TWI254955B - Wiring board, method for manufacturing wiring board and electronic component using wiring board - Google Patents

Abstract

A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

Description

Ϊ254955

V. EMBODIMENT OF THE INVENTION (J) The technical field of the invention is related to the wiring method, the manufacturing method of the electronic wiring board using the wiring board, and the actuator, the resistor, and the line g ^ The wiring for solid-state capacitance can be used for miniaturization and thin electronic parts such as passive components such as crystals. < Clothing method and use of the wiring substrate, [Prior Art]

Processing Una) The capacitor is in the form of a wafer: a capacitor; or a passive component such as a resistor, in which the component of the container is known as an electronic component of the yak. Wafer-like electro-solid state electrolysis; The purity of the button powder burned surname: the eve piece will be electrified from the high liquid in the temperature and high vacuum;:: the f-porous sintered body becomes the anode, and will be in the acid such as manganese dioxide. ::: J: It is a dielectric. The cathode layer, the carbon layer and the silver layer constitute a solid electrolyte area with a small resistance of 4 knives. The anode of the pores and the electrolyte of the electrode state have good AC characteristics. Reliable: 1:... Chip-type capacitors for securing components; use = hand; : "Mobile electronic devices such as pirates or notebook computers, high-frequency: high-current-consuming electronic devices;;; i: type, thin, and When the electric wavy γ piece is used, the button type solid electrolytic capacitor

Page 61254955 (2)~Β ---^— 2 is formed by sealing the tantalum solid electrolytic capacitor element with a resin after the lead frame is connected, but in recent years, the electronic device has been miniaturized and thin type= It is difficult for the electrostatic capacitance to be large with respect to the external dimensions. Therefore, the proposal phase. A wafer type capacitor which is not used in a lead frame is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. The wafer type capacitor described in the Japanese Patent Publication No. 8 - 1 4 8 3 8 6 has a capacitor element 3 and is composed of an anode 3〇1, a cathode 3〇2, and a 3〇3. a first support portion 1B supporting the anode 1 of the capacitor element 3 and the second support portion 1C supporting the cathode 302; and being composed of the following members, the insulating substrate 1 having the support portions 丨β, 〖c The second external electrode 9 and the second external electrode 10, which are electrically connected by the conductive members 11, 12 and the anode 3〇1 and the cathode 3〇2, respectively; and the outer casing 13 are covered with the capacitor element 3 supported by the insulating substrate 1. The main part. As shown in Fig. 6(b), a three-dimensional wiring board provided with a recessed portion 和4 and a segment portion 丨5 is used as shown in Fig. 6(b). The segment portion 15 is formed of an insulating substrate 1 and a double-sided lamination on the insulating substrate = = resins 23, 25. The recess 14 is loaded with a portion of the capacitor element 3. An anode conductor 6 is provided on the upper surface of the segment portion 15, and an anode terminal 17 is provided on the back surface of the three-dimensional wiring board corresponding to the anode conductor 16. Further, a cathode conductor layer 18 is provided on the bottom surface of the concave portion 14, and a cathode terminal 19 is provided on the back surface of the three-dimensional wiring board corresponding to the cathode noble layer 18. At this time, the anode conductor 16 and the anode terminal 17 are connected via the conductor 2 provided in the connection hole 24, and the cathode conductor layer 18 and the cathode terminal 19 are connected via the connection hole 27. In addition, the symbol 26 is filled in the connection hole 24 &

