TW201638754A - Conductive film, wiring and touch panel sensor - Google Patents

Abstract

Provided is a conductive film having a conductive sheet which is provided with a plurality of first wave lines formed by arranging the directions of circular arcs of semicircles in an alternating manner on a substrate, and a plurality of second wave lines formed by arranging the directions of circular arcs of semicircles in an alternating manner on the substrate, the second wave lines being arranged symmetrically with respect to the first wave lines, the conductive sheet being configured such that the direction of arrangement of the circular arcs of each of the first wave lines and the direction of arrangement of the circular arcs of each of the second wave lines are parallel, the first wave lines and the second wave lines are separated by a preset distance, and the facing circular arcs of the first wave lines and second wave lines are at least in contact. The first wave lines and the second wave lines are configured from a conductive material. Also provided is a wiring having the conductive film. Also provided is a touch panel sensor also having the conductive film.

Description

Conductive film, wiring, and touch panel sensor

The present invention relates to a conductive film formed with a conductive thin wire, a wiring having a conductive film, and a touch panel sensor having a conductive film, and more particularly to a conductive film and wiring excellent in visibility. Touch panel sensor.

A conductive film in which a conductive thin wire is formed on a substrate is widely used for a transparent electrode of various electronic components such as a solar cell, an inorganic electroluminescence (IEL) device, and an organic electroluminescence (OEL) device. , electromagnetic shielding shields for various display devices, touch panels, and transparent planar heating elements. In particular, in recent years, the mounting rate of touch panels in mobile phones and portable game machines has increased, and the demand for conductive films for capacitive touch panels capable of multi-point detection has rapidly increased.

As the conductive thin wire, a transparent conductive oxide such as indium tin oxide (ITO) is used. The transparent conductive oxide is suitable for applications such as a touch panel that can be seen with a low visibility and can be fatally seen. However, the sheet resistance of the transparent conductive oxide is about 10 Ω/□ to 100 Ω/□, which is not suitable for large area and high sensitivity. Compared with the transparent conductive oxide, the metal has an advantage of being easy to pattern, excellent in flexibility, and lower in electrical resistance. Therefore, a metal such as copper or silver is used for a conductive thin wire in a touch panel or the like.

Patent Document 1 describes a touch panel using metal thin wires. The touch panel of Patent Document 1 is a capacitance sensor including a substrate, a plurality of Y electrode patterns, a plurality of X electrode patterns, a plurality of jumper insulating layers, a plurality of jumper wires, and a transparent insulating layer (touch) Sensor, input device). Each of the plurality of Y electrode patterns has a substantially rhombic shape, and is arranged in a matrix on the surface of the substrate along the X direction and the Y direction so that the apexes thereof face each other. The mesh is formed by intersecting two kinds of metal thin wires which are inclined in a line symmetry with respect to the Y direction in a lattice shape. The plurality of X electrode patterns have substantially the same rhombic shape as the Y electrode pattern. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-115694

[Problems to be Solved by the Invention] In the touch panel in which a plurality of Y electrode patterns having a substantially rhombic shape and a plurality of X electrode patterns are formed by using a thin metal wire as in Patent Document 1, when the touch panel is visually recognized In some cases, reflection of streaked light is generated by light having high directivity from the surroundings. The generation of the reflection of the stripe-shaped light reduces the visibility. It is desirable to prevent the occurrence of reflection of the stripe-shaped light which causes a decrease in visibility, and to further improve visibility.

An object of the present invention is to eliminate the problems based on the prior art and to provide a conductive film, a wiring, and a touch panel sensor which are excellent in visibility. [Means for solving the problem]

In order to achieve the above object, a first aspect of the present invention provides a conductive film, comprising: a conductive sheet, wherein the conductive sheet includes a substrate; and the plurality of first wavy lines are disposed on the substrate. The directions of the arcs of the semicircles are arranged differently from each other; and the plurality of second wavy lines are arranged on the substrate, and the directions of the arcs of the semicircles are arranged differently from each other, and the first wavy line is formed. The arrangement direction is symmetrical; the arrangement direction of the arcs of the first wavy lines is parallel to the arrangement direction of the arcs of the respective second wavy lines, and each of the first wavy lines is set in advance with each of the second wavy lines. The distance between the opposing first wavy lines and the arc of each of the second wavy lines is at least in contact with each other; the first wavy line and the second wavy line include a conductive material.

Each of the first wavy lines and each of the second wavy lines may have a configuration in which an arc of each of the first wavy lines facing each other overlaps with an arc of each of the second wavy lines. In addition, the semicircular arc includes an arc having a central angle of 170° to 190°. The conductive material may be formed by including a metal or an alloy and laminating a plurality of conductive sheets. When a plurality of conductive sheets are laminated, it is preferable to make the arrangement direction of the conductive sheets uniform. Further, the substrate is preferably a transparent substrate.

According to a second aspect of the invention, there is provided a wiring comprising the conductive film according to the first aspect of the invention. It is preferable that not only the conductive path can be formed by cutting parallel or perpendicular to the arrangement direction of the conductive film, but also the angle γ with respect to the arrangement direction is more than 0° and less than 90 in absolute value with respect to the conductive film. When at least one of the first wavy line and the second wavy line is cut in the range of ° to form a conductive path, when the diameter of the circular arc is Da, the direction in the direction orthogonal to the arrangement direction is When the interval between the wavy line and the second wavy line is P, the first wavy line and the second wavy line are cut in accordance with the arrangement angle f defined by |tanf|=P/Da.

According to a third aspect of the invention, there is provided a touch panel sensor comprising the conductive film according to the first aspect of the invention. The conductive film is preferably used for at least one of the sensor portion and the peripheral wiring portion. [Effects of the Invention]

According to the conductive film of the present invention, a conductive film excellent in visibility can be obtained. According to the wiring of the present invention, wiring excellent in visibility can be obtained. According to the touch panel sensor of the present invention, a touch panel sensor excellent in visibility can be obtained.

