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TW202219784A - A material analysis method checking the analysis position and analysis requirement of a sample through an information system - Google Patents

A material analysis method checking the analysis position and analysis requirement of a sample through an information system Download PDF

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TW202219784A
TW202219784A TW109139490A TW109139490A TW202219784A TW 202219784 A TW202219784 A TW 202219784A TW 109139490 A TW109139490 A TW 109139490A TW 109139490 A TW109139490 A TW 109139490A TW 202219784 A TW202219784 A TW 202219784A
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microscope
analysis
test piece
screen
computer
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TW109139490A
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柳紀綸
簡文祥
姚文振
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汎銓科技股份有限公司
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Priority to CN202110767429.3A priority patent/CN114486879B/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008—Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20091—Measuring the energy-dispersion spectrum [EDS] of diffracted radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
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    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
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    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract

The present invention discloses a material analysis method checking the analysis position and analysis requirement of a sample through an information system by taking screenshots at different work stations and respectively sending and storing to a designated location of a server, thereby the analyzer at each work station can conveniently use the screenshots taken at various work stations and stored in the designated location of the server to check whether the analyzed positions and the analysis requirement at various work stations are correct or not to ensure that the sample is correctly analyzed.

Description

一種透過資訊系統檢核試片的分析位置及分析需求的材料分析方法A material analysis method for checking the analysis position and analysis requirements of a test piece through an information system

本發明是關於一種材料分析方法，且特別是關於一種透過資訊系統檢核試片的分析位置及分析需求的材料分析方法。The present invention relates to a material analysis method, and more particularly, to a material analysis method for checking the analysis position and analysis requirement of a test piece through an information system.

材料分析過程通常需要在不同工作站點進行處理，包括利用光學顯微鏡在該待分析樣品欲分析之處進行定位標註、利用一樣品切割顯微鏡切割被該光學顯微鏡定位標註的該待分析樣品以形成一試片、利用一試片汲取裝置汲取該試片並放置一載具上、將該表面放置有該試片的該載具載入該分析顯微鏡內進行分析以及影像拍攝。惟，在不同工作站點進行處理時所拍攝的影像，目前均以列印出來或者分散儲存於各工作點的電腦內，各工作站點的分析人員無法檢核該待分析樣品在各工作點進行的分析位置以及分析需求是否正確。The material analysis process usually needs to be processed at different work stations, including using an optical microscope to position and mark the to-be-analyzed sample where it is to be analyzed, and using a sample cutting microscope to cut the to-be-analyzed sample positioned and marked by the optical microscope to form a sample. The test piece is picked up by a test piece pickup device and placed on a carrier, and the carrier with the test piece placed on the surface is loaded into the analysis microscope for analysis and image shooting. However, the images taken during processing at different work stations are currently printed out or stored in the computers of each work station. Analyze the location and whether the analysis requirements are correct.

有鑒於此，一種透過資訊系統檢核試片的分析位置及分析需求的材料分析方法乃目前業界所殷切期盼。In view of this, a material analysis method for checking the analysis position and analysis requirement of the test piece through an information system is currently eagerly desired by the industry.

