529316 A7 _____B7 _____ 五、發明說明（丨） 【發明所屬之技術領域】 本發明係有關於複合板之製造方法。 【習知技術】 例如，半導體晶圓的製程中，係包含：烘烤處理製程( 爲了將在半導體晶圓（基板)的表面所塗佈的光阻膜(感光膜) 中殘存的溶劑加以去除，而對上述基板進行加熱）、以及冷 卻製程（將被加熱的基板冷卻至室溫）。在如此般的烘烤處 理的加熱製程中或冷卻處理的冷卻製程中，係使用著具備 接著片(含有接著片本體、及附設於此接著片本體的電極等 的金屬突出部)及平板狀的金屬基台所成之複合板。即就是 ，烘烤處理的加熱製程中，如此般的複合板，其金屬突出 部係由不銹鋼所構成，以此作爲加熱器來作用。又，冷卻 處理的冷卻製程中，如此般的複合板，係使用以銅電極構 成金屬突出部 '且該金屬突出部上積層P · N型半導體所 形成的冷卻板。 上述般的複合板’以往係如圖10(a)所不，進行：成爲 於金屬基台40的表面積層接著片42(由接著片本體與附設 於其表面的金屬突出部所形成）的狀態之裝配製程，其次， •如圖10(b)所示，藉邊加熱、邊以機械壓力機44進行加壓 的加熱/加壓製程而製造的。 【發明所欲解決之課題】 然而，作爲金屬基台40，常需控制熱容量、儘可能很 4 木紙張尺度適用中國國家標準(CNS)A4規格（210 x 297公爱) "" --- (請先閱讀背面之注意事項再填寫本頁) · -^1 n n 1_1 n n n^OJfl n n n 1 n n n - 529316 A7 五、發明說明（/ ) 薄地形成，且，內部有冷卻水路的中空的場合’更會使剛 性降低。因此，在用機械壓力機44加壓時，金屬基台40 有可能變形。如果變形，則藉機械壓力機44的剛性高、且 平滑的模具45所下壓的接著片42之透過接著劑41對金屬 基板40所作用之壓力會變得不均一，壓力低的部分可能無 法得到接著強度。而且，接著片42的表面上’由於金屬突 出部形成了凹凸部，在與凹部相對應的部位，對金屬基台 40的壓力不足，而可能引起接著不良。 本發明係爲解決上述習知的缺點而產生的，其目的係 提供一種複合板之製造方法，係使附設有金屬突出部的接 著片本體可確實地接著於金屬基台的表面。 【用以解決課題之手段及效果】 因此’申請專利範圍1的複合板之製造方法，係用以 製造複合板(具備：接著片本體1、附設於此接著片本體1 表面的金屬突出部2、內部有中空部3的金屬基台4);其 特徵在於，在上述接著片本體1表面上積層著上述金屬突 出部2的狀態下，對上述金屬基台4表面透過接著劑s積 層此接著片本體1，然後用有耐熱性及耐通氣性的包袋13 ‘將該等包圍後，使此包袋13的內部呈減壓狀態，在此減壓 狀態下，於處理室14內使上述金屬基台4的中空部3與上 述包袋13的外部連通，同時將此包袋13加熱、加壓， 以將上述接著片本體1接著於金屬基台4上。 在上述申請專利範圍1的複合板之製造方法中，加熱 5 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 χ -" (請先閱讀背面之注意事項再填寫本頁) 裝 529316 A7 ______Β7__ 五、發明說明（j ) 、加壓時(加熱/加壓製程12)，因爲使處理室14內的上述 金屬基台4的中空部3與上述包袋13的外部處於連通狀態 ，此金屬基台4的中空部3與處理室14內部無壓力差產生 ，可有效地防止金屬基台4的變形。藉此，若使用以此製 造方法製造的複合板，進行烘烤處理或冷卻處理，可使此 複合板上載置的半導體晶圓等的被處理物的面內溫度分布 保持均一，可高精度地、確實地實行此等處理。另外，加 熱/加壓製程12中，由於接著片本體1及金屬突出部2被 包袋13包圍著，接著片本體丨對金屬基台4均一地加壓， 使在全區域之中，接著片本體1確實地接著於金屬基台4 上’可製造無接著不良的高品質之複合板。 申請專利範圍2的複合板之製造方法，其特徵在於： 係配置輔助片25，該輔助片25在加熱、加壓時，係沿著 具有金屬突出部2及接著片本體丨的接著片8表面呈密合 〇 在上述申請專利範圍2的複合板之製造方法中，即使 金屬突出部2的厚度尺寸比較大，由於輔助片25沿著接著 片8的表面密合，接著片本體1對於金屬基台4可更均一 地被壓接，可製造高品質之複合板。 申請專利範圍3的複合板之製造方法，其特徵在於： 上述輔助片25係由玻璃纖維所構成的不織布。 在上述申請專利範圍3的複合板之製造方法中’輔助 片25有良好的密合性及耐熱性，可提供安定且高品質之複 合板。 6 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） . (請先閲讀背面之注意事項再填寫本頁) --------訂·------ 529316 A7 ______B7__ 五、發明說明（今） 申請專利範圍4的複合板之製造方法，其特徵在於·· 上述輔助片2 5係採用在上述加熱溫度會軟化而成可塑化之 金屬箔。 在上述申請專利範圍4的複合板之製造方法中，輔助 片25的密合性更優良，可提供安定且高品質之複合板。 申請專利範圍5的複合板之製造方法，其特徵在於： 輔助片25具有凹凸部30、31，在將上述包袋13加熱、加 壓時，此輔助片25的凹部30底面30a會壓向上述金屬突 出部2，且此輔助片25的凸部31表面31a會壓向上述金 屬突出部2間的凹處32底面32a。 在上述申請專利範圍5的複合板之製造方法中，因 爲以輔助片25的凹部30底面30a對上述金屬突出部2加 壓、並以輔助片25的凸部31的表面31a對上述金屬突出 部2間的凹處32的底面32a加壓，可使接著片本體1全體 確實地對著金屬基台4加壓，使提供安定且高品質之複合 板成爲可能。 申請專利範圍6的複合板之製造方法，其特徵在於： 上述複合板係作爲冷卻處理製程的冷卻板被使用著。 在上述申請專利範圍第i項〜第5項的複合板之製造 .方法中’雖可能適用於烘烤處理中加熱用板，根據此申請 專利範圍6的複合板之製造方法，亦適合於冷卻板的製造。 【發明之實施形態】 接著’對於本發明的複合板之製造方法的實施形態， 7 ί、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ϋ n ϋ >ia I I I I- 一OJ« ϋ m ϋ I i in · 529316 A7 ___B7_ 五、發明說明（< ) 邊參照圖式邊做詳細的說明。圖1與圖3係此實施形態的 複合板之製造方法的說明圖，圖2係此複合板之製造方法 的製程圖。複合板係如圖4所示般地，具備接著片本體1 、附設於此接著片本體1表面的金屬突出部2 (參照圖2)、 內部有中空部3 (參照圖1)的金屬基台4，作爲例如半導體 晶圓製程的冷卻處理中使用的冷卻板被利用著。即就是， 由銅電極構成的金屬突出部2，藉在其上積層著P · N型半 導體，而形成冷卻板。然而，在此實施形態中，在接著片 本體1與金屬基台4之間設置接著劑層5，由接著片本體1 與金屬突出部2構成接著片8。 且，接著片本體1由如聚醯亞胺系，具體地如熱熔接 型聚醯亞胺薄膜所構成，其厚度尺寸爲25//m左右，其中 ，兩側各設置著5//m左右厚的接著用變質層。且，金屬 突出部2係由例如導體所形成的電極而構成。此場合，在 接著片本體1上貼附銅板之後，用餽刻形成此電極(金屬突 出部2)，然後，進入本發明的製造方法之製程。根據本發 明的製造方法，在接著片本體1與金屬基台4之間的接著 製程中，亦可在接著片本體1上接著並固定金屬突出部2 。又，接著劑層5亦係由聚醯亞胺系所構成，且金屬突出 .部2的厚度尺寸係作成例如1mm，又接著劑層5的厚度尺 寸係作成例如25//m。 而且，金屬基台4係由例如不銹鋼、鋁及銅等的各種 金屬所構成。如上所述，內部具有構成冷卻用水路等的中 空部3。且，中空部3係如圖1所示，被連接到通氣管9、 8 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) " " "^529316 A7 _____B7 _____ 5. Description of the invention (丨) [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a composite board. [Know-how] For example, the semiconductor wafer manufacturing process includes a baking process (in order to remove the solvent remaining in the photoresist film (photosensitive film) coated on the surface of the semiconductor wafer (substrate). And heating the substrate), and a cooling process (cooling the heated substrate to room temperature). In such a heating process of a baking process or a cooling process of a cooling process, a bonding sheet (including a metal projection including a bonding sheet body and electrodes attached to the bonding sheet body) and a flat plate are used. Composite board made of metal abutment. That is, in the heating process of the baking process, the metal protruding part of such a composite panel is composed of stainless steel and functions as a heater. In the cooling process of the cooling process, such a composite plate is a cooling plate formed by using copper electrodes to form metal protrusions' and laminating P · N