TW218055B - - Google Patents

Info

Publication number: TW218055B
Authority: TW; Taiwan

Application number

TW082102306A

Original Assignee

Gold Star Electronics

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-04-03

Filing date

1993-03-26

Publication date

1993-12-21

1993-03-26 Application filed by Gold Star Electronics filed Critical Gold Star Electronics

1993-12-21 Application granted granted Critical

1993-12-21 Publication of TW218055B publication Critical patent/TW218055B/zh

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1062—Channel region of field-effect devices of charge coupled devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Electromagnetism (AREA)
Ceramic Engineering (AREA)
Solid State Image Pick-Up Elements (AREA)
Transforming Light Signals Into Electric Signals (AREA)

TW082102306A 1992-04-03 1993-03-26 TW218055B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1019920005608A KR960002645B1 (ko)	1992-04-03	1992-04-03	전하 전송장치 및 고체 촬상장치

Publications (1)

Publication Number	Publication Date
TW218055B true TW218055B (zh)	1993-12-21

Family

ID=19331361

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW082102306A TW218055B (zh)	1992-04-03	1993-03-26

Country Status (5)

Country	Link
US (1)	US5359213A (zh)
JP (1)	JP3589472B2 (zh)
KR (1)	KR960002645B1 (zh)
DE (1)	DE4310915B4 (zh)
TW (1)	TW218055B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5492852A (en) *	1993-10-07	1996-02-20	Nec Corporation	Method for fabricating a solid imaging device having improved smear and breakdown voltage characteristics
US5625210A (en) *	1995-04-13	1997-04-29	Eastman Kodak Company	Active pixel sensor integrated with a pinned photodiode
KR0172854B1 (ko) *	1995-08-02	1999-02-01	문정환	씨씨디 고체촬상소자 및 그의 신호처리방법
WO1997009818A1 (en) *	1995-08-21	1997-03-13	Starcam Systems, Inc.	High-speed high-resolution multi-frame real-time digital camera
US6320617B1 (en)	1995-11-07	2001-11-20	Eastman Kodak Company	CMOS active pixel sensor using a pinned photo diode
US6297070B1 (en)	1996-12-20	2001-10-02	Eastman Kodak Company	Active pixel sensor integrated with a pinned photodiode
US5903021A (en) *	1997-01-17	1999-05-11	Eastman Kodak Company	Partially pinned photodiode for solid state image sensors
US5963251A (en) *	1997-02-03	1999-10-05	Trw Inc.	Frame transfer readout correction
US6492694B2 (en)	1998-02-27	2002-12-10	Micron Technology, Inc.	Highly conductive composite polysilicon gate for CMOS integrated circuits
JP2001156284A (ja) *	1999-11-25	2001-06-08	Sanyo Electric Co Ltd	固体撮像素子及びその製造方法
US20070131992A1 (en) *	2005-12-13	2007-06-14	Dialog Semiconductor Gmbh	Multiple photosensor pixel image sensor
US20080136933A1 (en) *	2006-12-11	2008-06-12	Digital Imaging Systems Gmbh	Apparatus for controlling operation of a multiple photosensor pixel image sensor
US20100094340A1 (en) *	2008-10-15	2010-04-15	Tyco Healthcare Group Lp	Coating compositions

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SU535604A1 (ru) *	1974-08-09	1976-11-15	Предприятие П/Я В-2892	Регистр сдвига на приборах с зар довой св зью
US4613895A (en) *	1977-03-24	1986-09-23	Eastman Kodak Company	Color responsive imaging device employing wavelength dependent semiconductor optical absorption
US4223329A (en) *	1978-06-30	1980-09-16	International Business Machines Corporation	Bipolar dual-channel charge-coupled device
US4229754A (en) *	1978-12-26	1980-10-21	Rockwell International Corporation	CCD Imager with multi-spectral capability
NL8101883A (nl) *	1981-04-16	1982-11-16	Philips Nv	Ladingsgekoppelde inrichting.
JPS58138187A (ja) *	1982-02-12	1983-08-16	Toshiba Corp	固体イメ−ジセンサ
DE3418778A1 (de) *	1984-05-19	1985-11-21	Josef Dr. 8048 Haimhausen Kemmer	Ccd-halbleiterbauelement
DD247327A1 (de) *	1986-03-31	1987-07-01	Werk Fernsehelektronik Veb	Ueberlaufanordnung fuer ladungssammelnde halbleitergebiete
JP2822393B2 (ja) *	1988-07-30	1998-11-11	ソニー株式会社	固体撮像装置及びその駆動方法
JPH0278278A (ja) *	1988-09-13	1990-03-19	Nec Corp	赤外線センサ
KR920007355B1 (ko) *	1990-05-11	1992-08-31	금성일렉트론 주식회사	Ccd영상 소자의 구조 및 제조방법

1992
- 1992-04-03 KR KR1019920005608A patent/KR960002645B1/ko not_active IP Right Cessation
1993
- 1993-03-26 TW TW082102306A patent/TW218055B/zh not_active IP Right Cessation
- 1993-03-30 US US08/040,072 patent/US5359213A/en not_active Expired - Lifetime
- 1993-04-02 DE DE4310915A patent/DE4310915B4/de not_active Expired - Lifetime
- 1993-04-02 JP JP09843093A patent/JP3589472B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JP3589472B2 (ja)	2004-11-17
DE4310915A1 (de)	1993-10-07
KR930022571A (ko)	1993-11-24
JPH06151808A (ja)	1994-05-31
US5359213A (en)	1994-10-25
DE4310915B4 (de)	2006-08-24
KR960002645B1 (ko)	1996-02-24

Publication	Publication Date	Title
DK0553875T3 (zh)	1997-04-21
TW255911B (zh)	1995-09-01
DK0630289T3 (zh)	1997-02-24
TW229263B (zh)	1994-09-01
TW223005B (zh)	1994-05-01
DK0596750T3 (zh)	1997-02-24
TW218055B (zh)	1993-12-21
BR9207065A (zh)	1995-10-24
DK0632741T3 (zh)	1997-02-24
DK114493A (zh)	1994-04-17
DK0576346T3 (zh)	1997-03-10
DK0581129T3 (zh)	1997-03-17
DK0574276T3 (zh)	1997-07-07
DK113692D0 (zh)	1992-09-16
DK0596569T3 (zh)	1997-03-17
TW225074B (zh)	1994-06-11
DK0597323T3 (zh)	1997-02-24
DK0581726T3 (zh)	1997-02-24
BR9202713C1 (zh)	2006-09-26
DE9207553U1 (zh)	1992-10-01
IN181066B (zh)	1998-04-18
DK11192D0 (zh)	1992-01-30
DK117092D0 (zh)	1992-09-22
DK127492D0 (zh)	1992-10-19
DK145992D0 (zh)	1992-12-01

Legal Events

Date	Code	Title	Description
2013-05-11	MK4A	Expiration of patent term of an invention patent