1254955 V. INSTRUCTIONS (3) At this time, the capacitor is placed in the section 15 and the anode is placed in the recess 14 to guide the anode 3〇1 to the two U β 4 A. The electrical body 16 is connected. Further, the cathode 3 Ο 2 is connected to the cathode conductor layer 18 via a battery. Tian San, [Invention] The subject to be solved by the invention is: ΪΓ plate: technology: the wiring substrate of the contiguous capacitor is provided with an external electrode (the anode and the cathode on the back side of the external terminal 3 connector element 1) And U) and FIG. 6(b) are connected by a conductor provided inside the beating hole of the insulating substrate. The method of forming a conductor by the through hole provided in the substrate of the burdock is electrically charged. , J: The method of entering the V-electric resin, but in recent years, the wafer-type electro-embedded "Heibei perforation has a smaller aperture, and it is difficult to be inside the through-hole. Therefore, the conductor is buried in the conductor. When the inside of the through hole is poorly filled, there is a problem that electrical conduction is liable to occur. Further, it is difficult to reduce the size of the wiring board because the conductor inside the through hole is liable to cause electrical conduction defects, and the chip type capacitor is difficult to be small. In the above-mentioned Japanese Patent Application Laid-Open No. Hei 8-1 48386, the chip type capacitor j' is different from the through hole 11A on the anode 301 side and the through hole 12A on the cathode 302 side. The conductive member 11 is formed inside the through holes 1 1 A, 1 2 A The problem of the process of 1 2 is difficult. Page 8 1254955 V. Invention description (4) M heart is as special as 4, 8386, or special opening 2 〇. The anode of the device element and the insulating substrate 2: In order to connect the substrate, a step 33 must be formed for the crystal; the number of processes in the substrate is increased, and the wiring having a high manufacturing cost is used. Therefore, the object of the present invention is A passive element such as a chip type capacitor that is connected to a capacitor element: a substrate "a wiring board that is connected". The device can be miniaturized and thin. Another object of the present invention is to provide a chip type substrate for a capacitor element. W 4 passive components can be easily fabricated. Another object of the invention is to provide a wafer-type electrical f-wiring substrate to which capacitor elements are connected, which reduces manufacturing costs due to less formation. Another object of the present invention is to provide an electronic electronic component of a passive component such as a resistor or a coil, so that the manufacturing cost can be reduced, and the number of garments can be reduced. The method for solving the problem can be reduced. (1) The present invention forms a wiring substrate for forming a passive component by the above-mentioned hunting, and the board has a predetermined pattern of gates Y, and is intended to have an insulating pattern. And a second wire; the wire is connected to the insulating substrate, and the wiring is formed: the opening is filled with the opening and the wiring is on the opposite side of the insulating substrate. Page 9 1254955 5. Description of the invention 5) The service is based on the means (1) 'the external terminal portion exposed on the back surface of the surface on which the 1 = portion is embedded in the insulating substrate, and is not as in the wiring board used in the conventional wafer container It is also possible to form the wiring two wood on both sides of the insulating substrate. Therefore, the wiring board can be made thinner, and the electronic device using the wiring board can be made thinner. In the case where the external terminal portion is embedded in the insulating substrate 5, it is not necessary to provide a through hole having a small aperture as in the conventional wiring board used for the capacitor, and the external terminal portion does not require a small aperture & The terminal portion 1 m σ is directly connected to the pattern portion, and the pattern portion and the external electron "" are poorly connected. Therefore, the wiring board is easily miniaturized. In order to prevent the electrical characteristics of the component from changing, the external terminal portion is made. Nickel, gold, silver, the low resistance value of all the anvil i ~ electric milk characteristics change, the tin material is better 'especially the use of copper, but also the alloy of these materials is better. Use conductive tree: ϊ : Electrical characteristics of the J piece 'The external terminal portion may also be used, because the resistance value is greater than the metal material. The difference in the expansion coefficient of the conductive resin is small, the material is high, or the thermal expansion of the insulating substrate Moreover, at the outer end, the sub-tank and the insulating film are hard to be peeled off. The chip-shaped capacitor is mounted on the exposed surface, and the exposed surface is usually provided with a solder adhesive for the crystal bonding agent, which is an environmental concern. In the solder set Tin, tin-silver alloy, bismuth=two use lead-free materials are better, especially one of the plating films is better. '5 β gold, tin-bismuth alloy, tin-zinc alloy, and more, the insulating handle In order to shape the part of the electronic component into a plurality of electronic parts and then cut the insulating substrate