type semiconductors on the metal protrusions. The above-mentioned composite board is conventionally shown in FIG. 10 (a), and is performed in a state where the sheet 42 (which is formed by the main body of the sheet and the metal protrusion attached to the surface) is attached to the surface area of the metal base 40. The assembly process is as follows. As shown in FIG. 10 (b), it is manufactured by a heating / pressurizing process in which a mechanical press 44 is used for heating while applying pressure. [Problems to be Solved by the Invention] However, as the metal abutment 40, it is often necessary to control the heat capacity as much as possible. The wood paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 public love) " "- -(Please read the precautions on the back before filling this page) ·-^ 1 nn 1_1 nnn ^ OJfl nnn 1 nnn-529316 A7 V. Description of the invention (/) Thinly formed, and there is a hollow place with a cooling water channel inside ' It will also reduce rigidity. Therefore, the metal base 40 may be deformed when pressurized by the mechanical press 44. If deformed, the rigidity of the mechanical press 44 and the smoothness of the bonding sheet 42 pressed by the smooth mold 45 will cause the pressure on the metal substrate 40 to be uneven, and the low pressure part may not be able to be used. The adhesion strength is obtained. Further, since the metal protruding portion is formed with uneven portions on the surface of the adhesive sheet 42, the pressure on the metal base 40 is insufficient at the portion corresponding to the concave portion, which may cause defective bonding. The present invention has been made to solve the above-mentioned conventional disadvantages, and an object thereof is to provide a method for manufacturing a composite board so that a contact sheet body provided with a metal protruding portion can be reliably adhered to the surface of a metal base. [Means and Effects to Solve the Problem] Therefore, the method for manufacturing a composite board according to the scope of the patent application 1 is for manufacturing a composite board (equipped with a bonding sheet body 1 and a metal protrusion 2 attached to the surface of the bonding sheet body 1 And a metal base 4 with a hollow portion 3 inside); characterized in that, in a state where the metal protruding portion 2 is laminated on the surface of the bonding sheet main body 1, the surface of the metal base 4 is laminated through the adhesive s The sheet body 1 is surrounded by a heat-resistant and air-permeable bag 13 ′, and then the inside of the bag 13 is decompressed. In this depressurized state, the above is made in the processing chamber 14. The hollow portion 3 of the metal base 4 communicates with the outside of the bag 13, and at the same time, the bag 13 is heated and pressurized to adhere the above-mentioned adhesive sheet body 1 to the metal base 4. In the manufacturing method of the composite board of the above patent application range 1, heating 5 paper sizes is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ- " (Please read the precautions on the back before filling this page). 529316 A7 ______ Β7__ 5. Description of the invention (j), during pressurization (heating / pressurizing process 12), because the hollow portion 3 of the metal base 4 in the processing chamber 14 and the outside of the bag 13 are connected, this There is no pressure difference between the hollow portion 3 of the metal base 4 and the inside of the processing chamber 14, which can effectively prevent the deformation of the metal base 4. Therefore, if the composite plate manufactured by this manufacturing method is used, the baking treatment or the cooling treatment is performed. In this way, the in-plane temperature distribution of the processed objects such as semiconductor wafers placed on this composite board can be kept uniform, and these processes can be performed accurately and reliably. In addition, in the heating / pressing process 12, The body 1 and the metal protrusion 2 are surrounded by the bag 13, and then the sheet body 丨 uniformly presses the metal base 4 so that it is in the entire area, and then the sheet body 1 is firmly attached to the metal base 4. Manufacturing without adhesion A high-quality composite board. The method for manufacturing a composite board with patent application scope 2 is characterized in that an auxiliary sheet 25 is arranged. When the auxiliary sheet 25 is heated