TW201917815A - Method of manufacturing electrostatic chuck plate - Google Patents

Abstract

Provided is a method of manufacturing an electrostatic chuck plate which is able to form an electrode at a lower cost than a conventional price. The method of manufacturing the electrostatic chuck, which absorbs and holds a workpiece by a force of a static electricity, includes: a conductor membrane forming step of forming the conductor membrane containing a metallic oxide on an insulation surface side comprised of an insulator of a base substrate; and an electrode forming step of processing ablation of the conductor membrane by a laser beam of a wavelength having penetrability about the base substrate and forming a standard electrode on the insulation surface side of the base substrate after the conductor layer forming step.

Description

Manufacturing method of electrostatic chuck plate

The present invention relates to a method for manufacturing an electrostatic chuck plate when used to hold a plate-like workpiece or the like.

When processing semiconductor wafers, optical device wafers, package substrates, etc. with a cutting device, grinding device, laser processing device, etc., it is common to attach protective members such as adhesive tapes or rigid substrates to these plate-like workpieces. . Thereby, a to-be-processed object can be protected by the impact applied during processing, conveyance, etc.

The above-mentioned protective member is usually attached to a workpiece by an adhesive having a certain degree of adhesion. Therefore, for example, there is a case where the protective member cannot be easily peeled from the processed object. In addition, when a disposable adhesive tape or the like that is no longer usable is used, the cost required for processing the object to be processed tends to increase.

Therefore, in recent years, development of an electrostatic chuck plate that uses static electricity to adsorb and hold a workpiece has been progressing (for example, refer to Patent Document 1). In this electrostatic chuck plate, for example, by forming a comb-tooth shape of an electrode for generating an electrostatic adsorption force, a strong adsorption force is maintained even after the supply of electricity to the electrode is stopped. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-51836

(Problems to be solved by the invention)

The electrodes of the electrostatic chuck plate, which represent the comb-shaped electrodes described above, are often formed by wet etching. However, since this wet etching requires a mask matching the pattern of the electrode, there is a problem that it is easy to cost. Therefore, a manufacturing method of an electrostatic chuck plate capable of forming an electrode at a lower cost has been sought.

The present invention has been developed by the present invention in view of such problems, and an object thereof is to provide a method for manufacturing an electrostatic chuck plate that can form electrodes at a lower cost than before. (Means for solving problems)

According to one aspect of the present invention, there is provided a method for manufacturing an electrostatic chuck plate, which is a method for manufacturing an electrostatic chuck plate that is held by an electrostatic force to adsorb a workpiece, and includes: (1) a conductive film forming step, A conductive film containing a metal oxide is provided on the insulating surface side of the base substrate made of an insulator; and an electrode forming step is a laser having a wavelength of transmissivity to the base substrate after the conductive film forming step. Bundle to abrade the conductive film, and form positive and negative electrodes on the insulating surface side of the base substrate.

In one aspect of the present invention described above, the base substrate is made of glass, and the wavelength of the laser beam is preferably 500 nm or more.

According to another aspect of the present invention, there is provided a manufacturing method of an electrostatic chuck plate, which is a manufacturing method of an electrostatic chuck plate that is held by an electrostatic force to adsorb and hold a workpiece, and is characterized by having: a resin sheet preparation step, It consists of a resin sheet provided with a metal oxide-containing conductive film on the first surface side; a electrode forming step, which is after the resin sheet preparation step, using a laser beam having a wavelength that is transparent to the resin sheet. The conductive film is subjected to ablation processing to form positive and negative electrodes on the first surface side of the resin sheet; and an electrode displacement step, which is a step of attaching the electrodes to the insulating surface of the base substrate made of an insulator after the electrode forming step. Side, the resin sheet is peeled off from the electrode, whereby positive and negative electrodes are moved to the insulating surface side of the base substrate.

In another aspect of the present invention described above, the resin sheet is connected to a transparent resin sheet having a visible range, and the wavelength of the laser beam is preferably 1000 nm or more. [Effect of the invention]

In the method for manufacturing an electrostatic chuck plate according to one aspect of the present invention and the method for manufacturing an electrostatic chuck plate according to another aspect of the present invention, the conductive film is etched and processed with a laser beam to form positive and negative electrodes, so the phase The positive and negative electrodes can be formed at a lower cost than when a method such as wet etching, which is easy to cost, is used.

An embodiment according to an aspect of the present invention will be described with reference to the drawings. The manufacturing method of the electrostatic chuck plate of this embodiment includes a conductive film formation step (see FIG. 1 (A)) and an electrode formation step (see FIG. 1 (B), FIG. 1 (C), and FIG. 2).

In the conductor film forming step, a conductor film containing a metal oxide is provided on a first surface side of a base substrate made of an insulator on at least a first surface. In the electrode forming step, the conductive film is etched and processed with a laser beam having a wavelength transparent to the base substrate, and positive and negative electrodes are formed on the first surface side of the base substrate. Hereinafter, a method for processing a wafer according to this embodiment will be described in detail.

In the method for manufacturing an electrostatic chuck plate according to this embodiment, first, a conductive film forming step of forming a conductive film containing a metal oxide on a base substrate is performed. FIG. 1A is a cross-sectional view schematically showing a state where a conductive film 3 is formed on the first surface (insulating surface) 1 a side of the base substrate 1.

As shown in FIG. 1 (A), the base substrate 1 is formed into a disc shape using glass materials such as soda glass, borosilicate glass, and quartz glass that are transparent to light in the visible region (wavelength: 360 nm to 830 nm). The first surface 1a and the second surface 1b are substantially flat. That is, the first surface 1a and the second surface 1b of the base substrate 1 are configured by an insulator.

The diameter of the base substrate 1 is preferably equal to or greater than the diameter of the object 11 (see FIG. 5 and the like) to be adsorbed. The thickness of the base substrate 1 is typically about 1 mm to 30 mm. However, the material, shape, structure, size, thickness, etc. of the base substrate 1 are not limited.

For example, a base substrate 1 made of a material such as resin or ceramics may be used. In addition, the base substrate 1 only needs to be composed of an insulator at least on the first surface 1a. Therefore, for example, a substrate made of a semiconductor, a conductor, or the like may be coated with an insulator and used as the base substrate 1.

The conductor film forming step of the present embodiment is to form a metal oxide-containing conductor film 3 on the entire first surface 1a side of the base substrate 1 by a method such as sputtering. The metal oxide is preferably a material that is transparent to light in the visible region, such as indium tin oxide (ITO). Accordingly, since the conductive film 3 is transparent in the visible region, the electrostatic chuck plate of the present embodiment can be used, for example, in laser processing using a laser beam in the visible region. The thickness of the conductor film 3 is typically about 1 μm to 100 μm.

However, the material, shape, size, thickness, formation method, and the like of the conductor film 3 are not particularly limited. For example, a method such as CVD, vacuum evaporation, and coating may be used to form the conductor film 3. The conductor film 3 may be formed by a method of attaching a conductor film provided on a resin sheet to the first surface 1 a side of the base substrate 1. In this case, for example, a transparent conductive film ELECRYSTA (registered trademark) made by Nitto Denko Corporation can be used.

After the conductor film forming step, an electrode forming step is performed, which uses laser beams to abrade the conductor film 3 provided on the first surface 1a side of the base substrate 1 to form positive and negative electrodes. FIG. 1 (B) is a cross-sectional view schematically showing a state where the conductor film 3 is subjected to an ablation process. The electrode formation step is performed using, for example, the laser processing apparatus 2 shown in FIG. 1 (B).

The laser processing apparatus 2 includes a chuck table 4 for sucking and holding the base substrate 1. The chuck table 4 is a rotation drive source (not shown) connected to a motor or the like, and rotates around a rotation axis substantially parallel to the vertical direction. A moving mechanism (not shown) is provided below the chuck table 4. The chuck table 4 is moved by the moving mechanism in the processing feed direction (first horizontal direction) and the index feed direction (second horizontal direction).

A part of the upper surface of the chuck table 4 forms a holding surface 4 a for attracting and holding the base substrate 1. The holding surface 4 a is connected to a suction source (not shown) via a suction path (not shown) or the like formed inside the chuck table 4. When the negative pressure of the suction source is applied to the holding surface 4 a, the base substrate 1 is sucked and held on the chuck table 4.

Above the chuck table 4 is a laser irradiation unit 6. The laser irradiation unit 6 uses a laser oscillator (not shown) to irradiate and collect light to a predetermined position by a pulsed laser beam 6a. The laser oscillator is configured as a pulsed laser beam 6 a having a wavelength that is transparent to the base substrate 1 and can be processed by etching the conductive film 3.

In the electrode formation step, first, a predetermined irradiation line (not shown) of the irradiated laser beam 6 a is set on the conductor film 3. The predetermined irradiation line has to be set in a shape that separates the conductive film 3 into two or more. However, the timing of setting a predetermined irradiation line is arbitrary. At least, the predetermined irradiation line may be set before the laser beam 6 a is irradiated to the conductor film 3.

Next, the second surface 1b side of the base substrate 1 is brought into contact with the holding surface 4a of the chuck table 4 to apply a negative pressure from the suction source. Accordingly, the base substrate 1 is held on the chuck table 4 in a state where the conductive film 3 provided on the first surface 1a side is exposed above. Then, the chuck table 4 is rotated and moved to adjust the positional relationship between the base substrate 1 and the laser irradiation unit 6.

Then, the chuck table 4 is moved while the laser beam 6a is irradiated from the laser irradiation unit 6 toward the conductor film 3 so as to irradiate the laser beam 6a along a predetermined irradiation line (not shown). Thereby, a part of the conductor film 3 is removed by an ablation process, and an insulating region 3a can be formed along a predetermined irradiation line.

In the present embodiment, a laser beam 6 a having a wavelength transparent to the base substrate 1 is irradiated onto the conductor film 3. More specifically, for example, it is preferable to irradiate the laser beam 6a having a wavelength of 500 nm or more to the conductor film 3 under a condition of 0.44 J / cm ² or more. Thereby, a part of the conductor film 3 can be removed while suppressing the deterioration of the base substrate 1 to form the insulating region 3a.

Once the insulation area 3a is formed on all the irradiation lines, the conductive film 3 is separated into a positive electrode pattern (positive electrode) 3b (see FIG. 1 (C) and the like) and a negative electrode by the insulation area 3a. Pattern (negative electrode) 3c (see FIG. 1 (C) and the like). That is, a positive electrode pattern 3b and a negative electrode pattern 3c are formed on the first surface 1a side of the base substrate 1. Thereby, the electrostatic chuck plate 5 (refer FIG. 1 (C) etc.) which has the positive electrode pattern 3b and the negative electrode pattern 3c on the 1st surface 1a side of the base substrate 1 is completed.

As described above, in the present embodiment, since the laser beam 6a only needs to be irradiated along the predetermined irradiation line of the conductive film 3, it is easier to shorten the processing requirements than methods such as wet etching that requires a mask time. In addition, since a mask may not be formed like wet etching or the like, the cost of forming the positive electrode pattern 3b and the negative electrode pattern 3c can be reduced.

FIG. 1 (C) is a cross-sectional view schematically showing the structure of the electrostatic chuck plate 5, and FIG. 2 is a plan view schematically showing the structure of the electrostatic chuck plate 5. As shown in FIG. 1 (C) and FIG. 2, the shape of the positive electrode pattern 3b and the negative electrode pattern 3c is, for example, a pair of comb-toothed shapes in which a positive electrode and a negative electrode are arranged alternately.

In such a comb-shaped electrode, since the positive electrode and the negative electrode are arranged at a high density, for example, an electrostatic force called a gradient force acting between the electrode and the workpiece 11 is applied. The force also becomes stronger. That is, the workpiece 11 can be adsorbed and held by a strong force. In addition, even after the power supply to the positive electrode and the negative electrode is stopped, a strong adsorption force can be maintained.

However, the shape, size, and the like of the positive electrode pattern 3b and the negative electrode pattern 3c are not particularly limited. For example, a positive electrode pattern 3b and a negative electrode pattern 3c may be configured by a curve, a circle, or the like. In addition, as shown in FIG. 2, by setting the shape so that a predetermined irradiation line forming the insulating region 3 a can be drawn in one stroke, the time required for processing can be further shortened.

As described above, in the manufacturing method of the electrostatic chuck plate of the present embodiment, since the conductive film 3 is ablated and processed by the laser beam 6a, a positive electrode pattern (positive electrode) 3b and a negative electrode pattern (negative electrode) are formed. 3c. Therefore, the positive electrode pattern 3b and the negative electrode pattern 3c can be formed at a lower cost than when a method such as wet etching, which is easy to cost, is used.

The electrostatic chuck plate 5 manufactured in this manner is used by being incorporated into various devices for adsorbing and holding the workpiece 11. FIG. 3 is a perspective view schematically showing the structure of the frame unit 12 using the electrostatic chuck plate 5, and FIG. 4 is a cross-sectional view schematically showing the structure of the frame unit 12 using the electrostatic chuck plate 5.

As shown in FIGS. 3 and 4, the frame unit 12 is provided with a ring-shaped frame 14 made of a material such as aluminum. An opening 14c is formed in the central portion of the frame 14 to penetrate the frame 14 from the first surface 14a to the second surface 14b. The shape of the opening 14c is, for example, approximately circular when viewed from the first surface 14a side (or the second surface 14b side). In addition, the material, shape, size, and the like of the frame 14 are not particularly limited.

On the second surface 14b of the frame 14, a film-like base sheet 16 made of a material such as polyethylene (PE) or polyethylene terephthalate (PET) is fixed to cover the opening 14c. Specifically, the outer peripheral portion of the circular base sheet 16 on the first surface 16 a side is adhered to the second surface 14 b of the frame 14.

The base sheet 16 has, for example, flexibility to the extent that the workpiece 11 can be protected, and insulation to the extent that it does not hinder the electrostatic force described later. However, the material, shape, thickness, size, and the like of the base sheet 16 are not particularly limited. The workpiece 11 is held on the first surface 16 a side of the base sheet 16. On the other hand, the above-mentioned electrostatic chuck plate 5 is provided at a central portion on the second surface 16b side of the base sheet 16.

The electrostatic chuck plate 5 is in a configuration in which the conductive film 3 (the positive electrode pattern 3b and the negative electrode pattern 3c) is in close contact with the second surface 16b side of the base sheet 16 via a cover sheet 18 having an adhesive force, for example. be fixed. In this case, compared to a case where the second surface 1b side of the base substrate 1 is in close contact with the second surface 16b side of the base sheet 16, the electric field generated from the conductor film 3 can be applied to the first surface 16a with high efficiency.边 的 制作 物 11。 Side 11 of the workpiece.

The cover sheet 18 includes, for example, a circular base sheet formed of the same material as the base sheet 16 and an adhesive layer (paste layer) provided on one surface of the base sheet. Here, the diameter of the cover sheet 18 (base material sheet) is larger than the diameter of the electrostatic chuck plate 5 (base substrate 1). However, the material, shape, thickness, size, structure, and the like of the cover sheet 18 are not particularly limited.

On the second surface 16 b side of the base sheet 16, first wirings 20 a connected to the positive electrode pattern 3 b and second wirings 20 b connected to the negative electrode pattern 3 c are arranged. As shown in FIG. 3, the power supply unit 22 is provided on the first surface 14 a side of the frame 14, and the first wiring 20 a and the second wiring 20 b are, for example, wound around the frame 4 and connected to the power supply unit 22.

The power supply unit 22 includes a battery holder 22 a for accommodating a battery 24 that is used to supply power to the positive electrode pattern 3 b and the negative electrode pattern 3 c described above. Further, a position adjacent to the battery holder 22a is provided with a switch 22b for switching between power supply and non-power supply of the positive electrode pattern 3a and the negative electrode pattern 3b.

For example, when the switch 22b is turned on (ON state), the power of the battery 24 accommodated in the battery holder 22a is supplied to the positive electrode pattern 3b and the negative electrode pattern through the first wiring 20a and the second wiring 20b. 3c. On the other hand, when the switch 22b is brought into a non-conductive state (OFF state), the power supply to the positive electrode pattern 3b and the negative electrode pattern 3c is stopped.

In addition, in FIGS. 3 and 4, the power supply unit 22 is arranged on the first surface 14 a side of the frame 14, but the arrangement of the power supply unit 22 is not particularly limited. At least, the power supply unit 22 may be disposed at a position that does not interfere with the use of the frame unit 12 (that is, the object to be processed 11 is held and held). For example, the electric unit 22 may be arranged in the opening 14 c of the frame 14. The battery 24 is a primary battery such as a coin-type battery (coin-type battery) or a secondary battery that can be repeatedly used by charging.

FIG. 5 is a perspective view schematically showing a state in which the workpiece 11 is adsorbed on the frame unit 12. The processed object 11 is, for example, a disc-shaped wafer made of a material such as silicon (Si). The surface 11a side of the processed object 11 is divided into a plurality of areas by predetermined division lines (division lanes) 13 set in a grid shape, and IC (Integrated Circuit), MEMS (Micro Electro Mechanical Systems) are formed in each area. ) 等 的 设备 15。 15 and other devices.

However, the material, shape, structure, size, and the like of the workpiece 11 are not limited. The frame unit 12 may also be used to adsorb and hold the workpiece 11 made of other materials such as semiconductors, ceramics, resins, and metals. Similarly, the type, number, shape, structure, size, arrangement, etc. of the device 15 are also not limited.

When attaching the workpiece 11 to the frame unit 12, first, the workpiece 11 is placed on the base sheet 16 so that the back surface 11 b side of the workpiece 11 and the first surface 16 a side of the base sheet 16 are in contact with each other. More specifically, a region (central portion) of the base plate 16 corresponding to the electrostatic chuck plate 5 is placed on the substrate 11. Next, the switch 22b of the power supply unit 22 is turned on, and the power of the battery 24 is supplied to the positive electrode pattern 3b and the negative electrode pattern 3c.

Thereby, an electric field is generated around the positive electrode pattern 3b and the negative electrode pattern 3c. As a result, an electrostatic force acts on the object 11 and the conductor film 3. The object 11 is attracted and held on the frame unit 12 by the electrostatic force. In addition, the force acting on the static electricity between the workpiece 11 and the conductor film 3 includes a Coulomb force, a Johnsen-Rahbeck force, a gradient force, and the like.

The present invention is not limited to the description of the embodiments and the like, and various modifications can be made. For example, in the above-mentioned embodiment, after the conductive film 3 containing a metal oxide is provided on the base substrate 1, the conductive film 3 is etched and processed with a laser beam 6 a, but the electrostatic chuck plate 5 may be manufactured by another procedure.

FIG. 6 (A) is a cross-sectional view schematically showing a state in which the conductive film 3 is ablated and processed by a method of manufacturing an electrostatic chuck plate according to a modification. In the manufacturing method of the electrostatic chuck plate of the modification, first, a resin sheet preparation step is performed, which prepares a resin sheet 7 provided with a metal oxide-containing conductive film 3.

The resin sheet 7 is made of, for example, a resin material such as polyethylene terephthalate (PET) that is transparent to light in the visible range, and a metal oxide-containing conductive film 3 is provided on the first surface 7a side. As the resin sheet 7 with such a conductive film 3, for example, a transparent conductive film ELECRYSTA (registered trademark) made by Nitto Denko Corporation can be used.

After the resin sheet preparation step, an electrode forming step is performed, which uses a laser beam 6a to abrade the conductive film 3 provided on the first surface 7a side of the resin sheet 7 to form positive and negative electrodes. The electrode formation step is performed using, for example, the laser processing apparatus 2. Most of the configuration of the laser processing device 2 used in this modification is the same as that of the laser processing device 2 used in the above embodiment, but the laser oscillator is configured as a pulsed laser beam 6a, and the laser The beam 6 a has a wavelength which is transmissive to the resin sheet 7 and can abrade the conductor film 3.