Page 10 1254955 V. Description of the invention (6) Patching ♦ Pukai D*, by forming a region like a cross-adjacent part, the bottom area of the read cymbal can be made wider~ External terminal section. Thus, the board. #连接部的管通不差不差, A highly reliable wiring base system can be obtained. 2) In order to achieve the above object, the present invention provides a wiring substrate member 1 Γ = to be formed after assembling a passive component on an insulating substrate. The electron zero is characterized in that a conductor film is formed on one surface of the insulating substrate; an opening is formed at a predetermined position of the insulating ground f; and an external member is formed by filling a conductive member in the opening of the insulating substrate; The unnecessary portion of the conductor film forms a wiring of a predetermined pattern. According to the means (2), the external terminal portion is formed by embedding a conductive member in the opening portion of the insulating substrate, and the manufacturing method can be performed as compared with the conventional method of forming a wiring pattern on both surfaces of the insulating substrate. The number is less. However, the manufacturing cost of the wiring board can be reduced. Further, since the bottom surface of the opening portion of the insulating substrate is substantially the same as the area of the outer end portion, and the hole diameter (four) of the through hole or the non-through hole which is passed through the conventional insulating substrate, the conductivity is buried and buried. The manufacturing process of the components becomes easy. ~ At this time, the process of forming the external terminal portion is formed by filling one of copper, nickel, gold, silver, and tin in an opening portion of the insulating substrate by electroplating or forming an alloy of these materials. Forming a part of the external terminal. Further, in the case where the outer portion of the external terminal portion is formed to have a sufficiently wide area in the opening portion, the plating method is used instead of the plating method, and the insulating substrate is used in the insulating substrate.

1254955 V. INSTRUCTION OF THE INVENTION (7) The opening may be filled with a conductive resin and then cured. Further, after the pattern of the wiring is formed in the method (2), a solder adhesive is generally formed on the surface of the pattern portion and the external terminal portion. At this time, on the solder adhesive, it is preferable to use environmentally-friendly materials, and it is preferable to use a lead-free material, preferably a tin, a tin-silver alloy, a tin-copper alloy, a tin-wire alloy, or a tin-plated alloy. . Further, the insulating substrate generally forms a part forming region of the electronic component. First, after forming a plurality of electronic components, the insulating substrate is cut and the individual sheets are opened, and the area is formed by a cross-over adjacent part. In general, the bottom area of the two openings can be made wider, and the external terminal portion can be easily formed. At this time, the external terminal portion is cut at the time of singulation, and is separated into external terminal portions of the respective electronic components. (3) In order to achieve the above object, the present invention provides an electronic component formed by splitting a passive component, which is characterized in that it has a wiring substrate, and an insulating substrate having an opening of a pattern is defined on the insulating substrate. Figure 2, the wiring of the wiring, and the filling of the opening, and the wiring is connected to form: the line: the external terminal portion exposed on the reverse side of the insulating substrate; the passive element is disposed on the wiring substrate; the conductive member The wiring and the passive Z piece are connected to the electric pole; and the sealing insulator seals the periphery of the passive element. According to the means (3), the wiring substrate described in the means (1) is easy to be miniaturized and thinned, and the electronic component is easily small.

Further, by using copper, nickel, gold, silver, and tin in the external terminal portion

Page 12 1254495 5. Inventive Note (8), the resistance value of the alloy part of the external end or the outer part of the material can be made small, and the action characteristics of the electronic component can be improved. In the case of the contact resistance of the case #, in the means (3), the A-junction - the combination of the material and the shape on the insulating base, and the fixing of the wiring type, the electronic device can be miniaturized and miniaturized. [Embodiment] Embodiments of the Invention FIG. 1 is a schematic view showing a schematic configuration of an application capacitor according to an embodiment of the present invention, and FIG. 1(I) is a ^片^+/曰片型面图, FIG. (b) Fig. 1(a) shows a closed view of the sealing insulator in the flat (a) of Fig. 1(a) and Fig. 1(b). In addition, the map! In Fig. 1, 1 series insulated substrate, 2 series wiring, 3 series Lei Chang crying solid electrolytic capacitor crying yuan #), 3 & 4 ', electric -7C pieces (button metal sintered body 嶋 v, package W shell j 4A linear conductor, 4B conductive adhesive, 5 series sealing insulator, 6-series soldering protection, 7-series terminal plating. The wafer type capacitor to which the wiring board is applied in the embodiment of the present invention: Fig. 1(a) As shown in Fig. 1(b), the wiring board is provided with a wiring (conductor pattern) 2 on the insulating substrate 1, and the capacitor element 3 is provided on the wiring board (insulating substrate); the linear conductor 4, the wiring 2 and the anode 301 of the capacitor element 3 are electrically connected; the linear conductor " electrically connects the wiring 2 and the cathode 3 〇 2 of the capacitor element 3; and seals 1254955

