TW202135947A - Ink circulation device to ensure the temperature and flow rate of the ink supplied to the plurality of ink circulating heads to be truly uniform - Google Patents
Ink circulation device to ensure the temperature and flow rate of the ink supplied to the plurality of ink circulating heads to be truly uniform Download PDFInfo
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- TW202135947A TW202135947A TW110109866A TW110109866A TW202135947A TW 202135947 A TW202135947 A TW 202135947A TW 110109866 A TW110109866 A TW 110109866A TW 110109866 A TW110109866 A TW 110109866A TW 202135947 A TW202135947 A TW 202135947A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/18—Ink recirculation systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04531—Control methods or devices therefor, e.g. driver circuits, control circuits controlling a head having a heater in the manifold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17596—Ink pumps, ink valves
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Abstract
Description
本發明係有關於一種墨料(ink)循環裝置,用以對複數個墨料 循環頭供給墨料,該複數個墨料循環頭係噴出阻焊劑墨料(solder resist ink)此種黏度較高的墨料。The present invention relates to an ink circulation device, which is used to dispense a plurality of inks The circulation head supplies ink, and the plurality of ink circulation heads eject solder resist ink, which is a relatively high-viscosity ink.
為了覆蓋印刷基板(printer substrate)的表面並保護電路圖案(circuit pattern),於印刷基板形成有阻焊劑圖案(solder resist pattern)。已知有一種作為阻焊劑圖案形成裝置的噴墨(ink jet)裝置,為了形成阻焊劑圖案,從複數個噴墨頭(ink jet hand)對印刷基板噴出阻焊劑墨料(solder resist ink)。會有此種噴墨裝置具備用以對複數個噴墨頭供給阻焊劑墨料的墨料循環裝置之情形。在此所使用的阻焊劑墨料係具有熱硬化性以及UV(Ultra Violet;紫外線)硬化性且黏度較高。因此,考量到此點,墨料循環裝置係構成為將分別被供給至複數個噴墨頭之墨料的流量均一化,並具有用以加熱欲供給至複數個噴墨頭的阻焊劑墨料之加熱器。In order to cover the surface of the printer substrate and protect the circuit pattern, a solder resist pattern is formed on the printed substrate. An ink jet device is known as a solder resist pattern forming device. In order to form a solder resist pattern, a plurality of ink jet hands eject solder resist ink to a printed circuit board. There may be cases where such an inkjet device has an ink circulation device for supplying solder resist ink to a plurality of inkjet heads. The solder resist ink used here has thermal curability and UV (Ultra Violet; ultraviolet) curability and high viscosity. Therefore, considering this point, the ink circulation device is configured to uniformize the flow rate of the ink supplied to the plurality of inkjet heads, and has a solder resist ink for heating the ink to be supplied to the plurality of inkjet heads. The heater.
日本特開2019-1000號公報係與本案所揭示的墨料循環裝置相關,記載有一種用以供給應從通流(through flow)型的複數個頭噴出的液體之液體循環裝置(段落[0036]至[0048]、圖5)。日本特開2019-1000號公報的液體循環裝置係具有從加壓副槽(220)經由第一歧管(manifold)(230)、複數個頭(100)、第二歧管(240)、減壓副槽(210)返回至加壓副槽(220)之循環路徑。在該循環路徑中,於從第一歧管(230)至各個頭(100)之供給路徑(231)設置有電磁閥(232),亦於從各個頭(100)至各第二歧管(240)之排出路徑(241)設置有電磁閥(242)。Japanese Patent Laid-Open No. 2019-1000 is related to the ink circulation device disclosed in this case, and describes a liquid circulation device for supplying liquid to be ejected from a plurality of through flow-type heads (paragraph [0036] to [0048], Figure 5). The liquid circulation device of Japanese Patent Application Publication No. 2019-1000 has a pressure sub-tank (220), a first manifold (230), a plurality of heads (100), a second manifold (240), and a decompression The secondary tank (210) returns to the circulation path of the pressurized secondary tank (220). In this circulation path, a solenoid valve (232) is provided in the supply path (231) from the first manifold (230) to each head (100), and also from each head (100) to each second manifold ( The discharge path (241) of 240) is provided with a solenoid valve (242).
此外,於日本特開2009-233589號公報記載有用以對複數個墨料循環型頭供給墨料並使墨料於複數個墨料循環型頭循環之墨料供給裝置(申請專利範圍的請求項1、段落[0016]至[0018])。日本特開2009-233589號公報的墨料供給裝置係具備:供給歧管部,係由墨料供給部、循環泵部(4)以及供給歧管(18)等所構成;回收歧管部,係由回收歧管(17)等所構成;以及墨料噴出部(5);為了將頭內的墨料溫度保持在適當溫度,於供給歧管與回收歧管之間設置有調溫器(27)。In addition, Japanese Patent Laid-Open No. 2009-233589 describes an ink supply device for supplying ink to a plurality of ink circulation type heads and circulating the ink in the plurality of ink circulation type heads (claims in the scope of patent application) 1. Paragraphs [0016] to [0018]). The ink supply device of Japanese Patent Application Laid-Open No. 2009-233589 is provided with: a supply manifold section, which is composed of an ink supply section, a circulation pump section (4), a supply manifold (18), etc.; and a recovery manifold section, It is composed of a recovery manifold (17), etc.; and an ink ejection part (5); in order to keep the ink temperature in the head at an appropriate temperature, a thermostat ( 27).
[發明所欲解決之課題][The problem to be solved by the invention]
在用以噴出阻焊劑墨料或者UV墨料之噴墨裝置中,在以一個墨料循環裝置(一個墨料循環迴路)對複數個噴墨頭供給墨料之情形中,由於墨料的黏度較高,因此以45℃以上的高溫使墨料循環。因此,需要用以降低分別被供給至複數個噴墨頭之墨料的溫度的偏差以及墨料的流量的偏差之構成。In the inkjet device used to eject solder resist ink or UV ink, when an ink circulation device (an ink circulation circuit) supplies ink to a plurality of inkjet heads, due to the viscosity of the ink Higher, so the ink is circulated at a high temperature above 45°C. Therefore, it is necessary to reduce the deviation of the temperature of the ink supplied to the plurality of inkjet heads and the deviation of the flow rate of the ink.
相對於此,於日本特開2019-1000號公報所記載的液體循環裝置中,液體從第一歧管經由複數個供給路徑(231)分別被供給至複數個頭(100)並從複數個頭(100)分別經由複數個排出路徑(241)被排出,藉此被供給至複數個頭(100)之液體的流量被均一化。然而,於日本特開2019-1000號公報中完全未記載有用以調節被供給至複數個頭(100)之液體的溫度之構成。In contrast, in the liquid circulation device described in Japanese Patent Application Laid-Open No. 2019-1000, the liquid is supplied from the first manifold to the plurality of heads (100) via the plurality of supply paths (231), and from the plurality of heads (100). ) Are respectively discharged through a plurality of discharge paths (241), whereby the flow rate of the liquid supplied to the plurality of heads (100) is uniformized. However, there is no description in Japanese Patent Application Laid-Open No. 2019-1000 that is useful for adjusting the temperature of the liquid supplied to the plurality of heads (100).
於日本特開2009-233589號公報所記載的墨料供給裝置中,為了將頭內的墨料溫度保持在適當溫度,於供給歧管與回收歧管之間設置有調溫器(27)。然而,會有在從供給歧管對複數個墨料循環型頭供給墨料的過程中於墨料溫度產生偏差從而無法將複數個墨料循環型頭中的墨料溫度均一化之可能性。In the ink supply device described in JP 2009-233589 A, in order to maintain the ink temperature in the head at an appropriate temperature, a thermostat (27) is provided between the supply manifold and the recovery manifold. However, in the process of supplying ink from the supply manifold to the plurality of ink circulation type heads, a deviation may occur in the temperature of the ink, and the ink temperature in the plurality of ink circulation type heads may not be uniformized.
因此,在以一個墨料循環迴路對複數個墨料循環型頭供給阻焊劑墨料此種黏度較高的墨料之情形中,期望將被供給至複數個墨料循環型頭之墨料的溫度以及流量確實地均一化。 [用以解決課題之手段]Therefore, in the case where a relatively high viscosity ink such as solder resist ink is supplied to a plurality of ink circulation type heads by an ink circulation circuit, it is desirable to supply the ink to the plurality of ink circulation type heads. The temperature and flow rate are surely uniformized. [Means to solve the problem]
本發明的第一態樣為一種墨料循環裝置,係以經由墨料循環型的複數個噴墨頭之一個循環迴路使墨料循環並對複數個前述噴墨頭供給墨料;前述墨料循環裝置係具備:供給側歧管以及排出側歧管,係在前述循環迴路中分別配置於複數個前述噴墨頭的上游側以及下游測;複數個供給側分歧路徑,係構成前述循環迴路的一部分,用以將前述供給側歧管中的墨料分別供給至複數個前述噴墨頭;複數個排出側分歧路徑,係構成前述循環迴路的一部分,用以將複數個前述噴墨頭中的墨料分別排出至前述排出側歧管;共通調溫器,係包含用以加熱前述供給側歧管內的墨料之加熱器,用以調節前述墨料的溫度;以及複數個別調溫器,係分別包含用以加熱經由複數個前述供給側分歧路徑分別被供給至複數個前述噴墨頭的墨料之加熱器,用以以相同的目標溫度分別調節前述墨料的溫度。The first aspect of the present invention is an ink circulation device that circulates ink through a circulation loop of a plurality of inkjet heads of the ink circulation type and supplies ink to the plurality of inkjet heads; The circulation device is equipped with: a supply-side manifold and a discharge-side manifold, which are respectively arranged on the upstream and downstream sides of the plurality of inkjet heads in the circulation circuit; and a plurality of supply-side branch paths constitute the circulation circuit. One part is used to supply the ink in the supply side manifold to the plurality of inkjet heads; the plurality of discharge side branch paths constitute a part of the foregoing circulation circuit, which is used to transfer the ink in the plurality of inkjet heads Ink materials are respectively discharged to the aforementioned discharge-side manifold; a common thermostat includes a heater for heating the ink in the aforementioned supply-side manifold to adjust the temperature of the aforementioned ink; and a plurality of individual thermostats, The heaters respectively include heaters for heating the inks respectively supplied to the plurality of inkjet heads via the plurality of supply side branch paths, and respectively adjust the temperature of the inks with the same target temperature.
