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TW202436414A - Hydrogenated block copolymer, hydrogenated block copolymer composition, and formed article - Google Patents

Hydrogenated block copolymer, hydrogenated block copolymer composition, and formed article Download PDF

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TW202436414A
TW202436414A TW113104351A TW113104351A TW202436414A TW 202436414 A TW202436414 A TW 202436414A TW 113104351 A TW113104351 A TW 113104351A TW 113104351 A TW113104351 A TW 113104351A TW 202436414 A TW202436414 A TW 202436414A
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mass
block copolymer
hydrogenated block
hydrogenated
copolymer
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Chinese (zh)
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其田侑也
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日商旭化成股份有限公司
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Abstract

本發明獲得一種發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。 本發明之氫化嵌段共聚物(甲)滿足條件(1)~(3)。 <條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且氫化共聚物嵌段(b)之含量為65~95質量%。 <條件(2)>: 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40~75質量%。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS         (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將RS(質量%)與波峰強度P進行一次近似時之比例常數) The present invention provides a hydrogenated block copolymer exhibiting excellent low resilience and wear resistance. The hydrogenated block copolymer (A) of the present invention satisfies conditions (1) to (3). <Condition (1)>: It contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a covalent diene monomer unit, and the content of the hydrogenated copolymer block (b) is 65 to 95% by mass. <Condition (2)>: The content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 40 to 75% by mass. <Condition (3)>: The ratio g=P/P0 of the peak intensity P detected by a thermal decomposition gas chromatography mass spectrometer and P0 obtained according to (Formula I) is 0.75 or more. P0=k×RS         (Formula I) (In (Formula I), RS is the content (mass %) of the vinyl aromatic monomer unit in the block (b) relative to the entire hydrogenated block copolymer (A). k represents the proportional constant when RS (mass %) is approximated by the peak intensity P)

Description

氫化嵌段共聚物、氫化嵌段共聚物組合物、及成形體Hydrogenated block copolymer, hydrogenated block copolymer composition, and formed article

本發明係關於一種氫化嵌段共聚物、氫化嵌段共聚物組合物、及成形體。The present invention relates to a hydrogenated block copolymer, a hydrogenated block copolymer composition, and a formed article.

包含共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物之氫化物即便未進行硫化,於常溫下亦具有與硫化後之天然橡膠或合成橡膠同樣之彈性,並且於高溫下具有與熱塑性樹脂同樣之加工性,故被廣泛地用於塑膠之改質劑、黏著接著劑、汽車零件、及醫療器具等領域中。進而上述嵌段共聚物之氫化物由於耐候性、耐熱性優異,故尤其被廣泛地實際用作汽車零件或醫療器具等之材料。The hydrogenated block copolymers of covalent diene compounds and vinyl aromatic compounds have the same elasticity as vulcanized natural rubber or synthetic rubber at room temperature even without vulcanization, and have the same processability as thermoplastic resin at high temperature, so they are widely used in plastic modifiers, adhesives, automotive parts, and medical devices. Furthermore, the hydrogenated block copolymers are particularly widely used as materials for automotive parts or medical devices due to their excellent weather resistance and heat resistance.

然而,包含共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物之氫化物,例如氫化苯乙烯系彈性體(以下,有時簡稱為「TPS材料」)之耐磨耗性較差,故有於其用途方面存在限制之問題。 針對上述問題,業界提出有一種乙烯基芳香族單體單元之含量為40質量%以上且未達95質量%之無規共聚物苯乙烯系彈性體與聚丙烯樹脂之樹脂組合物、及該樹脂組合物之成形體,且揭示該成形體之耐磨耗性優異(例如參照專利文獻1)。 However, hydrogenated products of block copolymers containing covalent diene compounds and vinyl aromatic compounds, such as hydrogenated styrene elastomers (hereinafter, sometimes referred to as "TPS materials"), have poor wear resistance, so there is a problem of limitations in their use. In response to the above problem, the industry has proposed a resin composition of a random copolymer styrene elastomer and a polypropylene resin having a vinyl aromatic monomer unit content of 40 mass % or more and less than 95 mass %, and a molded body of the resin composition, and disclosed that the molded body has excellent wear resistance (for example, refer to Patent Document 1).

又,近年來,作為汽車之新穎之方向性,自動駕駛化或出行服務(mobility service)受到關注。因該潮流於汽車內飾材料所要求之性能方面亦會產生變化。例如,預測隨著自動駕駛化,汽車作為居住空間之意義會進一步增強。因此,為了不斷進行如搭乘者可生活得更舒適之空間構建,產生具有高級感之觸感,需要低反彈之材料等。 又,從出行服務之觀點出發,認為隨著共享汽車(car sharing)之滲透,業界不斷追求汽車之長壽命性與清潔性。因此,汽車內飾材料之清掃次數較先前增加,成為汽車內飾材料之材料之樹脂組合物需要更高之耐磨耗性。 如上所述,因自動駕駛化或出行服務之滲透,近年來,樹脂組合物之材料之聚合物需要優於先前產品之高耐磨耗性、良好之觸感。 In recent years, as a new direction of automobiles, autonomous driving or mobility services have attracted attention. Due to this trend, the performance required of automobile interior materials will also change. For example, it is predicted that with autonomous driving, the significance of automobiles as living spaces will be further enhanced. Therefore, in order to continuously construct spaces where passengers can live more comfortably, a high-end touch is produced, and low-rebound materials are required. In addition, from the perspective of mobility services, it is believed that with the penetration of car sharing, the industry is constantly pursuing the longevity and cleanliness of automobiles. Therefore, the number of times that automobile interior materials are cleaned has increased compared to before, and the resin composition used as the material for automobile interior materials needs to have higher wear resistance. As mentioned above, due to the penetration of autonomous driving or mobility services, in recent years, the polymers of the materials of the resin composition are required to have higher wear resistance and better touch than previous products.

鑒於如上所述之要求,業界提出有一種於特定之溫度範圍內具有tanδ(損耗正切)之波峰之氫化嵌段共聚物,且顯示使用該氫化嵌段共聚物之樹脂組合物之能量吸收性優異,可表現出低反彈性(例如參照專利文獻2)。 [先前技術文獻] [專利文獻] In view of the above requirements, the industry has proposed a hydrogenated block copolymer having a tanδ (loss tangent) peak within a specific temperature range, and it is shown that the resin composition using the hydrogenated block copolymer has excellent energy absorption and can show low resilience (for example, refer to patent document 2). [Prior art document] [Patent document]

[專利文獻1]國際公開第2003/035705號 [專利文獻2]國際公開第2010/018743號 [Patent Document 1] International Publication No. 2003/035705 [Patent Document 2] International Publication No. 2010/018743

[發明所欲解決之問題][The problem the invention is trying to solve]

然而,先前提出之氫化嵌段共聚物具有如下問題:關於良好之觸感即低反彈性、耐磨耗性,尚有改善之餘地。However, the hydrogenated block copolymers previously proposed have the following problems: there is still room for improvement in terms of good touch, i.e., low resilience, and abrasion resistance.

因此,本發明之目的在於提供一種可發揮出優異之低反彈性、及耐磨耗性之氫化嵌段共聚物。 [解決問題之技術手段] Therefore, the purpose of the present invention is to provide a hydrogenated block copolymer that can exhibit excellent low resilience and wear resistance. [Technical means for solving the problem]

本發明人等為了解決上述先前技術之課題而反覆進行努力研究,結果發現,可提供一種氫化嵌段共聚物,從而完成本發明,該氫化嵌段共聚物係具有特定之結構者,且藉由特定出氫化嵌段共聚物中之包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b)之含量、上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量、及規定之隨機性參數g,其低反彈性與耐磨耗性優異。 即,本發明如下所述。 The inventors of the present invention have repeatedly conducted research to solve the above-mentioned problems of the prior art, and as a result, have found that a hydrogenated block copolymer can be provided, thereby completing the present invention. The hydrogenated block copolymer has a specific structure, and by specifying the content of the hydrogenated copolymer block (b) containing vinyl aromatic monomer units and covalent diene monomer units in the hydrogenated block copolymer, the content of the vinyl aromatic monomer units in the hydrogenated copolymer block (b), and the specified random parameter g, the low resilience and wear resistance are excellent. That is, the present invention is as follows.

[1] 一種氫化嵌段共聚物(甲),其包含乙烯基芳香族單體單元與共軛二烯單體單元,且 含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a),並且 滿足下述<條件(1)>~<條件(3)>。 <條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且上述氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。 <條件(2)>: 上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據下述(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS         (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對均相聚合(homogeneous polymerization)之氫化嵌段共聚物(甲)進行分析時獲得) [2] 如上述[1]中所記載之氫化嵌段共聚物,其中上述波峰強度P、與 利用上述(式I)求出之P0之比率g=P/P0為0.9以上。 [3] 如上述[1]或[2]中所記載之氫化嵌段共聚物,其中上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為55質量%以上且65質量%以下。 [4] 如上述[1]至[3]中任一項所記載之氫化嵌段共聚物,其中氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為75質量%以上且85質量%以下。 [5] 一種氫化嵌段共聚物組合物,其含有:如上述[1]至[4]中任一項所記載之氫化嵌段共聚物(甲):1質量%以上且50質量%以下、 至少一種烯烴系樹脂(乙):5質量%以上且90質量%以下、 至少一種熱塑性樹脂(丙):1質量%以上且50質量%以下、及 至少一種軟化劑(丁):5質量%以上且90質量%以下。 [6] 如上述[5]中所記載之氫化嵌段共聚物組合物,其中上述烯烴系樹脂(乙)包含至少一種聚丙烯系樹脂。 [7] 一種成形體,其為如上述[5]中所記載之氫化嵌段共聚物組合物之成形體。 [8] 如上述[5]中所記載之成形體,其為發泡體。 [發明之效果] [1] A hydrogenated block copolymer (A) comprising vinyl aromatic monomer units and covalent diene monomer units, and containing at least one polymer block (a) mainly composed of vinyl aromatic monomer units, and satisfying the following <Condition (1)> to <Condition (3)>. <Condition (1)>: containing at least one hydrogenated copolymer block (b) comprising vinyl aromatic monomer units and covalent diene monomer units, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) is 65 mass % or more and 95 mass % or less. <Condition (2)>: the content of the vinyl aromatic monomer units in the hydrogenated copolymer block (b) is 40 mass % or more and 75 mass % or less. <Condition (3)>: The ratio g=P/P0 of the peak intensity P detected by the thermal decomposition gas chromatography mass spectrometry analyzer and P0 obtained according to the following (Formula I) is greater than 0.75. P0=k×RS         (Formula I) (In (Formula I), RS is the content (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole. k represents the proportional constant when the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole is first approximated to the peak intensity P, which is obtained when the hydrogenated block copolymer (A) of homogeneous polymerization is analyzed using a thermal decomposition gas chromatography mass spectrometry analyzer) [2] The hydrogenated block copolymer described in [1] above, wherein the ratio g=P/P0 of the peak intensity P to P0 obtained using the above (Formula I) is 0.9 or more. [3] The hydrogenated block copolymer as described in [1] or [2] above, wherein the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 55% by mass or more and 65% by mass or less. [4] The hydrogenated block copolymer as described in any one of [1] to [3] above, wherein the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) is 75% by mass or more and 85% by mass or less. [5] A hydrogenated block copolymer composition comprising: 1 mass % or more and 50 mass % or less of the hydrogenated block copolymer (A) as described in any one of [1] to [4] above, 5 mass % or more and 90 mass % or less of at least one olefinic resin (B), 1 mass % or more and 50 mass % or less of at least one thermoplastic resin (C), and 5 mass % or more and 90 mass % or less of at least one softener (D). [6] The hydrogenated block copolymer composition as described in [5] above, wherein the olefinic resin (B) comprises at least one polypropylene resin. [7] A molded article, which is a molded article of the hydrogenated block copolymer composition as described in [5] above. [8] The molded article described in [5] above is a foamed article. [Effects of the invention]

根據本發明,可獲得發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。According to the present invention, a hydrogenated block copolymer exhibiting excellent low resilience and abrasion resistance can be obtained.

以下,對用以實施本發明之形態(以下,稱為「本實施方式」)詳細地進行說明。再者,以下之本實施方式為用以說明本發明之例示,並非將本發明限定為以下內容之宗旨,本發明可於其主旨之範圍內進行各種變化而實施。The following is a detailed description of a form for implementing the present invention (hereinafter referred to as "this embodiment"). Furthermore, the following this embodiment is an example for explaining the present invention, and does not limit the present invention to the purpose of the following content. The present invention can be implemented in various ways within the scope of its purpose.

[氫化嵌段共聚物] 本實施方式之氫化嵌段共聚物(以下,有時記載為氫化嵌段共聚物(甲))係包含乙烯基芳香族單體單元與共軛二烯單體單元,且含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之嵌段共聚物之氫化物,並且滿足下述<條件(1)>~<條件(3)>。 [Hydrogenated block copolymer] The hydrogenated block copolymer of the present embodiment (hereinafter, sometimes described as hydrogenated block copolymer (a)) is a hydrogenated product of a block copolymer comprising vinyl aromatic monomer units and covalent diene monomer units, and containing at least one polymer block (a) having vinyl aromatic monomer units as the main component, and satisfies the following <condition (1)> to <condition (3)>.

<條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且本實施方式之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。 <條件(2)>: 上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與根據下述(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS    …  (式I) (RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行分析時獲得) <Condition (1)>: Contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a covalent diene monomer unit, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of the present embodiment is 65 mass % or more and 95 mass % or less. <Condition (2)>: The content of the vinyl aromatic monomer unit in the above hydrogenated copolymer block (b) is 40 mass % or more and 75 mass % or less. <Condition (3)>: The ratio g=P/P0 of the peak intensity P detected by a thermal decomposition gas chromatography mass spectrometer and P0 determined according to the following (Formula I) is 0.75 or more. P0=k×RS    …  (Formula I) (RS is the content (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole. k represents the proportional constant when the content RS of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole is first approximated to the peak intensity P, which is obtained when the hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization method) is analyzed using a thermal decomposition gas chromatography mass spectrometer))

藉由具有上述構成,可獲得發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。 再者,於本說明書中,將組入至聚合物中前之狀態記載為「化合物」,將組入至聚合物中後之狀態記載為「單體單元」。 By having the above-mentioned structure, a hydrogenated block copolymer exhibiting excellent low resilience and wear resistance can be obtained. In addition, in this specification, the state before being incorporated into the polymer is described as "compound", and the state after being incorporated into the polymer is described as "monomer unit".

(乙烯基芳香族單體單元) 本實施方式之氫化嵌段共聚物(甲)包含乙烯基芳香族單體單元。 作為形成乙烯基芳香族單體單元之乙烯基芳香族化合物,例如可例舉源自苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、二乙烯苯、1,1-二苯基乙烯、N,N-二甲基-對胺基乙基苯乙烯、N,N-二乙基-對胺基乙基苯乙烯等之單體單元,但並不限定於以上。 尤其是從成本與包含氫化嵌段共聚物之樹脂組合物之機械強度的平衡之觀點出發,較佳為苯乙烯。 該等可僅單獨使用一種,亦可併用兩種以上。 (Vinyl aromatic monomer units) The hydrogenated block copolymer (A) of the present embodiment contains vinyl aromatic monomer units. As the vinyl aromatic compound forming the vinyl aromatic monomer units, for example, monomer units derived from styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylethylene, N,N-dimethyl-p-aminoethylstyrene, N,N-diethyl-p-aminoethylstyrene, etc. can be cited, but it is not limited to the above. In particular, from the perspective of the balance between cost and the mechanical strength of the resin composition containing the hydrogenated block copolymer, styrene is preferred. These may be used alone or in combination of two or more.

(共軛二烯單體單元) 本實施方式之氫化嵌段共聚物(甲)包含共軛二烯單體單元。 共軛二烯單體單元係源自具有1對共軛雙鍵之二烯烴之單體單元。 作為此種二烯烴,例如可例舉:1,3-丁二烯、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-戊二烯、1,3-己二烯等,但並不限定於以上。 尤其是從良好之成形加工性與機械強度之平衡之觀點出發,較佳為1,3-丁二烯、異戊二烯。 該等可僅單獨使用一種,亦可併用兩種以上。 (Conjugated diene monomer units) The hydrogenated block copolymer (A) of the present embodiment includes conjugated diene monomer units. The conjugated diene monomer units are monomer units derived from dienes having a pair of conjugated double bonds. Examples of such dienes include, but are not limited to, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, and 1,3-hexadiene. In particular, from the viewpoint of a good balance between molding processability and mechanical strength, 1,3-butadiene and isoprene are preferred. These may be used alone or in combination of two or more.

(全部共軛二烯單體單元中之乙烯基鍵量) 本實施方式之氫化嵌段共聚物(甲)對全部共軛二烯單體單元中之乙烯基鍵量並無特別限定,較佳為5質量%以上。更佳為15質量%以上,進而較佳為20質量%以上。 若氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量為5質量%以上,則於氫化步驟中,可抑制由經氫化之共軛二烯嵌段之結晶化所引起之自溶液中的析出。又,若乙烯基鍵量為5質量%以上,則經氫化之共軛二烯嵌段之結晶化得以抑制,於本實施方式之氫化嵌段共聚物、其組合物、及成形體中可獲得良好之柔軟性。 又,本實施方式之氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量較佳為60質量%以下,更佳為50質量%以下。若氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量為60質量%以下,則於本實施方式之氫化嵌段共聚物、其組合物、及成形體中可獲得良好之拉伸強度。 氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量例如可藉由使用下述三級胺化合物或醚化合物等調整劑(乙烯基鍵量調整劑),控制在上述數值範圍內。 又,上述乙烯基鍵量可藉由下述實施例中所記載之方法進行測定。 (Vinyl bond content in all conjugated diene monomer units) The hydrogenated block copolymer (A) of this embodiment has no particular limitation on the vinyl bond content in all conjugated diene monomer units, and is preferably 5% by mass or more. More preferably, it is 15% by mass or more, and further preferably, it is 20% by mass or more. If the vinyl bond content in all conjugated diene monomer units of the hydrogenated block copolymer (A) is 5% by mass or more, precipitation from the solution caused by crystallization of the hydrogenated conjugated diene block can be suppressed in the hydrogenation step. Furthermore, if the vinyl bond content is 5% by mass or more, the crystallization of the hydrogenated covalent diene block can be suppressed, and good flexibility can be obtained in the hydrogenated block copolymer of the present embodiment, its composition, and molded body. Furthermore, the vinyl bond content of all covalent diene monomer units in the hydrogenated block copolymer (A) of the present embodiment is preferably 60% by mass or less, and more preferably 50% by mass or less. If the vinyl bond content of all covalent diene monomer units in the hydrogenated block copolymer (A) is 60% by mass or less, good tensile strength can be obtained in the hydrogenated block copolymer of the present embodiment, its composition, and molded body. The vinyl bond content of all the conjugated diene monomer units of the hydrogenated block copolymer (A) can be controlled within the above numerical range by using, for example, a modifier (vinyl bond content modifier) such as the following tertiary amine compound or ether compound. In addition, the above vinyl bond content can be measured by the method described in the following examples.

(全部乙烯基芳香族單體單元之含量) 本實施方式之氫化嵌段共聚物(甲)之全部乙烯基芳香族單體單元之含量較佳為50質量%以上且80質量%以下,更佳為55質量%以上且80質量%以下,進而較佳為60質量%以上且80質量%以下。 若全部乙烯基芳香族單體單元之含量為50質量%以上,則本實施方式之氫化嵌段共聚物(甲)有耐油性變得良好之傾向。若耐油性良好,則於汽車材料等中,可用於要求更嚴格之耐油性之用途。 作為要求更嚴格之耐油性之用途,例如於汽車內飾材料等中,於更薄壁之成形體成形時、或更複雜/大型之成形體成形時,亦於更長時間使用之情形時,藉由使用本實施方式之氫化嵌段共聚物(甲),有可抑制材料之變形或外觀不良等之傾向。 再者,於本說明書中,「通常之成形體」係定義為厚度為2 mm左右且平板狀之簡易之150 mm見方左右的小型成形體。經確認,與此種「通常之成形體」相比,薄壁之成形體、或複雜且大型之成形體有耐油性、耐磨耗性、耐損傷性、外觀、低溫特性、觸感、形狀維持等各種特性降低之傾向。 又,若耐油性良好,則有於下述本實施方式之氫化嵌段共聚物組合物中氫化嵌段共聚物(甲)調配量上限增加,調配自由度提高之傾向。 通常,有於下述本實施方式之氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)調配量越少,則耐油性變得越良好之傾向,但有氫化嵌段共聚物(甲)調配量越多,則耐磨耗性或觸感越優化之傾向,故調配量之上限較佳為較高。 再者,本實施方式之氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元之含量可將氫化前之嵌段共聚物、或氫化後之氫化嵌段共聚物作為檢體,並使用紫外線分光光度計來測定。 又,氫化嵌段共聚物(甲)之全部乙烯基芳香族單體單元之含量可藉由主要調整添加至聚合反應器中的乙烯基芳香族化合物之量、反應溫度、反應時間,控制在上述數值範圍內。 (Content of all vinyl aromatic monomer units) The content of all vinyl aromatic monomer units of the hydrogenated block copolymer (A) of the present embodiment is preferably 50% by mass or more and 80% by mass or less, more preferably 55% by mass or more and 80% by mass or less, and further preferably 60% by mass or more and 80% by mass or less. If the content of all vinyl aromatic monomer units is 50% by mass or more, the hydrogenated block copolymer (A) of the present embodiment tends to have good oil resistance. If the oil resistance is good, it can be used for applications requiring more stringent oil resistance in automotive materials, etc. For applications requiring more stringent oil resistance, such as automotive interior materials, when molding thinner-walled molded bodies, or when molding more complex/large molded bodies, or when used for a longer period of time, the use of the hydrogenated block copolymer (A) of this embodiment tends to suppress deformation of the material or poor appearance. In addition, in this specification, "normal molded bodies" are defined as simple small molded bodies of about 150 mm square that are flat and have a thickness of about 2 mm. It has been confirmed that thin-walled molded bodies, or complex and large molded bodies tend to have reduced properties such as oil resistance, wear resistance, damage resistance, appearance, low temperature characteristics, touch, and shape retention compared to such "normal molded bodies". Furthermore, if the oil resistance is good, the upper limit of the amount of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment described below increases, and the degree of freedom in the formulation tends to be improved. Generally, the less the amount of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment described below is, the better the oil resistance tends to be, but the more the amount of the hydrogenated block copolymer (A) is, the better the wear resistance or touch tends to be, so the upper limit of the formulation amount is preferably higher. Furthermore, the content of all vinyl aromatic monomer units in the hydrogenated block copolymer (A) of the present embodiment can be measured by using a UV spectrophotometer with the block copolymer before hydrogenation or the hydrogenated block copolymer after hydrogenation as a specimen. In addition, the content of all vinyl aromatic monomer units of the hydrogenated block copolymer (A) can be controlled within the above numerical range by mainly adjusting the amount of vinyl aromatic compound added to the polymerization reactor, the reaction temperature, and the reaction time.

再者,於本說明書中,關於構成氫化嵌段共聚物(甲)之聚合物嵌段,「作為主體」意指規定之嵌段聚合物中之比率為85質量%以上,較佳為90質量%以上,更佳為95質量%以上。 再者,上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下(上述<條件(2)>),故上述聚合物嵌段(a)與氫化聚合物嵌段(b)可明確地區分開來。 Furthermore, in this specification, regarding the polymer block constituting the hydrogenated block copolymer (a), "as the main body" means that the ratio in the specified block polymer is 85 mass% or more, preferably 90 mass% or more, and more preferably 95 mass% or more. Furthermore, the content of the vinyl aromatic monomer unit in the above hydrogenated copolymer block (b) is 40 mass% or more and 75 mass% or less (the above <condition (2)>), so the above polymer block (a) and the hydrogenated polymer block (b) can be clearly distinguished.

(將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)) 本實施方式之氫化嵌段共聚物(甲)含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)。因此有可防止顆粒黏連之傾向。 又,本實施方式之氫化嵌段共聚物(甲)之上述聚合物嵌段(a)之含量較佳為5質量%以上,更佳為10質量%以上,進而較佳為15質量%以上。 若將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量為5質量%以上,則氫化嵌段共聚物(甲)之顆粒之耐黏連性變得良好,有於本實施方式之氫化嵌段共聚物、其組合物、及成形體中表現出良好之拉伸特性之傾向。 (Polymer block (a) with vinyl aromatic monomer units as the main component) The hydrogenated block copolymer (A) of this embodiment contains at least one polymer block (a) with vinyl aromatic monomer units as the main component. Therefore, there is a tendency to prevent the particles from sticking together. In addition, the content of the above polymer block (a) of the hydrogenated block copolymer (A) of this embodiment is preferably 5% by mass or more, more preferably 10% by mass or more, and further preferably 15% by mass or more. If the content of the polymer block (a) with vinyl aromatic monomer units as the main component is 5% by mass or more, the particles of the hydrogenated block copolymer (A) have good anti-sticking properties, and there is a tendency to show good tensile properties in the hydrogenated block copolymer of this embodiment, its composition, and molded body.

於本實施方式之氫化嵌段共聚物(甲)之顆粒顯示出良好的耐黏連性之情形時,有輸送時於更長時間、更高之荷重、嚴苛之溫度環境(例如外部氣溫較高之地域、冷暖差劇烈之地域)等條件下亦不易產生黏連之傾向,可謀求容易進行複合物成形時之顆粒計量或摻合等。又,有能夠減少防黏著劑之調配量,可獲得避免裝置污垢,減少環境負荷,抑制意料之外之物性之降低,例如透明性、機械強度等之降低之效果之傾向。When the particles of the hydrogenated block copolymer (A) of the present embodiment show good anti-blocking properties, they tend to be less likely to stick even when transported for a longer time, under a higher load, or in a harsh temperature environment (e.g., in an area with a high external temperature or an area with a sharp temperature difference), and thus can be easily weighed or blended during composite molding. In addition, the amount of anti-sticking agent can be reduced, thereby avoiding device contamination, reducing environmental load, and suppressing unexpected reductions in physical properties, such as reductions in transparency and mechanical strength.

本實施方式之氫化嵌段共聚物(甲)中之上述聚合物嵌段(a)的含量可將氫化前之嵌段共聚物或氫化後之氫化嵌段共聚物作為檢體,藉由使用核磁共振裝置(NMR)之方法(Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981)中所記載之方法。以下稱為「NMR法」)進行測定。具體而言,可藉由下述實施例中所記載之方法進行測定。 又,氫化嵌段共聚物(甲)中之聚合物嵌段(a)之含量可藉由主要調整添加至聚合反應器中的乙烯基芳香族化合物之量、反應溫度、反應時間,控制在上述數值範圍內。 The content of the polymer block (a) in the hydrogenated block copolymer (A) of the present embodiment can be measured by using a nuclear magnetic resonance device (NMR) method (the method described in Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981). Hereinafter referred to as "NMR method") using the block copolymer before hydrogenation or the hydrogenated block copolymer after hydrogenation as a sample. Specifically, it can be measured by the method described in the following examples. In addition, the content of the polymer block (a) in the hydrogenated block copolymer (A) can be controlled within the above numerical range by mainly adjusting the amount of the vinyl aromatic compound added to the polymerization reactor, the reaction temperature, and the reaction time.

(氫化共聚物嵌段(b)) <條件(1)> 本實施方式之氫化嵌段共聚物(甲)含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。 (Hydrogenated copolymer block (b)) <Condition (1)> The hydrogenated block copolymer (A) of the present embodiment contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a covalent diene monomer unit, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) is 65 mass % or more and 95 mass % or less.

本實施方式之氫化嵌段共聚物(甲)中之上述氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,較佳為70質量%以上且90質量%以下,更佳為75質量%以上且85質量%以下。 若本實施方式之氫化嵌段共聚物(甲)中之上述氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為70質量%以上且90質量%以下,則表現更出高之耐磨耗性,若為75質量%以上且85質量%以下,則可於如下情形時使用:於如耐磨耗性之要求進而嚴格之用途,例如於汽車內飾材料等中於更薄壁之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,假定乘車時需要由更高之荷重或眼較粗之布料,例如細白布3號之類的眼粗於棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性的用途中,要求長時間維持外觀。 又,若耐磨耗性良好,則於使用本實施方式之氫化嵌段共聚物(甲)之氫化嵌段共聚物組合物中可降低氫化嵌段共聚物(甲)之調配量的下限值,有調配自由度提高之傾向。 通常,有下述氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之調配量越多,耐磨耗性變得越良好之傾向,但由於有氫化嵌段共聚物(甲)之調配量越少,則耐油性或材料成本等變得越良好之傾向,故調配量之下限值較佳為較低。 若本實施方式之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,則表現出優異之低反彈性,故有表現出良好之觸感之傾向。進而,若為70質量%以上且90質量%以下,則低反彈性提高,可用於如觸感之要求更嚴格之用途中,若為75質量%以上且85質量%以下,則可適宜地用於如觸感之要求進而嚴格之用途,例如汽車內飾材料等中。 The content of the above-mentioned hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of the present embodiment is 65 mass % or more and 95 mass % or less, preferably 70 mass % or more and 90 mass % or less, and more preferably 75 mass % or more and 85 mass % or less. If the content of the above-mentioned hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of the present embodiment is 65 mass % or more and 95 mass % or less, the hydrogenated block copolymer (A) of the present embodiment tends to show good wear resistance. Furthermore, if it is 70% by mass or more and 90% by mass or less, it shows higher wear resistance. If it is 75% by mass or more and 85% by mass or less, it can be used in the following situations: In applications where the requirements for wear resistance are more stringent, such as applications where excellent wear resistance is required in thinner-walled molded bodies in automotive interior materials, or applications where wear resistance due to higher loads or coarser mesh fabrics, such as fine white cloth No. 3, which is coarser than cotton fabrics, i.e., denim cotton fabrics, is required to maintain the appearance for a long time. Furthermore, if the wear resistance is good, the lower limit of the amount of the hydrogenated block copolymer (A) can be reduced in the hydrogenated block copolymer composition using the hydrogenated block copolymer (A) of the present embodiment, and there is a tendency to increase the degree of freedom in the formulation. Generally, the more the amount of the hydrogenated block copolymer (A) is formulated in the hydrogenated block copolymer composition described below, the better the wear resistance tends to be. However, since the less the amount of the hydrogenated block copolymer (A) is formulated, the better the oil resistance or material cost tends to be, the lower limit of the formulation amount is preferably lower. If the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of the present embodiment is 65% by mass or more and 95% by mass or less, it exhibits excellent low resilience and tends to exhibit good tactile properties. Furthermore, if it is 70% by mass or more and 90% by mass or less, the low resilience is improved and can be used in applications with more stringent requirements for tactile properties. If it is 75% by mass or more and 85% by mass or less, it can be suitably used in applications with more stringent requirements for tactile properties, such as automotive interior materials, etc.

<條件(2)> 本實施方式之氫化嵌段共聚物(甲)之上述氫化共聚物嵌段(b)(100質量%)中之乙烯基芳香族單體單元的含量為40質量%以上且75質量%以下。 <Condition (2)> The content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) (100% by mass) of the hydrogenated block copolymer (A) of this embodiment is 40% by mass or more and 75% by mass or less.

氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,較佳為45質量%以上且70質量%以下,更佳為55質量%以上且65質量%以下 若氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為45質量%以上且70質量%以下,則表現出更高之耐磨耗性,若為55質量%以上且65質量%以下,則有可於如下情形時使用之傾向:於如耐磨耗性之要求進而更嚴格之用途,例如於汽車內飾材料等中,於更薄壁下之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,假定乘車時需要更高之荷重或眼較粗之布料,例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性的用途中,要求長時間維持外觀。 若氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,則表現出優異之低反彈性,故有表現出良好之觸感之傾向。進而,若為45質量%以上且70質量%以下,則低反彈性提高,可於如觸感之要求更嚴格之用途中使用,若為55質量%以上且65質量%以下,則可於如觸感之要求進而嚴格之用途,例如汽車內飾材料等中使用。 The content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, preferably 45% by mass or more and 70% by mass or less, and more preferably 55% by mass or more and 65% by mass or less If the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, the hydrogenated block copolymer (A) of the present embodiment tends to show good wear resistance. Furthermore, if it is 45% by mass or more and 70% by mass or less, it shows higher wear resistance, and if it is 55% by mass or more and 65% by mass or less, it tends to be used in the following situations: In applications where the requirements for wear resistance are even more stringent, such as in automotive interior materials, applications where excellent wear resistance is required in thinner-walled molded bodies, or in automotive interior materials applications, applications where a higher load is required when riding in a car, or where coarser mesh fabrics are required, such as coarser mesh fabrics such as fine calico No. 3, which are denim twill cotton fabrics, and wear resistance is required to maintain the appearance for a long time. If the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, it exhibits excellent low resilience and tends to exhibit good tactile properties. Furthermore, if it is 45% by mass or more and 70% by mass or less, the low resilience is improved and it can be used in applications with more stringent requirements for tactile properties. If it is 55% by mass or more and 65% by mass or less, it can be used in applications with more stringent requirements for tactile properties, such as automotive interior materials.

再者,氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量可藉由核磁共振裝置(NMR)等來進行測定。 又,氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量可藉由調整添加至聚合反應器中之乙烯基芳香族化合物、共軛二烯化合物之量或供給速度、反應溫度等,控制在上述數值範圍內。 Furthermore, the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) can be measured by a nuclear magnetic resonance device (NMR) or the like. In addition, the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) can be controlled within the above numerical range by adjusting the amount or supply rate of the vinyl aromatic compound and the covalent diene compound added to the polymerization reactor, the reaction temperature, etc.

(氫化嵌段共聚物(甲)之重量平均分子量) 從本實施方式之氫化嵌段共聚物之顆粒製造時之擠出成形性、及獲得良好之機械強度之觀點出發,本實施方式之氫化嵌段共聚物(甲)之重量平均分子量(Mw)較佳為1萬以上且50萬以下,更佳為5萬以上且45萬以下,進而較佳為10萬以上且40萬以下。若重量平均分子量(Mw)為1萬以上,則有於使用本實施方式之氫化嵌段共聚物之氫化嵌段共聚物組合物中,表現出良好之機械強度之傾向 又,若重量平均分子量(Mw)為50萬以下,則於氫化嵌段共聚物之顆粒製造時(擠出成形時),有氫化嵌段共聚物(甲)容易熔融,線料較穩定,擠出成形性提高之傾向。 再者,本實施方式之氫化嵌段共聚物(甲)之重量平均分子量可利用凝膠滲透層析法(GPC)進行測定,並使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量製作)而求出。 (Weight average molecular weight of hydrogenated block copolymer (A)) From the viewpoint of extrusion moldability during pellet production of the hydrogenated block copolymer of this embodiment and obtaining good mechanical strength, the weight average molecular weight (Mw) of the hydrogenated block copolymer (A) of this embodiment is preferably 10,000 or more and 500,000 or less, more preferably 50,000 or more and 450,000 or less, and further preferably 100,000 or more and 400,000 or less. If the weight average molecular weight (Mw) is 10,000 or more, the hydrogenated block copolymer composition using the hydrogenated block copolymer of this embodiment tends to show good mechanical strength. In addition, if the weight average molecular weight (Mw) is 500,000 or less, the hydrogenated block copolymer (A) tends to be easy to melt during the preparation of the hydrogenated block copolymer pellets (during extrusion molding), the strands are more stable, and the extrusion molding properties tend to be improved. Furthermore, the weight average molecular weight of the hydrogenated block copolymer (A) of this embodiment can be measured by gel permeation chromatography (GPC) and obtained using a calibration curve obtained by measuring commercially available standard polystyrene (prepared using the peak molecular weight of standard polystyrene).

(氫化嵌段共聚物(甲)之分子量分佈(Mw/Mn)) 本實施方式之氫化嵌段共聚物(甲)分子量分佈(Mw/Mn)較佳為10以下,更佳為1~8,進而較佳為1.01~1.10。 氫化嵌段共聚物(甲)之重量平均分子量(Mw)與數量平均分子量(Mn)係利用凝膠滲透層析法(GPC)進行測定,使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量製作)而求出層析圖之波峰的分子量。氫化嵌段共聚物(甲)之分子量分佈(Mw/Mn)係根據重量平均分子量(Mw)與數量平均分子量(Mn)之比率求出。 (Molecular weight distribution (Mw/Mn) of hydrogenated block copolymer (A)) The molecular weight distribution (Mw/Mn) of the hydrogenated block copolymer (A) of the present embodiment is preferably 10 or less, more preferably 1 to 8, and further preferably 1.01 to 1.10. The weight average molecular weight (Mw) and number average molecular weight (Mn) of the hydrogenated block copolymer (A) are measured by gel permeation chromatography (GPC), and the molecular weight of the peak of the chromatogram is obtained using a calibration curve obtained by measuring commercially available standard polystyrene (prepared using the peak molecular weight of standard polystyrene). The molecular weight distribution (Mw/Mn) of the hydrogenated block copolymer (A) is obtained based on the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn).

(氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵之氫化率) 於使用本實施方式之氫化嵌段共聚物之氫化嵌段共聚物組合物中,從獲得良好之耐候性、低溫特性之觀點出發,本實施方式之氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵的氫化率較佳為25莫耳%以上,更佳為70莫耳%以上,進而較佳為85莫耳%以上,進而更佳為92莫耳%以上。 氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵之氫化率可藉由調整氫化量,控制在上述數值範圍內。氫化嵌段共聚物(甲)之氫化率可使用核磁共振裝置(NMR)等來測定。 (Hydrogenation rate of double bonds of conjugated diene monomer units in hydrogenated block copolymer (A)) In the hydrogenated block copolymer composition using the hydrogenated block copolymer of the present embodiment, from the viewpoint of obtaining good weather resistance and low temperature properties, the hydrogenation rate of double bonds of conjugated diene monomer units in the hydrogenated block copolymer (A) of the present embodiment is preferably 25 mol% or more, more preferably 70 mol% or more, further preferably 85 mol% or more, further preferably 92 mol% or more. The hydrogenation rate of double bonds of conjugated diene monomer units in the hydrogenated block copolymer (A) can be controlled within the above numerical range by adjusting the hydrogenation amount. The hydrogenation rate of the hydrogenated block copolymer (A) can be measured using a nuclear magnetic resonance device (NMR) or the like.

(氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵之氫化率) 關於本實施方式之氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵的氫化率,於下述本實施方式之氫化嵌段共聚物組合物中,從獲得良好之耐候性之觀點出發,較佳為50莫耳%以下,更佳為30莫耳%以下,進而較佳為10莫耳%以下。 氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵之氫化率可使用核磁共振裝置(NMR)等來測定。 (Hydrogenation rate of aromatic double bonds of vinyl aromatic monomer units in hydrogenated block copolymer (A)) Regarding the hydrogenation rate of aromatic double bonds of vinyl aromatic monomer units in the hydrogenated block copolymer (A) of the present embodiment, in the hydrogenated block copolymer composition of the present embodiment described below, from the viewpoint of obtaining good weather resistance, it is preferably 50 mol% or less, more preferably 30 mol% or less, and further preferably 10 mol% or less. The hydrogenation rate of aromatic double bonds of vinyl aromatic monomer units in the hydrogenated block copolymer (A) can be measured using a nuclear magnetic resonance device (NMR) or the like.