V. INSTRUCTION OF THE INVENTION (9) The periphery of the capacitor element 3 is sealed with an insulator 5. At this time, as shown in FIG. 1(b), the wiring 2 is formed on the surface of the insulating substrate 1 by the following members, and the external terminal portion 220 is embedded in the insulating substrate 1. Further, the back surface of the surface on which the pattern portion 2 设置j is provided is exposed. At this time, the external terminal portion 2 〇 2 is formed, for example, of electroplated copper. Further, a solder mask 6 is provided on a predetermined region of the pattern portion 201 of the wiring 2, and a terminal electric clock 7 is provided on the exposed portion of the pattern portion 201 and the external terminal portion 2A2. The terminal electric ore 7 is made of, for example, a metal material containing no lead such as tin, tin-copper alloy, tin wire, alloy, or tin-zinc alloy. Further, in the embodiment of the present invention, a wafer type capacitor to which a wiring substrate is applied, such as a tantalum solid electrolytic capacitor element, is composed of a member: an 'anode 301' consisting of a porous sintered body of tantalum; The solid electrolyte layer such as manganese monoxide or a conductive polymer, a carbon layer and a silver layer; and the metal sintered body (dielectric) 303 are composed of a pentoxide button electrochemically synthesized in an acidic liquid. '^ and FIG. 3 are schematic views for explaining a manufacturing method of a wiring substrate used for a chip capacitor according to an embodiment of the present invention, and a cross-sectional view showing a process for forming an opening portion for an external terminal, FIG. 2 ^ is a cross-sectional view of the process of the external terminal portion, Fig. 3 (a) is a cross-sectional view of the process, and Fig. 3 (b) is a cross-sectional view of a process for forming a solder resist film and terminal plating. The manufacturing method of the wiring board used in the wafer type capacitor using the wiring board of the present invention is in the TCp (Tape c town^

In the same manner as the wiring substrate (with a carrier) used for the manufacture of the package, for example, a reel-to-reel method is used to form a wiring (conductor pattern) on a strip-shaped insulating substrate. Hereinafter, a method of manufacturing the same will be described with reference to FIGS. 2 and 3. First, as shown in Fig. 2(a), after the tape material of the conductor film 8 is formed on the surface of the strip-shaped insulating substrate 1, the opening portion of the tape material is formed to form an opening portion for forming the external terminal portion. ]A. At this time, in the insulating multi-plate 1, for example, a polyimide tape is used, and in the conductor film 8, a rolled copper foil is used to form a copper foil.

Further, the opening portion 1A is formed, for example, by laser processing using a carbon dioxide gas laser or a cross-excimer laser. Further, at this time, the insulating substrate is formed in a direction in which a plurality of wafer type capacitors (part forming regions) CA are formed, and the opening portion 1A is, for example, as shown in FIG. 2(a). The formation regions CM and CA2 are formed. The cross-phase J and the material of the tape forming the conductor film 8 are not formed, and the opening 1A is formed by, for example, punching using a mold, and the insulating plate 1 is opened in advance. , bonding the conductor film 8 to one surface thereof is also <. The human-like person is filled with copper in the opening portion 丨A by the electric ore copper having the conductor film 8 as a cathode, for example, as shown in _*(b), and the 子1 sub-portion 20 is formed outside the wiring 2. At this time, the external terminal portion 220 is filled in the opening portion 1a to be 'opened/closed to the extent that the insulating substrate 1 does not protrude. Further, at this time, the surface side of the conductor film 8 is covered with an anti-caries agent, although omitted. At this time, the opening 1A of the insulating substrate 1 is formed to span the two parts/regions CA1 and CA2. The bottom surface of the opening 1 A has two outer diameters, and the area of the sub-section is easy to flow into the plating liquid. The opening 1 A can be easily formed