Hereinafter, the conductive film, the wiring, and the touch panel sensor of the present invention will be described in detail based on a preferred embodiment shown in the accompanying drawings. In addition, "~" which shows the numerical range below contains the numerical value shown on both sides. For example, ε is a numerical value α to a numerical value β, and means that the range of ε is a range including the numerical value α and the numerical value β, and if expressed by a mathematical symbol, α ≦ ε ≦ β. The optically transparent and transparent only means that the light transmittance is at least 60% or more, preferably 80% or more, more preferably 85% or more, and even more preferably 90% in a visible light wavelength region of a wavelength of 400 nm to 800 nm. the above. The light transmittance is measured, for example, by using "plastic-total light transmittance and total light reflectance" prescribed in JIS K 7375:2008. In addition, "substantially" and "simultaneously" are set to include the tolerances normally allowed in the technical field.

FIG. 1 is a schematic view for explaining reflection of stripe-shaped light. As shown in FIG. 1, when the light-emitting area 104 is irradiated with light having high directivity to the region 102 on which the metal thin wires are formed on the substrate 100, the light may be visually recognized in the region 102 regardless of the irradiation direction and the viewing direction. To the stripe-shaped reflected light 108. The stripe-shaped reflected light 108 is referred to as a splash. The stripe-shaped reflected light 108, that is, the spot is a person who obstructs visibility, and the visibility of the person who produces the spot is poor. The conductive film of the present invention suppresses the generation of spots and improves the visibility. The light having directivity means, for example, light from a light emitting diode, natural light such as sunlight, light of a fluorescent lamp, light of an incandescent light bulb, and light of an incandescent lamp are not included in directivity. Light. Light from a Light Emitting Diode includes monochromatic light and white light.

Next, a conductive film according to an embodiment of the present invention will be described. Fig. 2 is a schematic plan view showing a conductive film according to an embodiment of the present invention. Fig. 3 is a plan view showing an enlarged conductive film according to an embodiment of the present invention. 4 is a schematic view showing a conductive thin wire constituting a pattern of a conductive film according to an embodiment of the present invention, and FIG. 5 is a schematic view showing a conductive thin wire constituting a pattern of a conductive film according to an embodiment of the present invention, and FIG. 6 is a view A schematic view showing a pattern of a conductive film according to an embodiment of the present invention, and FIG. 7 is a schematic view showing another example of the conductive film according to the embodiment of the present invention.

The conductive film 10 shown in FIG. 2 has a conductive sheet 11 which is provided on the substrate 12 by superimposing a plurality of pattern wirings 14 extending in the H direction in the V direction. The substrate 12 is, for example, a transparent substrate. As shown in FIGS. 2 and 3, the pattern wiring 14 includes a first wavy line 14a extending in the H direction and a second wavy line 14b extending in the H direction, and has no straight portion. The first wavy line 14a and the second wavy line 14b are formed of conductive thin wires 15.

As shown in FIG. 4, the first wavy line 14a is arranged such that the semicircular arc 17a and the semicircular arc 17b are different from each other. The diameter of the semicircular arc 17a and the semicircular arc 17b are both Da. The semicircular arc 17a and the semicircular arc 17b are arranged in the H direction. In the present specification, the semicircular arc is arranged in the H direction. As shown in FIG. 5, the second wavy line 14b is arranged such that the semicircular arc 17a and the semicircular arc 17b are different from each other. The diameter of the semicircular arc 17a and the semicircular arc 17b are both Da. The arrangement direction of the arc of the semicircular arc 17a and the semicircular arc 17b is also the H direction. Even if the phase shift of the first wavy line 14a corresponds to the diameter Da of the circular arc, the second wavy line 14b can be obtained.

As shown in Fig. 6, the semicircular arc 17a is half of the outer circumference of the imaginary circle 19 of the diameter Da, and the semicircular arc 17b is symmetrical with the semicircular arc 17a, and is also the outer circumference of the imaginary circle 19 of the diameter Da. Half of it. By connecting the end portion 17c of the semicircular arc 17a to the end portion 17c of the semicircular arc 17a, the first wavy line 14a and the second wavy line 14b having mutually different arc directions are formed. The semicircular arc 17a and the semicircular arc 17b are set to O at the center of the imaginary circle 19, and have a central angle θ of 180° when the central angle is θ, and π (radian) when expressed by the radians method. . The arc of a semicircle is preferably a central angle θ of 180°. However, in consideration of an error or the like, in the present invention, as long as the central angle θ is in the range of 170° to 190°, it is called a semicircular arc. When the semicircular arc 17a and the semicircular arc 17b are connected one by one, the first wavy line 14a and the second wavy line 14b each have a one-period wave pattern. The first wavy line 14a and the second wavy line 14b can be formed by connecting the waveform patterns. In the first wavy line 14a and the second wavy line 14b, a line connecting the end portions 17c of the semicircular arc 17a is the center line C.

The second wavy line 14b is symmetrical with respect to the arrangement direction, that is, the H direction and the first wavy line 14a. As described above, the first wavy line 14a and the second wavy line 14b are bilaterally symmetrical with respect to the center line C, and as shown in FIG. 3, the semicircular arcs 17b face each other. Further, the first wavy line 14a and the second wavy line 14b are arranged such that the ends of the circular arc 17a and the circular arc 17b coincide with the set line B. The arrangement direction of the circular arc 17a and the circular arc 17b of each of the first wavy lines 14a is parallel to the arrangement direction of the circular arc 17a and the circular arc 17b of the second wavy line 14b, that is, the center line C is parallel to each other, and The first wavy line 14a and the second wavy line 14b are separated by a predetermined distance. The arc 17a of the opposing first wavy line 14a and the arc 17a of the second wavy line 14b are placed, for example, in a direction orthogonal to the arrangement direction, that is, in the V direction. The arcs 17a arranged to be convex to each other are arranged to overlap each other. At this time, the interval between the center line C of the first wavy line 14a and the center line C of the second wavy line 14b in the V direction is referred to as a pitch P.

