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TW201827382A - Silicone-based hybrid polymer-coated AlN filler - Google Patents

Silicone-based hybrid polymer-coated AlN filler Download PDF

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TW201827382A
TW201827382A TW107103178A TW107103178A TW201827382A TW 201827382 A TW201827382 A TW 201827382A TW 107103178 A TW107103178 A TW 107103178A TW 107103178 A TW107103178 A TW 107103178A TW 201827382 A TW201827382 A TW 201827382A
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filler
aluminum nitride
aln
coated
polymer
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TW107103178A
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佐藤綠
信藤卓也
堀口恭
手塚宏茂
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日商日本山村硝子股份有限公司
日商古河電子股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/06Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/072Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/40Compounds of aluminium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/10Treatment with macromolecular organic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12Treatment with organosilicon compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

According to the present invention, a surface-coated AlN filler for obtaining a heat-resistant heat dissipation material that is suppressed in deterioration of characteristics such as thermal conductivity due to hydrolysis of the AlN filler surface is obtained, said heat dissipation material being able to be used in a heat dissipation member that requires high thermal conduction characteristics. A silicone-based hybrid polymer-coated AlN filler according to the present invention is mainly composed of aluminum nitride; and the surface of this filler is coated with a silicone-based hybrid polymer. If 5 g of this filler, which has an average particle diameter of 20-40 [mu]m, is added into 50 mL of an ion exchange water, the electrical conductivity of the water after being held at 121 DEG C under saturated water vapor pressure for 50 hours is 350 [mu]S/cm or less.

Description

矽氧系混成聚合物被覆氮化鋁填料Siloxane hybrid polymer coated aluminum nitride filler

本發明有關一種填料,其以表面被矽氧系混成聚合物被覆而成的氮化鋁作為主成分(以下,將該填料稱為「AlN填料」)。The present invention relates to a filler whose main component is aluminum nitride obtained by coating a surface with a siloxane-based mixed polymer (hereinafter, this filler is referred to as "AlN filler").

以藉由高熱傳導特性來實行散熱或逸熱作為目的之複合構件(以下,稱為「散熱構件」),以重電相關或電器產品為中心,已廣泛地使用。此散熱構件,是由具有高熱傳導性的陶瓷或金屬等的填料與能夠賦予彈性的耐熱樹脂之複合材料所構成。近年來,隨著電子零件的高密度化、集積化,所要求的熱傳導率逐漸變高。其中,要求高電絕緣性的用途並不少。亦即,同時要求電絕緣性與高熱傳導性。一般而言,熱傳導性高的物質的導電性亦較高。因此,所要求的特性相反。對於這樣的要求,是使用氧化鋁、氧化鋯等陶瓷,但相較於金屬等,其熱傳導率並非滿足的數值。A composite member (hereinafter, referred to as a "radiating member") for the purpose of implementing heat dissipation or heat dissipation by high heat conduction characteristics has been widely used mainly for heavy-electricity-related or electrical products. This heat radiating member is composed of a composite material such as a ceramic or metal filler having high thermal conductivity and a heat-resistant resin capable of imparting elasticity. In recent years, with the increase in density and accumulation of electronic components, the required thermal conductivity has gradually increased. Among them, there are many applications requiring high electrical insulation. That is, both electrical insulation and high thermal conductivity are required. Generally, a substance having a high thermal conductivity has a high electrical conductivity. Therefore, the required characteristics are reversed. For such requirements, ceramics such as alumina and zirconia are used, but their thermal conductivity is not a satisfactory value compared to metals and the like.

作為具有比氧化物陶瓷更高的熱傳導率的陶瓷,是使用氮化鋁等氮化物陶瓷。氮化鋁(AlN)的絕緣性高,且具有170W・m-1 ・K-1 這樣高的熱傳導率,因此已廣泛使用作為高熱傳導絕緣板。已進展嘗試藉由將這種AlN等氮化物陶瓷作為填料利用,並摻合至各種樹脂中,來製作高熱傳導的功能性材料。AlN填料,能夠對於原本熱傳導率低的樹脂賦予高熱傳導性,因此藉由使AlN填料與樹脂複合化來製成散熱構件,在各領域中已實用化作為發熱體的冷卻用。As a ceramic having a higher thermal conductivity than an oxide ceramic, a nitride ceramic such as aluminum nitride is used. Aluminum nitride (AlN) has high insulation properties and has a high thermal conductivity of 170 W ・ m -1 ・ K -1 . Therefore, aluminum nitride (AlN) has been widely used as a high heat conductive insulating plate. Attempts have been made to use such nitride ceramics such as AlN as fillers and blend them with various resins to produce functional materials with high thermal conductivity. AlN fillers can provide high thermal conductivity to resins with low thermal conductivity. Therefore, AlN fillers and resins are combined to form heat-dissipating members, and they have been put to practical use as cooling elements in various fields.

然而,已知用於這樣的用途的AlN填料容易與大氣中的水分反應而發生水解,而分解成氫氧化鋁與氨(AlN+3H2 O→Al(OH)3 +NH3 )。如果AlN受到水解而成為Al(OH)3 ,則熱傳導特性下降,而無法對複合材料賦予高熱傳導性。尤其是重視耐熱性的熱傳導薄片等之中所使用的矽氧樹脂或耐綸樹脂等,其能夠隔絕大氣中的水蒸氣的阻氣性低,而有作為填料而複合化後的AlN容易被水解的傾向。因此,在阻氣性低的樹脂中,AlN容易被水解,因而熱傳導率會隨時間而下降。However, it is known that the AlN filler used for such applications easily reacts with moisture in the atmosphere to undergo hydrolysis, and is decomposed into aluminum hydroxide and ammonia (AlN + 3H 2 O → Al (OH) 3 + NH 3 ). When AlN is hydrolyzed to become Al (OH) 3 , the thermal conductivity is reduced, and high thermal conductivity cannot be imparted to the composite material. In particular, silicone resins and nylon resins used in heat-conducting sheets that emphasize heat resistance have low gas barrier properties that can block water vapor from the atmosphere, and AlN compounded as a filler is easily hydrolyzed. Propensity. Therefore, in a resin having low gas barrier properties, AlN is easily hydrolyzed, and thus the thermal conductivity decreases with time.

又,因為大多的泛用樹脂是藉由使用固體的小丸來在大氣中且高溫的條件下進行熔融揉合(雙軸揉合-押出成形),來實行填料混合,所混合的填料暴露於水蒸氣一事並非尋常的情況。因此,所摻合的填料、尤其是AlN填料,必須施加表面處理來使其穩定化。In addition, since most general-purpose resins use solid pellets to melt-knead (biaxial kneading-extrusion molding) under atmospheric and high-temperature conditions to perform filler mixing, the mixed filler is exposed to water. The case of steam is not unusual. Therefore, the blended filler, especially the AlN filler, must be surface-treated to stabilize it.

一般而言,作為對於AlN填料的耐水處理劑,已知矽烷偶合劑等各種偶合劑、或磷酸系處理劑。In general, as a water-resistant treatment agent for an AlN filler, various coupling agents such as a silane coupling agent or a phosphoric acid-based treatment agent are known.

各種偶合劑,是藉由使AlN填料表面具有一定程度的耐水性,並且使AlN填料表面與樹脂的親和性良好,而防止水分進入AlN填料/樹脂界面,來對防止AlN填料水合(水解)的情形具有一定的功效。然而,作為被膜的密合性較弱且膜質亦變硬,因此易於在表面產生龜裂或界面剝離,因而對於AlN填料的揉合步驟等的應力的耐久性不充分,且難以製作穩定的保護膜。Various coupling agents prevent the hydration (hydrolysis) of AlN fillers by making the surface of the AlN fillers have a certain degree of water resistance and making the surface of the AlN fillers have a good affinity with the resin to prevent water from entering the AlN filler / resin interface. Situations have some effect. However, since the adhesion as a coating is weak and the film quality is also hardened, cracks or interfacial peeling are likely to occur on the surface. Therefore, the durability of the stress such as the kneading step of the AlN filler is insufficient, and it is difficult to make stable protection. membrane.

磷酸系處理劑,雖然能夠在AlN填料表面形成非常堅固的耐水層,但非常難以完全去除磷酸成分,而因殘留的磷酸成分,根據使用用途而發生銅線路等腐蝕的問題,因此被限定於下述用途:在不與金屬接觸的地方使用等。The phosphoric acid-based treatment agent can form a very strong water-resistant layer on the surface of the AlN filler, but it is very difficult to completely remove the phosphoric acid component. The remaining phosphoric acid component causes corrosion problems such as copper wiring depending on the use. Therefore, it is limited to the following. Application: Used in places not in contact with metal.

作為最有效的方法,存在一種方法,其使用矽氧油,並藉由高溫烘烤來在AlN填料表面形成保護層,但存在下述問題:處理繁雜且特殊而無法簡單地實施,因而處理費用變高,並且使重要的特性也就是熱傳導率下降。As the most effective method, there is a method that uses a silicone oil and forms a protective layer on the surface of the AlN filler by high-temperature baking, but has the following problems: the processing is complicated and special and cannot be easily implemented, so the processing cost is high. It becomes high and reduces an important characteristic, that is, thermal conductivity.

又,為了改善矽烷偶合劑處理或矽氧油的烘烤硬化處理的問題,已研究各種矽烷系材料,但仍然難以獲得一種散熱材料,該散熱材料能夠在AlN填料表面形成密合性良好且穩定的被膜,並且使其均勻地分散於有機聚矽氧烷系樹脂或環氧樹脂等之中而能夠長期穩定(專利文獻1~3)。 [先前技術文獻] (專利文獻)In addition, in order to improve the problems of silane coupling agent treatment or baking hardening of silicone oil, various silane-based materials have been studied, but it is still difficult to obtain a heat-radiating material, which can form good and stable adhesion on the surface of the AlN filler. The coating can be stabilized for a long period of time by uniformly dispersing it in an organic polysiloxane resin or epoxy resin (Patent Documents 1 to 3). [Prior Art Literature] (Patent Literature)

專利文獻1:日本特開2013-091680號公報 專利文獻2:日本特開2011-153252號公報 專利文獻3:日本特開2011-153253號公報Patent Document 1: Japanese Patent Application Publication No. 2013-091680 Patent Document 2: Japanese Patent Application Publication No. 2011-153252 Patent Document 3: Japanese Patent Application Publication No. 2011-153253

[發明所欲解決的問題] 作為解決如上所述的AlN填料所具有的問題的方法,已嘗試以矽氧系聚合物等被覆AlN填料表面,來抑制AlN填料表面的水解,但當使用以聚二甲基矽氧烷與烷氧基矽烷低聚物作為主要原材料所製備的矽氧系混成預聚物來塗佈保護AlN填料表面時,亦仍然存在問題。[Problems to be Solved by the Invention] As a method for solving the problems of AlN fillers as described above, attempts have been made to cover the surface of AlN fillers with a silicone polymer or the like to suppress hydrolysis of the surface of the AlN fillers. Dimethylsiloxane and alkoxysilane oligomers are used as the main raw material for the preparation of the silica-based mixed prepolymer to protect the surface of the AlN filler, but there are still problems.

由上述矽氧系混成預聚物獲得的混成聚合物,已被提案作為一種材料,其兼具有機成分也就是矽氧樹脂的柔軟性、拒水性、脫模性等特性、及為了交聯而作為無機成分導入的烷氧基矽烷低聚物的黏合性,該材料即便連續使用溫度為200℃以上仍具有高耐熱性與柔軟性。A hybrid polymer obtained from the above-mentioned silicone-based hybrid prepolymer has been proposed as a material, which has the organic component, that is, the flexibility, water repellency, and release properties of the silicone resin, and is used for crosslinking. Adhesiveness of alkoxysilane oligomer introduced as an inorganic component, the material has high heat resistance and flexibility even at continuous use temperature of 200 ° C or higher.