1254955

The external terminal portion 2 Ο 2 . Next, as shown in Fig. 3 (a), the conductor film 8 is etched, and the unnecessary portion is removed to form the pattern portion 201 of the wiring 2. At this time, the pattern portion 2〇1 ^ forms a region CA1, CA2 across the two parts as shown in FIG. 3(a), and forms a cathode connection of the capacitor element having one end and the first part forming region CA1, and the other end. A pattern of anode connections to the capacitor elements of the second part forming region CA2. Further, in this case, the pattern shown in Fig. 3(a) is not limited, and independent wiring may be formed in each of the component forming regions CA1 and CA2. Further, as shown in FIG. 3(b), the solder resist film 6 is formed in the pattern portion 2 of the wiring 2 (the predetermined position of n), and the terminal is formed on the exit surface of the pattern portion 2〇1 and the external terminal portion 2〇2. Plating 7. At this time, the terminal plating 7 forms, for example, a plating film of tin, tin-silver alloy, tin-copper alloy, tin-bismuth alloy, tin-alloy, etc. The wafer honey-capacitor of the present embodiment formed in accordance with the above steps The wiring board to be used is formed by embedding the external terminal portion 2〇2 in the insulating substrate 1 and the aperture of the through hole for ensuring the conduction of the surface and the back surface of the insulating substrate (麻, -^ 彳In contrast, the opening portion 202 of the insulating substrate of the fabric forming region CA is easier to form, and the shape of the opening is improved by the shape of the mouth. The pattern portion 201 is formed on the surface of the crucible, and the pattern is formed on both sides, so that the number of processes can be reduced, and the manufacturing cost can be reduced. Compared with FIG. 4, the wafer type capacitor for explaining the present invention is used. The manufacturing side of the wiring substrate used is shown in the figure, and Figure 4 (a) is the forming line. The process of the conductor is ^ ^ ^ ^ ^ 彺 彺 lt; mouth 1〗 face, Figure 4 (b) is assembled electric today

16th page 1254955 V. INSTRUCTIONS (12) Sectional view of the process of the device components. In order to form a wafer type capacitor using the wiring substrate formed in accordance with the steps described with reference to FIGS. 2 and 3, first, for example, as shown in FIG. 4(a), the anode 301 of the capacitor element 3 is formed in the respective component forming regions CA. The portion is formed as a linear conductor 4A. The linear conductor 4A is formed, for example, by printing or applying a conductive paste such as silver paste. Next, a conductive adhesive 4B is applied to a portion of the cathode formation 302 of the component forming region CA to which the capacitor element 3 is connected, and as shown in FIG. 4(b), the capacitor component 3 is placed on each of the component forming regions CA. After bonding. Then, the sealing insulator 5 such as a thermosetting resin is applied to the surface of the capacitor element 3, and the sealing member 5 is cured, and the capacitor element 3 is sealed, and the component forming regions CA are cut. The chip type capacitors can be obtained as shown in Fig. 1 (a) and Fig. 1 (b). At this time, the pattern W201 and the external terminal portion 2〇2 of the wiring 2 formed so as to straddle the adjacent component forming regions CA1 and CA2 are cut and become independent terminals. As shown in the above description, according to the wiring board of the present embodiment, when the wiring board used for the chip type capacitor is used, the external end & ^ ^ 2 is buried in the insulating substrate 1, and the conventional The area of the bottom surface of the two-part 1 A of the one-piece forming region is widened as compared with the through-holes in which the surface pe of the insulating substrate is turned on. Therefore, the formation of the external terminal portion 2〇 2 is changed. == Further, the formation of the external terminal portion 220 is facilitated, and conduction failure is less likely to occur. Moreover, by forming the regions CA1, (^2) as if they are adjacent to each other