As shown in FIG. 3, an overlap region 22 surrounded by a semicircular arc 17a is formed. A point at which the mutually semicircular arcs 17a overlap each other is referred to as an intersection point 23. The opening portion 20 is formed by an arc 17b of the first wavy line 14a that is disposed to be concave from each other and an arc 17b of the second wavy line 14b. The opening portion 22 is included in the opening portion 20. Again. As a condition for generating the overlapping region 22, the pitch P<the diameter Da of the circular arc and the condition constituting the opening 20 are P≦Da according to the geometric relationship between the first wavy line 14a and the second wavy line 14b. Here, when P = Da, the first wavy line 14a and the second wavy line 14b are in contact as shown in Fig. 7, and therefore the region 22 exists as a contact and is included in the present invention. In the conductive film 10 shown in FIG. 3, in a state in which the plurality of first wavy lines 14a and the plurality of second wavy lines 14b are parallel to the center line C, the first wavy line 14a and the first wavy line 14a are used. The two wavy lines 14b, the first wavy line 14a, and the second wavy line 14b are alternately arranged such that the first wavy line 14a and the second wavy line 14b which are opposed to each other at a pitch P in the V direction are arranged to each other. The convex arcs are arranged to overlap each other, for example. The first wavy line 14a and the second wavy line 14b may be at least brought into contact as shown in Fig. 7, and do not necessarily need to overlap as shown in Fig. 3.

Here, the arrangement angle f of the overlapping region 22 is set to an angle formed by the line C ₁ passing through the center of the plurality of overlapping regions 22 and the line parallel to the H direction, that is, the center line C. The angle formed by the line C ₂ passing through the center of the plurality of overlapping regions 22 and the center line C also becomes the arrangement angle f. The arrangement angle f of the plurality of overlapping regions 22 may take a plurality of directions. Therefore, the arrangement angle f is defined by an absolute value. The arrangement angle f becomes |tanf|=(P/Da), which is also expressed as |f|=tan ^-1 (P/Da). Therefore, by changing the diameter Da of the circular arc and the pitch P between the first wavy line 14a and the second wavy line 14b, the arrangement angle f of the overlapping region 22 can be changed.

The diameter Da is preferably from 1 μm to 1000 μm. The pitch P is preferably from 1 μm to 1000 μm. If the diameter Da exceeds 1000 μm, the spot can be seen regardless of the shape, which is not preferable. In addition, when the distance 21a at which the arc 17b of the first wavy line 14a intersects the center line C and the intersection 21b where the arc 17b of the second wavy line 14b intersects the center line C is Pc, When the distance Pc is 150 μm or less, it is difficult to visually recognize the first wavy line 14a and the second wavy line 14b of the pattern wiring 14, which is preferable. On the other hand, when the distance Pc is short, the opening area may become small, the transmittance may become low, or haze may occur. Therefore, the distance Pc is preferably 50 μm or more. Further, the opposing first wavy line 14a and the second wavy line 14b are disposed such that the arcs that are arranged to be convex at least are placed in contact with each other, but the condition of the contact is P≦Da.

In the conductive film 10 shown in FIG. 2, a part of the pattern wiring 14 shown in FIG. 2 is arranged in an overlapping manner in the V direction, that is, the first wavy line having no straight portion as described above. 14a and a part of the second wavy line 14b are alternately arranged in the V direction, whereby the first wavy line 14a and the second wavy line 14b can be suppressed even if the first wavy line 14a and the second wavy line 14b are formed of a conductive material such as a metal or an alloy. The production of the spots.

The conductive film 10 is, for example, a configuration shown in FIG. As shown in FIG. 8, the first wavy line 14a and the second wavy line 14b are formed on the surface 12a of the substrate 12, and the pattern wiring 14 is provided. A protective layer 18 is provided on the pattern wiring 14 via the transparent adhesive layer 16.

The substrate 12 is a member that supports the first wavy line 14a and the second wavy line 14b, and includes, for example, an electrically insulating material. Further, the substrate 12 is, for example, a transparent substrate. Therefore, for the substrate 12, for example, a plastic film, a plastic plate, a glass plate, or the like can be used. The plastic film and the plastic plate include, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyester, polyethylene (polyethylene, PE), polypropylene. (Polypropylene, PP), Polystyrene, Ethylene Vinyl Acetate (EVA), Cycloolefin Polymer (COP), Cycloolefin Copolymer (COC) and other polyolefins, ethylene The base resin further includes polycarbonate (Polycarbonate, PC), polyamine, polyimide, acrylic resin, triacetyl cellulose (TAC), and the like. From the viewpoints of light transmittance, heat shrinkability, and processability, etc., it is preferable to contain polyethylene terephthalate (PET), cycloolefin polymer (COP), cyclic olefin copolymer (COC), or the like. Polyolefins. From the viewpoint of adhesion, damage resistance, and workability, an easy-to-adhere layer may be laminated on the substrate 12, and an easy-to-attach layer and a hard coat layer may be laminated.

As the substrate 12, a processed support subjected to at least one of atmospheric piezoelectric slurry treatment, corona discharge treatment, and ultraviolet irradiation treatment may be used. By performing the above treatment, a hydrophilic group such as an OH group is introduced onto the surface of the treated support, and the adhesion between the first wavy line 14a and the second wavy line 14b is further improved. Among the above-described processes, from the viewpoint of further improving the adhesion between the first wavy line 14a and the second wavy line 14b, atmospheric piezoelectric slurry treatment is preferred.