(氫化嵌段共聚物(甲)之結晶化波峰) 本實施方式之氫化嵌段共聚物(甲)較佳為於示差掃描熱量測定(DSC)圖中,於-25~80℃之範圍內,實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰之氫化物。 此處,「於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰」意指於該溫度範圍中,未出現由氫化共聚物嵌段(b)部分之結晶化引起之波峰,或者即便於確認到由結晶化引起之波峰之情形時,由該結晶化產生之結晶化波峰熱量亦未達3 J/g,較佳為未達2 J/g,更佳為未達1 J/g,進而較佳為無結晶化波峰熱量。 如上所述,若於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰,則於本實施方式之氫化嵌段共聚物(甲)中可獲得良好之柔軟性,從而可謀求下述氫化嵌段共聚物組合物之軟質化而較適宜。 為了獲得於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰氫化嵌段共聚物(甲),只要使共聚物進行氫化反應即可,該共聚物係藉由使用進行乙烯基鍵量之調整或乙烯基芳香族化合物與共軛二烯之共聚性之調整的規定之調整劑,於下述條件下進行聚合反應所獲得。 (Crystallization peak of hydrogenated block copolymer (A)) The hydrogenated block copolymer (A) of the present embodiment is preferably a hydrogenated product having a crystallization peak caused by the hydrogenated copolymer block (b) in the range of -25 to 80°C in the differential scanning calorimetry (DSC) diagram. Here, "there is substantially no crystallization peak caused by the hydrogenated copolymer block (b) in the range of -25 to 80°C" means that within the temperature range, there is no peak caused by the crystallization of the hydrogenated copolymer block (b), or even if a peak caused by crystallization is confirmed, the crystallization peak heat generated by the crystallization is less than 3 J/g, preferably less than 2 J/g, more preferably less than 1 J/g, and more preferably no crystallization peak heat. As described above, if there is substantially no crystallization peak caused by the hydrogenated copolymer block (b) in the range of -25 to 80°C, good flexibility can be obtained in the hydrogenated block copolymer (A) of the present embodiment, and it is more appropriate to seek softening of the hydrogenated block copolymer composition described below. In order to obtain a hydrogenated block copolymer (A) having substantially no crystallization peak caused by the hydrogenated copolymer block (b) in the range of -25 to 80°C, it is sufficient to subject the copolymer to a hydrogenation reaction. The copolymer is obtained by using a prescribed regulator for adjusting the vinyl bond weight or the copolymerizability of the vinyl aromatic compound and the co-polymerized diene, and conducting a polymerization reaction under the following conditions.

(氫化嵌段共聚物(甲)之黏彈性測定圖中之tanδ(損耗正切)波峰) 本實施方式之氫化嵌段共聚物(甲)較佳為於黏彈性測定圖中,tanδ(損耗正切)之波峰於-25℃以上且45℃以下存在至少1個。更佳為於-5℃以上且40℃以下,進而較佳為於10℃以上且35℃以下,進而更佳為於15℃以上且30℃以下存在至少1個。 該tanδ之波峰為由氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)引起之波峰。藉由在-25℃以上且60℃以下之範圍內存在至少1個該波峰,有於本實施方式之氫化嵌段共聚物(甲)中,表現出低反彈性,從而表現出良好之觸感之傾向。 再者,氫化嵌段共聚物(甲)之tanδ可使用黏彈性測定裝置(TA Instrument股份有限公司製造,ARES),於應變0.5%、頻率1 Hz、升溫速度3℃/min之條件下進行測定。具體而言,可藉由下述實施例中所記載之方法進行測定。 (Tanδ (loss tangent) peak in the viscoelasticity measurement graph of the hydrogenated block copolymer (A)) The hydrogenated block copolymer (A) of the present embodiment preferably has at least one tanδ (loss tangent) peak above -25°C and below 45°C in the viscoelasticity measurement graph. More preferably, it is above -5°C and below 40°C, further preferably, it is above 10°C and below 35°C, further preferably, it is above 15°C and below 30°C. The tanδ peak is a peak caused by the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A). By having at least one peak in the range of -25°C to 60°C, the hydrogenated block copolymer (A) of the present embodiment exhibits low resilience, thereby showing a tendency to have a good touch. Furthermore, the tanδ of the hydrogenated block copolymer (A) can be measured using a viscoelasticity measuring device (ARES, manufactured by TA Instrument Co., Ltd.) under the conditions of a strain of 0.5%, a frequency of 1 Hz, and a heating rate of 3°C/min. Specifically, the measurement can be performed by the method described in the following embodiment.

(氫化嵌段共聚物(甲)之隨機性參數g) <條件(3)> 本實施方式之氫化嵌段共聚物(甲)之利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據下述(式I)求出之P0之比率:g=P/P0為0.75以上。 P0=k×RS         (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之均相聚合之氫化嵌段共聚物(甲)進行分析時獲得) (Randomness parameter g of hydrogenated block copolymer (A)) <Condition (3)> The ratio of the peak intensity P detected by the thermal decomposition gas chromatography mass spectrometry analysis device of the hydrogenated block copolymer (A) of this embodiment to P0 obtained according to the following (Formula I): g = P/P0 is 0.75 or more. P0=k×RS         (Formula I) (In (Formula I), RS is the content (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole. k represents the proportional constant when the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole is first approximated with the peak intensity P, which is obtained when the homogeneously polymerized hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization method) is analyzed using a thermal decomposition gas chromatography mass spectrometer))

上述g=P/P0可根據藉由氫化嵌段共聚物(甲)之熱分解氣相層析質譜分析測定(以下,有時表述為py-GC/MS測定)所獲得之特定之波峰強度算出,為氫化嵌段共聚物(甲)之隨機性參數。 上述隨機性參數g(可評價隨機性之原因如下所述)表示氫化共聚物嵌段(b)中之乙烯基芳香族單體單元與共軛二烯單體單元多麼均勻地排列。上述g之值越大,則表示乙烯基芳香族單體單元與共軛二烯單體單元越均勻地排列。 可利用上述隨機性參數g評價隨機性之原因在於,如下所述,P表示被推測為氫化共聚物嵌段(b)中之(乙烯基芳香族單體)-(共軛二烯單體)-(乙烯基芳香族單體)之3連體結構之分解物之波峰的強度合計值。即,P表示乙烯基芳香族單體與共軛二烯單體多麼均勻地反應。 The above g=P/P0 can be calculated from the specific peak intensity obtained by thermal decomposition gas chromatography mass spectrometry analysis of the hydrogenated block copolymer (A) (hereinafter, sometimes referred to as py-GC/MS measurement), and is a random parameter of the hydrogenated block copolymer (A). The above random parameter g (the reason for evaluating randomness is described below) indicates how uniformly the vinyl aromatic monomer units and the covalent diene monomer units in the hydrogenated copolymer block (b) are arranged. The larger the value of the above g, the more uniformly the vinyl aromatic monomer units and the covalent diene monomer units are arranged. The reason why the randomness can be evaluated using the above randomness parameter g is that, as described below, P represents the total intensity of the peak of the decomposition product of the (vinyl aromatic monomer)-(covalent diene monomer)-(vinyl aromatic monomer) 3-linked structure in the hydrogenated copolymer block (b). That is, P represents how uniformly the vinyl aromatic monomer and the covalent diene monomer react.

於本實施方式之氫化嵌段共聚物(甲)中,上述隨機性參數g為0.75以上,較佳為0.8以上,更佳為0.85以上,進而較佳為0.9以上。 若隨機性參數g為0.75以上,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為0.9以上,則表現出更高之耐磨耗性,且可於如下情形時使用:於如耐磨耗性之要求更嚴格之用途,例如汽車內飾材料等中,於更薄壁之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,於假定乘車時需要由更高之荷重或眼較粗之布料,例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性之用途中,要求長時間維持外觀。 又,若隨機性參數g為0.75以上,則本實施方式之氫化嵌段共聚物(甲)之tanδ波峰之高度提高,低反彈性提高,表現出良好之觸感。進而,若為0.9以上,則有可獲得更高之tanδ波峰,可獲得更優異之低反彈性,而可獲得更良好之觸感之傾向。 In the hydrogenated block copolymer (A) of the present embodiment, the above-mentioned random parameter g is 0.75 or more, preferably 0.8 or more, more preferably 0.85 or more, and further preferably 0.9 or more. If the random parameter g is 0.75 or more, the hydrogenated block copolymer (A) of the present embodiment tends to show good wear resistance. Furthermore, if it is 0.9 or more, it shows higher wear resistance and can be used in the following situations: in applications where the wear resistance is more stringent, such as automotive interior materials, applications where excellent wear resistance is required in thinner-walled molded bodies, or automotive interior materials applications, applications where wear resistance is required by higher loads or coarser mesh fabrics, such as fabrics coarser than cotton fabrics such as fine white cloth No. 3, i.e., coarse twill cotton fabrics, etc., when riding in a car, and it is required to maintain the appearance for a long time. In addition, if the random parameter g is 0.75 or more, the height of the tanδ peak of the hydrogenated block copolymer (A) of the present embodiment is increased, the low resilience is improved, and a good touch is shown. Furthermore, if it is above 0.9, a higher tanδ peak can be obtained, which can lead to better low resilience and a tendency to obtain a better touch.

[隨機性參數g之算出方法] 隨機性參數g可根據藉由py-GC/MS測定所獲得之特定之波峰強度而算出。 g之算出中所使用之波峰強度P為被推測為氫化共聚物嵌段(b)中之(乙烯基芳香族單體)-(共軛二烯單體)-(乙烯基芳香族單體)結構之分解物之3個波峰強度的合計值,3個波峰設為由下述2個條件(i)、條件(ii)所定義者。 [Calculation method of random parameter g] The random parameter g can be calculated based on the specific peak intensity obtained by py-GC/MS measurement. The peak intensity P used in the calculation of g is the sum of the three peak intensities of the decomposition product of the (vinyl aromatic monomer)-(covalent diene monomer)-(vinyl aromatic monomer) structure in the hydrogenated copolymer block (b), and the three peaks are defined by the following two conditions (i) and (ii).

(條件(i)) 於將在下述表1所示之條件下測定試樣之情形時檢測之源自苯乙烯二聚物之波峰(藉由樣本測定來歸屬)的保持時間設為0 min之情形時,分別為以相對保持時間:1.83 min、2.15 min、2.45 min(容許誤差0.01 min左右)檢測到之波峰。 (條件(ii)) 分別具有質量值:252、264、276之碎片峰。 (Condition (i)) When the retention time of the peak derived from styrene dimer (attributed by sample measurement) detected when the sample was measured under the conditions shown in Table 1 below was set to 0 min, the peaks detected were at relative retention times of 1.83 min, 2.15 min, and 2.45 min (with an allowable error of about 0.01 min). (Condition (ii)) The fragment peaks had mass values of 252, 264, and 276, respectively.

將對以上述方法定義之3個波峰之絕對面積值的合計進行下述裝置感度修正所得之相對面積值設為波峰強度P。 隨機性參數g可藉由與利用下述(式I)求出之P0之比:g=P/P0而算出。 P0=k×RS    …  (式I) 上述(式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%),能夠利用核磁共振裝置(NMR)等進行測定。 上述(式I)中,k係使用相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P,利用一次近似式求出之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置(py-GC/MS)對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行測定時之波峰強度。 實驗上k之值成為0.0056左右。 例如,於某氫化嵌段共聚物之RS為40質量%時,P0根據上述(式I)而成為0.0056×40=0.224。 於利用py-GC/MS求出之波峰強度P=0.112之情形時, 可算出為g=0.112/0.224=0.5。 The relative area value obtained by performing the following device sensitivity correction on the sum of the absolute area values of the three peaks defined by the above method is set as the peak intensity P. The random parameter g can be calculated by the ratio with P0 obtained by the following (Formula I): g = P/P0. P0 = k × RS    …  (Formula I) In the above (Formula I), RS is the content (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (A), which can be measured by a nuclear magnetic resonance device (NMR) or the like. In the above (Formula I), k is a proportional constant obtained by using the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (A) and the peak intensity P, which is the peak intensity when the hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization method) is measured using a pyrolysis gas chromatography mass spectrometry analyzer (py-GC/MS). Experimentally, the value of k is about 0.0056. For example, when the RS of a certain hydrogenated block copolymer is 40 mass %, P0 becomes 0.0056×40=0.224 according to the above (Formula I). When the peak intensity P = 0.112 obtained by py-GC/MS, it can be calculated as g = 0.112/0.224 = 0.5.

P0為藉由下述特定之聚合方法(均相聚合法)使氫化嵌段共聚物(甲)聚合時之py-GC/MS測定之波峰強度P的推定值,藉由以隨機性參數g=P/P0之形式比較上述P0與實際上檢測到之P之值,可對氫化共聚物嵌段(b)中之乙烯基芳香族單體與共軛二烯單體多麼均勻地排列進行評價。P0 is an estimated value of the peak intensity P measured by py-GC/MS when the hydrogenated block copolymer (A) is polymerized by the specific polymerization method (homogeneous polymerization method) described below. By comparing the above P0 with the value of P actually detected in the form of a random parameter g = P/P0, it is possible to evaluate how uniformly the vinyl aromatic monomers and the covalent diene monomers in the hydrogenated copolymer block (b) are arranged.

py-GC/MS測定之MS檢測器之檢測感度由於每次進行調整均會產生變化,故使用外部標準物質進行感度修正。 於本說明書中,只要未特別說明,則波峰強度P之值設為將波峰絕對面積值除以由外部標準物質之測定獲得的基準值X所得之值。 作為外部標準物質,較佳為使用不易於熱或氧氣氣氛下分解,且容易操作之二丁基羥基甲苯(2,6-二第三丁基對甲酚,以下表述為BHT)。 基準值X設為於下述表1之條件下對0.010 mg之外部標準物質進行測定時所獲得之峰面積值。 再者,表1中,「樣品測定量」為製備溶液並滴加至樣品杯中後風乾所得之測定值,故測定樣品量設為成為固體0.10 mg者。 Since the detection sensitivity of the MS detector in py-GC/MS measurement changes every time it is adjusted, an external standard substance is used for sensitivity correction. In this manual, unless otherwise specified, the value of the peak intensity P is set to the value obtained by dividing the peak absolute area value by the reference value X obtained by the measurement of the external standard substance. As an external standard substance, it is preferred to use dibutylhydroxytoluene (2,6-di-tert-butyl-p-cresol, hereinafter referred to as BHT), which is not easily decomposed under heat or oxygen atmosphere and is easy to handle. The reference value X is set to the peak area value obtained when 0.010 mg of the external standard substance is measured under the conditions of the following Table 1. Furthermore, in Table 1, "sample measurement amount" is the measurement value obtained by preparing the solution and dropping it into the sample cup and then air-drying it, so the measured sample amount is set to 0.10 mg of solid.

[表1] py-GC/MS測定條件 熱解器裝置 Frontier Lab公司製造 Multishot Pyrolyzer EGA/PY-3030D 熱解器加熱條件 500℃ GC裝置 Agilent Technologies公司製造 7890A 使用管柱 DB-1(30 m×0.25 mmΦ,膜厚0.25 μm) 管柱溫度模式 於40℃下保持5 min後,以20℃/min升溫至320℃ 於320℃下保持11 min 氣體流速 1 ml/min 樣品注入口溫度 320℃ 分流比 1/50 樣品測定量 0.10 mg MS裝置 JEOL RESONANCE公司製造 JMS-Q1500GC 介面溫度 320℃ 離子化 EI 70 eV 掃描範圍 m/z 10~800 離子源溫度 240℃ [Table 1] py-GC/MS measurement conditions Pyrolyzer device Frontier Lab Multishot Pyrolyzer EGA/PY-3030D Pyrolyzer heating conditions 500℃ GC device Agilent Technologies manufactures the 7890A Use the column DB-1 (30 m×0.25 mmΦ, film thickness 0.25 μm) Column temperature mode After keeping at 40℃ for 5 min, increase the temperature to 320℃ at 20℃/min and keep at 320℃ for 11 min Gas flow rate 1 ml/min Sample injection port temperature 320℃ Split Ratio 1/50 Sample measurement 0.10 mg MS device JEOL RESONANCE Co., Ltd. manufactures JMS-Q1500GC Interface temperature 320℃ Ionization EI 70 eV Scanning range m/z 10~800 Ion source temperature 240℃

[均相聚合法] 本實施方式之氫化嵌段共聚物(甲)係於<條件(3)>之隨機性參數g之算出中,藉由均相聚合法製作者。 於利用均相聚合法之氫化嵌段共聚物(甲)之製造中,較佳為使用Mettler Toledo公司製造之in Situ FTIR分光光度計ReactIR 45P(以下,表述為ReactIR)。藉由使用上述ReactIR,可即時將聚合反應中之乙烯基芳香族化合物濃度與共軛二烯化合物濃度定量化,故可基於定量結果控制乙烯基芳香族化合物與共軛二烯化合物之進料速度,以較高之水準製造均勻之無規共聚物。 [Homogeneous Polymerization] The hydrogenated block copolymer (A) of this embodiment is prepared by homogeneous polymerization in the calculation of the random parameter g of <Condition (3)>. In the preparation of the hydrogenated block copolymer (A) by homogeneous polymerization, it is preferred to use an in situ FTIR spectrophotometer ReactIR 45P (hereinafter referred to as ReactIR) manufactured by Mettler Toledo. By using the above-mentioned ReactIR, the concentration of the vinyl aromatic compound and the concentration of the covalent diene compound in the polymerization reaction can be quantified in real time, so the feed rate of the vinyl aromatic compound and the covalent diene compound can be controlled based on the quantitative results, and a uniform random copolymer can be prepared at a higher level.

作為本實施方式之氫化嵌段共聚物(甲)之製造方法之一例,有如下方法:藉由ReactIR之測定立即求出某時間內之乙烯基芳香族化合物與共軛二烯化合物之反應性比,並以成為所需之反應性比之方式,立即控制作為聚合單體之乙烯基芳香族化合物與共軛二烯化合物之進料速度。 根據規定之時刻t0~t1之乙烯基芳香族化合物之進料量S0、共軛二烯化合物之進料量B0、規定之時刻t0~t1之反應系統中之乙烯基芳香族化合物之變化量ΔS、及共軛二烯化合物之變化量ΔB,即時求出乙烯基芳香族化合物與共軛二烯化合物之反應性比(S0+ΔS)/(B0+ΔB),以成為所需之反應性比之方式立即控制乙烯基芳香族化合物與共軛二烯化合物之進料速度。 例如,於上述反應性比:(S0+ΔS)/(B0+ΔB)高於所需之反應性比之情形時,只要加快共軛二烯化合物之進料速度,或者延遲乙烯基芳香族化合物之進料速度即可。 As an example of a method for producing the hydrogenated block copolymer (A) of the present embodiment, there is the following method: the reactivity ratio of the vinyl aromatic compound and the covalent diene compound within a certain time is immediately determined by the measurement of ReactIR, and the feed rate of the vinyl aromatic compound and the covalent diene compound as polymerization monomers is immediately controlled in such a way as to obtain the desired reactivity ratio. According to the feed amount S0 of the vinyl aromatic compound at the specified time t0-t1, the feed amount B0 of the co-diene compound, the change ΔS of the vinyl aromatic compound in the reaction system at the specified time t0-t1, and the change ΔB of the co-diene compound, the reactivity ratio (S0+ΔS)/(B0+ΔB) of the vinyl aromatic compound and the co-diene compound is immediately obtained, and the feed rate of the vinyl aromatic compound and the co-diene compound is immediately controlled in such a way that the desired reactivity ratio is obtained. For example, when the above reactivity ratio: (S0+ΔS)/(B0+ΔB) is higher than the desired reactivity ratio, the feed rate of the co-diene compound can be increased or the feed rate of the vinyl aromatic compound can be delayed.

通常,於乙烯基芳香族化合物與共軛二烯化合物之共聚中,於以所需之反應性比均勻地進行聚合之情形時,需要使乙烯基芳香族化合物與共軛二烯化合物之進料速度比與所需之反應性比相同而開始進料,且於共聚結束時,同時結束乙烯基芳香族化合物與共軛二烯化合物之進料。 例如,於進行苯乙烯與丁二烯之共聚之情形時,通常,丁二烯之反應速度快於苯乙烯之反應速度,故於進料剛開始後,有反應性比:(S0+ΔS)/(B0+ΔB)變得小於目標值之傾向,且有逐漸接近目標之反應性比之傾向。又,於進料剛結束後,有反應性比:(S0+ΔS)/(B0+ΔB)大於目標值之傾向。藉由使用上述ReactIR,即時測定反應性比:(S0+ΔS)/(B0+ΔB),以成為目標之反應性比之方式控制苯乙烯與丁二烯之進料速度比,藉此可將進料剛開始後與進料結束時之反應性比:(S0+ΔS)/(B0+ΔB)控制為目標之反應性比。 Generally, in the copolymerization of a vinyl aromatic compound and a covalent diene compound, when the polymerization is carried out uniformly at a desired reactivity ratio, it is necessary to start feeding with the feed rate ratio of the vinyl aromatic compound and the covalent diene compound being the same as the desired reactivity ratio, and to terminate the feeding of the vinyl aromatic compound and the covalent diene compound at the end of the copolymerization. For example, in the case of copolymerization of styrene and butadiene, generally, the reaction rate of butadiene is faster than the reaction rate of styrene, so immediately after the start of feeding, the reactivity ratio: (S0+ΔS)/(B0+ΔB) tends to become less than the target value, and gradually approaches the target reactivity ratio. Also, immediately after the end of feeding, the reactivity ratio: (S0+ΔS)/(B0+ΔB) tends to be greater than the target value. By using the above-mentioned ReactIR, the reactivity ratio: (S0+ΔS)/(B0+ΔB) is measured in real time, and the feed rate ratio of styrene and butadiene is controlled in such a way as to achieve the target reactivity ratio. Thus, the reactivity ratio: (S0+ΔS)/(B0+ΔB) immediately after the feed starts and at the end of the feed can be controlled to the target reactivity ratio.

以下,獲得具體之3種氫化嵌段共聚物(甲)-I~(甲)-III,並分別利用熱分解氣相層析質譜分析裝置(py-GC/MS)進行測定,求出波峰強度P。 又,根據上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元相對於上述氫化嵌段共聚物((甲)-I~(甲)-III)整體之含量RS(質量%)、與上述波峰強度P之一次近似式,將上述(式I)之係數k算出為k=005563。 將用於k之確定之值示於下述表2。 Below, three specific hydrogenated block copolymers (A)-I to (A)-III were obtained and measured by thermal decomposition gas chromatography mass spectrometry (py-GC/MS) to obtain peak intensity P. In addition, based on the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the total hydrogenated block copolymer ((A)-I to (A)-III) and the first-order approximation formula of the peak intensity P, the coefficient k of the above (Formula I) was calculated as k=005563. The determined values for k are shown in the following Table 2.

<氫化嵌段共聚物(甲)-I> 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯20質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.053質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯50質量份與苯乙烯30質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 其後,添加甲醇,停止聚合反應。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為50質量%,且相對於氫化嵌段共聚物(甲)整體之(b)氫化共聚物嵌段中之乙烯基芳香族單體單元之含量RS為30質量%。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-I。 所獲得之氫化嵌段共聚物(甲)-I之氫化率為98莫耳%。 <Hydrogenated block copolymer (A)-I> Batch polymerization was performed using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20 mass%) containing 20 parts by mass of styrene was added. Second, 0.053 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was performed at 65°C for 1 hour. Second, a cyclohexane solution (concentration 20 mass%) containing 50 parts by mass of butadiene and 30 parts by mass of styrene was added, and polymerization was performed at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (converted by mass). Thereafter, methanol was added to stop the polymerization reaction. The block copolymer obtained by the above method had a styrene content of 50 mass%, and the content RS of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) was 30 mass%. Furthermore, in the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared in the above manner was added based on Ti per 100 mass parts of the block copolymer, and the hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by mass of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by mass of the block copolymer to obtain a hydrogenated block copolymer (A)-I. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-I was 98 mol %.

<氫化嵌段共聚物(甲)-II> 將上述氫化嵌段共聚物(甲)-I之丁二烯50質量份與苯乙烯30質量份變更為丁二烯40質量份與苯乙烯40質量份,並進行聚合反應、及氫化反應,獲得氫化嵌段共聚物(甲)-II。 氫化反應前之嵌段共聚物中,苯乙烯含量為60質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為40質量%,且氫化嵌段共聚物(甲)-II之氫化率為98莫耳%。 <Hydrogenated block copolymer (A)-II> The 50 mass parts of butadiene and 30 mass parts of styrene in the above hydrogenated block copolymer (A)-I were changed to 40 mass parts of butadiene and 40 mass parts of styrene, and polymerization and hydrogenation were carried out to obtain hydrogenated block copolymer (A)-II. The styrene content in the block copolymer before the hydrogenation reaction was 60 mass%, and the content RS of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) as a whole was 40 mass%, and the hydrogenation rate of the hydrogenated block copolymer (A)-II was 98 mol%.

<氫化嵌段共聚物(甲)-III> 將上述氫化嵌段共聚物(甲)-I之丁二烯50質量份與苯乙烯30質量份變更為丁二烯30質量份與苯乙烯50質量份,並進行聚合反應、氫化反應,獲得氫化嵌段共聚物(甲)-III。 氫化反應前之嵌段共聚物中,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,且氫化嵌段共聚物(甲)-III之氫化率為98莫耳%。 <Hydrogenated block copolymer (A)-III> The 50 mass parts of butadiene and 30 mass parts of styrene in the above hydrogenated block copolymer (A)-I were changed to 30 mass parts of butadiene and 50 mass parts of styrene, and polymerization reaction and hydrogenation reaction were carried out to obtain hydrogenated block copolymer (A)-III. In the block copolymer before the hydrogenation reaction, the styrene content was 70 mass%, and the content RS of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) as a whole was 50 mass%, and the hydrogenation rate of the hydrogenated block copolymer (A)-III was 98 mol%.

[表2] (甲)-I (甲)-II (甲)-III 相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%) 30 40 50 波峰強度P 0.167 0.223 0.278 [Table 2] (A)-I (A)-II (A)-III The content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (a) as a whole RS (mass %) 30 40 50 Peak intensity P 0.167 0.223 0.278

(氫化嵌段共聚物(甲)之結構) 本實施方式之氫化嵌段共聚物(甲)之結構例如可例舉具有下述通式所表示之結構者。 c-(b-a) n、c-(a-b) n、c-(a-b-a) n、c-(b-a-b) n、c-(b-c-a) n、a-(c-b-c-a) n、a-c-(b-a) n、a-c-(a-b) n、a-c-(b-a) n-b、c-a-(b-a) n-c、a-c-(b-a) n-c、a-b-(c-a) n-b、a-c-(b-c) n-a-c、c-(a-b-c) n-a-c、a-(c-b) n-c-a、c-(a-c) n-b-c-a-c、[(a-b-c) n] m-X、[a-(b-c) n] m-X、[(a-b) n-c] m-X、[(a-b-a) n-c] m-X、[(b-a-b) n-c] m-X、[(c-b-a) n] m-X、[c-(b-a) n] m-X、[c-(a-b-a) n] m-X、[c-(b-a-b) n] m-X 再者,於上述各通式中,a表示將乙烯基芳香族單體單元作為主體之聚合物嵌段(a),b表示包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),c表示將共軛二烯單體單元作為主體之氫化聚合物嵌段(c)。 n為1以上之整數,較佳為1~5之整數。 m為2以上之整數,較佳為2~11之整數。 X表示偶合劑之殘基或多官能起始劑之殘基。 (Structure of Hydrogenated Block Copolymer (A)) The structure of the hydrogenated block copolymer (A) according to the present embodiment may be, for example, a structure represented by the following general formula. c-(ba) n , c-(ab) n , c-(aba) n , c-(bab) n , c-(bca) n , a-(cbca) n , ac-(ba) n , ac-(ab) n , ac-(ba) n -b, ca-(ba) n -c, ac-(ba) n -c, ab-(ca) n -b, ac-(bc) n -ac, c-(abc) n -ac , a-(cb) n -ca, c-(ac) n -bcac, [(abc) n ] m -X, [a-(bc) n ] m -X, [(ab) n -c] m -X, [(aba) n -c] m -X, [(bab) n -c] m -X, [(cba) n ] m -X, [c-(ba) n ] m -X, [c-(aba) n ] m -X, [c-(bab) n ] m -X Furthermore, in the above general formulas, a represents a polymer block (a) mainly composed of a vinyl aromatic monomer unit, b represents a hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a covalent diene monomer unit, and c represents a hydrogenated polymer block (c) mainly composed of a covalent diene monomer unit. n is an integer greater than 1, preferably an integer from 1 to 5. m is an integer greater than 2, preferably an integer from 2 to 11. X represents a residual group of a coupling agent or a residual group of a multifunctional initiator.

(氫化嵌段共聚物(甲)之結構之其他例) 本實施方式之氫化嵌段共聚物(甲)亦可為鍵結有具有規定之官能基的原子團之改性嵌段共聚物。只要根據於製作使用本實施方式之氫化嵌段共聚物(甲)之組合物時混練之樹脂之結構等,適當設定有無改性、官能基之種類等即可。 又,於將氫化嵌段共聚物(甲)設為改性嵌段共聚物之情形時,亦可為二次改性嵌段共聚物。於本說明書中,「二次改性」係以藉由製造方法賦予特徵之命名,將使官能基鍵結於聚合物之最初之步驟稱為一次改性,將使其他化合物與其官能基反應之步驟稱為二次改性。例如,典型之製造方法為於溶液中進行聚合後,於擠出機中使其他化合物(例如順丁烯二酸)、與使改性劑(例如胺)和聚合結束末端反應而成之一次改性品反應,製造二次改性品。 (Other examples of the structure of the hydrogenated block copolymer (A)) The hydrogenated block copolymer (A) of the present embodiment may also be a modified block copolymer to which an atomic group having a prescribed functional group is bonded. It is sufficient to appropriately set the presence or absence of modification, the type of functional group, etc. according to the structure of the resin to be kneaded when preparing a composition using the hydrogenated block copolymer (A) of the present embodiment. In addition, when the hydrogenated block copolymer (A) is set as a modified block copolymer, it may also be a secondary modified block copolymer. In this specification, "secondary modification" is a name given by a manufacturing method, and the initial step of bonding the functional group to the polymer is called the primary modification, and the step of reacting other compounds with its functional group is called the secondary modification. For example, a typical manufacturing method is to carry out polymerization in a solution, and then react other compounds (such as maleic acid) with a primary modified product formed by a reaction between a modifier (such as an amine) and the polymerization termination terminal in an extruder to produce a secondary modified product.

[氫化嵌段共聚物(甲)之製造方法] 作為本實施方式之氫化嵌段共聚物(甲)之氫化前的狀態之嵌段共聚物例如可藉由如下方法所獲得:於烴溶劑中使用有機鹼金屬化合物等聚合起始劑,使乙烯基芳香族化合物與共軛二烯化合物活性進行陰離子聚合。 [Method for producing hydrogenated block copolymer (A)] The block copolymer in the state before hydrogenation of the hydrogenated block copolymer (A) of the present embodiment can be obtained, for example, by the following method: using a polymerization initiator such as an organic alkali metal compound in a hydrocarbon solvent to allow a vinyl aromatic compound and a conjugated diene compound to undergo active anionic polymerization.

(烴溶劑) 作為烴溶劑,例如可例舉:正丁烷、異丁烷、正戊烷、正己烷、正庚烷、正辛烷等脂肪族烴類;環己烷、環庚烷、甲基環庚烷等脂環式烴類;苯、甲苯、二甲苯、乙基苯等芳香族烴,但並不限定於以上。 (Hydrocarbon solvent) Examples of hydrocarbon solvents include: aliphatic hydrocarbons such as n-butane, isobutane, n-pentane, n-hexane, n-heptane, and n-octane; alicyclic hydrocarbons such as cyclohexane, cycloheptane, and methylcycloheptane; and aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene, but are not limited to the above.

(聚合起始劑) 作為聚合起始劑,並無特別限定,例如可例舉:已知對乙烯基芳香族化合物及共軛二烯具有陰離子聚合活性之脂肪族烴鹼金屬化合物、芳香族烴鹼金屬化合物、有機胺基鹼金屬化合物等有機鹼金屬化合物。 作為有機鹼金屬化合物,例如較佳為碳數1~20之脂肪族及芳香族烴鋰化合物,但並不限定於以上,可應用1分子中包含1個鋰之化合物、1分子中包含複數個之鋰之二鋰化合物、三鋰化合物、四鋰化合物。 具體而言,可例舉:正丙基鋰、正丁基鋰、第二丁基鋰、第三丁基鋰、正戊基鋰、正己基鋰、苄基鋰、苯基鋰、甲苯基鋰、二異丙烯基苯與第二丁基鋰之反應產物、二乙烯苯與第二丁基鋰及少量1,3-丁二烯之反應產物等。 進而,例如亦可應用美國專利第5,708,092號說明書、英國專利第2,241,239號說明書、美國專利第5,527,753號說明書中所揭示之有機鹼金屬化合物。 (Polymerization initiator) The polymerization initiator is not particularly limited, and examples thereof include: organic alkali metal compounds such as aliphatic alkali metal compounds, aromatic alkali metal compounds, and organic amine alkali metal compounds that are known to have anionic polymerization activity for vinyl aromatic compounds and conjugated dienes. As the organic alkali metal compound, for example, aliphatic and aromatic alkali lithium compounds having 1 to 20 carbon atoms are preferred, but are not limited to the above, and compounds containing one lithium in one molecule, dilithium compounds containing multiple lithium in one molecule, trilithium compounds, and tetralithium compounds can be used. Specifically, examples include: n-propyl lithium, n-butyl lithium, sec-butyl lithium, tert-butyl lithium, n-pentyl lithium, n-hexyl lithium, benzyl lithium, phenyl lithium, tolyl lithium, the reaction product of diisopropenylbenzene and sec-butyl lithium, the reaction product of divinylbenzene and sec-butyl lithium and a small amount of 1,3-butadiene, etc. Furthermore, for example, the organoalkali metal compounds disclosed in the specification of U.S. Patent No. 5,708,092, the specification of British Patent No. 2,241,239, and the specification of U.S. Patent No. 5,527,753 can also be applied.

(調整劑) 於使用有機鹼金屬化合物作為聚合起始劑,使乙烯基芳香族化合物與共軛二烯化合物共聚時,使用規定之調整劑,藉此可調整組入至聚合物中之由共軛二烯化合物產生之乙烯基鍵(1,2-鍵或3,4-鍵)之含量、或乙烯基芳香族單體單元與共軛二烯單體單元之無規共聚性。 作為此種調整劑,例如可例舉:三級胺化合物、醚化合物、金屬醇化物化合物等,但並不限定於以上。 調整劑可僅單獨使用一種,亦可組合使用兩種以上。 (Adjuster) When an organic alkali metal compound is used as a polymerization initiator to copolymerize a vinyl aromatic compound and a covalent diene compound, a prescribed adjuster is used to adjust the content of the vinyl bond (1,2-bond or 3,4-bond) generated by the covalent diene compound incorporated into the polymer, or the random copolymerization of the vinyl aromatic monomer unit and the covalent diene monomer unit. Such adjusters include, for example, tertiary amine compounds, ether compounds, metal alcoholate compounds, etc., but are not limited to the above. The adjuster may be used alone or in combination of two or more.

作為三級胺化合物,例如可例舉通式R1R2R3N(此處,R1、R2、R3表示碳數1~20之烴基或具有三級胺基之烴基)所表示之化合物,但並不限定於以上。 具體而言,可例舉:三甲基胺、三乙基胺、三丁基胺、N,N-二甲基苯胺、N-乙基哌啶、N-甲基吡咯啶、N,N,N',N'-四甲基乙二胺、N,N,N',N'-四乙基乙二胺、1,2-二哌啶基乙烷、三甲基胺基乙基哌𠯤、N,N,N',N'',N''-五甲基伸乙基三胺、N,N'-二辛基對苯二胺等。 As tertiary amine compounds, for example, compounds represented by the general formula R1R2R3N (here, R1, R2, and R3 represent a alkyl group having 1 to 20 carbon atoms or a alkyl group having a tertiary amine group) can be cited, but are not limited to the above. Specifically, examples include: trimethylamine, triethylamine, tributylamine, N,N-dimethylaniline, N-ethylpiperidine, N-methylpyrrolidine, N,N,N',N'-tetramethylethylenediamine, N,N,N',N'-tetraethylethylenediamine, 1,2-dipiperidinylethane, trimethylaminoethylpiperidinium, N,N,N',N'',N''-pentamethylethylenetriamine, N,N'-dioctyl-p-phenylenediamine, etc.

作為醚化合物,例如可應用等直鏈狀醚化合物及環狀醚化合物,但並不限定於以上。 作為直鏈狀醚化合物,例如可例舉:二甲醚、二乙醚、二苯醚、乙二醇二甲醚、乙二醇二乙醚、乙二醇二丁醚等乙二醇之二烷基醚化合物類;二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇二丁醚等二乙二醇之二烷基醚化合物類,但並不限定於以上。 作為環狀醚化合物,例如可例舉:四氫呋喃、二㗁烷、2,5-二甲基氧雜環戊烷、2,2,5,5-四甲基氧雜環戊烷、2,2-雙(2-四氫呋喃基)丙烷、呋喃甲醇之烷基醚等,但並不限定於以上。 As ether compounds, for example, linear ether compounds and cyclic ether compounds can be applied, but are not limited to the above. As linear ether compounds, for example, dimethyl ether, diethyl ether, diphenyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether and other ethylene glycol dialkyl ether compounds; diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and other diethylene glycol dialkyl ether compounds, but are not limited to the above. As cyclic ether compounds, for example, tetrahydrofuran, dioxane, 2,5-dimethyloxycyclopentane, 2,2,5,5-tetramethyloxycyclopentane, 2,2-bis(2-tetrahydrofuranyl)propane, alkyl ethers of furan methanol, etc. can be cited, but are not limited to the above.

作為金屬醇化物化合物,例如可例舉:第三戊醇鈉、第三丁醇鈉、第三戊醇鉀、第三丁醇鉀等,但並不限定於以上。Examples of the metal alkoxide compound include sodium tert-pentoxide, sodium tert-butoxide, potassium tert-pentoxide, potassium tert-butoxide, and the like, but the compound is not limited thereto.

(聚合方法) 作為使用有機鹼金屬化合物作為聚合起始劑,使乙烯基芳香族化合物及共軛二烯化合物聚合之方法,可應用先前公知之方法。 例如可為分批聚合、連續聚合、或該等之組合中之任一種,但並不限定於以上。尤其是為了獲得耐熱性優異之共聚物,適宜為分批聚合。 聚合溫度較佳為0℃~180℃,更佳為30℃~150℃。聚合時間根據條件而有所不同,通常為48小時以內,較佳為0.1~10小時。 又,作為聚合系統之氣氛,較佳為氮氣等惰性氣體氣氛。 聚合壓力只要設定為於上述溫度範圍內可將單體及溶劑維持為液相之壓力範圍即可,並無特別限定。 進而,較佳為多加注意以避免聚合系統內混入如造成觸媒及活性聚合物惰性化之雜質,例如水、氧、二氧化碳等。 (Polymerization method) As a method for polymerizing a vinyl aromatic compound and a copolyene compound using an organic alkali metal compound as a polymerization initiator, a previously known method can be applied. For example, it can be any of batch polymerization, continuous polymerization, or a combination thereof, but it is not limited to the above. In particular, in order to obtain a copolymer with excellent heat resistance, batch polymerization is suitable. The polymerization temperature is preferably 0°C to 180°C, and more preferably 30°C to 150°C. The polymerization time varies depending on the conditions, but is usually within 48 hours, and preferably 0.1 to 10 hours. In addition, as the atmosphere of the polymerization system, an inert gas atmosphere such as nitrogen is preferred. The polymerization pressure is not particularly limited as long as it is set to a pressure range that can maintain the monomer and solvent in the liquid phase within the above temperature range. Furthermore, it is better to pay more attention to avoid the mixing of impurities such as water, oxygen, carbon dioxide, etc. into the polymerization system that may cause the catalyst and active polymer to become inert.