1254955 V. Inventive Note (13) In order to form the opening 1A of the external terminal portion 220, the bottom portion of the opening 1A becomes wider, and the formation of the external terminal portion 220 becomes easier. It is also difficult to cause poor conduction. Moreover, the area of the bottom portion of the opening portion 1 A in one part forming region is widened, and the formation of the external terminal portion 220 is facilitated, and the external terminal portion 20 is easily formed when the wiring substrate is downsized. 2. Therefore, it is easier to reduce the size and thickness of the wiring board than the conventional wiring board, and it is easy to reduce the size and thickness of the electronic component. Further, since the external terminal portion 220 is buried in the insulating substrate 1, the pattern portion 20 may be formed only on one surface of the insulating substrate 1. Therefore, compared with the case where the wiring pattern is formed on both sides of the insulating substrate 1 in the past, the number of processes is reduced, and the manufacturing cost of the wiring substrate can be reduced. Further, the wiring 2 and the anode 310 of the capacitor element 3 are connected by using the linear conductor 4A as shown in the conventional wafer type capacitors of Figs. 6(a) and 6(b). The insulating substrate 1 does not have to have a step portion, and the wiring substrate can be easily manufactured, and the manufacturing cost of the wiring substrate can be reduced. Further, by using the lead portion plating 7 of tin, a tin-silver alloy, a tin-copper alloy, a tin-bismuth alloy, or a tin-zinc alloy, which is not used, on the surface of the pattern portion 2 0 1 and the external terminal portion 220 of the wiring 2, Can be concerned about environmental protection. The present invention is specifically described above with reference to a wafer-type capacitor to which a wiring board is applied according to an embodiment of the present invention, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the wafer type capacitor to which the wiring substrate is applied in the above embodiment, the tantalum solid electrolytic capacitor element is used on the passive component of the wafer.

Page 18 1254955 V. INSTRUCTIONS (14) 3 ' But g is not limited to this' by using various passive components to form an electron zero. It is a matter of course that the same effects as those described for the wafer type capacitor to which the wiring board of the above embodiment is applied are obtained. In the above-described embodiment, the wafer-type capacitor of the wiring board of the above-described embodiment is formed of the outer terminal portion 2 〇2 by electro-mineral copper. However, it is not limited to the case of using, for example, nickel, gold, silver, tin, or the like. It may be formed by embedding a conductive paste or the like. In the above-described embodiment, the wafer-type capacitor to which the wiring board is applied is 'as shown in FIG. 4(a), and after the linear conductor 4 is formed on the wiring substrate, the capacitor element 3 is assembled, but the invention is not limited thereto. For example, the capacitor element 3 in which the conductor turns are formed in advance may be assembled on the anode 3〇J side. Fig. 5 is a view showing a wiring board in which a ring element as an inductance element is assembled according to an embodiment of the present invention, Fig. 5(a) is a plan view, and Fig. 5(b) is a cross-sectional view taken along line A A. In Fig. 5, the lanthanum-based insulating substrate is an external terminal portion, a 21-series coil-shaped wiring, a 22-series linear conductor (gold wire), and a 5-series insulator 7-series terminal plating. As shown in Fig. 5 (&) and Fig. 5 (匕), the wiring board is formed by the lower body member J, and the coiled wiring 21 is provided on the insulating substrate 2. The wiring of the it m-shaped wiring 21 One end is connected to the external terminal portion, the external terminal portion 202 is electrically connected to the other of the coil-shaped wiring 21, and the periphery of the sealing member 21 is sealed. As shown in Fig. 5(b), the coil-like wiring and the green-backed and spliced wiring are as shown in Fig. 5(b), and the coil-like wiring 21 on the surface of the insulating substrate 1 is formed by the following components. External terminal portion 2. 2 'buried in the insulating substrate'

1254955 V. INSTRUCTIONS (15) The back of the face of the pattern. At this time, the external terminal portion 2 〇 2 is formed, for example, by galvanized steel or the like. On the other hand, terminal plating 7 is provided on the exposed surface of the external terminal portion 202. The terminal electric ore 7 is made of, for example, a metal material containing no lead such as tin, tin-silver alloy, tin-copper alloy, tin-bismuth alloy or tin-zinc alloy. Moreover, this wiring board is manufactured as follows. A method of manufacturing a wiring board using a coil of a wiring board of the embodiment of the present invention is a wiring board (a tape-like manufacturing method used for manufacturing a T-P (Tape Carrier Package), for example, using a reel-to-roll The disk method forms a coil on the strip-shaped insulating substrate. As shown in Fig. 2(a), one of the strip-shaped insulating substrates 1 is formed by forming a rolled copper foil or an electrolytic copper foil. The tape opening of the conductor film 8 = the predetermined position of the tape 1 forms the sweat dHA for forming the external terminal portion. At this time, for example, a polyimide film is used for the insulating substrate 1. The gas laser or the excitation component is formed; and::, Ψ: the worker is formed. The opening portion 1a is not formed, and the opening is formed in the insulating substrate 1 in advance by, for example, 1 A. The part is the cathode _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Forming a large number of copper and copper, tin two-terminal terminal electric ore 7 forming, for example, tin, tin A plating film of a silver alloy, a tin-tin-bismuth alloy, a tin-zinc alloy or the like is preferable.

