TW201835575A - Probe, probe head and method of manufacturing probe head - Google Patents

Abstract

A probe includes a conductive main body and in insulating layer. The conductive main body has a needle tip and a needle tail located at two opposite ends. The insulating layer covers on a portion of the conductive main body apart from the needle tip and the needle tail. The insulating layer has a tip gradient layer at an end exposing the needle tip. A sectional area of the tip gradient layer gradually diminishes towards the needle tip. The insulating layer has a tail gradient layer at an end exposing the needle tail. A sectional area of the tail gradient layer gradually diminishes towards the needle tail. The tip gradient layer has a first length along a longitudinal direction of the conductive main body. The tail gradient layer has a second length along a longitudinal direction of the conductive main body. The first length is longer than the second length.

Description

 Probe, probe head and probe head manufacturing method  

The present invention relates to a probe and an assembly structure thereof, and more particularly to a probe for testing a semiconductor and an assembly structure thereof.

The main function of the probe card is to directly contact the solder pads or bumps on the object to be tested (such as wafers, wafers or dies that have not been packaged), and to meet the peripheral test machine and software control. The purpose of the measurement is to further screen out the defective product. Usually, the test signal is sent by the test machine, and the probe is stuck to the object to be tested, and then the test result signal is sent back by the test object, and the probe card is sent to the test machine for analysis.

In general, the probe card has a probe head for securing a certain number of probes. In order to improve the quality of the test and make the probe have a consistent shape, it is undoubtedly an important development direction for the industry.

Accordingly, it is an object of the present invention to provide a probe head that provides uniformity of the position of the tip and/or the tail of the probe relative to the insulating layer.

According to an embodiment of the invention, a probe includes a conductive body and an insulating layer. The electrically conductive body has a needle tip and a needle tail at opposite ends. The insulating layer is coated on the conductive body except for the needle tip and the tail of the needle. The insulating layer has a needle tip gradation area at one end of the exposed needle tip, and the cross-sectional area of the needle tip gradation area gradually decreases toward the needle tip, and the insulating layer exposes the needle tail. One end has a needle-tailed gradation zone, and the cross-sectional area of the needle-tailed gradation zone gradually decreases toward the needle tail. The tip gradation zone has a first length along the long axis direction of the conductive body, and the needle tail gradation zone has a second length along the long axis direction of the conductive body, and the first length is greater than the second length.

In accordance with an embodiment of the invention, a probe head includes a guide structure and a plurality of probes. The probe passes through the guide structure. The probe includes a conductive body and an insulating layer. The conductive body has a needle tip and a needle tail. The insulating layer is covered with the conductive body, the insulating layer is exposed with the tip of the needle, and the insulating layer has a needle tip grading area at one end of the bare needle tip, and the cross-sectional area of the needle tip grading area gradually decreases toward the needle tip.

According to an embodiment of the present invention, a method of manufacturing a probe head includes: forming a plurality of insulating layers respectively covering a plurality of conductive bodies to form a plurality of probes; implanting the probes into the guide structure, and the probes At least one first end is exposed outside the guide structure; and the first end of the probe exposed outside the guide structure is dry etched to remove the insulating layer covering the first end of the conductive body.

100‧‧‧ probe head

110‧‧‧Guide structure

111‧‧‧Upper guide

111a‧‧‧First upper guide

111b‧‧‧Second upper guide

112‧‧‧ lower guide

112a‧‧‧First lower guide

112b‧‧‧Second lower guide

113‧‧‧Connecting plate

120‧‧‧ probe

121‧‧‧Electrical body

122‧‧‧Needle

123‧‧‧needle tail

126‧‧‧Insulation

127‧‧‧Needle gradation

128‧‧‧ needle tail gradient zone

200‧‧‧ Space Conversion Architecture

300‧‧‧ boards

400‧‧‧ Probe Card

H1, H11‧‧‧ first perforation

H2, H12‧‧‧ second perforation

H21‧‧‧ third perforation

H22‧‧‧fourth perforation

L1‧‧‧ first length

L2‧‧‧ second length

OD1‧‧‧ first outer diameter

OD2‧‧‧ second outer diameter

P‧‧‧Plastic

S‧‧‧ Space

FIG. 1 is a schematic view showing the application of a probe head according to an embodiment of the present invention.

Fig. 2 is an enlarged view showing the probe of Fig. 1.

Fig. 3 is a partially enlarged view showing the needle tip of Fig. 2.

Fig. 4 is a partially enlarged view showing the tail of the second figure.

Figures 5 to 7 are flow charts showing the manufacture of the probe head of Figure 1.

Fig. 8 is an enlarged view showing a probe according to another embodiment of the present invention.

Figures 9 through 14 are flow charts showing the manufacture of the probe head to which the probe of Figure 8 is applied.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings. And if implementation is possible, the features of different embodiments can be applied interactively.

Please refer to FIG. 1 , which is a schematic diagram showing the application of the probe head 100 according to an embodiment of the present invention. As shown in FIG. 1, the probe head 100 is electrically connected to the circuit board 300 through the space conversion architecture 200 to form the probe card 400. In a practical application, the probe head 100 is configured to be electrically connected to a Device Under Test (DUT) to perform a signal test on the object to be tested. In particular, a plurality of probes 120 are assembled to the guide structure 110 to form the probe head 100.

Please refer to FIG. 2 , which is an enlarged view of the probe 120 of FIG. 1 . As shown in FIG. 2, the probe 120 includes a conductive body 121 and an insulating layer 126. The conductive body 121 has a needle tip 122 and a needle tail 123 at opposite ends. The insulating layer 126 covers the remaining portion of the conductive body 121 except the needle tip 122 and the needle tail 123. In other words, the insulating layer 126 covers the conductive body 121, and the insulating layer 126 exposes the needle tip 122 and the needle tail 123. More precisely, the tip 122 and the tail 123 are the ends of the conductive body 121 that are not covered by the insulating layer 126, and the tip 122 and the tail 123 are exposed to the guide structure after the probe 120 is assembled to the guide structure 110. 110 outside. In practical applications, the diameter of the conductive body 121 is fixed. Under the need of Fine pitch, the spacing between adjacent probes 120 is also required, and the perforation of the guide structure 110 lies in Limiting the position of the probe 120 so that the spacing between adjacent two perforations is also required, however, the guide structure 110 itself has a certain structural strength, and the thickness of the side wall between the two perforations requires a certain thickness to avoid the guide plate structure 110 when the perforation is processed. The diameter of the perforation has a certain limitation. The thickness of the insulating layer 126 may range from about 30 nanometers (nm) to about 200 nm in the case where the diameter of the diameter of the conductive body 121 and the aperture of the through hole are limited. Between, but the invention is not limited thereto.

In the present embodiment, the type of the probe 120 may be a forming needle or a probe fabricated by microelectromechanical processing (MEMS) electroforming, that is, the probe 120 has a curved portion such that the needle tip 122 does not extend at the same level as the needle tail 123. In the axial direction, the needle tip 122 and the needle tail 123 can be parallel to each other, but the invention is not limited thereto. Therefore, when the probe 120 is assembled to the guide plate structure 110, the bent portion of the probe 120 will be formed with the guide plate structure 110. The effect of the stop, i.e., the position of the probe 120, is limited and cannot be moved relative to the guide structure 110. When the probe is assembled to the guide structure 110, the perforation of the guide structure 110 adjacent the tip 122 is not in the same horizontal extension axis as the guide structure 110 of the adjacent pin tail 123, and is offset by a distance.

Please refer to FIG. 3, which is a partial enlarged view of the needle tip 122 of FIG. As shown in FIG. 3, the insulating layer 126 has a gradual change in film thickness at one end of the exposed tip 122, that is, the insulating layer 126 has a tip gradation region 127 at one end of the exposed tip 122, and the tip gradation region 127 The first outer diameter OD1 gradually decreases toward the needle tip 122. That is, the cross-sectional area of the needle tip gradation area 127 gradually decreases toward the needle tip 122. By having the pinpoint grading region 127 at one end of the exposed tip 122 of the insulating layer 126, the chance of the insulating layer 126 peeling off the conductive body 121 at one end of the exposed tip 122 is effectively reduced.

Please refer to FIG. 4, which is a partial enlarged view of the needle tail 123 of FIG. In addition, as shown in FIG. 4, the insulating layer 126 has a gradual change in the film thickness at one end of the exposed pin tail 123, that is, the insulating layer 126 has a needle tail gradation area 128 at one end of the exposed pin tail 123, and the needle tail gradation area The second outer diameter OD2 of 128 gradually decreases toward the needle tail 123. That is to say, the cross-sectional area of the needle tail gradation area 128 gradually decreases toward the needle tail 123. Similarly, by the insulating layer 126 having the pin tail gradation region 128 at one end of the exposed pin tail 123, the chance of the insulating layer 126 peeling off the conductive body 121 at one end of the exposed pin tail 123 is effectively reduced.

Furthermore, as shown in FIG. 3, the tip gradation region 127 has a first length L1 along the long axis direction of the conductive body 121. As shown in FIG. 4, the needle tail gradation region 128 has a long axis direction along the conductive body 121. The second length L2. In the present embodiment, the first length L1 is greater than the second length L2. In practical applications, the pin tail 123 is in contact with the contact of the space transformer 200 of the probe card 400 for signal transmission, so the pin tail 123 will be shorter than the tip 122 and the second length L2 may be less than about 100 microns ( Mm). In addition, in order to achieve the function of the insulation, the material of the insulating layer 126 may be, for example, a metal oxide or a polymer material, but the invention is not limited thereto.

Specifically, in the manufacturing process of the probe head 100, an insulating layer 126 is formed to cover each of the conductive bodies 121 to form a plurality of probes 120.

Then, please refer to pictures 5~7. 5 to 7 are flowcharts showing the manufacture of the probe head 100 of Fig. 1. As shown in FIG. 5, the probe 120 is implanted into the guide structure 110, and at least one end of the probe 120 is exposed outside the guide structure 110. In other words, the probe 120 traverses the guide structure 110, and, in the present embodiment, the probes 120 are more substantially parallel to each other.

Then, as shown in FIG. 6, the plasma P is applied substantially perpendicularly toward the guide structure 110 to dry-etch the probe 120 exposed at the end of the guide structure 110 to remove the cladding. The insulating layer 126 of the end of the conductive body 121 (in the sixth figure, the needle tail 123, in other embodiments may be the needle tip 122), and the end of the conductive body 121 (in the sixth figure, the needle tail 123, in other implementations) In the manner, the tip 122) may be exposed outside the guide structure 110. In practical applications, the plasma P used for dry etching may be argon (Argon), oxygen (Oxygen), carbon tetrafluoride (CF4) or a mixture of the above gases, but the invention is not limited thereto.

When one end of the probe 120 covering the needle tail 123 is etched by the plasma P, in addition to being able to expose the needle tail 123 of the conductive body 121, the insulating layer 126 forms a needle tail gradation area 128 at one end of the bare needle tail 123 ( The enlarged view of the needle tail gradation area 128 is shown in Fig. 4), and by the effect of the dry etching, as described above, the second outer diameter OD2 of the needle tail gradation area 128 gradually decreases toward the direction of the needle tail 123. That is, the cross-sectional area of the needle tail gradation area 128 gradually decreases toward the needle tail 123. It should be noted that in the present embodiment, the needle tail grading area 128 is at least partially exposed outside the guide structure 110.

Then, as shown in FIG. 7, the plasma P is applied substantially perpendicularly to the guide structure 110 to dry-etch the probe 120 exposed to the other end of the guide structure 110 to remove the coated conductive body. The insulating layer 126 of the end of 121 (the tip 122 in the seventh embodiment, and the needle tail 123 in other embodiments), and the end of the conductive body 121 (in the seventh drawing, the tip 122, in other embodiments The needle tail 123) is exposed outside the guide structure 110.

Similarly, when one end of the probe 120 covering the tip 122 is etched by the plasma P, in addition to being able to expose the tip 122 of the conductive body 121, the insulating layer 126 forms a tip gradation at one end of the exposed tip 122. The area 127 (see the enlarged view of the needle tip gradation area 127), and, by the effect of the dry etching, as described above, the first outer diameter OD1 of the needle tip gradation area 127 gradually decreases toward the needle tip 122. . That is, the cross-sectional area of the tip gradation area 127 gradually decreases toward the needle tip 122. It should be noted that in the present embodiment, the tip gradation area 127 is at least partially exposed outside the guide structure 110.