The conductive thin wire 15 is a material containing a conductive material, and includes, for example, a metal, an alloy, or a compound. The conductive thin wire 15 can be suitably used as a conductor, and the composition thereof is not particularly limited. The conductive thin wire 15 is made of, for example, gold (Au), silver (Ag), copper (Cu), nickel (Ni), titanium (Ti), palladium (Pd), platinum (Pt), aluminum (Al), or tungsten (W). Or molybdenum (Mo) is formed. Further, these oxides (O), nitrides (N), phosphides (P) or sulfides (S) may be contained, and these alloys may also be included. The conductive thin wire 15 may be contained in gold (Au), silver (Ag), or copper (Cu) and further contains a binder, and is also contained in the conductive thin wire 15. The conductive thin wire 15 is easily bent and has improved bending resistance by containing a binder. As the binder, a wiring for a conductive film can be suitably used, and for example, those described in Japanese Laid-Open Patent Publication No. 2013-149236 can be used. The conductive thin wire 15 is a thin metal wire in the case of containing a metal or an alloy.

Next, for example, an optically transparent resin called Optical Clear Clear Adhesive (OCA) or an optically transparent resin such as an ultraviolet curable resin called Optically Clear Resin (OCR) can be used. The protective layer 18 is for protecting the first wavy line 14a and the second wavy line 14b. The substrate of the protective layer 18 is not particularly limited. For example, glass, polycarbonate (PC), polyethylene terephthalate (PET), acrylic resin (polymethylmethacrylate (PMMA)), or the like can be used. The protective layer 18 may have an easy-to-adhere layer on the surface layer as in the case of the substrate 12, or may have an easy-adhesion layer and a hard coat layer.

The conductive film 10 shown in FIG. 2 is one having one conductive sheet 11, but the invention is not limited thereto, and a plurality of conductive sheets may be laminated as a conductive film. FIG. 9 is a schematic plan view showing a configuration of a conductive film according to an embodiment of the present invention, FIG. 10 is a schematic plan view showing a configuration of a conductive film according to an embodiment of the present invention, and FIG. 11 is a view showing conductivity of an embodiment of the present invention. A schematic plan view of another example of the constitution of the film. In this case, the conductive sheet 11a shown in Fig. 9 and the conductive sheet 11b shown in Fig. 10 are prepared. The configuration of the conductive sheet 11a of FIG. 9 and the conductive sheet 11b shown in FIG. 10 is the same as that of the conductive sheet 11 shown in FIG. 2, and thus detailed description thereof will be omitted.

The conductive sheet body 11a shown in FIG. 9 is overlapped with the conductive sheet body 11b shown in FIG. 10 by aligning the arrangement direction of the first wavy lines 14a, that is, the H direction, thereby obtaining the one shown in FIG. Conductive film 10a. In the conductive film 10a, the generation of the spots can be suppressed similarly to the conductive film 10 shown in Fig. 2 . When the conductive sheet 11a and the conductive sheet 11b are laminated as in the conductive film 10a as shown in FIG. 11, the center line C of the first wavy line 14a is parallel to each other, and thus the conductive sheet 11a is formed. The center line C of the first wavy line 14a of the conductive sheet 11b does not intersect each other. In this case, the laminated angle is set to 0°.

From the viewpoint of the uniformity of the transmittance in the plane of the conductive sheet 11a shown in FIG. 9 and the direction of the conductive sheet 11b shown in FIG. 10, it is preferable to use FIG. The conductive sheet 11a shown has the same arrangement direction as the first wavy line 14a of the conductive sheet 11b shown in FIG. 10, but is not particularly limited. For example, as shown in FIG. 12, the first wave of the first wavy line 14a of the conductive sheet 11a shown in FIG. 9 and the first wave of the conductive sheet 11b shown in FIG. 10 may be used. The conductive film 10b in which the alignment direction of the line 14a is shifted and orthogonal to each other is performed. When laminating as shown in FIG. 12, the angle formed by the center line C of the first wavy line 14a of the conductive sheet 11a and the center line C of the first wavy line 14a of the conductive sheet 11b becomes 90°, so the laminate angle is called 90°.

Further, as shown in FIG. 13, the arrangement direction of the first wavy line 14a of the conductive sheet 11a shown in FIG. 9 and the first wave of the conductive sheet 11b shown in FIG. 10 may be used. The conductive film 10c which is formed by laminating the line 14a in the direction in which the lines 14a are arranged is 45°. When laminating as shown in FIG. 13, the angle formed by the center line C of the first wavy line 14a of the conductive sheet 11a and the center line C of the first wavy line 14a of the conductive sheet 11b becomes 45°, so the laminate angle is called 45°. The conductive film 10b shown in FIG. 12 and the conductive film 10c shown in FIG. 13 can suppress the generation of the spots similarly to the conductive film 10 shown in FIG. In addition, although the conductive sheet of the two layers is described as an example, the number of the layers may be plural. Therefore, the number of layers of the conductive sheet is not limited to two, and may be three or more.

Next, a method of manufacturing the conductive film 10 will be described. The difference between the conductive film 10a shown in FIG. 11, the conductive film 10b shown in FIG. 12, and the conductive film 10c shown in FIG. 13 is different from that of the conductive film 10 shown in FIG. The conductive sheet body 11a and the conductive sheet body 11b have the same configuration as that of the conductive sheet body 11 in terms of the laminated layer and the laminated method. Therefore, the manufacturing method will be described by taking the conductive film 10 shown in FIG. 2 as an example.

The conductive film 10 is not particularly limited as long as it can form the pattern wiring 14 on the substrate 12, and for example, a plating method, a silver salt method, a vapor deposition method, a printing method, or the like can be suitably used. A method of forming the pattern wiring 14 by the plating method will be described. For example, the pattern wiring 14 may include a metal plating film formed on the underlayer by electroless plating of the electroless plating underlayer. In this case, it is formed by forming a catalyst ink containing at least metal fine particles into a pattern on a substrate, and then immersing the substrate in an electroless plating bath to form a metal plating film. More specifically, a method for producing a metal film substrate described in JP-A-2014-159620 can be used. Further, a resin composition having at least a functional group capable of interacting with a metal catalyst precursor is formed into a pattern on a substrate, and then a catalyst or a catalyst precursor is supplied and The substrate is immersed in an electroless plating bath to form a metal plating film. More specifically, a method for producing a metal film substrate described in JP-A-2012-144761 can be applied.

