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TW346627B - Method for forming bump on bump disk - Google Patents

Method for forming bump on bump disk

Info

Publication number
TW346627B
TW346627B TW086107935A TW86107935A TW346627B TW 346627 B TW346627 B TW 346627B TW 086107935 A TW086107935 A TW 086107935A TW 86107935 A TW86107935 A TW 86107935A TW 346627 B TW346627 B TW 346627B
Authority
TW
Taiwan
Prior art keywords
bump
disk
forming
substrate
preparing
Prior art date
Application number
TW086107935A
Other languages
Chinese (zh)
Inventor
Tswen-Ren Chern
Ming-Horng Su
Jyh-Jonq Hwang
Shyi-Tarng Lii
Original Assignee
Trace Storage Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trace Storage Technology Corp filed Critical Trace Storage Technology Corp
Priority to TW086107935A priority Critical patent/TW346627B/en
Application granted granted Critical
Publication of TW346627B publication Critical patent/TW346627B/en

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Abstract

A method for forming a bump on a bump disk/calibration disk, which at least comprises the following steps: (a) preparing a substrate of a bump disk; and (b) wet etching the surface of the substrate thereby forming a bump with a predetermined height.
TW086107935A 1997-06-04 1997-06-04 Method for forming bump on bump disk TW346627B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086107935A TW346627B (en) 1997-06-04 1997-06-04 Method for forming bump on bump disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086107935A TW346627B (en) 1997-06-04 1997-06-04 Method for forming bump on bump disk

Publications (1)

Publication Number Publication Date
TW346627B true TW346627B (en) 1998-12-01

Family

ID=58263913

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086107935A TW346627B (en) 1997-06-04 1997-06-04 Method for forming bump on bump disk

Country Status (1)

Country Link
TW (1) TW346627B (en)

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