然而,即便使用這種矽氧系混成預聚物,仍不容易進行使填料表面不劣化的表面處理。作為AlN填料,存在下述粒子:根據還原氮化法或直接氮化法來合成的粒徑為1μm前後的粒子、或是使其從數μm顆粒成長至20數μm為止的粒子;將1μm前後的粒子作為初級粒子使用並分散於有機溶劑系或水系溶劑中,然後適當添加黏合劑等添加劑來使其成為漿料狀,並利用噴霧乾燥機來進行造粒,然後使所造粒的顆粒在高溫的氮氣氣氛中進行燒結而成之粒子等。所獲得的AlN填料,在表面存在多個細微的凹凸,因而簡單的表面處理技術無法在表層形成薄的保護層,且膜厚易於產生不均勻性,結果成為欠缺耐久性的保護被膜。However, even if such a silica-based mixed prepolymer is used, it is not easy to perform a surface treatment that does not deteriorate the surface of the filler. As the AlN filler, there are the following particles: particles having a particle diameter of about 1 μm synthesized by a reduction nitridation method or a direct nitridation method, or particles growing from several μm particles to 20 μm particles; or about 1 μm The particles are used as primary particles and dispersed in an organic solvent-based or water-based solvent. Then, additives such as a binder are appropriately added to make it into a slurry state, and granulation is performed by a spray dryer. Particles sintered in a high-temperature nitrogen atmosphere. The obtained AlN filler has a plurality of fine irregularities on the surface. Therefore, a simple surface treatment technique cannot form a thin protective layer on the surface layer, and the film thickness is liable to cause unevenness. As a result, the protective film lacks durability.

尤其是到目前為止所開發的矽氧系混成預聚物,一般而言,為了提升耐熱性而使用了較高分子量的聚二甲基矽氧烷(PDMS)原料,因此所製備的有機-無機混成預聚物為高黏度,而難以對細微的凹凸進行均勻的表面處理,結果無法充分抑制AlN填料表面的水解的情形以維持AlN填料的高熱傳導性。又,由於高黏度,導致藉由表面處理來實行的被覆膜厚變厚,因而亦存在熱傳導率下降的問題。In particular, the silica-based hybrid prepolymers that have been developed so far generally use polydimethylsiloxane (PDMS) as a raw material in order to improve heat resistance. The mixed prepolymer has high viscosity, and it is difficult to uniformly treat fine unevenness. As a result, hydrolysis of the surface of the AlN filler cannot be sufficiently suppressed to maintain high thermal conductivity of the AlN filler. In addition, due to the high viscosity, the thickness of the coating film by the surface treatment becomes thicker, so that there is also a problem that the thermal conductivity decreases.

本發明為了提供一種能夠解決上述AlN填料的以往的問題點且耐熱性與熱傳導性優異的散熱構件,藉由使用所獲得的混成聚合物兼具耐熱性與柔軟性之矽氧系混成預聚物,在AlN填料表面形成保護層,來抑制AlN填料表面的水解,而防止熱傳導性下降。 [解決問題的技術手段]The present invention is to provide a heat-dissipating member capable of solving the conventional problems of the above-mentioned AlN filler and having excellent heat resistance and thermal conductivity. By using the obtained hybrid polymer, a silicone-based hybrid prepolymer having both heat resistance and flexibility is used. A protective layer is formed on the surface of the AlN filler to suppress the hydrolysis of the surface of the AlN filler and prevent the thermal conductivity from decreasing. [Technical means to solve the problem]

依據本發明而得的矽氧系混成聚合物被覆AlN填料,其是以表面被矽氧系混成聚合物被覆而成氮化鋁作為主成分之填料,並且,對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的導電率為350μS/cm以下。The silicon-oxygen mixed polymer-coated AlN filler obtained in accordance with the present invention is a filler mainly composed of aluminum nitride whose surface is coated with a silicon-oxygen mixed polymer, and 50 g of ion-exchanged water is added with an average of 5 g. After the filler having a particle diameter of 20 to 40 μm is maintained at a saturated water vapor pressure of 121 ° C. for 50 hours, the conductivity of water is 350 μS / cm or less.

藉由以這樣的方式進行,能夠獲得一種矽氧系混成聚合物被覆AlN填料,其能夠抑制填料表面的水解,而不損害AlN填料的熱傳導率,且不損害作為散熱構件的複合樹脂的熱傳導性。By performing in this manner, it is possible to obtain a silicon-oxygen mixed polymer-coated AlN filler, which can suppress the hydrolysis of the filler surface without impairing the thermal conductivity of the AlN filler and without impairing the thermal conductivity of the composite resin as a heat-radiating member. .

依據本發明而得的矽氧系混成聚合物被覆AlN填料,較佳是:對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的pH值為10以下。The silica-based hybrid polymer-coated AlN filler obtained according to the present invention is preferably: for 50 mL of ion-exchanged water, 5 g of the filler having an average particle diameter of 20 to 40 μm is added and maintained at a saturated water vapor pressure of 121 ° C. After 50 hours, the pH of the water was 10 or less.

依據本發明而得的矽氧系混成聚合物被覆AlN填料中,較佳是:矽氧系混成聚合物是下述固化物,該固化物包含由下述通式(1)表示的聚二甲基矽氧烷與由下述通式(2)表示的四烷氧基矽烷低聚物及/或其水解物之反應物,該聚二甲基矽氧烷的數目平均分子量(Mn)為500~3000;m是能夠滿足數目平均分子量(Mn)=500~3000的整數,且混合存在一定範圍內的整數m的分子;n表示4~10的整數,R表示碳數為1~3的烷基。In the silica-based hybrid polymer-coated AlN filler obtained according to the present invention, it is preferable that the silica-based hybrid polymer is a cured product containing polydimethylene represented by the following general formula (1) The reaction product of a polysiloxane and a tetraalkoxysilane oligomer and / or a hydrolyzate thereof represented by the following general formula (2), the number average molecular weight (Mn) of the polydimethylsiloxane is 500 ~ 3000; m is an integer capable of satisfying the number average molecular weight (Mn) = 500-3000, and mixed with an integer m within a certain range; n represents an integer of 4 to 10, and R represents an alkyl group having 1 to 3 carbon atoms.

藉由以這樣的方式進行,能夠製作一種散熱構件,其能夠防止填料劣化且功能性高。By performing in this way, it is possible to produce a heat dissipation member which can prevent deterioration of the filler and has high functionality.

這種矽氧系混成預聚物,在末端或側鏈具有反應性的矽烷醇基(OH基)或烷氧基(OR基)。這些官能基,在熱或水分的存在下容易與存在於AlN填料表面的反應性官能基(Al-OH基)反應,而形成穩定的無機鍵結(Al-O-Si-O-)。藉由此鍵結,能夠與AlN表面形成直接的鍵結,而表現作為保護膜的效果。由於以較薄的膜作為中間保護膜來表現效果,因此不會發生熱傳導率下降的情形。由於被膜具有PDMS骨架,因此富有柔軟性而能夠緩和機械性的外部應力,因而不易發生斷裂或剝離。在AlN填料表面之間形成的鍵結,亦為熱穩定,而作為散熱構件能夠穩定地使用至250℃左右的高溫為止。This siloxane system is mixed into a prepolymer and has a silanol group (OH group) or an alkoxy group (OR group) which is reactive at the terminal or side chain. These functional groups easily react with reactive functional groups (Al-OH groups) existing on the surface of the AlN filler in the presence of heat or moisture to form stable inorganic bonds (Al-O-Si-O-). By this bonding, a direct bond can be formed with the AlN surface, and the effect as a protective film can be exhibited. Since the effect is exhibited by using a thin film as an intermediate protective film, a decrease in thermal conductivity does not occur. Since the film has a PDMS skeleton, it is rich in flexibility and can relieve mechanical external stress, so it is unlikely to break or peel. The bond formed between the surfaces of the AlN filler is also thermally stable, and it can be used stably as a heat sink to a high temperature of about 250 ° C.

再者,在本說明書中,數目平均分子量(Mn),表示根據凝膠滲透層析法(GPC法)來測定而得的分子量,該凝膠滲透層析法是以聚苯乙烯作為標準物質,以四氫呋喃作為溶析液。In this specification, the number average molecular weight (Mn) refers to a molecular weight measured by a gel permeation chromatography method (GPC method), which uses polystyrene as a standard material, Tetrahydrofuran was used as the eluent.

又,本發明的矽氧系混成聚合物被覆AlN填料,在聚合物分子骨架上配置有多個甲基,由於其高拒水效果,防止水分侵入矽氧系混成聚合物/AlN填料界面的效果較大。此亦為能夠抑制AlN填料水解的主要因素之一。In addition, the silica-based hybrid polymer coated AlN filler of the present invention has a plurality of methyl groups arranged on the polymer molecular skeleton. Due to its high water-repellent effect, the effect of preventing moisture from entering the silica-based hybrid polymer / AlN filler interface Larger. This is also one of the main factors that can inhibit the hydrolysis of AlN fillers.

依據本發明而得的矽氧系混成聚合物被覆AlN填料中,更佳是由上述通式(1)表示的聚二甲基矽氧烷的數目平均分子量(Mn)為600~2000。In the silica-based hybrid polymer-coated AlN filler obtained according to the present invention, the number average molecular weight (Mn) of the polydimethylsiloxane represented by the general formula (1) is more preferably 600 to 2000.

依據本發明而得的矽氧系混成聚合物被覆AlN填料,更佳是平均粒徑為25~35μm。The silica-based hybrid polymer-coated AlN filler obtained according to the present invention preferably has an average particle diameter of 25 to 35 μm.

依據本發明而得的矽氧系混成聚合物被覆AlN填料中,要被矽氧系混成聚合物被覆的AlN填料與矽氧系混成預聚物的質量比,較佳是:相對於AlN填料100質量份,矽氧系混成預聚物為2~10質量份。In the silicon-oxygen mixed polymer-coated AlN filler obtained according to the present invention, the mass ratio of the silicon-oxygen mixed polymer-coated AlN filler and the silicon-oxygen mixed prepolymer is preferably: relative to the AlN filler 100 The mass of the silicone-based mixed prepolymer is 2 to 10 parts by mass.

依據本發明而得的散熱構件,包含上述任一種矽氧系混成聚合物被覆AlN填料。 [發明的效果]The heat dissipation member obtained according to the present invention includes any one of the above-mentioned silicon-oxygen mixed polymer-coated AlN fillers. [Effect of the invention]

如以上所述,根據本發明,能夠提供一種矽氧系混成聚合物被覆AlN填料,其顯示高熱傳導性,並且具有高耐熱性。又,根據本發明,能夠提供一種散熱構件,其長期穩定且能夠在不受環境影響的情形下使用,並且因填料水解導致特性變化的情形較少。As described above, according to the present invention, it is possible to provide a silicon-oxygen mixed polymer-coated AlN filler which exhibits high thermal conductivity and has high heat resistance. Furthermore, according to the present invention, it is possible to provide a heat radiating member which is stable for a long period of time and can be used without being affected by the environment, and there are few cases where characteristics change due to hydrolysis of the filler.