又,亦可於上述聚合步驟結束時,添加必需量之2官能以上之偶合劑而進行偶合反應。 作為2官能偶合劑,可應用公知者,並無特別限定。例如可例舉:三甲氧基矽烷、三乙氧基矽烷、四甲氧基矽烷、四乙氧基矽烷、二甲基二甲氧基矽烷、二乙基二甲氧基矽烷、二氯二甲氧基矽烷、二氯二乙氧基矽烷、三氯甲氧基矽烷、三氯乙氧基矽烷等烷氧基矽烷化合物;二氯乙烷、二溴乙烷、二甲基二氯矽烷、二甲基二溴矽烷等二鹵素化合物;苯甲酸甲酯、苯甲酸乙酯、苯甲酸苯酯、鄰苯二甲酸酯類等酸酯類等。 又,作為3官能以上之多官能偶合劑,可應用先前公知者,並無特別限定。例如可例舉:三元以上之多元醇類、環氧化大豆油、二縮水甘油基雙酚A、1,3-雙(N-N'-二縮水甘油基胺基甲基)環己烷等多元環氧化合物;通式R 4 nSiX n(此處,R表示碳數1~20之烴基,X表示鹵素,n表示3~4之整數)所表示之鹵化矽化合物,例如甲基三氯化矽、第三丁基三氯化矽、四氯化矽及該等之溴化物等;通式R 4 nSnX n(此處,R表示碳數1~20之烴基,X表示鹵素,n表示3~4之整數)所表示之鹵化錫化合物,例如甲基三氯化錫、第三丁基三氯化錫、四氯化錫等多價鹵素化合物等。又,亦可使用碳酸二甲酯或碳酸二乙酯等。 Furthermore, at the end of the above-mentioned polymerization step, a coupling reaction can be carried out by adding a necessary amount of a coupling agent having two or more functions. As the bifunctional coupling agent, known ones can be used without particular limitation. For example, alkoxysilane compounds such as trimethoxysilane, triethoxysilane, tetramethoxysilane, tetraethoxysilane, dimethyldimethoxysilane, diethyldimethoxysilane, dichlorodimethoxysilane, dichlorodiethoxysilane, trichloromethoxysilane, trichloroethoxysilane, etc.; dihalogen compounds such as dichloroethane, dibromoethane, dimethyldichlorosilane, dimethyldibromosilane, etc.; acid esters such as methyl benzoate, ethyl benzoate, phenyl benzoate, phthalic acid esters, etc. can be cited. As a polyfunctional coupling agent having three or more functions, any known coupling agent can be used without any particular limitation. Examples include: polyhydric alcohols having three or more functions, epoxidized soybean oil, diglycidyl bisphenol A, polyhydric epoxy compounds such as 1,3-bis(N-N'-diglycidylaminomethyl)cyclohexane; silicon halides represented by the general formula R 4 - nSiX n (where R represents a alkyl group having 1 to 20 carbon atoms, X represents a halogen, and n represents an integer of 3 to 4), such as methylsilicon trichloride, tert-butylsilicon trichloride, silicon tetrachloride, and bromides thereof; and polyhydric epoxy compounds represented by the general formula R 4 - nSnX n (Here, R represents a carbon number of 1 to 20 alkyl groups, X represents a halogen, and n represents an integer of 3 to 4) a tin halide compound represented by, for example, methyltin trichloride, tert-butyltin trichloride, tin tetrachloride and other polyvalent halogen compounds. In addition, dimethyl carbonate or diethyl carbonate may also be used.

(改性步驟) 如上所述,本實施方式之氫化嵌段共聚物(甲)可為鍵結有具有官能基之原子團之改性嵌段共聚物。具有官能基之原子團之鍵結較佳為作為下述氫化步驟之前步驟。 作為上述「具有官能基之原子團」,例如可例舉含有至少一種選自羥基、羧基、羰基、硫代羰基、醯鹵化物基、酸酐基、羧酸基、硫代羧酸基、醛基、硫代醛基、羧酸酯基、醯胺基、磺酸基、磺酸酯基、磷酸基、磷酸酯基、胺基、亞胺基、腈基、吡啶基、喹啉基、環氧基、硫代環氧基、硫基、異氰酸基、異硫氰酸基、鹵化矽基、矽烷醇基、烷氧基矽基、鹵化錫基、硼酸基、含硼之基、硼酸鹽基、烷氧基錫基、苯基錫基等中之官能基之原子團,但並不限定於以上。尤佳為具有至少1個選自羥基、環氧基、胺基、矽烷醇基、烷氧基矽烷基中之官能基之原子團。 上述「具有官能基之原子團」可利用改性劑進行鍵結。 作為改性劑,例如可例舉:四縮水甘油基間苯二甲胺、四縮水甘油基-1,3-二胺基甲基環己烷、ε-己內酯、δ-戊內酯、4-甲氧基二苯甲酮、γ-縮水甘油氧基乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基二甲基苯氧基矽烷、雙(γ-縮水甘油氧基丙基)甲基丙氧基矽烷、1,3-二甲基-2-咪唑啶酮、1,3-二乙基-2-咪唑啶酮、N,N'-二甲基伸丙基脲、N-甲基吡咯啶酮等,但並不限定於以上。 (Modification step) As described above, the hydrogenated block copolymer (A) of the present embodiment may be a modified block copolymer to which an atomic group having a functional group is bonded. The bonding of the atomic group having a functional group is preferably performed as a step before the hydrogenation step described below. Examples of the “atomic group having a functional group” include, but are not limited to, an atomic group containing at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, a carbonyl group, a thiocarbonyl group, an acyl halide group, an acid anhydride group, a carboxylic acid group, a thiocarboxylic acid group, an aldehyde group, a thioaldehyde group, a carboxylate group, an amide group, a sulfonic acid group, a sulfonate group, a phosphoric acid group, a phosphoric acid ester group, an amino group, an imino group, a nitrile group, a pyridine group, a quinoline group, an epoxy group, a thioepoxy group, a sulfide group, an isocyanate group, an isothiocyanate group, a silyl halide group, a silanol group, an alkoxysilyl group, a tin halide group, a boric acid group, a boron-containing group, a borate group, an alkoxytin group, a phenyltin group, and the like. It is particularly preferred to be an atomic group having at least one functional group selected from a hydroxyl group, an epoxy group, an amine group, a silanol group, and an alkoxysilyl group. The above-mentioned "atomic group having a functional group" can be bonded using a modifier. Examples of the modifier include tetraglycidyl-m-xylylenediamine, tetraglycidyl-1,3-diaminomethylcyclohexane, ε-caprolactone, δ-valerolactone, 4-methoxybenzophenone, γ-glycidyloxyethyltrimethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-glycidyloxypropyldimethylphenoxysilane, bis(γ-glycidyloxypropyl)methylpropoxysilane, 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, N,N'-dimethylpropylurea, N-methylpyrrolidone, etc., but are not limited to the above.

改性嵌段共聚物並無特別限定,例如可藉由如下方法獲得:藉由陰離子活性聚合,使用具有官能基之聚合起始劑或具有官能基之不飽和單體進行聚合,或者於活性末端形成官能基,或者使含有官能基之改性劑進行加成反應。 作為其他方法,可藉由如下方法獲得:使有機鋰化合物等有機鹼金屬化合物與嵌段共聚物反應(金屬化反應),使具有官能基之改性劑與加成了有機鹼金屬之嵌段聚合物進行加成反應。 其中,於後者之方法之情形時,亦可藉由在獲得氫化嵌段共聚物後進行金屬化反應,其後使改性劑反應,而製作改性氫化嵌段共聚物。 進行改性反應之溫度較佳為0~150℃,更佳為20~120℃。改性反應所需之時間根據其他條件而有所不同,較佳為24小時以內,更佳為0.1~10小時。 根據所使用之改性劑之種類,有時於使改性劑反應之階段,通常胺基等亦會變為有機金屬鹽,但於該情形時,可藉由利用水或醇等具有活性氫之化合物進行處理而轉換為胺基等。再者,於此種改性嵌段共聚物中,於改性嵌段共聚物中,亦可混合存在一部分未經改性之嵌段共聚物。 The modified block copolymer is not particularly limited, and can be obtained, for example, by the following method: by anionic living polymerization, using a polymerization initiator having a functional group or an unsaturated monomer having a functional group for polymerization, or forming a functional group at the active end, or allowing a modifier containing a functional group to undergo an addition reaction. As another method, it can be obtained by the following method: reacting an organic alkali metal compound such as an organic lithium compound with a block copolymer (metallization reaction), and allowing a modifier having a functional group to undergo an addition reaction with a block polymer to which an organic alkali metal is added. Among them, in the case of the latter method, the modified hydrogenated block copolymer can also be prepared by performing a metallization reaction after obtaining a hydrogenated block copolymer, and then reacting the modifier. The temperature for the modification reaction is preferably 0 to 150°C, more preferably 20 to 120°C. The time required for the modification reaction varies depending on other conditions, preferably within 24 hours, more preferably 0.1 to 10 hours. Depending on the type of modifier used, sometimes during the stage of reacting the modifier, amine groups and the like are usually converted into organic metal salts, but in this case, they can be converted into amine groups and the like by treating with compounds having active hydrogen such as water or alcohol. Furthermore, in such a modified block copolymer, a portion of unmodified block copolymers may also be mixed in the modified block copolymer.

又,上述改性嵌段共聚物亦可為二次改性嵌段共聚物。二次改性嵌段共聚物可藉由使與該改性嵌段共聚物之官能基具有反應性之二次改性劑和改性嵌段共聚物反應所獲得。 作為二次改性劑,例如可例舉具有選自羧基、酸酐基、異氰酸基、環氧基、矽烷醇基、烷氧基矽烷基中之官能基之改性劑,但並不限定於以上,較佳為具有至少2個選自該等官能基中之官能基者。 其中,於官能基為酸酐基之情形時,亦可為具備1個酸酐基者。 Furthermore, the modified block copolymer may also be a secondary modified block copolymer. The secondary modified block copolymer may be obtained by reacting a secondary modifier reactive with the functional group of the modified block copolymer with the modified block copolymer. As the secondary modifier, for example, a modifier having a functional group selected from a carboxyl group, an anhydride group, an isocyanate group, an epoxy group, a silanol group, and an alkoxysilane group may be cited, but it is not limited to the above, and preferably has at least 2 functional groups selected from these functional groups. Among them, when the functional group is an anhydride group, it may also have one anhydride group.

如上所述,於使二次改性劑與改性嵌段共聚物反應之情形時,相對於鍵結於改性嵌段共聚物之官能基每1當量,二次改性劑之使用量較佳為0.3~10莫耳,更佳為0.4~5莫耳,進而較佳為0.5~4莫耳。 關於使改性嵌段共聚物與二次改性劑反應之方法,可應用公知之方法,並無特別限定。例如可例舉下述熔融混練方法、或者使各成分溶解或分散混合於溶劑等中並使其反應之方法等。再者,該等二次改性較佳為於氫化步驟後進行。 As described above, when the secondary modifier is reacted with the modified block copolymer, the amount of the secondary modifier used is preferably 0.3 to 10 mol, more preferably 0.4 to 5 mol, and further preferably 0.5 to 4 mol per 1 equivalent of the functional group bonded to the modified block copolymer. Regarding the method of reacting the modified block copolymer with the secondary modifier, a known method can be applied without particular limitation. For example, the following melt kneading method or a method of dissolving or dispersing and mixing each component in a solvent and reacting them can be cited. Furthermore, the secondary modification is preferably performed after the hydrogenation step.

作為二次改性劑,例如可例舉:順丁烯二酸酐、均苯四甲酸二酐、1,2,4,5-苯四羧酸二酐、甲苯基二異氰酸酯、四縮水甘油基-1,3-二胺基甲基環己烷、雙-(3-三乙氧基矽烷基丙基)-四硫化物等作為適宜者,但並不限定於以上。Examples of the secondary modifier include maleic anhydride, pyromellitic dianhydride, 1,2,4,5-benzenetetracarboxylic dianhydride, tolyl diisocyanate, tetraglycidyl-1,3-diaminomethylcyclohexane, bis-(3-triethoxysilylpropyl)-tetrasulfide, but the present invention is not limited thereto.

又,本實施方式之氫化嵌段共聚物(甲)可設為利用α,β-不飽和羧酸或其衍生物,例如其酸酐、酯化物、醯胺化物、醯亞胺化物進行接枝改性而成之改性嵌段共聚物。 作為α,β-不飽和羧酸或其衍生物,例如可例舉:順丁烯二酸酐、順丁烯二酸酐醯亞胺、丙烯酸或其酯、甲基丙烯酸或其酯、內-順-雙環[2,2,1]-5-庚烯-2,3-二羧酸或其酸酐等,但並不限定於以上。 α,β-不飽和羧酸或其衍生物之加成量相對於氫化嵌段共聚物(甲)每100質量份,較佳為0.01~20質量份,更佳為0.1~10質量份。 進行接枝改性之情形時之反應溫度較佳為100~300℃,更佳為120~280℃。 作為接枝改性之方法,並無特別限定,例如可應用日本專利特開昭62-79211號公報中所記載之方法。 Furthermore, the hydrogenated block copolymer (A) of the present embodiment can be a modified block copolymer obtained by grafting and modifying α,β-unsaturated carboxylic acid or its derivatives, such as its anhydride, ester, amide, and imide. As α,β-unsaturated carboxylic acid or its derivatives, for example, maleic anhydride, maleic anhydride imide, acrylic acid or its ester, methacrylic acid or its ester, endo-cis-bicyclo[2,2,1]-5-heptene-2,3-dicarboxylic acid or its anhydride, etc. can be cited, but it is not limited to the above. The addition amount of α,β-unsaturated carboxylic acid or its derivative is preferably 0.01 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass per 100 parts by mass of the hydrogenated block copolymer (A). The reaction temperature for graft modification is preferably 100 to 300°C, more preferably 120 to 280°C. The graft modification method is not particularly limited, and for example, the method described in Japanese Patent Publication No. 62-79211 can be applied.

(氫化反應步驟) 本實施方式之氫化嵌段共聚物(甲)可藉由如下方法獲得:使用規定之氫化觸媒,將如上所述之非氫化之非改性或改性嵌段共聚物供於氫化反應。 作為氫化觸媒,並無特別限定,例如可例舉公知之觸媒,即(1)使Ni、Pt、Pd、Ru等金屬擔載於碳、二氧化矽、氧化鋁、矽藻土等而成之擔載型非均相氫化觸媒;(2)使用Ni、Co、Fe、Cr等之有機酸鹽或乙醯丙酮鹽等過渡金屬鹽與有機鋁等還原劑之所謂齊格勒型氫化觸媒;(3)Ti、Ru、Rh、Zr等之有機金屬化合物等所謂有機金屬錯合物等均相氫化觸媒。 又,作為氫化觸媒,例如亦可使用日本專利特公昭42-8704號公報、日本專利特公昭43-6636號公報、日本專利特公昭63-4841號公報、日本專利特公平1-37970號公報、日本專利特公平1-53851號公報、日本專利特公平2-9041號公報中所記載之氫化觸媒,但並不限定於以上。 作為適宜之氫化觸媒,可例舉:二茂鈦化合物、還原性有機金屬化合物、或該等之混合物。 作為二茂鈦化合物,例如可使用日本專利特開平8-109219號公報中所記載之化合物,但並不限定於以上。具體而言,可例舉:雙環戊二烯基二氯化鈦、單五甲基環戊二烯基三氯化鈦等具有至少1個以上之具有(取代)環戊二烯基骨架、茚基骨架、或茀基骨架之配位基之化合物。 作為還原性有機金屬化合物,例如可例舉:有機鋰等有機鹼金屬化合物、有機鎂化合物、有機鋁化合物、有機硼化合物、或有機鋅化合物等,但並不限定於以上。 (Hydrogenation reaction step) The hydrogenated block copolymer (A) of this embodiment can be obtained by the following method: using a prescribed hydrogenation catalyst, subjecting the non-hydrogenated non-modified or modified block copolymer as described above to a hydrogenation reaction. The hydrogenation catalyst is not particularly limited. For example, known catalysts can be cited, namely (1) supported heterogeneous hydrogenation catalysts in which metals such as Ni, Pt, Pd, and Ru are supported on carbon, silica, alumina, diatomaceous earth, etc.; (2) so-called Ziegler-type hydrogenation catalysts using organic acid salts of Ni, Co, Fe, Cr, etc. or transition metal salts such as acetylacetonate and reducing agents such as organic aluminum; (3) so-called organic metal complexes such as organic metal compounds of Ti, Ru, Rh, and Zr, etc. Furthermore, as a hydrogenation catalyst, for example, the hydrogenation catalyst described in Japanese Patent Publication No. 42-8704, Japanese Patent Publication No. 43-6636, Japanese Patent Publication No. 63-4841, Japanese Patent Publication No. 1-37970, Japanese Patent Publication No. 1-53851, and Japanese Patent Publication No. 2-9041 can also be used, but it is not limited to the above. As a suitable hydrogenation catalyst, a titanocene compound, a reducing organic metal compound, or a mixture thereof can be cited. As a titanocene compound, for example, the compound described in Japanese Patent Publication No. 8-109219 can be used, but it is not limited to the above. Specifically, compounds having at least one ligand having a (substituted) cyclopentadienyl skeleton, indenyl skeleton, or fluorenyl skeleton, such as biscyclopentadienyl titanium dichloride and monopentamethylcyclopentadienyl titanium trichloride, can be cited. As reducing organic metal compounds, organic alkali metal compounds such as organic lithium, organic magnesium compounds, organic aluminum compounds, organic boron compounds, or organic zinc compounds can be cited, but are not limited to the above.

對氫化反應進行說明。 反應溫度通常較佳為0~200℃之溫度範圍,更佳為30~150℃之溫度範圍。 氫化反應中所使用之氫之壓力較佳為0.1~15 MPa,更佳為0.2~10 MPa,進而較佳為0.3~5 MPa。 氫化反應時間通常較佳為3分鐘~10小時,更佳為10分鐘~5小時。 氫化反應可為分批製程、連續製程、或該等之組合中之任一種。 較佳為視需要自經過氫化反應經所獲得之氫化嵌段共聚物之溶液中去除觸媒殘渣,並將氫化嵌段共聚物自溶液中分離。 作為分離方法,例如可例舉:於氫化後之反應液中添加丙酮或醇等對氫化改性共聚物而言為不良溶劑之極性溶劑,使聚合物沉澱並回收之方法;將反應液於攪拌下投入至熱水中,藉由蒸汽汽提去除溶劑並回收之方法;直接加熱聚合物溶液而將溶劑蒸餾去除之方法等,但並不限定於以上。 The hydrogenation reaction is described. The reaction temperature is usually preferably in the range of 0 to 200°C, more preferably in the range of 30 to 150°C. The pressure of hydrogen used in the hydrogenation reaction is preferably 0.1 to 15 MPa, more preferably 0.2 to 10 MPa, and further preferably 0.3 to 5 MPa. The hydrogenation reaction time is usually preferably 3 minutes to 10 hours, more preferably 10 minutes to 5 hours. The hydrogenation reaction can be any of a batch process, a continuous process, or a combination thereof. It is preferred to remove catalyst residues from the solution of the hydrogenated block copolymer obtained through the hydrogenation reaction as needed, and separate the hydrogenated block copolymer from the solution. As separation methods, for example, there are: adding polar solvents such as acetone or alcohol, which are poor solvents for hydrogenated modified copolymers, to the reaction solution after hydrogenation to precipitate the polymer and recover it; putting the reaction solution into hot water while stirring, removing the solvent by steam stripping and recovering it; directly heating the polymer solution to remove the solvent by distillation, etc., but it is not limited to the above.

再者,於本實施方式之氫化嵌段共聚物(甲)中亦可添加各種酚系穩定劑、磷系穩定劑、硫系穩定劑、胺系穩定劑等穩定劑。Furthermore, various stabilizers such as phenol stabilizers, phosphorus stabilizers, sulfur stabilizers, and amine stabilizers may be added to the hydrogenated block copolymer (A) of the present embodiment.

[氫化嵌段共聚物組合物] 本實施方式之氫化嵌段共聚物組合物含有氫化嵌段共聚物(甲)、烯烴系樹脂(乙)、熱塑性樹脂(丙)、及軟化劑(丁)。 本實施方式之氫化嵌段共聚物組合物含有本實施方式之(甲)氫化嵌段共聚物:1質量%以上且50質量%以下、至少一種(乙)烯烴系樹脂:5質量%以上且90質量%以下、至少一種熱塑性樹脂(丙):1質量%以上且50質量%以下、及至少一種軟化劑(丁):5質量%以上且90質量%以下。 [Hydrogenated block copolymer composition] The hydrogenated block copolymer composition of the present embodiment contains a hydrogenated block copolymer (A), an olefinic resin (B), a thermoplastic resin (C), and a softener (D). The hydrogenated block copolymer composition of the present embodiment contains the hydrogenated block copolymer (A) of the present embodiment: 1% by mass or more and 50% by mass or less, at least one olefinic resin (B): 5% by mass or more and 90% by mass or less, at least one thermoplastic resin (C): 1% by mass or more and 50% by mass or less, and at least one softener (D): 5% by mass or more and 90% by mass or less.

((乙)烯烴系樹脂) 以下對構成本實施方式之氫化嵌段共聚物組合物之烯烴系樹脂(乙)進行說明。 作為烯烴系樹脂(乙),例如可例舉:聚乙烯(PE)、聚丙烯(PP)、1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、4-甲基-1-戊烯、1-辛烯等α-烯烴類之均聚物,但並不限定於以上。又,可例舉:包含選自乙烯、丙烯、丁烯、戊烯、己烯、辛烯等中之烯烴之組合之無規共聚物、或嵌段共聚物。 具體而言,可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-3-甲基-1-丁烯共聚物、乙烯-4-甲基-1-戊烯共聚物、乙烯-1-己烯共聚物、乙烯-1-辛烯共聚物、乙烯-1-癸烯共聚物、丙烯-1-丁烯共聚物、丙烯-1-己烯共聚物、丙烯-1-辛烯共聚物、丙烯-4-甲基-1-戊烯共聚物、乙烯-丙烯-1-丁烯共聚物、丙烯-1-己烯-乙烯共聚物、丙烯-1-辛烯-乙烯共聚物等乙烯及/或丙烯-α-烯烴共聚物。 又,作為與乙烯及/或丙烯之共聚物,亦包含與其他不飽和單體之共聚物。 作為上述與其他不飽和單體之共聚物,例如可例舉:乙烯及/或丙烯與丙烯酸、甲基丙烯酸、順丁烯二酸、伊康酸、丙烯酸甲酯、甲基丙烯酸甲酯、順丁烯二酸酐、芳基順丁烯二醯亞胺、烷基順丁烯二醯亞胺等不飽和有機酸或其衍生物之共聚物;乙烯及/或丙烯與乙酸乙烯酯等乙烯酯類之共聚物;進而乙烯及/或丙烯與二環戊二烯、4-亞乙基-2-降𦯉烯、4-甲基-1,4-己二烯、5-甲基-1,4-己二烯等非共軛二烯等之共聚物,但並不限定於以上。 從經濟性、或使本實施方式之氫化嵌段共聚物組合物中之相溶性變得良好而獲得較高之透明性的觀點出發,(乙)烯烴系樹脂較佳為包含至少一種聚丙烯系樹脂。 (Olefinic resin) The olefinic resin (Olefinic resin) constituting the hydrogenated block copolymer composition of the present embodiment is described below. As the olefinic resin (Olefinic resin), for example, homopolymers of α-olefins such as polyethylene (PE), polypropylene (PP), 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 4-methyl-1-pentene, and 1-octene can be cited, but it is not limited to the above. In addition, random copolymers or block copolymers containing combinations of olefins selected from ethylene, propylene, butene, pentene, hexene, octene, etc. can be cited. Specifically, examples include ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-3-methyl-1-butene copolymers, ethylene-4-methyl-1-pentene copolymers, ethylene-1-hexene copolymers, ethylene-1-octene copolymers, ethylene-1-decene copolymers, propylene-1-butene copolymers, propylene-1-hexene copolymers, propylene-1-octene copolymers, propylene-4-methyl-1-pentene copolymers, ethylene-propylene-1-butene copolymers, propylene-1-hexene-ethylene copolymers, propylene-1-octene-ethylene copolymers, and the like. In addition, copolymers with ethylene and/or propylene also include copolymers with other unsaturated monomers. As the copolymers of the above-mentioned monomers and other unsaturated monomers, for example, there can be cited: copolymers of ethylene and/or propylene with unsaturated organic acids or their derivatives such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, methyl acrylate, methyl methacrylate, maleic anhydride, aryl maleic anhydride, alkyl maleic anhydride, etc.; copolymers of ethylene and/or propylene with vinyl esters such as vinyl acetate; and copolymers of ethylene and/or propylene with non-conjugated dienes such as dicyclopentadiene, 4-ethylidene-2-northene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, etc., but the above are not limited to the above. From the perspective of economy or improving the compatibility of the hydrogenated block copolymer composition of the present embodiment to obtain higher transparency, the (ethylene) hydrocarbon resin preferably contains at least one polypropylene resin.

又,烯烴系樹脂(乙)亦可為利用規定之官能基改性而成者。 作為官能基,並無特別限定,例如可例舉:環氧基、羧基、酸酐基、羥基等。 作為用以使烯烴系樹脂(乙)改性之含官能基之化合物或改性劑,並無特別限定,例如可例舉下述化合物。 例如可例舉:甲基丙烯酸縮水甘油酯、丙烯酸縮水甘油酯、乙烯基縮水甘油醚、烯丙基縮水甘油醚等不飽和環氧化物;或順丁烯二酸、反丁烯二酸、伊康酸、檸康酸、烯丙基琥珀酸、順丁烯二酸酐、反丁烯二酸酐、伊康酸酐等不飽和有機酸等。除此以外,並無特別限定,例如可例舉離子聚合物、氯化聚烯烴等。 In addition, the olefinic resin (II) may be modified with a prescribed functional group. The functional group is not particularly limited, and examples thereof include: an epoxy group, a carboxyl group, an anhydride group, a hydroxyl group, etc. The functional group-containing compound or modifier used to modify the olefinic resin (II) is not particularly limited, and examples thereof include the following compounds. For example, unsaturated epoxides such as glycidyl methacrylate, glycidyl acrylate, vinyl glycidyl ether, and allyl glycidyl ether; or unsaturated organic acids such as maleic acid, fumaric acid, itaconic acid, linaconic acid, allyl succinic acid, maleic anhydride, fumaric anhydride, and itaconic anhydride, etc. may be cited. Other than these, there are no particular limitations, and examples thereof include ionic polymers, chlorinated polyolefins, etc.

從經濟性、或使本實施方式之氫化嵌段共聚物組合物中之相溶性變得良好而獲得較高之透明性的觀點出發,烯烴系樹脂(乙)較佳為聚丙烯均聚物、乙烯-丙烯之無規或嵌段共聚物等聚丙烯系樹脂。 尤其是就透明性、柔軟性之觀點而言,更佳為乙烯-丙烯之無規共聚物。 烯烴系樹脂(乙)可包含僅一種之單獨之材料,亦可為併用兩種以上者。 From the viewpoint of economy or making the compatibility in the hydrogenated block copolymer composition of the present embodiment better and obtaining higher transparency, the olefinic resin (B) is preferably a polypropylene resin such as a polypropylene homopolymer, a random or block copolymer of ethylene-propylene, etc. In particular, from the viewpoint of transparency and softness, a random copolymer of ethylene-propylene is more preferred. The olefinic resin (B) may include only one single material or may be a combination of two or more.

本實施方式之氫化嵌段共聚物組合物含有氫化嵌段共聚物(甲)、及至少一種烯烴系樹脂(乙),氫化嵌段共聚物(甲)之含量較佳為1質量%以上且50質量%以下,更佳為1質量%以上且45質量%以下,進而較佳為5質量%以上且40質量%以下。 若氫化嵌段共聚物(甲)之含量為1質量%以上,則有氫化嵌段共聚物組合物之耐磨耗性提高,硬度降低之傾向。另一方面,若氫化嵌段共聚物(甲)之含量為50質量%以下,則有本實施方式之氫化嵌段共聚物組合物之耐油性提高之傾向。 又,從本實施方式之氫化嵌段共聚物組合物之機械強度之觀點出發,烯烴樹脂(B)之含量為5質量%以上,從氫化嵌段共聚物組合物之低溫特性之觀點出發為90質量%以下。較佳為7質量%以上且85質量%以下,更佳為10質量%以上且80質量%以下。 The hydrogenated block copolymer composition of the present embodiment contains a hydrogenated block copolymer (A) and at least one olefinic resin (B), and the content of the hydrogenated block copolymer (A) is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 45% by mass or less, and further preferably 5% by mass or more and 40% by mass or less. If the content of the hydrogenated block copolymer (A) is 1% by mass or more, the wear resistance of the hydrogenated block copolymer composition tends to be improved and the hardness tends to be reduced. On the other hand, if the content of the hydrogenated block copolymer (A) is 50% by mass or less, the oil resistance of the hydrogenated block copolymer composition of the present embodiment tends to be improved. In addition, from the perspective of the mechanical strength of the hydrogenated block copolymer composition of this embodiment, the content of the olefin resin (B) is 5% by mass or more, and from the perspective of the low-temperature characteristics of the hydrogenated block copolymer composition, it is 90% by mass or less. It is preferably 7% by mass or more and 85% by mass or less, and more preferably 10% by mass or more and 80% by mass or less.

本實施方式之氫化嵌段共聚物組合物除了上述本實施方式之氫化嵌段共聚物(甲)、聚烯烴系樹脂(乙)以外,還含有至少一種熱塑性樹脂(丙)1質量%以上且50質量%以下、至少一種軟化劑(丁)5質量%以上且90質量%以下。除此以外,亦可調配改質劑、添加劑等。The hydrogenated block copolymer composition of the present embodiment contains, in addition to the hydrogenated block copolymer (A) and the polyolefin resin (B) of the present embodiment, at least one thermoplastic resin (C) in an amount of 1% by mass or more and 50% by mass or less, and at least one softener (D) in an amount of 5% by mass or more and 90% by mass or less. In addition, a modifier, an additive, etc. may also be formulated.

上述軟化劑(丁)使本實施方式之氫化嵌段共聚物組合物柔軟化,且賦予流動性(成形加工性)。 作為軟化劑,例如可應用礦物油或液狀或者低分子量之合成軟化劑,但並不限定於以上,尤其適宜為環烷系及/或石蠟系之加工處理油或增量油。 礦物油系之軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 作為合成軟化劑,例如可使用聚丁烯、低分子量聚丁二烯、液態石蠟等,但更佳為上述礦物油系軟化劑。 於對本實施方式之氫化嵌段共聚物組合物要求較高之耐熱性、機械物性之情形時,所應用之礦物油系之軟化劑於40℃之動黏度較佳為60 cst以上,更佳為120 cst以上。 軟化劑可僅單獨使用一種,亦可併用兩種以上。 The softener (D) softens the hydrogenated block copolymer composition of the present embodiment and imparts fluidity (molding processability). As the softener, for example, mineral oil or liquid or low molecular weight synthetic softeners can be used, but are not limited to the above, and are particularly suitable for cycloalkane and/or wax processing oils or extender oils. The mineral oil softener is a mixture of aromatic rings, cycloalkane rings and wax chains. The wax chain with carbon number accounting for more than 50% of the total carbon is called a wax chain, the cycloalkane ring with carbon number of 30 to 45% is called a cycloalkane chain, and the aromatic carbon number exceeding 30% is called an aromatic chain. As synthetic softeners, for example, polybutene, low molecular weight polybutadiene, liquid wax, etc. can be used, but the above-mentioned mineral oil-based softeners are more preferred. When the hydrogenated block copolymer composition of the present embodiment requires higher heat resistance and mechanical properties, the mineral oil-based softener used preferably has a kinematic viscosity of 60 cst or more at 40°C, and more preferably 120 cst or more. The softener may be used alone or in combination of two or more.

上述改質劑設為提高本實施方式之氫化嵌段共聚物組合物表面之耐損傷性,或者具有改良黏著性之功能者。 作為改質劑,例如可應用有機聚矽氧烷,但並不限定於以上。其發揮氫化嵌段共聚物組合物之表面改質效果,且作為耐磨耗性改善助劑而發揮功能。 作為改質劑之形態,可為低黏度之液狀~高黏度之液狀物、固體狀中之任一種,從確保於本實施方式之氫化嵌段共聚物組合物中之良好之分散性的觀點出發,適宜為液狀物,即矽油。進而關於改質劑之動黏度,從抑制聚矽氧烷本身之滲出之觀點出發,較佳為90 cst以上,更佳為1000 cst以上。作為聚矽氧烷,例如可例舉:二甲基聚矽氧烷、甲基苯基聚矽氧烷等通用矽油;或烷基改性、聚醚改性、氟改性、醇改性、胺基改性、環氧改性等各種改性矽油,但並不限定於以上。就作為耐磨耗性改善助劑之效果較高之方面而言,適宜為二甲基聚矽氧烷,但並無特別限制。 該等改質劑可僅單獨使用一種,亦可併用兩種以上。 The above-mentioned modifier is designed to improve the damage resistance of the surface of the hydrogenated block copolymer composition of the present embodiment, or has the function of improving adhesion. As a modifier, for example, organic polysiloxane can be applied, but it is not limited to the above. It exerts the surface modification effect of the hydrogenated block copolymer composition and functions as an auxiliary agent for improving wear resistance. As a form of the modifier, it can be any of a low-viscosity liquid to a high-viscosity liquid or a solid. From the perspective of ensuring good dispersibility in the hydrogenated block copolymer composition of the present embodiment, it is preferably a liquid, that is, silicone oil. Furthermore, regarding the dynamic viscosity of the modifier, from the perspective of inhibiting the exudation of polysiloxane itself, it is preferably 90 cst or more, and more preferably 1000 cst or more. As polysiloxane, for example, general silicone oils such as dimethyl polysiloxane and methylphenyl polysiloxane; or various modified silicone oils such as alkyl modification, polyether modification, fluorine modification, alcohol modification, amino modification, and epoxy modification can be cited, but it is not limited to the above. In terms of the higher effect as an auxiliary agent for improving wear resistance, dimethyl polysiloxane is suitable, but there is no special limitation. These modifiers can be used alone or in combination of two or more.

作為添加劑,只要係填充劑、潤滑劑、離型劑、塑化劑、抗氧化劑、熱穩定劑、光穩定劑、紫外線吸收劑、阻燃劑、防靜電劑、補強劑、著色劑、熱塑性樹脂或橡膠狀聚合物之調配中通常所使用者,則並無特別限制。 作為填充劑,例如可例舉:二氧化矽、滑石、雲母、矽酸鈣、鋁碳酸鎂、高嶺土、矽藻土、石墨、碳酸鈣、碳酸鎂、氫氧化鎂、氫氧化鋁、硫酸鈣、硫酸鋇等無機填充劑;碳黑等有機填充劑,但並不限定於以上。 作為潤滑劑,例如可例舉:硬脂酸、山萮酸、硬脂酸鋅、硬脂酸鈣、硬脂酸鎂、伸乙基雙硬脂醯胺等,但並不限定於以上。 作為塑化劑,例如可例舉有機聚矽氧烷、礦物油等,但並不限定於以上。 作為抗氧化劑,例如可例舉受阻酚系抗氧化劑,但並不限定於以上。 作為熱穩定劑,例如可例舉:磷系、硫系及胺系熱穩定劑等,但並不限定於以上。 作為光穩定劑,例如可例舉受阻胺系光穩定劑,但並不限定於以上。 作為紫外線吸收劑,例如可例舉苯并三唑系紫外線吸收劑,但並不限定於以上。 作為補強劑,例如可例舉:有機纖維、玻璃纖維、碳纖維、金屬晶鬚等,但並不限定於以上。 作為著色劑,例如可例舉:氧化鈦、氧化鐵、碳黑等,但並不限定於以上。 除此以外,可例舉於「橡膠、塑膠調配藥品」(Rubber Digest公司編)等中所記載者。 There are no special restrictions on additives as long as they are fillers, lubricants, release agents, plasticizers, antioxidants, heat stabilizers, light stabilizers, ultraviolet absorbers, flame retardants, antistatic agents, reinforcing agents, colorants, thermoplastic resins or rubber polymers that are commonly used in the formulation. Examples of fillers include inorganic fillers such as silica, talc, mica, calcium silicate, magnesium aluminate, kaolin, diatomaceous earth, graphite, calcium carbonate, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, calcium sulfate, and barium sulfate; and organic fillers such as carbon black, but not limited to the above. Examples of lubricants include stearic acid, behenic acid, zinc stearate, calcium stearate, magnesium stearate, ethyl distearate, etc., but not limited to the above. Examples of plasticizers include organic polysiloxanes, mineral oils, etc., but not limited to the above. As antioxidants, for example, hindered phenol antioxidants can be cited, but not limited to the above. As heat stabilizers, for example, phosphorus-based, sulfur-based and amine-based heat stabilizers can be cited, but not limited to the above. As light stabilizers, for example, hindered amine-based light stabilizers can be cited, but not limited to the above. As ultraviolet absorbers, for example, benzotriazole-based ultraviolet absorbers can be cited, but not limited to the above. As reinforcing agents, for example, organic fibers, glass fibers, carbon fibers, metal whiskers, etc. can be cited, but not limited to the above. As colorants, for example, titanium oxide, iron oxide, carbon black, etc. can be cited, but not limited to the above. In addition, examples include those listed in "Rubber and Plastic Compounding Products" (edited by Rubber Digest Co., Ltd.).

((丙)熱塑性樹脂) 作為上述熱塑性樹脂(丙),例如可例舉:共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物及其氫化物(但不同於上述本實施方式之氫化嵌段共聚物(甲));上述乙烯基芳香族化合物之聚合物;上述乙烯基芳香族化合物與其他乙烯基單體例如乙烯、丙烯、丁烯、氯乙烯、偏二氯乙烯、乙酸乙烯酯、丙烯酸及丙烯酸甲酯等丙烯酸酯、甲基丙烯酸及甲基丙烯酸甲酯等甲基丙烯酸酯、丙烯腈、甲基丙烯腈等之共聚樹脂;橡膠改性苯乙烯系樹脂(HIPS);丙烯腈-丁二烯-苯乙烯共聚樹脂(ABS);甲基丙烯酸酯-丁二烯-苯乙烯共聚樹脂(MBS)等,但並不限定於以上。 ((C) Thermoplastic resin) As the above-mentioned thermoplastic resin (C), for example, block copolymers of covalent diene compounds and vinyl aromatic compounds and hydrogenated products thereof (but different from the hydrogenated block copolymer (A) of the above-mentioned embodiment); polymers of the above-mentioned vinyl aromatic compounds; copolymers of the above-mentioned vinyl aromatic compounds and other vinyl monomers such as ethylene, propylene, butylene, vinyl chloride, vinylidene chloride, vinyl acetate, acrylic acid and methyl acrylate and other acrylic acid esters, methacrylic acid and methyl methacrylate and other methacrylic acid esters, acrylonitrile, methacrylonitrile, etc.; rubber-modified styrene resin (HIPS); acrylonitrile-butadiene-styrene copolymer (ABS); methacrylate-butadiene-styrene copolymer (MBS), etc., but not limited to the above.

