊形中心。參照第3E圖，散熱基座35〇具有七個反射杯 132 ,此些反射杯132其中六個於散熱基座35〇上係呈一正 六邊形分佈，另一個反射杯132〇位於六邊形中心。值得一 提的疋，反射杯均勻分佈於散熱基座上。可以使發光二極 體封裝結構具有較佳的散熱效率。 由上述本發明較佳實施例可知，本發明具有以下優點： 1 ·本發明之發光二極體封裝結構具有複數個發光單 元，每一發光單元是由一反射杯及一發光二極體晶片組 成。每一發光二極體晶片具有獨立的反射杯，相鄰發光二 極體晶片以反射杯分隔，可以提高發光二極體封裝結構的 發光效率及散熱效率。 ,2.本發明之發光二極體封裝結構，可藉由表面粘著技 術及印刷電路板精密的佈線技術，結合較大面積的金屬散 熱基座，將更多的發光二極體晶片封裝於單一發光二極： 封裝結構。進而提高發光三極體封裝結構之亮度，相較於 習知在-個反射杯内設置多個發光二極體晶片，本發明可 以增加發光二極體封裝結構之亮度達25%以上。 —雖然本發明已以較佳實施例揭露如上，然其並非用以 限疋本發明，任何熟習此技藝者，在不脫離本發明之精 和範圍内’當可作各種之更動與潤飾，因此本發明之保護 1291254 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖繪示依照本發明一較佳實施例之發光二極體封 裝結構100的上視圖。 第2圖繪示第1圖中發光二極體封裝結構1〇〇的a_a, 剖面圖。 弟3 A圖至弟3E圖繪示依照本發明其他較佳實施例之 散熱基座之上視圖。 【主要元件符號說明】 100 :發光二極體封裝結構 138 :側壁 110 :印刷電路板 120 :散熱基座 130 :發光單元 132a-132c :發光單元 132 :反射杯 134 :發光二極體晶片 136 :底面 139 :反射層 140 :封膠 150 :光學透鏡 310-350 :散熱基座 d :反射杯之杯深 D:散熱基座之厚度 A :反射杯開口角度1291254 According to FIG. 3C, the heat dissipation base 330 has five reflective cups 132. Four of the reflective cups 132 are distributed in a rectangular shape on the heat dissipation base 33, and the other reflective cup 132a is located in the center of the rectangle. Referring to FIG. 3D, the heat dissipation base 34 has six reflective cups 132, five of which are distributed in a regular pentagon on the heat dissipation base 340, and the other reflective cup 13 is on the positive five sides. Shape center. Referring to FIG. 3E, the heat dissipation base 35 has seven reflective cups 132. Six of the reflective cups 132 are distributed in a regular hexagon on the heat dissipation base 35, and the other reflective cup 132 is located on the hexagon. center. It is worth mentioning that the reflector cup is evenly distributed on the heat sink base. The light emitting diode package structure can have better heat dissipation efficiency. According to the preferred embodiment of the present invention, the present invention has the following advantages: 1. The light emitting diode package structure of the present invention has a plurality of light emitting units, each of which is composed of a reflective cup and a light emitting diode chip. . Each of the light-emitting diode chips has a separate reflective cup, and the adjacent light-emitting diode chips are separated by a reflective cup, which can improve the luminous efficiency and heat dissipation efficiency of the light-emitting diode package structure. 2. The light-emitting diode package structure of the present invention can be packaged with more light-emitting diode chips by surface adhesion technology and precise wiring technology of printed circuit boards, combined with a large-area metal heat sink base. Single light-emitting diode: package structure. Further, the brightness of the light-emitting diode package structure is improved. Compared with the conventional arrangement of a plurality of light-emitting diode chips in a reflector cup, the present invention can increase the brightness of the light-emitting diode package structure by more than 25%. The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the invention, and various modifications and refinements may be made without departing from the scope of the invention. The scope of the protection of the invention 1291254 is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A top view of the light emitting diode package structure 100. FIG. 2 is a cross-sectional view showing a_a of the light emitting diode package structure 1A in FIG. 1. 3D to 3E show a top view of a heat sink base in accordance with other preferred embodiments of the present invention. [Main component symbol description] 100: LED package structure 138: sidewall 110: printed circuit board 120: heat dissipation base 130: light-emitting unit 132a-132c: light-emitting unit 132: reflector cup 134: light-emitting diode wafer 136: Bottom surface 139: Reflective layer 140: Sealant 150: Optical lens 310-350: Heat sink base d: Cup depth of the reflector cup D: Thickness of the heat sink base A: Reflector cup opening angle