本發明之一目的乃揭示一種透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，其步驟包括：提供一待分析樣品；提供一光學顯微鏡模組，該光學顯微鏡模組包括一光學顯微鏡、一第一電腦和一第一螢幕，其中該光學顯微鏡、該第一電腦和該第一螢幕彼此連接，且該第一電腦透過網際網路與一伺服器連接，利用該光學顯微鏡觀察該待分析樣品並搜尋該待分析樣品欲分析之處，進而在該待分析樣品欲分析之處進行定位標註，且在被定位標註的該待分析樣品的影像同步呈現於該第一螢幕後，截取該第一螢幕所呈現的影像以產生一第一截圖，並透過該第一電腦經由網際網路將該第一截圖傳送並儲存至該伺服器的指定位置；提供一樣品切割顯微鏡模組，該樣品切割顯微鏡模組包括一樣品切割顯微鏡、一第二電腦和一第二螢幕，其中該樣品切割顯微鏡、該第二電腦和該第二螢幕彼此連接，且該第二電腦透過網際網路與該伺服器連接，利用該樣品切割顯微鏡切割被該光學顯微鏡定位標註的該待分析樣品以形成一試片，且將該試片的影像呈現於該第二螢幕後，截取該第二螢幕所呈現的該試片的影像以產生一第二截圖，並透過該第二電腦經由網際網路將該第二截圖傳送並儲存至該伺服器的該指定位置；提供一試片汲取模組，該試片汲取模組包括一試片汲取裝置、一第三電腦和一第三螢幕，其中該試片汲取裝置、該第三電腦和該第三螢幕彼此連接，且該第三電腦透過網際網路與該伺服器連接，利用該試片汲取裝置汲取該試片並放置一載具上，且將表面被放置該試片的該載具影像呈現於該第三螢幕後，截取該第三螢幕所呈現的該試片的影像以產生一第三截圖，並透過該第三電腦經由網際網路將該第三截圖傳送並儲存至該伺服器的該指定位置；以及提供一分析顯微鏡模組，該分析顯微鏡模組包括一分析顯微鏡、一第四電腦和一第四螢幕，其中該分析顯微鏡、該第四電腦和該第四螢幕彼此連接，且該第四電腦透過網際網路與該伺服器連接，將該表面放置有該試片的該載具載入該分析顯微鏡內進行分析以及拍攝，拍攝所得之影像呈現於該第四螢幕後，截取該第四螢幕所呈現的該試片的影像以產生一第四截圖，並透過該第四電腦經由網際網路將該第四截圖傳送並儲存至該伺服器的該指定位置。An object of the present invention is to disclose a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system, the steps of which include: providing a sample to be analyzed; providing an optical microscope module, the optical microscope module includes a Optical microscope, a first computer and a first screen, wherein the optical microscope, the first computer and the first screen are connected to each other, and the first computer is connected to a server through the Internet, and the optical microscope is used to observe The to-be-analyzed sample searches for the place where the to-be-analyzed sample is to be analyzed, and then marks the location where the to-be-analyzed sample is to be analyzed, and after the image of the to-be-analyzed sample that is located and marked is displayed on the first screen synchronously, intercepting the image presented on the first screen to generate a first screenshot, and transmitting and storing the first screenshot to a designated location of the server through the first computer via the Internet; providing a sample cutting microscope module, The sample cutting microscope module includes a sample cutting microscope, a second computer and a second screen, wherein the sample cutting microscope, the second computer and the second screen are connected to each other, and the second computer communicates with each other through the Internet The server is connected, and the sample to be analyzed, which is positioned and marked by the optical microscope, is cut by the sample cutting microscope to form a test piece, and the image of the test piece is displayed on the second screen, and the second screen is intercepted. The image of the test piece is generated to generate a second screenshot, and the second screenshot is transmitted and stored to the designated location of the server through the second computer via the Internet; The film extracting module includes a test strip extracting device, a third computer and a third screen, wherein the test strip extracting device, the third computer and the third screen are connected to each other, and the third computer communicates with each other through the Internet. The server is connected, and the test piece is picked up by the test piece pickup device and placed on a carrier, and the image of the carrier with the test piece placed on the surface is displayed on the third screen, and the third screen is intercepted. The image of the test piece is generated to generate a third screenshot, and the third screenshot is transmitted and stored to the designated location of the server through the Internet through the third computer; and an analysis microscope module is provided for analyzing the The microscope module includes an analysis microscope, a fourth computer and a fourth screen, wherein the analysis microscope, the fourth computer and the fourth screen are connected to each other, and the fourth computer is connected to the server through the Internet, The carrier with the test piece placed on the surface is loaded into the analysis microscope for analysis and photography, the image obtained by shooting is displayed on the fourth screen, and the image of the test piece displayed on the fourth screen is intercepted to generate A fourth screenshot is sent and stored to the designated location of the server through the fourth computer via the Internet.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該光學顯微鏡為超高解析度數位顯微鏡。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the optical microscope is an ultra-high-resolution digital microscope.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該超高解析度數位顯微鏡為超高解析度二微光學顯微鏡(2D Optical Microscope)或超高解析度三微光學顯微鏡(3D Optical Microscope)。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the ultra-high-resolution digital microscope is an ultra-high-resolution two-microscope optical microscope (2D Optical Microscope) or an ultra-high-resolution three-microscope. 3D Optical Microscope.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該樣品切割顯微鏡為聚焦離子束顯微鏡(Focused Ion Beam, FIB)。In the above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the sample cutting microscope is a Focused Ion Beam (FIB) microscope.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該試片汲取裝置為吸針裝置。In the above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the test piece drawing device is a needle suction device.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該載具為銅網。In the above-mentioned material analysis method for checking the analysis position and analysis requirement of the test piece through the information system, the carrier is a copper mesh.