又,作為上述(丙)熱塑性樹脂,例如可例舉:聚乙烯;含有50質量%以上之乙烯之乙烯共聚物,例如乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯共聚物及其水解物;乙烯-丙烯酸離子聚合物或氯化聚乙烯等聚乙烯系樹脂;聚丙烯;含有50質量%以上之丙烯之丙烯共聚物,例如丙烯-乙烯共聚物、丙烯-丙烯酸乙酯共聚物;或氯化聚丙烯等聚丙烯系樹脂;乙烯-降𦯉烯樹脂等環狀烯烴系樹脂;聚丁烯系樹脂;聚氯乙烯系樹脂;聚乙酸乙烯酯系樹脂及其水解物等,但並不限定於以上。Furthermore, examples of the above-mentioned (c) thermoplastic resin include: polyethylene; ethylene copolymers containing 50% by mass or more of ethylene, such as ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers and hydrolyzates thereof; polyethylene resins such as ethylene-acrylic acid ionomers or chlorinated polyethylene; polypropylene; propylene copolymers containing 50% by mass or more of propylene, such as propylene-ethylene copolymers, propylene-ethyl acrylate copolymers; or polypropylene resins such as chlorinated polypropylene; cyclic olefin resins such as ethylene-northene resins; polybutene resins; polyvinyl chloride resins; polyvinyl acetate resins and hydrolyzates thereof, but are not limited to the above.

又,作為(丙)熱塑性樹脂,例如可例舉:丙烯酸及其酯或醯胺之聚合物;聚丙烯酸酯系樹脂;丙烯腈及/或甲基丙烯腈之聚合物;含有50質量%以上之該等丙烯腈系單體之與其他能夠共聚之單體的共聚物,即腈樹脂;尼龍-46、尼龍-6、尼龍-66、尼龍-610、尼龍-11、尼龍-12、尼龍-6尼龍-12共聚物等聚醯胺系樹脂;聚酯系樹脂;熱塑性聚胺基甲酸酯系樹脂;聚-4,4'-二氧基二苯基-2,2'-丙烷碳酸酯等聚碳酸酯系聚合物;聚醚碸或聚烯丙基碸等熱塑性聚碸;聚甲醛系樹脂;聚(2,6-二甲基-1,4-伸苯基)醚等聚苯醚系樹脂;聚苯硫醚、聚4,4'-二苯硫醚等聚苯硫醚系樹脂;聚芳酯系樹脂;聚醚酮聚合物或共聚物;聚酮系樹脂;氟系樹脂;聚氧苯甲醯基系聚合物;聚醯亞胺系樹脂;1,2-聚丁二烯、反式-聚丁二烯等聚丁二烯系樹脂等,但並不限定於以上。In addition, as (c) thermoplastic resins, for example, there can be cited: polymers of acrylic acid and its esters or amides; polyacrylate resins; polymers of acrylonitrile and/or methacrylonitrile; copolymers containing 50% by mass or more of these acrylonitrile monomers and other copolymerizable monomers, i.e., nitrile resins; polyamide resins such as nylon-46, nylon-6, nylon-66, nylon-610, nylon-11, nylon-12, and nylon-6-nylon-12 copolymers; polyester resins; thermoplastic polyurethane resins; poly-4,4'-dioxy The invention also includes polycarbonate polymers such as 2,2'-diphenyl-2,2'-propane carbonate; thermoplastic polysulfones such as polyether sulfones or polyallyl sulfones; polyoxymethylene resins; polyphenylene ether resins such as poly(2,6-dimethyl-1,4-phenylene) ether; polyphenylene sulfide resins such as polyphenylene sulfide and poly-4,4'-diphenyl sulfide; polyarylate resins; polyetherketone polymers or copolymers; polyketone resins; fluorine resins; polyoxybenzoyl polymers; polyimide resins; polybutadiene resins such as 1,2-polybutadiene and trans-polybutadiene, etc., but is not limited to the above.

上述熱塑性樹脂(丙)之中,尤佳為聚苯乙烯、橡膠改性苯乙烯系樹脂等苯乙烯系樹脂;聚乙烯;乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯系共聚物、乙烯-丙烯酸酯系共聚物、乙烯-甲基丙烯酸酯系共聚物等聚乙烯系聚合物;聚丙烯;丙烯-乙烯共聚物等聚丙烯系樹;聚醯胺系樹脂;聚酯系樹脂;聚碳酸酯系樹脂。該等熱塑性樹脂(丙)之數量平均分子量通常為1000以上,較佳為5000~500萬,更佳為1萬~100萬。Among the above-mentioned thermoplastic resins (C), polystyrene resins such as polystyrene and rubber-modified styrene resins are particularly preferred; polyethylene; polyethylene polymers such as ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers, ethylene-acrylate copolymers, and ethylene-methacrylate copolymers; polypropylene; polypropylene resins such as propylene-ethylene copolymers; polyamide resins; polyester resins; and polycarbonate resins. The number average molecular weight of the thermoplastic resins (C) is usually 1,000 or more, preferably 5,000 to 5,000,000, and more preferably 10,000 to 1,000,000.

於本實施方式之氫化嵌段共聚物組合物中,從機械強度之觀點出發,熱塑性樹脂(丙)之含量設為1質量%以上,從耐油性之觀點出發,設為50質量%以下。較佳為3質量%以上且47質量%以下,更佳為5質量%以上且45質量%以下。 又,於將上述成分(甲)及(丙)之合計量設為100質量份之情形時,成分(丙)之含量較佳為2~150質量份,更佳為2~140質量份,進而較佳為2~130質量份。 In the hydrogenated block copolymer composition of the present embodiment, the content of the thermoplastic resin (C) is set to 1 mass % or more from the viewpoint of mechanical strength, and is set to 50 mass % or less from the viewpoint of oil resistance. It is preferably 3 mass % or more and 47 mass % or less, and more preferably 5 mass % or more and 45 mass % or less. In addition, when the total amount of the above-mentioned components (A) and (C) is set to 100 mass parts, the content of component (C) is preferably 2 to 150 mass parts, more preferably 2 to 140 mass parts, and further preferably 2 to 130 mass parts.

((丁)軟化劑) 其次,對構成本實施方式之氫化嵌段共聚物組合物之軟化劑(丁)進行說明。 軟化劑(丁)較佳為使氫化嵌段共聚物組合物柔軟化,並且賦予加工性之橡膠用軟化劑。 作為軟化劑(丁),例如可例舉:礦物油、或液狀或低分子量之合成軟化劑,但並不限定於以上,其中,較佳為環烷系及/或石蠟系之加工處理油或增量油。 礦物油系軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 於本實施方式之氫化嵌段共聚物組合物中可使用合成軟化劑,並無特別限定,例如可使用聚丁烯、低分子量聚丁二烯、液態石蠟等。其中,較佳為上述礦物油系橡膠用軟化劑。 ((D) Softener) Next, the softener (D) constituting the hydrogenated block copolymer composition of the present embodiment is described. The softener (D) is preferably a rubber softener that softens the hydrogenated block copolymer composition and imparts processability. As the softener (D), for example, mineral oil or liquid or low molecular weight synthetic softeners can be cited, but are not limited to the above. Among them, cycloalkane-based and/or wax-based processing oils or extender oils are preferred. Mineral oil-based softeners are mixtures of aromatic rings, cycloalkane rings, and wax chains. The wax chain with carbon numbers accounting for more than 50% of the total carbon is called a wax series, the cycloalkane ring with carbon numbers of 30-45% is called a cycloalkane series, and the aromatic carbon number exceeding 30% is called an aromatic series. Synthetic softeners can be used in the hydrogenated block copolymer composition of the present embodiment without particular limitation, for example, polybutene, low molecular weight polybutadiene, liquid wax, etc. Among them, the above-mentioned mineral oil-based rubber softener is preferred.

於本實施方式之氫化嵌段共聚物組合物中,從表面觸感之觀點出發,軟化劑(丁)之含量設為5質量%以上,從抑制滲出之觀點出發,設為90質量%以下。較佳為7質量%以上且85質量%以下,更佳為10質量%以上且80質量%以下。 又,於將成分(甲)及(乙)之合計量設為100質量份之情形時,成分(丁)之含量較佳為2~150質量份,更佳為2~130質量份,進而較佳為2~100質量份。若軟化劑(丁)之含量為上述上限值以下,則可抑制滲出,表面觸感變得良好。 In the hydrogenated block copolymer composition of the present embodiment, the content of the softener (D) is set to 5% by mass or more from the viewpoint of surface touch, and is set to 90% by mass or less from the viewpoint of suppressing bleeding. It is preferably 7% by mass or more and 85% by mass or less, and more preferably 10% by mass or more and 80% by mass or less. In addition, when the total amount of components (A) and (B) is set to 100 parts by mass, the content of component (D) is preferably 2 to 150 parts by mass, more preferably 2 to 130 parts by mass, and further preferably 2 to 100 parts by mass. If the content of the softener (D) is below the above upper limit, bleeding can be suppressed and the surface touch becomes good.

於本實施方式之氫化嵌段共聚物組合物中,除了上述成分(甲)、(乙)、(丙)、及(丁)以外,視需要可任意地調配添加劑。 添加劑之種類只要係熱塑性樹脂或橡膠狀聚合物之調配中通常所使用者,則並無特別限制。 In the hydrogenated block copolymer composition of the present embodiment, in addition to the above-mentioned components (A), (B), (C), and (D), additives can be arbitrarily formulated as needed. The type of additive is not particularly limited as long as it is commonly used in the formulation of thermoplastic resins or rubber polymers.

本實施方式之氫化嵌段共聚物組合物可藉由先前公知之方法製造。 本實施方式之氫化嵌段共聚物組合物之製造方法例如可使用利用班布里混合機、單螺桿擠出機、雙螺桿擠出機、雙向捏合機、多螺桿擠出機等混合機,將各成分(上述氫化嵌段共聚物(甲)、及聚烯烴系樹脂(乙)、熱塑性樹脂(丙)、軟化劑(丁)、其他添加劑)熔融混練之方法;於將各成分溶解或分散混合後,將溶劑加熱去除之方法等,但並不限定於以上。 從生產性、優良混練性之觀點出發,尤其適宜為利用擠出機之熔融混練法。 關於氫化嵌段共聚物組合物之形狀,例如可設為顆粒狀、片狀、繩狀、小片狀等任意形狀,但並不限定於以上。又,亦可於熔融混練後,直接製作成形品。 The hydrogenated block copolymer composition of the present embodiment can be produced by a previously known method. The method for producing the hydrogenated block copolymer composition of the present embodiment can be, for example, a method of melt-kneading the components (the above-mentioned hydrogenated block copolymer (A), and polyolefin resin (B), thermoplastic resin (C), softener (D), and other additives) using a mixer such as a Banbury mixer, a single-screw extruder, a twin-screw extruder, a bidirectional kneader, or a multi-screw extruder; a method of removing the solvent by heating after dissolving or dispersing and mixing the components, etc., but is not limited to the above. From the viewpoint of productivity and good kneading properties, the melt kneading method using an extruder is particularly suitable. The shape of the hydrogenated block copolymer composition can be any shape such as granules, sheets, ropes, small pieces, etc., but is not limited to the above. In addition, it is also possible to directly produce a molded product after melt kneading.

(補強性填充劑及補強性填充劑調配物) 藉由在本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(以下,有時記載為成分(A))中,調配選自二氧化矽系無機填充劑、金屬氧化物、金屬氫氧化物、金屬碳酸化物、碳黑中之至少一種補強性填充劑(以下,有時記載為成分(C)),可製備補強性填充劑調配物。 相對於本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(成分(A))100質量份,補強性填充劑調配物中之成分(C)之含量較佳為0.5~100質量份,更佳為5~100質量份,進而較佳為20~80質量份。 於使用本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(成分(A))製備上述補強性填充劑調配物之情形時,較佳為相對於成分(A)100質量份,進而包含0~500質量份、較佳為5~300質量份、更佳為10~200質量份之不同於上述本實施方式之氫化嵌段共聚物及上述烯烴系樹脂(乙)及上述熱塑性樹脂(丙)之熱塑性樹脂及/或橡膠狀聚合物(以下,有時記載為成分(B))。 (Reinforcing filler and reinforcing filler formulation) A reinforcing filler formulation can be prepared by blending at least one reinforcing filler selected from a silica-based inorganic filler, a metal oxide, a metal hydroxide, a metal carbonate, and carbon black (hereinafter, sometimes described as component (C)) into the hydrogenated block copolymer or the above-mentioned hydrogenated block copolymer composition (hereinafter, sometimes described as component (A)) of the present embodiment. Relative to 100 parts by mass of the hydrogenated block copolymer or the above-mentioned hydrogenated block copolymer composition (component (A)) of the present embodiment, the content of component (C) in the reinforcing filler formulation is preferably 0.5 to 100 parts by mass, more preferably 5 to 100 parts by mass, and further preferably 20 to 80 parts by mass. When the reinforcing filler formulation is prepared using the hydrogenated block copolymer of the present embodiment or the hydrogenated block copolymer composition (component (A)), it is preferred that 0 to 500 parts by mass, preferably 5 to 300 parts by mass, and more preferably 10 to 200 parts by mass of a thermoplastic resin and/or a rubbery polymer (hereinafter sometimes referred to as component (B)) different from the hydrogenated block copolymer of the present embodiment and the olefinic resin (B) and the thermoplastic resin (C) is contained relative to 100 parts by mass of component (A).

(不同於成分(乙)、成分(丙)之熱塑性樹脂及/或橡膠狀聚合物) 作為上述熱塑性樹脂及/或橡膠狀聚合物(成分(B)),例如可例舉:乙烯基芳香族單體單元含量超過60質量%之共軛二烯單體與乙烯基芳香族單體之嵌段共聚樹脂及其氫化物(但不同於本實施方式之(A)氫化嵌段共聚物);上述乙烯基芳香族化合物之聚合物;上述乙烯基芳香族化合物與其他乙烯系化合物(例如乙烯、丙烯、丁烯、氯乙烯、偏二氯乙烯、乙酸乙烯酯、丙烯酸及丙烯酸甲酯等丙烯酸酯、甲基丙烯酸及甲基丙烯酸甲酯等甲基丙烯酸酯、丙烯腈、甲基丙烯腈等)之共聚樹脂;橡膠改性苯乙烯系樹脂(HIPS);丙烯腈-丁二烯-苯乙烯共聚樹脂(ABS);甲基丙烯酸酯-丁二烯-苯乙烯共聚樹脂(MBS);聚乙烯;乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯共聚物及其水解物等包含乙烯與其他能夠共聚之單體之乙烯含量為50質量%以上之共聚物;乙烯-丙烯酸離子聚合物或氯化聚乙烯等聚乙烯系樹脂;聚丙烯;丙烯-乙烯共聚物、丙烯-丙烯酸乙酯共聚物或氯化聚丙烯等聚丙烯系樹脂、乙烯-降𦯉烯樹脂等環狀烯烴系樹脂、聚丁烯系樹脂、聚氯乙烯系樹脂、聚乙酸乙烯酯系樹脂及其水解物等包含丙烯與其他能夠共聚之單體之丙烯含量為50質量%以上之共聚物;丙烯酸及其酯或醯胺之聚合物;聚丙烯酸酯系樹脂;丙烯腈及/或甲基丙烯腈之聚合物;包含丙烯腈系單體與其他能夠共聚之單體之丙烯腈系單體含量為50質量%以上之共聚物,即腈樹脂;尼龍-46、尼龍-6、尼龍-66、尼龍-610、尼龍-11、尼龍-12、尼龍-6、尼龍-12共聚物等聚醯胺系樹脂;聚酯系樹脂;熱塑性聚胺基甲酸酯系樹脂;聚-4,4'-二氧基二苯基-2,2'-丙烷碳酸酯等聚碳酸酯系聚合物;聚醚碸或聚烯丙基碸等熱塑性聚碸;聚甲醛系樹脂;聚(2,6-二甲基-1,4-伸苯基)醚等聚苯醚系樹脂;聚苯硫醚、聚4,4'-二苯硫醚等聚苯硫醚系樹脂;聚芳酯系樹脂;聚醚酮聚合物或共聚物;聚酮系樹脂;氟系樹脂;聚氧苯甲醯基系聚合物;聚醯亞胺系樹脂;1,2-聚丁二烯、反式-聚丁二烯等聚丁二烯系樹脂等,但並不限定於以上。 該等成分(B)亦可為鍵結有羥基、環氧基、胺基、羧酸基、酸酐基等含極性基之原子團者。 (Thermoplastic resin and/or rubber polymer different from component (B) and component (C)) As the above-mentioned thermoplastic resin and/or rubber polymer (component (B)), for example, there can be cited: block copolymers of conjugated diene monomers and vinyl aromatic monomers with a vinyl aromatic monomer unit content exceeding 60% by mass and their hydrogenated products (but different from the (A) hydrogenated block copolymer of the present embodiment); polymers of the above-mentioned vinyl aromatic compounds; copolymers of the above-mentioned vinyl aromatic compounds and other vinyl compounds (for example, ethylene, propylene, butene, vinyl chloride, vinylidene chloride, vinyl acetate, acrylic acid and methyl acrylate and other acrylic acid esters, methacrylic acid and methyl methacrylate and other methacrylic acid esters, acrylonitrile, methacrylonitrile, etc.) Resins; rubber-modified styrene resins (HIPS); acrylonitrile-butadiene-styrene copolymers (ABS); methacrylate-butadiene-styrene copolymers (MBS); polyethylene; copolymers containing ethylene and other copolymerizable monomers such as ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers and their hydrolyzates, with an ethylene content of 50% or more; polyethylene resins such as ethylene-acrylic acid ionomers or chlorinated polyethylene; polypropylene; polypropylene resins such as propylene-ethylene copolymers, propylene-ethyl acrylate copolymers or chlorinated polypropylene , cyclic olefin resins such as ethylene-northene resins, polybutene resins, polyvinyl chloride resins, polyvinyl acetate resins and their hydrolyzates, copolymers containing propylene and other copolymerizable monomers with a propylene content of 50% or more; polymers of acrylic acid and its esters or amides; polyacrylate resins; polymers of acrylonitrile and/or methacrylonitrile; copolymers containing acrylonitrile monomers and other copolymerizable monomers with a propylene monomer content of 50% or more, i.e. nitrile resins; polyacrylic acid such as nylon-46, nylon-6, nylon-66, nylon-610, nylon-11, nylon-12, nylon-6, nylon-12 copolymers, etc. Amine resins; polyester resins; thermoplastic polyurethane resins; polycarbonate polymers such as poly-4,4'-dioxydiphenyl-2,2'-propane carbonate; thermoplastic polysulfones such as polyether sulfones or polyallyl sulfones; polyoxymethylene resins; polyphenylene ether resins such as poly(2,6-dimethyl-1,4-phenylene) ether; polyphenylene sulfide resins such as polyphenylene sulfide and poly-4,4'-diphenyl sulfide; polyarylate resins; polyetherketone polymers or copolymers; polyketone resins; fluorine resins; polyoxybenzoyl polymers; polyimide resins; polybutadiene resins such as 1,2-polybutadiene and trans-polybutadiene, etc., but not limited to the above. The components (B) may also be bonded with an atomic group containing a polar group such as a hydroxyl group, an epoxy group, an amine group, a carboxylic acid group, or an anhydride group.

可用作上述補強性填充劑(成分(C))之二氧化矽系無機填充劑係將化學式SiO 2作為結構單元之主成分之固體粒子,例如可例舉:二氧化矽、黏土、滑石、高嶺土、雲母、矽灰石、蒙脫石、沸石、玻璃纖維等無機纖維狀物質等,但並不限定於以上。又,亦可使用對表面進行疏水化而成之二氧化矽系無機填充劑、或二氧化矽系無機填充劑與二氧化矽系以外之無機填充劑之混合物。作為二氧化矽系無機填充劑,較佳為二氧化矽及玻璃纖維。作為二氧化矽,可使用被稱為乾式法白碳、濕式法白碳、合成矽酸鹽系白碳、膠體二氧化矽者等。 二氧化矽系無機填充劑較佳為平均粒徑為0.01~150 μm者,二氧化矽系無機填充劑分散於補強性填充劑調配物中,為了充分地發揮其添加效果,平均分散粒徑較佳為0.05~1 μm,更佳為0.05~0.5 μm。 The silica-based inorganic filler that can be used as the above-mentioned reinforcing filler (component (C)) is a solid particle with a chemical formula SiO2 as the main component of the structural unit, and examples thereof include: silica, clay, talc, kaolin, mica, wollastonite, montmorillonite, zeolite, glass fiber and other inorganic fiber-like substances, but are not limited to the above. In addition, a silica-based inorganic filler whose surface is hydrophobized or a mixture of a silica-based inorganic filler and an inorganic filler other than silica-based can also be used. As the silica-based inorganic filler, silica and glass fiber are preferred. As silica, what is called dry white carbon, wet white carbon, synthetic silicate white carbon, colloidal silica, etc. can be used. The silica-based inorganic filler preferably has an average particle size of 0.01 to 150 μm. The silica-based inorganic filler is dispersed in the reinforcing filler formulation. In order to fully exert its addition effect, the average dispersed particle size is preferably 0.05 to 1 μm, and more preferably 0.05 to 0.5 μm.

可用作上述補強性填充劑(成分(C))之金屬氧化物係將化學式MxOy(M為金屬原子,x、y分別為1~6之整數)作為結構單元之主成分之固體粒子,例如可例舉:氧化鋁、氧化鈦、氧化鎂、氧化鋅等。又,作為補強性填充劑,亦可使用金屬氧化物與除金屬氧化物以外之無機填充劑之混合物。 作為用作補強性填充劑之金屬氫氧化物,例如可例舉:氫氧化鋁、氫氧化鎂、氫氧化鋯、水合矽酸鋁、水合矽酸鎂、鹼性碳酸鎂、水滑石、氫氧化鈣、氫氧化鋇、氧化錫之水合物、硼砂等無機金屬化合物之水合物等水合系無機填充材,但並不限定於以上,尤佳為氫氧化鎂與氫氧化鋁。 作為用作補強性填充劑之金屬碳酸化物,例如可例舉碳酸鈣、碳酸鎂等,但並不限定於以上。 又,作為補強性填充劑,例如可使用FT(Fine Thermal,細粒子熱裂法爐黑)、SRF(Semi-reinforcing Furnace,半補強爐黑)、FEF(Fast Extruding Furnace,快壓出爐黑)、HAF(High Abrasion Furnace,高耐磨爐黑)、ISAF(Intermediate Super Abrasion Furnace,中超耐磨爐黑)、SAF(Super Abrasion Furnace,超耐磨爐黑)等各等級之碳黑,尤佳為氮吸附比表面積為50 mg/g以上、且DBP(鄰苯二甲酸二丁酯)吸油量為80 mL/100 g以上之碳黑。 The metal oxide that can be used as the above-mentioned reinforcing filler (component (C)) is a solid particle with a chemical formula of MxOy (M is a metal atom, x and y are integers of 1 to 6 respectively) as the main component of the structural unit, for example: aluminum oxide, titanium oxide, magnesium oxide, zinc oxide, etc. In addition, as a reinforcing filler, a mixture of a metal oxide and an inorganic filler other than the metal oxide can also be used. Examples of metal hydroxides used as reinforcing fillers include aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, hydrated aluminum silicate, hydrated magnesium silicate, alkaline magnesium carbonate, hydrotalcite, calcium hydroxide, barium hydroxide, hydrates of tin oxide, hydrates of inorganic metal compounds such as borax, etc., but are not limited to the above. Magnesium hydroxide and aluminum hydroxide are particularly preferred. Examples of metal carbonates used as reinforcing fillers include calcium carbonate, magnesium carbonate, etc., but are not limited to the above. In addition, as reinforcing fillers, for example, various grades of carbon black such as FT (Fine Thermal), SRF (Semi-reinforcing Furnace), FEF (Fast Extruding Furnace), HAF (High Abrasion Furnace), ISAF (Intermediate Super Abrasion Furnace), and SAF (Super Abrasion Furnace) can be used, and preferably carbon black having a nitrogen adsorption specific surface area of 50 mg/g or more and a DBP (dibutyl phthalate) oil absorption of 80 mL/100 g or more.

於使用本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))之補強性填充劑調配物中,亦可調配矽烷偶合劑(以下,有時記載為成分(D))。 矽烷偶合劑(D)係用以使本實施方式之氫化嵌段共聚物(甲)與上述補強性填充劑(C)之相互作用變得緊密者,係具有對氫化嵌段共聚物(甲)與補強性填充劑(C)中之一者或兩者為親和性或鍵結性之基之化合物。 作為較佳之矽烷偶合劑(D),例如可例舉2個以上之巰基及/或硫與矽烷醇基或烷氧基矽烷一同連結而成之具有多硫鍵者,但並不限定於以上。具體而言,可例舉:雙-[3-(三乙氧基矽烷基)-丙基]-四硫化物、雙-[3-(三乙氧基矽烷基)-丙基]-二硫化物、雙-[2-(三乙氧基矽烷基)-乙基]-四硫化物、3-巰基丙基-三甲氧基矽烷、3-三乙氧基矽烷基丙基-N,N-二甲硫基胺甲醯基四硫化物、3-三乙氧基矽烷基丙基苯并噻唑四硫化物等。 從獲得目標之作用效果之觀點出發,矽烷偶合劑(D)之調配量相對於補強性填充劑調配物較佳為0.1~30質量%,更佳為0.5~20質量%,進而較佳為1~15質量%。 A silane coupling agent (hereinafter sometimes referred to as component (D)) may also be formulated in the reinforcing filler formulation using the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)) of the present embodiment. The silane coupling agent (D) is used to make the interaction between the hydrogenated block copolymer (A) of the present embodiment and the reinforcing filler (C) more intimate, and is a compound having a group having affinity or bonding properties for one or both of the hydrogenated block copolymer (A) and the reinforcing filler (C). As a preferred silane coupling agent (D), for example, there can be cited those having a polysulfide bond formed by linking two or more silyl groups and/or sulfur with a silanol group or an alkoxysilane, but it is not limited to the above. Specifically, there can be cited: bis-[3-(triethoxysilyl)-propyl]-tetrasulfide, bis-[3-(triethoxysilyl)-propyl]-disulfide, bis-[2-(triethoxysilyl)-ethyl]-tetrasulfide, 3-butylpropyl-trimethoxysilane, 3-triethoxysilylpropyl-N,N-dimethylthioaminomethyl tetrasulfide, 3-triethoxysilylpropylbenzothiazole tetrasulfide, etc. From the perspective of achieving the desired effect, the amount of silane coupling agent (D) is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, and even more preferably 1 to 15% by mass relative to the reinforcing filler formulation.

含有本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物與補強性填充劑之補強性填充劑調配物可利用硫化劑進行硫化,即進行交聯而形成為硫化組合物。 作為硫化劑,可例舉:有機過氧化物及偶氮化合物等自由基產生劑、肟化合物、亞硝基化合物、聚胺化合物、硫、硫化合物(一氯化硫、二氯化硫、二硫醚化合物、高分子聚硫化合物等。 硫化劑之使用量通常相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物100質量份為0.01~20質量份,較佳為0.1~15質量份之比率。 作為用作硫化劑之有機過氧化物(以下,有時記載為成分(E)),從臭氣性或焦化穩定性(於各成分之混合時之條件下不會交聯,但於設為交聯反應條件時會迅速交聯之特性)之觀點出發,例如可例舉:2,5-二甲基-2,5-二-(過氧化第三丁基)己烷、2,5-二甲基-2,5-二-(過氧化第三丁基)己炔-3、1,3-雙(過氧化第三丁基異丙基)苯、1,1-雙(過氧化第三丁基)-3,3,5-三甲基環己烷、4,4-雙(過氧化第三丁基)戊酸正丁酯、過氧化二第三丁基作為較佳者,但並不限定於以上。 除上述以外,例如亦可使用過氧化二異丙苯、過氧化苯甲醯、過氧化對氯苯甲醯、過氧化2,4-二氯苯甲醯、過氧化苯甲酸第三丁酯、過氧化苯甲酸第三丁酯、過氧化異丙基碳酸第三丁酯、過氧化二乙醯、過氧化月桂醯、過氧化第三丁基異丙苯基等。 The reinforcing filler formulation containing the hydrogenated block copolymer (A) of the present embodiment or the above-mentioned hydrogenated block copolymer composition and the reinforcing filler can be vulcanized by a vulcanizing agent, that is, crosslinked to form a vulcanized composition. As the vulcanizing agent, free radical generators such as organic peroxides and azo compounds, oxime compounds, nitroso compounds, polyamine compounds, sulfur, sulfur compounds (sulfur monochloride, sulfur dichloride, disulfide compounds, high molecular weight polysulfide compounds, etc.) can be cited. The amount of the vulcanizing agent used is usually 0.01 to 20 parts by mass relative to 100 parts by mass of the hydrogenated block copolymer (A) or the above-mentioned hydrogenated block copolymer composition, preferably 0.1 to 15 parts by mass. As the organic peroxide used as the vulcanizing agent (hereinafter, sometimes described as component (E)), from the viewpoint of odor or scorch stability (the property that it does not crosslink under the conditions when the components are mixed, but crosslinks rapidly under the conditions of crosslinking reaction), for example, 2,5-dimethyl-2,5-di-(tert-butylperoxide)hexane, 2,5-dimethyl-2,5-di-(tert-butylperoxide)hexyne-3, 1,3-bis(tert-butylperoxide isopropyl)benzene, 1,1-bis(tert-butylperoxide)-3,3,5-trimethylcyclohexane, 4,4-bis(tert-butylperoxide) valerate n-butyl, di-tert-butyl peroxide are preferred, but are not limited to the above. In addition to the above, for example, diisopropylbenzene peroxide, benzoyl peroxide, p-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, tert-butyl perbenzoate, tert-butyl perbenzoate, tert-butyl peroxyisopropyl carbonate, diacetyl peroxide, lauryl peroxide, tert-butyl cumyl peroxide, etc. can also be used.

又,硫化時,作為硫化加速劑(以下,有時記載為成分(F)),亦能夠以視需要之量使用亞磺醯胺系、胍系、秋蘭姆系、醛-胺系、醛-氨系、噻唑系、硫脲系、二硫代胺基甲酸酯系化合物等。 又,作為硫化助劑,亦能夠以視需要之量使用鋅白、硬脂酸等。 又,於使用有機過氧化物作為上述硫化劑而使補強性填充劑調配物交聯時,尤其亦可與作為上述硫化劑之有機過氧化物併用如下成分:對醌二肟、對,對'-二苯甲醯醌二肟、N-甲基-N-4-二亞硝基苯胺、亞硝基苯、二苯基胍、三羥甲基丙烷-N,N'-間伸苯基二順丁烯二醯亞胺等過氧化交聯用助劑(以下,有時記載為成分(G));二乙烯苯、氰尿酸三烯丙酯、乙二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、甲基丙烯酸烯丙酯等多官能性甲基丙烯酸酯單體;丁酸乙烯酯、硬脂酸乙烯酯等多官能性乙烯基單體(以下,有時記載為成分(H))等。 此種硫化加速劑(F)、過氧化交聯用助劑(G)、多官能性乙烯基單體(H)通常係相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物(成分(A))100質量份,以較佳為0.01~20質量份、更佳為0.1~15質量份之比率使用。 作為利用硫化劑使補強性填充劑調配物硫化之方法,可應用先前實施之方法,例如於120~200℃,較佳為140~180℃之溫度下硫化。硫化後之補強性填充劑調配物於硫化物之狀態下發揮出耐熱性、耐撓曲性或耐油性。 Furthermore, during vulcanization, as a vulcanization accelerator (hereinafter, sometimes described as component (F)), sulfenamide-based, guanidine-based, thiuram-based, aldehyde-amine-based, aldehyde-ammonia-based, thiazole-based, thiourea-based, dithiocarbamate-based compounds, etc. can also be used in an amount as needed. Furthermore, as a vulcanization aid, zinc white, stearic acid, etc. can also be used in an amount as needed. When an organic peroxide is used as the above-mentioned vulcanizing agent to crosslink the reinforcing filler formulation, the following components can be used together with the organic peroxide as the above-mentioned vulcanizing agent: a peroxide crosslinking auxiliary agent (in the form of trihydroxymethylpropane-N,N'-m-phenylenedibutylene diimide) such as p-quinone dioxime, p-,p-dibenzoylquinone dioxime, N-methyl-N-4-dinitrosoaniline, nitrosobenzene, diphenylguanidine, trihydroxymethylpropane-N,N'-m-phenylenedibutylene diimide, etc. hereinafter, sometimes described as component (G)); multifunctional methacrylate monomers such as divinylbenzene, triallyl cyanurate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, trihydroxymethylpropane trimethacrylate, and allyl methacrylate; multifunctional vinyl monomers such as vinyl butyrate and vinyl stearate (hereinafter, sometimes described as component (H)), etc. Such vulcanization accelerator (F), peroxide crosslinking aid (G), and multifunctional vinyl monomer (H) are usually used in a ratio of preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, relative to 100 parts by mass of the hydrogenated block copolymer (A) or the above-mentioned hydrogenated block copolymer composition (component (A)). As a method of vulcanizing the reinforcing filler formulation using a vulcanizing agent, the previously implemented method can be applied, such as vulcanizing at a temperature of 120 to 200°C, preferably 140 to 180°C. The vulcanized reinforcing filler formulation exhibits heat resistance, flex resistance or oil resistance in the state of a sulfide.

為了改良使用上述本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之補強性填充劑調配物之加工性,亦可進而調配軟化劑(以下,有時記載為成分(I))。即,除了構成氫化嵌段共聚物組合物之軟化劑(丁)以外,可進而以所需之量調配軟化劑。 軟化劑中較適合為礦物油、或液狀或者低分子量之合成軟化劑。其中,通常較佳為用於橡膠之軟化、增容、加工性提高之環烷系及/或石蠟系之加工處理油或增量油。 礦物油系軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 於上述補強性填充劑調配物中可使用合成軟化劑,可使用聚丁烯、低分子量聚丁二烯、液態石蠟等。然而,較佳為上述礦物油系軟化劑。 相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物(成分(A))100質量份,補強性填充劑調配物中之軟化劑(成分(I))之調配量較佳為0~100質量份,更佳為1~90質量份,進而較佳為30~90質量份。若軟化劑之量超過100質量份,則容易產生滲出,有於組合物表面產生黏膩之虞。 In order to improve the processability of the reinforcing filler formulation using the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition of the present embodiment, a softener (hereinafter, sometimes described as component (I)) may be further formulated. That is, in addition to the softener (D) constituting the hydrogenated block copolymer composition, a softener may be further formulated in a required amount. The softener is preferably a mineral oil or a liquid or low molecular weight synthetic softener. Among them, cycloalkane-based and/or wax-based processing oil or extender oil for softening, compatibilizing, and improving processability of rubber is generally preferred. Mineral oil-based softeners are a mixture of aromatic rings, cycloalkane rings and wax chains. The wax chain with carbon numbers accounting for more than 50% of the total carbon is called a wax series, the cycloalkane ring with carbon numbers of 30-45% is called a cycloalkane series, and the aromatic carbon number exceeding 30% is called an aromatic series. Synthetic softeners can be used in the above-mentioned reinforcing filler formulations, such as polybutene, low molecular weight polybutadiene, liquid wax, etc. However, the above-mentioned mineral oil-based softeners are preferred. The amount of the softener (ingredient (I)) in the reinforcing filler formulation is preferably 0 to 100 parts by mass, more preferably 1 to 90 parts by mass, and further preferably 30 to 90 parts by mass relative to 100 parts by mass of the hydrogenated block copolymer (A) or the above-mentioned hydrogenated block copolymer composition (ingredient (A)). If the amount of the softener exceeds 100 parts by mass, it is easy to ooze out and there is a risk of stickiness on the surface of the composition.

包含本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物之補強性填充劑調配物可適宜地用作建築材料、電線被覆材或制振材料等。又,其硫化物利用該特徵而適於輪胎用途或抗振橡膠、皮帶、工業用品、鞋類、發泡體等之材料。The reinforcing filler formulation containing the hydrogenated block copolymer (A) of this embodiment or the above hydrogenated block copolymer composition can be suitably used as a building material, wire sheathing material or vibration damping material, etc. Moreover, its sulfide is suitable for tire use or anti-vibration rubber, belts, industrial products, shoes, foams, etc. by utilizing this characteristic.

(交聯物) 本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物可於硫化劑之存在下交聯,形成為交聯物,即交聯氫化嵌段共聚物或交聯氫化嵌段共聚物組合物。 藉由使本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物交聯,可提高耐熱性[高溫C-Set(compression set,壓縮永久變形)]或耐撓曲性。 於製備含有本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物之上述補強性填充劑調配物之交聯物之情形時,尤其是氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))、與不同於上述烯烴系樹脂(乙)或上述熱塑性樹脂(丙)之熱塑性樹脂及/或橡膠狀聚合物(成分(B))之調配比率以成分(A)/成分(B)之質量比率計,較佳為10/90~100/0,更佳為20/80~90/10,進而較佳為30/70~80/20。 (Crosslinked product) The hydrogenated block copolymer (A) of the present embodiment or the above hydrogenated block copolymer composition can be crosslinked in the presence of a vulcanizing agent to form a crosslinked product, i.e., a crosslinked hydrogenated block copolymer or a crosslinked hydrogenated block copolymer composition. By crosslinking the hydrogenated block copolymer (A) of the present embodiment or the above hydrogenated block copolymer composition, heat resistance [high temperature C-Set (compression set, compression permanent set)] or flexural resistance can be improved. In the case of preparing a crosslinked product of the reinforcing filler formulation containing the hydrogenated block copolymer (A) of the present embodiment or the hydrogenated block copolymer composition, in particular, the blending ratio of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)) and the thermoplastic resin different from the olefinic resin (B) or the thermoplastic resin (C) and/or the rubbery polymer (component (B)) is preferably 10/90 to 100/0, more preferably 20/80 to 90/10, and further preferably 30/70 to 80/20 in terms of the mass ratio of component (A)/component (B).