本發明的第二態樣係如本發明的第一態樣,其中從前述供給側歧管分別經由複數個前述供給側分歧路徑以及複數個前述排出側分歧路徑到達至前述排出側歧管之複數個分歧路徑係構成為配管的長度以及配管阻抗成為相同。The second aspect of the present invention is the same as the first aspect of the present invention, wherein from the supply side manifold to the plurality of the discharge side manifold via the plurality of supply side branch paths and the plurality of discharge side branch paths respectively The two branch path systems are configured such that the length of the pipe and the impedance of the pipe become the same.
本發明的第三態樣係如本發明的第二態樣,其中進一步具備:複數個個別閥,係分別開閉複數個前述分歧路徑。The third aspect of the present invention is the same as the second aspect of the present invention, which further includes a plurality of individual valves for opening and closing a plurality of the aforementioned branch paths respectively.
本發明的第四態樣係如本發明的第三態樣,其中複數個前述個別閥係構成為能夠調整流量。The fourth aspect of the present invention is the same as the third aspect of the present invention, wherein a plurality of the aforementioned individual valves are configured to be able to adjust the flow rate.
本發明的第五態樣係如本發明的第二態樣,其中進一步具備:複數個供給側個別閥,係分別開閉複數個前述供給側分歧路徑;以及複數個排出側個別閥,係分別開閉複數個前述排出側分歧路徑。The fifth aspect of the present invention is the same as the second aspect of the present invention, which further includes: a plurality of supply-side individual valves which respectively open and close a plurality of the aforementioned supply-side branch paths; and a plurality of discharge-side individual valves which respectively open and close A plurality of the aforementioned branching paths on the discharge side.
本發明的第六態樣係如本發明的第五態樣,其中進一步具備:旁路(bypass)流路,係從前述供給側歧管到達至前述排出側歧管;以及旁路閥,係開閉前述旁路流路。The sixth aspect of the present invention is the same as the fifth aspect of the present invention, which further includes: a bypass flow path from the supply side manifold to the discharge side manifold; and a bypass valve, Open and close the aforementioned bypass flow path.
本發明的第七態樣係如本發明的第六態樣,其中進一步具備:供給槽,係儲留欲經由前述供給側歧管供給至複數個前述噴墨頭的墨料;循環槽,係儲留從複數個前述噴墨頭經由前述排出側歧管排出的墨料;用以將墨料從前述排出側歧管排出至前述循環槽之流路;用以將墨料從前述循環槽輸送至前述供給槽之流路;用以將墨料從前述供給槽供給至前述供給側歧管之流路;加壓調整裝置,係將前述供給槽的氣壓設定成正壓;減壓調整裝置,係將前述循環槽的氣壓設定成負壓;以及控制部,係控制複數個前述供給側個別閥、複數個前述排出側個別閥、前述旁路閥、前述加壓調整裝置以及前述減壓調整裝置;前述控制部係在前述墨料循環裝置啟動時,在預定的待機期間中,以複數個前述供給側個別閥以及複數個前述排出側個別閥變成閉狀態且前述旁路閥變成開狀態之方式控制前述旁路閥、複數個前述供給側個別閥以及複數個前述排出側個別閥;前述控制部係在前述墨料循環裝置啟動時,在預定的前述待機期間中,以作為前述供給槽的氣壓而設定的正壓與大氣壓之間的差變成比在前述墨料循環裝置的穩態動作狀態中屬於作為前述供給槽的氣壓而設定的正壓之穩態正壓與大氣壓之間的差還大並且作為前述循環槽的氣壓而設定的負壓與大氣壓之間的差變成比在前述墨料循環裝置的穩態動作狀態中屬於作為前述循環槽的氣壓而設定的負壓之穩態負壓與大氣壓之間的差還大之方式控制前述加壓調整裝置以及前述減壓調整裝置;前述控制部係在經過前述待機期間時,以複數個前述供給側個別閥以及複數個前述排出側個別閥變成開狀態且前述旁路閥變成閉狀態之方式控制前述旁路閥、複數個前述供給側個別閥以及複數個前述排出側個別閥,並且以前述供給槽的氣壓變成前述穩態正壓且前述循環槽的氣壓變成前述穩態負壓之方式控制前述加壓調整裝置以及前述減壓調整裝置。 [發明功效]The seventh aspect of the present invention is the sixth aspect of the present invention, further comprising: a supply tank for storing ink to be supplied to the plurality of inkjet heads via the supply side manifold; and a circulation tank Store ink discharged from a plurality of inkjet heads through the discharge side manifold; flow path for discharging ink from the discharge side manifold to the circulation tank; for conveying ink from the circulation tank The flow path to the aforementioned supply tank; the flow path used to supply ink from the aforementioned supply tank to the aforementioned supply-side manifold; a pressure adjustment device that sets the air pressure of the aforementioned supply tank to a positive pressure; a pressure reduction adjustment device, The air pressure of the circulation tank is set to a negative pressure; and the control unit controls a plurality of the supply side individual valves, a plurality of the discharge side individual valves, the bypass valve, the pressure adjustment device, and the pressure reduction adjustment device ; The control unit is a method in which a plurality of the supply side individual valves and a plurality of the discharge side individual valves become closed and the bypass valves become open during a predetermined standby period when the ink circulation device is activated Controls the bypass valve, the supply-side individual valves, and the discharge-side individual valves; the control unit is used as the air pressure of the supply tank during the predetermined standby period when the ink circulation device is activated The difference between the set positive pressure and the atmospheric pressure becomes larger than the difference between the steady state positive pressure and the atmospheric pressure belonging to the positive pressure set as the pressure of the supply tank in the steady state operation state of the ink circulation device. And the difference between the negative pressure set as the air pressure of the circulation tank and the atmospheric pressure becomes greater than the steady-state negative pressure and the negative pressure set as the air pressure of the circulation tank in the steady-state operating state of the ink circulation device. The pressure adjustment device and the pressure reduction adjustment device are controlled so that the difference between the atmospheric pressures is large; the control unit uses a plurality of the supply side individual valves and a plurality of the discharge side individual valves when the standby period elapses. The bypass valve, the supply-side individual valves, and the discharge-side individual valves are controlled such that the bypass valve becomes the open state and the bypass valve becomes the closed state, and the air pressure of the supply tank becomes the steady-state positive pressure and the foregoing The pressure adjustment device and the pressure reduction adjustment device are controlled in such a way that the air pressure of the circulation tank becomes the steady state negative pressure. [Efficacy of invention]
依據本發明的第一態樣,在以一個循環迴路對複數個噴墨頭供給墨料之構成中,不僅加熱供給側歧管內的墨料從而調節該墨料的溫度,亦加熱從供給側歧管經由複數個供給側分歧路徑分別供給至複數個噴墨頭的墨料從而以相同的目標溫度分別調節該墨料的溫度。藉此,能將藉由一個墨料循環迴路供給墨料之複數個噴墨頭中的墨料溫度確實地均一化。According to the first aspect of the present invention, in the configuration of supplying ink to a plurality of inkjet heads in a circulation loop, not only the ink in the supply side manifold is heated to adjust the temperature of the ink, but also the ink from the supply side is heated. The manifolds respectively supply the inks of the inkjet heads via the plurality of supply-side branch paths to adjust the temperature of the inks at the same target temperature. Thereby, the ink temperature in a plurality of inkjet heads supplied with ink through one ink circulation circuit can be uniformized surely.
依據本發明的第二態樣,由於從供給側歧管到達至排出側歧管之複數個分歧路徑係構成為配管的長度以及配管阻抗相同,因此將複數個分歧路徑中的墨料的流量均一化,從而抑制朝向複數個噴墨頭的墨料供給量的偏差。According to the second aspect of the present invention, since the plurality of branch paths from the supply side manifold to the discharge side manifold are configured to have the same pipe length and pipe impedance, the flow rate of the ink in the plurality of branch paths is uniform Therefore, the deviation of the ink supply amount to the plurality of inkjet heads can be suppressed.
依據本發明的第三態樣,能藉由複數個個別閥分別開閉從供給側歧管到達至排出側歧管的複數個分歧路徑。According to the third aspect of the present invention, a plurality of branch paths from the supply side manifold to the discharge side manifold can be opened and closed by a plurality of individual valves, respectively.
依據本發明的第四態樣,能藉由設置於從供給側歧管到達至排出側歧管的複數個分歧路徑之複數個個別閥分別調整該複數個分歧路徑中的墨料的流量。因此,能與該複數個分歧路徑的配管的長度以及配管阻抗相同之構成相輔相成從而將該複數個分歧路徑中的墨料的流量確實地均一化。According to the fourth aspect of the present invention, the flow rate of the ink in the plurality of branch paths can be adjusted by the plurality of individual valves provided in the plurality of branch paths from the supply side manifold to the discharge side manifold. Therefore, it is possible to complement the configuration in which the length of the piping of the plurality of branch paths and the piping impedance are the same, so that the flow rate of the ink in the plurality of branch paths can be surely uniformized.
依據本發明的第五態樣,能藉由複數個供給側個別閥分別開閉複數個供給側分歧路徑,並能藉由複數個排出側個別閥分別開閉複數個排出側分歧路徑。According to the fifth aspect of the present invention, a plurality of supply-side branch paths can be opened and closed by a plurality of supply-side individual valves, and a plurality of discharge-side branch paths can be opened and closed by a plurality of discharge-side individual valves.
依據本發明的第六態樣,藉由開放旁路閥,能將被供給至供給側歧管的墨料經由旁路流路輸送至排出側歧管而不供給至噴墨頭側。According to the sixth aspect of the present invention, by opening the bypass valve, the ink supplied to the supply side manifold can be transported to the discharge side manifold via the bypass flow path without being supplied to the inkjet head side.
依據本發明的第七態樣,在墨料循環裝置的啟動時的待機期間中,複數個上述供給側個別閥以及複數個上述排出側個別閥係變成閉狀態且上述旁路閥係變成開狀態。此外,將屬於供給槽的氣壓之正壓與大氣壓之間的差設定成比該供給槽的穩態正壓與大氣壓之間的差還大,將屬於供給槽的氣壓之負壓與大氣壓之間的差設定成比該供給槽的穩態負壓與大氣壓之間的差還大。藉由以將供給槽的負壓與循環槽的正壓之間的差增大之方式進行變更,墨料的流量變得比穩態循環時還多。在啟動時的待機期間中,在墨料循環裝置停止中阻止混入的氣泡朝噴墨頭側流動之狀態下該混入的氣泡係比以往還短時間地被排出至槽外,而且墨料以及用以構成流路之配管部的溫度上升加速,達至穩態墨料溫度為止之時間比以往還縮短。According to the seventh aspect of the present invention, during the standby period when the ink circulation device is activated, a plurality of the supply side individual valves and a plurality of the discharge side individual valve systems become closed and the bypass valve systems become open . In addition, the difference between the positive pressure of the air pressure belonging to the supply tank and the atmospheric pressure is set to be larger than the difference between the steady-state positive pressure of the supply tank and the atmospheric pressure, and the negative pressure of the air pressure belonging to the supply tank is set to be greater than the atmospheric pressure. The difference of is set to be larger than the difference between the steady-state negative pressure of the supply tank and the atmospheric pressure. By changing to increase the difference between the negative pressure of the supply tank and the positive pressure of the circulation tank, the flow rate of the ink becomes larger than that in the steady state circulation. During the standby period at startup, the mixed air bubbles are prevented from flowing to the inkjet head side while the ink circulation device is stopped. The mixed air bubbles are discharged to the outside of the tank in a shorter time than before. The temperature rise of the piping part that constitutes the flow path is accelerated, and the time to reach the steady-state ink temperature is shorter than before.
以下參照隨附圖式說明本發明的實施形態。Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[1.整體構成]
圖1係顯示具備本發明的實施形態之一的墨料循環裝置之阻焊劑墨料噴射裝置的整體構成之立體圖。以下如圖1所示,定義XYZ正交座標系統,將彼此正交的水平的兩個方向作為X軸方向以及Y軸方向,將鉛直方向的朝上方向作為Z軸方向。阻焊劑墨料噴射裝置係具備基部2以及固定於基部2上的支撐構造物6,於基部2上設置有Y軸方向移動機構4,於支撐構造物6的側面設置有X軸方向移動機構3。X軸方向移動機構3係包含線性馬達(linear motor)等(未圖示),該線性馬達係用以使作為噴墨移動體30的托架沿著導軌(guide rail)41移動。Y軸方向移動機構4係包含朝Y軸方向延伸的兩條導軌21、21,台(table)10係以被這兩條導軌21、21導引而能夠於Y軸方向移動的狀態下安裝於這兩條導軌21、21。Y軸方向移動機構4係包含用以使台10沿著導軌21移動之線性馬達等(未圖示)。[1. Overall composition]
FIG. 1 is a perspective view showing the overall structure of a solder resist ink jetting device equipped with an ink circulation device according to one embodiment of the present invention. Hereinafter, as shown in FIG. 1, the XYZ orthogonal coordinate system is defined, and two horizontal directions orthogonal to each other are defined as the X-axis direction and the Y-axis direction, and the upward direction of the vertical direction is defined as the Z-axis direction. The solder resist ink jetting device is provided with a base 2 and a support structure 6 fixed to the base 2. A Y-axis direction moving mechanism 4 is provided on the base 2 and an X-axis direction moving mechanism 3 is provided on the side of the support structure 6 . The X-axis direction moving mechanism 3 includes a linear motor (not shown) and the like for moving the carriage as the
如上所述,噴墨移動體30係以能夠經由升降機構5朝X軸方向移動的形態安裝於導軌41、41,升降機構5係作為Z軸方向移動機構發揮作用。因此,噴墨移動體30係構成為不僅能夠朝X軸方向移動亦能朝Z軸方向移動。噴墨移動體30係包含:頭部31,係用以噴出阻焊劑墨料;以及循環機構本體部33,係用以對頭部31供給阻焊劑墨料。As described above, the
台10係用以載置欲藉由從上述頭部31噴出阻焊劑墨料從而形成阻焊劑圖案的印刷基板之構件,且具備用以將所載置的印刷基板固定於台之機構(未圖示)。The stage 10 is a member for mounting a printed circuit board for which a solder resist pattern is to be formed by spraying a solder resist ink from the head 31, and is equipped with a mechanism for fixing the mounted printed circuit board on the stage (not shown) Show).
此外,阻焊劑墨料噴射裝置係具備控制部50並構成為:控制部 50係控制X軸方向移動機構3、Y軸方向移動機構4以及升降機構5,藉此能在預定範圍內任意地變更噴墨移動體30中的頭部31與載置於台10的上表面的印刷基板之間的相對性位置關係。此外,如後所述,控制部50亦使用於用以控制本實施形態的墨料循環裝置中的阻焊劑墨料的流動以及溫度,且亦作為屬於墨料循環裝置的構成要素之控制部發揮作用。In addition, the solder resist ink jetting device is equipped with a
[2.墨料循環裝置的構成]
接著,說明本實施形態的墨料循環裝置。墨料循環裝置係具備:用以構成阻焊劑墨料的循環性的流路之部分(以下稱為「墨料循環系統」或者「墨料循環迴路」),係相當於圖1所示的噴墨移動體30中的頭部31以及循環機構本體部33等;以及控制部50,係用以控制墨料循環系統中的阻焊劑墨料(以下亦簡稱為「墨料」)的流動以及溫度。[2. Composition of ink circulation device]
Next, the ink circulation device of this embodiment will be described. The ink circulation device is equipped with: a part (hereinafter referred to as the "ink circulation system" or "ink circulation circuit") that constitutes the circulation flow path of the solder resist ink, which is equivalent to the spray nozzle shown in Figure 1 The head 31 and the circulation mechanism body 33 in the
圖2係顯示本實施形態的墨料循環系統的構成之圖。如圖2所示,本實施形態的墨料循環系統係由循環箱墨料循環部、循環托架配管部以及頭部所構成。其中,頭部係包含於圖1所示的頭部31,循環箱墨料循環部與循環托架配管部係包含於圖1所示的循環機構本體部33。Fig. 2 is a diagram showing the configuration of the ink circulation system of this embodiment. As shown in FIG. 2, the ink circulation system of this embodiment is composed of a circulation tank ink circulation part, a circulation bracket piping part, and a head. Among them, the head is included in the head 31 shown in FIG. 1, and the ink circulation part of the circulation tank and the circulation bracket piping part are included in the circulation mechanism main body 33 shown in FIG. 1.
如圖2所示,循環箱墨料循環部係包含補充槽101、循環槽102、供給槽103、第一共通路徑電磁閥SV11、第二共通路徑電磁閥SV12、第一送液泵EP1、第二送液泵EP2、用以去除異物等之過濾器FL、用以偵測補充槽101、循環槽102、供給槽103中的墨料是否到達上限以及下限等之幾個位準感測器(level sensor)LV。從外部經由流路200被供給至墨料循環裝置之墨料首先係被儲留於補充槽101。於補充槽101與循環槽102之間設置有流路(以下稱為「第一共通流路」) 211,藉由設置於第一共通流路211之第一送液泵EP1將補充槽101內的墨料經由第一共通路徑電磁閥SV11輸送至循環槽102。於循環槽102與供給槽103之間設置有流路(以下稱為「第二共通流路」)212,藉由設置於第二共通流路212之第二送液泵EP2將循環槽102內的墨料經由第二共通路徑電磁閥SV12以及過濾器FL輸送至供給槽103。此外,補充槽101、循環槽102以及供給槽103係配置於相同的高度(鉛直方向中的相同位置),並在圖2所示的墨料循環系統中以墨料適當地流動之方式將循環槽102內的氣壓調整成負壓Pn且將供給槽103內的氣壓調整成正壓Pp(詳細內容係於後述之)。用以調整本實施形態中的各個加熱部的墨料溫度之加熱管調溫器TR12、輸入側共通歧管調溫器TR13、調溫器TR1至TR9係包含加熱管加熱器HE12、輸入側共通歧管加熱器13、頭個別區塊加熱器HE1至HE9以及溫度感測恆溫器(temperature sensor thermostat),並且以變成藉由控制部50所設定的溫度之方式控制各個加熱器。As shown in FIG. 2, the ink circulation part of the circulation box includes a
如圖2所示,循環托架配管部係作為供給側歧管之輸入側共通歧管111、作為排出側歧管之輸出側共通歧管112、包含加熱管加熱器E12之調溫器(以下稱為「加熱管調溫器」)TR12、用以檢測輸入側共通歧管111內的墨料的溫度之輸入歧管液溫感測器TS6、作為頭個別閥之第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10、以及第一聯結器(coupler)CV1至第十聯結器CV10。第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10亦可為能連續地調整於對應的流路流動的墨料的流量之閥。再者,循環托架配管部係包含由第一個別區塊121至第十個別區塊130所構成的十個頭個別區塊。頭部係包含由第一頭HD1至第五頭HD5所構成的五個噴墨頭(以下亦簡稱為「頭HD1至HD5」)。輸入側共通歧管111係具備調溫器(以下稱為「輸入側共通歧管調溫器TR13」),該輸入側共通歧管調溫器TR13係包輸入側共通歧管加熱器HE13。屬於輸入側的個別區塊之第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129為墨料供給用的頭個別區塊,分別包含頭個別區塊加熱器HE1、HE3、HE5、HE7、HE9之調溫器(以下稱為「頭個別區塊調溫器」)TR1、TR3、TR5、TR7、TR9。此外,於頭HD1至HD5分別安裝有頭恆溫器TS1至TS5。頭恆溫器TS1至TS5係輸出與對應的頭HD1、HD2、HD3、HD4、HD5的(與頭HD1、HD2、HD3、HD4、HD5內的墨料的液溫大致相等)溫度相當的頭恆溫器溫度TSt1至TSt5。
此外,輸入側共通歧管111以及輸出側共通歧管112皆具有墨料的緩衝功能。As shown in Figure 2, the circulation bracket piping part is the input side
如圖2所示,在墨料循環系統中,設置有從供給槽103到達至輸入側共通歧管(以下亦稱為「輸入歧管」)111之墨料供給用的流路213,於流路(以下稱為「第三共通流路」)213設置有加熱管加熱器HE12。第三共通流路213係在輸入側共通歧管111分歧成由第一個別流路201至第五個別流路205所構成的五個墨料供給用的流路,作為這些供給側分歧路徑之第一個別流路201至第五個別流路205係分別連通至屬於五個墨料供給用的頭個別區塊之第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129。此外,於這些第一個別流路201至第五個別流路205分別設置有第一個別路徑電磁閥SV1至第五個別路徑電磁閥SV5且分別設置有第一聯結器CV1、第三聯結器CV3、第五聯結器CV5、第七聯結器CV7以及第九聯結器CV9。第一個別流路201至第五個別流路205係在第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127以及第九個別區塊129分別分歧成兩個流路並分別連通至第一頭HD1至第五頭HD5的供給口。此外,各個頭HDi(i=1至5)係具有用以接受墨料之兩個供給口以及用以排出墨料之兩個排出口。As shown in Figure 2, the ink circulation system is provided with a
各個頭HDi(i=1至5)為墨料循環型的噴射頭,且構成為:經由從兩個供給口所供給的墨料中之與未從該頭HDi的噴嘴噴出的墨料對應之噴嘴從兩個排出口排出。Each head HDi (i=1 to 5) is an ink circulation type ejection head, and is configured to correspond to the ink that is not ejected from the nozzles of the head HDi through one of the inks supplied from the two supply ports The nozzles are discharged from two discharge ports.
於第一頭HD1至第五頭HD5的排出口係各自連接有兩個分別連通至第二個別區塊122、第四個別區塊124、第六個別區塊126、第八個別區塊128、第十個別區塊130之流路。藉此,從第一頭HD1至第五頭HD5排出的墨料係分別經由兩個流路分別被輸送至第二個別區塊122、第四個別區塊124、第六個別區塊126、第八個別區塊128以及第十個別區塊130;於這些第二個別區塊122、第四個別區塊124、第六個別區塊126、第八個別區塊128以及第十個別區塊130分別連接有墨料排出用的一個流路。亦即,於這些第二個別區塊122、第四個別區塊124、第六個別區塊126、第八個別區塊128以及第十個別區塊130分別連接有作為墨料排出用的流路之第六個別流路206至第十個別流路210,作為這些排出側分歧路徑之第六個別流路206至第十個別流路210係連通至輸出側共通歧管(以下亦稱為「輸出歧管」)112。於這些第六個別流路206至第十個別流路210分別設置有第二聯結器CV2、第四聯結器CV4、第六聯結器CV6、第八聯結器CV8以及第十聯結器CV10並且分別設置有第六個別路徑電磁閥SV6至第十個別路徑電磁閥SV10。Two discharge ports at the first head HD1 to the fifth head HD5 are connected to the second
於輸出歧管112與循環槽102之間設置有墨料排出用的第四共通流路214,第四共通流路214係使用於用以將經由上述第六個別流路206至第十個別流路210排出的墨料輸送至循環槽102。A fourth
此外,在墨料循環系統中,設置有從輸入歧管111到達至輸出歧管112之旁路流路215,於旁路流路215設置有旁路電磁閥SV13。旁路電磁閥(亦稱為作為輸入-輸出共通歧管閥的旁路電磁閥)SV13雖然在後述的啟動調溫程序中被打開,但在之後的穩態調溫程序被關閉(參照後述的圖5的步驟S102、S122)。In addition, in the ink circulation system, a
在以上述方式所構成的墨料循環系統中,為了在穩態動作時(後述的啟動調溫程序以及穩態調溫程序的執行後的穩態動作狀態時)將被供給至第一頭HD1至第五頭HD5的墨料量均一化,從輸入歧管111經由第一個別流路201至第五個別流路205、第一頭HD1至第五頭HD5以及第六個別流路206至第十個別流路210到達至輸出歧管112為止之五個流路係構成為這些配管的長度以及配管阻抗變成彼此相同。此外,在此種構成中,較佳為將供給側的第一個別流路201至第五個別流路205的配管的長度以及配管阻抗作成彼此相同,並將排出側的第六個別流路206至第十個別流路210的配管長度以及配管阻抗作成彼此相同。此外,分別設置於連接至輸入歧管111的墨料供給用的第一個別流路201至第五個別流路205之第一個別路徑電磁閥SV1至第五個別路徑電磁閥SV5係構成為能夠手動地調整流量。藉此,能更確實地將供給至第一頭HD1至第五頭HD5的墨料量均一化。此外,分別設置於連接至輸出歧管112的墨料排出用的第六個別流路206至第十個別流路210之第六個別路徑電磁閥SV6至第十個別路徑電磁閥SV10亦構成為能夠調整流量。In the ink circulation system constructed in the above manner, in order to be supplied to the first head HD1 during steady-state operation (in the steady-state operation state after the start of the temperature regulation program and the steady-state temperature regulation program described later) The ink volume to the fifth head HD5 is uniformized, from the
如上所述,在上述墨料循環系統中,循環槽102內的氣壓被調整至負壓Pn,供給槽103內的氣壓被調整至正壓Pp。因此,如圖3所示,為了將循環槽102的內部的氣壓調整至負壓(比大氣壓還低的壓力)Pn,於循環槽102連接有減壓調整裝置152;為了將供給槽103的內部的氣壓調整至正壓(比大氣壓還高的壓力)Pp,於供給槽103連接有加壓調整裝置153。減壓調整裝置152係例如由真空泵、減壓緩衝槽、壓力調整機構(調整器(regulator))等所構成,加壓調整裝置153係例如由空壓機(compressor)、加壓緩衝槽以及壓力調整機構(調整器)等所構成。這些減壓調整裝置152以及加壓調整裝置153係構成為能夠藉由控制部50的控制而以後述的方式動作。As described above, in the ink circulation system described above, the air pressure in the
圖4係顯示本實施形態的控制部50的硬體構成之方塊圖。控制部50係具備CPU(Central Processing Unit;中央處理單元)511、ROM(Read Only Memory;唯讀記憶體)512以及RAM(Random Access Memory;隨機存取記憶體)513,並具備流路閥控制介面521、頭控制介面522、壓力控制介面523、加熱器控制介面525、目標溫度設定介面527以及溫度監視介面529作為用以控制圖2所示的循環系統中墨料的流動以及溫度之介面,這些控制部50的各個構成要素之CPU511、ROM512、RAM513、流路閥控制介面521、頭控制介面522、壓力控制介面523、加熱器控制介面525、目標溫度設定介面527以及溫度監視介面529係經由系統匯流排彼此連接。於ROM512儲存有墨料循環控制處理程式,CPU511一邊使用RAM513作為作業用記憶體一邊執行墨料循環控制處理程式,藉此控制墨料循環系統中的墨料的流動以及溫度。此外,進行基於圖案形成資料之頭HD1至HD5的墨料液滴噴出控制。FIG. 4 is a block diagram showing the hardware configuration of the