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該分析顯微鏡為電子束顯微鏡、離子束顯微鏡、雙粒子束顯微鏡、原子力顯微鏡、質譜儀、能量散射光譜儀(SEM/EDS)、3D雷射共焦輪廓儀 (3D Laser confocal profile)或X-射線光電子能譜儀 (X-ray photoelectron spectroscopy；XPS)。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the analysis microscope is an electron beam microscope, an ion beam microscope, a two-particle beam microscope, an atomic force microscope, a mass spectrometer, and an energy scattering spectrometer (SEM). /EDS), 3D Laser confocal profiler (3D Laser confocal profile) or X-ray photoelectron spectroscopy (XPS).

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該電子束顯微鏡為掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)、掃描式電子顯微鏡/能量散射光譜儀(SEM/EDS)或穿透式電子顯微鏡/能量散射光譜儀(TEM/EDS)。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the electron beam microscope is a scanning electron microscope (SEM), a transmission electron microscope (TEM), a scanning electron microscope/energy Scattering Spectrometer (SEM/EDS) or Transmission Electron Microscopy/Energy Dispersion Spectrometer (TEM/EDS).

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該離子束顯微鏡為聚焦離子束顯微鏡(FIB)或電漿聚焦離子束掃描電子顯微鏡(PFIB)。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the ion beam microscope is a Focused Ion Beam Microscope (FIB) or a Plasma Focused Ion Beam Scanning Electron Microscope (PFIB).

如上所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該雙粒子束顯微鏡為雙束聚焦離子束顯微鏡(Dual Beam FIB)、雙束聚焦離子束/能量散射光譜儀(Dual Beam FIB/EDS)。The above-mentioned material analysis method for checking the analysis position and analysis requirements of the test piece through the information system, the dual particle beam microscope is a dual beam focused ion beam microscope (Dual Beam FIB), a dual beam focused ion beam/energy scattering spectrometer ( Dual Beam FIB/EDS).

為了使本發明揭示內容的敘述更加詳盡與完備，下文針對了本發明的實施態樣與具體實施例提出了說明性的描述；但這並非實施或運用本發明具體實施例的唯一形式。以下所揭露的各實施例，在有益的情形下可相互組合或取代，也可在一實施例中附加其他的實施例，而無須進一步的記載或說明。In order to make the description of the disclosure of the present invention more detailed and complete, the following provides an illustrative description for the embodiments and specific embodiments of the present invention; but this is not the only form of implementing or using the specific embodiments of the present invention. The embodiments disclosed below can be combined or substituted with each other under beneficial circumstances, and other embodiments can also be added to one embodiment without further description or explanation.

在以下描述中，將詳細敘述許多特定細節以使讀者能夠充分理解以下的實施例。然而，可在無此等特定細節之情況下實踐本發明之實施例。在其他情況下，為簡化圖式，熟知的結構與裝置僅示意性地繪示於圖中。In the following description, numerous specific details are set forth in detail to enable the reader to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are shown schematically in the drawings for simplicity of illustration.