Further, a method of forming the pattern wiring 14 by the silver salt method will be described. First, the silver salt emulsion layer containing silver halide is subjected to exposure treatment using an exposure pattern to be the pattern wiring 14, and then development processing is performed, whereby the pattern wiring 14 can be formed. More specifically, a method for producing a metal thin wire described in Japanese Laid-Open Patent Publication No. 2015-22397 can be used. In addition, a method of forming the pattern wiring 14 by the vapor deposition method will be described. First, a copper foil layer is formed by vapor deposition, and a copper wiring is formed from a copper foil layer by photolithography, whereby the pattern wiring 14 can be formed. In addition to the vapor-deposited copper foil, the copper foil layer can also use an electrolytic copper foil. More specifically, the step of forming a copper wiring described in Japanese Laid-Open Patent Publication No. 2014-29614 can be used. In addition, a method of forming the pattern wiring 14 by the printing method will be described. First, a conductive paste containing a conductive powder is applied onto a substrate in the same pattern as the pattern wiring 14, and then heat treatment is performed, whereby the pattern wiring 14 can be formed. Patterning using a conductive paste is performed, for example, by an inkjet method or a screen printing method. More specifically, as the conductive paste, a conductive paste described in Japanese Laid-Open Patent Publication No. 2011-28985 can be used.

Next, regarding the formation of the conductive thin wires 15, a method of manufacturing the same will be described in detail by taking a plating method as an example. 14 to 16 are schematic cross-sectional views showing a method of manufacturing a conductive film in order of steps. First, as shown in FIG. 14, a photosensitive layer 32 is formed on the surface 12a of the substrate 12. The exposure light L is irradiated with the pattern of the pattern wiring 14, and the exposure region 32a and the non-exposure region 32b are formed in the photosensitive layer 32. The exposure light L is not particularly limited, and may be light that passes through the mask in which the pattern is formed, and may be laser light.

Then, the non-exposed area of the photosensitive layer (layer for forming a layer to be plated) is removed. By performing this step, the non-exposed areas in the layer for forming a plating layer are removed, and more specifically, the non-exposed areas 32b are removed for the photosensitive layer 32 shown in FIG. 14, as shown in FIG. A layered body 36 having a patterned plated layer having the first patterned coating layer 34 can be obtained. The removal method is not particularly limited, and a method suitable for selecting a compound contained in the layer for forming a layer to be plated is preferably selected, and a method of contacting a solvent for dissolving the compound with a layer for forming a layer to be plated is generally used. . More specifically, a method of using an alkaline solution as a developing solution can be cited. When an alkali solution is used to remove a non-exposed area, a method of spraying an alkaline solution onto a layered body subjected to an irradiation step and spraying the layered body subjected to the irradiation step in an alkaline solution may be mentioned. The method and the method of applying an alkaline solution to the layer for forming a layer to be plated, etc., are preferably a method of spraying in a shower form. In the case of the spray-spraying method, the spray time is preferably from about 1 minute to about 3 minutes from the viewpoint of productivity, workability, and the like.

The layered body 36 including the patterned plated layer shown in Fig. 15 is obtained by the above procedure. The layered body 36 containing the patterned layer to be plated can be suitably used for the purpose of forming a metal film (conductive film). In other words, a plating catalyst or a precursor thereof is applied to the pattern-shaped layer to be plated in the layered body 36 including the patterned layer to be plated, and further a plating treatment is performed to form a pattern-shaped layer to be plated. Metal layer 38. That is, the pattern of the metal layer can be controlled by controlling the shape of the pattern-shaped layer to be plated. Further, by using such a pattern-like layer to be plated, the metal layer is excellent in adhesion to the substrate. Hereinafter, the step of forming the metal layer (metal layer forming step) will be described in detail.

<Metal Layer Forming Step> This step is to apply a plating catalyst or a precursor to the pattern-shaped layer to be plated in the layered body including the patterned layer to be plated, and to provide a plating catalyst or a precursor thereof. The pattern-like layer is subjected to a plating treatment to form a metal layer on the patterned layer to be plated. More specifically, by performing this step, as shown in FIG. 16, the metal layer 38 is formed on the first patterned plated layer 34. Further, the metal thin layer 38 is formed on the first patterned-shaped plated layer 34 as the conductive thin wire 15.

In addition, FIG. 16 shows a form in which the metal layer 38 is placed on a surface other than the contact surface of the first pattern-shaped plated layer 34 with the substrate 12. In other words, the metal layer is disposed so as to cover the surface of the patterned plated layer other than the contact surface of the substrate. However, the present invention is not limited to this embodiment, and may be only the upper surface of the first pattern-like plated layer 34. The form of the metal layer 38 is configured. The metal layer 38 is also disposed on the surface of the first patterned-shaped plated layer 34 other than the contact surface with the substrate 12, and is referred to as a conductive thin wire 15.

Hereinafter, the step of applying a plating catalyst or a precursor thereof to the patterned plating layer (step X), and plating the patterned plating layer to which the plating catalyst or its precursor is applied are performed. The steps (step Y) are separated for explanation.

(Step X: Plating Catalyst Giving Step) In this step, first, a plating catalyst or a precursor thereof is applied to the patterned coating layer. The interactive group derived from the compound corresponds to its function, and adheres (adsorbs) the plating catalyst or its precursor imparted thereto. More specifically, a plating catalyst or a precursor thereof is applied to the surface of the pattern-formed layer and the surface of the pattern-coated layer. The plating catalyst or its precursor is a function as a catalyst or electrode for plating treatment. Therefore, the type of the plating catalyst or its precursor to be used can be appropriately determined depending on the type of the plating treatment. Further, the plating catalyst or precursor thereof used is preferably an electroless plating catalyst or a precursor thereof. Hereinafter, the electroless plating catalyst or its precursor will be mainly described in detail.