<AlN:氮化鋁> 鋁的氮化物,為絕緣性且熱傳導性高。有時直接使用以還原氮化法或直接氮化法來合成的初級粒子,亦可將以噴霧乾燥機等來進行造粒後,使其燒結來製成所謂的AlN燒結填料來使用。使用噴霧乾燥機來進行造粒的方法中,藉由調整噴霧乾燥機的噴霧條件,能夠控制顆粒的粒徑,作為結果,能夠製造具有各種粒度分佈的AlN燒結填料。再者,在本發明中,AlN填料,亦包含為了燒結助劑而添加了少量氧化釔(Y2 O3 )的AlN填料,亦包含為了控制粒徑而添加了少量氮化硼(BN)的AlN填料。<AlN: Aluminum Nitride> Aluminum nitride is insulating and has high thermal conductivity. The primary particles synthesized by the reduction nitridation method or the direct nitridation method may be used as they are, or they may be granulated by a spray dryer or the like and then sintered to form a so-called AlN sintered filler and used. In the method for granulating using a spray dryer, the particle size of the particles can be controlled by adjusting the spray conditions of the spray dryer, and as a result, AlN sintered fillers having various particle size distributions can be produced. Furthermore, in the present invention, the AlN filler also includes an AlN filler to which a small amount of yttrium oxide (Y 2 O 3 ) is added for a sintering aid, and an AlN filler to which a small amount of boron nitride (BN) is added to control a particle diameter. AlN filler.

<矽氧系混成聚合物被覆AlN填料> 使AlN填料分散於樹脂材料中來製成散熱構件時,藉由以矽氧系混成聚合物來進行被覆,能夠抑制填料水解。能夠將矽氧系混成聚合物被覆AlN填料加入離子交換水中,並利用高壓滅菌器(autoclave)等來在加壓下進行處理後,以此時的水的導電率(變化)來評估此抑制效果。本發明人發現,若將5g平均粒徑為20~40μm的AlN填料加入50mL離子交換水中,並在以121℃的飽和水蒸氣壓(2大氣壓(atm))保持50小時後,此時水的導電率被抑制至350μS/cm以下,若更確實地抑制至230μS/cm以下,則當使該AlN填料分散於矽氧系樹脂、環氧樹脂、耐綸樹脂等各種樹脂材料中、尤其是環氧樹脂中,來製成散熱構件時,能夠充分抑制熱傳導性劣化。<Silicon-based Hybrid Polymer Covered AlN Filler> When an AlN filler is dispersed in a resin material to form a heat-radiating member, the silicone-based hybrid polymer is used for coating to suppress the hydrolysis of the filler. The silica-based mixed polymer-coated AlN filler can be added to ion-exchanged water, and treated under pressure using an autoclave or the like. The suppression effect can be evaluated by the conductivity (change) of water at this time. . The inventors have found that if 5 g of AlN filler having an average particle diameter of 20 to 40 μm is added to 50 mL of ion-exchanged water and maintained at a saturated water vapor pressure (2 atmospheres (atm)) of 121 ° C. for 50 hours, When the electrical conductivity is suppressed to 350 μS / cm or less, and if it is more surely suppressed to 230 μS / cm or less, the AlN filler is dispersed in various resin materials such as silicone resin, epoxy resin, and nylon resin, especially the ring. When an oxyresin is used as a heat radiation member, it is possible to sufficiently suppress deterioration of thermal conductivity.

又,相同評估中,若水的pH值為10以下,則能夠獲得一種散熱構件,該散熱構件能夠進一步確實地充分抑制導熱性劣化。In addition, in the same evaluation, if the pH value of the water is 10 or less, a heat dissipation member can be obtained, and the heat dissipation member can more surely and sufficiently suppress deterioration in thermal conductivity.

<矽氧系混成預聚物> 作為本發明中使用的作為矽氧系混成預聚物的原料的聚二甲基矽氧烷(以後標記為PDMS),較佳是由通式(1)表示且數目平均分子量(Mn)為500~3000。<Silica-based hybrid prepolymer> Polydimethylsiloxane (hereinafter referred to as PDMS), which is a raw material of the silicon-based hybrid prepolymer used in the present invention, is preferably represented by the general formula (1) The number average molecular weight (Mn) is 500 to 3000.

此處,m是能夠滿足數目平均分子量(Mn)=500~3000的整數,且混合存在一定範圍內的整數m的分子。再者,較佳是使用具有兩末端矽烷醇基(Si-OH基)之PDMS,但使用具有末端烷氧基之PDMS亦能夠預期有相同效果,該末端烷氧基容易因水解而變成矽烷醇基。 Here, m is an integer that satisfies the number-average molecular weight (Mn) = 500 to 3000, and the integer m in a certain range is mixed. Furthermore, it is preferable to use PDMS having both terminal silanol groups (Si-OH groups), but the same effect can also be expected using PDMS having terminal alkoxy groups, and the terminal alkoxy groups easily become silanols by hydrolysis. base.

所製備的矽氧系混成預聚物的黏度會受到作為原料的PDMS的平均分子量影響,因此由高分子量的PDMS所製備的矽氧系混成預聚物,不易表現保護AlN等氮化物填料表面的效果。研究的結果,數目平均分子量(Mn)在500~3000的範圍內獲得了良好的表面處理的效果。數目平均分子量(Mn)小於500時,所獲得聚合物被覆的柔軟性變得不充分,而保護層(被覆)較硬,因此易於發生龜裂,並且可能變得易於自AlN填料表面剝離。另一方面,當使用由平均分子量超過3000的PDMS所製備的矽氧系混成預聚物時,由於高黏度,可能無法追隨AlN填料表面的細微的凹凸,而變得難以充分密合。如果考慮到保護層(被覆)的柔軟性、密合性等,PDMS的平均分子量更佳是600~2000。The viscosity of the prepared silica-based mixed prepolymer will be affected by the average molecular weight of PDMS as a raw material. Therefore, the silica-based mixed prepolymer prepared from high-molecular-weight PDMS is not easy to protect the surface of nitride fillers such as AlN. effect. As a result of the study, a good surface treatment effect was obtained in the range of the number average molecular weight (Mn) from 500 to 3000. When the number average molecular weight (Mn) is less than 500, the softness of the obtained polymer coating becomes insufficient, and the protective layer (coating) is hard, so cracking is liable to occur, and it may become easy to peel off from the surface of the AlN filler. On the other hand, when a silicone-based mixed prepolymer prepared from PDMS having an average molecular weight of more than 3000 is used, it may be impossible to follow the fine unevenness on the surface of the AlN filler due to high viscosity, and it may become difficult to sufficiently adhere. Taking into consideration the softness and adhesion of the protective layer (coating), the average molecular weight of PDMS is more preferably 600 to 2,000.

<測定聚矽氧烷(聚二甲基矽氧烷)的平均分子量> 平均分子量,是根據凝膠滲透層析法(GPC法)進行測定,並將Mn(數目平均分子量)設為平均分子量。使用聚苯乙烯作為標準試料,來測定以聚苯乙烯換算的分子量。 再者,根據GPC法來實行的以聚苯乙烯換算的分子量測定,是設為依下述的測定條件來實行。 a)測定機器:東曹公司製造的HLC-8220GPC b)管柱:東曹公司製造的 TSK-gel Super H-RC 2根 TSK-gel Super HZ2000 3根 TSK-gel Super HZ4000 1根 c)烘箱溫度:40℃ d)溶析液:四氫呋喃(THF) 0.35mL/min e)標準試料:聚苯乙烯 f)注入量:10μL g)濃度:1wt% h)製備試料:以四氫呋喃(THF)作為溶劑,並在室溫靜置來使其溶解。 i)校正:測定時,使用標準試料來作成校正曲線。<Measurement of average molecular weight of polysiloxane (polydimethylsiloxane)> The average molecular weight is measured by a gel permeation chromatography (GPC method), and Mn (number average molecular weight) is set as an average molecular weight. Using polystyrene as a standard sample, the molecular weight in terms of polystyrene was measured. The molecular weight measurement in terms of polystyrene in accordance with the GPC method was performed under the following measurement conditions. a) Measuring machine: HLC-8220GPC manufactured by Tosoh Corporation b) Tubular column: TSK-gel Super H-RC manufactured by Tosoh Corporation 2 TSK-gel Super HZ2000 3 TSK-gel Super HZ4000 1 c) Oven temperature : 40 ° C d) eluent: tetrahydrofuran (THF) 0.35mL / min e) standard sample: polystyrene f) injection volume: 10 μL g) concentration: 1wt% h) preparation sample: using tetrahydrofuran (THF) as a solvent, And let stand at room temperature to dissolve. i) Calibration: When measuring, use a standard sample to make a calibration curve.

作為矽氧系混成預聚物的無機成分來摻合的是由通式(2)表示的烷氧基矽烷低聚物及/或其水解物。Blended as an inorganic component of the siloxane-based mixed prepolymer is an alkoxysilane oligomer represented by the general formula (2) and / or a hydrolyzate thereof.

此處,n是4~10的整數,R是選自碳數為1~3的烷基,且全部可以相同,亦可以不同。能夠較佳地使用的形態,是R為乙基或甲基。這些烷氧基,由於一部分會因水解而成為矽烷醇基,因此可考慮羥基與烷氧基混合存在於分子內的狀況。 Here, n is an integer of 4 to 10, and R is an alkyl group selected from 1 to 3 carbon atoms, and all of them may be the same or different. In a preferred form, R is ethyl or methyl. Since some of these alkoxy groups become silanol groups by hydrolysis, a situation in which a hydroxyl group and an alkoxy group are mixed in the molecule can be considered.

所製備的矽氧系混成預聚物,作為原液的濃度較高,當直接使用時,作成的保護膜會變厚,而發生熱傳導率下降的情形或填料凝集的情形。因此,較理想是利用適當溶劑來加以稀釋並進行表面處理。作為溶劑,只要與矽氧系混成預聚物的相溶性高,並無特別限制,較理想是甲苯、二甲苯、三級丁醇、庚烷、甲基乙基酮等,亦取決於用途或AlN填料的形態,較理想是:以相對於稀釋後的混成預聚物溶膠總量,矽氧系混成預聚物成為10wt%以下的方式,來進行稀釋。若是超過該濃度的濃度,則會發生下述問題:無法獲得充分保護AlN表面的細微的凹凸表面的效果、或成為厚膜而熱傳導特性下降。The prepared silicon-oxygen mixed prepolymer has a high concentration as a stock solution. When it is used directly, the prepared protective film becomes thick, and the thermal conductivity decreases or the filler agglomerates. Therefore, it is desirable to use a suitable solvent for dilution and surface treatment. The solvent is not particularly limited as long as it has high compatibility with silica-based prepolymers. Toluene, xylene, tertiary butanol, heptane, methyl ethyl ketone, etc. are also preferred, depending on the application or The form of the AlN filler is preferably diluted in such a manner that the silica-based mixed prepolymer becomes 10 wt% or less relative to the total amount of the mixed prepolymer sol after dilution. When the concentration exceeds this concentration, the following problems occur: the effect of sufficiently protecting the fine uneven surface of the AlN surface cannot be obtained, or the thickness becomes a thick film, and the thermal conductivity is deteriorated.

表面處理中,是將適量AlN填料摻合至利用上述溶劑稀釋後的矽氧系混成預聚物(溶膠)液中,並藉由攪拌處理來實施AlN填料表面處理。關於混合方法,並無特別限制,能夠進行攪拌器攪拌、藉由攪拌葉片來實行的混合攪拌、行星式雙軸離心攪拌等各種方法。但是,需要使要施加表面處理的AlN填料充分均質地分散於稀釋後的混成預聚物中,並使AlN表面充分濕潤。In the surface treatment, an appropriate amount of an AlN filler is blended into a silicone-based mixed prepolymer (sol) solution diluted with the above-mentioned solvent, and the AlN filler surface treatment is performed by stirring. The mixing method is not particularly limited, and various methods such as agitator stirring, mixing stirring by a stirring blade, and planetary biaxial centrifugal stirring can be performed. However, the AlN filler to be subjected to the surface treatment needs to be sufficiently homogeneously dispersed in the diluted mixed prepolymer, and the AlN surface must be sufficiently wetted.