實施例Example

請參閱圖1~6，根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，其步驟流程乃如圖1所示，包括： 步驟一(S1)：提供一待分析樣品(未標示)； 步驟二(S2)：提供一如圖2所示之光學顯微鏡模組100，該光學顯微鏡模組100包括一光學顯微鏡110、一第一電腦130和一第一螢幕150，其中該光學顯微鏡110、該第一電腦130和該第一螢幕150彼此連接，且該第一電腦130透過網際網路600與一伺服器500連接，利用該光學顯微鏡100觀察該待分析樣品並搜尋該待分析樣品欲分析之處，進而在該待分析樣品欲分析之處進行定位標註，且在被定位標註的該待分析樣品的影像同步呈現於該第一螢幕150後，截取該第一螢幕150所呈現的影像以產生一第一截圖SS1，並透過該第一電腦130經由網際網路600將該第一截圖SS1傳送並儲存至如圖6所示之該伺服器500的指定位置510； 步驟三(S3)：提供一如圖3所示之樣品切割顯微鏡模組200，該樣品切割顯微鏡模組200包括一樣品切割顯微鏡210、一第二電腦230和一第二螢幕250，其中該樣品切割顯微鏡210、該第二電腦230和該第二螢幕250彼此連接，且該第二電腦250透過網際網路600與該伺服器500連接，利用該樣品切割顯微鏡210切割被該光學顯微鏡110定位標註的該待分析樣品以形成一試片，且將該試片的影像呈現於該第二螢幕250後，截取該第二螢幕250所呈現的該試片的影像以產生一第二截圖SS2，並透過該第二電腦230經由網際網路600將該第二截圖SS2傳送並儲存至如圖6所示之該伺服器500的指定位置510； 步驟四(S4)：提供一如圖4所示之試片汲取模組300，該試片汲取模組300包括一試片汲取裝置310、一第三電腦330和一第三螢幕350，其中該試片汲取裝置310、該第三電腦330和該第三螢幕350彼此連接，且該第三電腦330透過網際網路600與該伺服器500連接，利用該試片汲取裝置310汲取該試片並放置一載具上，且將表面被放置該試片的該載具影像呈現於該第三螢幕350後，截取該第三螢幕350所呈現的該試片的影像以產生一第三截圖SS3，並透過該第三電腦330經由網際網路600將該第三截圖SS3傳送並儲存至如圖6所示之該伺服器500的指定位置510；以及 步驟五(S5)：提供一如圖5所示之分析顯微鏡模組400，該分析顯微鏡模組400包括一分析顯微鏡410、一第四電腦430和一第四螢幕450，其中該分析顯微鏡410、該第四電腦430和該第四螢幕450彼此連接，且該第四電腦430透過網際網路600與該伺服器500連接，將該表面放置有該試片的該載具載入該分析顯微鏡410內進行分析以及拍攝，拍攝所得之影像呈現於該第四螢幕450後，截取該第四螢幕450所呈現的該試片的影像以產生一第四截圖SS4，並透過該第四電腦430經由網際網路600將該第四截圖SS4傳送並儲存至如圖6所示之該伺服器500的指定位置510。 Please refer to FIGS. 1 to 6 . According to an embodiment of the present invention, a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system is shown. The step flow is shown in FIG. 1 , including: Step 1 (S1): provide a sample to be analyzed (not marked); Step 2 (S2): Provide an optical microscope module 100 as shown in FIG. 2, the optical microscope module 100 includes an optical microscope 110, a first computer 130 and a first screen 150, wherein the optical microscope 110, The first computer 130 and the first screen 150 are connected to each other, and the first computer 130 is connected to a server 500 through the Internet 600, and the optical microscope 100 is used to observe the sample to be analyzed and search for the sample to be analyzed. the location of the sample to be analyzed is further positioned and marked at the location where the sample to be analyzed is to be analyzed, and after the image of the sample to be analyzed that is positioned and marked is displayed on the first screen 150 synchronously, the image displayed on the first screen 150 is captured to generating a first screenshot SS1, and sending and storing the first screenshot SS1 through the first computer 130 via the Internet 600 to the designated location 510 of the server 500 as shown in FIG. 6; Step 3 (S3): Provide a sample cutting microscope module 200 as shown in FIG. 3, the sample cutting microscope module 200 includes a sample cutting microscope 210, a second computer 230 and a second screen 250, wherein the sample The cutting microscope 210 , the second computer 230 and the second screen 250 are connected to each other, and the second computer 250 is connected to the server 500 through the Internet 600 , and the cutting microscope 210 is used for the sample to be cut and marked by the optical microscope 110 . The sample to be analyzed is formed to form a test piece, and after the image of the test piece is displayed on the second screen 250, the image of the test piece displayed on the second screen 250 is intercepted to generate a second screenshot SS2, and Send and store the second screenshot SS2 to the designated location 510 of the server 500 as shown in FIG. 6 through the second computer 230 via the Internet 600; Step 4 (S4): Provide a test piece pickup module 300 as shown in FIG. 4 , the test piece pickup module 300 includes a test piece pickup device 310, a third computer 330 and a third screen 350, wherein the The test piece fetching device 310, the third computer 330 and the third screen 350 are connected to each other, and the third computer 330 is connected to the server 500 through the Internet 600, and the test piece fetching device 310 is used to pick up the test piece and After placing on a carrier, and presenting the image of the carrier on which the test piece is placed on the third screen 350, the image of the test piece displayed on the third screen 350 is captured to generate a third screenshot SS3, and send and store the third screenshot SS3 through the third computer 330 via the Internet 600 to the designated location 510 of the server 500 as shown in FIG. 6; and Step 5 (S5): Provide an analysis microscope module 400 as shown in FIG. 5, the analysis microscope module 400 includes an analysis microscope 410, a fourth computer 430 and a fourth screen 450, wherein the analysis microscope 410, The fourth computer 430 and the fourth screen 450 are connected to each other, and the fourth computer 430 is connected to the server 500 through the Internet 600 to load the carrier on which the test piece is placed into the analysis microscope 410 Analysis and shooting are carried out inside, and the obtained image is displayed on the fourth screen 450, and the image of the test piece displayed on the fourth screen 450 is intercepted to generate a fourth screenshot SS4, and the fourth computer 430 is passed through the Internet through the Internet The network 600 transmits and stores the fourth screenshot SS4 to the designated location 510 of the server 500 as shown in FIG. 6 .