在此,流路閥控制介面521係用以使CPU511控制第一共通路徑電磁閥SV11、第二共通路徑電磁閥SV12與旁路電磁閥SV13的開閉以及第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10的開閉之介面。頭控制介面522係下述介面:用以將圖案形成資料發送至頭HD1至HD5,使頭HD1至HD5噴出液滴(墨料滴),藉此使頭HD1至HD5進行基於圖案形成資料的圖案形成。在對頭HD1至HD5發送不同的內容的圖案形成資料之情形中,會有從頭HD1至HD5噴出的墨料噴出量變得不均一之可能性。壓力控制介面523係用以控制減壓調整裝置152以及加壓調整裝置153之介面,減壓調整裝置152以及加壓調整裝置153係用以分別調整循環槽102以及供給槽103的氣壓。加熱器控制介面525係用以控制加熱管加熱器HE12、輸入側共通歧管加熱器HE13以及頭個別區塊加熱器HE1、HE3、HE5、HE7、HE9的導通(ON)以及切斷(OFF)之介面。目標溫度設定介面527係用以設定加熱管調溫器TR12的目標溫度Tk1、輸入側共通歧管調溫器TR13的目標溫度Ti1以及頭個別區塊調溫器TR1、TR3、TR5、TR7、TR9的目標溫度Th1之介面。溫度監視介面529係用以取得從頭恆溫器TS1至TS5分別輸出的頭恆溫器溫度TSt1至TSt5以及從輸入歧管液溫感測器TS6輸出的輸入側共通歧管液溫TSt6之介面。Here, the flow path
此外,於控制部50中的系統匯流排亦經由系統匯流排連接有用以進行圖1所示的X軸方向移動機構3、Y軸方向移動機構4及升降機構5的控制以及來自頭HD1至HD5的墨料的噴出量的控制之介面。此外,於ROM512亦儲存有阻焊劑圖案形成處理程式,CPU511一邊使用RAM513作為作業用記憶體一邊執行阻焊劑圖案形成處理程式,藉此經由這些介面進行X軸方向移動機構3、Y軸方向移動機構4及升降機構5的控制以及來自頭HD1至HD5的墨料的噴出控制,從而於載置於台10的印刷基板形成有阻焊劑圖案。由於這些構成以及動作的詳細內容係與以往相同且與本實施形態的特徵沒有直接性的關連,因此省略說明。In addition, the system bus in the
[3.墨料循環裝置的動作]
接著,參照圖2、圖3以及圖5說明基於墨料循環控制處理程式的控制處理,藉此說明本實施形態的墨料循環裝置的動作。圖5係顯示用以控制本實施形態的墨料循環裝置中的墨料的流動以及溫度之控制處理(以下稱為「墨料循環控制處理」)之流程圖。在本實施形態中,當墨料循環裝置啟動時,開始圖5的墨料循環控制處理;在墨料循環控制處理中,控制部50中的CPU511係基於墨料循環控制處理程式經由流路閥控制介面521、頭控制介面522、壓力控制介面523、加熱器控制介面525、目標溫度設定介面527以及溫度監視介面529以下述方式控制墨料循環裝置中的各部。此外,墨料循環裝置係構成為:當墨料循環裝置啟動時,第一送液泵EP1以及第二送液泵EP2開始動作,之後因應補充槽101、循環槽102、供給槽103中的位準感測器的檢測結果來控制第一送液泵EP1以及第二送液泵EP2的動作。此構成的詳細內容係與以往相同。[3. Action of ink circulation device]
Next, the control processing based on the ink circulation control processing program will be described with reference to FIGS. 2, 3, and 5, thereby explaining the operation of the ink circulation device of this embodiment. FIG. 5 is a flowchart showing a control process (hereinafter referred to as "ink circulation control process") for controlling the flow and temperature of the ink in the ink circulation device of this embodiment. In this embodiment, when the ink circulation device is activated, the ink circulation control process of FIG. 5 is started; in the ink circulation control process, the
在本實施形態中的墨料循環控制處理中,首先,執行啟動調溫程序(S100),該啟動調溫程序(S100)係用以去除墨料循環系統的氣泡並縮短啟動時間。在啟動執行程序中進行流路閥的初始設定(S102)、槽壓力的初始設定(S104)以及調溫器的初始設定(S106)。In the ink circulation control process in this embodiment, first, the start-up temperature adjustment program (S100) is executed. The start-up temperature adjustment program (S100) is used to remove bubbles in the ink circulation system and shorten the startup time. In the startup execution program, the initial setting of the flow path valve (S102), the initial setting of the tank pressure (S104), and the initial setting of the thermostat (S106) are performed.
在流路閥的初始設定(S102)中,關閉作為頭個別閥的第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10並打開作為輸入-輸出共通歧管閥的旁路電磁閥SV13。In the initial setting of the flow path valve (S102), the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 as the head individual valve are closed, and the bypass solenoid valve SV13 as the input-output common manifold valve is opened.
在槽壓力的初始設定(S104)中,將供給槽103內的氣壓(正壓Pp)設定成高正壓值PpH,將循環槽102內的氣壓(負壓Pn)設定成高負壓值PnH。在本實施形態中,至少準備與大氣壓的差較大之屬於預定的正壓值之高正壓值PpH以及與大氣壓的差較小之屬於預定的正壓值之低正壓值PpL作為供給槽103內的氣壓(正壓)Pp的設定值,並至少準備與大氣壓的差較大之屬於預定的負壓值之高負壓值PnH以及與大氣壓的差較小之屬於預定的負壓值之低負壓值PnL作為循環槽102內的氣壓(負壓)Pn的設定值。In the initial setting of tank pressure (S104), the air pressure in the supply tank 103 (positive pressure Pp) is set to a high positive pressure value PpH, and the air pressure in the circulation tank 102 (negative pressure Pn) is set to a high negative pressure value PnH . In this embodiment, at least a high positive pressure value PpH belonging to a predetermined positive pressure value with a large difference from the atmospheric pressure and a low positive pressure value PpL belonging to a predetermined positive pressure value with a small difference from the atmospheric pressure are prepared as the supply tank The setting value of the air pressure (positive pressure) Pp in 103, and prepare at least one of the high negative pressure value PnH which belongs to the predetermined negative pressure value with the larger difference from the atmospheric pressure and the predetermined negative pressure value which belongs to the predetermined negative pressure value with the smaller difference from the atmospheric pressure The low negative pressure value PnL is used as the set value of the air pressure (negative pressure) Pn in the
在調溫器的初始設定(S106)中,將加熱管加熱器HE12以及輸入側共通歧管加熱器HE13導通。此外,從輸入歧管液溫感測器TS6取得輸入歧管111內的墨料溫度作為輸入側共通歧管液溫TSt6,依據輸入側共通歧管液溫TSt6將加熱管加熱器HE12的目標溫度Tk1設定至加熱管調溫器TR12並將輸入側共通歧管加熱器HE13的目標溫度Ti1設定至輸入側共通歧管調溫器TR13。藉此,將加熱管加熱器HE12加熱至對應的目標溫度Tk1並將輸入側共通歧管加熱器HE13加熱至對應的目標溫度Ti1。再者,將頭個別區塊加熱器HE1、HE3、HE5、HE7、HE9導通。此外,依據頭恆溫器溫度TSt1至TSt5將預定溫度作為目標溫度Th1設定至頭個別區塊調溫器TR1、TR3、TR5、TR7、TR9。藉此,將第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129內的墨料溫度加熱至該目標溫度Th1。In the initial setting of the thermostat (S106), the heating pipe heater HE12 and the input side common manifold heater HE13 are turned on. In addition, the ink temperature in the
當此種啟動調溫程序(由S102至S106所構成的S100)結束時,待機至輸入側共通歧管液溫TSt6到達至預定溫度T1為止(S110)。When this start-up temperature adjustment program (S100 composed of S102 to S106) ends, it waits until the input-side common manifold liquid temperature TSt6 reaches the predetermined temperature T1 (S110).