The electroless plating catalyst used in this step may be any electroless plating catalyst as long as it is an active core at the time of electroless plating, and specifically, a touch having a self-catalytic reduction reaction A metal having a dielectric property (known as a metal capable of electroless plating having a lower ionization tendency than Ni) or the like. Specifically, Pd, Ag, Cu, Ni, Pt, Au, Co, etc. are mentioned. Among them, in terms of high catalyst performance, it is particularly preferable to be Ag, Pd, Pt, and Cu. As the electroless plating catalyst, a metal colloid can also be used. The electroless plating catalyst precursor used in this step can be used without any particular limitation as long as it can be an electroless plating catalyst by a chemical reaction. Metal ions which are metals exemplified as the electroless plating catalyst can be mainly used.

As a method of providing a plating catalyst or a precursor thereof to a patterned plating layer, for example, a solution obtained by dispersing or dissolving a plating catalyst or a precursor thereof in a suitable solvent is prepared, and the solution is applied. The layered body to be plated on the pattern or the layered body on which the pattern is to be plated may be immersed in the solution.

(Step Y: Plating Treatment Step) Next, the plating layer to be plated to which the plating catalyst or its precursor is applied is subjected to a plating treatment. The method of the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment). In this step, the electroless plating treatment may be separately performed, or the electroless plating treatment may be performed after the electroless plating treatment. As the electroless plating treatment and the electrolytic plating treatment, a known method can be employed. By performing the above steps, a metal layer (plating layer) can be formed on the patterned layer to be plated.

Next, the wiring of the embodiment of the present invention will be described. The conductive film of the present invention can be formed by appropriately cutting the circular arc of the pattern wiring 14 to form a wiring. The conductive film 10 can be used to form wiring. Examples of the pattern formed by the wiring include the following FIGS. 17, 18, 19, 20, and 21. However, these do not limit the wiring pattern of the present invention. Hereinafter, the wiring will be described in detail.

17 is a schematic view showing a first example of the wiring according to the embodiment of the present invention, and FIG. 18 is a schematic view showing a second example of the wiring according to the embodiment of the present invention. 19 is a schematic view showing a third example of the wiring according to the embodiment of the present invention, and FIG. 20 is a schematic view showing a fourth example of the wiring according to the embodiment of the present invention. Fig. 21 is a schematic view showing a fifth example of the wiring of the embodiment of the present invention. In addition, in FIGS. 17, 18, 19, 20, and 21, the same components as those of the conductive film 10 shown in FIG. 2 and FIG. 3 are denoted by the same reference numerals, and the detailed description thereof is omitted. instruction of. In addition, the V direction and the H direction of FIGS. 17, 18, 19, 20, and 21 correspond to the V direction and the H direction of FIG. In addition, in FIGS. 17, 18, 19, 20, and 21, the outline line 45, the outline line 47, and the first wavy line 14a and the second wavy line of the pattern wiring 14 are shown by thick lines. The intersecting part of 14b is cut off. Here, the symbol 42, the symbol 42a, the symbol 42b, the symbol 46, the symbol 46a, and the symbol 46b indicate a live line. The area indicated by symbol 44, symbol 44a, symbol 44b, and symbol 48 is not a live line and may or may not be removed. It can be divided finely without cutting. From the viewpoint of transmittance, it is preferable to form it as dummy wiring without cutting it.

The wiring 40a shown in FIG. 17 is a wiring line that cuts the conductive film 10 (see FIG. 2) perpendicularly to the V direction, that is, the arrangement direction of the circular arc. The first wavy line 14a of the pattern wiring 14 and the second wavy line 14b are cut by the outline 45 to form the live line 42. In the wiring 40a, the live line 42 serves as a conduction path, and the region 44 between the active lines 42 serves as a dummy wiring. The wiring 40b shown in FIG. 18 is a wiring line that cuts the conductive film 10 (see FIG. 2) in parallel with respect to the H direction, that is, the arrangement direction of the circular arcs. In this case, the first wavy line 14a of the pattern wiring 14 and the second wavy line 14b are also cut by the outline 45 to form the live line 42. In the wiring 40b, the live line 42 serves as a conduction path, and the region 44 between the active lines 42 serves as a dummy wiring.

Here, a case where the first wavy line 14a and the second wavy line 14b of the pattern wiring 14 are obliquely cut will be described. In the case of cutting obliquely, the angle at which the cutting is performed is defined by the angle γ formed with the arrangement direction. It is necessary to make the angle γ at which the cutting is performed coincide with the arrangement angle f of the overlapping region 22. That is, the condition of |γ|=|f|=tan ^-1 (P/Da) must be satisfied. In addition, when the first wavy line 14a and the second wavy line 14b of the pattern wiring 14 are cut in a direction orthogonal to the arrangement direction of the circular arc and a direction parallel to the arrangement direction of the circular arc, the first wavy line 14a and the second wavy line 14b are not More restrictive than P/Da. Therefore, the condition at the time of cutting is applied to the range in which the angle γ exceeds 0° and is less than 90° in absolute value. Further, the angle γ at which the cutting is performed can be changed by changing the arrangement angle f of the overlapping region 22 by changing the ratio P/Da as described above. Further, when the angle γ at which the cutting is performed is determined in advance, the ratio P/Da may be set in accordance with the angle γ. Here, the cut portion does not necessarily need to be arranged in a line at an angle γ, and the live line formed by the cutting may be cut at an angle γ. From the viewpoint of visibility, the cut portion is preferably not in a straight line but deviated from a straight line.

When the first wavy line 14a and the second wavy line 14b of the pattern wiring 14 are cut in a direction orthogonal to the arrangement direction of the circular arc and a direction parallel to the arrangement direction of the circular arc as described above, The wiring 40a shown in FIG. 17 and the wiring 40b shown in FIG. 18 are not restricted by the ratio P/Da, which is restricted by the ratio P/Da.

