Nothing Special   »   [go: up one dir, main page]

TW540260B - Substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component Download PDF

Info

Publication number
TW540260B
TW540260B TW091118812A TW91118812A TW540260B TW 540260 B TW540260 B TW 540260B TW 091118812 A TW091118812 A TW 091118812A TW 91118812 A TW91118812 A TW 91118812A TW 540260 B TW540260 B TW 540260B
Authority
TW
Taiwan
Prior art keywords
pattern
electronic component
patent application
scope
component mounting
Prior art date
Application number
TW091118812A
Other languages
English (en)
Chinese (zh)
Inventor
Yutaka Iguchi
Masaharu Ishizaka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of TW540260B publication Critical patent/TW540260B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
TW091118812A 2001-08-22 2002-08-20 Substrate for mounting electronic component TW540260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001251969A JP2003068804A (ja) 2001-08-22 2001-08-22 電子部品実装用基板

Publications (1)

Publication Number Publication Date
TW540260B true TW540260B (en) 2003-07-01

Family

ID=19080523

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091118812A TW540260B (en) 2001-08-22 2002-08-20 Substrate for mounting electronic component

Country Status (3)

Country Link
JP (1) JP2003068804A (ko)
KR (1) KR20030017392A (ko)
TW (1) TW540260B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013020306A1 (zh) * 2011-08-05 2013-02-14 深圳市华星光电技术有限公司 液晶面板及软板上芯片构造的卷带基板
TWI397965B (zh) * 2005-07-04 2013-06-01 Nitto Denko Corp 印刷電路板
TWI422303B (zh) * 2008-05-09 2014-01-01 Nitto Denko Corp 配線電路基板及其製造方法
TWI693870B (zh) * 2017-09-15 2020-05-11 韓商斯天克有限公司 電路板及其製造方法
TWI751471B (zh) * 2019-01-14 2022-01-01 韓商斯天克有限公司 柔性印刷電路板與其製造方法及具備柔性電路板的封裝結構

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3544970B2 (ja) 2002-09-30 2004-07-21 沖電気工業株式会社 Ｃｏｆテープキャリア、半導体素子、半導体装置
JP2006148072A (ja) * 2004-10-18 2006-06-08 Hitachi Chem Co Ltd 配線板
JP2006269496A (ja) * 2005-03-22 2006-10-05 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基板、および半導体装置
JP4592458B2 (ja) * 2005-03-22 2010-12-01 株式会社フジクラ プリント配線基板、電子回路装置及びその製造方法
JP4883442B2 (ja) * 2005-08-10 2012-02-22 セイコーインスツル株式会社 回路基板とその製造方法、及び半導体装置
JP2008306102A (ja) * 2007-06-11 2008-12-18 Hitachi Cable Ltd 半導体装置用テープキャリア及びその製造方法
US20090020316A1 (en) * 2007-07-19 2009-01-22 Chia-Hui Wu Method of manufacturing chip on film and structure thereof
JP4975584B2 (ja) * 2007-10-26 2012-07-11 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法。
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
WO2018159023A1 (ja) * 2017-03-01 2018-09-07 住友電気工業株式会社 フレキシブルプリント配線板、接続体の製造方法及び接続体
KR102375126B1 (ko) * 2017-11-02 2022-03-17 엘지이노텍 주식회사 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
KR102088920B1 (ko) * 2017-12-13 2020-03-13 주식회사 엘비루셈 2층 패턴형 ｃｏｆ 패키지용 필름
JP2018085522A (ja) * 2017-12-21 2018-05-31 ルネサスエレクトロニクス株式会社 半導体装置
TWI784661B (zh) * 2021-08-09 2022-11-21 頎邦科技股份有限公司 軟性電路板之佈線結構

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397965B (zh) * 2005-07-04 2013-06-01 Nitto Denko Corp 印刷電路板
TWI422303B (zh) * 2008-05-09 2014-01-01 Nitto Denko Corp 配線電路基板及其製造方法
WO2013020306A1 (zh) * 2011-08-05 2013-02-14 深圳市华星光电技术有限公司 液晶面板及软板上芯片构造的卷带基板
TWI693870B (zh) * 2017-09-15 2020-05-11 韓商斯天克有限公司 電路板及其製造方法
US11147160B2 (en) 2017-09-15 2021-10-12 Stemco Co., Ltd. Circuit board and method for manufacturing same
TWI751471B (zh) * 2019-01-14 2022-01-01 韓商斯天克有限公司 柔性印刷電路板與其製造方法及具備柔性電路板的封裝結構

Also Published As

Publication number Publication date
KR20030017392A (ko) 2003-03-03
JP2003068804A (ja) 2003-03-07

Similar Documents

Publication Publication Date Title
TW540260B (en) Substrate for mounting electronic component
US7198989B2 (en) Method of producing a COF flexible printed wiring board
US20080007927A1 (en) Multilayered printed circuit board and the manufacturing method thereof
US20060220242A1 (en) Method for producing flexible printed wiring board, and flexible printed wiring board
TW200522828A (en) Printed wiring board and semiconductor device
TW201405745A (zh) 晶片封裝基板、晶片封裝結構及其製作方法
JP2009154522A (ja) 軟性フィルム及びそれを備える表示装置
US20080257742A1 (en) Method of manufacturing printed circuit board for semiconductor package
TW200402858A (en) Flexible wiring substrate and method for producing the same
US6708398B2 (en) Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package
JP4117892B2 (ja) 電子部品実装用フィルムキャリアテープ及びフレキシブル基板
US7382042B2 (en) COF flexible printed wiring board and method of producing the wiring board
JP3750113B2 (ja) 電子部品実装用フィルムキャリアテープ及びその製造方法
JP2009152533A (ja) 軟性フィルム及びそれを備える表示装置
JP3772843B2 (ja) Ｃｏｆ用フレキシブルプリント配線基板
JP2009277987A (ja) 電子部品実装用フィルムキャリアテープ、その製造方法、および、半導体装置
TW565899B (en) Substrate for mounting electronic component, and method of removing warpage from substrate for mounting electronic component
JP2001267376A (ja) Ｆｐｃの製造方法及び表示装置
JP3726964B2 (ja) Ｃｏｆフィルムキャリアテープの製造方法
TWI299886B (en) Method for Producing the Wiring Board
JP2016139754A (ja) 半導体装置の製造方法
JP4826103B2 (ja) 半導体装置用基板、および半導体素子用ｂｇａパッケージ
JPH08167676A (ja) 半導体装置
JP2003204011A (ja) 多層配線板および多層配線板の製造方法
JP3879259B2 (ja) Ｔａｂ用フィルムキャリアテープ

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees