TW230833B - - Google Patents
Info
- Publication number
- TW230833B TW230833B TW082104831A TW82104831A TW230833B TW 230833 B TW230833 B TW 230833B TW 082104831 A TW082104831 A TW 082104831A TW 82104831 A TW82104831 A TW 82104831A TW 230833 B TW230833 B TW 230833B
- Authority
- TW
- Taiwan
- Prior art keywords
- bit line
- cmp
- transistor
- overall
- produced
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 210000004027 cell Anatomy 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 210000000352 storage cell Anatomy 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
- H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4223878A DE4223878C2 (de) | 1992-06-30 | 1992-06-30 | Herstellverfahren für eine Halbleiterspeicheranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
TW230833B true TW230833B (zh) | 1994-09-21 |
Family
ID=6463664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082104831A TW230833B (zh) | 1992-06-30 | 1993-06-17 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0647355B1 (zh) |
JP (1) | JP3654898B2 (zh) |
KR (1) | KR100252331B1 (zh) |
AT (1) | ATE205333T1 (zh) |
DE (2) | DE4223878C2 (zh) |
TW (1) | TW230833B (zh) |
WO (1) | WO1994000873A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960009998B1 (ko) * | 1992-06-08 | 1996-07-25 | 삼성전자 주식회사 | 반도체 메모리장치의 제조방법 |
DE4221432C2 (de) * | 1992-06-30 | 1994-06-09 | Siemens Ag | Globales Planarisierungsverfahren für integrierte Halbleiterschaltungen oder mikromechanische Bauteile |
JPH1070252A (ja) * | 1996-08-27 | 1998-03-10 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
DE19640413A1 (de) | 1996-09-30 | 1998-04-02 | Siemens Ag | Verfahren zur Herstellung barrierenfreier Halbleiterspeicheranordnungen |
GB2322964B (en) * | 1997-03-07 | 2001-10-17 | United Microelectronics Corp | Polysilicon CMP process for high-density DRAM cell structures |
KR100301370B1 (ko) * | 1998-04-29 | 2001-10-27 | 윤종용 | 디램셀커패시터의제조방법 |
KR100468784B1 (ko) * | 2003-02-14 | 2005-01-29 | 삼성전자주식회사 | 콘택으로부터 형성된 하드 마스크를 사용하는 다마신과정으로 배선을 형성하는 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0430040A3 (en) * | 1989-11-27 | 1992-05-20 | Micron Technology, Inc. | Method of forming a conductive via plug or an interconnect line of ductile metal within an integrated circuit using mechanical smearing |
JPH0834303B2 (ja) * | 1990-05-18 | 1996-03-29 | 株式会社東芝 | 半導体記憶装置の製造方法 |
US5061650A (en) * | 1991-01-17 | 1991-10-29 | Micron Technology, Inc. | Method for formation of a stacked capacitor |
-
1992
- 1992-06-30 DE DE4223878A patent/DE4223878C2/de not_active Expired - Fee Related
-
1993
- 1993-06-17 TW TW082104831A patent/TW230833B/zh not_active IP Right Cessation
- 1993-06-24 WO PCT/DE1993/000550 patent/WO1994000873A1/de active IP Right Grant
- 1993-06-24 DE DE59310206T patent/DE59310206D1/de not_active Expired - Lifetime
- 1993-06-24 AT AT93912617T patent/ATE205333T1/de not_active IP Right Cessation
- 1993-06-24 EP EP93912617A patent/EP0647355B1/de not_active Expired - Lifetime
- 1993-06-24 KR KR1019940704840A patent/KR100252331B1/ko not_active IP Right Cessation
- 1993-06-24 JP JP50194694A patent/JP3654898B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH08503812A (ja) | 1996-04-23 |
DE4223878C2 (de) | 1995-06-08 |
EP0647355B1 (de) | 2001-09-05 |
DE4223878A1 (de) | 1994-01-05 |
KR950702341A (ko) | 1995-06-19 |
JP3654898B2 (ja) | 2005-06-02 |
EP0647355A1 (de) | 1995-04-12 |
ATE205333T1 (de) | 2001-09-15 |
KR100252331B1 (ko) | 2000-04-15 |
WO1994000873A1 (de) | 1994-01-06 |
DE59310206D1 (de) | 2001-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |