TW202418904A - Temperature protection device for assembling electronic components on printed circuit board - Google Patents

Abstract

A temperature protection device for assembling electronic components on printed circuit board includes a pillow seat inserted in the electronic component assembly position of the printed circuit board, wherein a jack is configured above the pillow seat, a pin is configured below the pillow seat, and the jack is electrically connected to the pin. With the device, when assembling, firstly insert the pillow seat on the printed circuit board, and immerse a connection between the printed circuit board and the pin of the pillow seat into a soldering furnace, so that the solder melted in the soldering furnace is attached to the connection, then the printed circuit board is removed from the soldering furnace for cooling, so that the pillow seat is fixed on the printed circuit board, and finally, insert the electronic component into the pillow seat to complete the steps of assembling the electronic component on the printed circuit board.

Description

Temperature protection method and device for assembling electronic components on printed circuit boards

The invention relates to a process for assembling electronic components on a printed circuit board, and in particular to a technology for isolating electronic components from directly enduring high heat during welding, maintaining the assembly stability of the printed circuit board, and effectively exerting the function of the printed circuit board and extending its service life.

A printed circuit board is a device used to carry electronic components. Metal wires are arranged on it to connect the fixed electronic components to each other, forming a functional electronic circuit for use in electronic products.

In order to achieve the purpose of fixing electronic components, the known method of assembling electronic components on printed circuit boards is mainly achieved by welding. The basic method is for the operator to insert the pins of the electronic components into the preset holes of the printed circuit board, and then hold the welding tool to melt the solder and stick it to the connection position between the pins and the printed circuit board, and wait for it to cool down to form a fixed state. However, this known technology must manually weld a large number of electronic components separately, which is quite inefficient and tests the patience and carefulness of the operator. As long as there is any error in a circuit, the entire circuit board may be scrapped, causing serious losses. Therefore, it is only suitable for simple or special work occasions.

Due to the shortcomings of manual soldering, the commonly known method of assembling electronic components on printed circuit boards is to adopt a furnace process, that is, the required electronic components are completely inserted into the printed circuit board, and then the area to be soldered is immersed in the molten solder inside the soldering furnace. After the solder is completely attached to all soldering areas, the printed circuit board is removed from the soldering furnace for cooling, and the electronic component assembly work on the printed circuit board is completed. In this way, a large number of electronic components can be assembled on the printed circuit board at one time to improve the work efficiency and maintain the quality of the product.

However, the aforementioned method of assembling electronic components of a printed circuit board that can improve work efficiency is to immerse the surface of the entire printed circuit board in a soldering furnace to attach solder to all the pins of the electronic components. In order to ensure the integrity of the operation, an effective soldering furnace temperature and soldering time must be maintained, so that a large amount of high temperature of the soldering furnace will be transferred to the electronic components. However, due to the different heat resistance coefficients of various electronic components and the inevitable difference in temperature between different areas of the soldering furnace, some electronic components are likely to damage their internal structures due to their inability to withstand high temperatures, which at the least reduces the working efficiency and even the service life of the electronic components, and at worst damages the electronic components and makes the printed circuit board unusable.

What's more, for special electronic components, such as temperature-sensitive thermosensitive devices, such as small AC/DC or DC/DC power supplies, oscillators, filters, etc., they react more sensitively and violently to high temperature changes and are easily damaged due to improper temperature control during furnace operation, resulting in a decrease in product yield and an increase in the burden of product testing. In particular, the price of these thermosensitive devices is relatively high, and if they are damaged, the cost will be greatly increased, which will have an undue impact on product sales.

Therefore, in order to solve the problem of high temperature damage to electronic components during the furnace, some companies will exclude more precise electronic components from the furnace process and manually assemble them after most electronic components on the printed circuit board have been assembled, reducing the chance of damage to precise electronic components. However, this will increase the production process and the cost of electronic component assembly on the printed circuit board, and as mentioned above, manual assembly may also be difficult to maintain quality due to negligence of the operator.

In view of the above-mentioned deficiencies, it is obvious that the conventional electronic component assembly method of printed circuit boards is far from perfect and needs to be solved urgently.

In order to overcome the above-mentioned shortcomings, the purpose of the present invention is to provide a temperature protection method and device for assembling electronic components on a printed circuit board, which utilizes a pillow pre-installed on the printed circuit board to perform a furnace process, and then connects and fixes the electronic components on the pillow, so that the electronic components will not be subjected to the high heat during welding, thereby maintaining the assembly stability and effective function of the printed circuit board.

Another object of the present invention is to provide a temperature protection method and device for assembling electronic components on a printed circuit board, which can improve process efficiency, reduce the cost of failure or replacement, increase product availability, and thereby extend the service life of the printed circuit board and reduce costs.

Another object of the present invention is to provide a temperature protection method and device for assembling electronic components on a printed circuit board, wherein the electronic components can be replaced or upgraded without replacing the entire printed circuit board, thereby further saving costs, reducing electronic waste and being beneficial to environmental protection.

A temperature protection device for assembling electronic components on a printed circuit board that can achieve the above-mentioned purpose mainly includes a pillow seat, which is used to be inserted into the electronic component assembly position of the printed circuit board to provide the temperature protection of the present invention during the process of assembling the electronic components on the printed circuit board.

A socket is provided above the pillow seat, and a pin is provided below the pillow seat, and the socket is electrically connected to the pin. The pin is inserted into the printed circuit board, and the connection between the pin and the printed circuit board is attached with solder through a soldering furnace to stably fix the pillow seat on the printed circuit board, and the electronic component is inserted into the socket, so that the electronic component is assembled on the printed circuit board through the pillow seat, and the electronic component is electrically connected to the printed circuit board to exert its function.

With the above composition, the temperature protection method for assembling electronic components on a printed circuit board of the present invention includes the following steps: The pillow is inserted at the electronic component assembly position of the printed circuit board; The connection between the printed circuit board and the pin of the pillow is immersed in a soldering furnace, so that the molten solder in the soldering furnace adheres to the connection; The printed circuit board is removed from the soldering furnace for cooling, so that the pillow is fixed on the printed circuit board; The electronic component is inserted into the pillow, and the step of assembling the electronic component on the printed circuit board is completed.

In addition, in order to strengthen the stability of the electronic component when being fixed to the pillow, after the electronic component is inserted into the pillow, adhesive is packaged between the electronic component and the pillow.

Furthermore, at least one side of the pillow seat extends with a guard edge, which can guide the electronic component to be quickly and correctly inserted into the pillow seat, and when the electronic component is fixed to the pillow seat, the guard edge supports the electronic component to maintain a stable connection.

Furthermore, in order to enhance the fixing effect, the edge of the edge guard is provided with a buckle point, so that when the electronic component is inserted into the pillow seat, the buckle point is buckled on the outside of the electronic component to fix the electronic component in the pillow seat.

The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by technical personnel in this field, thereby making a clearer and more precise definition of the protection scope of the present invention.

Please refer to Figures 1 to 4. Figure 1 is a three-dimensional diagram of the overall structure of the present invention, Figure 2 is a schematic diagram of the structure of the printed circuit board of the present invention undergoing a furnace process, Figure 3 is a schematic diagram of the structure of the printed circuit board of the present invention after completing the pillow assembly and solder is attached to the connection of the pins, and Figure 4 is a schematic diagram of the structure of the printed circuit board of the present invention after completing the pillow assembly and inserting electronic components. The present invention provides a temperature protection device for assembling electronic components on a printed circuit board, which mainly includes a pillow 100, which is used to be inserted into the assembly position of the electronic component 300 of the printed circuit board 200, and is used to provide the temperature protection of the present invention for the process of assembling the electronic component 300 on the printed circuit board 200.

The pillow base 100 is generally rectangular, with a socket 110 disposed on the top and a pin 120 disposed on the bottom of the pillow base 100. The pin 120 is inserted into the printed circuit board 200. The connection between the pin 120 and the printed circuit board 200 is attached with solder 410 through a soldering furnace 400 to stably fix the pillow base 100 on the printed circuit board 200. The electronic component 300 is inserted into the socket 110. The socket 110 and the pin 120 are electrically connected, usually by a metal wire or a thin sheet, so that the electronic component 300 is assembled on the printed circuit board 200 through the pillow 100, and the electronic component 300 is electrically connected to the printed circuit board 200 through the metal wire or the thin sheet to perform its function.

With the above structure, please refer to the flowchart of FIG5. With the above structure, the temperature protection method of assembling electronic components on a printed circuit board of the present invention includes the following steps: 5-1. Insert the pillow 100 at the assembly position of the electronic component 300 on the printed circuit board 200; 5-2. Immerse the connection between the printed circuit board 200 and the pin 120 of the pillow 100 in the soldering furnace 400, so that the molten solder 410 in the soldering furnace 400 adheres to the connection; 5-3. Remove the printed circuit board 200 from the soldering furnace 400 for cooling, so that the pillow 100 is fixed on the printed circuit board 200; 5-4. Insert the electronic component 300 into the pillow base 100 to complete the step of assembling the electronic component 300 on the printed circuit board 200.

Since the pillow base 100 does not contain the electronic component 300 during soldering, the function of the pillow base 100 will not be affected regardless of the time or temperature of the soldering furnace 400. Thus, the electronic component 300 can be assembled after the printed circuit board 200 cools down, thereby ensuring the stability of the electronic component 300. In particular, for special or precise electronic components 300, such as small AC/DC or DC/DC power supplies, oscillators, filters, etc., which are heat-sensitive components, since the electronic component 300 is not exposed to high heat when assembled on the printed circuit board 200, its function can be fully exerted and its service life can be extended.

In addition, the electronic component 300 is fixed to the pillow base 100 by plugging and unplugging, so that the operation is very fast and accurate, and will not be affected by the operator's skills, and can maintain the normal operation of the electronic component 300. Moreover, when the electronic component 300 malfunctions, it can be quickly replaced or upgraded without replacing the entire printed circuit board 200, which can save costs and achieve environmental protection effects.

Please refer to FIG6, which is a three-dimensional diagram of the structure of the electronic component and the pillow base of the present invention with adhesive encapsulated between them. In order to strengthen the stability of the electronic component 300 when fixed to the pillow base 100, after the electronic component 300 is inserted into the pillow base 100, adhesive 500 is encapsulated between the electronic component 300 and the pillow base 100. There are many types of adhesive 500, and any component that can achieve a fixing effect can be used, and it is not limited here.

In addition, please refer to FIG. 7 and FIG. 8. FIG. 7 is a structural three-dimensional diagram of the pillow base of the present invention provided with a flange and a buckle point, and FIG. 8 is a structural three-dimensional diagram of the electronic component of the present invention inserted into the pillow base with flanges and buckle points. The pillow base 100 has a flange 130 extending from at least one side. The flange 130 can guide the electronic component 300 to be quickly and correctly inserted into the pillow base 100, and when the electronic component 300 is fixed to the pillow base 100, the flange 130 supports the electronic component 300 to maintain a stable connection. In particular, when the printed circuit board 200 is used sideways, the support of the flange 130 can ensure that the electronic component 300 will not fall off and cause an accidental failure.

Furthermore, in order to further enhance the fixing effect, a buckle point 131 is provided at the edge of the retaining edge 130, so that when the electronic component 300 is inserted into the pillow base 100, the buckle point 131 is naturally buckled on the outside of the electronic component 300 to fix the electronic component 300 in the pillow base, and the best fixing effect can be obtained in combination with the adhesive 500.

The above implementation methods are only for illustrating the technical concept and features of the present invention, and their purpose is to allow people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be included in the protection scope of the present invention.

5-1~5-4: Steps 100: Pillow 110: Socket 120: Pins 130: Edge guard 131: Buckle point 200: Printed circuit board 300: Electronic components 400: Soldering furnace 410: Solder 500: Adhesive

Figure 1 is a three-dimensional diagram of the overall structure of the present invention. Figure 2 is a schematic diagram of the structure of the printed circuit board of the present invention undergoing a furnace process. Figure 3 is a schematic diagram of the structure of the printed circuit board of the present invention after the pillow seat assembly is completed and solder is attached to the connection of the pins. Figure 4 is a schematic diagram of the structure of the printed circuit board of the present invention after the pillow seat assembly is completed and the electronic components are inserted. Figure 5 is a flowchart of the overall process of the present invention. Figure 6 is a three-dimensional diagram of the structure of the electronic components and the pillow seat of the present invention with adhesive encapsulated between them. Figure 7 is a three-dimensional diagram of the structure of the pillow seat of the present invention with a flange and a buckle point. Figure 8 is a three-dimensional diagram of the structure of the electronic components of the present invention inserted into the pillow seat with flanges and buckle points.

100: pillow seat

110: Socket

120: Pin

200: Printed circuit board

300: Electronic components

Claims (8)

A temperature protection method for assembling electronic components on a printed circuit board, comprising: inserting a pillow seat at the electronic component assembly position of the printed circuit board; immersing the connection between the pins of the printed circuit board and the pillow seat in a soldering furnace, so that the molten solder in the soldering furnace adheres to the connection; removing the printed circuit board from the soldering furnace for cooling, so that the pillow seat is fixed on the printed circuit board; and inserting the electronic component into the pillow seat, completing the assembly of the electronic component on the printed circuit board. A temperature protection method for assembling electronic components on a printed circuit board as described in claim 1, wherein after the electronic component is inserted into the pillow seat, adhesive is encapsulated between the electronic component and the pillow seat to enhance fixation. A temperature protection method for assembling electronic components on a printed circuit board as described in claim 1, wherein a guard edge extends from at least one side of the pillow seat to guide the electronic component to be quickly and correctly inserted into the pillow seat, and the guard edge supports the electronic component to maintain a stable connection. A temperature protection method for assembling electronic components on a printed circuit board as described in claim 3, wherein the edge of the baffle is provided with a buckle point so that when the electronic component is inserted into the pillow seat, the buckle point can be buckled on the outside of the electronic component to fix the electronic component in the pillow seat. A temperature protection device for assembling electronic components on a printed circuit board comprises: A pillow seat, which is inserted into the electronic component assembly position of the printed circuit board, a pin is arranged below the pillow seat, the pin is inserted into the printed circuit board, and the connection between the pin and the printed circuit board is attached with solder through a soldering furnace; a socket is arranged above the pillow seat, so that the electronic component is inserted into the socket, the socket and the pin are electrically connected, so that the electronic component is assembled on the printed circuit board through the pillow seat and conducts. A temperature protection device for assembling electronic components on a printed circuit board as described in claim 5, wherein adhesive is encapsulated between the electronic component and the pillow seat to enhance fixation. A temperature protection device for assembling electronic components on a printed circuit board as described in claim 5, wherein a guard edge extends from at least one side of the pillow base, and the guard edge is used to support the electronic component to maintain a stable connection. A temperature protection device for assembling electronic components on a printed circuit board as described in claim 5, wherein the edge of the edge guard is provided with a buckle point, which is buckled onto the outside of the electronic component to fix the electronic component in the pillow seat.

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