本發明之電極形成用樹脂組合物之一態樣包含上述構成，以下，一面參照作為一實施形態之電極形成用樹脂組合物，一面對本發明進行說明。 本實施形態中使用之(A)熱硬化性樹脂係將複數種特定之熱硬化性樹脂組合而使用者。作為用於該(A)熱硬化性樹脂之樹脂，包含(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物、(A2)於常溫下為液狀且於主鏈具有脂肪族烴基之雙馬來醯亞胺樹脂、及(A3)聚丁二烯樹脂。 本實施形態中使用之(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物分別為於1分子中具有1個以上之(甲基)丙烯醯基之(甲基)丙烯酸酯或(甲基)丙烯醯胺且含有羥基者。 此處，具有羥基之(甲基)丙烯酸酯可藉由使多元醇化合物與(甲基)丙烯酸或其衍生物反應而獲得。該反應可使用公知之化學反應。具有羥基之(甲基)丙烯酸酯係使用相對於多元醇化合物通常為0.5～5倍莫耳之丙烯酸酯或丙烯酸。 又，具有羥基之(甲基)丙烯醯胺可藉由使具有羥基之胺化合物與(甲基)丙烯酸或其衍生物反應而獲得。關於使(甲基)丙烯酸酯與胺化合物反應而製造(甲基)丙烯醯胺類之方法，由於(甲基)丙烯酸酯之雙鍵極富於反應性，故而一般使胺、環戊二烯、醇等預先加成至雙鍵作為保護基，醯胺化結束後進行加熱而使保護基脫離。 並且，藉由使該(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物含有羥基，而於電極形成時，促進由還原效果所產生之燒結性，並且接著性提高。 又，此處所謂之羥基係脂肪族烴基之氫原子經取代之醇性之基。該羥基之含量可為1分子中1至50個，若羥基之含量處於該範圍內，則不會因硬化過多而阻礙燒結性，可促進燒結性。 作為此種(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物，例如可列舉以下之通式(1)～(4)所表示之化合物。 [化1](式中，R1
表示氫原子或甲基，R2
表示碳數1～100之2價之脂肪族烴基或具有環狀結構之脂肪族烴基) [化2](式中，R1
及R2
分別表示與上述相同者) [化3](式中，R1
表示與上述相同者，n表示1～50之整數) [化4](式中，R1
及n分別表示與上述相同者) 作為該(A1)成分之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物，可單獨使用上述通式(1)～(4)所表示之化合物，或者組合2種以上而使用。再者，通式(1)及(2)中之R2
之碳數可為1～100，亦可為1～36。若R2
之碳數處於此種範圍內，則不會因硬化過多而阻礙燒結性。 本實施形態中使用之(A2)於常溫下為液狀且於主鏈具有脂肪族烴基之雙馬來醯亞胺樹脂係於主鏈具有碳數為1以上之脂肪族烴基且該主鏈將2個馬來醯亞胺基連結而構成者。此處，脂肪族烴基可為直鏈狀、支鏈狀及環狀之任一形態，碳數可為6以上，碳數可為12以上，碳數亦可為24以上。又，該脂肪族烴基可直接或間接地鍵結於馬來醯亞胺基，亦可直接鍵結於馬來醯亞胺基。 該(A2)成分之馬來醯亞胺樹脂可較佳地使用以下之通式(5)所表示之化合物。 [化5](式中，Q表示碳數6以上之2價之直鏈狀、支鏈狀或環狀之脂肪族烴基，P係選自O、CO、COO、CH2
、C(CH3
)2
、C(CF3
)2
、S、S2
、SO及SO2
中之2價之原子或有機基、或者含有至少1個以上之該等原子或有機基之有機基，m表示1～10之整數) 此處，P所表示之2價之原子可列舉O、S等，2價之有機基可列舉CO、COO、CH2
、C(CH3
)2
、C(CF3
)2
、S2
、SO、SO2
等，又，可列舉含有至少一個以上之該等原子或有機基之有機基。作為含有上述原子或有機基之有機基，可列舉碳數1～3之烴基、具有苯環、環環、胺基甲酸酯鍵等者作為除上述以外之結構，可例示以下之化學式所表示之基作為該情形之P。 [化6]於本實施形態中，使用於主鏈具有脂肪族烴基之雙馬來醯亞胺樹脂作為(A2)成分之雙馬來醯亞胺樹脂係獲得耐熱性優異並且低應力下吸濕後之熱時接著強度良好之電極形成用樹脂組合物之必要條件之一。為了有效地獲得該特性，較佳為使用以如上述通式(5)所表示之脂肪族烴基進行醯亞胺延長且於室溫下為液狀之雙馬來醯亞胺樹脂作為(A2)成分。 該(A2)成分之雙馬來醯亞胺樹脂由聚苯乙烯換算所得之數量平均分子量可為500以上且10000以下，亦可為500以上且5000以下。若數量平均分子量未達500，則可撓性降低，又，耐熱性亦降低。若數量平均分子量超過10000，則有製備組合物時之作業性、使用時之作業性降低之傾向。 本實施形態中使用之(A3)環氧化聚丁二烯係將聚丁二烯進行環氧改性而成之化合物，可為環氧當量為50～500(g/eq)之環氧化聚丁二烯。若環氧當量未達50，則有黏度增大，樹脂組合物之作業性降低之傾向，若超過500，則有熱時之接著強度降低之傾向。再者，環氧當量係藉由過氯酸法而求出者。作為該環氧化聚丁二烯，亦可使用於分子內具有羥基者。 作為環氧化聚丁二烯，例如可使用由Daicel股份有限公司市售之Epolead PB4700及GT401(均為商品名)、由日本曹達股份有限公司市售之JP-100及JP-200(均為商品名)。藉由含有該(A3)環氧化聚丁二烯，電極形成用樹脂組合物可提高電極對晶片零件端子之接著性。 該(A3)環氧化聚丁二烯可為數量平均分子量為500～10000者。若分子量處於該範圍內，則接著性良好，可控制為適當之黏度，故而作業性變得良好。數量平均分子量係藉由凝膠滲透層析法，利用標準聚苯乙烯之校正曲線進行測定(以下，稱為GPC法)而得之值。並且，上述所說明之(A1)～(A3)之各成分亦可如下所示般以調配特定之量之方式製成(A)熱硬化性樹脂。 即，關於本實施形態中使用之(A)熱硬化性樹脂，於將(A)熱硬化性樹脂設為100質量%時，可將(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物設為0～75質量%，將(A2)於常溫下為液狀且於主鏈具有脂肪族烴基之雙馬來醯亞胺樹脂設為10～90質量%，將(A3)環氧化聚丁二烯設為10～90質量%。 進而，(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物可為0～50質量%。 進而，(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物可為0質量%。於(A1)具有羥基之(甲基)丙烯酸酯化合物或(甲基)丙烯醯胺化合物為0質量%之情形時，(A2)於常溫下為液狀且於主鏈具有脂肪族烴基之雙馬來醯亞胺樹脂之調配量相對於(A3)環氧化聚丁二烯之調配量之比[(A2)/(A3)]可為1以上。若(A1)～(A3)之各成分處於該範圍內，則耐熱性、耐濕性及接著性良好，尤其可用於耐環境性之要求水準較高之車載用途。 若(A1)成分之調配量多於75質量%，則有電極形成用樹脂組合物之耐熱性、耐濕性較差之虞。若(A2)成分之調配量少於10質量%，則電極形成用樹脂組合物之耐熱性、耐濕性較差，若多於90質量%，則有電極形成用樹脂組合物之接著強度較差之虞。又，若(A3)成分之調配量少於10質量%，則電極形成用樹脂組合物之接著強度較差，若多於90質量%，則有電極形成用樹脂組合物之未反應成分易於殘留而接著強度較差之虞。 再者，作為該(A)熱硬化性樹脂，亦可使用除上述(A1)～(A3)成分以外之熱硬化性樹脂，關於此處可使用之熱硬化性樹脂，例如可列舉：環氧樹脂、雙馬來醯亞胺樹脂、聚丁二烯樹脂、酚樹脂等。其中，於將(A)熱硬化性樹脂設為100質量%時，除(A1)～(A3)成分以外之熱硬化性樹脂可為20質量%以下，亦可為10質量%以下。 用於本實施形態之(B)自由基起始劑只要為通常用於自由基聚合之聚合觸媒，則可無特別限定地使用。 作為該(B)自由基起始劑，可為急速加熱試驗(將試樣1 g載置於電熱板之上，以4℃/分鐘升溫時之分解起始溫度之測定試驗)中之分解起始溫度成為40～140℃者。若分解起始溫度未達40℃，則有接著性熱硬化型樹脂組合物之常溫下之保存性變得不良之虞，若超過140℃，則有硬化時間極端地變長之可能性。再者，關於上述分解起始溫度，將相對於試樣之加熱前之質量之1%質量損失時之溫度設為分解起始溫度。 作為滿足該條件之自由基起始劑之具體例，例如可列舉：1,1-雙(過氧化第三丁基)-2-甲基環己烷、過氧化新癸酸第三丁酯、過氧化二異丙苯等。該等可單獨使用，亦可為了控制硬化性而將2種以上混合而使用。 該(B)自由基起始劑之調配量相對於上述(A)熱硬化性樹脂100質量份，可為0.1～10質量份。若該調配量超過10質量份，則有樹脂組合物之黏度之經時變化變大而作業性降低之虞，若未達0.1質量份，則有硬化性顯著地降低之可能性。 本實施形態中使用之(C)銀微粒子只要為其厚度或短徑為1～200 nm之銀微粒子，則可無特別限定地使用。該(C)銀微粒子之形狀可列舉：板型、樹枝狀、桿狀、線狀、球狀等。此處，若為板型，則只要其厚度滿足上述範圍即可，又，若為樹枝狀、桿狀、線狀、球狀，則只要其剖面直徑中之最短之直徑滿足上述範圍即可。 上述(C)銀微粒子亦可使用板型銀微粒子。由於該板型銀微粒子有堆積於短徑方向之傾向，故而有如下優點：將電極形成用樹脂組合物藉由浸漬塗佈而成膜於電子零件之兩端時，可獲得表面上凹凸較少且平滑之電極面。 該板型銀微粒子之中心粒徑可為0.3～15 μm。本發明之一實施形態藉由將板型銀微粒子之中心粒徑設為該範圍，可提高於樹脂成分中之分散性。此處，中心粒徑係指利用雷射繞射式粒度分佈測定裝置進行測定而獲得之體積基準之粒度分佈曲線中之50%累計值(50%粒徑)。 又，厚度為10～200 nm，進而，亦可為10～100 nm。該厚度係藉由對由穿透式電子顯微鏡(TEM)或掃描式電子顯微鏡(SEM)取得之觀察圖像進行資料處理而測定者。進而，該厚度之平均厚度可為上述範圍內。該平均厚度係如下所述般作為個數平均厚度而算出。 將由板型銀微粒子之[n＋1]個(n＋1例如為50至100左右)之觀察圖像計測之厚度自厚至薄依序排列，將其範圍(最大厚度：x1
，最小厚度：xn ＋ 1
)分割成n個部份，將各個厚度之區間設為[xj
，xj ＋ 1
](j＝1、2、・・・・、n)。此情形之分割成為對數標度上之等分割。又，基於對數標度，各個厚度區間中之代表厚度用下述式表示。 [數1]進而，若將rj
(j＝1、2、・・・・、n)設為與區間[xj
，xj ＋ 1
]對應之相對量(差量%)，將總區間之合計設為100%，則對數標度上之平均值μ可用下述式計算。 [數2]該μ係對數標度上之數值，其不具有作為厚度之單位，故而為了回到厚度之單位，計算10μ
即10之μ次方。該10μ
係個數平均厚度。 又，與厚度方向垂直之方向之長邊可為厚度之8～150倍之範圍內，亦可為10～50倍。進而，與厚度方向垂直之方向之短邊可為厚度之1～100倍之範圍內，亦可為3～50倍。 該板型銀微粒子可於100～250℃進行自燒結。藉由含有如此於100～250℃進行自燒結之銀微粒子，而於熱硬化時銀微粒子之流動性提高，其結果為，銀微粒子彼此之接點變得更多，並且接點之面積變大，導電性顯著提高。由於自燒結溫度越低，燒結性越好，故而板型銀微粒子之燒結溫度可為100～200℃。再者，此處可進行自燒結係指即便不施加加壓或添加劑等，亦利用低於熔點之溫度下之加熱進行燒結。 作為此種(C)板型銀微粒子，例如可列舉：TOKUSEN KOGYO股份有限公司製造之M612(商品名；中心粒徑6～12 μm，粒子厚度60～100 nm，熔點250℃)、M27(商品名；中心粒徑2～7 μm，粒子厚度60～100 nm，熔點200℃)、M13(商品名；中心粒徑1～3 μm，粒子厚度40～60 nm，熔點200℃)、N300(商品名；中心粒徑0.3～0.6 μm，粒子厚度50 nm以下，熔點150℃)等。該等板型銀微粒子可單獨使用，亦可組合使用。尤其是，為了提高填充率，板型銀微粒子例如可於上述板型銀微粒子中M27、M13等相對較大之銀微粒子中組合N300等粒徑較小者而使用。 (C)板型銀微粒子較佳為粒子厚度為200 nm以下，振實密度(TD)為3.0～7.0 g/cm3
，且比表面積(BET)為2.0～6.0 m2