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該第一截圖S1、該第二截圖S2、該第三截圖S3以及該第四截圖S4均可作局部放大，以利相關檢核。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the above-mentioned embodiment, the first screenshot S1 , the second screenshot S2 , the third screenshot S3 and the fourth screenshot S4 are all Partial magnification can be made to facilitate related inspections.

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該光學顯微鏡110為超高解析度數位顯微鏡，例如但不限於為超高解析度二微光學顯微鏡(2D Optical Microscope)或超高解析度三微光學顯微鏡(3D Optical Microscope)。According to the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system disclosed in the above-mentioned embodiment, the optical microscope 110 is an ultra-high-resolution digital microscope, such as but not limited to an ultra-high-resolution two-microscope optical microscope. Microscope (2D Optical Microscope) or Ultra High Resolution Three Micro Optical Microscope (3D Optical Microscope).

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該樣品切割顯微鏡210為聚焦離子束顯微鏡(Focused Ion Beam, FIB)。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the above-mentioned embodiment, the sample cutting microscope 210 is a Focused Ion Beam (FIB) microscope.

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該試片汲取裝置310為吸針裝置。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the above-mentioned embodiment, the test piece extraction device 310 is a needle suction device.

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該載具為銅網。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system disclosed in the above-mentioned embodiment, the carrier is a copper mesh.

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該分析顯微鏡410為電子束顯微鏡、離子束顯微鏡、雙粒子束顯微鏡、原子力顯微鏡、質譜儀、能量散射光譜儀(SEM/EDS)、3D雷射共焦輪廓儀 (3D Laser confocal profile)或X-射線光電子能譜儀 (X-ray photoelectron spectroscopy；XPS)。該電子束顯微鏡為例如但不限於掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)、掃描式電子顯微鏡/能量散射光譜儀(SEM/EDS)或穿透式電子顯微鏡/能量散射光譜儀(TEM/EDS)。該離子束顯微鏡為例如但不限於聚焦離子束顯微鏡(FIB)或電漿聚焦離子束掃描電子顯微鏡(PFIB)。該雙粒子束顯微鏡為例如但不限於雙束聚焦離子束顯微鏡(Dual Beam FIB)、雙束聚焦離子束/能量散射光譜儀(Dual Beam FIB/EDS)。According to the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system disclosed in the above-mentioned embodiment, the analysis microscope 410 is an electron beam microscope, an ion beam microscope, a double particle beam microscope, an atomic force microscope, a mass spectrometer, Energy dispersive spectrometer (SEM/EDS), 3D Laser confocal profile (3D Laser confocal profile) or X-ray photoelectron spectroscopy (XPS). The electron beam microscope is, for example, but not limited to, a scanning electron microscope (SEM), a transmission electron microscope (TEM), a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), or a transmission electron microscope/energy dispersive spectrometer ( TEM/EDS). The ion beam microscope is, for example, but not limited to, a focused ion beam microscope (FIB) or a plasma focused ion beam scanning electron microscope (PFIB). The dual beam microscope is, for example, but not limited to, a dual beam focused ion beam microscope (Dual Beam FIB), a dual beam focused ion beam/energy scattering spectrometer (Dual Beam FIB/EDS).