In the electrode formation step of the modified example, first, a predetermined irradiation line (not shown) of the irradiated laser beam 6 a is set to the conductor film 3. The predetermined irradiation line has to be set in a shape that separates the conductive film 3 into two or more. However, the timing of setting a predetermined irradiation line is arbitrary. At least, the predetermined irradiation line may be set before the laser beam 6 a is irradiated to the conductor film 3.

Next, the second surface 7b side of the resin sheet 7 is brought into contact with the holding surface 4a of the chuck table 4 to apply a negative pressure to the suction source. Accordingly, the resin sheet 7 is held on the chuck table 4 in a state where the conductive film 3 provided on the first surface 7a side is exposed above. Next, the chuck table 4 is rotated and moved to adjust the positional relationship between the resin sheet 7 and the laser irradiation unit 6.

Then, the laser beam 6a is irradiated from the laser irradiation unit 6 toward the conductor film 3 while the laser beam 6a is irradiated along a predetermined irradiation line (not shown) set on the conductor film 3. The chuck table 4 moves. Thereby, a part of the conductor film 3 is removed by an ablation process, and an insulating region 3a can be formed along a predetermined irradiation line.

In this modification, a laser beam 6 a having a wavelength that is transparent to the resin sheet 7 is irradiated onto the conductor film 3. More specifically, for example, the conductive film 3 is preferably irradiated with a laser beam 6a having a wavelength of 1000 nm or more under conditions of 0.44 J / cm ² or more and less than 8.84 J / cm ² . With this, as in the case of using a laser beam in the ultraviolet region (wavelength: less than 360 nm), the resin sheet 7 is not deteriorated or damaged, and a part of the conductor film 3 can be removed to form the insulating region 3a.

When the insulating region 3a is formed over the entire irradiation target line, the conductive film 3 is separated into a positive electrode pattern (positive electrode) 3b and a negative electrode pattern (negative electrode) 3c by the insulating region 3a. That is, a positive electrode pattern 3 b and a negative electrode pattern 3 c are formed on the first surface 7 a side of the resin sheet 7.

After the electrode formation step, an electrode displacement step is performed, which involves moving the positive electrode pattern 3 b and the negative electrode pattern 3 c to the first surface (insulating surface) 1 a side of the base substrate 1. In this electrode displacement step, for example, after the positive electrode pattern 3 b and the negative electrode pattern 3 c on the resin sheet 7 are attached to the first surface 1 a side of the base substrate 1, the resin sheet 7 is peeled off.

FIG. 6 (B) is a cross-sectional view schematically showing a state in which the resin sheet 7 is peeled off from the positive electrode pattern 3 b and the negative electrode pattern 3 c attached to the base substrate 1 by the manufacturing method of the electrostatic chuck plate according to the modification. As shown in FIG. 6 (B), the positive electrode pattern 3 b and the negative electrode pattern 3 c are adhered to the first surface 1 a side of the base substrate 1 with an adhesive 9. The base substrate 1 is the same as the base substrate 1 used in the above-mentioned embodiment.

After the positive electrode pattern 3 b and the negative electrode pattern 3 c are attached to the first surface 1 a side of the base substrate 1 by the adhesive 9, the resin sheet 7 is peeled by the positive electrode pattern 3 b and the negative electrode pattern 3 c. Thereby, the positive electrode pattern 3b and the negative electrode pattern 3c are transferred to the first surface 1a side of the base substrate 1, and the electrostatic chuck plate 5a is completed. 6 (C) is a cross-sectional view schematically showing a structure of an electrostatic chuck plate manufactured by a method of manufacturing an electrostatic chuck plate according to a modification.

As described above, even in the manufacturing method of the electrostatic chuck plate according to the modification, the conductive film 3 is ablated and processed by the laser beam 6a to form a positive electrode pattern (positive electrode) 3b and a negative electrode pattern (negative electrode) 3c. Therefore, the positive electrode pattern 3b and the negative electrode pattern 3c can be formed at a lower cost than in the case of using a method such as wet etching which is easy to cost.

In addition, the structures, methods, and the like related to the above-mentioned embodiments, modifications, and the like can be appropriately changed and implemented without departing from the scope of the object of the present invention.