Page 20 1254955 V. INSTRUCTION OF THE INVENTION (16) ----- Next, the conductor film 8 is rotted into a coil shape, and the coil-shaped distribution "line 21" is formed. One of the coiled wirings 2 1 is connected to the external scorpion 2 2 2 . The other end of the coil-shaped wiring 2 1 is connected to the winding body, the body (gold wire) 22, and other external terminal portions 220. The surface on which the coil-shaped wiring 2 1 is formed is sealed by the sealing, J, and the rim body 5, and then cut into individual pieces. According to the above steps, the wiring substrate of the embodiment of the present invention in which the coil of the electric power component is assembled is obtained by etching the total conductor film 8 on the insulating substrate 1 to obtain a coil component that does not have to be separately mounted. It is easy to manufacture a coil that can be miniaturized and thinned. The present invention is not limited to the above embodiments, and various modifications can be made. For example, the driven element may be directly formed on the insulating substrate by the material and shape of the combined wiring. That is, by mounting the transistor element on the insulating substrate and sealing the transistor element with a sealing insulator, a small-sized lower electrode type transistor can be obtained. Further, by mounting a resistor element on an insulating substrate and connecting both ends of the resistor element to the external terminal portion, the resistor element is sealed and sealed by a sealing insulator to obtain a small-sized lower electrode type resistor. Advantageous Effects of Invention A wiring board according to the present invention has a predetermined wiring pattern formed on an insulating substrate having an opening, and has an external terminal portion that is filled with the opening and connected to the wiring and exposed on the opposite side of the 'insulating substrate on which the wiring is formed. , the following effects are obtained. (1) Passive to a chip type capacitor such as a capacitor element to be connected

Page 21 1254955 V. INSTRUCTION DESCRIPTION (17) (2) A wiring board that can be easily manufactured is obtained by forming a passive element such as a chip capacitor that connects capacitor elements. (3) By forming a passive element such as a chip capacitor to which a capacitor element is connected, a wiring board can be provided, which reduces the number of processes and reduces manufacturing costs. (4) Since the coil is obtained by etching the conductor film formed on the insulating substrate, it is not necessary to mount the separately manufactured coil component, and it is possible to easily manufacture a sub-component such as a coil which can be reduced in size and thickness.

Page 22 1254955 Brief Description of the Drawings FIG. 1 (a) and (b)' are schematic diagrams showing the schematic structure of a wafer type electric grid device to which a wiring board is applied according to an embodiment of the present invention. . 2 is a schematic view for explaining a method of manufacturing a wiring board used for a wafer type capacitor to which a wiring board is applied according to an embodiment of the present invention, and FIG. 2(a) is a cross-sectional view showing a process of forming an opening portion for an external terminal. 2 (°b) is a cross-sectional view showing a process of forming an external terminal portion. 3 is a cross-sectional view showing a process of manufacturing a wiring board used in a wiring substrate type capacitor according to an embodiment of the present invention. FIG. 3(b) is a cross-sectional view showing a process of forming a pattern portion, and FIG. Sectional view of the process of the film and terminal electrode. 4, FIG. 4 is a cross-sectional view showing the process of forming a conductor in the embodiment of the present invention, t, ^ j = yuan = ^, and FIG. 4(b) is an assembled capacitor port. A cross-sectional view of the process of the piece. Fig. 5 is a plan view showing a wiring board as an inductance element in the embodiment of the present invention, Fig. 5 (&) is a plan view, and Fig. 5 (b) is a cross-sectional view taken along line A-A. ^ 6 (a) and (b) show the schematic structure of a conventional wafer type capacitor. Description of component symbols: 1 Insulating substrate 1 A Opening of insulating substrate