/g。 用於本實施形態之(D)銀粉係除(C)成分以外之銀粉。 (D)銀粉之平均粒徑為0.2～20 μm，只要為為了賦予導電性而添加至樹脂接著劑中之作為無機填充材料之銀粉即可。於本實施形態中，(D)銀粉之振實密度可為2.0～7.0 g/cm3
。 藉由除了上述(C)成分之銀微粒子以外，亦添加此種(D)成分之銀粉，可進一步提高晶片零件之端子與電極之接合強度。又，作為此處所使用之銀粒子之形狀，例如可列舉：薄片狀、樹脂狀、桿狀、線狀、球狀、板狀等。再者，該(D)成分之銀粉之平均粒徑係指利用雷射繞射粒度分佈測定裝置進行測定而獲得之體積基準之粒度分佈曲線中之50%累計值(50%粒徑)。 再者，關於該等(C)成分與(D)成分之比率，(C)成分：(D)成分之質量比可為10：90～50：50。若相對於(D)成分，(C)成分之比率過少，則燒結性降低，由此導致電阻值增加，若過多，則有黏度大幅地增加，損害對電子零件之塗佈性之虞。 本實施形態之電極形成用樹脂組合物可以於該電極形成用樹脂組合物中，使(A)熱硬化性樹脂為1～15質量%，使(B)自由基起始劑相對於(A)熱硬化性樹脂100質量份為0.1～10質量份，使(C)銀微粒子為5～40質量%，使(D)銀粉為50～90質量%之方式含有上述(A)～(D)成分。藉由設為此種組成，耐熱性、耐濕性、接著性、及耐環境性變得良好。 本實施形態之電極形成用樹脂組合物包含上述(A)～(D)之各成分，但除了該等以外，亦可視需要適當調配一般調配於此種樹脂組合物中之硬化促進劑、橡膠、矽酮等低應力化劑、偶合劑、密接賦予劑、鈦酸酯偶合劑、顏料、染料、消泡劑、界面活性劑、稀釋劑等添加劑。 本實施形態之電極形成用樹脂組合物係將上述(A)～(D)之各成分、及視需要調配之偶合劑等添加劑、溶劑等充分地混合。 其次，本實施形態之電極形成用樹脂組合物係將經混合之樹脂組合物藉由分散、捏合機、三輥研磨機等進行混練處理。最後，將經混練之樹脂組合物消泡，藉此可製備本實施形態之電極形成用樹脂組合物。 以此方式獲得之電極形成用樹脂組合物可用於形成電氣、電子零件之電極等之用途，其觸變比(25℃下之2 rpm之黏度與20 rpm之黏度之比率)可為1.1～4.5。若觸變比未達1.1，則有於電子零件製造時之浸漬塗佈時誘發由拉絲所導致之作業性之降低之虞，若觸變比超過4.5，則於浸漬塗佈時用作電氣、電子零件之外部電極之情形時，會產生稜角而尺寸穩定性較差，於任一情形時，作為電子零件之良率均會變差。 又，形成為電子零件之外部電極之電極形成用樹脂組合物之硬化物之膜厚可為5～100 μm。若膜厚未達5 μm，則對意圖之部分之塗佈性較差而欠缺塗膜均勻性，從而產生針孔，若超過100 μm，則有硬化時發生下垂，而欠缺塗膜均勻性之虞。 於電子零件之製造步驟中，浸漬塗佈電極形成用樹脂組合物時，藉由刮板而將浸漬槽之表面平坦化，但自連續作業之效率方面考慮，必須使電極形成用樹脂組合物之黏度變化率(增黏率)為200%以下。 以此方式獲得之本實施形態之電極形成用樹脂組合物成為其硬化物之車載零件水準之耐環境性能(超耐濕性、超耐熱性)及高導熱性、散熱性優異者。因此，於使用該電極形成用樹脂組合物形成電子零件之內部電極或外部電極之情形時，可觀察到顯著之特性之提高。例如，於用作電感器之外部電極之情形時，可與線圈直接金屬結合，且與除線圈以外之素體，藉由樹脂接著力而表現較高之接合力，故而可有助於電阻值之降低及車載等級之可靠性之提高。 其次，對本實施形態之晶片型電子零件及其製造方法進行說明。 本實施形態之晶片型電子零件係具有包含陶瓷燒結體之長方體形狀之晶片型電子零件素體者，且形成於晶片型電子零件素體之內部的內部電極及形成於晶片型電子零件素體之端面的外部電極中之至少一者係上述實施形態之電極形成用樹脂組合物之燒結體。此時所獲得之燒結體之體積電阻率較佳為1×10-4
Ω・cm以下。進而，體積電阻率越低，作為電子零件之特性越高，故而該體積電阻率亦可為1×10-5
Ω・cm以下。若體積電阻率超過1×10-4
Ω・cm，則有未充分地燒結，而招致製品可靠性之變差之虞。 製造本實施形態之晶片型電子零件時，於陶瓷層之表面使用本實施形態之電極形成用樹脂組合物藉由印刷而形成特定之電極圖案層。 本實施形態之晶片型電子零件之製造方法之下一步驟係於該電極圖案層上載置另一陶瓷層，於該另一陶瓷層之表面使用本實施形態之電極形成用樹脂組合物藉由印刷而形成特定之電極圖案層，反覆進行該操作，而將陶瓷層與電極圖案層交替地積層。 本實施形態之晶片型電子零件之製造方法之下一步驟係藉由對所獲得之積層體進行燒結，而製成具有由電極圖案形成之內部電極之晶片型電子零件素體。 本實施形態之晶片型電子零件之製造方法之最後之步驟係於該晶片型電子零件素體之端面形成外部電極，而獲得晶片型電子零件。此時，外部電極之形成可藉由公知之電極形成用之樹脂組合物而實施，但亦可使用本實施形態之電極形成用樹脂組合物。 製造本實施形態之另一晶片型電子零件時，將本實施形態之電極形成用樹脂組合物藉由印刷或浸漬而塗佈於晶片型電子零件素體之端面，並對所塗佈之該電極形成用樹脂組合物進行燒結，藉此形成外部電極，而獲得晶片型電子零件。 此時，於本實施形態中，上述電極形成用樹脂組合物可藉由如先前般之加熱而進行燒結，進而，即便於100～300℃使其燒結，亦可充分地確保導電性。又，該電極形成用樹脂組合物之浸漬塗佈時之連續作業性良好，可有效率地進行電極形成。 [實施例] 其次，藉由實施例而對本實施形態進一步詳細地進行說明，但本實施形態並不受到該等實施例任何限定。 (實施例1～12、比較例1～3) 根據表1～3中記載之組成而將各成分混合，並用輥進行混練，而獲得電極形成用樹脂組合物。利用以下之方法對所獲得之樹脂組合物進行評價。將其結果一併示於表1～3中。再者，實施例及比較例中使用之材料係使用具有下述特性者。 [(A)成分] (A1)丙烯酸樹脂：羥基乙基丙烯醯胺(興人(股)製造，商品名：HEAA) (A2)醯亞胺擴張型雙馬來醯亞胺(Designer Molecules公司製造，商品名：BMI-1500；數量平均分子量：1500) (A3)環氧化聚丁二烯樹脂(日本曹達(股)製造，商品名：JP-200) [(A')成分] 環氧樹脂：雙酚F型液狀環氧樹脂(三菱化學(股)製造，商品名：YL983U) 酚樹脂：雙酚F(本州化學工業(股)製造，商品名：Bisphenol F) [(B)成分] 自由基起始劑：過氧化二異丙苯(日本油脂(股)製造，商品名：Percumyl D；急速加熱試驗中之分解溫度：126℃) [(C)成分] 板型銀微粒子(TOKUSEN KOGYO(股)製造，商品名：M13；中心粒徑：2 μm，厚度：50 nm以下) [(C')成分] 球狀銀微粒子(DOWA Electronics(股)製造，商品名：Ag nano powder-1；平均粒徑：20 nm) [(D)成分] 銀粉A(形狀：薄片狀，平均粒徑：4.0 μm，厚度：0.3 μm以上，振實密度：5.5 g/cm3
) 銀粉B(形狀：薄片狀，平均粒徑：3.0 μm，厚度：0.3 μm以上，振實密度：3.8 g/cm3
) 銀粉C(形狀：球狀，平均粒徑：2.4 μm，振實密度：5.0 g/cm3
) [其他成分] 稀釋溶劑：丁基卡必醇(東京化成工業(股)製造) 硬化促進劑：1-苄基-2-苯咪唑(四國化成工業(股)製造，商品名：1B2PZ) 添加劑：矽烷偶合劑(信越化學工業(股)製造，商品名：KBM-503) [表1]
[表2]
[表3]
＜評價方法＞ [黏度] 使用E型黏度計(3°圓錐)，測定25℃、2 rpm下之值。 [觸變比] 使用E型黏度計(3°圓錐)，測定25℃下、2 rpm及20 rpm下之黏度，並將20 rpm相對於2 rpm之黏度之比(2 rpm之黏度/20 rpm之黏度)作為觸變比。 [體積電阻率] 將電極形成用樹脂組合物藉由網版印刷法而以5 mm×50 mm、厚度30 μm塗佈於玻璃基板(厚度1 mm)，並於200℃將其硬化60分鐘。對於所獲得之配線，使用製品名「MCP-T600」(三菱化學(股)製造)，藉由四端子法而測定電阻。 [塗佈外觀] 將電極形成用樹脂組合物藉由浸漬塗佈而成膜於晶片型電子零件素體之兩端，並於200℃進行60分鐘之加熱硬化，而製成電子零件。將此時所獲得之電子零件中因電極形成用樹脂組合物之階差等而無法獲得尺寸穩定性者設為NG。關於是否獲得尺寸穩定性之判斷，利用顯微鏡對電極剖面進行觀察，將表面之凹凸之差未達50 μm者判定為「良」，將表面之凹凸之差為50～100 μm者判定為「合格」，將超過100 μm者判定為「不良」。 [1%重量減少溫度] 將各實施例及各比較例中所獲得之電極形成用樹脂組合物10 mg於200℃硬化1小時之後，使用TG/DTA7200熱重量分析裝置(SII NanoTechnology股份有限公司製造)作為測定裝置，一面使壓縮空氣流動，一面於室溫(25℃)至600℃之範圍內，於10℃/min之條件下進行加熱，並測定所使用之試樣之重量損失1%之溫度，藉此求出。 [硬化物吸水率] 使用膜厚為200 μm、大小為500 mm見方之硬化物，以初始重量為基準，測定放置於85℃、85%高溫恆濕槽中168小時之後之重量，藉此求出。 [黏著強度] 將電極形成用樹脂組合物藉由浸漬塗佈而成膜於晶片型電子零件素體之兩端，並於200℃進行60分鐘之加熱硬化。對其實施鍍Ni及鍍Sn，並利用焊料將其封裝於基板，而製成電子零件。將該電子零件以20 mm/min橫推而測定剪切強度，並將破壞時之負載作為黏著強度(N)。 [耐熱通電試驗後之電阻值變化率] 將電極形成用樹脂組合物藉由浸漬塗佈而成膜於晶片型電子零件素體之兩端，並於200℃進行60分鐘之加熱硬化。對其實施鍍Ni及鍍Sn，並利用焊料將其封裝於基板，而製成電子零件。 將該電子零件放入恆溫槽(溫度150℃)中，於該狀態下實施通電試驗(1 A)，並算出經過500小時後、經過1000小時後、經過2000小時後、經過3000小時後相對於初始值之相對值。 [耐濕通電試驗後之電阻值變化率] 藉由浸漬塗佈而將電極形成用樹脂組合物成膜於晶片型電子零件素體之兩端，並於200℃進行60分鐘之加熱硬化。對其施加鍍Ni及鍍Sn，並利用焊料將其封裝於基板，而製成電子零件。 將該電子零件放入恆溫恆濕槽(溫度85℃、濕度85%)中，於該狀態下實施通電試驗(1 A)，算出經過500小時後、經過1000小時後、經過2000小時後、經過3000小時後相對於初始值之相對值。 由以上之結果可知，使用本實施形態之電極形成用樹脂組合物之電子零件可獲得任一特性均良好且高可靠性之電子零件。One aspect of the electrode composition resin composition of the present invention includes the above-mentioned configuration. Hereinafter, the present invention will be described with reference to the electrode composition resin composition as an embodiment. The (A) thermosetting resin used in this embodiment is a user who combines a plurality of specific thermosetting resins. The resin used in the (A) thermosetting resin includes (A1) a (meth) acrylate compound or a (meth) acrylamide compound having a hydroxyl group, and (A2) is liquid at room temperature and is mainly Bismaleimide resin having an aliphatic hydrocarbon group in the chain, and (A3) polybutadiene resin. The (A1) (meth) acrylic acid ester compound or (meth) acrylamide compound having a hydroxyl group used in this embodiment is a (meth) acryl group having one or more (meth) acrylamide groups in one molecule. ) Acrylic ester or (meth) acrylamide and contains a hydroxyl group. Here, the (meth) acrylate having a hydroxyl group can be obtained by reacting a polyol compound with (meth) acrylic acid or a derivative thereof. This reaction can use a well-known chemical reaction. As the (meth) acrylic acid ester having a hydroxyl group, an acrylic acid or acrylic acid that is usually 0.5 to 5 times the mole of the polyol compound is used. The (meth) acrylamide having a hydroxyl group can be obtained by reacting an amine compound having a hydroxyl group with (meth) acrylic acid or a derivative thereof. Regarding a method for producing (meth) acrylamidoamines by reacting a (meth) acrylate with an amine compound, since the double bond of (meth) acrylate is extremely reactive, amines and cyclopentadiene are generally used. , Alcohol and the like are added in advance to a double bond as a protective group, and after the amidine reaction is completed, the protective group is removed. In addition, when the (meth) acrylic acid ester compound or the (meth) acrylamide compound contains a hydroxyl group, sinterability due to a reduction effect is promoted when the electrode is formed, and adhesion is improved. Here, the alcoholic group in which the hydrogen atom of the hydroxy aliphatic hydrocarbon group is substituted. The content of the hydroxyl group may be 1 to 50 in one molecule. If the content of the hydroxyl group is within this range, sinterability is not hindered due to excessive hardening, and sinterability can be promoted. As such a (meth) acrylic acid ester compound or (meth) acrylamide compound which has such a (A1) hydroxyl group, the compound represented by following General formula (1)-(4) is mentioned, for example. [Chemical 1] (In the formula, R 1 represents a hydrogen atom or a methyl group, and R 2 represents a divalent aliphatic hydrocarbon group having a carbon number of 1 to 100 or an aliphatic hydrocarbon group having a cyclic structure.) (Wherein R 1 and R 2 each represent the same as the above) [Chemical Formula 3] (In the formula, R 1 represents the same as the above, and n represents an integer of 1 to 50.) (In the formula, R 1 and n each represent the same as the above.) As the (meth) acrylate compound or (meth) acrylamide compound as the (A1) component, the above-mentioned general formulae (1) to ( 4) The compound represented by the above, or it may be used in combination of two or more kinds. The carbon number of R 2 in the general formulae (1) and (2) may be 1 to 100 or 1 to 36. When the carbon number of R 2 is in such a range, sinterability is not hindered by excessive hardening. (A2) used in this embodiment is a bismaleimide resin which is liquid at normal temperature and has an aliphatic hydrocarbon group in the main chain. The resin has an aliphatic hydrocarbon group having a carbon number of 1 or more in the main chain, and the main chain will be Two maleimidine imino groups are connected to form one. Here, the aliphatic hydrocarbon group may have any of linear, branched, and cyclic forms, the number of carbons may be 6 or more, the number of carbons may be 12 or more, and the number of carbons may be 24 or more. The aliphatic hydrocarbon group may be directly or indirectly bonded to a maleimidine group, or may be directly bonded to a maleimide group. As the maleimide resin of the component (A2), a compound represented by the following general formula (5) can be preferably used. [Chemical 5] (In the formula, Q represents a divalent linear, branched or cyclic aliphatic hydrocarbon group having 6 or more carbon atoms, and P is selected from O, CO, COO, CH 2 , C (CH 3 ) 2 , C (CF 3 ) 2 , S, S 2 , SO and SO 2 are divalent atoms or organic groups, or organic groups containing at least one of these atoms or organic groups, m represents an integer from 1 to 10) Here, examples of the divalent atom represented by P include O, S, and the like, and examples of the divalent organic group include CO, COO, CH 2 , C (CH 3 ) 2 , C (CF 3 ) 2 , S 2 , SO. , SO 2 and the like, and organic groups containing at least one or more of these atoms or organic groups can be mentioned. Examples of the organic group containing the atom or the organic group include a hydrocarbon group having 1 to 3 carbon atoms, a benzene ring, a cyclic ring, and a urethane bond as structures other than the above, and the following chemical formulas can be exemplified The base is taken as the P of the situation. [Chemical 6] In this embodiment, the bismaleimide imide resin having an aliphatic hydrocarbon group in the main chain as the (A2) component is used to obtain a bismaleimide resin having excellent heat resistance and heat after moisture absorption under low stress. Next, one of the necessary conditions for a resin composition for electrode formation with good strength. In order to effectively obtain this characteristic, it is preferable to use a bismaleimide imine resin in which the imine is extended with an aliphatic hydrocarbon group represented by the above-mentioned general formula (5) and is liquid at room temperature as (A2) ingredient. The number-average molecular weight of the bismaleimide imide resin of the component (A2) obtained by polystyrene conversion may be 500 or more and 10,000 or less, or 500 or more and 5,000 or less. When the number-average molecular weight is less than 500, flexibility is reduced, and heat resistance is also reduced. When the number average molecular weight exceeds 10,000, the workability at the time of preparing the composition and the workability at the time of use tend to decrease. The (A3) epoxidized polybutadiene used in this embodiment is a compound obtained by epoxy-modifying polybutadiene, and may be an epoxidized polybutane having an epoxy equivalent of 50 to 500 (g / eq). Diene. If the epoxy equivalent is less than 50, the viscosity will increase, and the workability of the resin composition will tend to decrease. If it exceeds 500, the adhesive strength at the time of heat tends to decrease. The epoxy equivalent is determined by the perchloric acid method. The epoxidized polybutadiene can also be used for those having a hydroxyl group in the molecule. As the epoxidized polybutadiene, for example, Epolead PB4700 and GT401 (both trade names) commercially available from Daicel Co., Ltd., and JP-100 and JP-200 (both commercial goods) commercially available from Soda Co., Ltd. can be used. name). By containing the (A3) epoxidized polybutadiene, the resin composition for electrode formation can improve the adhesion of the electrode to the wafer component terminal. The (A3) epoxidized polybutadiene may be one having a number average molecular weight of 500 to 10,000. When the molecular weight is within this range, the adhesiveness is good and the viscosity can be controlled to be appropriate, so the workability becomes good. The number-average molecular weight is a value obtained by measurement using a calibration curve of standard polystyrene (hereinafter referred to as GPC method) by gel permeation chromatography. In addition, each of the components (A1) to (A3) described above may be made into a (A) thermosetting resin by mixing a specific amount as shown below. That is, regarding the (A) thermosetting resin used in this embodiment, when (A) the thermosetting resin is 100% by mass, (A1) a (meth) acrylate compound having a hydroxyl group or ( The meth) acrylamidonium compound is set to 0 to 75% by mass, and (A2) is a bismaleimide resin having a liquid state at normal temperature and having an aliphatic hydrocarbon group in the main chain thereof as 10 to 90% by mass. (A3) The epoxidized polybutadiene is 10 to 90% by mass. Furthermore, the (A1) (meth) acrylate compound or (meth) acrylamide compound which has a hydroxyl group may be 0-50 mass%. Furthermore, the (A1) (meth) acrylate compound or (meth) acrylamide compound which has a hydroxyl group may be 0 mass%. When (A1) the (meth) acrylic acid ester compound or (meth) acrylamide compound having a hydroxyl group is 0% by mass, (A2) is a liquid at ordinary temperature and has an aliphatic hydrocarbon group in the main chain. The ratio of the blended amount of maleimide resin to the blended amount of (A3) epoxidized polybutadiene [(A2) / (A3)] may be 1 or more. If each component of (A1)-(A3) exists in this range, heat resistance, humidity resistance, and adhesiveness will become favorable, and it can be used especially for a vehicle use which requires a high level of environmental resistance. If the compounding amount of the (A1) component is more than 75% by mass, the heat resistance and humidity resistance of the electrode composition resin composition may be inferior. If the blending amount of the component (A2) is less than 10% by mass, the heat resistance and moisture resistance of the electrode forming resin composition are poor, and if it is more than 90% by mass, the bonding strength of the electrode forming resin composition is poor. Yu. When the blending amount of the component (A3) is less than 10% by mass, the bonding strength of the resin composition for electrode formation is poor, and when it is more than 90% by mass, unreacted components of the resin composition for electrode formation are liable to remain and Then the strength may be poor. Further, as the (A) thermosetting resin, a thermosetting resin other than the components (A1) to (A3) may be used. Examples of the thermosetting resin usable here include epoxy resins. Resin, bismaleimide resin, polybutadiene resin, phenol resin, etc. However, when (A) the thermosetting resin is 100% by mass, the thermosetting resin other than the components (A1) to (A3) may be 20% by mass or less, or 10% by mass or less. The (B) radical initiator used in this embodiment can be used without particular limitation as long as it is a polymerization catalyst generally used for radical polymerization. As the (B) radical initiator, the decomposition can be performed in a rapid heating test (a measurement test of a decomposition initiation temperature when a sample of 1 g is placed on a hot plate and the temperature is raised at 4 ° C / minute). Those whose starting temperature is 40 to 140 ° C. If the decomposition initiation temperature is less than 40 ° C, the storage stability of the adhesive thermosetting resin composition at room temperature may be poor. If it exceeds 140 ° C, the curing time may be extremely long. In addition, regarding the said decomposition start temperature, the temperature at the time of 1% mass loss with respect to the mass before heating of a sample was made into a decomposition start temperature. Specific examples of the radical initiator satisfying this condition include, for example, 1,1-bis (third butyl peroxide) -2-methylcyclohexane, third butyl peroxydecanoate, Dicumyl peroxide and so on. These may be used alone, or two or more kinds may be mixed and used in order to control the hardenability. The compounding amount of this (B) radical initiator may be 0.1-10 mass parts with respect to 100 mass parts of said (A) thermosetting resins. If the blending amount exceeds 10 parts by mass, the viscosity of the resin composition may change with time and workability may decrease. If it is less than 0.1 part by mass, the hardenability may be significantly reduced. The silver fine particles (C) used in this embodiment can be used without particular limitation as long as the silver fine particles have a thickness or a short diameter of 1 to 200 nm. Examples of the shape of the (C) silver fine particles include a plate shape, a dendritic shape, a rod shape, a linear shape, and a spherical shape. Here, if it is a plate type, the thickness may satisfy the above range, and if it is dendritic, rod-shaped, linear, or spherical, the shortest diameter among the cross-sectional diameters may satisfy the above range. The (C) silver fine particles may also be plate-shaped silver fine particles. Since the plate-shaped silver fine particles tend to accumulate in the short-diameter direction, there is an advantage that when the resin composition for electrode formation is formed by dip coating on both ends of an electronic component, less unevenness on the surface can be obtained. And smooth electrode surface. The plate-shaped silver fine particles may have a central particle diameter of 0.3 to 15 μm. According to an embodiment of the present invention, by setting the center particle diameter of the plate-shaped silver fine particles to this range, the dispersibility in the resin component can be improved. Here, the central particle size refers to a 50% cumulative value (50% particle size) in a volume-based particle size distribution curve obtained by measurement using a laser diffraction particle size distribution measuring device. The thickness is 10 to 200 nm, and may be 10 to 100 nm. The thickness is measured by performing data processing on an observation image obtained by a transmission electron microscope (TEM) or a scanning electron microscope (SEM). Furthermore, the average thickness of the thickness may be within the above range. This average thickness is calculated as the number average thickness as described below. The thicknesses measured from the observation images of [n + 1] pieces of plate-shaped silver particles (n + 1 is, for example, about 50 to 100) are arranged in order from thick to thin, and the range (maximum thickness: x 1 , minimum thickness: x n +) 1) is divided into n portions, the thickness of each segment is set to [x j, x j + 1 ] (j = 1,2, · · · ·, n). The division in this case becomes an equal division on a logarithmic scale. In addition, based on a logarithmic scale, the representative thickness in each thickness interval is expressed by the following formula. [Number 1] Furthermore, if r j (j = 1, 2, ..., n) is a relative amount (difference%) corresponding to the interval [x j , x j + 1 ], the total of the total interval is set to 100%, the average μ on the logarithmic scale can be calculated by the following formula. [Number 2] The μ is a numerical value on a logarithmic scale, which does not have a unit of thickness, so in order to return to the unit of thickness, calculate 10 μ , which is the power of 10 μ. The 10 μ is the number average thickness. The long side in the direction perpendicular to the thickness direction may be within a range of 8 to 150 times the thickness, or may be 10 to 50 times. Furthermore, the short side in the direction perpendicular to the thickness direction may be within a range of 1 to 100 times the thickness, or may be 3 to 50 times. The plate-shaped silver fine particles can be self-sintered at 100 to 250 ° C. By containing the silver fine particles that are self-sintered at 100 to 250 ° C, the fluidity of the silver fine particles is improved during thermal curing. As a result, the number of contacts between the silver fine particles is increased, and the area of the contacts is increased , Electrical conductivity is significantly improved. The lower the self-sintering temperature, the better the sinterability. Therefore, the sintering temperature of the plate-type silver fine particles can be 100-200 ° C. Here, self-sintering means that the sintering is performed by heating at a temperature lower than the melting point without applying pressure or additives. Examples of such (C) plate-type silver fine particles include M612 (trade name; center particle diameter of 6 to 12 μm, particle thickness of 60 to 100 nm, melting point of 250 ° C.), manufactured by TOKUSEN KOGYO Co., Ltd., and M27 (commodity Name; central particle size 2 to 7 μm, particle thickness 60 to 100 nm, melting point 200 ° C), M13 (trade name; central particle size 1 to 3 μm, particle thickness 40 to 60 nm, melting point 200 ° C), N300 (commodity Name; center particle diameter 0.3 to 0.6 μm, particle thickness 50 nm or less, melting point 150 ° C) and the like. These plate-type silver fine particles may be used alone or in combination. In particular, in order to increase the filling rate, the plate-shaped silver fine particles can be used in combination with a relatively small particle size such as N300 among the relatively large silver fine particles such as M27 and M13 in the plate-shaped silver fine particles. (C) The plate-type silver fine particles preferably have a particle thickness of 200 nm or less, a tap density (TD) of 3.0 to 7.0 g / cm 3 , and a specific surface area (BET) of 2.0 to 6.0 m 2 / g. The (D) silver powder used in this embodiment is a silver powder other than the (C) component. (D) The average particle diameter of the silver powder is 0.2 to 20 μm, as long as it is a silver powder as an inorganic filler to be added to the resin adhesive in order to impart conductivity. In this embodiment, the tap density of the silver powder (D) may be 2.0 to 7.0 g / cm 3 . By adding the silver powder of the component (D) in addition to the silver fine particles of the component (C), the bonding strength between the terminal and the electrode of the wafer component can be further improved. Examples of the shape of the silver particles used herein include a sheet shape, a resin shape, a rod shape, a linear shape, a spherical shape, and a plate shape. The average particle size of the silver powder of the component (D) refers to a 50% cumulative value (50% particle size) in a volume-based particle size distribution curve obtained by measurement using a laser diffraction particle size distribution measuring device. Moreover, regarding the ratio of these (C) component and (D) component, the mass ratio of (C) component: (D) component may be 10: 90-50: 50. If the ratio of the component (C) to the component (D) is too small, the sinterability will decrease, which will result in an increase in resistance value. If the ratio is too large, the viscosity will increase significantly, which may impair the coatability to electronic parts. The resin composition for electrode formation according to this embodiment can be used in the electrode composition resin composition to make (A) the thermosetting resin at 1 to 15% by mass, and make (B) the radical initiator relative to (A) 100 parts by mass of the thermosetting resin is 0.1 to 10 parts by mass, (C) the silver fine particles are 5 to 40% by mass, and (D) the silver powder is 50 to 90% by mass, the components (A) to (D) are contained . By setting it as such a composition, heat resistance, moisture resistance, adhesiveness, and environmental resistance become favorable. The resin composition for electrode formation of this embodiment includes the components (A) to (D) described above, but in addition to these, a hardening accelerator, rubber, and Additives such as silicone, such as low-stress agents, coupling agents, adhesion-imparting agents, titanate coupling agents, pigments, dyes, defoamers, surfactants, and diluents. The resin composition for electrode formation according to this embodiment is a mixture of each of the components (A) to (D), and additives such as a coupling agent, a solvent, and the like, which are prepared as necessary. Next, the resin composition for electrode formation of this embodiment is a kneading process of the mixed resin composition by a dispersing, kneading machine, three-roll mill, or the like. Finally, by defoaming the kneaded resin composition, a resin composition for electrode formation according to this embodiment can be prepared. The resin composition for electrode formation obtained in this way can be used for the purpose of forming electrodes for electrical and electronic parts, etc., and its thixotropic ratio (ratio of viscosity at 2 rpm at 25 ° C. to viscosity at 20 rpm) can be 1.1 to 4.5 . If the thixotropic ratio is less than 1.1, the workability may be lowered due to wire drawing during dip coating during the manufacture of electronic parts. If the thixotropic ratio exceeds 4.5, it may be used for electrical, In the case of an external electrode of an electronic part, edges and corners are generated and the dimensional stability is poor. In either case, the yield as an electronic part is deteriorated. Moreover, the film thickness of the hardened | cured material of the electrode composition resin composition formed as the external electrode of an electronic component may be 5-100 micrometers. If the film thickness is less than 5 μm, the coating on the intended part is poor and the uniformity of the coating film is lacking, resulting in pinholes. If it exceeds 100 μm, sagging may occur during curing, and the uniformity of the coating film may be lacking. . In the manufacturing process of electronic parts, when the resin composition for electrode formation is dip-coated, the surface of the dipping tank is flattened by a squeegee. However, from the viewpoint of efficiency of continuous operation, it is necessary to make the resin composition for electrode formation The viscosity change rate (thickening rate) is 200% or less. The resin composition for electrode formation of this embodiment obtained in this way is excellent in the environmental resistance (ultra-humidity and super heat resistance), high thermal conductivity, and heat dissipation of the automotive parts of the cured product. Therefore, when the internal electrode or the external electrode of an electronic component is formed using the electrode formation resin composition, a significant improvement in characteristics can be observed. For example, when it is used as an external electrode of an inductor, it can be directly metal-bonded to the coil, and it has a higher bonding force with the resin body than the coil, and it can contribute to the resistance value. The reduction and the reliability of the vehicle-grade. Next, a wafer-type electronic component and a manufacturing method thereof according to this embodiment will be described. The wafer-type electronic component of the present embodiment is a wafer-type electronic component element having a rectangular parallelepiped shape including a ceramic sintered body, and an internal electrode formed inside the wafer-type electronic component element and a wafer-type electronic component element At least one of the external electrodes on the end face is a sintered body of the resin composition for electrode formation of the above embodiment. The volume resistivity of the sintered body obtained at this time is preferably 1 × 10 -4 Ω · cm or less. Furthermore, the lower the volume resistivity, the higher the characteristics as an electronic component. Therefore, the volume resistivity may be 1 × 10 -5 Ω · cm or less. If the volume resistivity exceeds 1 × 10 -4 Ω · cm, there is a possibility that the product may not be sufficiently sintered and the reliability of the product may be deteriorated. When the wafer-type electronic component of this embodiment is manufactured, a specific electrode pattern layer is formed on the surface of the ceramic layer by printing using the resin composition for electrode formation of this embodiment. The next step of the method for manufacturing a wafer-type electronic part of this embodiment is to place another ceramic layer on the electrode pattern layer, and use the electrode composition resin composition of this embodiment on the surface of the other ceramic layer to print A specific electrode pattern layer is formed, and this operation is repeatedly performed, and the ceramic layer and the electrode pattern layer are alternately laminated. The next step of the method for manufacturing a wafer-type electronic part in this embodiment is to sinter the obtained laminated body to form a wafer-type electronic part body having internal electrodes formed by electrode patterns. The last step of the method for manufacturing a wafer-type electronic part in this embodiment is to form an external electrode on the end surface of the body of the wafer-type electronic part, thereby obtaining a wafer-type electronic part. In this case, the formation of the external electrode can be performed by a known resin composition for electrode formation, but the resin composition for electrode formation of this embodiment can also be used. When manufacturing another wafer-type electronic component of this embodiment, the resin composition for electrode formation of this embodiment is applied to the end surface of a wafer-type electronic component element body by printing or dipping, and the applied electrode is applied. The forming resin composition is sintered to form an external electrode, and a wafer-type electronic component is obtained. At this time, in the present embodiment, the resin composition for electrode formation can be sintered by heating as before, and even if it is sintered at 100 to 300 ° C., sufficient conductivity can be ensured. The resin composition for electrode formation has good continuous workability during dip coating, and enables efficient electrode formation. [Examples] Next, the present embodiment will be described in more detail by way of examples, but this embodiment is not limited to these examples at all. (Examples 1 to 12, Comparative Examples 1 to 3) Each component was mixed according to the composition described in Tables 1 to 3 and kneaded with a roller to obtain a resin composition for electrode formation. The obtained resin composition was evaluated by the following method. The results are shown in Tables 1 to 3 together. The materials used in the examples and comparative examples are those having the following characteristics. [(A) Component] (A1) Acrylic resin: hydroxyethyl acrylamide (manufactured by Hingren Co., Ltd., trade name: HEAA) (A2) ammonium diamine bismaleimide (manufactured by Designer Molecules) , Trade name: BMI-1500; Number average molecular weight: 1500) (A3) Epoxidized polybutadiene resin (manufactured by Soda Co., Ltd., trade name: JP-200) [(A ') component] Epoxy resin: Bisphenol F type liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: YL983U) Phenol resin: bisphenol F (manufactured by Honshu Chemical Industry Co., Ltd., trade name: Bisphenol F) [(B) component] Free Base initiator: Dicumyl peroxide (manufactured by Japan Oils and Fats Co., Ltd., trade name: Percumyl D; decomposition temperature in rapid heating test: 126 ° C) [(C) component] plate-type silver microparticles (TOKUSEN KOGYO ( (Trade name: M13; center particle diameter: 2 