On the other hand, in the present embodiment, the guide structure 110 further includes an upper guide 111, a lower guide 112, and a connecting plate 113. As shown in FIGS. 5-7, the upper guide plate 111 has a plurality of first through holes H1, and the probes 120 respectively pass through the corresponding first through holes H1, and the needle tails 123 are at least partially exposed outside the upper guide plates 111. There is a space S between the upper guide plate 111 and the lower guide plate 112. The lower guide plate 112 has a plurality of second through holes H2. The probes 120 respectively pass through the corresponding second through holes H2, and the needle tips 122 are at least partially exposed to the lower guide plates 112. outer. The connecting plate 113 is connected between the upper guide plate 111 and the lower guide plate 112. In the process of implanting the probe 120 into the guide structure 110, the probe 120 is first traversed through the corresponding second through hole H2, and then the first through hole H1 of the upper guide plate 111 is adapted to the probe 120 to pass the probe 120. Corresponding to the first through hole H1, the upper guide plate 111, the lower guide plate 112, and the connecting plate 113 are finally assembled.

In the operation of the probe head 100, when the tip 122 of the probe 120 abuts the object, even if the adjacent probe 120 is deformed by pressure, the space between the upper and lower guides 111 and 112 is deformed. Since S is in contact with each other, since the portion of the conductive body 121 between the tip 122 and the tail 123 is covered by the insulating layer 126, the problem that the adjacent probes 120 do not cause a short circuit.

Since the end of the probe 120 exposed outside the guide structure 110 is dry etched to remove the insulating layer 126 covering the end of the conductive body 121, the end of the conductive body 121 (ie, the tip 122 or the tail 123) is exposed to the insulating layer. In addition to 126, a plurality of probes 120 can be assembled with the guide structure 110 simultaneously for a plurality of probes 120. Therefore, the position of the tip 122 of each probe 120 relative to the tip gradation area 127, or the end of the needle 123 can be consistent with respect to the position of the needle tail grading area 128. As a result, the needle tip 100 has a uniformity in the needle mark to be tested after the probe card 400 is formed. In actual operation, while performing dry etching on the plurality of probes 120, about 70% or more of the probes 120 may have the same insulating layer 126. The so-called insulating layer 126 of the same position, for example, the distance between the end of the tip 122 of each probe 120 and the tip gradation area 127, or the end of the tail 123 of each probe 120, respectively The distance from the needle tail grading zone 128 falls within a tolerance of approximately plus or minus 20 microns to 30 microns. In other words, when a plurality of probes 120 are implanted into the guide structure 110 and dry etched, the tip gradation region 127 or the needle gradation region 128 is aligned with each other in the range of 40 micrometers to 60 micrometers.

Furthermore, since the end of the probe 120 exposed outside the guide structure 110 is dry etched to remove the insulating layer 126 covering the end of the conductive body 121, and the end of the conductive body 121 (ie, the needle tip 122 or the needle tail 123) is exposed. The outer surface of the insulating layer 126 can be simultaneously applied to the plurality of probes 120 after the plurality of probes 120 and the guide structure 110 are assembled, so that the manufacturing time of the probe head 100 can be effectively saved, so that the probe head 100 can be fabricated. The cost has also decreased accordingly.

On the other hand, since the dry etching of the plurality of probes 120 can be performed simultaneously, the probe 120 is suitable for mass production, and the probe 120 formed after the dry etching can be taken out from the guide structure 110 for backup. use. When the probe card 400 is tested, the probe 120 is in contact with the contact of the object to be tested, thereby performing a test of the electrical signal. Since the contact of the object to be tested wears the probe 120, the probe 120 needs to be replaced after a period of use. However, it should be understood that there may be an error in the formation of the probe 120, so there may be a situation in which the needle tip gradation area 127 and/or the needle tail gradation area 128 are inconsistent between the backup probe 120 and the original probe 120. . In particular, the probe 120 that needs to be replaced typically only occupies a minority of the probes 120 on the probe head 100, so after replacing a few damaged probes 120, the probe tip 100 has a tip gradation zone 127 of the integral probe 120. And/or the needle tail grading zone 128 position is mostly consistent.

Please refer to FIG. 8 , which is an enlarged view of the probe 120 according to another embodiment of the present invention. In the present embodiment, as shown in FIG. 8, the type of the probe 120 may be a wire needle, that is, the probe 120 may be bent and not permanently deformed, and therefore, the probe 120 can be assembled to the guide structure 110. It can be moved along its axis relative to the guide structure 110, that is, the probe 120 is linear in the assembly process, and can easily pass through the guide structure 110 composed of three or four guide plates, and confirm that the plurality of probes 120 are directly guided. After the plate structure 110, the upper guide plate 111 or the lower guide plate 112 is appropriately misaligned, and the probe 120 is subjected to a lateral force formed by the misalignment between the guide plates, and the curved form of the S form is fixed in the guide plate structure 110. The situation in which the probe 120 slips can be avoided. The shape of the probe 120 assembled to the guide structure 110 is similar to the structure of Figure 2.

Please refer to pictures 9~14. 9 to 14 are flowcharts showing the manufacture of the probe head 100 to which the probe 120 of Fig. 8 is applied. As shown in FIG. 9, the probes 120 are first implanted in the guide structure 110, respectively, and the opposite ends of the probe 120 are exposed outside the guide structure 110.

Thereafter, as shown in FIG. 10, the probe 120 is moved relative to the guide structure 110, so that one end of the probe 120 can further protrude outside the guide structure 110 according to actual conditions. Then, as shown in FIG. 11, the plasma P is applied substantially perpendicularly to the guide structure 110 to dry-etch the end of the probe 120 exposed outside the guide structure 110 to remove the end of the covered conductive body 121. The insulating layer 126 (in the eleventh figure, the tip 122, in other embodiments may be the tail 123), and the end of the conductive body 121 (in the 11th view, the tip 122, in other embodiments may be the tail 123) is exposed outside the guide structure 110.

For example, when one end of the probe 120 covering the tip 122 is etched by the plasma P, in addition to being able to expose the tip 122 of the conductive body 121, the insulating layer 126 forms a tip at one end of the exposed tip 122. The layer region 127, and, by the effect of the dry etching, as described above, the first outer diameter OD1 of the needle tip gradation region 127 gradually decreases toward the direction of the needle tip 122. That is, the cross-sectional area of the tip gradation area 127 gradually decreases toward the needle tip 122.

On the other hand, in other embodiments, when one end of the probe 120 covering the needle tail 123 is etched by the plasma P, the insulating layer 126 exposes the needle tail 123 except that the needle tail 123 of the conductive body 121 can be exposed. The needle end gradation area 128 is also formed at one end, and by the effect of the dry etching, as described above, the second outer diameter OD2 of the needle tail gradation area 128 gradually decreases toward the direction of the needle tail 123. That is, the cross-sectional area of the needle tail gradation area 128 gradually decreases toward the needle tail 123.

According to the actual application, as shown in Fig. 12, since the probe 120 is a wire needle (flexible and not permanently deformed), the probe 120 moves relative to the guide structure 110, and the needle gradation area 127 moves to the guide. Within the board structure 110, the tail 123, which is covered by the insulating layer 126 at the other end, is further protruded out of the guide structure 110 for subsequent dry etching.

Alternatively, according to the actual application, as shown in FIG. 13, the probe 120 moves relative to the guide structure 110, and the needle tail gradation area 128 moves into the guide structure 110, so that the other end is covered by the insulating layer 126. The tip 122 is further protruded out of the guide structure 110 to apply the plasma P and dry etch.

As shown in FIG. 14, when the needle tail 123 of the coated conductive body 121 and the insulating layer 126 of the needle tip 122 are successively removed, the probe 120 moves relative to the guide plate structure 110. At this time, the needle tail gradation area 128 and the needle tip gradually become The layer regions 127 are each at least partially located within the fence structure 110 for subsequent use by the probe head 100.