and pressurized, the auxiliary sheet 25 is provided with a metal protrusion 2 and then The surface of the bonding sheet 8 of the sheet body is closely adhered. In the manufacturing method of the composite plate of the above-mentioned patent application range 2, even if the thickness of the metal protrusion 2 is relatively large, the auxiliary sheet 25 is closely adhered along the surface of the adhesive sheet 8. Then, the sheet body 1 can be more uniformly crimped to the metal base 4 to manufacture a high-quality composite board. The method for manufacturing a composite board with a patent scope of 3 is characterized in that the auxiliary sheet 25 is made of glass fiber. Non-woven fabric. In the manufacturing method of the composite panel of the above patent application range 3, the 'auxiliary sheet 25 has good adhesion and heat resistance, and can provide stable and high-quality composite panels. 6 Wood paper standards are applicable to Chinese national standards ( CNS) A4 specification (210 X 297 mm). (Please read the notes on the back before filling out this page) -------- Order · ------ 529316 A7 ______B7__ 5. Description of the invention (present ) Apply for The method for manufacturing a composite board of the scope 4 is characterized in that the auxiliary sheet 25 is a plasticized metal foil that softens at the above heating temperature. In the method of manufacturing the composite board of the above-mentioned patent application, the auxiliary board 25 The adhesiveness of the sheet 25 is more excellent, and a stable and high-quality composite sheet can be provided. The method for manufacturing a composite sheet with a patent scope of 5 is characterized in that the auxiliary sheet 25 has uneven portions 30 and 31, During heating and pressurization, the bottom surface 30a of the recessed portion 30 of the auxiliary sheet 25 will be pressed against the metal protrusion 2 and the surface 31a of the convex portion 31 of the auxiliary sheet 25 will be pressed against the recess 32 between the metal protrusions 2 and the bottom surface 32a. . In the method for manufacturing a composite board of the above-mentioned patent application range 5, the metal protruding portion 2 is pressed by the bottom surface 30 a of the recessed portion 30 of the auxiliary sheet 25, and the metal protruding portion is pressed by the surface 31 a of the convex portion 31 of the auxiliary sheet 25. Pressing the bottom surface 32a of the two recesses 32 can press the entire adhesive sheet body 1 against the metal base 4 surely, and it is possible to provide a stable and high-quality composite plate. The method for manufacturing a composite board with a scope of application for patent 6 is characterized in that the composite board is used as a cooling board in a cooling process. In the method of manufacturing a composite board in the scope of items i to 5 of the above-mentioned patent application, although the method 'may be applicable to a heating plate in a baking process, the method of manufacturing a composite board according to the scope of patent application 6 is also suitable for cooling. Manufacture of boards. [Embodiment of the invention] Next, for the embodiment of the method for manufacturing the composite board of the present invention, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back first) (Fill in this page again) ϋ n ϋ > ia III I- 一 OJ «ϋ m ϋ I i in · 529316 A7 ___B7_ 5. Explanation of the invention (<) The detailed description will be made with reference to the drawings. Fig. 1 and Fig. 3 are explanatory diagrams of a manufacturing method of the composite plate of this embodiment, and Fig. 2 is a process drawing of the manufacturing method of the composite plate. As shown in FIG. 4, the composite plate is provided with a bonding sheet body 1, a metal protrusion 2 (see FIG. 2) attached to the surface of the bonding sheet body 1, and a metal base having a hollow portion 3 (see FIG. 1) inside. 