根據上述本實施例所揭示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，由於在包括利用光學顯微鏡在該待分析樣品欲分析之處進行定位標註、利用一樣品切割顯微鏡切割被該光學顯微鏡定位標註的該待分析樣品以形成一試片、利用一試片汲取裝置汲取該試片並放置一載具上、將該表面放置有該試片的該載具載入該分析顯微鏡內進行分析以及影像拍攝等不同工作站點，均分別進行截圖，並且分別傳送儲存至伺服器的指定地點，故各工作站點的分析人員可便利地利用儲存於伺服器的指定地點之各工作站點之截圖檢核該待分析樣品在各工作點進行的分析位置及分析方法是否正確，確保樣品分析無誤。According to the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system disclosed in the above-mentioned embodiment, the method includes using an optical microscope to locate and mark the place to be analyzed in the sample to be analyzed, and using a sample cutting microscope. Cut the sample to be analyzed marked by the optical microscope to form a test piece, use a test piece pickup device to pick up the test piece and place it on a carrier, load the carrier on which the test piece is placed on the surface into the test piece Screenshots are taken at different work stations such as analysis and image shooting in the analysis microscope, and they are respectively sent and stored to the designated location of the server, so the analysts at each work station can conveniently use the workstations stored in the designated location of the server. Screenshot of the point to check whether the analysis position and analysis method of the sample to be analyzed at each work point are correct, to ensure that the sample analysis is correct.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the appended patent application.

S1:步驟一 S2:步驟二 S3:步驟三 S4:步驟四 S5:步驟五 100:光學顯微鏡模組 110:光學顯微鏡 130:第一電腦 150:第一螢幕 200:樣品切割顯微鏡模組 210:樣品切割顯微鏡 230:第二電腦 250:第二螢幕 300:試片汲取模組 310:試片汲取裝置 330:第三電腦 350:第三螢幕 400:分析顯微鏡模組 410:分析顯微鏡 430:第一電腦 450:第一螢幕 500:伺服器 510:指定位置 600:網際網路 SS1:第一截圖 SS2:第二截圖 SS3:第三截圖 SS4:第四截圖 S1: Step 1 S2: Step 2 S3: Step 3 S4: Step 4 S5: Step 5 100: Optical microscope module 110: Optical Microscopy 130: First Computer 150: First screen 200: Sample cutting microscope module 210: Sample Cutting Microscopy 230: Second computer 250: Second screen 300: Test piece extraction module 310: Specimen Picking Device 330: Third Computer 350: Third screen 400: Analytical Microscope Module 410: Analytical Microscopy 430: First Computer 450: first screen 500: Server 510: Specify location 600: Internet SS1: First Screenshot SS2: Second Screenshot SS3: The third screenshot SS4: Fourth Screenshot

圖1之流程圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法。The flowchart of FIG. 1 is a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system according to an embodiment of the present invention.

圖2所繪示的方塊圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法中所使用的光學顯微鏡模組100及透過網際網路連接的伺服器500。The block diagram shown in FIG. 2 is an optical microscope module 100 used in a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system according to an embodiment of the present invention, and an optical microscope module 100 through the Internet Connected server 500.

圖3所繪示的方塊圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法中所使用的樣品切割顯微鏡模組200及透過網際網路連接的伺服器500。The block diagram shown in FIG. 3 is a sample cutting microscope module 200 used in a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system according to an embodiment of the present invention, and through the Internet The server 500 to which the road is connected.

圖4所繪示的方塊圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法中所使用的樣品切割顯微鏡模組300及透過網際網路連接的伺服器500。The block diagram shown in FIG. 4 is a sample cutting microscope module 300 used in a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system according to an embodiment of the present invention, and through the Internet The server 500 to which the road is connected.

圖5所繪示的方塊圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法中所使用的分析顯微鏡模組400及透過網際網路連接的伺服器500。The block diagram shown in FIG. 5 is the analysis microscope module 400 used in the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system according to an embodiment of the present invention, and through the Internet Connected server 500.

圖6所繪示的方塊圖是根據本發明一實施例所繪示的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法中所使用的伺服器500及被傳送儲存於該伺服器500內的指定位置510的第一截圖SS1~第四截圖SS4。The block diagram shown in FIG. 6 is a server 500 used in a material analysis method for checking the analysis position and analysis requirements of a test piece through an information system according to an embodiment of the present invention, and the server 500 is transmitted and stored in the server The first screenshot SS1 to the fourth screenshot SS4 of the designated position 510 in the device 500 are displayed.