It should be noted that in the embodiment, the guide structure 110 further includes a first upper guide 111a, a second upper guide 111b, a first lower guide 112a, a second lower guide 112b, and a connecting plate 113. The first upper guide plate 111a has a plurality of first through holes H11, and the probes 120 respectively pass through the first through holes H11, and the needle tails 123 are at least partially exposed outside the first upper guide plates 111a. The second upper guide plate 111b has a plurality of second through holes H12, and the probes 120 respectively pass through the second through holes H12. The first lower guide plate 112a has a plurality of third through holes H21, and the probes 120 respectively pass through the third through holes H21, and a space S is formed between the second upper guide plate 111b and the first lower guide plate 112a. The second lower guide plate 112b has a plurality of fourth through holes H22, and the probes 120 respectively pass through the fourth through holes H22, and the needle tips 122 are at least partially exposed outside the second lower guide plates 112b. The connecting plate 113 is connected between the second upper guide plate 111b and the first lower guide plate 112a. The type of the probe 120 of the present embodiment is a wire needle. When the probe 120 is implanted into the guide plate structure 110, the probe 120 is first traversed through the first through hole H11, the second through hole H12, and the third through hole H21, respectively. Four perforations H22, and then dislocation of the first upper guide plate 111a and the second upper guide plate 111b with the first lower guide plate 112a and the second lower guide plate 112b, so that the probe forms a bending deformation in the space S portion, and finally the first The upper guide plate 111a, the second upper guide plate 111b, the first lower guide plate 112a, the second lower guide plate 112b, and the connection plate 113 are assembled.

Since the probe 120 traverses the first through hole H11 and the second through hole H12 and the needle tail 123 is at least partially exposed outside the first upper guide plate 111a, the probe 120 exposed outside the first upper guide plate 111a is opposite to the first upper guide plate. The angle of 111a can be controlled by adjusting the relative position of the first through hole H11 and the second through hole H12. Similarly, since the probe 120 traverses the third through hole H21 and the fourth through hole H22 and the tip 122 is at least partially exposed outside the second lower guide 112b, the probe 120 exposed outside the second lower guide 112b is opposite to the second The angle of the lower guide plate 112b can be controlled by adjusting the relative positions of the third through holes H21 and the fourth through holes H22.

It should be noted that, in all the embodiments of the present invention, in the step of removing the insulating layer 126 of the needle body 123 and the needle tip 122 of the conductive body 121, the order of removing the needle tip 122 or the needle tail 123 is not limited, and the first step is removed. A portion may be referred to as a first end, and a portion removed later may be referred to as a second end.

In summary, the technical solution disclosed in the foregoing embodiments of the present invention has at least the following advantages:

(1) Since the probe is exposed to the end of the guide structure to dry-etch, to remove the insulating layer covering the end of the conductive body, and the end of the conductive body (ie, the needle tip or the needle tail) is exposed outside the insulating layer, After the plurality of probes and the guide plate structure are assembled, the plurality of probes are simultaneously performed. Therefore, the position of the tip of each probe relative to the gradation area of the needle tip or the position of the needle tail relative to the gradation area of the needle tail may have consistency. As a result, the needle tip of the probe head to be tested after the probe card is assembled has uniformity.

(2) The opportunity for the insulating layer to peel off the conductive body is effectively reduced by the insulating layer having the tip gradation area at one end of the bare needle tip and the needle tail grading area at one end of the exposed needle tail.

(3) Since the probe is exposed to the end of the guide structure to dry-etch, to remove the insulating layer covering the end of the conductive body, and the end of the conductive body (ie, the needle tip or the needle tail) is exposed outside the insulating layer, After the plurality of probes and the guide structure are assembled, the plurality of probes are simultaneously performed, so that the production time of the probe head can be effectively saved, and the manufacturing cost of the probe head is also reduced accordingly.