4. For example, a cooling plate used in a cooling process of a semiconductor wafer process is used. That is, the metal protruding portion 2 made of a copper electrode is formed by laminating a P · N type semiconductor thereon to form a cooling plate. However, in this embodiment, an adhesive layer 5 is provided between the adhesive sheet main body 1 and the metal base 4, and the adhesive sheet 8 is composed of the adhesive sheet main body 1 and the metal protruding portion 2. Moreover, the sheet body 1 is made of, for example, polyimide-based, specifically, a heat-fusible polyimide film, and has a thickness of about 25 // m, wherein about 5 // m are set on each side. The thicker layer is followed by a metamorphic layer. The metal protruding portion 2 is formed of, for example, an electrode formed of a conductor. In this case, after attaching a copper plate to the sheet body 1, the electrode (metal projection 2) is formed by feed engraving, and then the process of the manufacturing method of the present invention is started. According to the manufacturing method of the present invention, in the bonding process between the bonding sheet body 1 and the metal base 4, the metal protruding portion 2 may be bonded and fixed to the bonding sheet body 1. The adhesive layer 5 is also made of polyimide, and the thickness of the metal protruding portion 2 is, for example, 1 mm, and the thickness of the adhesive layer 5 is, for example, 25 // m. The metal base 4 is made of various metals such as stainless steel, aluminum, and copper. As described above, the hollow portion 3 constituting a cooling water passage or the like is provided inside. Moreover, as shown in Fig. 1, the hollow part 3 is connected to the air ducts 9 and 8. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) " " " ^
—ϋ 1 II f請先閱讀背面之注音？事項再填寫本頁} · ϋ i I n ί ϋ ί ον a n —a— I ϋ ϋ m n I . A7 529316 B7 _____ 五、發明說明（v ) 與外部成連通狀態。 但是，本發明的製造方法係如圖2所示般地，具有裝 配製程10、脫氣製程π及加熱/加壓製程12。裝配製程 1〇係指，如圖1所示的，在金屬基台4上，積層：構成接 著劑層5的接著劑S及接著片本體1(積層有金屬突出部2) ，形成積層體M，將此積層體M與金屬基台4收容於包袋 13的製程。脫氣製程11係指，如圖3所示的’從此包袋 13的的內部抽出空氣，使此包袋13內呈減壓狀態的製程 。加熱/加壓製程12係指，在將此減壓狀態的包袋13，放 在處理室14內加熱到既定溫度的同時，用既定的壓力進行 加壓的製程。 另一方面，包袋13係如圖1所示般地，具有：耐熱性 與耐通氣性兼備的基片15，及耐熱性與耐通氣性兼備的柔 軟片16。基片15呈平板狀，片16由於係柔軟的，可與上 述積層體Μ及金屬基台4相對應做變形，在收容狀態，形 成與基片15的外周緣部17相對應的帽簷狀部18。而且， 此基片15的外周緣部17與片16的帽簷狀部18之間，配 設著密封用的片材19。又，片16具有圖示中省略的真空 璋。此真空璋與圖外的真空泵等的真空管20 (參照圖3)相 .連接。且，上述金屬基台4的通氣管9並非開口在包袋13 內，而是開口在處理室14內。 而且，處理室14如圖3所示，其內部具有一對加熱器 21、21，且其周壁上設有氣體供給口 23，從此氣體供給口 23供給著氮氣等氣體。即是，將此處理室14內配設的構 9 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) ' (請先閱讀背面之注音？事項再填寫本頁) --------^---------. A7 529316 五、發明說明（1 ) 件(此場合係指包袋13、及收容於包袋13內的金屬基台4 與積層體M)，在所定溫度加熱的同時，在既定壓力下進行 加壓。 接著，對在上述裝配製程10、脫氣製程u及加熱/加 壓製程12進行的製造方法加以說明。首先，在裝配製程 10中，如圖1所示，在金屬基台4的表面上，依次積層 構成接著劑層5的接著劑S、接著片本體1(積層有金屬突 出部2)，並將此積層體Μ與金屬基台4收容於包袋13內 部。此場合，構成接著片8的接著片本體1與金屬突出部 2，在此積層狀態既可係已經被一體化(接著），亦可係未被 接著的狀態。又，在積層體Μ上積層著輔助片25。此輔 助片25，例如係玻璃纖維所構成的不織布，不僅有良好的 耐熱性及變形性，而且相對於接著片8及包袋13可簡單地 剝離。 接著，收容了金屬基台4等的包袋π，如圖3所示的 ，收容設置於處理室14內，而進入脫氣製程。即是，驅動 真空栗、通過真空管20來抽出包袋13內的空氣，使包袋 13處於減壓狀態。此場合的減壓狀態包含真空狀態。其後 ，進入加熱/加壓製程12。在加熱器21、21中，將收容了 .接著片8及金屬基台4的包袋13加熱的同時，從氣體供給 口 23，對處理室14供給氣體(氮氣），用此氣壓對包袋13 進行加壓。即就是，藉由受加熱或加壓而變形的包袋13的 片16，通過接著劑S，將接著片8對著金屬基台4加壓。 在此加熱/加壓製程12中，爲使包袋13內部維持減壓狀態 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝--------訂---------· A7 529316 _____B7 五、發明說明（又） ，最好抽出包袋13內部的空氣。且，例如設定處理室14 的內部溫度約200°C、內部的氣體壓力約20kg/cm2。 (請先閱讀背面之注意事項再填寫本頁) 藉此，接著劑S被加熱，且，通過包袋13，輔助片 25被壓向金屬基台4側，接著片本體1與金屬基台4接著 ，且若使金屬突出部2未被接著般來設定，由於接著片本 體1的表面側係接著用變質層，金屬突出部2會被接著於 接著片本體1上。此場合，如圖5(a)所示般地，藉有輔助 片25，如圖5(b)所示般地，在接著片本體1的金屬突出部 2的對應部位26、金屬突出部間部位(即金屬突出部2間的 凹處32)，用大致均一的壓力(加壓力)壓向金屬基台4。即 是，可將接著片本體1的金屬基台對應面全體，以無間隙 的方式確實壓向金屬基台4,使接著片本體1以足夠的接 著強度接著於金屬基台4。相對與此，如圖6(a)所示般地 ，未使用輔助片25的場合，在凹處32，如圖6(b)所示般 地，有可能無法產生足夠的壓力。此係因爲，雖然包袋13 的片16係柔軟之物，因需能承受接著壓、溫度，乃不能期 待大的變形，因而片16與接著片8的表面之間會產生間隙 。特別是，若金屬突出部2的厚度尺寸大的場合，外壓有 可能無法充分傳達。然而，使用輔助片25的場合，接著 .片本體1對金屬基台4的壓力，係如圖5(b)所示般地均等 地產生，使輔助片25密合於接著片8的表面全體，進而可 將接著片8強固地接著於金屬基台4上。 另外，根據此製造方法，在處理室14內透過通氣管9 ’使金屬基台4的中空部3與包袋13的外部呈連通狀態， 11 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 529316 A7 _-___Β7_____ 五、發明說明（（| ) 因此，金屬基台4的中空部3與處理室I4內部維持同一壓 力，可有效地防止金屬基台4的變形，並可能消除由變形 所引起的接著不良。又，可使此被製造的複合板的表面維 持較高的平坦度。使用此複合板，對被處理物進行加熱處 理或冷卻處理的場合，可使被處理物的面內溫度分布均一 ，並可高精度地進行各處理。 其次，圖7係顯示複合板的其他實施形態。此場合， 作爲輔助片25，使用著薄的第一片25a及氈狀的、厚的第 2片25b。若使用此些片25a、25b，在脫氣製程11中，雖 薄的第一片25a確實地沿著金屬突出部2的表面及接著片 本體1的表面密合，惟對接著片本體1或金屬突出部2顯 示良好的剝離性，故在加熱/加壓製程12結束後，製品(複 合板)的取出作業變得容易。且，在此實施形態中，係與上 述的實施形態進行同樣的裝配製程10、脫氣製程U及加 熱/加壓製程12，僅在裝配製程1〇中，積層薄的第一片 25a及氈狀的厚的第2片25b此點不同，因此省略詳細的 說明。在其他的實施形態中，亦可獲致與上述的實施形態 同樣的作用效果。 又，圖8係顯示複合板的別的實施形態。此場合，輔 .助片25有凹凸部30、31。若使用此輔助片25，在加熱/加 壓製程12中，可用此輔助片25的凹部30的底面30a壓著 金屬突出部2的同時，用此輔助片25的凸部31的表面 31a，壓向上述金屬突出部2間的凹處32的底面32a。艮P 是，在此實施形態，也進行與上述圖1的實施形態同樣的 12 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) n ϋ H· ϋ i— n 一 ον I ϋ ·ϋ «ϋ II βϋ n n I * 529316 A7 ---- -B7__ 五、發明說明（j ) 裝配製程10、脫氣製程11及加熱/加壓製程12，僅在裝配 製程10中，積層具凹凸部30、31的輔助片25此點不同， 所以省略詳細的說明。因此，在此另外的實施形態中，亦 可獲致與上述的實施形態同樣的作用效果。另一方面，作 爲輔助片25，能以例如形成接著片8的方式，在樹脂片本 體的表面上進行不銹鋼薄膜等之金屬薄膜的熱壓接然後蝕 刻，藉此，可設置與接著片8的凹凸相反圖案的凸凹。 又，作爲別的實施形態，在加熱/加壓製程12中，亦 可使用軟化並可塑化的金屬箔所構成的輔助片25。即是， 只要用加熱、加壓讓此輔助片25軟化而沿著接著片本體1 及金屬突出部2密合，則可與上述各實施形態的輔助片25 同樣地，在此加熱/加壓製程12中，使接著片本體1全體 大致均一地對著金屬基台加壓，可製造高品質之複合板。 此場合，於接著後，輔助片25有必要從接著片8剝離。只 要能剝離，則可使用藉加熱而熔融者，又作爲金屬箔的材 質可使用顯示如此的性質的各種金屬。 另一方面，作爲複合板，在上述實施形態，雖利用了 半導體晶圓的製程的冷卻處理中所使用的冷卻板，即是， 由銅電極構成金屬突出部2、於其上積層著P · N型半導體 .之物，但亦可利用在半導體晶圓的製程的烘烤中所使用的 加熱板方面。此場合，例如，如圖9所示般，只要對接著 片本體1上進行不銹鋼薄膜之熱壓接等、蝕刻，使金屬突 出部2(此圖9中省略了金屬突出部2之圖示）的加熱電路圖 案化’然後於其上，透過構成接著劑層6的接著劑S來積 13 木紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) · an n n ϋ n n n 一 -OJ· n ϋ II ·ϋ n n _ A7 529316 五、發明說明（Λ ) 層覆片7，構成接著片8 ’讓此接著片8成爲所謂的加熱板 即可。且，作爲覆片7 ’係由例如聚醯亞胺系樹脂所構成 〇 以上雖對本發明的複合板之製造方法的具體實施形態 進行了說明，惟本發明並非僅限於上述實施形態，可在本 發明的範圍內進行種種變更而實施。例如’圖1及圖7所 示的製造方法中，輔助片25的數目增減係自由的’圖7及 圖8所示的製造方法中，可製造有覆片7的複合板。另外 ，作爲構成接著劑層5的接著劑S，可採用熱固性或熱塑 性的其中一者，另片狀之物亦可，氈狀之物亦可。又’接 著劑層5亦可具熱熔接型聚醯亞胺薄膜的接著用變質層來 構成。且，接著劑層5在接著過程中伴有氣體產生的場合 ，接著片8上最好設有讓氣體逃逸的微細的開□(孔）。藉 此，可將未接著部的產生防於未然。並且，作爲複合板， 亦可係在金屬基台4的兩側都具備接著片8之物。 【圖式之簡單說明】 圖1係說明本發明的複合板之製造方法的實施形態中 裝配製程之截面圖。 圖2係顯示上述複合板之製造方法之製程圖。 圖3係爲說明上述複合板之製造方法的加熱/加壓製程 之截面圖。 圖4係上述複合板之製造方法中所製造的複合板之截 面圖。 14 木紙張尺度^用中國國家標準（CNS)A4規格（21〇 χ 297公爱） -- (請先閱讀背面之注意事項再填寫本頁) · ϋ ι ϋ n ϋ n H 一 ον I In i^i n n n n I # 529316 A7 五、發明說明（l〆） 圖5係顯示上述複合板之製造方法中的加壓狀態，其 中，（a)係截面圖、（b)係壓力大小之示意圖。 圖6係顯示未使用上述輔助片的場合之加壓狀態，（a) 係截面圖、（b)係壓力大小之示意圖。 圖7係爲說明本發明的複合板之製造方法的其他實施 形態中裝配製程之截面圖。 圖8係爲說明本發明的複合板之製造方法的別的實施 形態中裝配製程之截面圖。 圖9係爲說明本發明的複合板之製造方法中所製造的 其他的複合板之截面圖。 圖10係顯示習知的複合板之製造方法之槪略圖。 【符號說明】 1 接著片本體 2 金屬突出部 3 中空部 4 金屬基台 8 接著片 13 包袋 14 處理室 25 輔助片 30 凹部 30a 底面 31 凸部 15 本、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) · ϋ I i n -ϋ ϋ I^*OJa ϋ n n ϋ I n ϋ I * 529316 A7 B7 五、發明說明（0) 31a 表面 32 凹處 32a 底面 16 衣紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂·-------·—Ϋ 1 II f Please read the Zhuyin on the back first? Please fill in this page again for matters} · ϋ i I n ί ϋ ί ον a n —a— I ϋ ϋ m n I. A7 529316 B7 _____ 5. Description of the invention (v) Connected to the outside. However, as shown in FIG. 2, the manufacturing method of the present invention includes a preparation process 10, a degassing process π, and a heating / pressurizing process 12. The assembling process 10 refers to, as shown in FIG. 1, layering on the metal base 4: the adhesive agent S constituting the adhesive agent layer 5 and the adhesive sheet body 1 (the metal protrusion 2 is laminated) to form a laminated body M The process of accommodating the laminated body M and the metal abutment 4 in the bag 13. The degassing process 11 is a process of extracting air from the inside of the bag 13 as shown in FIG. 3 to bring the inside of the bag 13 into a decompressed state. The heating / pressurizing process 12 refers to a process in which the decompressed bag 13 is placed in a processing chamber 14 and heated to a predetermined temperature, and then pressurized with a predetermined pressure. On the other hand, as shown in Fig. 1, the bag 13 has a base sheet 15 having both heat resistance and air permeability resistance, and a flexible sheet 16 having both heat resistance and air resistance resistance. The base sheet 15 has a flat plate shape. Since the sheet 16 is soft, it can be deformed corresponding to the laminated body M and the metal base 4 described above. In the storage state, a brim-shaped portion corresponding to the outer peripheral edge portion 17 of the base sheet 15 is formed. 18. Between the outer peripheral edge portion 17 of the base sheet 15 and the brim-like portion 18 of the sheet 16, a sheet 19 for sealing is arranged. In addition, the sheet 16 has a vacuum tomium (not shown). This vacuum pump is connected to a vacuum tube 20 (see FIG. 3) such as a vacuum pump (not shown). The vent tube 9 of the metal base 4 is not opened in the bag 13 but is opened in the processing chamber 14. As shown in FIG. 3, the processing chamber 14 has a pair of heaters 21 and 21 therein, and a gas supply port 23 is provided on the peripheral wall. From this gas supply port 23, a gas such as nitrogen is supplied. That is to say, the 9-paper size of the structure 9 provided in this processing chamber 14 applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '(Please read the note on the back? Matters before filling out this page)- ------ ^ ---------. A7 529316 V. Description of the invention (1) (this case refers to the bag 13 and the metal abutment 4 and the laminate contained in the bag 13) The body M) is heated at a predetermined temperature and pressurized at a predetermined pressure. Next, a