圖6係顯示待機期間的墨料循環系統中的墨料的流動之圖,亦即顯示執行啟動調溫程序(S100)後直至開始穩態調溫程序(S120)為止之期間的墨料循環系統中的墨料的流動之圖。在待機期間中,由於作為頭個別閥的第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10關閉且作為輸入-輸出共通歧管閥的旁路電磁閥SV13打開,因此如圖6所示,墨料不於第一個別路流路201至第十個別流路210流動,墨料係在供給槽103→輸入歧管111→旁路流路215→輸出歧管112→第四共通流路214→循環槽102→第二共通流路212→供給槽103此種路徑循環。此時,由於供給槽103的氣壓(正壓Pp)為高正壓值PpH且循環槽102的氣壓(負壓Pn)為高負壓值PnH,因此與後述的穩態調溫程序後的穩態動作中相比墨料的流量(循環量)變多。Fig. 6 is a diagram showing the flow of ink in the ink circulation system during the standby period, that is, the ink circulation system during the period after the start temperature adjustment program (S100) is executed until the steady state temperature adjustment program (S120) is started A diagram of the ink flow in. During the standby period, the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 as the head individual valve are closed and the bypass solenoid valve SV13 as the input-output common manifold valve is opened, as shown in FIG. 6 , The ink does not flow in the first
當輸入側共通歧管液溫TSt6到達至預定溫度T1時,開始穩態調溫程序(S120)。在穩態調溫程序中,進行流路閥的穩態設定(S122)、槽壓力的穩態設定(S124)以及調溫器的穩態設定(S126)。When the common manifold liquid temperature TSt6 on the input side reaches the predetermined temperature T1, the steady-state temperature adjustment procedure is started (S120). In the steady-state temperature regulation program, the steady-state setting of the flow path valve (S122), the steady-state setting of the tank pressure (S124), and the steady-state setting of the thermostat (S126) are performed.
在流路閥的穩態設定(S122)中,打開作為頭個別閥的第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10並關閉輸入-輸出共通歧管閥的旁路電磁閥SV13。In the steady state setting of the flow path valve (S122), the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 as the head individual valve are opened, and the bypass solenoid valve SV13 of the input-output common manifold valve is closed.
在槽壓力的穩態設定(S124)中,將供給槽103內的氣壓(正壓Pp)設定成低正壓值PpL,將循環槽102內的氣壓(負壓Pn)設定成低負壓值PnL。In the steady state setting of the tank pressure (S124), the air pressure in the supply tank 103 (positive pressure Pp) is set to a low positive pressure value PpL, and the air pressure in the circulation tank 102 (negative pressure Pn) is set to a low negative pressure value PnL.
在調溫器的穩態設定(S126)中,將加熱管加熱器HE12持續地設定成導通狀態,且亦將輸入側共通歧管加熱器HE13持續地設定成導通狀態。此外,從輸入歧管液溫感測器TS6取得輸入側共通歧管液溫TSt6,並基於輸入側共通歧管液溫TSt6將加熱管加熱器HE12的目標溫度Tk2設定至加熱管調溫器TR12並將輸入側共通歧管加熱器HE13的目標溫度Ti2設定至輸入側共通歧管調溫器TR13。在此,這些目標溫度Tk2、Ti2皆以變得比啟動調溫程序中的目標溫度Tkl、Ti1的各者還大之方式選定。In the steady state setting of the thermostat (S126), the heating pipe heater HE12 is continuously set to the on state, and the input side common manifold heater HE13 is also continuously set to the on state. In addition, the input side common manifold liquid temperature TSt6 is acquired from the input manifold liquid temperature sensor TS6, and the target temperature Tk2 of the heating tube heater HE12 is set to the heating tube thermostat TR12 based on the input side common manifold liquid temperature TSt6 And the target temperature Ti2 of the input side common manifold heater HE13 is set to the input side common manifold thermostat TR13. Here, these target temperatures Tk2 and Ti2 are selected so as to become larger than each of the target temperatures Tk1 and Ti1 in the start-up temperature adjustment program.
再者,將頭個別區塊加熱器HE1、HE3、HE5、HE7、HE9持續地設定成導通狀態,針對頭個別區塊調溫器TR1、TR3、TR5、TR7、TR9將頭恆溫器溫度TSt1至TSt5作為基礎將預定溫度Th2作為目標溫度進行設定,藉此將第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129內的墨料溫度加熱至預定溫度Th2。在此,預定溫度Th2係選定成比啟動調溫程序中的預定溫度(目標溫度Th1)還高的溫度(Th2>Th1)。Furthermore, the individual head block heaters HE1, HE3, HE5, HE7, and HE9 are continuously set to the ON state, and the head individual block thermostats TR1, TR3, TR5, TR7, TR9 are set to the head thermostat temperature TSt1 to TSt5 is used as the basis to set the predetermined temperature Th2 as the target temperature, thereby setting the first
當上述的穩態調溫程序(由S122至S126所構成的) S120結束時,各個頭HD1至HD5的墨料係變成被維持至在目標溫度(相當於預定溫度Th2的溫度)的穩態動作狀態。When the above-mentioned steady state temperature adjustment program (constituted by S122 to S126) S120 ends, the ink system of each head HD1 to HD5 becomes a steady state operation that is maintained at the target temperature (temperature equivalent to the predetermined temperature Th2) state.
圖7係顯示穩態動作狀態的墨料循環系統中的墨料的流動之圖。在穩態動作狀態中,由於作為頭個別閥的第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10打開且作為輸入-輸出共通歧管閥的旁路電磁閥SV13關閉,因此如圖7所示,墨料不於旁路流路215流動,墨料係在供給槽103→輸入歧管111→第一個別流路201至第五個別流路205→第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129→第一頭HD1至第五頭HD5→第二個別區塊122、第四個別區塊124、第六個別區塊126、第八個別區塊128、第十個別區塊130→第六個別流路206至第十個別流路210→輸出歧管112→第四共通流路214→循環槽102→第二共通流路212→供給槽103此種路徑循環。此時,由於供給槽103的氣壓(正壓Pp)為低正壓值PpL且循環槽102的氣壓(負壓Pn)為低負壓值PnL,因此墨料係以比上述待機期間(S110)的流量還少的穩態動作時的流量循環。Fig. 7 is a diagram showing the flow of ink in the ink circulation system in a steady-state operation state. In the steady-state operating state, the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 as the head individual valve are opened and the bypass solenoid valve SV13 as the input-output common manifold valve is closed, as shown in Figure 7 As shown, the ink does not flow in the
一邊維持上述穩態動作狀態,頭HD1至HD5一邊對載置於台的印刷基板執行圖案形成。亦即,頭HD1至HD5係基於圖案形成資料噴出墨料。由於被發送至頭HD1至HD5的圖案形成資料一般來說為不同的內容,因此頭HD1至HD5係噴出不同量的墨料。在本實施形態中,於第一個別流路201至第五個別流路205夾設調溫器TR1、TR3、TR5、TR7、TR9,調溫器TR1、TR3、TR5、TR7、TR9係以於第一個別流路201至第五個別流路205流動的墨料的溫度變成均一之方式進行溫度控制。因此,即使在頭HD1至HD5噴出不同量的墨料之情形中,亦能將均一的溫度的墨料供給至頭HD1至HD5。藉此,能針對對於印刷基板之圖案形成確保高的品質。While maintaining the above-mentioned steady-state operating state, the heads HD1 to HD5 perform pattern formation on the printed circuit board placed on the table. That is, the heads HD1 to HD5 eject ink based on the pattern formation data. Since the pattern formation data sent to the heads HD1 to HD5 generally have different contents, the heads HD1 to HD5 eject different amounts of ink. In this embodiment, thermostats TR1, TR3, TR5, TR7, and TR9 are interposed between the first
此外,在本實施形態中,調溫器TR1、TR3、TR5、TR7、TR9係配置於接近頭HD1至HD5的位置。亦即,從調溫器TR1、TR3、TR5、TR7、TR9至頭HD1至HD5為止之第一個別流路201至第五個別流路205的配管長度係作成比從輸入側共通歧管111至調溫器TR1、TR3、TR5、TR7、TR9為止之第一個別流路201至第五個別流路205的配管長度還短的長度。藉此,能將調溫器TR1、TR3、TR5、TR7、TR9調整過之溫度均一性高的墨料在大致維持在原本的溫度下供給至頭HD1至HD5。結果,能夠將對於印刷基板之圖案形成的品質提升的更高。In addition, in this embodiment, the thermostats TR1, TR3, TR5, TR7, and TR9 are arranged at positions close to the heads HD1 to HD5. That is, the piping length from the first
此外,即使在第一個別流路201至第五個別流路205的配管長度以及配管阻抗存在差異之情形中,藉由夾設於第一個別流路201至第五個別流路205之第一個別路徑電磁閥SV1至第五個別路徑電磁閥SV5(藉此,能夠於頭HD1至HD5各者個別地調整墨料流量)與調溫器TR1、TR3、TR5、TR7、TR9(藉此,能夠於頭HD1至HD5各者個別地調整墨料溫度)的作用將均一的溫度的墨料供給至頭HD1至HD5。亦即,能夠藉由調溫器TR1、TR3、TR5、TR7、TR9將在夾設於輸入側共通歧管111與頭HD1至HD5之間的第一個別流路201至第五個別流路205可能產生的墨料溫度的差異修正並供給至頭HD1至HD5。In addition, even in the case where the piping length and piping impedance of the first
本實施形態的墨料循環裝置係具備下述兩者:輸入側共通歧管調溫器TR13,係能加熱墨料循環迴路整體;以及調溫器TR1、TR3、TR5、TR7、TR9,係個別地加熱頭HD1至HD5。因此,在如啟動調溫程序S100(參照圖5)般需要在短時間使墨料的溫度升溫之情形中,在需要使用輸入側共通歧管調溫器TR13精密地調整供給至頭HD1至HD5的墨料溫度之穩態調溫程序S120(參照圖5)中,能夠以併用輸入側共通歧管調溫器TR13與調溫器TR1、TR3、TR5、TR7、TR9之方式來運用。藉此,能有效率地運用調溫器。The ink circulation device of this embodiment is equipped with the following two: the input-side common manifold thermostat TR13, which can heat the entire ink circulation circuit; and the thermostats TR1, TR3, TR5, TR7, and TR9, which are separate Ground heating head HD1 to HD5. Therefore, in the case where the temperature of the ink needs to be raised in a short time like starting the temperature adjustment program S100 (refer to FIG. 5), it is necessary to use the input side common manifold thermostat TR13 to precisely adjust the supply to the heads HD1 to HD5. In the steady-state temperature control program S120 (refer to FIG. 5) of the ink temperature, it can be used by using the input-side common manifold thermostat TR13 and the thermostats TR1, TR3, TR5, TR7, and TR9 in combination. In this way, the thermostat can be used efficiently.