The wiring 40c shown in FIG. 19 cuts the first wavy line 14a and the second wavy line 14b of the pattern wiring 14 of the conductive film 10 (see FIG. 2) by two outline lines 45. A live line 42a is formed. In the wiring 40c, the live line 42a serves as a conduction path, and the region 44a between the active lines 42a serves as a dummy wiring. Further, in the wiring 40c, the outline 45 is a triangular wave shape that advances perpendicularly to the V direction, that is, the arrangement direction of the circular arc. In the wiring 40c, the polygonal polygonal regions are formed by being connected in a direction perpendicular to the arrangement direction of the circular arcs. The angle γ of the oblique side of the live line 42a is formed by being cut obliquely with respect to the arrangement direction of the circular arc in accordance with the arrangement angle f of the overlap region 22 as described above.

The wiring 40d shown in FIG. 20 cuts the first wavy line 14a and the second wavy line 14b of the pattern wiring 14 of the conductive film 10 (see FIG. 2) by two outline lines 45. A live line 42a is formed. In the wiring 40d, the live line 42a serves as a conduction path, and the region 44a between the active lines 42a becomes a dummy wiring. Further, in the wiring 40d, the outline 45 is a triangular wave shape that advances in parallel with respect to the H direction, that is, the arrangement direction of the circular arc. In the wiring 40d, the polygonal polygonal regions are formed by being connected in a direction parallel to the arrangement direction of the circular arcs. The angle γ of the oblique side of the live line 42a is formed by being cut obliquely with respect to the arrangement direction of the circular arc in accordance with the arrangement angle f of the overlap region 22 as described above.

The wiring 40e shown in FIG. 21 is a wiring in which a polygonal direction is formed by combining a direction parallel to the arrangement direction of the circular arcs, a vertical direction, and a direction of inclination, and parallel to the arrangement direction of the circular arc, and further in a polygonal shape. A virtual router is formed inside. In the wiring 40e shown in FIG. 21, the first wavy line 14a of the pattern wiring 14 and the second wavy line 14b are cut by the outline 47, thereby forming the live line 46. The live line 46 has a polygonal area 46a and a linear area 46b connecting the polygonal areas 46a. Inside the polygonal region 46a, the region 48 surrounded by the outline 47 becomes a dummy wiring. Further, the region 44b where the live line 46 is not formed also becomes a dummy wiring. In the wiring 40e, the live line 46 serves as a conductor, and is energized in the polygonal area 46a and the linear area 46b. Further, the region 48 inside the polygonal region 46a is separated from the polygonal region 46a by cutting the first wavy line 14a and the second wavy line 14b by the outline 47, and thus is not energized. The angle γ of the oblique side of the outer side of the polygonal region 46a and the angle γ of the inner inclined surface are also formed by being cut obliquely with respect to the arrangement direction of the circular arc in accordance with the arrangement angle f of the overlapping region 22 as described above.

As described above, the wiring can be formed using the conductive film of the present invention, and the wiring can be used for an antenna and a touch panel sensor, for example, in addition to a conductive wiring for passing a current. Further, the wiring using the conductive film of the present invention can suppress the generation of the spots similarly to the conductive film 10.

Next, a touch panel sensor according to an embodiment of the present invention will be described. Fig. 22 is a schematic view showing a touch panel sensor according to an embodiment of the present invention. 23 to 25 and 26 to 28 are schematic cross-sectional views of the touch panel sensor of the embodiment of the present invention shown in Fig. 22. Furthermore, in the touch panel sensor 50 shown in FIG. 22 and FIGS. 23 to 25 and FIGS. 26 to 28, the conductive film shown in FIGS. 2, 3, and 8 is applied. The same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

The touch panel sensor 50 shown in FIG. 22 is used together with a display device such as a liquid crystal display device, and is disposed on the display device. Therefore, it is transparent in order to recognize the image displayed by the display device. The display device is not particularly limited as long as a predetermined image including an animation or the like is displayed on the screen, and an organic EL (Organic Electro Luminescence) display device, electronic paper, or the like can be used in addition to the liquid crystal display device.

The touch panel sensor 50 has a touch panel portion 52 and a controller 54, and the touch panel portion 52 and the controller 54 are connected by, for example, a connection wiring 55. The contact of the touch panel portion 52 of the touch panel sensor 50 is detected by the controller 54 at a position where the electrostatic capacitance in the touch panel sensor 50 changes due to contact of a finger or the like. The controller 54 is an external device of the touch panel sensor 50, such as a well-known person including position detection for a capacitive touch panel.

The X direction shown in Fig. 22 is orthogonal to the Y direction. In the touch panel portion 52 of the touch panel sensor 50, a plurality of first conductive layers 60 extending in the X direction are disposed with a space in the Y direction. Further, a plurality of second conductive layers 70 extending in the Y direction are disposed with a space in the X direction. Each of the first conductive layers 60 is electrically connected to the first terminal portion 62 at one end thereof. Further, each of the first terminal portions 62 is electrically connected to the first wiring 64. Each of the first wires 64 is collected in the connector portion 66, and is connected to the controller 54 by the connection wiring 55. Each of the second conductive layers 70 is electrically connected to the second terminal portion 72 at one end thereof. Each of the second terminal portions 72 is electrically connected to the conductive second wiring 74. Each of the second wires 74 is collected in the connector portion 76, and is connected to the controller 54 by the connection wiring 55. The terminal portion may be disposed not only at one end of the conductive layer but also at both ends and electrically connected to the wiring, and then collected in the connector portion.

Each of the first conductive layer 60 and the second conductive layer 70 functions as a detecting electrode for detecting contact in the touch panel sensor 50. The sensor portion 52a for detecting contact is configured by the first conductive layer 60 and the second conductive layer 70. The first terminal portion 62, the first wiring 64, the connector portion 66, the second terminal portion 72, the second wiring 74, and the connector portion 76 are also collectively referred to as a peripheral wiring portion 52b. The first conductive layer 60, the first terminal portion 62, the first wiring 64, and the connector portion 66 have the same configuration as the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76.

