TW289147B - - Google Patents
Info
- Publication number
- TW289147B TW289147B TW084100388A TW84100388A TW289147B TW 289147 B TW289147 B TW 289147B TW 084100388 A TW084100388 A TW 084100388A TW 84100388 A TW84100388 A TW 84100388A TW 289147 B TW289147 B TW 289147B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Jigs For Machine Tools (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33096293 | 1993-12-27 | ||
| JP31641094A JPH07297268A (ja) | 1993-12-27 | 1994-12-20 | 静電チャック付セラミックスヒーター |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW289147B true TW289147B (zh) | 1996-10-21 |
Family
ID=26568647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084100388A TW289147B (zh) | 1993-12-27 | 1995-01-17 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5566043A (zh) |
| JP (1) | JPH07297268A (zh) |
| KR (1) | KR950021342A (zh) |
| TW (1) | TW289147B (zh) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982986A (en) | 1995-02-03 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber |
| JPH08227933A (ja) * | 1995-02-20 | 1996-09-03 | Shin Etsu Chem Co Ltd | 静電吸着機能を有するウエハ加熱装置 |
| JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
| JPH09213781A (ja) * | 1996-02-01 | 1997-08-15 | Tokyo Electron Ltd | 載置台構造及びそれを用いた処理装置 |
| JPH11260534A (ja) | 1998-01-09 | 1999-09-24 | Ngk Insulators Ltd | 加熱装置およびその製造方法 |
| JPH11343571A (ja) * | 1998-05-29 | 1999-12-14 | Ngk Insulators Ltd | サセプター |
| US6410172B1 (en) | 1999-11-23 | 2002-06-25 | Advanced Ceramics Corporation | Articles coated with aluminum nitride by chemical vapor deposition |
| WO2001080601A1 (fr) | 2000-04-14 | 2001-10-25 | Ibiden Co., Ltd. | Dispositif de chauffage en ceramique |
| US6554907B2 (en) | 2001-01-02 | 2003-04-29 | Applied Materials, Inc. | Susceptor with internal support |
| US6623563B2 (en) * | 2001-01-02 | 2003-09-23 | Applied Materials, Inc. | Susceptor with bi-metal effect |
| US6986865B2 (en) * | 2002-07-10 | 2006-01-17 | Watlow Electric Manufacturing Company | Method for manufacturing an electrostatic chuck |
| JP4278046B2 (ja) * | 2003-11-10 | 2009-06-10 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | ヒータ機構付き静電チャック |
| KR100794960B1 (ko) * | 2006-06-07 | 2008-01-16 | (주)나노테크 | 하이브리드형 히터 제조방법 |
| US7901509B2 (en) * | 2006-09-19 | 2011-03-08 | Momentive Performance Materials Inc. | Heating apparatus with enhanced thermal uniformity and method for making thereof |
| JP2008085283A (ja) | 2006-09-26 | 2008-04-10 | Momentive Performance Materials Inc | 熱均一性が強化された加熱装置及びその製造方法 |
| US8405005B2 (en) * | 2009-02-04 | 2013-03-26 | Mattson Technology, Inc. | Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate |
| JP5416570B2 (ja) * | 2009-12-15 | 2014-02-12 | 住友電気工業株式会社 | 加熱冷却デバイスおよびそれを搭載した装置 |
| US9644269B2 (en) | 2014-01-30 | 2017-05-09 | Varian Semiconductor Equipment Associates, Inc | Diffusion resistant electrostatic clamp |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2680338B2 (ja) * | 1988-03-31 | 1997-11-19 | 株式会社東芝 | 静電チャック装置 |
| EP0493089B1 (en) * | 1990-12-25 | 1998-09-16 | Ngk Insulators, Ltd. | Wafer heating apparatus and method for producing the same |
| JPH0750736B2 (ja) * | 1990-12-25 | 1995-05-31 | 日本碍子株式会社 | ウエハー加熱装置及びその製造方法 |
| US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
| JP3081279B2 (ja) * | 1991-06-03 | 2000-08-28 | 電気化学工業株式会社 | ホットプレート |
| JPH04371579A (ja) * | 1991-06-19 | 1992-12-24 | Ulvac Japan Ltd | 静電吸着装置 |
| JPH0513555A (ja) * | 1991-07-01 | 1993-01-22 | Toto Ltd | 静電チヤツク及び静電チヤツクに対する電圧印加方法 |
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1994
- 1994-12-20 JP JP31641094A patent/JPH07297268A/ja active Pending
- 1994-12-27 KR KR1019940037554A patent/KR950021342A/ko active IP Right Grant
- 1994-12-27 US US08/364,191 patent/US5566043A/en not_active Expired - Lifetime
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1995
- 1995-01-17 TW TW084100388A patent/TW289147B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07297268A (ja) | 1995-11-10 |
| KR950021342A (ko) | 1995-07-26 |
| US5566043A (en) | 1996-10-15 |