(4) Since the dry etching of a plurality of probes can be performed simultaneously, the probe is suitable for mass production, and the probe formed after the dry etching can be taken out from the guide structure for backup.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

Claims (19)

 A probe comprising: a conductive body having a tip and a tail at opposite ends; and an insulating layer covering the remaining portion of the conductive body except the tip and the tail, the insulating layer being exposed One end of the needle tip has a tip gradation zone, and the cross-sectional area of the apex zone of the needle tip gradually decreases toward the tip of the needle. The insulating layer has a needle gradation zone at one end of the needle tail exposed, and the cross-sectional area of the gradual zone of the needle tail The needle tip grading region has a first length along the long axis direction of the conductive body, and the needle tail gradation region has a second length along the long axis direction of the conductive body, the first The length is greater than the second length.    The probe of claim 1, wherein the insulating layer is a metal oxide or a high molecular polymer material.    The probe of claim 1, wherein the insulating layer has a thickness ranging between about 30 nanometers and about 200 nanometers.    The probe of claim 1 wherein the second length is less than about 100 microns.    a probe head comprising: a guide plate structure; and a plurality of probes passing through the guide plate structure, each of the probes comprising: a conductive body having a tip; and an insulating layer covering the conductive body The insulating layer exposes the tip of the needle, and the insulating layer has a tip gradation zone at one end of the exposed tip, and the cross-sectional area of the tip gradation zone gradually decreases toward the tip.    The probe head of claim 5, wherein each of the conductive bodies further has a pin tail, corresponding to the insulating layer exposing the pin tail, and the insulating layer has a pin tail gradient at one end of the exposed pin tail The cross-sectional area of the needle-progressing zone gradually decreases toward the needle tail.    The probe head according to claim 6, wherein each of the tip gradation regions has a first length along a longitudinal direction of the corresponding conductive body, corresponding to the long tail region of the needle tail along the long axis of the conductive body The direction has a second length that is greater than the second length.    The probe head of claim 6, wherein the stitch tail grading regions are at least partially exposed outside the guide structure.    The probe head of claim 6, wherein the needle striker regions are at least partially located within the guide structure.    The probe head according to claim 6, wherein the distance between the ends of the stitch ends and the corresponding tapered tail region respectively falls within a tolerance range of about plus or minus 20 to 30 micrometers.    The probe head of claim 6, wherein the guide structure further comprises: an upper guide plate having a plurality of first through holes, the probes respectively traversing the first through holes, and the pin tails are at least partially exposed Outside the upper guide plate; a lower guide plate having a space between the upper guide plate and the lower guide plate, the lower guide plate having a plurality of second through holes, the probes respectively crossing the second through holes, and The tips are at least partially exposed outside the lower guide; and a connecting plate is coupled between the upper guide and the lower guide.    The probe head of claim 6, wherein the guide structure further comprises: a first upper guide plate having a plurality of first through holes, the probes respectively passing through the first through holes, and the stitch ends are at least a second upper guide plate having a plurality of second through holes, wherein the probes respectively pass through the second through holes; and a first lower guide plate having a plurality of third through holes The probes respectively pass through the third through holes, and a space between the second upper guide plate and the first lower guide plate; a second lower guide plate having a plurality of fourth through holes, the probes The fourth through holes are respectively traversed, and the needle tips are at least partially exposed outside the second lower guide plate; and a connecting plate is connected between the second upper guide plate and the first lower guide plate.    The probe head of claim 5, wherein the tip gradation regions are at least partially exposed outside the guide structure.    The probe head of claim 5, wherein the tip gradation regions are at least partially located within the guide structure.    The probe head of claim 5, wherein the distance between the ends of the tips and the corresponding apex regions of the needle tip falls within a tolerance range of about plus or minus 20 to 30 microns.    A method for manufacturing a probe head, comprising: forming a plurality of insulating layers respectively covering a plurality of conductive bodies to form a plurality of probes; implanting the probes into a guide structure, and each of the probes At least one first end is exposed outside the guiding structure; and the first ends of the probes exposed outside the guiding structure are dry etched to remove one of each of the conductive bodies The insulating layer at one end.    The manufacturing method of claim 16, wherein the step of implanting the probes into the guide structure comprises: exposing at least one second end of each of the probes to the outside of the guide structure; further comprising: The second ends of the probes exposed outside the structure of the guide are dry etched to remove the insulating layer covering the second end of each of the conductive bodies.    The manufacturing method of claim 17, wherein exposing at least one second end of each of the probes to the outside of the guide structure comprises: moving the probes relative to the guide structure.    The manufacturing method of claim 16, wherein exposing at least one first end of each of the probes to the outside of the guide structure comprises: moving the probes relative to the guide structure.