S1:步驟一 S1: Step 1

S2:步驟二 S2: Step 2

S3:步驟三 S3: Step 3

S4:步驟四 S4: Step 4

S5:步驟五 S5: Step 5

100:光學顯微鏡模組 100: Optical microscope module

200:樣品切割顯微鏡模組 200: Sample cutting microscope module

300:試片汲取模組 300: Test piece extraction module

400:分析顯微鏡模組 400: Analytical Microscope Module

410:分析顯微鏡 410: Analytical Microscopy

500:伺服器 500: Server

SS1:第一截圖 SS1: First Screenshot

SS2:第二截圖 SS2: Second Screenshot

SS3:第三截圖 SS3: The third screenshot

SS4:第四截圖 SS4: Fourth Screenshot

Claims (10)

一種透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，其步驟包括： 提供一待分析樣品； 提供一光學顯微鏡模組，該光學顯微鏡模組包括一光學顯微鏡、一第一電腦和一第一螢幕，其中該光學顯微鏡、該第一電腦和該第一螢幕彼此連接，且該第一電腦透過網際網路與一伺服器連接，利用該光學顯微鏡觀察該待分析樣品並搜尋該待分析樣品欲分析之處，進而在該待分析樣品欲分析之處進行定位標註，且在被定位標註的該待分析樣品的影像同步呈現於該第一螢幕後，截取該第一螢幕所呈現的影像以產生一第一截圖，並透過該第一電腦經由網際網路將該第一截圖傳送並儲存至該伺服器的指定位置； 提供一樣品切割顯微鏡模組，該樣品切割顯微鏡模組包括一樣品切割顯微鏡、一第二電腦和一第二螢幕，其中該樣品切割顯微鏡、該第二電腦和該第二螢幕彼此連接，且該第二電腦透過網際網路與該伺服器連接，利用該樣品切割顯微鏡切割被該光學顯微鏡定位標註的該待分析樣品以形成一試片，且將該試片的影像呈現於該第二螢幕後，截取該第二螢幕所呈現的該試片的影像以產生一第二截圖，並透過該第二電腦經由網際網路將該第二截圖傳送並儲存至該伺服器的該指定位置； 提供一試片汲取模組，該試片汲取模組包括一試片汲取裝置、一第三電腦和一第三螢幕，其中該試片汲取裝置、該第三電腦和該第三螢幕彼此連接，且該第三電腦透過網際網路與該伺服器連接，利用該試片汲取裝置汲取該試片並放置一載具上，且將表面被放置該試片的該載具影像呈現於該第三螢幕後，截取該第三螢幕所呈現的該試片的影像以產生一第三截圖，並透過該第三電腦經由網際網路將該第三截圖傳送並儲存至該伺服器的該指定位置；以及 提供一分析顯微鏡模組，該分析顯微鏡模組包括一分析顯微鏡、一第四電腦和一第四螢幕，其中該分析顯微鏡、該第四電腦和該第四螢幕彼此連接，且該第四電腦透過網際網路與該伺服器連接，將該表面放置有該試片的該載具載入該分析顯微鏡內進行分析以及拍攝，拍攝所得之影像呈現於該第四螢幕後，截取該第四螢幕所呈現的該試片的影像以產生一第四截圖，並透過該第四電腦經由網際網路將該第四截圖傳送並儲存至該伺服器的該指定位置。 A material analysis method for checking the analysis position and analysis requirements of a test piece through an information system, the steps of which include: provide a sample to be analyzed; An optical microscope module is provided, the optical microscope module includes an optical microscope, a first computer and a first screen, wherein the optical microscope, the first computer and the first screen are connected to each other, and the first computer transmits The Internet is connected to a server, and the optical microscope is used to observe the sample to be analyzed and search for the place where the sample to be analyzed is to be analyzed, and then locate and mark the place where the sample to be analyzed is to be analyzed, and locate the labeled After the image of the sample to be analyzed is displayed on the first screen synchronously, the image displayed on the first screen is captured to generate a first screenshot, and the first screenshot is transmitted and stored to the first computer through the Internet through the first computer. the designated location of the server; A sample cutting microscope module is provided, the sample cutting microscope module includes a sample cutting microscope, a second computer and a second screen, wherein the sample cutting microscope, the second computer and the second screen are connected to each other, and the A second computer is connected to the server through the Internet, uses the sample cutting microscope to cut the sample to be analyzed positioned and marked by the optical microscope to form a test piece, and presents the image of the test piece behind the second screen , intercept the image of the test piece presented on the second screen to generate a second screenshot, and transmit and store the second screenshot to the designated location of the server through the second computer via the Internet; A test piece pickup module is provided, the test piece pickup module includes a test piece pickup device, a third computer and a third screen, wherein the test piece pickup device, the third computer and the third screen are connected to each other, And the third computer is connected to the server through the Internet, uses the test piece absorbing device to pick up the test piece and places it on a carrier, and presents the image of the carrier on which the test piece is placed on the third After the screen, capture the image of the test piece displayed on the third screen to generate a third screenshot, and transmit and store the third screenshot to the designated location of the server through the third computer via the Internet; as well as An analysis microscope module is provided, the analysis microscope module includes an analysis microscope, a fourth computer and a fourth screen, wherein the analysis microscope, the fourth computer and the fourth screen are connected to each other, and the fourth computer passes through The Internet is connected to the server, the carrier with the test piece placed on the surface is loaded into the analysis microscope for analysis and shooting, the image obtained by shooting is displayed on the fourth screen, and the fourth screen is intercepted. The presented image of the test piece is used to generate a fourth screenshot, and the fourth screenshot is transmitted and stored to the designated location of the server through the fourth computer via the Internet. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該光學顯微鏡為超高解析度數位顯微鏡。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system according to claim 1, the optical microscope is a super-high resolution digital microscope. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該超高解析度數位顯微鏡為超高解析度二微光學顯微鏡(2D Optical Microscope)或超高解析度三微光學顯微鏡(3D Optical Microscope)。According to the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system as described in claim 1, the ultra-high-resolution digital microscope is an ultra-high-resolution 2D Optical Microscope or an ultra-high-resolution digital microscope. 3D Optical Microscope. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該樣品切割顯微鏡為聚焦離子束顯微鏡(Focused Ion Beam, FIB)。According to the material analysis method for checking the analysis position and analysis requirements of a test piece through an information system as described in claim 1, the sample cutting microscope is a Focused Ion Beam (FIB) microscope. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該試片汲取裝置為吸針裝置。According to the material analysis method for checking the analysis position and analysis requirement of a test piece through an information system as described in claim 1, the test piece drawing device is a needle suction device. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該載具為銅網。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system according to claim 1, the carrier is a copper mesh. 如請求項1所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該分析顯微鏡為電子束顯微鏡、離子束顯微鏡、雙粒子束顯微鏡、原子力顯微鏡、質譜儀、能量散射光譜儀(SEM/EDS)、3D雷射共焦輪廓儀 (3D Laser confocal profile)或X-射線光電子能譜儀 (X-ray photoelectron spectroscopy；XPS)。The material analysis method for checking the analysis position and analysis requirements of a test piece through an information system as described in claim 1, the analysis microscope is an electron beam microscope, an ion beam microscope, a two-particle beam microscope, an atomic force microscope, a mass spectrometer, an energy scattering microscope Spectrometer (SEM/EDS), 3D Laser confocal profile or X-ray photoelectron spectroscopy (XPS). 如請求項7所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該電子束顯微鏡為掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)、掃描式電子顯微鏡/能量散射光譜儀(SEM/EDS)或穿透式電子顯微鏡/能量散射光譜儀(TEM/EDS)。The material analysis method for checking the analysis position and analysis requirements of the test piece through the information system according to claim 7, the electron beam microscope is a scanning electron microscope (SEM), a transmission electron microscope (TEM), a scanning electron microscope Microscope/Energy Scattering Spectrometer (SEM/EDS) or Transmission Electron Microscopy/Energy Scattering Spectrometer (TEM/EDS). 如請求項7所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該離子束顯微鏡為聚焦離子束顯微鏡(FIB)或電漿聚焦離子束掃描電子顯微鏡(PFIB)。According to the material analysis method for checking the analysis position and analysis requirement of the test piece through the information system according to claim 7, the ion beam microscope is a focused ion beam microscope (FIB) or a plasma focused ion beam scanning electron microscope (PFIB). 如請求項7所述的透過資訊系統檢核試片的分析位置及分析需求的材料分析方法，該雙粒子束顯微鏡為雙束聚焦離子束顯微鏡(Dual Beam FIB)、雙束聚焦離子束/能量散射光譜儀(Dual Beam FIB/EDS)。According to the material analysis method for checking the analysis position and analysis requirements of the test piece through the information system according to claim 7, the dual particle beam microscope is a dual beam focused ion beam microscope (Dual Beam FIB), a dual beam focused ion beam/energy Scattering spectrometer (Dual Beam FIB/EDS).
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