上述表面處理後,使用旋轉蒸發器等來使溶劑揮發,並對AlN填料反覆進行乾燥、破碎、燒結、破碎,從而獲得一種以矽氧系混成聚合物進行表面處理而成的AlN填料。再者,破碎時會發生露出斷裂面的情形,因此亦較理想是反覆進行數次這些一連串的處理。After the above surface treatment, a rotary evaporator or the like is used to volatilize the solvent, and the AlN filler is repeatedly dried, crushed, sintered, and crushed, so as to obtain an AlN filler prepared by surface-treating a silicone-based mixed polymer. In addition, the fracture surface may be exposed during crushing, so it is also desirable to repeat these series of treatments several times.

[製造矽氧系混成預聚物] 本發明中,是利用由通式(1)表示的PDMS與由通式(2)表示的四烷氧基矽烷低聚物及/或其水解物(以下,稱為矽烷低聚物)的縮合反應,在金屬化合物觸媒的存在下製備(約120℃)矽氧系混成預聚物。[Production of a siloxane-based hybrid prepolymer] In the present invention, PDMS represented by the general formula (1) and a tetraalkoxysilane oligomer and / or a hydrolysate thereof (hereinafter (Referred to as a silane oligomer), a silicon-oxygen mixed prepolymer is prepared (about 120 ° C) in the presence of a metal compound catalyst.

關於金屬化合物觸媒,存在:金屬的有機酸鹽(尤其是羧酸鹽)、醇鹽、烷基化金屬化合物、乙醯基丙酮錯合物、乙醯基乙酸乙酯錯合物、金屬醇鹽的一部分烷氧基被乙醯基丙酮基或乙醯基乙酸乙酯取代而成之金屬錯合物等;具體而言,可例示例如:辛酸鋅(2-乙基己酸鋅)、辛酸鋯(2-乙基己酸鋯)、辛酸氧鋯(2-乙基己酸氧鋯)、二月桂酸二丁基錫、二乙酸二丁基錫、雙(乙醯基丙酮基)二丁基錫、鈦酸四(2-乙基己)酯、四正丁醇鈦、四異丙醇鈦、二異丙氧基雙(乙醯基乙酸乙酯)鈦、四(乙醯基丙酮基)鈦、二-2-乙基己氧基雙(2-乙基-3-羥基己醇)鈦、二異丙氧基雙(乙醯基丙酮基)鈦、四正丙醇鋯、四正丁醇鋯、四(乙醯基丙酮基)鋯、三丁氧基單乙醯基丙酮基鋯、二丁氧基雙(乙醯基乙酸乙酯)鋯等。雖然無特別限制,但從反應性、穩定性等而言,較理想是錫(Sn)系觸媒也就是二月桂酸二丁基錫、二乙酸二丁基錫、雙(乙醯基丙酮基)二丁基錫等。Regarding metal compound catalysts, there are: metal organic acid salts (especially carboxylates), alkoxides, alkylated metal compounds, acetamidoacetone complexes, acetoacetate complexes, metal alcohols Metal complexes in which a part of the alkoxy group of the salt is substituted with ethyl acetone or ethyl acetoacetate; specifically, examples include zinc caprylate (zinc 2-ethylhexanoate), caprylic acid Zirconium (zirconyl 2-ethylhexanoate), zirconyl octoate (zirconyl 2-ethylhexanoate), dibutyltin dilaurate, dibutyltin diacetate, bis (ethylacetonyl) dibutyltin, titanate (2-ethylhexyl) ester, titanium tetra-n-butoxide, titanium tetraisopropoxide, titanium diisopropoxy bis (ethyl ethylacetate) titanium, tetra (ethyl ethyl acetone) titanium, di-2 -Ethylhexyloxybis (2-ethyl-3-hydroxyhexanol) titanium, diisopropoxybis (ethylideneacetone) titanium, tetra-n-propanol zirconium, tetra-n-butoxide zirconium, tetra ( Ethyl acetonyl) zirconium, tributoxy monoethyl acetonyl acetonyl zirconium, dibutoxy bis (ethyl ethyl acetoacetate) zirconium, and the like. Although not particularly limited, from the viewpoints of reactivity and stability, tin (Sn) -based catalysts, that is, dibutyltin dilaurate, dibutyltin diacetate, bis (ethylacetonyl) dibutyltin, etc. .

實行上述縮合反應時,為了實行四烷氧基矽烷低聚物的穩定水解,較理想是:藉由在用於反應的容器內充滿非活性氣體後的氣氛下進行加熱,來實行水解和縮合反應。作為非活性氣體,可列舉氮氣或稀有氣體類也就是18族元素(氦、氖、氬、氪、氙等)。又,可將這些氣體混合使用。作為水解的方法,可考慮下述各種方法:滴入、噴霧適量的水、以及導入水蒸氣等。根據情況,亦可考慮下述合成方法:將已進行濕度管理的乾燥空氣送入合成容器內、每隔固定時間進行減壓等。When carrying out the above-mentioned condensation reaction, in order to carry out stable hydrolysis of the tetraalkoxysilane oligomer, it is preferable to perform the hydrolysis and condensation reaction by heating in an atmosphere filled with an inert gas in the container used for the reaction. . Examples of the inert gas include nitrogen or a rare gas, that is, a group 18 element (helium, neon, argon, krypton, xenon, etc.). These gases can be used in combination. As a method of hydrolysis, various methods can be considered: dripping, spraying an appropriate amount of water, and introducing water vapor or the like. Depending on the situation, the following synthesis methods may be considered: sending dry air that has been subjected to humidity management into a synthesis container, and reducing the pressure at regular intervals.

矽氧系混成預聚物,能夠藉由下述方式獲得:在上述非活性氣體氣氛下,使含有上述四烷氧基矽烷低聚物與上述PDMS之混合物於上述縮合觸媒的存在下進行水解和縮合反應。亦即,受到水解後的上述四烷氧基矽烷低聚物的烷氧基變成矽烷醇基,且在非活性氣體的存在下與PDMS末端的矽烷醇基進行脫水反應、脫醇反應等。藉由使用矽烷低聚物,能夠在不加速易於由矽烷單體所產生的同元縮合(homocondensation)的情形下,流暢地實行PDMS與水解後的低聚物的縮合反應。藉此,使上述低聚物與上述PDMS均質地反應,而順利地進行縮合反應。The silica-based mixed prepolymer can be obtained by hydrolyzing a mixture containing the tetraalkoxysilane oligomer and the PDMS in the presence of the condensation catalyst under the inert gas atmosphere. And condensation reaction. That is, the alkoxy group of the tetraalkoxysilane oligomer after hydrolysis becomes a silanol group, and undergoes dehydration reaction, dealcoholization reaction, and the like with a silanol group at the end of PDMS in the presence of an inert gas. By using a silane oligomer, it is possible to smoothly perform a condensation reaction between PDMS and a hydrolyzed oligomer without accelerating homocondensation easily generated by a silane monomer. Thereby, the said oligomer and the said PDMS are reacted homogeneously, and a condensation reaction progresses smoothly.

再者,從長期穩定性等方面而言,亦期望在獲得上述矽氧系混成預聚物時,於上述非活性氣體氣氛下,將穩定化溶劑添加至原料液中,該原料液是由含有上述醇鹽與上述PDMS之混合物所組成。作為此穩定化溶劑,三級丁醇、庚烷、甲苯、二甲苯、甲基乙基酮等的相溶性亦高,亦能夠以前述方式作為稀釋溶劑使用。In addition, from the viewpoint of long-term stability and the like, it is also desirable to add a stabilizing solvent to a raw material liquid under the above-mentioned inert gas atmosphere when obtaining the above-mentioned silicon-oxygen mixed prepolymer. It consists of a mixture of the alkoxide and PDMS. As this stabilizing solvent, tertiary butanol, heptane, toluene, xylene, methyl ethyl ketone and the like are also highly compatible, and they can also be used as a diluting solvent in the manner described above.

[摻合比] 上述PDMS與上述四烷氧基矽烷低聚物的摻合比(PDMS/矽烷低聚物),較理想是:作為莫耳比,設在0.05~5(PDMS/矽烷低聚物=1/20~1/0.2)的範圍內,較理想是設在0.125~2.0(PDMS/矽烷低聚物=1/8~1/0.5)的範圍內,進一步較理想是設在0.25~1.0(PDMS/矽烷低聚物=1/4~1/1)的範圍內。但是,較理想是配合所使用的AlN填料的官能基量而改變此摻合比。當官能基量較多時,在上述範圍內提高四烷氧基矽烷低聚物的摻合比是理想的。若PDMS/低聚物的莫耳比在上述範圍內,則能夠流暢地實行脫水縮合反應,且變得不易在反應中或反應後發生膠化,因此變得不易發生膠化物生成的情形,而能夠獲得一種穩定的溶膠,該溶膠沒有低分子的矽氧烷殘留。[Blending ratio] The blending ratio of the PDMS and the tetraalkoxysilane oligomer (PDMS / silane oligomer) is preferably set to a molar ratio of 0.05 to 5 (PDMS / silane oligomer). (1 = 20 to 1 / 0.2), preferably in the range of 0.125 to 2.0 (PDMS / silane oligomer = 1/8 to 1 / 0.5), and more preferably in the range of 0.25 to 1.0 (PDMS / silane oligomer = 1/4 to 1/1). However, it is desirable to change the blending ratio in accordance with the functional group amount of the AlN filler used. When the amount of functional groups is large, it is desirable to increase the blending ratio of the tetraalkoxysilane oligomer within the above range. If the molar ratio of the PDMS / oligomer is within the above range, the dehydration condensation reaction can be smoothly performed, and gelation during or after the reaction becomes difficult to occur, so that it is difficult for the gelation to occur, and It is possible to obtain a stable sol without low molecular weight siloxane residues.

再者,此處所說的莫耳比,是指基於PDMS的數目平均分子量(Mn)與四烷氧基矽烷的低聚物的純度和平均分子量來計算而得的莫耳比,該PDMS的數目平均分子量是以聚苯乙烯作為標準物質,以四氫呋喃作為溶析液,並根據凝膠滲透層析法(GPC法)來測定而得。In addition, the molar ratio mentioned here refers to a molar ratio calculated based on the number average molecular weight (Mn) of PDMS and the purity and average molecular weight of the oligomer of tetraalkoxysilane, and the number of PDMS The average molecular weight was determined by gel permeation chromatography (GPC method) using polystyrene as a standard material and tetrahydrofuran as an eluent.

<AlN填料的表面處理> 以相對於AlN填料100質量份,矽氧系混成預聚物成為2~10質量份、較理想是成為2.5~6質量份的方式,將以溶劑進行稀釋後的混成預聚物溶膠混合至AlN填料中,並實行攪拌混合處理。在室溫繼續進行處理5小時以上、較理想是10小時以上、進一步較理想是24小時以上。然後,在減壓下去除溶劑,從而獲得一種表面附著有混成預聚物之AlN凝集體。藉由對此凝集體進行熱處理,能夠獲得一種AlN填料,該AlN填料在表面形成有混成預聚物硬化層且耐久性高。此AlN填料,由於耐水性優異,因此例如當添加至環氧樹脂等親水性樹脂中時,熱傳導性等特性不會劣化。<Surface treatment of AlN filler> The silicon-based mixed prepolymer is 2 to 10 parts by mass, and more preferably 2.5 to 6 parts by mass with respect to 100 parts by mass of the AlN filler. The prepolymer sol was mixed into the AlN filler and subjected to agitation and mixing treatment. The treatment is continued at room temperature for 5 hours or more, preferably 10 hours or more, and more preferably 24 hours or more. Then, the solvent was removed under reduced pressure to obtain an AlN aggregate with a prepolymer mixed on the surface. By heat-treating the agglomerates, an AlN filler can be obtained. The AlN filler has a mixed prepolymer hardened layer formed on the surface and has high durability. Since this AlN filler is excellent in water resistance, when it is added to a hydrophilic resin such as an epoxy resin, characteristics such as thermal conductivity are not deteriorated.

相較於以往的方法也就是使用各種偶合劑或矽氧油、矽氧樹脂的情況,本發明的矽氧系混成聚合物被覆AlN填料的耐水性非常高,並且亦不包含像磷酸系處理劑這種會腐蝕金屬構件這樣的成分,因此亦能夠對於環氧樹脂等親水性樹脂或矽氧橡膠、耐綸樹脂等具有吸水性的樹脂使用,並且能夠在不限定用途或適用的地方的情形下使用。進一步,富有柔軟性的被膜,即便是揉合樹脂等應力高的加工處理,亦不會斷裂。 [實施例]Compared with the conventional method, that is, when various coupling agents, silicone oils, and silicone resins are used, the silicone-based hybrid polymer-coated AlN filler of the present invention has very high water resistance, and does not include a phosphoric acid-based treatment agent. Such a component that corrodes metal members can also be used for hydrophilic resins such as epoxy resins, or water-absorbent resins such as silicone rubber and nylon resin, and can be used in applications where the use or application is not limited. use. Furthermore, the flexible film does not break even in high-stress processing such as kneading resin. [Example]

使用實施例,進一步具體地說明本發明。 再者,實施例中的「份」、「%」只要沒有特別記載,皆是以質量為基準(質量份、質量%)。又,本發明,完全不受限於這些實施例。The present invention will be described more specifically using examples. In addition, "part" and "%" in an Example are based on mass (mass part, mass%) as long as there is no special description. The present invention is not limited to these examples at all.

<合成矽氧系混成預聚物> (製備A液) 使安裝有攪拌裝置、溫度計、滴液管路之反應容器中充分充滿氮氣。此時,作為氮氣,是使用藉由氮氣製造裝置(日本優耐克司股份有限公司製造的UNX-200)所製造的氮氣。合成時是使用2L容器,並以約1kg的規模來實施合成。<Synthetic silica-based mixed prepolymer> (Preparation of liquid A) The reaction vessel equipped with a stirring device, a thermometer, and a dripping line is sufficiently filled with nitrogen. At this time, as the nitrogen gas, nitrogen gas produced by a nitrogen production apparatus (UNX-200 manufactured by Japan Unix Corporation) was used. The synthesis was carried out on a scale of about 1 kg using a 2L container.

繼而,在充分充滿上述氮氣後的上述反應容器內,將兩末端具有矽烷醇基之聚二甲基矽氧烷(PDMS)、與四烷氧基矽烷的低聚物裝入反應容器中,並將合成容器升溫至120℃為止後,加入縮合觸媒,進一步在120℃攪拌30分鐘來使其反應。然後,自然冷卻至室溫為止,並摻合三級丁醇作為稀釋溶劑,而獲得A液。Then, in the reaction vessel sufficiently filled with the nitrogen gas, a polydimethylsiloxane (PDMS) having a silanol group at both ends and an oligomer with a tetraalkoxysilane were charged into the reaction vessel, and After the synthesis vessel was heated up to 120 ° C, a condensation catalyst was added, and the reaction was further stirred at 120 ° C for 30 minutes. Then, it was left to cool to room temperature, and tertiary butanol was mixed as a diluting solvent to obtain a liquid A.

(製備B液) 將四烷氧基矽烷的低聚物與有機金屬化合物投入與上述不同的反應容器中,並在室溫攪拌,而獲得透明的B液。(Preparation of liquid B) A tetraalkoxysilane oligomer and an organometallic compound were put into a reaction container different from the above, and stirred at room temperature to obtain a transparent liquid B.

(實施例1) (製備A-1液) 所使用的原材料是使用:PDMS,為Momentive公司製造的兩末端矽烷醇聚二甲基矽氧烷XC96-723(數目平均分子量:Mn=680);四乙氧基矽烷(TEOS)低聚物,為矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 40(四乙氧基矽烷的直鏈狀4~6聚物也就是低聚物,低聚物純度:70質量%,平均分子量:745);稀釋溶液,為三級丁醇(和光純藥工業股份有限公司製造,和光特級);縮合觸媒,為二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260);並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Example 1) (Preparation of liquid A-1) The raw materials used were: PDMS, a two-terminal silanol polydimethylsiloxane XC96-723 (number average molecular weight: Mn = 680) manufactured by Momentive; Teethoxysilane (TEOS) oligomer is ethyl silicate, Silicate 40 (tetraethoxysilane straight-chain 4-6 polymer, also known as oligomer, manufactured by Tama Chemical Industry Co., Ltd. Polymer purity: 70% by mass, average molecular weight: 745); dilute solution, tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade); condensation catalyst, dibutyltin dilaurate (Kyoto Pharmaceutical Co., Ltd. Co., Ltd. (KS-1260); and synthesis was performed on a scale of about 1 kg. The blending amount of each raw material is as follows.

莫耳比:PDMS(XC96-723)為185.6g,TEOS低聚物(Silicate 40)為813.4g,且XC96-723與Silicate 40的純低聚物成分的莫耳比為1:2.8。添加1.0g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Molar ratio: PDMS (XC96-723) is 185.6 g, TEOS oligomer (Silicate 40) is 813.4 g, and the molar ratio of pure oligomer components of XC96-723 and Silicate 40 is 1: 2.8. 1.0 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

(製備B液) 所使用的原材料是:TEOS低聚物,為多摩化學工業股份有限公司製造的Silicate 45(四乙氧基矽烷的直鏈狀8~10聚物也就是低聚物,低聚物純度:95質量%,平均分子量:1282);有機金屬化合物,為2-乙基己酸鋅(日本化學工業股份有限公司製造的NIKKA OCTHIX ZINC 18%,分子量:351.79);稀釋溶液,為三級丁醇。摻合量如以下所述。(Preparation of liquid B) The raw materials used are: TEOS oligomer, Silicate 45 (tetraethoxysilane straight-chain 8 to 10 polymer, also known as oligomer, oligomer) manufactured by Tama Chemical Industry Co., Ltd. Material purity: 95% by mass, average molecular weight: 1282); organometallic compound, zinc 2-ethylhexanoate (NIKKA OCTHIX ZINC manufactured by Nippon Chemical Industry Co., Ltd. 18%, molecular weight: 351.79); diluted solution, three Butanol. The blending amount is as described below.

莫耳比:TEOS低聚物(Silicate 45)為76g,2-乙基己酸鋅(NIKKA OCTHIX ZINC 18%)為24g。Ethyl Silicate 45與2-乙基己酸鋅的莫耳比為1:1.2。摻合10g三級丁醇作為稀釋溶劑。Molar ratio: 76 g of TEOS oligomer (Silicate 45) and 24 g of zinc 2-ethylhexanoate (NIKKA OCTHIX ZINC 18%). The molar ratio of Ethyl Silicate 45 to zinc 2-ethylhexanoate is 1: 1.2. 10 g of tertiary butanol was blended as a dilution solvent.

(製備表面處理劑C-1液) 將A-1液的總量與B液的總量混合並加以攪拌,而獲得C-1液。(Preparation of surface treatment agent C-1 liquid) The total amount of the A-1 liquid and the total amount of the B liquid were mixed and stirred to obtain a C-1 liquid.

(表面處理方法) 以相對於填料(氮化鋁:古河電子公司製造的FAN-f30,平均粒徑為約30μm)100質量份,預聚物成為3質量份的方式,來加入C-1液,進一步加入100質量份三級丁醇,並在40℃攪拌24小時後,以旋轉蒸發器進行減壓乾燥來使其成為粉末狀態。然後,以200℃實行熱處理4小時,進一步實行碎解處理。被矽氧系混成聚合物被覆的AlN填料的平均粒徑亦為約30μm。(Surface treatment method) The C-1 solution was added to 100 parts by mass of a filler (aluminum nitride: FAN-f30 manufactured by Furukawa Electronics Co., Ltd., with an average particle diameter of about 30 μm) and 3 parts by mass of the prepolymer. 100 parts by mass of tertiary butanol was further added, and the mixture was stirred at 40 ° C. for 24 hours, and then dried under reduced pressure on a rotary evaporator to make it into a powder state. Then, heat treatment was performed at 200 ° C for 4 hours, and further disintegration treatment was performed. The average particle diameter of the AlN filler coated with the silica-based mixed polymer was also about 30 μm.

再者,平均粒徑是使用思百吉股份有限公司製造的雷射繞射式粒度分佈測定裝置MASTERSIZER 3000,以乾式進行測定。The average particle diameter was measured dry using a laser diffraction particle size distribution measuring device MASTERSIZER 3000 manufactured by Spikey Corporation.

(實施例2~4) (製備A-2、3、4液) 所使用的原材料是使用:PDMS,為Momentive公司製造的兩末端矽烷醇聚二甲基矽氧烷XC96-723(數目平均分子量:Mn=680);TEOS低聚物,為矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 45(四乙氧基矽烷的直鏈狀8~10聚物也就是低聚物,低聚物純度:95質量%,平均分子量:1282);稀釋溶液,為三級丁醇(和光純藥工業股份有限公司製造,和光特級);縮合觸媒,為二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260);並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Examples 2 to 4) (Preparation of liquids A-2, 3, and 4) The raw materials used were: PDMS, a two-terminal silanol polydimethylsiloxane XC96-723 (number average molecular weight) manufactured by Momentive. : Mn = 680); TEOS oligomer is ethyl silicate, Silicate 45 (tetraethoxysilane straight-chain 8 to 10 polymer, also known as oligomer, oligomer) manufactured by Tama Chemical Industry Co., Ltd. Material purity: 95% by mass, average molecular weight: 1282); diluted solution, tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., Heguang Special Grade); condensation catalyst, dibutyltin dilaurate (Kyodo Pharmaceutical Co., Ltd. limited) KS-1260 manufactured by the company); and synthesis was performed on a scale of about 1 kg. The blending amount of each raw material is as follows.

A-2液:莫耳比,PDMS(XC96-723)為117.0g,TEOS低聚物(Silicate 45)為882.4g,且XC96-723與Silicate 45的純低聚物成分的莫耳比為1:3.8。添加0.65g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Liquid A-2: Molar ratio, PDMS (XC96-723) is 117.0g, TEOS oligomer (Silicate 45) is 882.4g, and the molar ratio of pure oligomer components of XC96-723 and Silicate 45 is 1 : 3.8. 0.65 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

A-3液:莫耳比,PDMS(XC96-723)為209.4g,TEOS低聚物(Silicate 45)為789.5g,且XC96-723與Silicate 45的純低聚物成分的莫耳比為1:1.9。添加1.2g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Liquid A-3: Molar ratio, PDMS (XC96-723) is 209.4g, TEOS oligomer (Silicate 45) is 789.5g, and the molar ratio of pure oligomer components of XC96-723 and Silicate 45 is 1 : 1.9. As a condensation catalyst, 1.2 g of dibutyltin dilaurate was added. 150 g of tertiary butanol was blended as a dilution solvent.