於使本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物交聯之情形時,交聯方法並無特別限定,較佳為進行所謂「動態交聯」。 動態交聯係藉由使各種調配物於熔融狀態下,於硫化劑反應之溫度條件下混練,同時產生分散與交聯之方法,且詳細地記載於A. Y. Coran等人之文獻(Rub. Chem. and Technol. vol. 53.141 - (1980))中。 動態交聯通常係使用如班布里混合機或加壓式捏合機之密閉式混練機、或單軸或雙軸擠出機等來進行。混練溫度通常為130~300℃,較佳為150~250℃,混練時間通常為1~30分鐘。 作為動態交聯中所使用之硫化劑,可適宜地使用有機過氧化物或酚樹脂交聯劑,其使用量通常相對於氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))100質量份為0.01~15質量份,較佳為0.04~10質量份。 作為用作硫化劑之有機過氧化物,可使用上述成分(E)。於使用有機過氧化物進行交聯時,可使用上述成分(F)作為硫化加速劑,又,亦可併用上述成分(G):過氧化交聯用助劑或上述成分(H):多官能性乙烯基單體等。該等硫化加速劑之使用量通常相對於氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))100質量份為0.01~20質量份,較佳為0.1~15質量份。 When the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition of the present embodiment is crosslinked, the crosslinking method is not particularly limited, and it is preferred to perform so-called "dynamic crosslinking". Dynamic crosslinking is a method of simultaneously dispersing and crosslinking various formulations by kneading them in a molten state under the temperature conditions of the vulcanizing agent reaction, and is described in detail in the literature of A. Y. Coran et al. (Rub. Chem. and Technol. vol. 53.141 - (1980)). Dynamic crosslinking is usually performed using a closed mixer such as a Banbury mixer or a pressure kneading machine, or a single-screw or double-screw extruder. The kneading temperature is usually 130 to 300°C, preferably 150 to 250°C, and the kneading time is usually 1 to 30 minutes. As the vulcanizing agent used in the dynamic crosslinking, an organic peroxide or a phenolic resin crosslinking agent can be suitably used, and the amount used is usually 0.01 to 15 parts by mass, preferably 0.04 to 10 parts by mass, relative to 100 parts by mass of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)). As the organic peroxide used as the vulcanizing agent, the above-mentioned component (E) can be used. When the organic peroxide is used for crosslinking, the above-mentioned component (F) can be used as a vulcanization accelerator, and the above-mentioned component (G): a peroxide crosslinking aid or the above-mentioned component (H): a multifunctional vinyl monomer, etc. can also be used in combination. The amount of such vulcanization accelerators used is usually 0.01 to 20 parts by mass, preferably 0.1 to 15 parts by mass, relative to 100 parts by mass of the hydrogenated block copolymer or hydrogenated block copolymer composition (component (A)).

於使用本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))之交聯物中,可於不損害其目的之範圍內視需要調配軟化劑、耐熱穩定劑、防靜電劑、耐候穩定劑、抗老化劑、填充劑、著色劑、潤滑劑等添加物。作為為了控制最終製品之硬度或流動性所調配之軟化劑,可使用上述橡膠用軟化劑(I)。 軟化劑可於混練各成分時添加,亦可於氫化嵌段共聚物(甲)之製造時預先使其包含於上述氫化嵌段共聚物中,即製備充油橡膠。 製備上述交聯物時之軟化劑之添加量相對於氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))100質量份,通常為0~200質量份,較佳為10~150質量份,更佳為20~100質量份。 又,作為填充劑,可使用上述作為補強性填充劑之成分(C)。相對於氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))100質量份,填充劑之添加量通常為0~200質量份,較佳為10~150質量份,更佳為20~100質量份。 上述交聯物較佳為以凝膠含量(其中,不含無機填充劑等不溶物等不溶成分)較佳為成為5~80質量%、更佳為成為10~70質量%、進而較佳為成為20~60質量%之方式進行動態交聯。關於凝膠含量,使用沸騰二甲苯利用索氏萃取器使交聯物1 g進行10小時回流,利用80目之金屬篩網對殘留物進行過濾,測定殘留於篩網上之不溶物之乾燥質量(g)而求出之不溶物相對於試樣1 g之比率(質量%),將該比率(質量%)設為凝膠含量。凝膠含量可藉由調整硫化劑之種類或量、硫化時之條件(溫度、滯留時間、佔有率等)而加以控制。 上述交聯物可與上述補強性填充劑調配物之硫化物同樣地用於輪胎用途或抗振橡膠、皮帶、工業用品、鞋類、發泡體等,進而亦可用作醫療用器具材料或食品包裝材料。 In the crosslinked product of the hydrogenated block copolymer or hydrogenated block copolymer composition (component (A)) using the present embodiment, additives such as softeners, heat stabilizers, antistatic agents, weather stabilizers, anti-aging agents, fillers, colorants, lubricants, etc. may be formulated as needed within the scope that does not impair its purpose. As a softener formulated to control the hardness or fluidity of the final product, the above-mentioned rubber softener (I) can be used. The softener can be added when the components are mixed, or it can be included in the above-mentioned hydrogenated block copolymer in advance when the hydrogenated block copolymer (A) is produced, that is, to prepare an oil-extended rubber. The amount of the softener added when preparing the crosslinked product is usually 0 to 200 parts by mass, preferably 10 to 150 parts by mass, and more preferably 20 to 100 parts by mass relative to 100 parts by mass of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)). In addition, as a filler, the above-mentioned component (C) as a reinforcing filler can be used. The amount of the filler added is usually 0 to 200 parts by mass, preferably 10 to 150 parts by mass, and more preferably 20 to 100 parts by mass relative to 100 parts by mass of the hydrogenated block copolymer or the hydrogenated block copolymer composition (component (A)). The crosslinked product is preferably dynamically crosslinked in a manner such that the gel content (excluding insoluble components such as inorganic fillers) is preferably 5 to 80 mass%, more preferably 10 to 70 mass%, and further preferably 20 to 60 mass%. Regarding the gel content, 1 g of the crosslinked product is refluxed for 10 hours using a Soxhlet extractor with boiling xylene, and the residue is filtered using an 80-mesh metal sieve. The dry mass (g) of the insoluble matter remaining on the sieve is measured to determine the ratio (mass %) of the insoluble matter relative to 1 g of the sample, and the ratio (mass %) is set as the gel content. The gel content can be controlled by adjusting the type or amount of the vulcanizing agent, the conditions during vulcanization (temperature, residence time, occupancy, etc.). The crosslinked product can be used for tire applications or anti-vibration rubber, belts, industrial products, shoes, foams, etc. in the same way as the sulfide of the reinforcing filler formulation, and can also be used as a medical device material or food packaging material.

[使用氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之成形體] 本實施方式之成形體為本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之成形體,可藉由使上述本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物成形所獲得。 上述成形體例如可藉由擠出成形、射出成形、雙色射出成形、夾層成形、中空成形、壓縮成形、真空成形、旋轉成形、粉末凝塑成形、發泡成形、積層成形、壓延成形、吹塑成形等而製造。 作為上述成形體,例如可例舉:片材、膜、各種形狀之射出成形體、中空成形體、壓空成形體、真空成形體、擠出成形體、發泡成形體、不織布或纖維狀之成形體、合成皮革等多種多樣之成形體,但並不限定於以上。 該等成形體例如可用於汽車用零件、食品包裝材料、醫療器具、家電製品構件、電子元件構件、建築材料、工業零件、家庭用品、玩具素材、鞋類用素材、纖維素材等。 [Molded article using hydrogenated block copolymer (A) or hydrogenated block copolymer composition] The molded article of the present embodiment is a molded article of the hydrogenated block copolymer (A) or hydrogenated block copolymer composition of the present embodiment, which can be obtained by molding the hydrogenated block copolymer (A) of the present embodiment or the hydrogenated block copolymer composition. The molded article can be manufactured, for example, by extrusion molding, injection molding, two-color injection molding, sandwich molding, hollow molding, compression molding, vacuum molding, rotation molding, powder slurry molding, foam molding, lamination molding, calendering molding, blow molding, etc. Examples of the above-mentioned molded bodies include sheets, films, injection molded bodies of various shapes, hollow molded bodies, pressurized molded bodies, vacuum molded bodies, extruded molded bodies, foamed molded bodies, non-woven fabrics or fiber-shaped molded bodies, synthetic leather, and many other molded bodies, but are not limited to the above. Such molded bodies can be used, for example, for automobile parts, food packaging materials, medical equipment, home appliance components, electronic component components, building materials, industrial parts, household goods, toy materials, shoe materials, fiber materials, etc.

作為汽車用零件,例如可例舉:側飾條、墊圈、換擋把頭、密封條、窗框與其密封材、扶手、輔助握把、車門拉手、手柄、控制台盒、頭枕、儀錶板、保險桿、擾流板、氣囊蓋等,但並不限定於以上。 作為醫療器具,例如可例舉:醫療用管(tube)、醫療用軟管(hose)、導管、採血袋、輸液袋、血小板保存袋、人工透析用袋等,但並不限定於以上。 作為建築材料,例如可例舉壁材、地板材等,但並不限定於以上。 除此以外,並無特別限定,例如可例舉:工業用軟管、食品用軟管、吸塵器軟管、電冰箱密封件、電線及其他各種被覆材、握把用被覆材、軟質玩偶等。 亦可對上述成形體適當實施發泡、粉末、延伸、接著、印刷、塗裝、鍍覆等加工。 本實施方式之氫化嵌段共聚物(甲)及上述氫化嵌段共聚物組合物表現出柔軟性、低反跳彈性、透明性、耐扭結性優異之效果,故作為軟管、管等中空狀成形體之材料極有用。 As automotive parts, for example, side trims, gaskets, shift knobs, weather strips, window frames and their sealing materials, armrests, auxiliary grips, door handles, handles, console boxes, headrests, dashboards, bumpers, spoilers, airbag covers, etc. can be cited, but are not limited to the above. As medical equipment, for example, medical tubes, medical hoses, catheters, blood collection bags, infusion bags, platelet storage bags, artificial dialysis bags, etc. can be cited, but are not limited to the above. As building materials, for example, wall materials, floor materials, etc. can be cited, but are not limited to the above. In addition, there is no particular limitation, for example: industrial hoses, food hoses, vacuum cleaner hoses, refrigerator seals, wires and other various covering materials, handle covering materials, soft dolls, etc. The above-mentioned molded body can also be appropriately processed by foaming, powdering, stretching, bonding, printing, painting, coating, etc. The hydrogenated block copolymer (A) of this embodiment and the above-mentioned hydrogenated block copolymer composition show excellent effects of softness, low rebound elasticity, transparency, and kink resistance, so it is very useful as a material for hollow molded bodies such as hoses and tubes.

其次,對使用本實施方式之氫化嵌段共聚物(甲)、氫化嵌段共聚物組合物之成形體,按目的分成[第一成形體]~[第三成形體]進行說明。Next, molded products using the hydrogenated block copolymer (A) and the hydrogenated block copolymer composition according to the present embodiment will be described by being divided into [first molded product] to [third molded product] according to the purpose.

[第一成形體] 作為使用本實施方式之氫化嵌段共聚物(甲)之成形體之第一態樣,可例舉實質上僅包含氫化嵌段共聚物(甲)之成形體。 「實質上僅包含氫化嵌段共聚物(甲)」係構成成形體之聚合物僅為氫化嵌段共聚物(甲)之主旨,且不為排除含有下述各種添加劑之主旨。又,不排除於不損害氫化嵌段共聚物(甲)之功能之範圍內,添加其他聚合物之態樣。可容許之其他聚合物之添加量亦取決於聚合物之結構或用途,例如於和聚丙烯等聚烯烴之樹脂組合物之情形時,大致為5質量%以下。若為與其他彈性體之樹脂組合物,則雖然亦取決於上述其他彈性體之結構,但其添加量可容許至80質量%以下。 第一成形體除適於醫療用途等中所使用之透明之管、袋以外,亦可用作構成用於保護膜之黏著性膜之黏著層,但第一成形體並不限定於上述。 [First molded body] As a first aspect of a molded body using the hydrogenated block copolymer (A) of the present embodiment, a molded body substantially containing only the hydrogenated block copolymer (A) can be exemplified. “Substantially containing only the hydrogenated block copolymer (A)” means that the polymer constituting the molded body is only the hydrogenated block copolymer (A), and does not exclude the inclusion of the various additives described below. Furthermore, it does not exclude the aspect of adding other polymers within the scope that does not impair the function of the hydrogenated block copolymer (A). The allowable amount of other polymers to be added also depends on the structure or use of the polymer. For example, in the case of a resin composition with a polyolefin such as polypropylene, it is generally less than 5% by mass. If it is a resin composition with other elastomers, the amount of addition can be allowed to be less than 80% by mass, although it also depends on the structure of the above-mentioned other elastomers. In addition to being suitable for transparent tubes and bags used in medical purposes, the first molded body can also be used as an adhesive layer constituting an adhesive film for a protective film, but the first molded body is not limited to the above.

(管) 使用本實施方式之氫化嵌段共聚物(甲)之管之透明性、柔軟性、耐扭結性、溶劑接著性、及各特性之平衡優異。 於無損本實施方式之目的之範圍內,管除了本實施方式之氫化嵌段共聚物(甲)以外,亦可進而含有其他成分。作為其他成分,例如可例舉:不同於氫化嵌段共聚物(甲)之結構之氫化共聚物(苯乙烯系熱塑性彈性體)、熱穩定劑、抗氧化劑、紫外線吸收劑、抗老化劑、塑化劑、光穩定劑、結晶成核劑、衝擊改良劑、顏料、潤滑劑、軟化劑、防靜電劑、分散劑、阻燃劑、防銅害劑、交聯劑、阻燃助劑、相容劑、及黏著性賦予劑等,但並不限定於以上。該等其他成分可僅使用一種,亦可組合使用兩種以上。 (Tube) The tube using the hydrogenated block copolymer (A) of this embodiment has excellent transparency, flexibility, kink resistance, solvent adhesion, and balance of various properties. The tube may further contain other components in addition to the hydrogenated block copolymer (A) of this embodiment within the scope of not impairing the purpose of this embodiment. As other components, for example, hydrogenated copolymers (styrene-based thermoplastic elastomers) having a structure different from that of hydrogenated block copolymer (A), heat stabilizers, antioxidants, ultraviolet absorbers, anti-aging agents, plasticizers, light stabilizers, crystallization nucleating agents, impact modifiers, pigments, lubricants, softeners, antistatic agents, dispersants, flame retardants, copper anti-pollution agents, crosslinking agents, flame retardant aids, compatibilizers, and adhesion agents, but are not limited to the above. These other components may be used alone or in combination of two or more.

<潤滑劑> 上述管為了防止管表面彼此或內部彼此之固著,及使手感等質感變得良好,可含有潤滑劑。 作為潤滑劑,較佳為選自脂肪醯胺系潤滑劑、硬脂酸金屬鹽系潤滑劑、及脂肪酸單甘油酯系潤滑劑中之至少一種(較佳為至少兩種)之潤滑劑。 作為脂肪醯胺系潤滑劑,例如可例舉:芥酸醯胺、山萮醯胺、油醯胺、硬脂醯胺、N-硬脂基月桂醯胺、N-硬脂基硬脂醯胺、N-硬脂基山萮醯胺、N-硬脂基芥酸醯胺、N-油基油醯胺、N-油基山萮醯胺、N-月桂基芥酸醯胺、伸乙基雙油醯胺、伸乙基雙硬脂醯胺、六亞甲基雙油醯胺、六亞甲基雙芥酸醯胺等,但並不限定於以上。該等之中,較佳為芥酸醯胺、山萮醯胺、油醯胺、硬脂醯胺、及伸乙基雙硬脂醯胺,更佳為油醯胺。 作為硬脂酸金屬鹽系潤滑劑之金屬種,例如可例舉:鋅、鈉、鈣、鎂、鋰等。該等之中,較佳為硬脂酸鋅。 作為脂肪酸單甘油酯系潤滑劑,例如可例舉:月桂酸單甘油酯、肉豆蔻酸單甘油酯、棕櫚酸單甘油酯、硬脂酸單甘油酯、油酸單甘油酯、山萮酸單甘油酯等,但並不限定於以上。該等之中,較佳為硬脂酸單甘油酯。 從防止固著之觀點出發,上述管中之潤滑劑之含量較佳為0.05質量%以上,從避免潤滑劑自管內滲出而對向管表面之印刷性帶來影響之觀點出發,較佳為1.0質量%以下,更佳為0.7質量%以下。從該等觀點出發,上述管中之潤滑劑之含量較佳為0.05~1.0質量%,更佳為0.05~0.7質量%之範圍內。 脂肪醯胺系潤滑劑、硬脂酸金屬鹽系潤滑劑、及脂肪酸單甘油酯系潤滑劑分別可僅單獨使用一種,亦可併用兩種以上。其中,較佳為併用芥酸醯胺、硬脂酸鋅、及伸乙基雙硬脂醯胺,質量比較佳為芥酸醯胺/硬脂酸鋅/伸乙基雙硬脂醯胺=0.20/0.15/0.15。 <Lubricant> The above-mentioned tube may contain a lubricant to prevent the tube surfaces or the inside from sticking to each other and to improve the texture such as the hand feel. As the lubricant, at least one (preferably at least two) lubricants selected from fatty amide lubricants, stearic acid metal salt lubricants, and fatty acid monoglyceride lubricants are preferred. Examples of the fatty amide lubricant include erucic acid amide, behenyl amide, oleyl amide, stearyl amide, N-stearyl lauryl amide, N-stearyl stearyl amide, N-stearyl behenyl amide, N-stearyl erucic acid amide, N-oleyl oleyl amide, N-oleyl behenyl amide, N-lauryl erucic acid amide, ethylene dioleyl amide, ethylene distearyl amide, hexamethylene dioleyl amide, hexamethylene dierucic acid amide, etc., but the present invention is not limited to the above. Among them, erucic acid amide, behenyl amide, oleyl amide, stearyl amide, and ethyl distearate amide are preferred, and oleyl amide is more preferred. As metal species of stearic acid metal salt lubricants, for example, zinc, sodium, calcium, magnesium, lithium, etc. can be cited. Among them, zinc stearate is preferred. As fatty acid monoglyceride lubricants, for example, lauric acid monoglyceride, myristic acid monoglyceride, palmitic acid monoglyceride, stearic acid monoglyceride, oleic acid monoglyceride, behenic acid monoglyceride, etc. can be cited, but are not limited to the above. Among them, stearic acid monoglyceride is preferred. From the perspective of preventing sticking, the lubricant content in the tube is preferably 0.05% by mass or more, and from the perspective of avoiding the lubricant from seeping out of the tube and affecting the printability of the tube surface, it is preferably 1.0% by mass or less, and more preferably 0.7% by mass or less. From these perspectives, the lubricant content in the tube is preferably 0.05-1.0% by mass, and more preferably 0.05-0.7% by mass. The fatty amide lubricant, the metal stearate lubricant, and the fatty acid monoglyceride lubricant can be used alone or in combination of two or more. Among them, it is better to use erucic acid amide, zinc stearate, and ethyl distearate together, and the best mass ratio is erucic acid amide/zinc stearate/ethyl distearate = 0.20/0.15/0.15.

<軟化劑> 上述管可含有軟化劑。 作為軟化劑,例如可例舉:石蠟系油、環烷系油、芳香族系油、固體石蠟(paraffin wax)、液態石蠟、白礦物油、植物系軟化劑等,但並不限定於以上。該等之中,從低溫特性或耐滲出性等觀點出發,更佳為石蠟系油、液態石蠟、白礦物油。 軟化劑於40℃下之動黏度較佳為500 mm 2/sec以下。軟化劑於40℃下之動黏度之下限值並無特別限定,較佳為10 mm 2/sec。若軟化劑於40℃下之動黏度為500 mm 2/sec以下,則有上述管之流動性進一步提高,成形加工性進一步提高之傾向。軟化劑之動黏度可藉由使用玻璃製毛細管式黏度計進行試驗之方法等加以測定。 <Softener> The tube may contain a softener. Examples of the softener include, but are not limited to, paraffin oil, cycloparaffin oil, aromatic oil, solid paraffin, liquid paraffin, white mineral oil, and plant-based softeners. Among these, paraffin oil, liquid paraffin, and white mineral oil are more preferred from the viewpoint of low temperature characteristics and anti-bleeding properties. The kinematic viscosity of the softener at 40°C is preferably 500 mm 2 /sec or less. The lower limit of the kinematic viscosity of the softener at 40°C is not particularly limited, but is preferably 10 mm 2 /sec. If the kinematic viscosity of the softener at 40°C is 500 mm 2 /sec or less, the fluidity of the tube mentioned above tends to be further improved, and the molding processability tends to be further improved. The kinematic viscosity of the softener can be measured by a test method using a glass capillary viscometer.

<黏著賦予劑> 管亦可含有黏著賦予劑。 作為黏著賦予劑,例如可例舉:苯并呋喃-茚樹脂、對第三丁基苯酚-乙炔樹脂、苯酚-甲醛樹脂、二甲苯-甲醛樹脂、萜烯樹脂、氫化萜烯樹脂、萜烯-酚樹脂、芳香族系烴樹脂、脂肪族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族/脂環族系石油樹脂、脂肪族/芳香族系烴樹脂、氫化改性脂環族系烴樹脂、氫化脂環族系烴樹脂、烴系黏著化樹脂、聚丁烯、液狀聚丁二烯、順-1,4-聚異戊二烯橡膠、氫化聚異戊二烯橡膠、液狀聚異戊二烯橡膠、松脂系樹脂等,但並不限定於以上。 <Adhesive agent> The tube may contain an adhesive agent. Examples of adhesive agents include benzofuran-indene resins, p-tert-butylphenol-acetylene resins, phenol-formaldehyde resins, xylene-formaldehyde resins, terpene resins, hydrogenated terpene resins, terpene-phenol resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aliphatic/alicyclic hydrocarbon resins, Oil resins, aliphatic/aromatic hydrocarbon resins, hydrogenated modified alicyclic hydrocarbon resins, hydrogenated alicyclic hydrocarbon resins, hydrocarbon adhesive resins, polybutene, liquid polybutadiene, cis-1,4-polyisoprene rubber, hydrogenated polyisoprene rubber, liquid polyisoprene rubber, rosin resins, etc., but not limited to the above.

<管之製造方法> [構成管之材料之製造方法] 構成管之材料例如可適當選擇本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分,藉由將該等乾摻之方法;利用供於通常之高分子物質之混合之裝置混合之方法等而製備。 作為混合裝置,並無特別限定,例如可例舉:班布里混合機、Laboplastomill、單軸擠出機、雙軸擠出機等混練裝置,從生產性、優良混練性之觀點出發,較佳為藉由使用擠出機之熔融混合法來製造。 混練時之熔融溫度可適當設定,通常為130~300℃之範圍內,較佳為150~250℃之範圍。 <Method for manufacturing tube> [Method for manufacturing tube-forming material] The tube-forming material can be prepared by, for example, appropriately selecting the hydrogenated block copolymer (A) of the present embodiment and other components added as needed, by a method of dry-mixing the components; by a method of mixing using a device for mixing conventional polymer materials, etc. The mixing device is not particularly limited, and examples thereof include: a Banbury mixer, a Laboplastomill, a single-screw extruder, a double-screw extruder and other kneading devices. From the viewpoint of productivity and good kneading properties, it is preferably manufactured by a melt mixing method using an extruder. The melting temperature during kneading can be appropriately set, and is usually in the range of 130 to 300°C, and preferably in the range of 150 to 250°C.

[管之成形方法] 作為管之成形方法,並無特別限定,例如可例舉如下方法:適當選擇本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分,投入至擠出機中而使其熔融,將其通入至模具中而形成為管狀,並進行水冷或空氣冷卻而製成管。作為擠出機,可使用單軸或多軸擠出機,又,亦可將多層管成形,該多層管係使用複數台擠出機進行多層擠出而成。 管之形狀並無特別限定,通常使用圓形、橢圓形等管。管之粗細並無特別限定,例如以外徑計較佳為1~50 mm者,更佳為2~30 mm者,進而較佳為3~20 mm者。又,管之厚度較佳為0.3~30 mm者,更佳為0.4~20 mm者,進而較佳為0.5~10 mm者。 [Tube forming method] There is no particular limitation on the tube forming method, and for example, the following method can be cited: the hydrogenated block copolymer (A) of the present embodiment and other components added as needed are appropriately selected, put into an extruder to be melted, passed into a mold to be formed into a tube, and water-cooled or air-cooled to form a tube. As an extruder, a single-axis or multi-axis extruder can be used, and a multi-layer tube can also be formed, which is formed by extruding multiple layers using multiple extruders. There is no particular limitation on the shape of the tube, and generally circular, elliptical, etc. tubes are used. There is no particular limitation on the thickness of the tube, and for example, the outer diameter is preferably 1 to 50 mm, more preferably 2 to 30 mm, and further preferably 3 to 20 mm. Furthermore, the thickness of the tube is preferably 0.3 to 30 mm, more preferably 0.4 to 20 mm, and even more preferably 0.5 to 10 mm.

管亦可於不阻礙本實施方式之目的之範圍內積層其他聚合物而製成多層管。上述其他聚合物可單獨使用一種,或者組合使用兩種以上,以單層或每層之種類可不同之多層進行積層而使用。進而,藉由多層化,適當地選擇不同之2種以上之聚合物,藉此可獲得根據部位而硬度不同,儘管如此不具有接縫之管。作為上述多層結構之管之包含上述聚合物的層根據所賦予之所需性能,可位於最內層、中間層、最外層中之任一者。The tube may also be made into a multilayer tube by layering other polymers within the scope that does not hinder the purpose of the present embodiment. The above-mentioned other polymers may be used alone or in combination of two or more, and may be layered in a single layer or multiple layers in which the types of each layer may be different. Furthermore, by multi-layering, by appropriately selecting two or more different polymers, a tube having different hardness depending on the location can be obtained, although it has no seams. The layer containing the above-mentioned polymers in the tube having the above-mentioned multi-layer structure may be located in any of the innermost layer, the middle layer, and the outermost layer, depending on the required performance to be given.

於上述管中,從進而抑制壁厚之增加而維持柔軟性,其後提高耐壓性等之觀點出發,可捲繞編織補強線或螺旋補強體而製成耐壓管(軟管)。 編織補強線設置於厚度方向之內部或層間,可使用維尼綸、聚醯胺、聚酯、芳族聚醯胺纖維、碳纖維、金屬線等,螺旋補強體設置於外周,可使用金屬、塑膠等。 In the above-mentioned tube, from the viewpoint of further suppressing the increase of wall thickness and maintaining flexibility, and then improving pressure resistance, a braided reinforcing wire or a spiral reinforcing body can be wound to make a pressure-resistant tube (hose). The braided reinforcing wire is set inside or between layers in the thickness direction, and can use vinyl, polyamide, polyester, aromatic polyamide fiber, carbon fiber, metal wire, etc. The spiral reinforcing body is set on the periphery and can use metal, plastic, etc.

上述管能夠以高度之水準使優異之透明性、柔軟性、耐扭結性、溶劑接著性、及各特性之平衡變得良好,尤其可不限定用途地使用。 可有效利用上述特性而用於家電用品用途、汽車內外裝零件用途、日用品、娛樂用品、玩具、工業用品、食品製造設備用途、醫療用途、飲用水用途等較廣泛之用途。該等之中,上述管可尤其適宜地用作醫療用途。例如亦可適宜地用作輸液裝置(infusion set)用管、經腸營養裝置用管、延長管、藥劑投予管、血液迴路用管、營養管、連結管、附葉片之靜脈針用管、進而,吸引用導管、排液用導管、經腸營養導管、胃管導管、藥液投予導管、腹膜透析用管、血液導管及氣球導管、尿道導管等。 The above-mentioned tube can achieve excellent transparency, flexibility, kink resistance, solvent adhesion, and a good balance of various characteristics at a high level, and can be used without limiting the purpose. The above-mentioned characteristics can be effectively utilized for a wide range of uses such as home appliances, automotive interior and exterior parts, daily necessities, entertainment products, toys, industrial products, food manufacturing equipment, medical uses, drinking water uses, etc. Among them, the above-mentioned tube can be particularly suitable for medical use. For example, it can also be suitably used as a tube for an infusion set, a tube for a transintestinal nutrition set, an extension tube, a drug administration tube, a blood circuit tube, a nutrition tube, a connecting tube, a bladed intravenous needle tube, and further, a suction catheter, a drainage catheter, a transintestinal nutrition catheter, a gastric tube catheter, a drug administration catheter, a peritoneal dialysis tube, a blood catheter, a balloon catheter, a urethral catheter, etc.

(黏著性膜) 黏著性膜具備:基材膜;及黏著層,其配置於上述基材膜上,包含本實施方式之氫化嵌段共聚物(甲),且初始黏著性、黏著亢進性及卷出性、其等各種性能平衡優異。 於黏著性膜之黏著層中亦可含有黏著賦予劑。 作為黏著賦予劑,只要為可對黏著層賦予黏性之樹脂,則並無特別限定,例如可例舉:氫化萜烯樹脂、松脂系萜烯系樹脂、氫化松脂萜烯系樹脂、芳香族改性氫化萜烯樹脂、苯并呋喃系樹脂、酚系樹脂、萜酚系樹脂、氫化萜酚樹脂、芳香族烴樹脂、脂肪族烴樹脂等公知之黏著賦予樹脂。尤佳為氫化萜烯樹脂、芳香族改性氫化萜烯樹脂、氫化萜酚樹脂、及萜酚樹脂。 黏著賦予劑可僅單獨使用一種,亦可混合使用兩種以上。 作為黏著賦予劑,例如可使用「橡膠、塑膠調配藥品」(Rubber Digest公司編)中所記載者。藉由使用黏著賦予劑,可謀求改良黏著力。黏著層中之黏著賦予劑之含量於黏著層中較佳為0.5~50質量%,更佳為5~45質量%,進而較佳為10~30質量%。若黏著層中之黏著賦予劑之含量為50質量%以下,則有可有效地防止黏著亢進,可進一步減少剝離時之糊劑殘留量之傾向。若為0.5質量%以上,則可有獲得適度之黏著力之傾向。 (Adhesive film) The adhesive film comprises: a substrate film; and an adhesive layer, which is disposed on the substrate film and comprises the hydrogenated block copolymer (A) of the present embodiment, and has excellent balance among various properties such as initial adhesion, adhesion enhancement and roll-out properties. The adhesive layer of the adhesive film may also contain an adhesive imparting agent. As the adhesive imparting agent, there is no particular limitation as long as it is a resin that can impart adhesiveness to the adhesive layer. Examples thereof include: hydrogenated terpene resins, rosin-based terpene resins, hydrogenated rosin-based terpene resins, aromatic modified hydrogenated terpene resins, benzofuran-based resins, phenolic resins, terpene-phenolic resins, hydrogenated terpene-phenol resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins, and other known adhesive imparting resins. Particularly preferred are hydrogenated terpene resins, aromatic modified hydrogenated terpene resins, hydrogenated terpene-phenol resins, and terpene-phenol resins. Adhesives may be used alone or in combination of two or more. As adhesives, for example, those described in "Rubber and Plastic Compounding Chemicals" (Rubber Digest, Inc.) may be used. By using adhesives, it is possible to improve adhesion. The content of the adhesive in the adhesive layer is preferably 0.5 to 50% by mass, more preferably 5 to 45% by mass, and further preferably 10 to 30% by mass. If the content of the adhesive in the adhesive layer is 50% by mass or less, it is effective to prevent hyperadhesion and tends to further reduce the amount of paste residue during peeling. If it is 0.5% by mass or more, there is a tendency to obtain moderate adhesion.

<基材膜> 作為基材膜之材料,並無特別限定,可使用非極性樹脂及極性樹脂中之任一種。從性能或價格方面等出發,作為非極性樹脂,可例舉聚乙烯、均聚聚丙烯或嵌段聚丙烯作為較佳者,作為極性樹脂,可例舉聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂、聚醯胺系樹脂、乙烯-乙酸乙烯酯共聚物及其水解物等作為較佳者。 基材膜之厚度較佳為1 mm以下,更佳為300 μm以下,進而較佳為10~200 μm。若基材膜之厚度為10 μm以上,則可充分地進行被接著體之保護,若基材膜之厚度為1 mm以下,則可獲得實用上良好之彈性模數,可獲得良好之凹凸追隨性,可有效地防止隆起或剝離。 <Base film> The material of the base film is not particularly limited, and any non-polar resin or polar resin can be used. From the perspective of performance or price, polyethylene, homopolypropylene or block polypropylene can be exemplified as a non-polar resin, and polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyamide resins, ethylene-vinyl acetate copolymers and their hydrolyzates can be exemplified as polar resins. The thickness of the base film is preferably 1 mm or less, more preferably 300 μm or less, and further preferably 10 to 200 μm. If the thickness of the substrate film is 10 μm or more, the adherend can be adequately protected. If the thickness of the substrate film is 1 mm or less, a good elastic modulus can be obtained in practice, good uneven tracking performance can be obtained, and bulging or peeling can be effectively prevented.

<黏著層> 黏著性膜於上述基材膜上具有包含本實施方式之氫化嵌段共聚物(甲)之黏著層。於該黏著層中亦可含有下述其他材料。 <Adhesive layer> The adhesive film has an adhesive layer containing the hydrogenated block copolymer (A) of this embodiment on the above-mentioned base film. The adhesive layer may also contain the following other materials.

[黏著層中之其他材料] <氫化苯乙烯系彈性體> 黏著性膜之黏著層亦可進而含有氫化苯乙烯系彈性體。 作為氫化苯乙烯系彈性體,例如可例舉:苯乙烯-丁二烯-苯乙烯(SBS)、苯乙烯-異戊二烯-苯乙烯(SIS)、苯乙烯-丁二烯無規聚合物(SBR)、藉由氫化使SBS飽和而成之苯乙烯-乙烯-丁烯-苯乙烯(SEBS)、苯乙烯-乙烯-丙烯-苯乙烯(SEPS)作為代表性氫化苯乙烯系彈性體,但並不限定於以上,除此以外,亦可為苯乙烯-乙烯-丁烯(SEB)、苯乙烯-乙烯-丙烯(SEP)、苯乙烯-異丁烯-苯乙烯三嵌段共聚物(SIBS)等結構之彈性體。 又,作為上述氫化苯乙烯系彈性體,亦可使用賦予了各種官能基之反應性彈性體。作為上述官能基,例如可例舉:羥基、羧基、羰基、硫代羰基、醯鹵化物基、酸酐基、硫代羧酸基、醛基、硫代醛基、羧酸酯基、醯胺基、磺酸基、磺酸酯基、磷酸基、磷酸酯基、胺基、亞胺基、腈基、吡啶基、喹啉基、環氧基、硫代環氧基、硫基、異氰酸基、異硫氰酸基、鹵化矽基、烷氧基矽基、鹵化錫基、硼酸基、含硼之基、硼酸鹽基、烷氧基錫基、苯基錫基,但並不限定於以上。 [Other materials in the adhesive layer] <Hydrogenated styrene elastomer> The adhesive layer of the adhesive film may further contain a hydrogenated styrene elastomer. As hydrogenated styrene elastomers, for example, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-butadiene random polymer (SBR), styrene-ethylene-butylene-styrene (SEBS) obtained by saturating SBS by hydrogenation, and styrene-ethylene-propylene-styrene (SEPS) are representative hydrogenated styrene elastomers, but are not limited to the above. In addition, elastomers having structures such as styrene-ethylene-butylene (SEB), styrene-ethylene-propylene (SEP), and styrene-isobutylene-styrene triblock copolymer (SIBS) may be cited. Furthermore, as the above-mentioned hydrogenated styrene-based elastomer, a reactive elastomer to which various functional groups are imparted can also be used. Examples of the above-mentioned functional groups include: hydroxyl group, carboxyl group, carbonyl group, thiocarbonyl group, acyl halide group, acid anhydride group, thiocarboxylic acid group, aldehyde group, thioaldehyde group, carboxylate group, amide group, sulfonic acid group, sulfonate group, phosphoric acid group, phosphoric acid ester group, amino group, imino group, nitrile group, pyridine group, quinoline group, epoxy group, thioepoxy group, sulfide group, isocyanate group, isothiocyanate group, silyl halide group, alkoxysilyl group, tin halide group, boric acid group, boron-containing group, borate group, alkoxytin group, phenyltin group, but are not limited to the above.

<烯烴系樹脂、烯烴系彈性體> 黏著性膜之黏著層亦可進而含有烯烴系樹脂、烯烴系彈性體。 作為烯烴系樹脂、烯烴系彈性體,可例舉:碳數2~20之α-烯烴聚合物或共聚物、乙烯與不飽和羧酸或不飽和羧酸酯之共聚物。 具體而言,可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-1-己烯共聚物、乙烯-4-甲基戊烯共聚物、乙烯-1-辛烯共聚物、丙烯均聚物、丙烯-乙烯共聚物、丙烯-乙烯-1-丁烯共聚物、1-丁烯均聚物、1-丁烯-乙烯共聚物、1-丁烯-丙烯共聚物、4-甲基戊烯均聚物、4-甲基戊烯-1-丙烯共聚物、4-甲基戊烯-1-丁烯共聚物、4-甲基戊烯-1-丙烯-1-丁烯共聚物、丙烯-1-丁烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物等。 <Olefinic resin, olefinic elastomer> The adhesive layer of the adhesive film may further contain an olefinic resin or an olefinic elastomer. Examples of the olefinic resin and olefinic elastomer include: a polymer or copolymer of α-olefin having 2 to 20 carbon atoms, and a copolymer of ethylene and an unsaturated carboxylic acid or an unsaturated carboxylic acid ester. Specifically, examples include: ethylene-propylene copolymer, ethylene-1-butene copolymer, ethylene-1-hexene copolymer, ethylene-4-methylpentene copolymer, ethylene-1-octene copolymer, propylene homopolymer, propylene-ethylene copolymer, propylene-ethylene-1-butene copolymer, 1-butene homopolymer, 1-butene-ethylene copolymer, 1-butene-propylene copolymer, 4-methylpentene homopolymer, 4-methylpentene-1-propylene copolymer, 4-methylpentene-1-butene copolymer, 4-methylpentene-1-propylene-1-butene copolymer, propylene-1-butene copolymer, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, etc.

<丙烯酸系共聚物> 黏著性膜之黏著層亦可進而含有丙烯酸系共聚物。 作為丙烯酸系共聚物,例如可例舉:丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、丙烯腈等與乙酸乙烯酯、氯乙烯、苯乙烯等之共聚物,但並不限定於以上。 <Acrylic copolymer> The adhesive layer of the adhesive film may further contain an acrylic copolymer. Examples of acrylic copolymers include copolymers of methyl acrylate, ethyl acrylate, methyl methacrylate, acrylonitrile, etc., and vinyl acetate, vinyl chloride, styrene, etc., but are not limited to the above.

<軟化劑> 黏著性膜之黏著層亦可進而含有軟化劑。 作為軟化劑,並無特別限定,例如可使用礦物油系軟化劑及合成樹脂系軟化劑中之任一種。 作為礦物油系軟化劑,例如可例舉:芳香族系烴、環烷系烴及石蠟系烴之混合物。再者,石蠟系烴之碳原子數占全部碳原子中之50%以上者被稱為石蠟系油,環烷系烴之碳原子為30~45%者被稱為環烷系油,又,芳香族系烴之碳原子為35%以上者被稱為芳香族系油。作為礦物油系軟化劑,較佳為橡膠用軟化劑之石蠟系油,作為合成樹脂系軟化劑,較佳為聚丁烯、低分子量聚丁二烯等。 <Softener> The adhesive layer of the adhesive film may further contain a softener. The softener is not particularly limited, and for example, any of a mineral oil-based softener and a synthetic resin-based softener may be used. As a mineral oil-based softener, for example, a mixture of aromatic hydrocarbons, cycloparaffin hydrocarbons, and wax hydrocarbons may be cited. Furthermore, wax hydrocarbons whose carbon atoms account for 50% or more of all carbon atoms are called wax oils, cycloparaffin hydrocarbons whose carbon atoms account for 30 to 45% are called cycloparaffin oils, and aromatic hydrocarbons whose carbon atoms account for 35% or more are called aromatic oils. As a mineral oil-based softener, wax-based oil for rubber softeners is preferred, and as a synthetic resin-based softener, polybutene, low molecular weight polybutadiene, etc. are preferred.

<抗氧化劑、光穩定劑等> 於黏著性膜之黏著層中亦可進而添加抗氧化劑、光穩定劑等穩定劑。 作為抗氧化劑,例如可例舉:2,6-二第三丁基-4-甲基苯酚、3-(4'-羥基-3',5'-二第三丁基苯基)丙酸正十八烷基酯、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-第三丁基苯酚)、2,4-雙[(辛硫基)甲基]-鄰甲酚、丙烯酸2-第三丁基-6-(3-第三丁基-2-羥基-5-甲基苄基)-4-甲基苯酯、丙烯酸2,4-二第三戊基-6-[1-(3,5-二第三戊基-2-羥基苯基)乙基]苯酯、丙烯酸2-[1-(2-羥基-3,5-二第三戊基苯基)]酯等受阻酚系抗氧化劑;硫代二丙酸二月桂酯、硫代二丙酸月桂基硬脂酯、季戊四醇-四(β-月桂基硫代丙酸酯)等硫系抗氧化劑;亞磷酸三(壬基苯基)酯、亞磷酸三(2,4-二第三丁基苯基)酯等磷系抗氧化劑等,但並不限定於以上。 作為光穩定劑,例如可例舉:2-(2'-羥基-5'-甲基苯基)苯并三唑、2-(2'-羥基-3',5'第三丁基苯基)苯并三唑、2-(2'-羥基-3',5'-二第三丁基苯基)-5-氯苯并三唑等苯并三唑系紫外線吸收劑或2-羥基-4-甲氧基二苯甲酮等二苯甲酮系紫外線吸收劑、或受阻胺系光穩定劑,但並不限定於以上。 <Antioxidants, light stabilizers, etc.> Antioxidants, light stabilizers, etc. may be further added to the adhesive layer of the adhesive film. As antioxidants, for example, 2,6-di-tert-butyl-4-methylphenol, 3-(4'-hydroxy-3',5'-di-tert-butylphenyl) propionate n-octadecyl ester, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,4-bis[(octylthio)methyl]-o-cresol, 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, acrylic acid Hindered phenol antioxidants such as 2,4-di-tert-pentyl-6-[1-(3,5-di-tert-pentyl-2-hydroxyphenyl)ethyl]phenyl ester and 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)]acrylate; sulfur antioxidants such as dilauryl thiodipropionate, lauryl stearyl thiodipropionate, and pentaerythritol-tetrakis(β-lauryl thiopropionate); phosphorus antioxidants such as tris(nonylphenyl) phosphite and tris(2,4-di-tert-butylphenyl) phosphite, but not limited to the above. Examples of light stabilizers include benzotriazole-based ultraviolet light absorbers such as 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-tert-butylphenyl)benzotriazole, and 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-5-chlorobenzotriazole, or benzophenone-based ultraviolet light absorbers such as 2-hydroxy-4-methoxybenzophenone, or hindered amine-based light stabilizers, but are not limited to the above.

<顏料、蠟類、熱塑性樹脂、天然橡膠、合成橡膠> 除了上述各種材料以外,黏著性膜之黏著層視需要亦可包含各種添加劑。 作為上述添加劑,例如可例舉:鐵丹、二氧化鈦等顏料;固體石蠟、微晶蠟、低分子量聚乙烯蠟等蠟類;無定形聚烯烴、乙烯-丙烯酸乙酯共聚物等聚烯烴系或低分子量之乙烯基芳香族系熱塑性樹脂;天然橡膠;聚異戊二烯橡膠、聚丁二烯橡膠、苯乙烯-丁二烯橡膠、乙烯-丙烯橡膠、氯丁二烯橡膠、丙烯酸系橡膠、異戊二烯-異丁烯橡膠、聚戊烯橡膠等合成橡膠,但並不限定於以上。作為上述合成橡膠,除了上述以外,可例舉於「橡膠、塑膠調配藥品」(Rubber Digest公司編)等中所記載者。 <Pigments, waxes, thermoplastic resins, natural rubber, synthetic rubber> In addition to the above materials, the adhesive layer of the adhesive film may also contain various additives as needed. Examples of the above-mentioned additives include pigments such as ferrite and titanium dioxide; waxes such as solid wax, microcrystalline wax, and low molecular weight polyethylene wax; polyolefin-based or low molecular weight vinyl aromatic thermoplastic resins such as amorphous polyolefins and ethylene-ethyl acrylate copolymers; natural rubber; synthetic rubbers such as polyisoprene rubber, polybutadiene rubber, styrene-butadiene rubber, ethylene-propylene rubber, chloroprene rubber, acrylic rubber, isoprene-isobutylene rubber, and polypentene rubber, but are not limited to the above. Examples of the above-mentioned synthetic rubbers include those described in "Rubber and Plastic Compounding Products" (edited by Rubber Digest Co., Ltd.) and the like.

<飽和脂肪酸雙醯胺> 黏著性膜之黏著層可包含具有抑制黏著亢進之效果之飽和脂肪酸雙醯胺。 作為飽和脂肪酸雙醯胺,例如可例舉:伸乙基雙硬脂醯胺(EBSA)、亞甲基雙硬脂醯胺、六亞甲基雙硬脂醯胺等飽和脂肪酸脂肪族雙醯胺;以及間苯二甲基雙硬脂醯胺、及N,N'-二硬脂基間苯二甲醯胺等飽和脂肪酸芳香族雙醯胺,但並不限定於以上。 該等飽和脂肪酸雙醯胺可僅單獨使用一種,亦可組合使用兩種以上。 亦可進而調配具有抑制黏著亢進之效果之苯乙烯系嵌段相補強劑。作為苯乙烯系嵌段相補強劑,例如作為單體單元,可例舉:苯乙烯及α-甲基苯乙烯、對甲基苯乙烯、對氯苯乙烯、氯甲基苯乙烯、第三丁基苯乙烯、對乙基苯乙烯、二乙烯苯等苯乙烯系化合物,但並不限定於以上。該等可僅單獨使用一種,亦可組合使用兩種以上。 <Saturated fatty acid diamide> The adhesive layer of the adhesive film may contain a saturated fatty acid diamide having an effect of inhibiting hyperadhesion. Examples of saturated fatty acid diamides include saturated fatty acid aliphatic diamides such as ethylenebisstearylamide (EBSA), methylenebisstearylamide, and hexamethylenebisstearylamide; and saturated fatty acid aromatic diamides such as meta-xylylenebisstearylamide and N,N'-distearyl meta-xylylene diamide, but are not limited to the above. These saturated fatty acid diamides may be used alone or in combination of two or more. It is also possible to further formulate a styrene-based block phase reinforcing agent that has the effect of inhibiting hyperadhesion. As a styrene-based block phase reinforcing agent, for example, as a monomer unit, there can be exemplified: styrene and α-methylstyrene, p-methylstyrene, p-chlorostyrene, chloromethylstyrene, tert-butylstyrene, p-ethylstyrene, divinylbenzene and other styrene compounds, but it is not limited to the above. These can be used alone or in combination of two or more.

<構成黏著性膜之黏著層之樹脂材料之製造方法> 構成本實施方式之黏著性膜之黏著層之樹脂材料例如可藉由如下方法製造:對本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分進行乾摻之方法;或者利用供於通常之高分子材料之混合之裝置進行混合之方法等。 作為混合裝置,例如可例舉:班布里混合機、Laboplastomill、單軸擠出機、雙軸擠出機等混練裝置,但並不限定於以上,從生產性、優良混練性之觀點出發,較佳為藉由使用擠出機之熔融混合法來製造。 又,尤其是於在構成黏著層之樹脂材料中調配黏著賦予劑之情形時,於使用上述乾摻法之情形時,黏著賦予劑之黏性較強,且為片狀,故有處理性變差之虞,故亦可製作預先將黏著賦予劑混練於本實施方式之氫化嵌段共聚物(甲)中而成之母料。構成黏著層之樹脂材料於混練時之熔融溫度可適當設定,通常在130~300℃之範圍內,較佳為150~250℃之範圍。 為了謀求輕量化、柔軟化及密接性之提高效果,亦可對構成黏著層之樹脂材料實施發泡處理。作為發泡方法,例如有化學方法、物理方法、熱膨脹型微球之利用等,但並不限定於以上。可藉由分別添加無機系發泡劑、有機系發泡劑等化學發泡劑、物理發泡劑等,添加熱熱膨脹型微球等而使氣泡分佈於材料內部。又,亦可藉由添加中空填料(已膨脹氣球),謀求輕量化、柔軟化、密接性之提高。 <Method for producing resin material constituting adhesive layer of adhesive film> The resin material constituting the adhesive layer of the adhesive film of the present embodiment can be produced, for example, by a method of dry-blending the hydrogenated block copolymer (A) of the present embodiment and other components added as needed; or by mixing using a device for mixing conventional polymer materials. As mixing devices, for example, mixing devices such as Banbury mixer, Laboplastomill, single-screw extruder, double-screw extruder, etc. can be cited, but are not limited to the above. From the perspective of productivity and good mixing properties, it is preferably produced by a melt mixing method using an extruder. Moreover, especially when the adhesive agent is mixed in the resin material constituting the adhesive layer, when the above-mentioned dry blending method is used, the adhesive agent has a strong viscosity and is in a flaky form, so there is a risk of poor handling properties. Therefore, a masterbatch can be prepared by pre-mixing the adhesive agent in the hydrogenated block copolymer (A) of the present embodiment. The melting temperature of the resin material constituting the adhesive layer during mixing can be appropriately set, usually in the range of 130 to 300°C, preferably in the range of 150 to 250°C. In order to achieve the effects of weight reduction, flexibility and improved adhesion, the resin material constituting the adhesive layer can also be subjected to a foaming treatment. As foaming methods, there are chemical methods, physical methods, and the use of heat-expandable microspheres, but they are not limited to the above. Bubbles can be distributed inside the material by adding chemical foaming agents such as inorganic foaming agents, organic foaming agents, physical foaming agents, etc., and adding heat-expandable microspheres. In addition, hollow fillers (expanded balloons) can be added to achieve weight reduction, flexibility, and improved adhesion.

<黏著性膜之製造方法> 黏著性膜於基材膜上具備包含本實施方式之氫化嵌段共聚物(甲)之黏著層。 黏著性膜之製造方法並無特別限定,例如可例舉:將構成黏著層之樹脂材料之溶液或熔融物塗敷於基材膜上之方法、使用膜擠出機之方法等。此處,於使用構成黏著層之樹脂材料之溶液或熔融物之情形時,可於製成含有氫化嵌段共聚物(甲)及其他成分之樹脂材料後製成溶液或熔融物,亦可於製成添加有氫化嵌段共聚物(甲)之溶液或熔融物後進行混合。 於藉由樹脂材料之溶液塗敷之方法製造黏著性膜之情形時,例如可藉由溶解於能夠溶解樹脂材料溶之溶劑中,並使用塗佈機等塗敷於基材膜上,並將溶劑加熱乾燥等而製造,但並不限定於以上。於使樹脂材料熔融並塗敷之方法中,例如可藉由使用熱熔塗佈機等,將熔融之樹脂材料塗敷於基材膜上等而製造黏著性膜,但並不限定於此。於該情形時,較佳為使用具有高於塗敷溫度之玻璃轉移溫度、熔點或軟化點之各種基材膜。 作為利用膜擠出機製造黏著性膜之方法,例如可藉由如下方法製造:利用熔融共擠壓機,使包含樹脂材料之黏著層之成分、與可構成基材膜之熱塑性樹脂等成分成為兩個流向,即,使黏著層形成用流體、與基材體膜形成用流體於模嘴內合流而形成單一流體並擠出,將黏著層與樹脂膜層複合,但並不限定於以上。於利用膜擠出機之方法之情形時,形成黏著層之樹脂材料亦可藉由預先將黏著層用之各成分乾摻而製造,故其為生產性優異之方法。又,於進行擠出成形之情形時,有所製作之黏著性膜之密接性、接著強度尤其優異之傾向。 黏著性膜可暫時黏著於導光板或稜鏡片材等光學系統成形體、合成樹脂板、金屬板、裝飾合板、被覆塗裝鋼板、各種銘牌等之表面,用作該等被接著體之加工時或搬送、保管時之防止損傷或防止污垢用保護膜。 <Method for producing adhesive film> The adhesive film has an adhesive layer containing the hydrogenated block copolymer (A) of the present embodiment on a base film. The method for producing the adhesive film is not particularly limited, and examples thereof include a method of applying a solution or melt of a resin material constituting the adhesive layer on a base film, a method of using a film extruder, etc. Here, when a solution or melt of a resin material constituting the adhesive layer is used, a resin material containing the hydrogenated block copolymer (A) and other components may be prepared to form a solution or melt, or a solution or melt to which the hydrogenated block copolymer (A) is added may be prepared and then mixed. In the case of manufacturing an adhesive film by coating a solution of a resin material, for example, it can be manufactured by dissolving in a solvent capable of dissolving the resin material, applying it on a base film using a coating machine, and heating and drying the solvent, but it is not limited to the above. In the method of melting the resin material and coating it, for example, it can be manufactured by using a hot melt coating machine, etc., and coating the molten resin material on a base film, but it is not limited to this. In this case, it is preferable to use various base films having a glass transition temperature, melting point or softening point higher than the coating temperature. As a method of manufacturing an adhesive film using a film extruder, for example, the following method can be used to manufacture the adhesive film: using a melt co-extruder, the components of the adhesive layer including the resin material and the components such as the thermoplastic resin that can constitute the substrate film are made into two flows, that is, the fluid for forming the adhesive layer and the fluid for forming the substrate film are merged in the die nozzle to form a single fluid and extruded, and the adhesive layer and the resin film layer are compounded, but it is not limited to the above. In the case of the method using a film extruder, the resin material for forming the adhesive layer can also be manufactured by pre-drying the components for the adhesive layer, so it is a method with excellent productivity. In addition, when extrusion molding is performed, the adhesive film produced tends to have particularly excellent adhesion and bonding strength. The adhesive film can be temporarily adhered to the surface of optical system moldings such as light guide plates or prism sheets, synthetic resin plates, metal plates, decorative plywood, coated steel plates, various nameplates, etc., and used as a protective film to prevent damage or dirt during processing, transportation, and storage of such adherends.

[第二成形體] 第二成形體為上述本實施方式之氫化嵌段共聚物組合物之成形體。 作為第二成形體,可例舉:汽車構件,例如汽車內飾表皮材、片狀成形體(片材、膜)、飲用水配管、飲用水管;以及包裝材,例如食品包裝材、及衣服包裝材;用於保護膜之黏著性膜、與極性樹脂之包覆模製成形體,但並不限定於上述。 [Second molded body] The second molded body is a molded body of the hydrogenated block copolymer composition of the present embodiment described above. Examples of the second molded body include: automotive components, such as automotive interior surface materials, sheet-shaped molded bodies (sheets, films), drinking water piping, drinking water pipes; and packaging materials, such as food packaging materials and clothing packaging materials; adhesive films for protective films, and polar resin overmolded molded bodies, but are not limited to the above.

(包覆模製成形體) 本實施方式之氫化嵌段共聚物組合物有對極性樹脂顯示出接著性之傾向,故可形成與極性樹脂一併進行包覆模製成形而成之多層成形體(包覆模製成形體)。 包覆模製成形體藉由設為具備包含極性樹脂之層、及積層於其層上之包含本實施方式之氫化嵌段共聚物組合物之層之構成,成為接著性優異者。 (Coated molded article) The hydrogenated block copolymer composition of the present embodiment has a tendency to show adhesion to polar resins, and thus can be formed into a multi-layered article (coated molded article) formed by coating with a polar resin. The coated molded article has a structure having a layer containing a polar resin and a layer containing the hydrogenated block copolymer composition of the present embodiment laminated on the layer, thereby having excellent adhesion.

<極性樹脂> 作為極性樹脂,例如可例舉:聚氯乙烯、ABS、丙烯腈-苯乙烯共聚物、聚丙烯酸、聚丙烯酸甲酯之類的聚丙烯酸酯、聚甲基丙烯酸、聚甲基丙烯酸甲酯之類的聚甲基丙烯酸酯、聚乙烯醇、聚偏二氯乙烯、聚對苯二甲酸乙二酯、聚醯胺、聚縮醛、聚碳酸酯、聚對苯二甲酸丁二酯、聚偏二氟乙烯、聚碸、聚醚碸、聚苯硫醚、聚芳酯、聚醯胺醯亞胺、聚醚醯亞胺、聚醚酮、聚醚醚酮、聚醯亞胺、液晶聚合物、聚四氟乙烯、酚樹脂、脲樹脂、三聚氰胺樹脂、不飽和聚酯、環氧樹脂、及聚胺基甲酸酯,但並不限定於以上。 極性樹脂可單獨使用一種,亦可組合使用兩種以上。 <Polar resin> Examples of polar resins include polyvinyl chloride, ABS, acrylonitrile-styrene copolymers, polyacrylic acid, polyacrylates such as polymethyl acrylate, polymethacrylic acid, polymethacrylates such as polymethyl methacrylate, polyvinyl alcohol, polyvinylidene chloride, polyethylene terephthalate, polyamide, polyacetal, polycarbonate, polybutylene terephthalate, polyvinylidene fluoride, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, polyamide imide, polyetherimide, polyetherketone, polyetheretherketone, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenol resin, urea resin, melamine resin, unsaturated polyester, epoxy resin, and polyurethane, but are not limited to the above. Polar resins can be used alone or in combination of two or more.

包含極性樹脂之層除了極性樹脂以外,亦可包含填充劑。 作為包含極性樹脂之層中之填充劑,例如可例舉:玻璃纖維、玻璃球、玻璃中空球、碳纖維、纖維素奈米纖維、矽灰石、鈦酸鉀晶鬚、碳酸鈣晶鬚、硼酸鋁晶鬚、硫酸鎂晶鬚、海泡石、硬矽鈣石、氧化鋅晶鬚等之類的纖維狀無機填充劑、滑石、碳酸鈣、氧化鈣、碳酸鋅、矽灰石、沸石、矽灰石、二氧化矽、氧化鋁、黏土、氧化鈦、氫氧化鎂、氧化鎂、矽酸鈉、矽酸鈣、矽酸鎂、鋁酸鈉、鋁酸鈣、鋁矽酸鈉、氧化鋅、鈦酸鉀、水滑石、硫酸鋇、鈦黑、以及爐黑、熱碳黑、及乙炔黑等之類的碳黑等,但並不限定於以上。 纖維狀無機填充劑亦可利用對極性樹脂具有親和性基或反應性基之化合物進行表面處理。 填充劑可單獨使用一種,亦可使用兩種以上。 The layer containing the polar resin may contain a filler in addition to the polar resin. Examples of the filler in the layer containing the polar resin include: glass fiber, glass sphere, glass hollow sphere, carbon fiber, cellulose nanofiber, wollastonite, potassium titanium crystal whisker, calcium carbonate crystal whisker, aluminum borate crystal whisker, magnesium sulfate crystal whisker, sepiolite, hard silicate, zinc oxide crystal whisker, etc., fibrous inorganic fillers, talc, calcium carbonate, calcium oxide, Zinc carbonate, wollastonite, zeolite, wollastonite, silica, aluminum oxide, clay, titanium oxide, magnesium hydroxide, magnesium oxide, sodium silicate, calcium silicate, magnesium silicate, sodium aluminate, calcium aluminate, sodium aluminosilicate, zinc oxide, potassium titanate, hydrotalcite, barium sulfate, titanium black, and carbon black such as furnace black, thermal black, and acetylene black, etc., but not limited to the above. The fibrous inorganic filler can also be surface-treated with a compound having an affinity group or a reactive group for a polar resin. The filler can be used alone or in combination.

<包含氫化嵌段共聚物組合物之層> 作為構成上述包覆模製成形體之包含氫化嵌段共聚物組合物之層,可例舉含有本實施方式之氫化嵌段共聚物組合物與橡膠狀聚合物者。 橡膠狀聚合物較佳為包含乙烯基芳香族單體單元,且包含至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段,又,亦較佳為包含乙烯基芳香族單體單元,且乙烯基芳香族單體單元為60質量%以下之橡膠或彈性體。 作為橡膠狀聚合物,例如可例舉:苯乙烯丁二烯橡膠及其氫化物(但本實施方式之氫化嵌段共聚物除外)、苯乙烯-丁二烯嵌段共聚物及其氫化物、苯乙烯-丁二烯-異戊二烯嵌段共聚物及其氫化物等,但並不限定於以上。 <Layer containing hydrogenated block copolymer composition> As the layer containing hydrogenated block copolymer composition constituting the above-mentioned overmolded body, there can be exemplified a layer containing the hydrogenated block copolymer composition of the present embodiment and a rubbery polymer. The rubbery polymer preferably contains vinyl aromatic monomer units and contains at least one polymer block containing vinyl aromatic monomer units as the main component. Furthermore, it is also preferably a rubber or elastomer containing vinyl aromatic monomer units and containing 60% by mass or less of the vinyl aromatic monomer units. Examples of rubbery polymers include styrene butadiene rubber and its hydrogenated products (excluding the hydrogenated block copolymer of the present embodiment), styrene-butadiene block copolymer and its hydrogenated products, styrene-butadiene-isoprene block copolymer and its hydrogenated products, but are not limited to the above.

包含氫化嵌段共聚物組合物之層除了上述熱塑性樹脂(丙)以外,還可含有其他熱塑性樹脂。 作為上述熱塑性樹脂(丙)及其他熱塑性樹脂,例如可例舉:聚丙烯、聚乙烯、乙烯-丙烯共聚橡膠(EPM)、及乙烯-丙烯-非共軛二烯共聚橡膠(EPDM)等烯烴系聚合物;聚酯彈性體、聚對苯二甲酸乙二酯及聚對苯二甲酸丁二酯等聚酯系聚合物;聚醯胺6、聚醯胺6,6、聚醯胺6,10、聚醯胺11、聚醯胺12、及聚醯胺6,12等聚醯胺系樹脂;聚丙烯酸甲酯及聚甲基丙烯酸甲酯等丙烯酸系樹脂;聚甲醛均聚物及聚甲醛共聚物等聚甲醛系樹脂;苯乙烯均聚物、丙烯腈-苯乙烯樹脂、及丙烯腈-丁二烯-苯乙烯樹脂等苯乙烯系樹脂;聚碳酸酯樹脂;苯乙烯-丁二烯共聚物橡膠、及苯乙烯-異戊二烯共聚物橡膠等苯乙烯系彈性體以及其氫化物或其改性物;天然橡膠;合成異戊二烯橡膠及液狀聚異戊二烯橡膠以及其氫化物或改性物;氯丁二烯橡膠;丙烯酸系橡膠;丁基橡膠;丙烯腈-丁二烯橡膠;表氯醇橡膠;聚矽氧橡膠;氟橡膠;氯磺化聚乙烯;胺基甲酸酯橡膠;聚胺基甲酸酯系彈性體;聚醯胺系彈性體;聚酯系彈性體;軟質氯乙烯樹脂等,但並不限定於以上。 該等熱塑性樹脂可單獨使用一種,亦可併用兩種以上。 The layer comprising the hydrogenated block copolymer composition may contain other thermoplastic resins in addition to the above-mentioned thermoplastic resin (C). Examples of the thermoplastic resin (propylene) and other thermoplastic resins include olefin polymers such as polypropylene, polyethylene, ethylene-propylene copolymer rubber (EPM), and ethylene-propylene-non-conjugated diene copolymer rubber (EPDM); polyester polymers such as polyester elastomer, polyethylene terephthalate, and polybutylene terephthalate; polyamide resins such as polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 11, polyamide 12, and polyamide 6,12; acrylic resins such as polymethyl acrylate and polymethyl methacrylate; polyoxymethylene resins such as polyoxymethylene homopolymer and polyoxymethylene copolymer; styrene homopolymer, acrylonitrile-styrene; styrene resins such as styrene-butadiene-styrene resins; polycarbonate resins; styrene-butadiene copolymer rubbers, styrene-isoprene copolymer rubbers and other styrene elastomers and their hydrogenated products or modified products; natural rubber; synthetic isoprene rubber and liquid polyisoprene rubber and their hydrogenated products or modified products; chloroprene rubber; acrylic rubber; butyl rubber; acrylonitrile-butadiene rubber; epichlorohydrin rubber; polysilicone rubber; fluororubber; chlorosulfonated polyethylene; urethane rubber; polyurethane elastomer; polyamide elastomer; polyester elastomer; soft vinyl chloride resin, etc., but not limited to the above. These thermoplastic resins may be used alone or in combination of two or more.

包含氫化嵌段共聚物組合物之層除了上述軟化劑(丁)以外,還可含有其他軟化劑。 作為上述軟化劑(丁)及其他軟化劑,例如可例舉:石蠟系油、環烷系油、芳香族系油、固體石蠟、液態石蠟、白礦物油、植物系軟化劑等,但並不限定於以上。 軟化劑於40℃下之動黏度較佳為500 mm 2/sec以下。軟化劑於40℃下之動黏度之下限值並無特別限定,較佳為10 mm 2/sec。 若軟化劑於40℃下之動黏度為500 mm 2/sec以下,則有熱塑性彈性體組合物之流動性進一步提高,成形加工性進一步提高之傾向。軟化劑之動黏度可藉由使用玻璃製毛細管式黏度計進行試驗之方法等加以測定。 The layer containing the hydrogenated block copolymer composition may contain other softeners in addition to the above-mentioned softener (D). Examples of the above-mentioned softener (D) and other softeners include, but are not limited to, wax-based oils, cycloparaffin-based oils, aromatic oils, solid wax, liquid wax, white mineral oil, and plant-based softeners. The kinematic viscosity of the softener at 40°C is preferably 500 mm 2 /sec or less. The lower limit of the kinematic viscosity of the softener at 40°C is not particularly limited, but is preferably 10 mm 2 /sec. If the kinematic viscosity of the softener at 40°C is 500 mm 2 /sec or less, the fluidity of the thermoplastic elastomer composition tends to be further improved, and the molding processability tends to be further improved. The kinematic viscosity of the softener can be measured by a test method using a glass capillary viscometer.

包含氫化嵌段共聚物組合物之層除了上述成分(B)以外,亦可進而含有其他烯烴系樹脂、及烯烴系彈性體。 作為上述成分(B)及其他烯烴系樹脂、烯烴系彈性體,例如可例舉:碳數2~20之α-烯烴聚合物或共聚物、乙烯與不飽和羧酸或不飽和羧酸酯之共聚物,但並不限定於以上。例如可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-1-己烯共聚物、乙烯-4-甲基戊烯共聚物、乙烯-1-辛烯共聚物、丙烯均聚物、丙烯-乙烯共聚物、丙烯-乙烯-1-丁烯共聚物、1-丁烯均聚物、1-丁烯-乙烯共聚物、1-丁烯-丙烯共聚物、4-甲基戊烯均聚物、4-甲基戊烯-1-丙烯共聚物、4-甲基戊烯-1-丁烯共聚物、4-甲基戊烯-1-丙烯-1-丁烯共聚物、丙烯-1-丁烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物等,但並不限定於以上。 The layer containing the hydrogenated block copolymer composition may further contain other olefinic resins and olefinic elastomers in addition to the above-mentioned component (B). As the above-mentioned component (B) and other olefinic resins and olefinic elastomers, for example, α-olefin polymers or copolymers having 2 to 20 carbon atoms, copolymers of ethylene and unsaturated carboxylic acids or unsaturated carboxylic acid esters can be cited, but are not limited to the above. For example, ethylene-propylene copolymer, ethylene-1-butene copolymer, ethylene-1-hexene copolymer, ethylene-4-methylpentene copolymer, ethylene-1-octene copolymer, propylene homopolymer, propylene-ethylene copolymer, propylene-ethylene-1-butene copolymer, 1-butene homopolymer, 1-butene-ethylene copolymer, 1-butene-propylene copolymer, 4-methylpentene homopolymer, 4-methylpentene-1-propylene copolymer, 4-methylpentene-1-butene copolymer, 4-methylpentene-1-propylene-1-butene copolymer, propylene-1-butene copolymer, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, etc., but not limited to the above.

包含氫化嵌段共聚物組合物之層亦可含有黏著賦予劑。 作為黏著賦予劑,例如可例舉:苯并呋喃-茚樹脂、對第三丁基苯酚-乙炔樹脂、苯酚-甲醛樹脂、二甲苯-甲醛樹脂、萜烯樹脂、氫化萜烯樹脂、萜烯-酚樹脂、氫化萜酚樹脂、芳香族改性萜烯樹脂、芳香族改性氫化酚樹脂、苯乙烯樹脂、α甲基苯乙烯樹脂、芳香族系烴樹脂、脂肪族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族/脂環族系石油樹脂、脂肪族/芳香族系烴樹脂、氫化改性脂環族系烴樹脂、氫化脂環族系烴樹脂、烴系黏著化樹脂、聚丁烯、液狀聚丁二烯、順-1,4-聚異戊二烯橡膠、氫化聚異戊二烯橡膠、液狀聚異戊二烯橡膠、松脂系樹脂等,但並不限定於以上。 The layer containing the hydrogenated block copolymer composition may also contain an adhesive agent. Examples of adhesive agents include benzofuran-indene resins, tert-butylphenol-acetylene resins, phenol-formaldehyde resins, xylene-formaldehyde resins, terpene resins, hydrogenated terpene resins, terpene-phenol resins, hydrogenated terpene-phenol resins, aromatic modified terpene resins, aromatic modified hydrogenated phenol resins, styrene resins, α-methylstyrene resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins. Resins, aliphatic cyclic hydrocarbon resins, aliphatic/aliphatic petroleum resins, aliphatic/aromatic hydrocarbon resins, hydrogenated modified alicyclic hydrocarbon resins, hydrogenated alicyclic hydrocarbon resins, hydrocarbon adhesive resins, polybutene, liquid polybutadiene, cis-1,4-polyisoprene rubber, hydrogenated polyisoprene rubber, liquid polyisoprene rubber, rosin-based resins, etc., but not limited to the above.

於無損本發明之目的之範圍內,包含氫化嵌段共聚物組合物之層除了上述成分以外,亦可進而包含其他添加劑。 作為其他添加劑,例如可例舉:熱穩定劑、抗氧化劑、紫外線吸收劑、抗老化劑、塑化劑、光穩定劑、結晶成核劑、衝擊改良劑、顏料、潤滑劑、防靜電劑、阻燃劑、阻燃助劑、及相容劑等。 該等添加劑可僅使用一種,亦可組合使用兩種以上。 In the scope that does not impair the purpose of the present invention, the layer containing the hydrogenated block copolymer composition may further contain other additives in addition to the above-mentioned components. As other additives, for example: heat stabilizers, antioxidants, ultraviolet absorbers, anti-aging agents, plasticizers, light stabilizers, crystallization nucleating agents, impact modifiers, pigments, lubricants, antistatic agents, flame retardants, flame retardant aids, and compatibilizers, etc. These additives can be used alone or in combination of two or more.

<構成上述第二成形體之氫化嵌段共聚物組合物製造方法> 構成第二成形體之氫化嵌段共聚物組合物之製造方法並無特別限定,可藉由先前公知之方法製造。 例如可使用利用加壓捏合機、班布里混合機、密閉混合機、Laboplastomill、MIX-LABO、單螺桿擠出機、雙螺桿擠出機、雙向捏合機、多螺桿擠出機等通常之混合機之熔融混練方法;於使各成分溶解或分散混合後,將溶劑加熱去除之方法等。 構成上述第二成形體之氫化嵌段共聚物組合物之形狀並無特別限定,例如可例舉:顆粒狀、片狀、繩狀、小片狀等。又,亦可於熔融混練後,直接製成成形品。 <Method for producing the hydrogenated block copolymer composition constituting the above-mentioned second molded body> The method for producing the hydrogenated block copolymer composition constituting the second molded body is not particularly limited, and it can be produced by a previously known method. For example, a melt kneading method using a common mixer such as a pressure kneader, a Banbury mixer, a closed mixer, a Laboplastomill, a MIX-LABO, a single-screw extruder, a twin-screw extruder, a bidirectional kneader, a multi-screw extruder, etc. can be used; a method of removing the solvent by heating after dissolving or dispersing and mixing the components, etc. The shape of the hydrogenated block copolymer composition constituting the above-mentioned second molded body is not particularly limited, and examples thereof include: granular, sheet, rope, small flake, etc. In addition, a molded product can be directly produced after melt kneading.

<包覆模製成形體之製造方法> 若包覆模製成形體分別包含1層以上之包含本實施方式之氫化嵌段共聚物組合物之層、及包含極性樹脂之層,則積層層數並無特別限定。 包覆模製成形體之層形成方法並無特別限定,可使用先前公知之方法,例如可使用擠出成形、射出成形(嵌入成形、雙色射出成形、夾層成形、中空成形、壓縮成形、真空成形、旋轉成形、粉末凝塑成形、發泡成形、積層成形、壓延成形、及吹塑成形。 包含本實施方式之氫化嵌段共聚物組合物之層較佳為熱融合於包含極性樹脂之層。更具體而言,包覆模製成形體之製造方法較佳為包括如下步驟之形態:使用選自由射出成形法、嵌入成形法、擠出成形法、及壓縮成形法所組成之群中之至少1種方法,使包含本實施方式之氫化嵌段共聚物組合物之層成形於已成形的包含極性樹脂之層上。 包覆模製成形體之製造方法亦可於該步驟之前,包括如下步驟:藉由任意方法,較佳為選自由射出成形法、嵌入成形法、擠出成形法、及壓縮成形法所組成之群中之至少1種方法,使包含極性樹脂之層成形。 <Manufacturing method of overmolded body> If the overmolded body includes one or more layers including the hydrogenated block copolymer composition of the present embodiment and a layer including a polar resin, the number of layers is not particularly limited. The layer formation method of the overmolded body is not particularly limited, and a previously known method can be used, such as extrusion molding, injection molding (insert molding, two-color injection molding, sandwich molding, hollow molding, compression molding, vacuum molding, rotation molding, powder solidification molding, foaming molding, lamination molding, calendering molding, and blow molding. The layer containing the hydrogenated block copolymer composition of the present embodiment is preferably heat-fused to the layer containing the polar resin. More specifically, the method for manufacturing the overmolded body is preferably in a form including the following steps: using at least one method selected from the group consisting of injection molding, insert molding, extrusion molding, and compression molding to form the layer containing the hydrogenated block copolymer composition of the present embodiment on the formed layer containing the polar resin. The method for manufacturing the overmolded body may also include the following steps before the step: forming the layer containing the polar resin by any method, preferably at least one method selected from the group consisting of injection molding, insert molding, extrusion molding, and compression molding.

包覆模製成形體例如可形成為與汽車零件、工具、玩具、電氣、電子設備零件、醫療器具、建材、配管構件、餐具、生活、裝飾用品、工業零件、各種軟管、各種殼體、各種模組盒、各種功率控制單元零件、書寫工具、機器手、及醫療器具等各種用途相應之形狀。該等之中,較佳為具有把手者、及人觸摸需要握力或優良觸感者。作為此種成形體,例如可例舉:工具、電線、連接器、輕便電子設備、牙刷、電動剃刀、以及圓珠筆、觸控筆、及手寫筆之類的筆、以及叉子、刀子、及勺子之類的餐具、以及具有握把部之構件,但並不限定於以上。尤佳為因使用時之振動而對人體施加之負荷較大之電動工具。 作為構成上述握把部之構件,例如較佳為構成選自工具之握把、電線被覆構件、連接器殼體、輕便電子設備之握把、牙刷之握把、電動剃刀之握把、餐具之握把、書寫工具之握把、機器手之握把部、及汽車內飾構件之握把部中之至少一種。 The overmolded body can be formed into shapes corresponding to various uses such as automobile parts, tools, toys, electrical and electronic equipment parts, medical instruments, building materials, piping components, tableware, daily life, decorative items, industrial parts, various hoses, various housings, various module boxes, various power control unit parts, writing tools, robot hands, and medical instruments. Among them, those with handles and those that require grip or good touch when touched by people are preferred. Examples of such a molded body include: tools, wires, connectors, portable electronic devices, toothbrushes, electric razors, pens such as ballpoint pens, touch pens, and styluses, tableware such as forks, knives, and spoons, and components with a grip portion, but are not limited to the above. It is particularly preferred that the load imposed on the human body by the vibration during use is relatively large for an electric tool. As a component constituting the above-mentioned grip portion, it is preferred that the component constitutes at least one selected from a tool grip, a wire sheathing component, a connector housing, a grip of a portable electronic device, a toothbrush grip, an electric razor grip, a tableware grip, a writing tool grip, a robot grip, and a grip portion of an automobile interior component.

[第三成形體] 第三成形體為視目的含有樹脂組合物之總質量之5~99質量%、或5~80質量%、或超過8質量%且60質量%以下、或10~30質量%、或未達70質量%之本實施方式之氫化嵌段共聚物(甲)之樹脂組合物之成形體,且為含有聚烯烴樹脂10~40質量%作為其他樹脂成分之成形體。 [Third molded body] The third molded body is a molded body of the resin composition containing 5 to 99 mass%, or 5 to 80 mass%, or more than 8 mass% and less than 60 mass%, or 10 to 30 mass%, or less than 70 mass% of the total mass of the resin composition, and is a molded body containing 10 to 40 mass% of a polyolefin resin as other resin components.

構成第三成形體之樹脂組合物較佳為進而包含亦稱為硬化劑或硬化起始劑之自由基產生化合物。作為此種自由基產生化合物,例如可例舉:疊氮、過氧化物、硫及硫衍生物,但並不限定於以上。硬化起始劑作為自由基起始劑而尤佳。 亦稱為硬化觸媒之自由基產生化合物於高溫下、或UV(Ultra Violet,紫外線)照射下,進而於其他誘發能量添加下產生自由基。利用自由基產生化合物,樹脂組合物即便不存在UV或誘發能量亦能夠於低溫下進行加工,但於活化溫度下,或者於UV或誘發能量之導入下,會確實地產生高濃度之自由基。 作為自由基產生化合物,若於高溫下或添加UV照射等誘發能量,則可使用能夠生成自由基之任意化合物。 作為自由基產生化合物,例如可例舉:2,5-二甲基-2,5-二(過氧化第三丁基)-3-己炔、過氧化二第三丁基、過氧化第三丁基異丙苯基、二(過氧化第三丁基異丙基)苯、2,5-二甲基-2,5-二(過氧化第三丁基)己烷、過氧化二異丙苯等有機過氧化物,但並不限定於以上。 又,關於作為自由基產生化合物之典型之非過氧化起始劑,例如可例舉:2,3-二甲基-2,3-二苯基丁烷、2,3-三甲基矽烷氧基-2,3-二苯基丁烷等化合物。 又,關於作為自由基產生化合物之典型之UV自由基起始劑,可例舉2,2-二甲氧基-1,2二苯乙烷-1-酮。 硬化起始劑較佳為視目的以0.1~10質量%或0.3~7質量%或1~5質量%之量用於樹脂組合物中。 The resin composition constituting the third molded body preferably further includes a free radical generating compound also called a curing agent or a curing initiator. Examples of such free radical generating compounds include, but are not limited to, nitrogen anodes, peroxides, sulfur, and sulfur derivatives. The curing initiator is particularly preferred as a free radical initiator. The free radical generating compound also called a curing catalyst generates free radicals at high temperature, or under UV (Ultra Violet) irradiation, and further under other induction energy addition. By using the free radical generating compound, the resin composition can be processed at low temperature even in the absence of UV or induction energy, but at the activation temperature, or under the introduction of UV or induction energy, a high concentration of free radicals will be generated reliably. As the free radical generating compound, any compound capable of generating free radicals at high temperature or by adding induction energy such as UV irradiation can be used. As the free radical generating compound, for example, organic peroxides such as 2,5-dimethyl-2,5-di(tert-butylperoxide)-3-hexyne, di-tert-butyl peroxide, tert-butyl peroxide isopropylbenzene, di(tert-butylperoxide isopropyl)benzene, 2,5-dimethyl-2,5-di(tert-butylperoxide)hexane, and diisopropylbenzene peroxide can be cited, but are not limited to the above. In addition, as a typical non-peroxidation initiator as a free radical generating compound, for example, compounds such as 2,3-dimethyl-2,3-diphenylbutane and 2,3-trimethylsilanyloxy-2,3-diphenylbutane can be cited. In addition, as a typical UV free radical initiator as a free radical generating compound, 2,2-dimethoxy-1,2-diphenylethane-1-one can be cited. The hardening initiator is preferably used in the resin composition in an amount of 0.1 to 10 mass % or 0.3 to 7 mass % or 1 to 5 mass % depending on the purpose.