μm, thickness: 50 nm or less) [(C ') component] spherical silver microparticles (manufactured by DOWA Electronics, trade name: Ag nano powder-1; average particle diameter: 20 nm) [(D) component] silver powder A (shape: flake, average particle diameter: 4.0 μm, thickness: more than 0.3 μm, tap density: 5.5 g / cm 3) silver powder B ( Like: flake, average particle diameter: 3.0 μm, thickness: more than 0.3 μm, tap density: 3.8 g / cm 3) silver powder C (shape: sphere, average particle diameter: tap density 2.4 μm: 5.0 g / cm 3 ) [Other ingredients] Diluent solvent: Butylcarbitol (manufactured by Tokyo Chemical Industry Co., Ltd.) Hardening accelerator: 1-benzyl-2-benzimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., trade name: 1B2PZ) Additive: Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-503) [Table 1] [Table 2] [table 3] <Evaluation method> [Viscosity] The value at 25 ° C and 2 rpm was measured using an E-type viscometer (3 ° cone). [Thixotropic ratio] Using an E-type viscometer (3 ° cone), measure the viscosity at 25 ° C, 2 rpm and 20 rpm, and compare the viscosity ratio of 20 rpm to 2 rpm (2 rpm viscosity / 20 rpm Viscosity) as thixotropic ratio. [Volume resistivity] The resin composition for electrode formation was applied to a glass substrate (thickness: 1 mm) at a thickness of 5 mm × 50 mm and a thickness of 30 μm by a screen printing method, and was cured at 200 ° C. for 60 minutes. About the obtained wiring, the resistance was measured by the four-terminal method using the product name "MCP-T600" (made by Mitsubishi Chemical Corporation). [Appearance of Appearance] The electrode composition resin composition was formed by dipping coating on both ends of a wafer-type electronic component element body, and then heated and hardened at 200 ° C for 60 minutes to prepare an electronic component. In the electronic component obtained at this time, it was set as NG because the dimensional stability could not be obtained due to the step of the resin composition for electrode formation and the like. Regarding the determination of whether dimensional stability was obtained, the cross section of the electrode was observed with a microscope, and the difference between the unevenness on the surface of less than 50 μm was judged as “good”, and the difference between the unevenness on the surface of 50 and 100 μm was judged as “good” ", And those exceeding 100 μm were judged as" defective. " [1% weight reduction temperature] After curing 10 mg of the electrode forming resin composition obtained in each example and each comparative example at 200 ° C for 1 hour, a TG / DTA7200 thermogravimetric analyzer (manufactured by SII NanoTechnology Co., Ltd.) was used. ) As a measuring device, while flowing compressed air, it is heated at a temperature of 10 ° C / min in the range of room temperature (25 ° C) to 600 ° C, and measures the weight loss of the sample used by 1%. The temperature was calculated from this. [Water absorption of hardened material] Using a hardened material with a film thickness of 200 μm and a size of 500 mm square, based on the initial weight, determine the weight after placing in a 85 ° C, 85% high temperature and humidity bath for 168 hours, and then calculate Out. [Adhesive Strength] The resin composition for electrode formation was formed by dipping coating on both ends of a wafer-type electronic component element body, and then heated and hardened at 200 ° C for 60 minutes. This was plated with Ni and Sn, and was packaged on a substrate with solder to prepare an electronic component. The electronic component was laterally pushed at 20 mm / min to measure the shear strength, and the load at the time of failure was used as the adhesive strength (N). [Change rate of resistance value after heat resistance current test] A resin composition for electrode formation was formed by dipping coating on both ends of a wafer-type electronic component element body, and was heat-hardened at 200 ° C for 60 minutes. This was plated with Ni and Sn, and was packaged on a substrate with solder to prepare an electronic component. This electronic component was placed in a thermostatic bath (temperature: 150 ° C), and an energization test (1 A) was performed in this state, and calculated after 500 hours, 1000 hours, 2000 hours, and 3000 hours after The relative value of the initial value. [Change rate of resistance value after moisture resistance current test] The resin composition for electrode formation was formed on both ends of a wafer-type electronic component element body by dip coating, and was heat-hardened at 200 ° C for 60 minutes. Ni-plating and Sn-plating were applied to the substrate, and the substrate was packaged with solder to prepare electronic parts. This electronic component was placed in a constant temperature and humidity tank (temperature: 85 ° C, humidity: 85%), and an electric current test (1 A) was performed in this state. After 500 hours, 1000 hours, 2000 hours, and 2000 hours, Relative value after 3000 hours relative to initial value. From the above results, it can be seen that the electronic component using the resin composition for electrode formation of this embodiment can obtain an electronic component with good characteristics and high reliability.