Page 231254955 Brief description of the drawings 1 B First support portion 1C Second support portion 2 Wiring 201 Pattern portion 2 0 2 External terminal portion electrolytic capacitor element) 3 Capacitor element (button solid state 3 01 Anode 302 Cathode 3 0 3 Dielectric (Metal sintered body) 4A Linear conductor 4B Conductive adhesive 5 Sealing insulator 6 Solder protective film 7 Terminal plating 8 Conductor film 9 First external electrode 10 Second external electrode 11, 1 Conductive member 13 Housing 14 Concave portion 15 Segment 16 anode conductor 17 anode terminal 18 cathode conductor

Page 24 1254955

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Claims (1)

1254955 VI. Patent Application No. 1 · A wiring substrate, which is formed by assembling a passive component, and is characterized in that: an insulating substrate having an opening of a predetermined pattern; and a wiring formed on the insulating substrate in a predetermined pattern; And the external terminal portion is filled in the opening, and is connected to the wiring, and is exposed on the reverse side of the insulating substrate on which the wiring is formed. 2. The wiring board of claim 1, wherein the external terminal portion is made of one of copper, nickel, silver, tin or an alloy of these materials. 3. The wiring board according to the first aspect of the invention, wherein the external terminal portion is made of a conductive resin. 4. The wiring board according to any one of claims 1 to 3, wherein the external terminal portion is provided with one of tin, tin-silver alloy, tin-copper alloy, tin-face alloy, and tin-zinc alloy on the exposed surface thereof. The electric clock film. a method for manufacturing a wiring board for forming an electronic component by assembling a passive component on an insulating substrate, wherein: forming a conductor film on one surface of the insulating substrate; forming an opening at a predetermined position of the insulating substrate; A conductive member is filled in the opening of the insulating substrate to form an external terminal portion of the wiring, and a wiring of a predetermined pattern is formed by removing an unnecessary portion of the conductive film. 6. The method of manufacturing a wiring board according to claim 5, wherein the external terminal portion is one of copper, nickel, gold, silver, and tin or Page 261254955, apply for the special 'ΪΪ' "" &^; ^ material alloy to be filled with electric ore in the opening of the insulating substrate, such as the manufacturing method of the wiring substrate of the fifth application patent scope, the external The terminal portion is formed by filling the opening of the insulating substrate with a resin and hardening it. The method of wiring according to any one of the items 5 to 7 of the patent application, wherein the external terminal portion forms a tin on the exposed surface thereof after removing the conductor 1 An electro-mineral film of tin-silver alloy, tin-copper alloy, one of -, ', and tin-zinc alloy. w Tin: 9· An electronic component formed by assembling a passive component, characterized by a port; ίί substrate 'contains: an insulating substrate having a predetermined pattern of P1 sub-sections' on the insulating substrate in a predetermined pattern Forming; and outside: filling the opening and connecting with the wiring, and exposing on the opposite side of the insulating substrate of the shape 5; I is on the wiring substrate, and the power component is formed on the wiring substrate; The component 'electrically connects the wiring and the passive component; 1: Seals the periphery of the passive component with a Φ absolute body. 10. The electronic Α terminal part of claim 9 of the patent scope is composed of copper, nickel, gold, silver; 2' the outer alloy. One of the materials or the material 11' is an electrically conductive resin as in the ninth aspect of the patent application. 々, /, medium, the outside 1254955 VI. Patent Application Range 1 2 · An electronic component according to one of the claims 9 to 11 wherein the external terminal portion is provided with tin, tin-silver alloy, tin-copper alloy, tin surface on the exposed surface thereof. An electric ore film of one of an alloy and a tin alloy. 1 . The electronic component of claim 9 , wherein the passive component is a solid electrolytic capacitor component, comprising: a metal sintered body; an anode protruding from one end of the metal sintered body; and a cathode It is provided on the outer peripheral surface of the metal sintered body. 1 4. The electronic component of claim 9, wherein the passive component is a solid capacitor, a resistor, a coil, and a transistor. The electronic component of claim 9 or 14, wherein the passive component is directly formed on the insulating substrate by combining the material and shape of the wiring. Page 28