[4.功效]
在上述實施形態中,如圖2所示,以一個墨料循環系統對五個頭HD1至HD5供給墨料,於這些頭HD1至HD5的輸入側(上游側)與輸出側(下游測)分別設置有輸入歧管111以及輸出歧管112;在穩態動作狀態中,墨料經由從輸入歧管111經由第一個別流路201至第五個別流路205、第一頭HD1至第五頭HD5以及第六個別流路206至第十個別流路210到達至輸出歧管112之五個流路循環,藉此墨料係被個別地供給至五個頭HD1至HD5。此外,如上所述,這五個流路係構成為這些配管的長度以及配管阻抗彼此相同。藉此,用以對這五個頭HD1至HD5供給墨料之五個流路中的墨料流量係被均一化。此外,在本實施形態中,分別設置於五個頭HD1至HD5的輸入側的第一個別流路201至第五個別流路205之第一個別路徑電磁閥SV1至第五個別路徑電磁閥SV5皆以能夠調整流量之方式構成。因此,即使在藉由上述構成亦未將上述五個流路的墨料流量充分地均一化之情形中,亦能藉由第一個別路徑電磁閥SV1至第五個別路徑電磁閥SV5調整流量,從而能將上述五個流路的墨料流量確實地均一化。[4. Efficacy]
In the above embodiment, as shown in Figure 2, an ink circulation system is used to supply ink to the five heads HD1 to HD5, which are provided on the input side (upstream side) and output side (downstream side) of these heads HD1 to HD5. There are an
此外,在本實施形態中,在第三共通流路213中,藉由包含加熱管加熱器HE12的加熱管調溫器TR12將墨料加熱並調整至期望的溫度;在輸入歧管111中,藉由包含輸入側共通歧管加熱器HE13的調溫器(輸入側共通歧管調溫器TR13)將墨料加熱並調整至期望的溫度;除此之外,亦在輸入側的第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129中藉由分別設置於第一個別區塊121至第十個別區塊130中的輸入側的第一個別區塊121、第三個別區塊123、第五個別區塊125、第七個別區塊127、第九個別區塊129的頭個別區塊加熱器HEi之調溫器(頭個別區塊調溫器)TRi(i=1至5)調節墨料溫度並將墨料溫度均一化。藉此,能將藉由一個墨料循環系統供給墨料的五個頭HD1至HD5中的墨料溫度確實地均一化。在墨料循環裝置中使用阻焊劑墨料此種黏度較高的墨料之情形中,此種溫度的均一化係在謀求來自五個頭HD1至HD5的墨料噴出量的均一化之方面是有效的。In addition, in this embodiment, in the third
此外,在本實施形態中,於墨料循環裝置的啟動時執行啟動調溫程序(參照圖5),在關閉第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10且將供給槽103的氣壓(正壓Pp)設定成高正壓值PpH並將循環槽102的氣壓(負壓Pn)設定成高負壓值PnH的狀態下,墨料係以供給槽103→輸入歧管111→旁路流路215→輸出歧管112→循環槽102→供給槽103此種路徑循環(參照圖6)。藉此,阻止墨料循環裝置的停止中已混入的氣泡朝頭側(頭HD1至HD5)流入,並比以往還短時間地將該混入的氣泡排出至槽外。此外,由於墨料的流量變多,因此墨料以及用以構成流路之配管部的溫度上升係加速,到達至穩態墨料溫度之時間比以往還縮短。In addition, in this embodiment, when the ink circulation device is activated, the startup temperature adjustment program (refer to FIG. 5) is executed, and the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 are closed and the
再者,依據本實施形態,由於能夠變更循環槽102的氣壓(負壓Pn)以及供給槽103的氣壓(正壓Pp),因此亦能夠利用此功能提供下述功能:將墨料弱沖洗(purge)、使灣液面(meniscus)壓力變動來進行清洗(cleaning)。此外,獨立地控制分別設置於頭HD1至HD5的輸入側以及輸出側之第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10的開閉,藉此亦能對每個頭進行墨料沖洗(ink purge)以及清洗。再者,即使在使用常態關閉型電磁閥作為這些第一個別路徑電磁閥SV1至第十個別路徑電磁閥SV10從而墨料循環裝置或者具備墨料循環裝置的裝置未具有保持電源(待機用電源)之情形中,亦能防止墨料從頭HD1至HD5流出。Furthermore, according to this embodiment, since the air pressure of the circulation tank 102 (negative pressure Pn) and the air pressure of the supply tank 103 (positive pressure Pp) can be changed, this function can also be used to provide the following function: weak flushing of ink ( purge), make the pressure of the meniscus fluctuate to perform cleaning (cleaning). In addition, the opening and closing of the first individual path solenoid valve SV1 to the tenth individual path solenoid valve SV10 respectively provided on the input side and the output side of the heads HD1 to HD5 are independently controlled, so that each head can also be flushed with ink. purge) and cleaning. Furthermore, even when normally closed solenoid valves are used as these first individual path solenoid valves SV1 to tenth individual path solenoid valves SV10, the ink circulation device or the device equipped with the ink circulation device does not have a holding power supply (standby power supply) In this case, the ink can also be prevented from flowing out from the heads HD1 to HD5.
[5.變化例] 本發明並未限定於上述實施形態,只要未逸離本發明的範圍即能進一步地施予各種變化。例如,在上述實施形態中,雖然藉由一個墨料循環系統對五個頭HD1至HD5供給墨料(參照圖2),但亦可構成為藉由一個墨料循環系統對四個以下或者六個以上的複數個頭供給墨料。[5. Examples of changes] The present invention is not limited to the above-mentioned embodiment, and various changes can be further applied as long as it does not deviate from the scope of the present invention. For example, in the above embodiment, although one ink circulation system is used to supply ink to five heads HD1 to HD5 (refer to FIG. 2), it may be configured such that one ink circulation system supplies four or less heads or six The above plural heads supply ink.
此外,上述實施形態的墨料循環裝置係用以構成阻焊劑墨料噴射裝置的主要部分之裝置,雖然使用阻焊劑墨料,然而本發明亦可應用於用以使用其他種類的墨料之墨料循環裝置。然而,在使用阻焊劑墨料此種黏度較高的墨料之情形中本發明特別能發揮功效。In addition, the ink circulation device of the above embodiment is a device that constitutes the main part of the solder resist ink jetting device. Although solder resist ink is used, the present invention can also be applied to inks that use other types of inks. Material circulation device. However, the present invention is particularly effective in the case of using solder resist ink, which has a relatively high viscosity.