manufacturing method performed in the assembly process 10, the degassing process u, and the heating / pressing process 12 will be described. First, in the assembly process 10, as shown in FIG. 1, on the surface of the metal base 4, an adhesive S constituting an adhesive layer 5 and an adhesive sheet body 1 (with a metal protruding portion 2 laminated) are laminated in this order, and The laminated body M and the metal base 4 are housed inside the bag 13. In this case, the adhesive sheet body 1 and the metal protrusion 2 constituting the adhesive sheet 8 may be in a laminated state in which they are already integrated (adhered) or in an unadhered state. An auxiliary sheet 25 is laminated on the laminated body M. The auxiliary sheet 25, for example, a non-woven fabric made of glass fiber, not only has good heat resistance and deformability, but also can be easily peeled off from the adhesive sheet 8 and the bag 13. Next, as shown in FIG. 3, the bag π containing the metal base 4 and the like is stored in the processing chamber 14 and enters the degassing process. That is, the vacuum pump is driven to extract the air in the bag 13 through the vacuum tube 20, and the bag 13 is decompressed. The decompression state in this case includes a vacuum state. After that, it enters the heating / pressing process 12. In the heaters 21 and 21, the bag 13 containing the next sheet 8 and the metal base 4 is heated, and at the same time, a gas (nitrogen) is supplied from the gas supply port 23 to the processing chamber 14, and the bag is used at this pressure. 13 Pressurize. That is, the sheet 16 of the bag 13 deformed by being heated or pressurized, and the adhesive sheet 8 is pressed against the metal base 4 by the adhesive S. In this heating / pressing process 12, in order to maintain the reduced pressure inside the bag 13 10 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling (This page) Install -------- Order --------- · A7 529316 _____B7 V. Description of the invention (again), it is best to extract the air inside the bag 13. The internal temperature of the processing chamber 14 is set to about 200 ° C. and the internal gas pressure is set to about 20 kg / cm 2. (Please read the precautions on the back before filling this page) By this, the adhesive S is heated, and the auxiliary sheet 25 is pressed to the metal base 4 side by the bag 13, and then the sheet body 1 and the metal base 4 Next, if the metal protruding portion 2 is not set, the surface side of the bonding sheet body 1 is a modified layer for bonding, so that the metal protruding portion 2 is bonded to the bonding sheet body 1. In this case, as shown in FIG. 5 (a), the auxiliary sheet 25 is used, as shown in FIG. 5 (b), between the corresponding portion 26 and the metal protruding portion of the metal protruding portion 2 of the adhesive sheet body 1 as shown in FIG. 5 (b). The part (ie, the recess 32 between the metal protrusions 2) is pressed against the metal base 4 with a substantially uniform pressure (applied pressure). That is, the entire metal base corresponding surface of the bonding sheet body 1 can be surely pressed against the metal base 4 without any gap, so that the bonding sheet body 1 can be adhered to the metal base 4 with sufficient contact strength. On the other hand, as shown in FIG. 6 (a), when the auxiliary sheet 25 is not used, the recess 32 may not generate sufficient pressure as shown in FIG. 6 (b). This is because although the sheet 16 of the bag 13 is a soft thing, it cannot withstand large deformations because it needs to be able to withstand the pressure and temperature, so there will be a gap between the surface of the sheet 16 and the surface of the adhesive sheet 8. In particular, if the thickness of the metal protruding portion 2 is large, the external pressure may not be sufficiently transmitted. However, when the auxiliary sheet 25 is used, then the pressure of the sheet body 1 on the metal base 4 is generated uniformly as shown in FIG. 5 (b), so that the auxiliary sheet 25 is in close contact with the entire surface of the adhesive sheet 8. Further, the adhesive sheet 8 can be firmly adhered to the metal base 4. In addition, according to this manufacturing method, the hollow portion 3 of the metal abutment 4 and the outside of the bag 13 are communicated with each other through the ventilation pipe 9 ′ in the processing chamber 14. The Chinese paper standard (CNS) A4 specification applies to