A-4液:莫耳比,PDMS(XC96-723)為150.1g,TEOS低聚物(Silicate 45)為849.0g,且XC96-723與Silicate 45的純低聚物成分的莫耳比為1:2.9。添加0.8g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Liquid A-4: Molar ratio, PDMS (XC96-723) is 150.1g, TEOS oligomer (Silicate 45) is 849.0g, and the molar ratio of pure oligomer components of XC96-723 and Silicate 45 is 1 : 2.9. 0.8 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

(製備表面處理劑C-2、3、4液) 將A-2、3、4液各自的總量與B液的總量混合並加以攪拌,而獲得C-2、3、4液。(Preparation of liquids C-2, 3, and 4) The total amount of each of liquids A-2, 3, and 4 and the total amount of liquid B were mixed and stirred to obtain liquids C-2, 3, and 4.

(表面處理方法) 分別以相對於填料(氮化鋁:古河電子公司製造的FAN-f30)100質量份,預聚物成為3質量份的方式,來加入C-2、3、4液,進一步加入100質量份三級丁醇,並在40℃攪拌24小時後,以旋轉蒸發器進行減壓乾燥來使其成為粉末狀態。然後,以200℃實行熱處理4小時,進一步實行碎解處理。被矽氧系混成聚合物被覆而成的AlN填料的平均粒徑亦為約30μm。(Surface treatment method) C-2, 3, and 4 liquids were added to 100 parts by mass of the filler (aluminum nitride: FAN-f30 manufactured by Furukawa Electronics Co., Ltd.), and 3 parts by mass of the prepolymer were further added. After adding 100 parts by mass of tertiary butanol and stirring at 40 ° C. for 24 hours, it was dried under reduced pressure on a rotary evaporator to make it into a powder state. Then, heat treatment was performed at 200 ° C for 4 hours, and further disintegration treatment was performed. The average particle diameter of the AlN filler coated with the siloxane-based mixed polymer was also about 30 μm.

(實施例5) (製備A-5液) 所使用的原材料是使用:PDMS,為Gelest公司製造的兩末端矽烷醇聚二甲基矽氧烷DMS-S14(數目平均分子量:Mn=1500);TEOS低聚物,為矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 45(四乙氧基矽烷的直鏈狀8~10聚物也就是低聚物,低聚物純度:95質量%,平均分子量:1282);稀釋溶液,為三級丁醇(和光純藥工業股份有限公司製造,和光特級);縮合觸媒,為二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260);並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Example 5) (Preparation of liquid A-5) The raw materials used were: PDMS, a two-terminal silanol polydimethylsiloxane DMS-S14 (number average molecular weight: Mn = 1500) manufactured by Gelest Company; TEOS oligomer is ethyl silicate, Silicate 45 (tetraethoxysilane linear 8 to 10 oligomer is also an oligomer, manufactured by Tama Chemical Industry Co., Ltd., purity of oligomer: 95% by mass , Average molecular weight: 1282); dilute solution, tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., Heguang special grade); condensation catalyst, dibutyltin dilaurate (KS-1260, manufactured by Kyoho Pharmaceutical Co., Ltd.) ); And the synthesis was performed on a scale of about 1 kg. The blending amount of each raw material is as follows.

莫耳比:PDMS(DMS-S14)為226.2g,TEOS低聚物(Silicate 45)為773.2g,且DMS-S14與Silicate 45的純低聚物成分的莫耳比為1:3.8。添加0.6g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Molar ratio: PDMS (DMS-S14) is 226.2 g, TEOS oligomer (Silicate 45) is 773.2 g, and the molar ratio of pure oligomer components of DMS-S14 and Silicate 45 is 1: 3.8. 0.6 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

(製備表面處理劑C-5液) 將A-5液的總量與B液的總量混合並加以攪拌,而獲得C-5液。(Preparation of liquid C-5 for surface treatment) The total amount of liquid A-5 and the total amount of liquid B were mixed and stirred to obtain a liquid C-5.

(表面處理方法) 將預聚物量設為5質量份,此外則與C-1~C-4液的情況同樣地,以C-5液對填料(氮化鋁:古河電子公司製造的FAN-f30)進行表面處理,從而獲得一種平均粒徑為約30μm的被矽氧系混成聚合物被覆而成的AlN填料。(Surface treatment method) The amount of the prepolymer was set to 5 parts by mass, and in the same manner as in the case of the C-1 to C-4 liquid, the filler was filled with the C-5 liquid (aluminum nitride: FAN- manufactured by Furukawa Electronics Co., Ltd.). f30) performing surface treatment to obtain an AlN filler coated with a silicon-oxygen-based hybrid polymer having an average particle diameter of about 30 μm.

(比較例1) (製備A-6液) 所使用的原材料是使用:PDMS,為Gelest公司製造的兩末端矽烷醇聚二甲基矽氧烷DMS-S15(數目平均分子量:Mn=3500);低聚物,為矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 45(四乙氧基矽烷的直鏈狀8~10聚物也就是低聚物,低聚物純度:95質量%,平均分子量:1282);稀釋溶液,為三級丁醇(和光純藥工業股份有限公司製造,和光特級);縮合觸媒,為二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260);並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Comparative Example 1) (Preparation of liquid A-6) The raw material used was: PDMS, a two-terminal silanol polydimethylsiloxane DMS-S15 (number average molecular weight: Mn = 3500) manufactured by Gelest Company; The oligomer is ethyl silicate, Silicate 45 (tetraethoxysilane, linear 8 to 10 oligomer, also known as oligomer, manufactured by Tama Chemical Industry Co., Ltd., purity of oligomer: 95% by mass, Average molecular weight: 1282); Diluted solution is tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade); condensation catalyst is dibutyltin dilaurate (KS-1260 manufactured by Kyoho Pharmaceutical Co., Ltd.) And carry out the synthesis on a scale of about 1 kg. The blending amount of each raw material is as follows.

莫耳比:PDMS(DMS-S15)為405.5g,TEOS低聚物(Silicate 45)為594.1g,且DMS-S15與Silicate 45的純低聚物成分的莫耳比為1:3.8。添加0.4g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Molar ratio: PDMS (DMS-S15) is 405.5 g, TEOS oligomer (Silicate 45) is 594.1 g, and the molar ratio of pure oligomer components of DMS-S15 and Silicate 45 is 1: 3.8. 0.4 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

(製備表面處理劑C-6液) 將A-6液的總量與B液的總量混合並加以攪拌,而獲得C-6液。(Preparation of surface treatment agent C-6 liquid) The total amount of the A-6 liquid and the total amount of the B liquid were mixed and stirred to obtain a C-6 liquid.

(表面處理方法) 將預聚物量設為10質量份,此外則與C-1~C-4液的情況同樣地,以C-6液對填料(氮化鋁:古河電子公司製造的FAN-f30)進行表面處理,從而獲得一種平均粒徑為約30μm的被矽氧系混成聚合物被覆而成的AlN填料。(Surface treatment method) The amount of the prepolymer was set to 10 parts by mass, and in the same manner as in the case of the C-1 to C-4 liquid, the filler was filled with the C-6 liquid (aluminum nitride: FAN- manufactured by Furukawa Electronics Co., Ltd.). f30) performing surface treatment to obtain an AlN filler coated with a silicon-oxygen-based hybrid polymer having an average particle diameter of about 30 μm.

(比較例2) (製備A-7液) PDMS是使用JNC公司製造的兩末端矽烷醇聚二甲基矽氧烷FM9915(數目平均分子量:Mn=5000),TEOS低聚物是使用矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 40(四乙氧基矽烷的直鏈狀4~6聚物也就是低聚物,低聚物純度:70質量%,平均分子量:745),稀釋溶液是使用三級丁醇(和光純藥工業股份有限公司製造,和光特級),縮合觸媒是使用二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260),並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Comparative Example 2) (Preparation of liquid A-7) PDMS was a two-terminal silanol polydimethylsiloxane FM9915 (number average molecular weight: Mn = 5000) manufactured by JNC, and TEOS oligomer was ethyl silicate. Ester, Silicate 40 (straight-chain 4 to 6 polymer of tetraethoxysilane, which is an oligomer, purity of oligomer: 70% by mass, average molecular weight: 745) manufactured by Tama Chemical Industry Co., Ltd., diluted solution It uses tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., and Wako special grade), and the condensation catalyst is dibutyltin dilaurate (KS-1260 manufactured by Kyoho Pharmaceutical Co., Ltd.). Implement synthesis. The blending amount of each raw material is as follows.

莫耳比:PDMS(FM9915)為626.3g,TEOS低聚物(Silicate 40)為373.3g,且FM9915與Silicate 40的純低聚物成分的莫耳比為1:2.8。添加0.5g二月桂酸二丁基錫作為縮合觸媒。摻合150g三級丁醇作為稀釋溶劑。Molar ratio: PDMS (FM9915) is 626.3 g, TEOS oligomer (Silicate 40) is 373.3 g, and the molar ratio of pure oligomer components of FM9915 and Silicate 40 is 1: 2.8. 0.5 g of dibutyltin dilaurate was added as a condensation catalyst. 150 g of tertiary butanol was blended as a dilution solvent.

(製備表面處理劑C-7液) 將A-7液的總量與B液的總量混合並加以攪拌,而獲得C-7液。(Preparation of surface treatment agent C-7 liquid) The total amount of the A-7 liquid and the total amount of the B liquid were mixed and stirred to obtain a C-7 liquid.

(表面處理方法) 將預聚物量設為10質量份,此外則與C-1~C-4液的情況同樣地,以C-7液對填料(氮化鋁:古河電子公司製造的FAN-f30)進行表面處理,從而獲得一種平均粒徑為約30μm的被矽氧系混成聚合物被覆而成的AlN填料。(Surface treatment method) The amount of the prepolymer was set to 10 parts by mass, and in the same manner as in the case of the C-1 to C-4 liquids, the filler was filled with the C-7 liquid (aluminum nitride: FAN- manufactured by Furukawa Electronics Co., Ltd.). f30) performing surface treatment to obtain an AlN filler coated with a silicon-oxygen-based hybrid polymer having an average particle diameter of about 30 μm.

(比較例3) (製備A-8’液) PDMS是使用JNC公司製造的兩末端矽烷醇聚二甲基矽氧烷FM9926(數目平均分子量:Mn=20000),低聚物是使用矽酸乙酯,多摩化學工業股份有限公司製造的Silicate 40(四乙氧基矽烷的直鏈狀4~6聚物也就是低聚物,低聚物純度:70質量%,平均分子量:745),稀釋溶液是使用三級丁醇(和光純藥工業股份有限公司製造,和光特級),縮合觸媒是使用二月桂酸二丁基錫(共同藥品股份有限公司製造的KS-1260),並以約1kg的規模來實施合成。各原料的摻合量如以下所述。(Comparative Example 3) (Preparation of A-8 'solution) PDMS was a two-terminal silanol polydimethylsiloxane FM9926 (number average molecular weight: Mn = 20,000) manufactured by JNC, and ethyl silicate was used for the oligomer. Ester, Silicate 40 (straight-chain 4 to 6 polymer of tetraethoxysilane, which is an oligomer, purity of oligomer: 70% by mass, average molecular weight: 745) manufactured by Tama Chemical Industry Co., Ltd., diluted solution It uses tertiary butanol (manufactured by Wako Pure Chemical Industries, Ltd., and Wako special grade), and the condensation catalyst is dibutyltin dilaurate (KS-1260 manufactured by Kyoho Pharmaceutical Co., Ltd.). Implement synthesis. The blending amount of each raw material is as follows.