構成第三成形體之樹脂組合物亦可含有多官能性共硬化性添加劑、二烯系橡膠、鹵化或非鹵化阻燃劑、無機或有機填充劑或纖維、單乙烯系化合物、或抗氧化劑、著色劑或穩定劑、接著促進劑、強化劑、膜形成添加劑等本技術領域中公知之其他添加劑。又,亦可進而以樹脂組合物之0.1~50質量%之範圍之量包含其他添加劑。 樹脂組合物進而較佳為至少包含無機及/或有機填充劑。無機填充劑可用於抑制熱膨脹係數,改善積層片材之韌性。有機填充劑可用於降低積層片材之介電常數。 The resin composition constituting the third molded body may also contain multifunctional co-hardening additives, diene rubbers, halogenated or non-halogenated flame retardants, inorganic or organic fillers or fibers, monoethylene compounds, or antioxidants, colorants or stabilizers, adhesion promoters, reinforcing agents, film-forming additives and other additives known in the art. In addition, other additives may be further included in an amount ranging from 0.1 to 50% by weight of the resin composition. The resin composition further preferably contains at least inorganic and/or organic fillers. Inorganic fillers can be used to suppress the thermal expansion coefficient and improve the toughness of the laminated sheet. Organic fillers can be used to reduce the dielectric constant of laminated sheets.

作為第三成形體,可例舉:預浸體、金屬積層板、CCL(Copper Clad Laminate,銅箔積層板)、印刷配線板、多層配線基板、及電子設備等,但並不限定於上述。Examples of the third molded body include, but are not limited to, prepregs, metal laminates, CCLs (Copper Clad Laminates), printed wiring boards, multilayer wiring boards, and electronic devices.

[氫化嵌段共聚物之其他用途] (預浸體、金屬積層板) 本實施方式之氫化嵌段共聚物(甲)可用於金屬積層板用之介電化合物及利用其製作之印刷電路板。藉由使用本實施方式之氫化嵌段共聚物(甲),可獲得加工性良好、溶液黏度較低、具有優異之硬化性、軟化點溫度較高、於高頻下介電損耗因數較低、及介電常數特性較低之樹脂組合物,進而可由上述樹脂組合物獲得金屬箔與絕緣層之接著性優異之預浸體及金屬積層板。 [Other uses of hydrogenated block copolymers] (Prepreg, metal laminate) The hydrogenated block copolymer (A) of this embodiment can be used for dielectric compounds for metal laminates and printed circuit boards made using the same. By using the hydrogenated block copolymer (A) of this embodiment, a resin composition with good processability, low solution viscosity, excellent curability, high softening point temperature, low dielectric dissipation factor at high frequency, and low dielectric constant characteristics can be obtained, and further, a prepreg and a metal laminate with excellent adhesion between metal foil and insulating layer can be obtained from the above resin composition.

上述預浸體係指藉由使基布或補強布含浸包含本實施方式之氫化嵌段共聚物(甲)之樹脂組合物所獲得之經含浸後的織物。 金屬積層板係指印刷電路板或電路基板之基材。金屬積層板可藉由在浸漬於樹脂組合物中後之補強材料(例如纖維玻璃布)之單面或雙面積層金屬、例如銅包覆層所獲得。 具體而言,銅箔積層板(CCL)例如可藉由在1層以上之銅箔上積層1層以上之預浸體所獲得。積層係藉由將1組以上之銅與預浸體之重疊物於高溫、高壓力及真空條件下一同加壓而達成。 印刷電路板可藉由對CCL之銅表面進行蝕刻,製作電子電路所獲得。經蝕刻之CCL為了於層間確立電連接而裝配為具備貫通且經鍍覆處理之孔之多層構成。 The above-mentioned prepreg refers to a fabric obtained by impregnating a base fabric or a reinforcing fabric with a resin composition containing the hydrogenated block copolymer (A) of the present embodiment. Metal laminate refers to a base material of a printed circuit board or a circuit substrate. The metal laminate can be obtained by laminating a metal, such as a copper cladding layer, on one or both sides of a reinforcing material (such as fiberglass cloth) impregnated in a resin composition. Specifically, a copper foil laminate (CCL) can be obtained, for example, by laminating one or more layers of prepreg on one or more layers of copper foil. Lamination is achieved by pressing one or more sets of copper and prepreg stacks together under high temperature, high pressure and vacuum conditions. Printed circuit boards can be made by etching the copper surface of CCL to make electronic circuits. The etched CCL is assembled into a multi-layer structure with through-holes and plated treatments to establish electrical connections between layers.

於製造預浸體或金屬積層板時,為了變更上述樹脂組合物之固形物成分,及為了調整樹脂組合物之黏度,可添加溶劑。 作為溶劑,例如可例舉:甲基乙基酮等酮;二丁醚等醚;乙酸乙酯等酯;二甲基甲醯胺等醯胺;苯、甲苯、二甲苯等芳香族烴;及三氯乙烯等氯化烴,但並不限定於以上。各溶劑可單獨使用一種,亦能夠以該等之組合使用。 較佳之溶劑選自由甲醇、乙醇、乙二醇甲醚、丙酮、甲基乙基酮、甲基異丁基酮、環己酮、甲苯、二甲苯、乙酸甲氧基乙酯、乙酸乙氧基乙酯、乙酸丙氧基乙酯、乙酸乙酯、二甲基甲醯胺、丙二醇甲醚、γ-丁內酯(GBL)及二異丁基酮(DIBK)所組成之群。 所使用之溶劑之量取決於成分之溶解度、填充劑之量、應用方法及其他因素。溶劑較佳為以相對於將溶液與固形物成分合計所得之總質量,包含10~50質量%之固形物成分、或15~40質量%之固形物成分之方式調整使用量。 When manufacturing prepregs or metal laminates, a solvent may be added to change the solid content of the resin composition and to adjust the viscosity of the resin composition. Examples of the solvent include ketones such as methyl ethyl ketone; ethers such as dibutyl ether; esters such as ethyl acetate; amides such as dimethylformamide; aromatic hydrocarbons such as benzene, toluene, and xylene; and chlorinated hydrocarbons such as trichloroethylene, but are not limited to the above. Each solvent may be used alone or in combination. The preferred solvent is selected from the group consisting of methanol, ethanol, ethylene glycol methyl ether, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, ethyl acetate, dimethylformamide, propylene glycol methyl ether, γ-butyrolactone (GBL) and diisobutyl ketone (DIBK). The amount of solvent used depends on the solubility of the components, the amount of filler, the application method and other factors. The amount of solvent used is preferably adjusted in a manner that the solid component contains 10 to 50% by mass, or 15 to 40% by mass, relative to the total mass of the solution and the solid component.

於上述樹脂組合物中,可進而添加以下之添加劑:偶合劑、硬化促進劑、界面活性劑、強化劑、黏度調整劑、濕潤劑、抗氧化劑、著色劑等中之至少一種。 添加劑之選擇被用途、以及以增強電路組件之電特性或實質上不會造成不良影響之方式選擇之所需的特性,例如介電常數、介電損耗因數、介電損耗及/或其他所需之特性所左右。 硬化促進劑係為了使樹脂組合物之反應速度上升而添加。 界面活性劑係為了使無機填充劑均勻地分佈於樹脂組合物中、及防止無機填充劑之凝聚而添加。 強化劑係為了改善樹脂組合物之韌性而添加。 The following additives may be further added to the above resin composition: at least one of a coupling agent, a hardening accelerator, a surfactant, a strengthening agent, a viscosity modifier, a wetting agent, an antioxidant, a coloring agent, etc. The selection of additives is influenced by the application and the desired properties selected in a manner that enhances the electrical properties of the circuit component or does not substantially cause adverse effects, such as dielectric constant, dielectric dissipation factor, dielectric loss and/or other desired properties. The hardening accelerator is added to increase the reaction rate of the resin composition. The surfactant is added to uniformly distribute the inorganic filler in the resin composition and prevent the agglomeration of the inorganic filler. Strengthening agents are added to improve the toughness of resin compositions.

上述樹脂組合物能夠以全部樹脂組合物中之0.1~2質量%之量進而包含本技術領域中公知之接著促進劑,例如可形成金屬箔與複合體之含N雜環等金屬接著促進劑。藉此可增強金屬箔與樹脂組合物層之接著。接著促進劑亦能夠以水或有機溶劑之溶液或分散液之形態含有於電阻金屬層中。The resin composition can further contain a known adhesion promoter in the art, such as a metal adhesion promoter containing N-doped rings that can form a metal foil and a composite, in an amount of 0.1-2 mass % of the total resin composition. This can enhance the adhesion between the metal foil and the resin composition layer. The adhesion promoter can also be contained in the resistor metal layer in the form of a solution or dispersion of water or an organic solvent.

上述樹脂組合物可進而包含15質量%以下之接著促進聚合物,該接著促進聚合物選自由聚(伸芳基醚)、羧基官能化聚(伸芳基醚)、及利用順丁烯二酸酐進行官能化而成之苯乙烯-乙烯/丁烯-苯乙烯(SEBS)所組成之群中。 具體而言,硬化性樹脂組合物較佳為含有共聚物、選自硫硬化劑、及過氧化物硬化劑之硬化起始劑以及作為共硬化添加劑之二烯系橡膠。 The resin composition may further include 15% by weight or less of a bonding-promoting polymer selected from the group consisting of poly(arylene ether), carboxyl-functionalized poly(arylene ether), and styrene-ethylene/butylene-styrene (SEBS) functionalized with maleic anhydride. Specifically, the curable resin composition preferably contains a copolymer, a curing initiator selected from a sulfur curing agent and a peroxide curing agent, and a diene rubber as a co-curing additive.

上述樹脂組合物亦可進而含有聚苯醚樹脂、聚烯烴、苯乙烯系聚合物、苯乙烯系嵌段共聚物或氫化苯乙烯系嵌段共聚物、高Tg烴聚環烯烴等可溶性聚合物。以低量使用該等可溶性聚合物而用以對樹脂組合物進行改質,改善其膜形成能力、耐衝擊性、Tg、加工特性。The resin composition may further contain soluble polymers such as polyphenylene ether resin, polyolefin, styrene polymer, styrene block copolymer or hydrogenated styrene block copolymer, high Tg polycycloolefin, etc. These soluble polymers are used in low amounts to modify the resin composition to improve its film forming ability, impact resistance, Tg, and processing characteristics.

包含本實施方式之氫化嵌段共聚物(甲)之上述樹脂組合物中的任意選擇性之添加劑之量可視目的設為樹脂組合物之總量之0.1~25質量%、或超過0.2質量%、或超過0.5質量%、或未達10質量%、或未達15質量%之範圍。The amount of the optional additive in the above-mentioned resin composition including the hydrogenated block copolymer (A) of the present embodiment can be set to a range of 0.1 to 25 mass %, or more than 0.2 mass %, or more than 0.5 mass %, or less than 10 mass %, or less than 15 mass % of the total amount of the resin composition, depending on the purpose.

包含本實施方式之氫化嵌段共聚物(甲)之上述樹脂組合物適合用於印刷電路板用之積層體,例如銅箔積層體。 上述積層體可藉由使樹脂組合物含浸於基板或補強材料例如玻璃系纖維、織布、混織(cross ply)積層體等,繼而使樹脂組合物部分或整體地硬化,形成預浸體而製造。為了製作積層體,於1層以上之預浸體上積層1層以上之銅。印刷電路板可用於大量高頻高資料速度之電氣及電子用途。 The above-mentioned resin composition containing the hydrogenated block copolymer (A) of the present embodiment is suitable for use in laminates for printed circuit boards, such as copper foil laminates. The above-mentioned laminate can be manufactured by impregnating the resin composition into a substrate or a reinforcing material such as glass fiber, woven fabric, cross-ply laminate, etc., and then partially or completely hardening the resin composition to form a prepreg. In order to make the laminate, one or more layers of copper are laminated on one or more layers of prepreg. Printed circuit boards can be used for a large number of high-frequency and high-data-speed electrical and electronic applications.

作為用以製作高頻CCL或電路基板之一種方法,例如可例舉以下方法。 混合上述成分,獲得樹脂組合物,該上述成分包含本實施方式之氫化嵌段共聚物(甲)、硬化起始劑、及任意選擇之成分,例如二烯系聚合物等多官能性共硬化劑、阻燃劑、及其他任意選擇之成分,上述樹脂組合物使用溶劑例如甲苯、二甲苯、甲基乙基酮(MEK)、及其等之混合物稀釋為適當之黏度,形成膠液或清漆。將補強材料或基板,例如纖維、玻璃毛氈、木材紙漿紙、纖維玻璃布(已任意選擇性地利用偶合劑進行了處理)於膠液或清漆中含浸至所需之厚度。其次,藉由溶劑蒸發,自經含浸之纖維玻璃布中去除溶劑,形成預浸體。 上述預浸體係藉由如下方法形成:於未達硬化起始劑之活化溫度之溫度下使溶劑蒸發,或者以足以溶劑蒸發但未達到凝膠化時間之時間使溶劑蒸發。凝膠化時間係指材料開始軟化後至產生凝膠化為止之時間,凝膠化為自黏性液體向彈性凝膠之不可逆之變化。預浸體係藉由使樹脂組合物含浸於基板例如纖維品,使所獲得之含浸後之基板半硬化,或者使經塗佈之纖維與進一步之樹脂組合物一同熱壓而形成,或者不帶樹脂組合物地進行熱壓而形成。 其次,藉由將預浸體積層於銅箔之間,並於150~250℃之溫度及20 kg/cm 2~70 kg/cm 2之壓力下硬化,形成高頻CCL或電路基板。 As a method for manufacturing a high-frequency CCL or a circuit substrate, for example, the following method can be cited. The above-mentioned components are mixed to obtain a resin composition, which includes the hydrogenated block copolymer (A) of the present embodiment, a curing initiator, and arbitrarily selected components, such as a multifunctional co-curing agent such as a diene polymer, a flame retardant, and other arbitrarily selected components. The above-mentioned resin composition is diluted to a suitable viscosity using a solvent such as toluene, xylene, methyl ethyl ketone (MEK), and a mixture thereof to form a glue or varnish. A reinforcing material or substrate, such as fiber, glass felt, wood pulp paper, fiberglass cloth (optionally treated with a coupling agent) is impregnated in the glue or varnish to a desired thickness. Next, the solvent is removed from the impregnated fiberglass cloth by evaporation of the solvent to form a prepreg. The prepreg is formed by evaporating the solvent at a temperature that does not reach the activation temperature of the curing initiator, or evaporating the solvent for a time sufficient for the solvent to evaporate but not reaching the gelation time. The gelation time refers to the time from the beginning of softening of the material to the gelation, which is an irreversible change from a viscous liquid to an elastic gel. Prepreg is formed by impregnating a substrate such as a fiber with a resin composition, semi-hardening the obtained impregnated substrate, or hot pressing the coated fiber with a further resin composition, or hot pressing without a resin composition. Next, the prepreg volume is layered between copper foils and hardened at a temperature of 150-250°C and a pressure of 20 kg/ cm2-70 kg/ cm2 to form a high-frequency CCL or circuit substrate.

[發泡體] 本實施方式之成形體亦可為發泡體。 本實施方式之發泡體通常可藉由在本實施方式之氫化嵌段共聚物組合物中添加發泡劑(戊),並使其發泡而獲得。 發泡方法有化學方法或物理方法,均只要添加無機系發泡劑或有機系發泡劑等化學發泡劑、或物理發泡劑,其後藉由加熱等使發泡劑揮發及/或分解,使氣泡分佈於氫化嵌段共聚物組合物內部即可。藉由將氫化嵌段共聚物組合物之成形體製成發泡體,可謀求輕量化、柔軟性之提高、設計性之提高、制振、吸音特性之提高、隔熱特性之提高等。 [Foam] The molded body of the present embodiment may also be a foam. The foam of the present embodiment can be generally obtained by adding a foaming agent (e) to the hydrogenated block copolymer composition of the present embodiment and foaming the foam. The foaming method includes a chemical method or a physical method. In both cases, a chemical foaming agent such as an inorganic foaming agent or an organic foaming agent, or a physical foaming agent is added, and then the foaming agent is volatilized and/or decomposed by heating, etc., so that bubbles are distributed inside the hydrogenated block copolymer composition. By making the molded body of the hydrogenated block copolymer composition into a foam, it is possible to achieve weight reduction, improved flexibility, improved design, improved vibration damping, improved sound absorption characteristics, improved heat insulation characteristics, etc.

(發泡劑(戊)) 作為上述發泡劑,可使用無機系發泡劑、或有機系發泡劑、物理發泡劑。 作為無機系發泡劑,例如可例舉:碳酸氫鈉、碳酸銨、碳酸氫銨、亞硝酸銨、疊氮化合物、硼氫化鈉、乙酸鋁、金屬粉等,但並不限定於以上。 作為有機系發泡劑,例如可例舉:偶氮二甲醯胺(Azodicarbonamide)、偶氮二甲醯胺(Azobisformamide)、偶氮二異丁腈、偶氮二羧酸鋇、N,N'-二亞硝基五亞甲基四胺、N,N'-二亞硝基-N,N'-二甲基對苯二甲醯胺、苯磺醯肼、對甲苯磺醯肼、對,對'-氧基雙苯磺醯肼、對甲苯磺醯胺基脲等,但並不限定於以上。 作為物理發泡劑,例如可例舉:戊烷、丁烷、己烷等烴;氯甲烷、二氯甲烷等鹵代烴;氮氣、二氧化碳、空氣等氣體;三氯氟甲烷、二氯二氟甲烷、三氯三氟乙烷、氯二氟乙烷、氫氟碳等氟化烴等,但並不限定於以上。 又,該等發泡劑亦可組合使用。 發泡劑之調配量相對於本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物100質量份,較佳為0.1~30質量份,更佳為2~25質量份,進而較佳為3~20質量份。 (Foaming agent (E)) As the above-mentioned foaming agent, an inorganic foaming agent, an organic foaming agent, or a physical foaming agent can be used. As the inorganic foaming agent, for example, sodium bicarbonate, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, azide compounds, sodium borohydride, aluminum acetate, metal powder, etc. can be cited, but it is not limited to the above. Examples of organic foaming agents include: azodicarbonamide, azobisformamide, azobisisobutyronitrile, barium azodicarboxylate, N,N'-dinitrosopentamethylenetetramine, N,N'-dinitroso-N,N'-dimethylterephthalamide, benzenesulfonylhydrazine, p-toluenesulfonylhydrazine, p-,p-oxybisbenzenesulfonylhydrazine, p-toluenesulfonylamide urea, etc., but are not limited to the above. As physical foaming agents, for example, hydrocarbons such as pentane, butane, and hexane; halogenated hydrocarbons such as methyl chloride and dichloromethane; gases such as nitrogen, carbon dioxide, and air; fluorinated hydrocarbons such as trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, chlorodifluoroethane, and hydrofluorocarbon, etc., but are not limited to the above. In addition, these foaming agents can also be used in combination. The amount of the foaming agent is preferably 0.1 to 30 parts by mass, more preferably 2 to 25 parts by mass, and further preferably 3 to 20 parts by mass relative to 100 parts by mass of the hydrogenated block copolymer or the hydrogenated block copolymer composition of the present embodiment.

(發泡助劑) 於上述發泡體之製作步驟中,可與發泡助劑一同使用發泡劑。 作為發泡助劑,並無特別限定,可使用先前作為發泡助劑所通用者。 例如可例舉:脲化合物;氧化鋅、硬脂酸鋅、苯亞磺酸鋅、甲苯磺酸鋅、三氟甲磺酸鋅、碳酸鋅等鋅化合物;二氧化鉛、及三鹼式鉛等鉛化合物等。 於併用發泡劑與發泡助劑之情形時,其調配量相對於發泡劑100質量份,較佳為將發泡助劑設為0.1~1000質量份,更佳為設為0.5~500質量份,進而較佳為設為1~200質量份。 (Foaming aid) In the above-mentioned step of preparing the foamed body, a foaming agent may be used together with the foaming aid. The foaming aid is not particularly limited, and those commonly used as foaming aids can be used. For example, urea compounds; zinc compounds such as zinc oxide, zinc stearate, zinc benzenesulfinate, zinc toluenesulfonate, zinc trifluoromethanesulfonate, zinc carbonate; lead compounds such as lead dioxide and tribasic lead, etc. can be cited. When a foaming agent and a foaming aid are used together, the amount of the foaming aid relative to 100 parts by mass of the foaming agent is preferably 0.1 to 1000 parts by mass, more preferably 0.5 to 500 parts by mass, and even more preferably 1 to 200 parts by mass.

(發泡成核劑) 於上述發泡體之製作步驟中,可使用發泡成核劑。 作為發泡成核劑,並無特別限定,可使用先前作為發泡成核劑而通用者。 例如可例舉:氧化鈦、滑石、高嶺土、黏土、矽酸鈣、二氧化矽、檸檬酸鈉、碳酸鈣、矽藻土、煅燒波來鐵、沸石、膨潤土、玻璃、石灰石、硫酸鈣、氧化鋁、氧化鈦、碳酸鎂、碳酸鈉、碳酸鐵、聚四氟乙烯粉末。 關於發泡成核劑之調配量,相對於本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物100質量份,較佳為將發泡成核劑設為0.01~100質量份,更佳為0.05~50質量份,進而較佳為0.1~10質量份。 (Foaming nucleating agent) In the above-mentioned step of preparing the foamed body, a foaming nucleating agent may be used. As the foaming nucleating agent, there is no particular limitation, and those commonly used as foaming nucleating agents can be used. For example, titanium oxide, talc, kaolin, clay, calcium silicate, silicon dioxide, sodium citrate, calcium carbonate, diatomaceous earth, calcined porphyry, zeolite, bentonite, glass, limestone, calcium sulfate, aluminum oxide, titanium oxide, magnesium carbonate, sodium carbonate, iron carbonate, polytetrafluoroethylene powder can be cited. Regarding the amount of the foaming nucleating agent, relative to 100 parts by mass of the hydrogenated block copolymer or hydrogenated block copolymer composition of the present embodiment, it is preferred to set the foaming nucleating agent to 0.01 to 100 parts by mass, more preferably 0.05 to 50 parts by mass, and even more preferably 0.1 to 10 parts by mass.

(發泡體之使用例) 本實施方式之發泡體可應用於片材或膜或其他各種形狀之射出成形品、中空成形品、壓空成形品、真空成形品、擠出成形品等。 又,本實施方式之發泡體可廣泛地用於汽車內飾材料(儀錶板、車門板、座椅靠背板、方向盤等)、家電製品、工具、傢俱(緩衝部等)、住宅建材等需要緩衝性之構件。 於將本實施方式之發泡體用於汽車內飾材料用途之情形時,作為所使用之發泡劑,從低健康有害性之觀點出發,較佳為碳酸氫鈉或氮氣、二氧化碳、空氣等氣體。 (Examples of Use of Foam) The foam of this embodiment can be applied to injection molded products, hollow molded products, compressed air molded products, vacuum molded products, extruded molded products, etc. in the form of sheets or films or other various shapes. In addition, the foam of this embodiment can be widely used in automotive interior materials (dashboards, door panels, seat back panels, steering wheels, etc.), home appliances, tools, furniture (cushion parts, etc.), residential building materials, and other components that require cushioning properties. When the foam of this embodiment is used for automotive interior materials, the foaming agent used is preferably sodium bicarbonate or gases such as nitrogen, carbon dioxide, and air from the perspective of low health hazards.

(射出成形發泡之方法) 本實施方式之發泡體可藉由射出成形發泡來製作。 作為射出成形發泡之方法,並無特別限制,可例舉:短射法、全射法、抽芯法等。 藉由使用上述方法,可於相同之步驟內使具有緩衝性之發泡層、及褶皺面等具有設計性或與發泡層相比具有硬度之表層成形,故對削減成形步驟較有效。 又,作為射出成形發泡之方法,於應用抽芯法時,亦可基於消除成形體表面之旋渦痕(swirl mark)之目的等而使用反壓(Counter Pressure)裝置。 (Injection molding foaming method) The foam body of the present embodiment can be produced by injection molding foaming. There is no particular limitation on the method of injection molding foaming, and examples thereof include: short shot method, full shot method, core pulling method, etc. By using the above method, a foam layer with cushioning properties and a surface layer with a design such as a pleated surface or a hardness compared to the foam layer can be formed in the same step, so it is more effective in reducing the molding steps. In addition, as a method of injection molding foaming, when applying the core pulling method, a counter pressure device can also be used for the purpose of eliminating swirl marks on the surface of the molded body.

(適於發泡體之成形之氫化嵌段共聚物組合物) 發泡體之成形中之本實施方式之氫化嵌段共聚物組合物中的氫化嵌段共聚物(甲)之含量較佳為1質量%以上且50質量%以下,更佳為10質量%以上且49質量%以下,進而較佳為20質量%以上且48質量%以下。 若氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之含量處於上述範圍內,則於發泡體成形時有氣泡微細且氣泡之獨立性增高(發泡性增高)之傾向,故可期待隔熱性之提高或長期之氣泡穩定性、或改善抽芯成形時之成形外觀(抑制縮痕、凹坑、旋渦痕等)。 又,本實施方式之氫化嵌段共聚物(甲)之依據JIS K7210於溫度230℃、荷重2.16 kg之條件下測定的MFR(Melt Flow Rate,熔體流動速率)為10以上,於發泡體成形中所使用之氫化共聚物組合物中之氫化嵌段共聚物(甲)中,上述MFR較佳為15以上,更佳為30以上,進而較佳為50以上。 若MFR較高,則可獲得良好之加工性,可期待改善發泡體成形時之成形外觀(抑制縮痕、凹坑、旋渦痕)、或提高發泡倍率。 發泡倍率之較佳之範圍取決於用途,但通常較佳為1.5倍以上,更佳為1.75倍以上。由於倍率較高,故可謀求輕量化、柔軟性之提高、設計性之提高、制振、吸音特性之提高、隔熱特性之提高。 (Hydrogenated block copolymer composition suitable for foam molding) The content of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment in foam molding is preferably 1 mass % or more and 50 mass % or less, more preferably 10 mass % or more and 49 mass % or less, and further preferably 20 mass % or more and 48 mass % or less. If the content of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition is within the above range, the bubbles tend to be fine and the independence of the bubbles increases (the foaming property increases) during foam molding, so it can be expected that the heat insulation property is improved or the bubble stability is improved for a long time, or the molding appearance is improved during core-pulling molding (suppression of shrinkage marks, pits, vortex marks, etc.). In addition, the MFR (Melt Flow Rate) of the hydrogenated block copolymer (A) of the present embodiment measured at a temperature of 230°C and a load of 2.16 kg according to JIS K7210 is 10 or more, and in the hydrogenated block copolymer (A) in the hydrogenated copolymer composition used in foam molding, the MFR is preferably 15 or more, more preferably 30 or more, and further preferably 50 or more. If the MFR is higher, good processability can be obtained, and it can be expected to improve the molding appearance during foam molding (suppress shrinkage marks, pits, vortex marks), or increase the foaming ratio. The preferred range of the foaming ratio depends on the application, but it is usually preferably 1.5 times or more, and more preferably 1.75 times or more. Due to the high ratio, it is possible to achieve lightness, improved flexibility, improved design, improved vibration reduction, improved sound absorption, and improved heat insulation properties.

發泡體成形中所使用之氫化嵌段共聚物組合物中之烯烴系樹脂(乙)之含量較佳為5質量%以上且50質量%以下,更佳為8質量%以上且45質量%以下,進而較佳為12質量%以上且40質量%以下。 若烯烴系樹脂(乙)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。 The content of the olefinic resin (II) in the hydrogenated block copolymer composition used in foam molding is preferably 5% by mass or more and 50% by mass or less, more preferably 8% by mass or more and 45% by mass or less, and further preferably 12% by mass or more and 40% by mass or less. If the content of the olefinic resin (II) is within the above range, the balance between foamability and softness tends to be good.

發泡體成形中所使用之氫化嵌段共聚物組合物中之熱塑性樹脂(丙)之含量較佳為1質量%以上且50質量%以下,更佳為5質量%以上且40質量%以下,進而較佳為10質量%以上且30%以下。 若熱塑性樹脂(丙)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。 The content of the thermoplastic resin (C) in the hydrogenated block copolymer composition used in foam molding is preferably 1 mass % or more and 50 mass % or less, more preferably 5 mass % or more and 40 mass % or less, and further preferably 10 mass % or more and 30 mass % or less. If the content of the thermoplastic resin (C) is within the above range, the balance between foamability and softness tends to be good.

發泡體成形中所使用之氫化嵌段共聚物組合物中之軟化劑(丁)之含量較佳為5質量%以上且90質量%以下,更佳為10質量%以上且70質量%以下,進而較佳為20質量%以上且36質量%以下。 若軟化劑(丁)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。 [實施例] The content of the softener (D) in the hydrogenated block copolymer composition used in foam molding is preferably 5 mass % or more and 90 mass % or less, more preferably 10 mass % or more and 70 mass % or less, and further preferably 20 mass % or more and 36 mass % or less. If the content of the softener (D) is within the above range, the balance between foamability and softness tends to be good. [Example]

以下,例舉具體之實施例及比較例對本發明詳細地進行說明,但本發明並不受以下之實施例及比較例之任何限定。 下文對實施例及比較例中所應用之物性之測定方法、評價方法進行闡述。 The present invention is described in detail below by taking specific embodiments and comparative examples as examples, but the present invention is not limited to the following embodiments and comparative examples. The following describes the measurement method and evaluation method of the physical properties used in the embodiments and comparative examples.

[共聚物之結構之特定方法] ((1)氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量) 使用氫化嵌段共聚物,利用紫外分光光度計(島津製作所製造,UV-2450),測定氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量。 [Specification method of copolymer structure] ((1) Content of all vinyl aromatic monomer units (styrene) in hydrogenated block copolymer (A)) Using the hydrogenated block copolymer, the content of all vinyl aromatic monomer units (styrene) in the hydrogenated block copolymer (A) was measured using an ultraviolet spectrophotometer (manufactured by Shimadzu Corporation, UV-2450).

((2-1)氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(聚苯乙烯嵌段)(a)之含量) 使用氫化嵌段共聚物,並使用核磁共振裝置(NMR)(Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981)中所記載之方法。以下稱為「NMR法」),測定氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量。 ((2-1) Content of polymer block (polystyrene block) (a) mainly composed of vinyl aromatic monomer units in hydrogenated block copolymer (A)) Using hydrogenated block copolymers, the content of polymer block (a) mainly composed of vinyl aromatic monomer units in hydrogenated block copolymers (A) was measured using a nuclear magnetic resonance device (NMR) (the method described in Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981). hereinafter referred to as "NMR method").

((2-2)氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量) 藉由算出(100-氫化嵌段共聚物(甲)中之氫化共聚物嵌段(a)之含量),求出氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量。 ((2-2) The content of hydrogenated copolymer block (b) in hydrogenated block copolymer (A)) The content of hydrogenated copolymer block (b) in hydrogenated block copolymer (A) is obtained by calculating (100-the content of hydrogenated copolymer block (a) in hydrogenated block copolymer (A)).

((3)氫化嵌段共聚物(甲)中之乙烯基鍵量) 使用氫化嵌段共聚物,並使用核磁共振裝置(NMR)測定乙烯基鍵量。氫化嵌段共聚物(甲)中之共軛二烯單體單元中之乙烯基鍵量係藉由如下比率求出,該比率為與NMR測定中獲得之波峰中之共軛二烯單體單元相關的1,2-鍵及3,4-鍵之波峰合計面積相對於所有波峰(1,2-鍵、3,4-鍵之比率、及1,4-鍵)之合計面積之比率。 ((3) Vinyl bond content in hydrogenated block copolymer (A)) The hydrogenated block copolymer was used and the vinyl bond content was measured using a nuclear magnetic resonance device (NMR). The vinyl bond content in the conjugated diene monomer unit in the hydrogenated block copolymer (A) was obtained by the ratio of the total area of the peaks of 1,2-bond and 3,4-bond related to the conjugated diene monomer unit in the peaks obtained in the NMR measurement to the total area of all peaks (ratio of 1,2-bond, 3,4-bond, and 1,4-bond).

((4)氫化嵌段共聚物(甲)之重量平均分子量、分子量分佈) 使用氫化嵌段共聚物,利用GPC[裝置:HLC-82209PC(東曹公司製造),管柱:TSKgeguard colum SuperHZ-L(4.6 mm×20 cm)×3根]進行測定。 溶劑使用四氫呋喃。測定係於溫度35℃下進行。 重量平均分子量係使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量而製作),求出層析圖之波峰之分子量。 再者,於在層析圖中存在複數個波峰之情形時,將根據各波峰之分子量與各波峰之組成比(根據層析圖之各波峰之面積比求出)求出之平均分子量設為重量平均分子量(Mw)。 關於分子量分佈(Mw/Mn),亦同樣地利用GPC測定數量平均分子量(Mn),並根據Mw/Mn之比率算出。 ((4) Weight average molecular weight and molecular weight distribution of hydrogenated block copolymer (A)) The hydrogenated block copolymer was measured by GPC [apparatus: HLC-82209PC (manufactured by Tosoh Corporation), column: TSK Geguard colum SuperHZ-L (4.6 mm×20 cm)×3]. The solvent used was tetrahydrofuran. The measurement was performed at a temperature of 35°C. The weight average molecular weight was obtained by using a calibration curve obtained by measuring commercially available standard polystyrene (prepared using the peak molecular weight of standard polystyrene) to obtain the molecular weight of the peak of the chromatogram. Furthermore, when there are multiple peaks in the chromatogram, the average molecular weight calculated from the molecular weight of each peak and the composition ratio of each peak (calculated from the area ratio of each peak in the chromatogram) is set as the weight average molecular weight (Mw). Regarding the molecular weight distribution (Mw/Mn), the number average molecular weight (Mn) is measured by GPC in the same way and calculated from the ratio of Mw/Mn.

((5)氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率) 使用氫化嵌段共聚物,並使用核磁共振裝置(JEOL RESONANCE公司製造,測定ECS400),測定氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率。 ((5) Hydrogenation rate of double bonds of conjugated diene monomer units in hydrogenated block copolymer (A)) The hydrogenated block copolymer was used and a nuclear magnetic resonance device (manufactured by JEOL RESONANCE, measurement ECS400) was used to measure the hydrogenation rate of double bonds of conjugated diene monomer units in the hydrogenated block copolymer (A).

((6-1)相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS、氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量) 根據上述(1)中測定之氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元之含量、與上述(2-1)中測定之氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量的差,算出相對於聚合物整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元含量RS,且根據與上述(2-2)中測定之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量之比,算出氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量。 ((6-1) Content RS of vinyl aromatic monomer units in hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (A), content of vinyl aromatic monomer units in hydrogenated copolymer block (b)) The content RS of vinyl aromatic monomer units in hydrogenated copolymer block (b) relative to the entire polymer is calculated based on the difference between the content of all vinyl aromatic monomer units in hydrogenated block copolymer (A) measured in (1) above and the content of polymer block (a) mainly composed of vinyl aromatic monomer units in hydrogenated block copolymer (A) measured in (2-1) above, and the content of vinyl aromatic monomer units in hydrogenated copolymer block (b) is calculated based on the ratio to the content of hydrogenated copolymer block (b) in hydrogenated block copolymer (A) measured in (2-2) above.

((6-2)氫化共聚物嵌段(b)中之共軛二烯單體單元相對於氫化嵌段共聚物(甲)整體之含量) 藉由自氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量減去相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量而求出。 ((6-2) Content of the covalent diene monomer unit in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (A)) Calculated by subtracting the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (A) from the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A).

[氫化嵌段共聚物之物性之測定方法] ((7)tanδ波峰溫度) 將如下所述般製造之「氫化嵌段共聚物之加壓成形片材」切割為寬度12.5 mm、長度40 mm之尺寸而設為測定用樣品。 其次,將該測定用樣品設定為裝置ARES(TA Instruments股份有限公司製造,商品名)之扭轉型幾何形狀,於有效測定長度25 mm、應變0.5%、頻率1 Hz、升溫速度3℃/min之條件下,求出-20~60℃之tanδ波峰溫度。 tanδ波峰溫度設為根據利用RSI Orchestrator(TA Instruments股份有限公司製造,商品名)之自動測定而檢測到之波峰求出之值。 [Method for measuring physical properties of hydrogenated block copolymers] ((7) tanδ peak temperature) The "hydrogenated block copolymer pressure-molded sheet" produced as described below was cut into a size of 12.5 mm in width and 40 mm in length to serve as a sample for measurement. Next, the sample for measurement was set to the torsion geometry of the device ARES (trade name, manufactured by TA Instruments Co., Ltd.) and the tanδ peak temperature of -20 to 60°C was determined under the conditions of an effective measurement length of 25 mm, a strain of 0.5%, a frequency of 1 Hz, and a heating rate of 3°C/min. The tanδ peak temperature was determined based on the peak detected by automatic measurement using RSI Orchestrator (trade name, manufactured by TA Instruments Co., Ltd.).

((8)tanδ峰高) 將上述(7)中求出之-20~60℃之tanδ波峰溫度下的tanδ之值設為-20~60℃之tanδ峰高。 ((8) Tanδ peak height) The tanδ value at the tanδ peak temperature of -20 to 60℃ obtained in (7) above is set as the tanδ peak height of -20 to 60℃.

((9)硬度) 製成如下所述般製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 依據JIS K6253,利用A型硬度計分別測定瞬時之值。 對使硬度測定器之探針降下至測定用樣品上之瞬時之硬度值進行測定。 於下述表4~表5中,記載為硬度(JIS-A,瞬時)。 ((9) Hardness) A sample for measurement of a "pressure-molded sheet of a hydrogenated block copolymer" was prepared as described below. The instantaneous value was measured using a type A hardness tester in accordance with JIS K6253. The instantaneous hardness value when the probe of the hardness tester was lowered onto the measurement sample was measured. In Tables 4 and 5 below, it is recorded as hardness (JIS-A, instantaneous).