1‧‧‧ base substrate

1a‧‧‧first side (insulating surface)

1b‧‧‧side 2

3‧‧‧Conductor film

3a‧‧‧Insulation

3b‧‧‧Positive electrode pattern (positive electrode)

3c‧‧‧negative electrode pattern (negative electrode)

5,5a‧‧‧electrostatic chuck plate

7‧‧‧ resin sheet

7a‧‧‧Part 1

7b‧‧‧side 2

9‧‧‧ Adhesive

2‧‧‧laser processing equipment

4‧‧‧ Suction table

4a‧‧‧ keep face

6‧‧‧laser irradiation unit

6a‧‧‧laser beam

12‧‧‧ frame unit

14‧‧‧box

14a‧‧‧Part 1

14b‧‧‧Part 2

14c‧‧‧ opening

16‧‧‧ base sheet

16a‧‧‧Part 1

16b‧‧‧Part 2

18‧‧‧ Cover sheet

20a‧‧‧The first wiring

20b‧‧‧ 2nd wiring

22‧‧‧ Power Supply Unit

22a‧‧‧battery clamp

22b‧‧‧Switch

24‧‧‧ Battery

FIG. 1 (A) is a cross-sectional view schematically showing a state in which a conductive film is formed on a base substrate, and FIG. 1 (B) is a cross-sectional view schematically showing a state in which the conductive film is ablated. FIG. 1 (C ) Is a cross-sectional view schematically showing the structure of the completed electrostatic chuck plate. FIG. 2 is a plan view schematically showing the structure of the completed electrostatic chuck plate. FIG. 3 is a perspective view schematically showing a structure of a frame unit using an electrostatic chuck plate. FIG. 4 is a cross-sectional view schematically showing a structure of a frame unit using an electrostatic chuck plate. FIG. 5 is a perspective view schematically showing a state in which a workpiece is adsorbed on a frame unit. FIG. 6 (A) is a cross-sectional view schematically showing a state in which a conductive film is ablated by a manufacturing method of an electrostatic chuck plate according to a modification example, and FIG. 6 (B) is a schematic view showing an electrostatic chuck plate according to a modification example. 6 (C) is a cross-sectional view schematically showing a structure of an electrostatic chuck plate manufactured by a manufacturing method of an electrostatic chuck plate according to a modification method in which a resin sheet is peeled from an electrode attached to a base substrate by a manufacturing method. Sectional view.

Claims (4)

A manufacturing method of an electrostatic chuck plate is a manufacturing method of an electrostatic chuck plate which is held by an electrostatic force to adsorb a workpiece and is characterized by: (1) a conductive film forming step, which is formed by an insulator on a base substrate; A conductive film containing a metal oxide is provided on the insulating surface side; and an electrode forming step is performed after the conductive film forming step, and the conductive film is ablated by a laser beam having a wavelength that is transparent to the base substrate. Positive and negative electrodes are formed on the insulating surface side of the base substrate. For example, the method for manufacturing an electrostatic chuck plate according to the first patent application range, wherein the base substrate is formed of glass, and the wavelength of the laser beam is 500 nm or more. A manufacturing method of an electrostatic chuck plate is a manufacturing method of an electrostatic chuck plate which is held by an electrostatic force to adsorb and hold a workpiece, and is characterized by comprising: (1) a resin sheet preparation step, which is provided with a metal-containing material on the first surface side; A resin sheet of a conductive film of an oxide; an electrode forming step, which is a step of preparing the resin sheet, and then ablating and processing the conductive film with a laser beam having a wavelength that is transparent to the resin sheet; Positive and negative electrodes are formed on the first surface side; and an electrode displacement step, which is after the electrode formation step, attaching the electrode to the insulating surface side of the base substrate made of an insulator, and peeling the resin sheet from the electrode, thereby The positive and negative electrodes are moved to the insulating surface side of the base substrate. For example, the method for manufacturing an electrostatic chuck plate according to item 3 of the application, wherein the resin sheet is a transparent resin sheet in the visible region, and the wavelength of the laser beam is 1000 nm or more.