莫耳比:PDMS(FM9926)為609.1g,低聚物(Silicate 40)為90.8g,且Silicate 40的純低聚物成分相對於FM9926的莫耳比為1:2.8。添加0.18g二月桂酸二丁基錫作為縮合觸媒。摻合105g三級丁醇作為稀釋溶劑。 (製備A-8液) 將345g比較例3中使用的A-7液與805gA-8’液混合,來製作1150g的溶膠,並設為A-8液。Molar ratio: PDMS (FM9926) is 609.1 g, oligomer (Silicate 40) is 90.8 g, and the pure oligomer component of Silicate 40 with respect to FM9926 is 1: 2.8. As a condensation catalyst, 0.18 g of dibutyltin dilaurate was added. As a dilution solvent, 105 g of tertiary butanol was blended. (Preparation of A-8 solution) 345 g of the A-7 solution used in Comparative Example 3 and 805 g of the A-8 'solution were mixed to prepare 1150 g of a sol, and the solution was set to A-8 solution.

(製備表面處理劑C-8液) 將A-8液的總量與B液的總量混合並加以攪拌,而獲得C-8液。(Preparation of surface treatment agent C-8 liquid) The total amount of the A-8 liquid and the total amount of the B liquid were mixed and stirred to obtain a C-8 liquid.

(表面處理方法) 將預聚物量設為10質量份,此外則與C-1~C-4液的情況同樣地,以C-8液對填料(氮化鋁:古河電子公司製造的FAN-f30)進行表面處理,從而獲得一種平均粒徑為約30μm的被矽氧系混成聚合物被覆而成的AlN填料。(Surface treatment method) The amount of the prepolymer was set to 10 parts by mass, and in the same manner as in the case of the C-1 to C-4 liquids, the filler was filled with the C-8 liquid (aluminum nitride: FAN- manufactured by Furukawa Electronics Co., Ltd.). f30) performing surface treatment to obtain an AlN filler coated with a silicon-oxygen-based hybrid polymer having an average particle diameter of about 30 μm.

(比較例4) 設為分子量低且不含PDMS成分,而僅以TEOS低聚物成分來實施表面處理。所使用的原料,是TEOS低聚物(多摩化學工業股份有限公司製造的Silicate 45,四乙氧基矽烷的直鏈狀8~10聚物也就是低聚物,低聚物純度:95質量%,平均分子量:1282)。(Comparative example 4) It is set as low molecular weight and does not contain a PDMS component, and only surface treatment is performed with a TEOS oligomer component. The raw materials used are TEOS oligomers (Silicate 45 manufactured by Tama Chemical Industry Co., Ltd., linear 8 to 10 oligomers of tetraethoxysilane, that is, oligomers, oligomer purity: 95% by mass , Average molecular weight: 1282).

(表面處理方法) 以相對於填料(氮化鋁:古河電子公司製造的FAN-f30)100質量份成為10質量份的方式,來加入多摩化學工業股份有限公司製造的Silicate 45,一面進行加熱一面攪拌,並進行乾燥後,使其成為粉末狀態。然後,以200℃實行最終熱處理4小時,從而獲得一種平均粒徑為約30μm的被矽氧系混成物被覆而成的AlN填料。(Surface treatment method) Silicate 45 manufactured by Tama Chemical Industry Co., Ltd. is added so that 100 parts by mass of filler (aluminum nitride: FAN-f30 manufactured by Furukawa Electronics Co., Ltd.) becomes 10 parts by mass, and heating is performed while heating After being stirred and dried, it was brought into a powder state. Then, a final heat treatment was performed at 200 ° C. for 4 hours to obtain an AlN filler coated with a silicone-based mixture having an average particle diameter of about 30 μm.

(比較例5~7) 作為未實施表面處理的氮化鋁填料,準備H Grade (平均粒徑為1μm)、FAN-f30(平均粒徑為30μm)、FAN-f80(平均粒徑為80μm)3種(皆為古河電子公司製造)。(Comparative Examples 5 to 7) As the aluminum nitride filler without surface treatment, H Grade (average particle diameter: 1 μm), FAN-f30 (average particle diameter: 30 μm), and FAN-f80 (average particle diameter: 80 μm) were prepared. Three types (all manufactured by Furukawa Electronics).

<評估方法> [關於pH值測定方法與導電率測定方法] 將5g實施例1~5及比較例1~4中製作的各表面處理AlN填料和比較例5~7中準備的各表面未處理AlN填料,裝入聚四氟乙烯製的容器中,並加入50mL離子交換水,然後以鋁箔覆蓋玻璃容器口部,並在高壓滅菌器中於121℃保持50小時。然後,靜置至變成常溫為止,並測定濾液的pH值與導電率。<Evaluation Method> [About pH measurement method and conductivity measurement method] 5 g of each surface-treated AlN filler prepared in Examples 1 to 5 and Comparative Examples 1 to 4 and each surface prepared in Comparative Examples 5 to 7 were untreated. The AlN filler was put into a container made of polytetrafluoroethylene, and 50 mL of ion-exchanged water was added. Then, the mouth of the glass container was covered with aluminum foil, and kept in an autoclave at 121 ° C. for 50 hours. Then, it stood still until it became normal temperature, and measured the pH value and electrical conductivity of a filtrate.

pH值和導電率,是使用Eutech公司製造的pH值複合測定器來求得處理前後的水的數值。將各實施例、比較例的組成與評估結果整理並出示於表1~3中。The pH value and the electrical conductivity are values of water before and after treatment using a pH composite measuring device manufactured by Eutech. The compositions and evaluation results of the examples and comparative examples are summarized and shown in Tables 1 to 3.

[表1] [Table 1]

[表2] [Table 2]

[表3] [table 3]

<評估結果> 由pH值與導電率的結果可知,相較於比較例1~4的表面處理填料,藉由下述方式製備的被矽氧系混成聚合物被覆而成的AlN填料(實施例1~5)抑制了水解:使用數目平均分子量為1500以下的PDMS來作為原料的PDMS,並與TEOS低聚物進行縮合反應。藉由下述方式製備的被矽氧系混成聚合物被覆而成的AlN填料(比較例1~3)的抑制水解的效果較小:使用數目平均分子量為3500以上的PDMS來作為原料的PDMS。又,僅使用了TEOS低聚物之AlN填料(比較例4),由於其被膜的柔軟性不充分,因此與未處理的填料(比較例5~7)同等。再者,由未處理的AlN填料的結果亦可知,對於因表面的水解而導致pH值變化、導電率變化的情形,粒徑的影響並不大。<Evaluation Results> As can be seen from the results of pH and electrical conductivity, compared to the surface-treated fillers of Comparative Examples 1 to 4, an AlN filler (coated with a silicone-based hybrid polymer) prepared by the following method (Example) 1 to 5) Hydrolysis is suppressed: PDMS having a number average molecular weight of 1500 or less is used as a PDMS as a raw material, and a condensation reaction with a TEOS oligomer is performed. An AlN filler (Comparative Examples 1 to 3) coated with a silica-based mixed polymer prepared by the following method has a small effect of suppressing hydrolysis: PDMS having a number average molecular weight of 3500 or more is used as a PDMS as a raw material. In addition, an AlN filler (Comparative Example 4) using only TEOS oligomer was not as flexible as the film, and therefore was equivalent to an untreated filler (Comparative Examples 5 to 7). Furthermore, it can be seen from the results of the untreated AlN filler that the particle size is not greatly affected in the case where the pH value changes and the conductivity changes due to surface hydrolysis.

<散熱構件的熱傳導率的評估> (評估1) 作為包含依據本發明而得的矽氧系混成聚合物被覆AlN填料之散熱構件的一例,是用下述方式來製作熱傳導薄片。亦即,將10份硬化劑(味之素Fine-Techno公司製造的硬化劑AJICURE AH-154)、320份平均粒徑為約30μm的在實施例3中獲得的矽氧系混成聚合物被覆AlN填料(AlN填料:古河電子股份有限公司製造的FAN-f30),投入已裝有100份環氧樹脂(三菱化學股份有限公司製造的環氧樹脂Epikote 828)的聚丙烯製燒杯中,並以使其均勻的方式利用螺旋槳攪拌器(propeller agitator)進行混合10分鐘。使用陶瓷三輥磨機來進一步揉合所獲得的複合物(compound)10分鐘,並加以回收。以聚甲基戊烯樹脂薄膜來包夾所回收的複合物,並以拉伸輥來成形為大小為約100mm×150mm且厚度為0.5mm的薄片狀。在暖風循環式乾燥機中對所成形的薄片進行150℃×6小時的加熱,從而獲得橡膠薄片狀的熱傳導薄片。此薄片的熱傳導率為3.0W・m-1 ・K-1<Evaluation of Thermal Conductivity of Heat Dissipating Member> (Evaluation 1) As an example of a heat dissipating member containing a silicone-based hybrid polymer-coated AlN filler obtained in accordance with the present invention, a thermally conductive sheet was produced in the following manner. That is, 10 parts of a hardener (AJICURE AH-154 made by Ajinomoto Fine-Techno Co., Ltd.) and 320 parts of a silicon-oxygen mixed polymer obtained in Example 3 with an average particle diameter of about 30 μm were coated with AlN. The filler (AlN filler: FAN-f30 manufactured by Furukawa Electronics Co., Ltd.) was put into a polypropylene beaker containing 100 parts of epoxy resin (epikote 828 epoxy resin manufactured by Mitsubishi Chemical Corporation), and the Its homogeneous way was mixed with a propeller agitator for 10 minutes. A ceramic three-roll mill was used to further knead the obtained compound for 10 minutes and was recovered. The recovered composite was sandwiched with a polymethylpentene resin film, and formed into a sheet shape having a size of about 100 mm × 150 mm and a thickness of 0.5 mm by a stretching roll. The formed sheet was heated at 150 ° C. for 6 hours in a warm air circulation dryer to obtain a rubber sheet-like heat conductive sheet. The thermal conductivity of this sheet is 3.0 W ・ m -1 ・ K -1 .

對此熱傳導薄片進行200小時的耐壓力鍋試驗(PCT,將純水、試樣薄片裝入高壓滅菌器中,在121℃×100%相對溼度(RH)、2atm的條件下)後進行熱傳導率的測定,結果為3.0W・m-1 ・K-1 。未確認到劣化。This heat conductive sheet was subjected to a pressure cooker test for 200 hours (PCT, pure water and sample sheets were placed in an autoclave, under the conditions of 121 ° C. × 100% relative humidity (RH), 2 atm), and then the thermal conductivity was measured. As a result of measurement, it was 3.0 W ・ m -1 ・ K -1 . No deterioration was confirmed.

(評估2) 使用實施例2中獲得的矽氧系混成聚合物被覆AlN填料作為矽氧系混成聚合物被覆AlN填料,此外則與評估1同樣地進行,來獲得橡膠薄片狀的熱傳導薄片。此薄片的熱傳導率為3.0W・m-1 ・K-1(Evaluation 2) The silicone-based hybrid polymer-coated AlN filler obtained in Example 2 was used as the silicone-based hybrid polymer-coated AlN filler, and the same procedure as in Evaluation 1 was performed to obtain a rubber sheet-like heat conductive sheet. The thermal conductivity of this sheet is 3.0 W ・ m -1 ・ K -1 .