the wood paper standard ( 210 X 297 mm) 529316 A7 _-___ Β7 _____ 5. Description of the invention ((|) Therefore, the hollow part 3 of the metal base 4 and the inside of the processing chamber I4 maintain the same pressure, which can effectively prevent the deformation of the metal base 4 and It is possible to eliminate the defective bonding caused by deformation. In addition, the surface of the manufactured composite plate can be maintained at a high level of flatness. When this composite plate is used to heat or cool the object to be processed, it can be used. The in-plane temperature distribution of the processed object is uniform and each process can be performed with high accuracy. Next, FIG. 7 shows another embodiment of the composite board. In this case, as the auxiliary sheet 25, a thin first sheet 25a and a felt-like shape are used. The thick second sheet 25b. If these sheets 25a, 25b are used, the thin first sheet 25a is firmly along the surface of the metal protrusion 2 and the surface of the sheet body 1 in the degassing process 11. Close, but right Since the main body 1 or the metal protruding portion 2 exhibits good peelability, it is easy to take out a product (composite board) after the heating / pressing process 12 is completed. In this embodiment, it is the same as the above embodiment. The same assembly process 10, degassing process U, and heating / pressurizing process 12 are performed. Only in the assembling process 10, the thin first layer 25a and the felt-like thick second sheet 25b are different, so they are omitted. Detailed description. In other embodiments, the same effect as that of the above-mentioned embodiment can be obtained. In addition, FIG. 8 shows another embodiment of the composite board. In this case, the auxiliary sheet 25 has an uneven portion 30 31. If this auxiliary sheet 25 is used, in the heating / pressing process 12, the bottom surface 30a of the recessed part 30 of the auxiliary sheet 25 can be used to press the metal protruding part 2, and the surface of the convex part 31 of the auxiliary sheet 25 31a, pressed against the bottom surface 32a of the recess 32 between the metal protrusions 2. In this embodiment, the same 12-wood paper scale as in the embodiment of FIG. 1 described above is applied to the Chinese National Standard (CNS) A4. Specifications (210 X 297 mm) (Please read the back first (Please fill in this page again for further attention) n ϋ H · ϋ i— n ον I ϋ · ϋ «ϋ II βϋ nn I * 529316 A7 ---- -B7__ V. Description of the invention (j) Assembly process The gas process 11 and the heating / pressurizing process 12 are different only in the assembly process 10 in that the auxiliary sheet 25 having the uneven portions 30 and 31 is laminated, so detailed descriptions are omitted. Therefore, in this other embodiment, also The same effect as that of the above embodiment can be obtained. On the other hand, as the auxiliary sheet 25, for example, a bonding sheet 8 can be formed, and a metal thin film such as a stainless steel thin film can be heat-pressed on the surface of the resin sheet main body, and then By etching, the unevenness | corrugation of the pattern contrary to the unevenness | corrugation of the adhesive sheet 8 can be provided. As another embodiment, in the heating / pressing process 12, an auxiliary sheet 25 composed of a softened and plasticizable metal foil may be used. That is, as long as the auxiliary sheet 25 is softened by heating and pressing, and is brought into close contact with the adhesive sheet body 1 and the metal protruding portion 2, the auxiliary sheet 25 can be heated / pressurized in the same manner as the auxiliary sheet 25 of each embodiment described above. In the process 12, the entire adhesive sheet body 1 is pressed uniformly against the metal base, and a high-quality composite plate can be manufactured. In this case, after the bonding, the auxiliary sheet 25 needs to be peeled from the bonding sheet 8. As long as it can be peeled off, it can be melted by heating, and various metals showing such properties can be used as the material of the metal foil. On the other hand, as the composite plate, in the above-mentioned embodiment, although the cooling plate used in the cooling process of the semiconductor wafer manufacturing process is used, a metal electrode is made of a copper electrode 2 and P is laminated on it. N-type semiconductors, but it can also be used in the heating plate used in the baking of semiconductor wafer manufacturing process. In this case, as shown in FIG. 9, for example, as long as the stainless steel film is subjected to thermal compression bonding or the like on the adhesive sheet body 1, the metal protrusion 2 is formed (the illustration of the metal protrusion 2 is omitted in this FIG. 9). The heating circuit is patterned ', and then it is stacked on the 13th through the adhesive S constituting the adhesive layer 6. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the note on the back first) Please fill in this page again) · an nn ϋ nnn a-OJ · n ϋ II · ϋ nn _ A7 529316 V. Description of the invention (Λ) The layer cover sheet 7 constitutes the bonding sheet 8 'Let this bonding sheet 8 become the so-called heating Board. The cover sheet 7 'is made of, for example, a polyimide-based resin. Although the specific embodiment of the method for manufacturing the composite board of the present invention has been described above, the present invention is not limited to the above-mentioned embodiment, and can be used in the present invention. Various changes are implemented within the scope of the invention. For example, in the manufacturing method shown in Figs. 1 and 7, the number of auxiliary sheets 25 can be increased or decreased freely. In the manufacturing method shown in Figs. 7 and 8, a composite sheet with a cover sheet 7 can be manufactured. In addition, as the adhesive S constituting the adhesive layer 5, either a thermosetting or a thermoplastic may be used, and another sheet-like thing or a felt-like thing may be used. The adhesive layer 5 may be formed of a heat-fusible polyimide film with a modified layer as an adhesive layer. In addition, in the case where the adhesive layer 5 is accompanied by gas generation during the adhering process, the adhesive sheet 8 is preferably provided with fine openings (holes) for escape of the gas. This prevents the occurrence of unattached parts in advance. Moreover, as a composite board, the thing which provided the adhesive sheet 8 on both sides of the metal base 4 may be sufficient. [Brief Description of the Drawings] FIG. 1 is a cross-sectional view illustrating an assembly process in an embodiment of a method for manufacturing a composite board according to the present invention. FIG. 2 is a process diagram showing the manufacturing method of the composite board. Fig. 3 is a cross-sectional view illustrating a heating / pressing process of the above-mentioned manufacturing method of a composite board. Fig. 4 is a cross-sectional view of a composite plate manufactured in the above-mentioned method for manufacturing a composite plate. 14 Wood paper size ^ Use Chinese National Standard (CNS) A4 specification (21〇χ 297 public love)-(Please read the precautions on the back before filling this page) · ϋ ι ϋ n ϋ n H ον I In i ^ innnn I # 529316 A7 V. Description of the invention (l〆) Fig. 5 shows the pressurized state in the manufacturing method of the above-mentioned composite board, in which (a) is a cross-sectional view and (b) is a schematic diagram of the magnitude of pressure. Fig. 6 is a schematic diagram showing a pressurized state when the above-mentioned auxiliary sheet is not used, (a) is a cross-sectional view, and (b) is a schematic diagram of a pressure level. Fig. 7 is a cross-sectional view illustrating an assembling process in another embodiment of the method for manufacturing a composite board according to the present invention. Fig. 8 is a cross-sectional view illustrating an assembling process in another embodiment of the method for manufacturing a composite board according to the present invention. Fig. 9 is a cross-sectional view illustrating another composite plate manufactured in the method for manufacturing a composite plate of the present invention. FIG. 10 is a schematic diagram showing a conventional method for manufacturing a composite board. [Symbol description] 1 Next sheet body 2 Metal protruding part 3 Hollow part 4 Metal abutment 8 Next sheet 13 Bag 14 Processing chamber 25 Auxiliary sheet 30 Concave part 30a Bottom surface 31 Convex part 15 This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page) · ϋ I in -ϋ ϋ I ^ * OJa ϋ nn ϋ I n ϋ I * 529316 A7 B7 V. Description of the invention (0 ) 31a Surface 32 Recess 32a Bottom 16 Paper size Applicable to Chinese National Standard (CNS) A4 (210 x 297 mm) (Please read the precautions on the back before filling this page) -------- Order · ------- ·