2:基部 3:X軸方向移動機構 4:Y軸方向移動機構 5:升降機構 6:支撐構造物 10:台 21,41:導軌 30:噴墨移動體 31:頭部 33:循環機構本體部 50:控制部 101:補充槽 102:循環槽 103:供給槽 111:輸入側共通歧管(輸入歧管) 112:輸出側共通歧管(輸出歧管) 121:第一個別區塊 122:第二個別區塊 123:第三個別區塊 124:第四個別區塊 125:第五個別區塊 126:第六個別區塊 127:第七個別區塊 128:第八個別區塊 129:第九個別區塊 130:第十個別區塊 152:減壓調整裝置 153:加壓調整裝置 200:流路 201至205:第一個別流路至第五個別流路 206至210:第六個別流路至第十個別流路 211:第一共通流路(流路) 212:第二共通流路(流路) 213:第三共通流路(流路) 214:第四共通流路(流路) 215:旁路流路 511:CPU 512:ROM 513:RAM 521:流路閥控制介面 522:頭控制介面 523:壓力控制介面 525:加熱器控制介面 527:目標溫度設定介面 529:溫度監視介面 CV1:第一聯結器 CV2:第二聯結器 CV3:第三聯結器 CV4:第四聯結器 CV5:第五聯結器 CV6:第六聯結器 CV7:第七聯結器 CV8:第八聯結器 CV9:第九聯結器 CV10:第十聯結器 EP1:第一送液泵 EP2:第二送液泵 FL:過濾器 HD1至HD5:頭(第一頭至第五頭) HDi:頭 HE1至HE9:頭個別區塊加熱器 HE12:加熱管加熱器 HE13:輸入側共通歧管加熱器 HEi:頭個別區塊加熱器 LV:位準感測器 Pn:負壓 PnH:高負壓值 PnL:低負壓值 Pp:正壓 PpH:高正壓值 PpL:低正壓值 SV1至SV5:第一個別路徑電磁閥至第五個別路徑電磁閥(輸入側的個別路徑電磁閥,亦即供給側個別閥) SV6至SV10:第六個別路徑電磁閥至第十個別路徑電磁閥(輸出側的個別路徑電磁閥,亦即排出側個別閥) SV11:第一共通路徑電磁閥 SV12:第二共通路徑電磁閥 SV13:旁路電磁閥 T1:溫度 Th1,Ti1,Ti2,Tk1,Tk2:目標溫度 Th2:預定溫度 TR1,TR3,TR5,TR7,TR9:頭個別區塊調溫器(調溫器) TR12:加熱管調溫器 TR13:輸入側共通歧管調溫器 Tri:調溫器 TS1至TS5:頭恆溫器 TS6:輸入歧管液溫感測器 TSt1至TSt5:頭恆溫器溫度 TSt6:輸入側共通歧管液溫2: base 3: X-axis direction moving mechanism 4: Y-axis direction moving mechanism 5: Lifting mechanism 6: Supporting structure 10 stages 21, 41: rail 30: Inkjet mobile 31: head 33: Circulation mechanism body 50: Control Department 101: Supplementary Slot 102: Circulation slot 103: supply tank 111: Common manifold on the input side (input manifold) 112: Common manifold on the output side (output manifold) 121: The first individual block 122: second individual block 123: The third individual block 124: The fourth individual block 125: Fifth individual block 126: The sixth individual block 127: The seventh individual block 128: Eighth individual block 129: Ninth individual block 130: Tenth individual block 152: Decompression adjustment device 153: Pressure adjustment device 200: flow path 201 to 205: the first individual flow path to the fifth individual flow path 206 to 210: The sixth individual flow path to the tenth individual flow path 211: The first common flow path (flow path) 212: Second common flow path (flow path) 213: The third common flow path (flow path) 214: Fourth common flow path (flow path) 215: Bypass flow path 511: CPU 512:ROM 513: RAM 521: Flow path valve control interface 522: Head Control Interface 523: Pressure control interface 525: Heater control interface 527: Target temperature setting interface 529: Temperature monitoring interface CV1: first coupling CV2: second coupling CV3: third coupling CV4: Fourth coupling CV5: Fifth coupling CV6: sixth coupling CV7: seventh coupling CV8: Eighth coupling CV9: Ninth coupling CV10: Tenth coupling EP1: The first liquid delivery pump EP2: Second liquid delivery pump FL: filter HD1 to HD5: head (first head to fifth head) HDi: Head HE1 to HE9: Head individual block heater HE12: Heating tube heater HE13: Common manifold heater on the input side HEi: Head individual block heater LV: Level sensor Pn: negative pressure PnH: high negative pressure value PnL: Low negative pressure value Pp: positive pressure PpH: high positive pressure value PpL: Low positive pressure value SV1 to SV5: The first individual path solenoid valve to the fifth individual path solenoid valve (the individual path solenoid valve on the input side, that is, the individual valve on the supply side) SV6 to SV10: The sixth individual path solenoid valve to the tenth individual path solenoid valve (the individual path solenoid valve on the output side, that is, the individual valve on the discharge side) SV11: The first common path solenoid valve SV12: Second common path solenoid valve SV13: Bypass solenoid valve T1: temperature Th1, Ti1, Ti2, Tk1, Tk2: target temperature Th2: predetermined temperature TR1, TR3, TR5, TR7, TR9: the first individual block thermostat (thermostat) TR12: Heating tube thermostat TR13: Input side common manifold thermostat Tri: Thermostat TS1 to TS5: head thermostat TS6: Input manifold liquid temperature sensor TSt1 to TSt5: head thermostat temperature TSt6: Liquid temperature of the common manifold on the input side
[圖1]係顯示具備本發明的實施形態之一的墨料循環裝置之阻焊劑墨料噴射裝置的整體構成之立體圖。 [圖2]係顯示上述實施形態的墨料循環裝置中的流路構成之圖。 [圖3]係用以說明上述實施形態的墨料循環裝置中的槽壓力調整之圖。 [圖4]係顯示上述實施形態的墨料循環裝置中的控制部的硬體構成之方塊圖。 [圖5]係顯示用以控制上述實施形態的墨料循環裝置中的墨料的流動以及溫度之控制處理之流程圖。 [圖6]係顯示上述實施形態中執行啟動程序後直至開始穩態調溫程序為止之期間的墨料循環系統中的墨料的流動之圖。 [圖7]係顯示上述實施形態中的墨料循環系統的穩態動作狀態的墨料的流動之圖。Fig. 1 is a perspective view showing the overall structure of a solder resist ink jetting device equipped with an ink circulation device according to one embodiment of the present invention. [Fig. 2] is a diagram showing the structure of the flow path in the ink circulation device of the above-mentioned embodiment. Fig. 3 is a diagram for explaining the tank pressure adjustment in the ink circulation device of the above embodiment. Fig. 4 is a block diagram showing the hardware configuration of the control unit in the ink circulation device of the above-mentioned embodiment. [Fig. 5] is a flowchart showing a control process for controlling the flow and temperature of the ink in the ink circulation device of the above-mentioned embodiment. Fig. 6 is a diagram showing the flow of ink in the ink circulation system during the period after the start-up procedure is executed until the steady-state temperature adjustment procedure is started in the above-mentioned embodiment. Fig. 7 is a diagram showing the flow of ink in the steady state operation state of the ink circulation system in the above embodiment.
101:補充槽 101: Supplementary Slot
102:循環槽 102: Circulation slot
103:供給槽 103: supply tank
111:輸入側共通歧管(輸入歧管) 111: Common manifold on the input side (input manifold)
112:輸出側共通歧管(輸出歧管) 112: Common manifold on the output side (output manifold)
121:第一個別區塊 121: The first individual block
122:第二個別區塊 122: second individual block
123:第三個別區塊 123: The third individual block
124:第四個別區塊 124: The fourth individual block
125:第五個別區塊 125: Fifth individual block
126:第六個別區塊 126: The sixth individual block
127:第七個別區塊 127: The seventh individual block
128:第八個別區塊 128: Eighth individual block
129:第九個別區塊 129: Ninth individual block
130:第十個別區塊 130: Tenth individual block
200:流路 200: flow path
201至205:第一個別流路至第五個別流路 201 to 205: the first individual flow path to the fifth individual flow path
206至210:第六個別流路至第十個別流路 206 to 210: The sixth individual flow path to the tenth individual flow path
211:第一共通流路(流路) 211: The first common flow path (flow path)
212:第二共通流路(流路) 212: Second common flow path (flow path)
213:第三共通流路(流路) 213: The third common flow path (flow path)
214:第四共通流路(流路) 214: Fourth common flow path (flow path)
215:旁路流路 215: Bypass flow path
CV1:第一聯結器 CV1: first coupling
CV2:第二聯結器 CV2: second coupling
CV3:第三聯結器 CV3: third coupling
CV4:第四聯結器 CV4: Fourth coupling
CV5:第五聯結器 CV5: Fifth coupling
CV6:第六聯結器 CV6: sixth coupling
CV7:第七聯結器 CV7: seventh coupling
CV8:第八聯結器 CV8: Eighth coupling
CV9:第九聯結器 CV9: Ninth coupling
CV10:第十聯結器 CV10: Tenth coupling
EP1:第一送液泵 EP1: The first liquid delivery pump
EP2:第二送液泵 EP2: Second liquid delivery pump
FL:過濾器 FL: filter
HD1至HD5:頭(第一頭至第五頭) HD1 to HD5: head (first head to fifth head)
HE1至HE9:頭個別區塊加熱器 HE1 to HE9: Head individual block heater
HE12:加熱管加熱器 HE12: Heating tube heater
HE13:輸入側共通歧管加熱器 HE13: Common manifold heater on the input side
LV:位準感測器 LV: Level sensor
Pp:正壓 Pp: positive pressure
SV1至SV5:第一個別路徑電磁閥至第五個別路徑電磁閥(輸入側的個別路徑電磁閥,亦即供給側個別閥) SV1 to SV5: The first individual path solenoid valve to the fifth individual path solenoid valve (the individual path solenoid valve on the input side, that is, the individual valve on the supply side)
SV6至SV10:第六個別路徑電磁閥至第十個別路徑電磁閥(輸出側的個別路徑電磁閥,亦即排出側個別閥) SV6 to SV10: The sixth individual path solenoid valve to the tenth individual path solenoid valve (the individual path solenoid valve on the output side, that is, the individual valve on the discharge side)
SV11:第一共通路徑電磁閥 SV11: The first common path solenoid valve
SV12:第二共通路徑電磁閥 SV12: Second common path solenoid valve
SV13:旁路電磁閥 SV13: Bypass solenoid valve
TR1,TR3,TR5,TR7,TR9:頭個別區塊調溫器(調溫器) TR1, TR3, TR5, TR7, TR9: the first individual block thermostat (thermostat)
TR12:加熱管調溫器 TR12: Heating tube thermostat
TR13:輸入側共通歧管調溫器 TR13: Input side common manifold thermostat
TS1至TS5:頭恆溫器 TS1 to TS5: head thermostat
TS6:輸入歧管液溫感測器 TS6: Input manifold liquid temperature sensor
TSt6:輸入側共通歧管液溫 TSt6: Liquid temperature of the common manifold on the input side
Claims (7)
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