對此熱傳導薄片進行200小時的PCT(將純水、試樣薄片裝入高壓滅菌器中,在121℃×100%RH、2atm的條件下)後進行熱傳導率的測定,結果為2.8W・m-1 ・K-1 。幾乎未確認到劣化。This thermally conductive sheet was subjected to PCT for 200 hours (filled with pure water and sample sheet in an autoclave under the conditions of 121 ° C × 100% RH, 2 atm), and the thermal conductivity was measured. The result was 2.8 W2.8m -1 ・ K -1 . Hardly any deterioration was observed.

評估1與評估2中,熱傳導率的測定,是使用Mentor Graphics Japan公司製造的T3ster DynTIM,並依照美國材料試驗學會(ASTM) D5470來實行。製作直徑為12.8mm、厚度為0.35mm、0.5mm、0.6mm、0.7mm、0.8mm的試料。對試料施加規定的荷重,並由上下(厚度方向)的溫度差與電力測定熱阻值。由上述5種試料的厚度與熱阻的圖表,分離接觸熱阻分量與薄片的熱阻分量,並對薄片的熱阻分量進行直線近似,然後由所求得的熱阻值來計算熱傳導率。In Evaluation 1 and Evaluation 2, the thermal conductivity was measured using T3ster DynTIM manufactured by Mentor Graphics Japan, and performed in accordance with American Society for Testing and Materials (ASTM) D5470. Samples having a diameter of 12.8 mm and a thickness of 0.35 mm, 0.5 mm, 0.6 mm, 0.7 mm, and 0.8 mm were prepared. A predetermined load was applied to the sample, and the thermal resistance value was measured from the temperature difference between the upper and lower (thickness direction) and electric power. From the graphs of the thickness and thermal resistance of the above five samples, the contact thermal resistance component and the thermal resistance component of the sheet were separated, and the thermal resistance component of the sheet was linearly approximated, and then the thermal conductivity was calculated from the obtained thermal resistance value.

[變化例] 本發明並不僅限於上述實施例,只要本發明技術領域中具有通常知識者能夠由申請專利範圍和說明書的記載理解且不違反本發明的技術思想,能夠加以變化、刪除及追加。[Modifications] The present invention is not limited to the above embodiments, as long as those with ordinary knowledge in the technical field of the present invention can understand from the scope of the patent application and the description and do not violate the technical idea of the present invention, they can be changed, deleted, and added.

作為PDMS,只要在上述數目平均分子量的範圍內,可使用分子量分佈不同的PDMS。例如,若使用分子量分佈狹小、分子量一致的PDMS,則能夠獲得一種未反應部位非常少的矽氧系混成預聚物,且能夠顯示耐久性或表面的拒水性優異的特性。As the PDMS, as long as the number average molecular weight is within the range, PDMS having different molecular weight distributions can be used. For example, when PDMS with a narrow molecular weight distribution and uniform molecular weight is used, a silicone-based hybrid prepolymer having very few unreacted sites can be obtained, and characteristics such as durability and surface water repellency can be exhibited.

又,反應容器的氣氛取代時所用的非活性氣體,可以是純度為80%以上且含水率為20%以下的非活性氣體。The inert gas used when the atmosphere in the reaction vessel is replaced may be an inert gas having a purity of 80% or more and a moisture content of 20% or less.

歸納本發明如下。The present invention can be summarized as follows.

(1)依據本發明而得的矽氧系混成聚合物被覆AlN填料,其是以表面被矽氧系混成聚合物被覆而成的氮化鋁作為主成分之填料,並且,對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的導電率為350μS/cm以下。(1) A silica-based polymer-coated AlN filler obtained in accordance with the present invention is a filler containing aluminum nitride whose surface is coated with a silica-based polymer as a main component, and 50 mL of ion-exchanged water After adding 5 g of the filler having an average particle diameter of 20 to 40 μm, and maintaining it at a saturated water vapor pressure of 121 ° C. for 50 hours, the conductivity of water is 350 μS / cm or less.

(2)依據本發明而得的矽氧系混成聚合物被覆AlN填料,較佳是:對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的pH值為10以下。(2) The silica-based hybrid polymer-coated AlN filler obtained according to the present invention is preferably: for 50 mL of ion-exchanged water, 5 g of the filler having an average particle diameter of 20 to 40 μm is added, and the saturated water is at 121 ° C. After the vapor pressure was maintained for 50 hours, the pH of the water was 10 or less.

(3)依據本發明而得的矽氧系混成聚合物被覆AlN填料中,較佳是:矽氧系混成聚合物是下述固化物,該固化物包含由下述通式(1)表示的聚二甲基矽氧烷與由下述通式(2)表示的四烷氧基矽烷低聚物及/或其水解物之反應物,該聚二甲基矽氧烷的數目平均分子量(Mn)為500~3000;m是能夠滿足數目平均分子量(Mn)=500~3000的整數,且混合存在一定範圍內的整數m的分子;n表示4~10的整數,R表示碳數為1~3的烷基。(3) In the silica-based hybrid polymer-coated AlN filler obtained according to the present invention, it is preferred that the silica-based hybrid polymer is a cured product containing the following formula (1) Reactant of polydimethylsiloxane with a tetraalkoxysilane oligomer and / or its hydrolysate represented by the following general formula (2), the number average molecular weight of the polydimethylsiloxane (Mn ) Is 500 ~ 3000; m is an integer capable of satisfying the number average molecular weight (Mn) = 500-3000, and mixed with an integer m within a certain range; n represents an integer of 4 to 10, and R represents an alkyl group having 1 to 3 carbon atoms.

(4)依據本發明而得的矽氧系混成聚合物被覆AlN填料中,較佳是由上述通式(1)表示的聚二甲基矽氧烷的數目平均分子量(Mn)為600~2000。(4) In the silica-based hybrid polymer-coated AlN filler obtained according to the present invention, the number average molecular weight (Mn) of the polydimethylsiloxane represented by the general formula (1) is preferably 600 to 2000. .

(5)依據本發明而得的矽氧系混成聚合物被覆AlN填料,較佳是平均粒徑為25~35μm。(5) The silica-based hybrid polymer-coated AlN filler obtained according to the present invention preferably has an average particle diameter of 25 to 35 μm.

(6)依據本發明而得的矽氧系混成聚合物被覆AlN填料中,要被矽氧系混成聚合物被覆的AlN填料與矽氧系混成預聚物的質量比,較佳是:相對於AlN填料100質量份,矽氧系混成預聚物為2~10質量份。(6) The mass ratio of the silica-based hybrid polymer-coated AlN filler obtained according to the present invention to the silica-based hybrid polymer-coated AlN filler and the silica-based prepolymer is preferably: The AlN filler is 100 parts by mass, and the silica-based mixed prepolymer is 2 to 10 parts by mass.

(7)依據本發明而得的散熱構件,包含上述(1)~(6)中任一項所述之矽氧系混成聚合物被覆AlN填料。 [產業上的可利用性](7) The heat-dissipating member according to the present invention includes the silicon-oxygen mixed polymer-coated AlN filler as described in any one of (1) to (6) above. [Industrial availability]

若使用依據本發明而得的矽氧系混成聚合物被覆AlN填料,則能夠得到一種散熱構件或功能性構件,該散熱構件或功能性構件受環境影響較少,亦即因AlN填料表面的水解所導致的熱傳導率等的特性下降的情形較少,因而能夠設計一種材料,該材料的兼具耐熱性與柔軟性、高熱傳導性的優越性較高。If the silica-based hybrid polymer coated AlN filler obtained according to the present invention is used, a heat dissipation member or functional member can be obtained, which is less affected by the environment, that is, due to hydrolysis of the surface of the AlN filler Since there are few cases where characteristics such as thermal conductivity are reduced, it is possible to design a material which is superior in both heat resistance, flexibility, and high thermal conductivity.

no

no

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Claims (7)

一種矽氧系混成聚合物被覆氮化鋁填料,其是以表面被矽氧系混成聚合物被覆而成的氮化鋁作為主成分之填料,並且,對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的導電率為350μS/cm以下。A silicon-oxygen mixed polymer-coated aluminum nitride filler is a filler containing aluminum nitride coated on the surface with a silicon-oxygen mixed polymer as a main component, and 5 g of average particle size is added to 50 mL of ion-exchanged water. After the filler is 20 to 40 μm and is maintained at a saturated water vapor pressure of 121 ° C. for 50 hours, the conductivity of water is 350 μS / cm or less. 如請求項1所述之矽氧系混成聚合物被覆氮化鋁填料,其中,對於50mL離子交換水,加入5g平均粒徑為20~40μm的該填料,並在以121℃的飽和水蒸氣壓保持50小時後,水的pH值為10以下。The silicon-oxygen mixed polymer-coated aluminum nitride filler according to claim 1, wherein 50 g of ion-exchanged water is added with 5 g of the filler having an average particle diameter of 20 to 40 μm, and the saturated water vapor pressure is 121 ° C. After holding for 50 hours, the pH of the water was 10 or less. 如請求項1或請求項2所述之矽氧系混成聚合物被覆氮化鋁填料,其中,前述矽氧系混成聚合物是下述固化物,該固化物包含由下述通式(1)表示的聚二甲基矽氧烷與由下述通式(2)表示的四烷氧基矽烷低聚物及/或其水解物之反應物,該聚二甲基矽氧烷的數目平均分子量Mn為500~3000;m是能夠滿足數目平均分子量Mn=500~3000的整數,且混合存在一定範圍內的整數m的分子;n表示4~10的整數,R表示碳數為1~3的烷基。The silica-based hybrid polymer-coated aluminum nitride filler according to claim 1 or claim 2, wherein the silica-based hybrid polymer is a cured product containing the following general formula (1) The number-average molecular weight of the polydimethylsiloxane represented by the reaction between the polydimethylsiloxane represented by the following general formula (2) and a tetraalkoxysilane oligomer and / or a hydrolyzate thereof: Mn is 500 ~ 3000; m is an integer capable of satisfying the number-average molecular weight Mn = 500-3000, and mixed with an integer m within a certain range; n represents an integer of 4 to 10, and R represents an alkyl group having 1 to 3 carbon atoms. 如請求項3所述之矽氧系混成聚合物被覆氮化鋁填料,其中,由前述通式(1)表示的聚二甲基矽氧烷的數目平均分子量Mn為600~2000。The silicon-oxygen mixed polymer-coated aluminum nitride filler according to claim 3, wherein the number average molecular weight Mn of the polydimethylsiloxane represented by the general formula (1) is 600 to 2000. 如請求項1~請求項4中任一項所述之矽氧系混成聚合物被覆氮化鋁填料,其中,平均粒徑為25~35μm。The siloxane-based mixed polymer-coated aluminum nitride filler according to any one of claim 1 to claim 4, wherein the average particle diameter is 25 to 35 μm. 如請求項1~請求項5中任一項所述之矽氧系混成聚合物被覆氮化鋁填料,其中,要被前述矽氧系混成聚合物被覆的氮化鋁填料與矽氧系混成預聚物的質量比,相對於氮化鋁填料100質量份,矽氧系混成預聚物為2~10質量份。The silica-based hybrid polymer-coated aluminum nitride filler according to any one of claim 1 to claim 5, wherein the aluminum nitride filler to be coated with the aforementioned silica-based hybrid polymer is mixed with a silica-based pre- The mass ratio of the polymer is 2 to 10 parts by mass based on 100 parts by mass of the aluminum nitride filler. 一種散熱構件,其包含請求項1~請求項6中任一項所述之矽氧系混成聚合物被覆氮化鋁填料。A heat dissipation member comprising the silicon-oxygen-based hybrid polymer-coated aluminum nitride filler according to any one of claim 1 to claim 6.
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