((10)熔體流動速率(MFR,單位:g/10 min)) 製成如下所述般製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 依據JIS K7210,於溫度230℃、荷重2.16 kg之條件下進行MFR之測定。 ((10) Melt flow rate (MFR, unit: g/10 min)) A sample for measurement of a "pressure-molded sheet of a hydrogenated block copolymer" was prepared as described below. MFR was measured at a temperature of 230°C and a load of 2.16 kg in accordance with JIS K7210.

[使用氫化嵌段共聚物之成形體之特性之評價方法] ((11)耐磨耗性) 使用學振型摩擦試驗器(TESTER SANGYO股份有限公司製造,AB-301型),以摩擦布細白布3號棉、荷重500 g,對藉由下述[射出成形片材之製作]而製作之射出成形片材表面(皮紋加工面)進行摩擦,根據摩擦後之體積減少量,依據以下之基準評價耐磨耗性。 <評價基準> 5:摩擦次數50000次後,體積減少量未達0.01 ml 4:摩擦次數50000次後,體積減少量為0.01 ml以上且未達0.05 ml 3:摩擦次數50000次後,體積減少量為0.05 ml以上且未達0.10 ml 2:摩擦次數50000次後,體積減少量為0.10 ml以上且未達0.15 ml 1:摩擦次數50000次後,體積減少量超過0.15 ml [Evaluation method of properties of molded articles using hydrogenated block copolymers] ((11) Wear resistance) Using a Gakushin friction tester (AB-301 model, manufactured by Tester Sangyo Co., Ltd.), the surface (grained surface) of the injection molded sheet produced by the following [Production of injection molded sheets] was rubbed with a friction cloth made of fine white cloth No. 3 cotton and a load of 500 g. The wear resistance was evaluated based on the volume reduction after friction according to the following criteria. <Evaluation criteria> 5: After 50,000 frictions, the volume reduction is less than 0.01 ml 4: After 50,000 frictions, the volume reduction is 0.01 ml or more and less than 0.05 ml 3: After 50,000 frictions, the volume reduction is 0.05 ml or more and less than 0.10 ml 2: After 50,000 frictions, the volume reduction is 0.10 ml or more and less than 0.15 ml 1: After 50,000 frictions, the volume reduction exceeds 0.15 ml

可判定為耐磨耗性合格之評分為3分以上,且分數越高,就於使用上述更薄壁/複雜之成形體之情形時,以更高之荷重或眼較粗之布料進行磨耗時之耐久性提高、調配自由度提高之觀點而言,評價為越優異。 若耐磨耗性良好,則可於汽車材料等中,用於要求更嚴格之耐磨耗性之用途。例如,於汽車內飾材料等中,於以更薄壁成形時或更複雜/大型之成形體成形時,亦不遜色於簡易之形狀且小型之通常之成形體,且可期待於使用更長時間之情形時亦維持材料之外觀。 又,於假定乘車時因更高之荷重或眼較粗之布料(例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等)而受到磨耗之情形,亦可期待長時間維持材料外觀。 又,若耐磨耗性良好,則有於本實施方式之氫化嵌段共聚物組合物中氫化嵌段共聚物(甲)調配量下限降低,調配自由度提高之傾向。 通常有氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之調配量越多,則耐磨耗性變得越良好之傾向,但有氫化嵌段共聚物(甲)之調配量越少,則耐油性或材料成本等變得越良好之傾向,故調配量之下限較佳為較低。 The score that can be judged as qualified for wear resistance is 3 points or more, and the higher the score, the better it is evaluated from the perspective of improved durability and increased freedom of blending when using the above-mentioned thinner wall/complex molded bodies, with higher loads or coarser mesh fabrics. If the wear resistance is good, it can be used in automotive materials and other applications that require more stringent wear resistance. For example, in automotive interior materials, when thinner wall molding or more complex/large molded bodies are formed, it is not inferior to simple shapes and small ordinary molded bodies, and it can be expected that the appearance of the material can be maintained even when used for a longer period of time. Furthermore, even when the material is worn by a higher load or a coarser mesh (e.g., a coarser mesh than cotton fabric such as fine white cloth No. 3, i.e., a denim cotton fabric) during riding, it can be expected that the material appearance can be maintained for a long time. In addition, if the wear resistance is good, the lower limit of the amount of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment is reduced, and the degree of freedom in the blending tends to be improved. Generally, the more the amount of the hydrogenated block copolymer (A) in the hydrogenated block copolymer composition is, the better the wear resistance tends to be, but the less the amount of the hydrogenated block copolymer (A) is, the better the oil resistance or material cost tends to be, so the lower limit of the blending amount is preferably lower.

((12)低反彈性:鄧祿普(Dunlop)反跳彈性模數) 製成以下述方式製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 利用鄧祿普反跳彈性試驗機,依據BS903,於23℃下測定反跳彈性模數。 從觸感之觀點出發,若反跳彈性模數為20%以下,則實用上良好,數值越低,評價為傾向於越優異。 ((12) Low resilience: Dunlop rebound modulus) A sample for measurement of a "hydrogenated block copolymer pressure-molded sheet" manufactured in the following manner was prepared. The rebound modulus was measured at 23°C using a Dunlop rebound modulus tester in accordance with BS903. From the perspective of touch, if the rebound modulus is 20% or less, it is good in practice, and the lower the value, the more excellent the evaluation tends to be.

(氫化嵌段共聚物之隨機性參數g之算出) 對氫化嵌段共聚物(甲),於下述表3之條件下,進行py-GC/MS測定,並算出波峰強度P。 又,根據相對於氫化嵌段共聚物(甲)整體之共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS,利用P0=0.005563×RS算出P0,並根據g=P/P0算出g。 此處,上述「0.005563」表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數(k),該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行分析時獲得。 (Calculation of random parameter g of hydrogenated block copolymer) The hydrogenated block copolymer (A) was subjected to py-GC/MS measurement under the conditions of Table 3 below, and the peak intensity P was calculated. In addition, P0 was calculated using P0=0.005563×RS based on the content RS of the vinyl aromatic monomer unit in the copolymer block (b) relative to the entire hydrogenated block copolymer (A), and g was calculated based on g=P/P0. Here, the above "0.005563" represents the proportional constant (k) when the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole is first approximated with the peak intensity P, which is obtained when the hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization method) is analyzed using a thermal decomposition gas chromatography mass spectrometer.

[表3] 熱解器裝置 Frontier Lab公司製造 Multishot Pyrolyzer EGA/PY-3030D 熱解器加熱條件 500℃ GC裝置 Agilent Technologies公司製造 7890A 使用管柱 DB-1(30 m×0.25 mmΦ,膜厚0.25 μm) 管柱溫度模式 於40℃下保持5 min後,以20℃/min升溫至320℃ 於320℃下保持11 min 氣體流速 1 ml/min 樣品注入口溫度 320℃ 分流比 1/50 樣品測定量 0.10 mg MS裝置 JEOL RESONANCE公司製造 JMS-Q1500GC 介面溫度 320℃ 離子化 EI 70 eV 掃描範圍 m/z 10~800 離子源溫度 240℃ [Table 3] Pyrolyzer device Frontier Lab Multishot Pyrolyzer EGA/PY-3030D Pyrolyzer heating conditions 500℃ GC device Agilent Technologies manufactures the 7890A Use the column DB-1 (30 m×0.25 mmΦ, film thickness 0.25 μm) Column temperature mode After keeping at 40℃ for 5 min, increase the temperature to 320℃ at 20℃/min and keep at 320℃ for 11 min Gas flow rate 1 ml/min Sample injection port temperature 320℃ Split Ratio 1/50 Sample measurement 0.10 mg MS device JEOL RESONANCE Co., Ltd. manufactures JMS-Q1500GC Interface temperature 320℃ Ionization EI 70 eV Scanning range m/z 10~800 Ion source temperature 240℃

[氫化嵌段共聚物之製造] (氫化觸媒之製備) 藉由下述方法製備於下述實施例及比較例中製作氫化嵌段共聚物時所使用之氫化觸媒。 預先對具備攪拌裝置之反應容器進行氮氣置換,於其中添加經乾燥、純化之環己烷1升。 其次,添加雙(η5-環戊二烯基)二氯化鈦100毫莫耳。 一面將其充分地攪拌,一面添加包含三甲基鋁200毫莫耳之正己烷溶液,於室溫下反應約3天。藉此獲得氫化觸媒。 [Production of Hydrogenated Block Copolymer] (Preparation of Hydrogenated Catalyst) The hydrogenated catalyst used in the production of hydrogenated block copolymers in the following examples and comparative examples was prepared by the following method. A reaction vessel equipped with a stirring device was replaced with nitrogen in advance, and 1 liter of dried and purified cyclohexane was added thereto. Next, 100 mmol of bis(η5-cyclopentadienyl)titanium dichloride was added. While stirring the mixture thoroughly, an n-hexane solution containing 200 mmol of trimethylaluminum was added, and the mixture was reacted at room temperature for about 3 days. Thus, a hydrogenated catalyst was obtained.

(氫化嵌段共聚物) 以如下方式製備構成氫化嵌段共聚物組合物之氫化嵌段共聚物(甲)-1~(甲)-10、(甲)-A~(甲)-E。 (Hydrogenated block copolymer) Hydrogenated block copolymers (A)-1 to (A)-10, (A)-A to (A)-E constituting the hydrogenated block copolymer composition were prepared as follows.

[實施例1] (氫化嵌段共聚物(甲)-1) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯13質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份添加正丁基鋰0.047質量份,及相對於正丁基鋰(n-BuLi)1莫耳添加乙烯基鍵量調整劑N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯30質量份與苯乙烯44質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升。於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯13質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為44質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-1。 所獲得之氫化嵌段共聚物(甲)-1之氫化率為98莫耳%。 將其他物性示於表4。 [Example 1] (Hydrogenated block copolymer (A)-1) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 13 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.047 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of vinyl bond adjuster N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium (n-BuLi), and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 30 parts by mass of butadiene and 44 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, while using ReactIR to quantify the concentrations of butadiene and styrene in the reaction system in real time, the feed rate is appropriately adjusted in such a way that the polymerization rate of each reaches 1:1 (mass fraction conversion). In ReactIR, butadiene monomer is tracked at a wavelength of 1589 cm -1 , and styrene monomer is always tracked at a wavelength of 775 cm -1 . When the reactivity ratio is higher than the required reactivity ratio by more than 10%, the feed rate of butadiene is increased. When the reactivity ratio is lower than the required reactivity ratio by more than 10%, the feed rate of butadiene is reduced to adjust to the required reaction ratio until the reaction is completed. Finally, a cyclohexane solution containing 13 parts by mass of styrene (concentration 20 mass%) is added, and polymerization is carried out at 65°C for 1 hour. Thereafter, methanol is added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 70% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 44% by mass, a vinyl bond content of 21% by mass, and a weight average molecular weight of 160,000. Furthermore, to the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared by the above method was added based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-1. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-1 was 98 mol%. Other physical properties are shown in Table 4.

[實施例2] (氫化嵌段共聚物(甲)-2) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯12質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯31質量份與苯乙烯45質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯12質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為69質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為45質量%,乙烯基鍵量為20質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-2。 所獲得之氫化嵌段共聚物(甲)-2之氫化率為98莫耳%。將其他物性示於表4。 [Example 2] (Hydrogenated block copolymer (A)-2) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 12 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.048 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 31 parts by mass of butadiene and 45 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 12 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 69% by mass, a vinyl aromatic monomer unit content RS of 45% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 20% by mass, and a weight average molecular weight of 160,000. Furthermore, the hydrogenation catalyst prepared by the above method was added to the obtained block copolymer at 100 ppm based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-2. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-2 was 98 mol%. Other physical properties are shown in Table 4.

[實施例3] (氫化嵌段共聚物(甲)-3) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為21質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-3。 所獲得之氫化嵌段共聚物(甲)-3之氫化率為98莫耳%。將其他物性示於表4。 [Example 3] (Hydrogenated block copolymer (A)-3) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.048 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 66% by mass, a vinyl aromatic monomer unit content RS of 50% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 21% by mass, and a weight average molecular weight of 161,000. Furthermore, a hydrogenation catalyst prepared by the above method is added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-3. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-3 was 98 mol%. Other physical properties are shown in Table 4.

[實施例4] (氫化嵌段共聚物(甲)-4) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯7質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.049質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯35質量份與苯乙烯51質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯7質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為65質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為51質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-4。 所獲得之氫化嵌段共聚物(甲)-4之氫化率為98莫耳%。將其他物性示於表4。 [Example 4] (Hydrogenated block copolymer (A)-4) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 7 parts by mass of styrene (concentration 20 mass%) was added. Next, 0.049 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 35 parts by mass of butadiene and 51 parts by mass of styrene was added (concentration 20 mass%), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 7 parts by mass of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 65% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 51% by mass, a vinyl bond content of 21% by mass, and a weight average molecular weight of 160,000. Furthermore, to the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared by the above method was added based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-4. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-4 was 98 mol%. Other physical properties are shown in Table 4.

[實施例5] (氫化嵌段共聚物(甲)-5) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯39質量份與苯乙烯45質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為61質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為45質量%,乙烯基鍵量為24質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-5。 所獲得之氫化嵌段共聚物(甲)-5之氫化率為98莫耳%。將其他物性示於表4。 [Example 5] (Hydrogenated block copolymer (A)-5) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.050 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 39 parts by mass of butadiene and 45 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 61% by mass, a vinyl aromatic monomer unit content RS of 45% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 24% by mass, and a weight average molecular weight of 160,000. Furthermore, a hydrogenation catalyst prepared by the above method is added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-5. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-5 was 98 mol%. Other physical properties are shown in Table 4.

[實施例6] (氫化嵌段共聚物(甲)-6) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯38質量份與苯乙烯46質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為62質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為46質量%,乙烯基鍵量為22質量%,重量平均分子量為15.9萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-6。 所獲得之氫化嵌段共聚物(甲)-6之氫化率為98莫耳%。將其他物性示於表4。 [Example 6] (Hydrogenated block copolymer (A)-6) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.050 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 38 parts by mass of butadiene and 46 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 62% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 46% by mass, a vinyl bond content of 22% by mass, and a weight average molecular weight of 159,000. Furthermore, the hydrogenation catalyst prepared by the above method was added to the obtained block copolymer at 100 ppm based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-6. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-6 was 98 mol%. Other physical properties are shown in Table 4.

[實施例7] (氫化嵌段共聚物(甲)-7) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.047質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯30質量份與苯乙烯54質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為54質量%,乙烯基鍵量為17質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-7。 所獲得之氫化嵌段共聚物(甲)-7之氫化率為98莫耳%。將其他物性示於表4。 [Example 7] (Hydrogenated block copolymer (A)-7) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.047 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 30 parts by mass of butadiene and 54 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 70% by mass, a vinyl aromatic monomer unit content RS of 54% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 17% by mass, and a weight average molecular weight of 160,000. Furthermore, a hydrogenation catalyst prepared by the above method was added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-7. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-7 was 98 mol%. Other physical properties are shown in Table 4.

[實施例8] (氫化嵌段共聚物(甲)-8) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.047質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯29質量份與苯乙烯55質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為71質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為55質量%,乙烯基鍵量為17質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-8。 所獲得之氫化嵌段共聚物(甲)-8之氫化率為98莫耳%。將其他物性示於表4。 [Example 8] (Hydrogenated block copolymer (A)-8) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.047 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 29 parts by mass of butadiene and 55 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 71% by mass, a vinyl aromatic monomer unit content RS of 55% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 17% by mass, and a weight average molecular weight of 160,000. Furthermore, a hydrogenation catalyst prepared by the above method was added to the obtained block copolymer at a Ti standard of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-8. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-8 was 98 mol%. Other physical properties are shown in Table 4.

[實施例9] (氫化嵌段共聚物(甲)-9) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於60℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為24質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-9。 所獲得之氫化嵌段共聚物(甲)-9之氫化率為98莫耳%。將其他物性示於表4。 [Example 9] (Hydrogenated block copolymer (A)-9) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.048 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 60°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 66% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 50% by mass, a vinyl bond content of 24% by mass, and a weight average molecular weight of 161,000. Furthermore, a hydrogenation catalyst prepared by the above method is added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-9. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-9 was 98 mol%. Other physical properties are shown in Table 4.

[實施例10] (氫化嵌段共聚物(甲)-10) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.5莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為17質量%,重量平均分子量為16.0萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-10。 所獲得之氫化嵌段共聚物(甲)-10之氫化率為98莫耳%。將其他物性示於表4。 [Example 10] (Hydrogenated block copolymer (A)-10) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.048 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.5 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 66% by mass, a vinyl aromatic monomer unit content RS of 50% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 17% by mass, and a weight average molecular weight of 160,000. Furthermore, a hydrogenation catalyst prepared by the above method was added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-10. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-10 was 98 mol%. Other physical properties are shown in Table 4.

[比較例1] (氫化嵌段共聚物(甲)-A) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯18質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.045質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯22質量份與苯乙烯42質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯18質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為78質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為42質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-A。 所獲得之氫化嵌段共聚物(甲)-A之氫化率為98莫耳%。將其他物性示於表5。 [Comparative Example 1] (Hydrogenated block copolymer (A)-A) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 18 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.045 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 22 parts by mass of butadiene and 42 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 18 parts by mass of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 78% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 42% by mass, a vinyl bond content of 21% by mass, and a weight average molecular weight of 160,000. Furthermore, to the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared by the above method was added based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-A. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-A was 98 mol%. Other physical properties are shown in Table 5.

[比較例2] (氫化嵌段共聚物(甲)-B) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯2質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯39質量份與苯乙烯57質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯2質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為61質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為57質量%,乙烯基鍵量為20質量%,重量平均分子量為15.9萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-B。 所獲得之氫化嵌段共聚物(甲)-B之氫化率為98莫耳%。將其他物性示於表5。 [Comparative Example 2] (Hydrogenated block copolymer (A)-B) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 2 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.050 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 39 parts by mass of butadiene and 57 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 2 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 61% by mass, a vinyl aromatic monomer unit content RS of 57% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 20% by mass, and a weight average molecular weight of 159,000. Furthermore, a hydrogenation catalyst prepared by the above method is added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-B. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-B was 98 mol%. Other physical properties are shown in Table 5.

[比較例3] (氫化嵌段共聚物(甲)-C) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.054質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯51質量份與苯乙烯33質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為49質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為33質量%,乙烯基鍵量為30質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-C。 所獲得之氫化嵌段共聚物(甲)-C之氫化率為98莫耳%。將其他物性示於表5。 [Comparative Example 3] (Hydrogenated block copolymer (A)-C) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.054 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 51 parts by mass of butadiene and 33 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 49% by mass, a vinyl aromatic monomer unit content RS of the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a) of 33% by mass, a vinyl bond content of 30% by mass, and a weight average molecular weight of 160,000. Furthermore, to the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared by the above method was added based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-C. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-C was 98 mol%. Other physical properties are shown in Table 5.

[比較例4] (氫化嵌段共聚物(甲)-D) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.044質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯20質量份與苯乙烯64質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm -1之波長追蹤丁二烯單體,且以775 cm -1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為80質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為64質量%,乙烯基鍵量為14質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-D。 所獲得之氫化嵌段共聚物(甲)-D之氫化率為98莫耳%。將其他物性示於表5。 [Comparative Example 4] (Hydrogenated block copolymer (A)-D) Batch polymerization was carried out using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added. Next, 0.044 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution containing 20 parts by mass of butadiene and 64 parts by mass of styrene was added (concentration 20% by mass), and polymerization was carried out at 80°C for 2 hours. At this time, the concentrations of butadiene and styrene in the reaction system were quantitatively measured in real time by using ReactIR, and the feed rate was appropriately adjusted so that the polymerization rate of each reached 1:1 (mass fraction conversion). In ReactIR, the butadiene monomer was tracked at a wavelength of 1589 cm -1 , and the styrene monomer was always tracked at a wavelength of 775 cm -1 . When the reactivity ratio was higher than the required reactivity ratio by more than 10%, the feed rate of butadiene was increased, and when the reactivity ratio was lower than the required reactivity ratio by more than 10%, the feed rate of butadiene was reduced, thereby adjusting to the required reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 8 mass parts of styrene (concentration 20 mass%) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. The block copolymer obtained by the above method has a styrene content of 80% by mass, a vinyl aromatic monomer unit content RS of 64% by mass in the hydrogenated copolymer block (b) relative to the entire hydrogenated block copolymer (a), a vinyl bond content of 14% by mass, and a weight average molecular weight of 161,000. Furthermore, a hydrogenation catalyst prepared by the above method is added to the obtained block copolymer at a Ti base of 100 ppm per 100 parts by mass of the block copolymer, and a hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to 100 parts by weight of the block copolymer to obtain a hydrogenated block copolymer (A)-D. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-D was 98 mol%. Other physical properties are shown in Table 5.

[比較例5] (氫化嵌段共聚物(甲)-E) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,未使用ReactIR,以進料速度成為丁二烯:苯乙烯=34:50之方式以一定速度進行進料。最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為25質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-E。 所獲得之氫化嵌段共聚物(甲)-E之氫化率為98莫耳%。將其他物性示於表5。 [Comparative Example 5] (Hydrogenated block copolymer (A)-E) Batch polymerization was performed using a tank reactor (content volume 10 L) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20 mass%) containing 8 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyl lithium was added relative to 100 parts by mass of all monomers, and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") was added relative to 1 mol of n-butyl lithium, and polymerization was performed at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20 mass%) containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added, and polymerization was performed at 80°C for 2 hours. At this time, ReactIR was not used, and the feed rate was set to butadiene:styrene = 34:50 at a constant rate. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Thereafter, methanol was added to stop the polymerization reaction and obtain a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content was 66% by mass, the content RS of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole was 50% by mass, the vinyl bond content was 25% by mass, and the weight average molecular weight was 160,000. Furthermore, to the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared in the above manner was added based on Ti per 100 parts by mass of the block copolymer, and a hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, 0.3 parts by mass of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate as a stabilizer was added to obtain a hydrogenated block copolymer (A)-E. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-E was 98 mol%. Other physical properties are shown in Table 5.

[加壓成形片材之製作] 使用4英吋輥,分別單獨對以上述方式製作之氫化嵌段共聚物(甲)-1~(甲)-10、及(甲)-A~(甲)-E於160℃下進行輥壓出,其後藉由油壓加壓,於200℃、100 kg/cm 2下進行加壓成形,製作2 mm厚之加壓成形片材。 [Preparation of pressure-molded sheets] The hydrogenated block copolymers (A)-1 to (A)-10 and (A)-A to (A)-E prepared in the above manner were individually rolled out at 160°C using a 4-inch roller, and then press-molded by hydraulic pressure at 200°C and 100 kg/ cm2 to produce 2 mm thick pressure-molded sheets.

[射出成形片材之製作] 使用氫化嵌段共聚物(甲)-1~(甲)-10、及(甲)-A~(甲)-E,於220℃下進行射出成形,製作2 mm厚之射出成形片材,獲得物性測定片。 [Preparation of injection molded sheets] Hydrogenated block copolymers (A)-1 to (A)-10 and (A)-A to (A)-E were used for injection molding at 220°C to prepare 2 mm thick injection molded sheets and obtain physical property measurement sheets.

對上述[實施例1~10]、[比較例1~5]之氫化嵌段共聚物(甲)-1~10、及(甲)-A~E,測定下述項目之數值。 (結構分析值) 氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量(質量%) 將氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元作為主體之聚合物嵌段(聚苯乙烯嵌段)(a)之含量(質量%) 氫化嵌段共聚物(甲)中之包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b)之含量(質量%) 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 氫化共聚物嵌段(b)中之共軛二烯相對於氫化嵌段共聚物(甲)整體之含量(質量%) 氫化嵌段共聚物(甲)中之乙烯基鍵量(質量%) 氫化嵌段共聚物(甲)之分子量分佈 氫化嵌段共聚物(甲)之重量平均分子量(萬) 氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率(莫耳%) (物性) ・熔體流動速率(MFR:230℃,2.16 kg) ・黏彈性測定圖中之-20~60℃之tanδ波峰溫度(℃) ・硬度(JIS-A 瞬時) For the hydrogenated block copolymers (A)-1 to 10 and (A)-A to E of [Examples 1 to 10] and [Comparative Examples 1 to 5] above, the values of the following items were measured. (Structural analysis value) Content of all vinyl aromatic monomer units (styrene) in hydrogenated block copolymer (A) (mass %) Content of polymer block (polystyrene block) (a) mainly composed of vinyl aromatic monomer units in hydrogenated block copolymer (A) (mass %) Content of hydrogenated copolymer block (b) containing vinyl aromatic monomer units and covalent diene monomer units in hydrogenated block copolymer (A) (mass %) Content of vinyl aromatic monomer units in hydrogenated copolymer block (b) (mass %) Content of vinyl aromatic monomer units in hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A) (mass %) Content of covalent diene in hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A) (mass %) Vinyl bond content in hydrogenated block copolymer (A) (mass %) Molecular weight distribution of hydrogenated block copolymer (A) Weight average molecular weight of hydrogenated block copolymer (A) (10,000) Hydrogenation rate of double bonds of conjugated diene monomer units in hydrogenated block copolymer (A) (mol %) (Physical properties) ・ Melt flow rate (MFR: 230℃, 2.16 kg) ・ Tanδ peak temperature at -20~60℃ in viscoelasticity measurement chart (℃) ・ Hardness (JIS-A instantaneous)

再者,聚合物嵌段(a)~(b)分別表示以下之聚合物嵌段。 聚合物嵌段(a):將乙烯基芳香族單體單元作為主體之聚合物嵌段 共聚物嵌段(b):包含乙烯基芳香族化合物單體單元與共軛二烯單體單元之氫化共聚物嵌段 Furthermore, polymer blocks (a) to (b) represent the following polymer blocks respectively. Polymer block (a): A polymer block mainly composed of vinyl aromatic monomer units Copolymer block (b): A hydrogenated copolymer block containing vinyl aromatic compound monomer units and covalent diene monomer units

[表4] 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 氫化嵌段共聚物 (甲)-1 (甲)-2 (甲)-3 (甲)-4 (甲)-5 (甲)-6 (甲)-7 (甲)-8 (甲)-9 (甲)-10 乙烯基鍵量調整劑(mol/n-BuLi 1 mol) 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.5 聚合溫度(℃) 80 80 80 80 80 80 80 80 60 80 有效利用react_IR 全部乙烯基芳香族單體單元之含量(質量%) 70 69 66 65 61 62 70 71 66 66 聚合物嵌段(a)之含量(質量%) 26 24 16 14 16 16 16 16 16 16 氫化共聚物嵌段(b)之含量(質量%) 74 76 84 86 84 84 84 84 84 84 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 59 59 59 59 53 55 64 66 59 59 相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%) 44 45 50 51 45 46 54 55 50 50 氫化共聚物嵌段(b)中之共軛二烯單體單元相對於氫化嵌段共聚物(甲)整體之含量(質量%) 30 31 34 35 39 38 30 29 34 34 氫化嵌段共聚物(甲)中之乙烯基鍵量(質量%) 21 20 21 21 24 22 17 17 24 17 分子量分佈 1.05 1.06 1.08 1.06 1.08 1.07 1.05 1.06 1.06 1.06 重量平均分子量(萬) 16.0 16.0 16.1 16.0 16.0 15.9 16.0 16.0 16.1 16.0 共軛二烯單體單元之雙鍵之氫化率(莫耳%) 98 98 98 98 98 98 98 98 98 98 波峰強度P 0.231 0.242 0.262 0.274 0.243 0.239 0.272 0.284 0.240 0.237 P0 0.243 0.249 0.276 0.282 0.248 0.257 0.299 0.308 0.276 0.276 隨機性參數g(=P/P0) 0.95 0.97 0.95 0.97 0.98 0.93 0.91 0.92 0.87 0.86 MFR(230℃,2.16 kg) 2.9 3.9 10.1 11.3 8.3 8.3 10.7 11.8 9.5 9.5 硬度(JIS-A,瞬時) 87 86 74 72 70 71 90 92 74 74 -20~60℃之tanδ波峰溫度(℃) 19 19 19 19 11 15 30 33 18 19 -20~60℃之tanδ峰高 1.7 1.8 2.2 2.3 2.2 2.2 2.2 2.2 2.0 2.0 耐磨耗性:評分 3 5 5 3 3 5 5 3 4 4 低反彈性:鄧祿普反跳彈性模數(%) 3.1 2.5 1.0 0.90 15 1.2 1.6 10 2.0 2.0 [Table 4] Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Embodiment 8 Embodiment 9 Embodiment 10 Hydrogenated block copolymer (A) -1 (A)-2 (A)-3 (A) -4 (A) -5 (A)-6 (A)-7 (A)-8 (A)-9 (A) -10 Vinyl bond adjuster (mol/n-BuLi 1 mol) 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.9 0.5 Polymerization temperature (℃) 80 80 80 80 80 80 80 80 60 80 Effective use of react_IR Content of all vinyl aromatic monomer units (mass %) 70 69 66 65 61 62 70 71 66 66 Content of polymer block (a) (mass %) 26 twenty four 16 14 16 16 16 16 16 16 Content of hydrogenated copolymer block (b) (mass %) 74 76 84 86 84 84 84 84 84 84 Content of vinyl aromatic monomer units in hydrogenated copolymer block (b) (mass %) 59 59 59 59 53 55 64 66 59 59 The content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (a) as a whole RS (mass %) 44 45 50 51 45 46 54 55 50 50 Content of the conjugated diene monomer unit in the hydrogenated copolymer block (b) relative to the total content of the hydrogenated block copolymer (a) (mass %) 30 31 34 35 39 38 30 29 34 34 Vinyl bond content in hydrogenated block copolymer (A) (mass %) twenty one 20 twenty one twenty one twenty four twenty two 17 17 twenty four 17 Molecular weight distribution 1.05 1.06 1.08 1.06 1.08 1.07 1.05 1.06 1.06 1.06 Weight average molecular weight (ten thousand) 16.0 16.0 16.1 16.0 16.0 15.9 16.0 16.0 16.1 16.0 Hydrogenation rate of double bonds of conjugated diene monomer units (molar %) 98 98 98 98 98 98 98 98 98 98 Peak intensity P 0.231 0.242 0.262 0.274 0.243 0.239 0.272 0.284 0.240 0.237 P0 0.243 0.249 0.276 0.282 0.248 0.257 0.299 0.308 0.276 0.276 Randomness parameter g(=P/P0) 0.95 0.97 0.95 0.97 0.98 0.93 0.91 0.92 0.87 0.86 MFR (230℃, 2.16 kg) 2.9 3.9 10.1 11.3 8.3 8.3 10.7 11.8 9.5 9.5 Hardness (JIS-A, instantaneous) 87 86 74 72 70 71 90 92 74 74 -20~60℃ tanδ peak temperature (℃) 19 19 19 19 11 15 30 33 18 19 -20~60℃ tanδ peak height 1.7 1.8 2.2 2.3 2.2 2.2 2.2 2.2 2.0 2.0 Abrasion resistance: Rating 3 5 5 3 3 5 5 3 4 4 Low rebound: Denlop rebound elastic modulus (%) 3.1 2.5 1.0 0.90 15 1.2 1.6 10 2.0 2.0

[表5] 比較例1 比較例2 比較例3 比較例4 比較例5 氫化嵌段共聚物 (甲)-A (甲)-B (甲)-C (甲)-D (甲)-E 乙烯基鍵量調整劑(mol/n-BuLi 1 mol) 0.9 0.9 0.9 0.9 0.9 聚合溫度(℃) 80 80 80 80 80 有效利用react_IR × 全部乙烯基芳香族單體單元之含量(質量%) 78 61 49 80 66 聚合物嵌段(a)之含量(質量%) 36 4 16 16 16 氫化共聚物嵌段(b)之含量(質量%) 64 96 84 84 84 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 65 59 39 76 59 相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%) 42 57 33 64 50 氫化共聚物嵌段(b)中之共軛二烯單體單元相對於氫化嵌段共聚物(甲)整體之含量(質量%) 22 39 51 20 34 氫化嵌段共聚物(甲)中之乙烯基鍵量(質量%) 21 20 30 14 25 分子量分佈 1.06 1.06 1.06 1.06 1.06 重量平均分子量(萬) 16.0 15.9 16.0 16.1 16.0 共軛二烯單體單元之雙鍵之氫化率(莫耳%) 98 98 98 98 98 波峰強度P 0.229 0.302 0.179 0.337 0.199 P0 0.231 0.315 0.182 0.355 0.276 隨機性參數g(=P/P0) 0.99 0.96 0.98 0.95 0.72 MFR(230℃,2.16 kg) 2.4 13.7 4.6 14.7 12.5 硬度(JIS-A,瞬時) 95 65 55 95< 74 -20~60℃之tanδ波峰溫度(℃) 18 19 -20 46 18 -20~60℃之tanδ峰高 1.2 2.5 2.2 2.2 1.5 耐磨耗性:評分 1 1 1 1 1 低反彈性:鄧祿普反跳彈性模數(%) 10 0.50 70 45 6.0 [Table 5] Comparison Example 1 Comparison Example 2 Comparison Example 3 Comparison Example 4 Comparison Example 5 Hydrogenated block copolymer (A) (A)-B (A)-C (A)-D (A)-E Vinyl bond adjuster (mol/n-BuLi 1 mol) 0.9 0.9 0.9 0.9 0.9 Polymerization temperature (℃) 80 80 80 80 80 Effective use of react_IR × Content of all vinyl aromatic monomer units (mass %) 78 61 49 80 66 Content of polymer block (a) (mass %) 36 4 16 16 16 Content of hydrogenated copolymer block (b) (mass %) 64 96 84 84 84 Content of vinyl aromatic monomer units in hydrogenated copolymer block (b) (mass %) 65 59 39 76 59 The content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (a) as a whole RS (mass %) 42 57 33 64 50 Content of the conjugated diene monomer unit in the hydrogenated copolymer block (b) relative to the total content of the hydrogenated block copolymer (a) (mass %) twenty two 39 51 20 34 Vinyl bond content in hydrogenated block copolymer (A) (mass %) twenty one 20 30 14 25 Molecular weight distribution 1.06 1.06 1.06 1.06 1.06 Weight average molecular weight (ten thousand) 16.0 15.9 16.0 16.1 16.0 Hydrogenation rate of double bonds of conjugated diene monomer units (molar %) 98 98 98 98 98 Peak intensity P 0.229 0.302 0.179 0.337 0.199 P0 0.231 0.315 0.182 0.355 0.276 Randomness parameter g(=P/P0) 0.99 0.96 0.98 0.95 0.72 MFR (230℃, 2.16 kg) 2.4 13.7 4.6 14.7 12.5 Hardness (JIS-A, instantaneous) 95 65 55 95< 74 -20~60℃ tanδ peak temperature (℃) 18 19 -20 46 18 -20~60℃ tanδ peak height 1.2 2.5 2.2 2.2 1.5 Abrasion resistance: Rating 1 1 1 1 1 Low rebound: Denlop rebound elastic modulus (%) 10 0.50 70 45 6.0

可知,實施例1~10之氫化嵌段共聚物之耐磨耗性與低反彈性優異。 [產業上之可利用性] It can be seen that the hydrogenated block copolymers of Examples 1 to 10 have excellent wear resistance and low resilience. [Industrial Applicability]

本發明之氫化嵌段共聚物於汽車零件(汽車內飾材料、汽車包裝材料)、醫療用具材料、食品包裝容器等各種容器、家電用品、工業零件、玩具等領域中具有產業上之可利用性。The hydrogenated block copolymer of the present invention has industrial applicability in the fields of automobile parts (automobile interior materials, automobile packaging materials), medical device materials, various containers such as food packaging containers, home appliances, industrial parts, toys, etc.

Claims (8)

一種氫化嵌段共聚物(甲),其包含乙烯基芳香族單體單元與共軛二烯單體單元,且 含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a),並且 滿足下述<條件(1)>~<條件(3)>, <條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且上述氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下; <條件(2)>: 上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下; <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據下述(式I)求出之P0之比率g=P/P0為0.75以上; P0=k×RS         (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%); k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對均相聚合之氫化嵌段共聚物(甲)進行分析時獲得)。 A hydrogenated block copolymer (A) comprising vinyl aromatic monomer units and covalent diene monomer units, and containing at least one polymer block (a) mainly composed of vinyl aromatic monomer units, and satisfying the following <Condition (1)> to <Condition (3)>, <Condition (1)>: containing at least one hydrogenated copolymer block (b) comprising vinyl aromatic monomer units and covalent diene monomer units, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) is 65% by mass or more and 95% by mass or less; <Condition (2)>: the content of the vinyl aromatic monomer units in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less; <Condition (3)>: The ratio of the peak intensity P detected by a thermal decomposition gas phase chromatography mass spectrometry analyzer to P0 obtained according to the following (Formula I) is g=P/P0 or more, which is 0.75; P0=k×RS (Formula I) (In (Formula I), RS is the content (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole; k represents the proportional constant when the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (A) as a whole is first approximated to the peak intensity P, and the peak intensity P is obtained when the homogeneously polymerized hydrogenated block copolymer (A) is analyzed by a thermal decomposition gas phase chromatography mass spectrometry analyzer). 如請求項1之氫化嵌段共聚物,其中上述波峰強度P、與 利用上述(式I)求出之P0之比率g=P/P0為0.9以上。 The hydrogenated block copolymer of claim 1, wherein the ratio of the peak intensity P to P0 obtained by the above (Formula I) g = P/P0 is greater than 0.9. 如請求項1之氫化嵌段共聚物,其中上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為55質量%以上且65質量%以下。The hydrogenated block copolymer of claim 1, wherein the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 55 mass % or more and 65 mass % or less. 如請求項1之氫化嵌段共聚物,其中氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為75質量%以上且85質量%以下。The hydrogenated block copolymer of claim 1, wherein the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (a) is 75 mass % or more and 85 mass % or less. 一種氫化嵌段共聚物組合物,其含有:如請求項1至4中任一項之氫化嵌段共聚物(甲):1質量%以上且50質量%以下、 至少一種烯烴系樹脂(乙):5質量%以上且90質量%以下、 至少一種熱塑性樹脂(丙):1質量%以上且50質量%以下、及 至少一種軟化劑(丁):5質量%以上且90質量%以下。 A hydrogenated block copolymer composition, comprising: a hydrogenated block copolymer (A) as in any one of claims 1 to 4: 1% by mass or more and 50% by mass or less, at least one olefinic resin (B): 5% by mass or more and 90% by mass or less, at least one thermoplastic resin (C): 1% by mass or more and 50% by mass or less, and at least one softener (D): 5% by mass or more and 90% by mass or less. 如請求項5之氫化嵌段共聚物組合物,其中上述烯烴系樹脂(乙)包含至少一種聚丙烯系樹脂。The hydrogenated block copolymer composition of claim 5, wherein the olefinic resin (B) comprises at least one polypropylene resin. 一種成形體,其為如請求項5之氫化嵌段共聚物組合物之成形體。A shaped body, which is a shaped body of the hydrogenated block copolymer composition of claim 5. 如請求項5之成形體,其為發泡體。The formed body as claimed in claim 5 is a foamed body.
TW113104351A 2023-02-08 2024-02-05 Hydrogenated block copolymer, hydrogenated block copolymer composition, and formed article TW202436414A (en)

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