As shown in FIG. 23, in the touch panel sensor 50, a first conductive layer 60 is formed on the surface 12a of the substrate 12, and a second conductive layer 70 is formed on the back surface 12b of the substrate 12. A protective layer 18 is provided on the first conductive layer 60 via the bonding layer 16, and a protective layer 18 is provided on the second conductive layer 70 via the bonding layer 16. Although not shown in FIG. 23, the first terminal portion 62, the first wiring 64, and the connector portion 66 are formed on the surface 12a of the substrate 12 on which the first conductive layer 60 is formed. The first terminal portion 62, the first wiring 64, and the connector portion 66 may be formed using the conductive film 10 in the same manner as the first conductive layer 60. Further, although not shown in FIG. 23, the second terminal portion 72, the second wiring 74, and the connector portion 76 are formed on the back surface 12b of the substrate 12 on which the second conductive layer 70 is formed. The second terminal portion 72, the second wiring 74, and the connector portion 76 may be formed using the conductive film 10 in the same manner as the second conductive layer 70.

The first conductive layer 60 is formed on the surface 12a of one substrate 12, and the second conductive layer 70 is formed on the back surface 12b, whereby the position of the first conductive layer 60 and the second conductive layer 70 can be reduced even if the substrate 12 is shrunk. The deviation of the relationship. Each of the first conductive layer 60 and the second conductive layer 70 is schematically illustrated in a rod shape. However, the configuration may be, for example, the wiring 40a to the wiring 40c shown in FIGS. 17 to 19 . Each of the first conductive layer 60 and the second conductive layer 70 includes the pattern wiring 14 . The surface 18a of the protective layer 18 becomes the surface of the touch panel sensor 50. In the touch panel sensor 50, the substrate 12 is preferably a transparent substrate. Furthermore, when the touch panel sensor 50 is made flexible, for example, it preferably contains polyethylene terephthalate (PET), a cyclic olefin polymer (COP), a cyclic olefin copolymer. Polyolefins such as (COC).

The configuration of the touch panel sensor 50 is not limited to the configuration shown in FIG. 23, and may be, for example, a configuration in which one conductive layer is provided on one substrate 12. As in the touch panel sensor 50 shown in FIG. 24 and FIG. 25, the surfaces 12a of the substrate 12 on which the pattern wirings 14 are formed may be brought into contact with each other. Further, as in the touch panel sensor 50 shown in FIG. 26 and FIG. 27, the direction of the surface 12a of the substrate 12 on which the pattern wiring 14 is formed may be aligned and the back surface 12b of the pattern wiring 14 may be pasted. The surface 12a of the substrate 12 is joined. Further, as in the touch panel sensor 50 shown in FIG. 28, the back surface 12b of the substrate 12 on which the pattern wiring 14 is not formed may be brought into contact with each other. In addition, when the bonding is performed, the protective layer 18 may be disposed between the two substrates 12 as shown in FIG. 24 and FIG. 26, and may also be as shown in FIG. 25, FIG. 27 and FIG. The touch panel sensor 50 shown in FIG. 28 does not provide a protective layer 18 between the two substrates 12.

In the touch panel sensor 50, by using the conductive film 10, in addition to functioning as a touch panel sensor, generation of the speckle can be suppressed. The touch panel sensor 50 is formed by forming the conductive sheet 11 on the surface 12a of one substrate 12, and forming the conductive sheet 11 on the back surface 12b, and is electrically conductive. The structure in which the film 10 overlaps has the same configuration. As described above, the method of superposing the conductive sheets 11 is preferably such that the arrangement direction of the two conductive sheets 11 , that is, the H direction and the V direction are aligned (see FIG. 11 ). Further, as shown in FIG. 12 or FIG. 13, the H direction may be aligned with the V direction, and the conductive sheet body 11 may be laminated by changing the angle. In any of the lamination methods, of course, both functions as the touch panel sensor 50, and the generation of the spots can be suppressed.

The present invention basically constitutes the above. In the above, the conductive film, the wiring, and the touch panel sensor of the present invention have been described in detail. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Improvement or change. [Example 1]

Hereinafter, the present invention will be more specifically described by way of examples of the invention. Further, the materials, the amounts used, the ratios, the processing contents, the processing procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the invention. Therefore, the scope of the invention should not be construed as being limited by the specific examples shown below.

In the present Example, conductive films of Examples 1 to 6 and Comparative Examples 1 and 2 were produced, and spots were evaluated. The spots were evaluated in the following manner.

(Evaluation of Spots) The conductive films of Examples 1 to 6 and Comparative Examples 1 and 2 were irradiated with light of a white light-emitting diode without any restriction, and the presence or absence of streaky reflected light was observed. The presence or absence of streaked reflected light was evaluated by the evaluation points of the following evaluation criteria. In addition, the evaluation was performed by 10 subjects, and the number of people who recognized the stripe-shaped reflected light among the 10 subjects was evaluated. Evaluation criteria "A": A person who recognizes the stripe-shaped reflected light (spot) is 0 (unknown) "B": A person who recognizes the stripe-shaped reflected light (spot) is 1 to 4 "C": The number of people who can see the streaked light (spots) is 5 to 9 "D": 10 people who can see the streaked light (spot) are visible (all members can see)

Hereinafter, Examples 1 to 6 and Comparative Example 1 and Comparative Example 2 will be described. (Example 1) <Preparation of Composition 1> A composition 1 was obtained by preparing a liquid having the following composition. Isopropyl Alcohol (IPA) 94.9 parts by mass of polyacrylic acid 3 parts by mass of Methylenebisacrylamide (MBA) 2 parts by mass of IRGACURE (registered trademark) 127 (manufactured by BASF) 0.1 parts by mass

<Preparation of the laminated body> The composition 1 was applied to the surface of the substrate so that the A4300 (trade name: Toyobo Co., Ltd. product) having a thickness of 100 μm was used as a substrate and the film thickness was 0.5 μm. Hereinafter, A4300 (trade name, manufactured by Toyobo Co., Ltd.) is also simply referred to as a PET film. Then, a mask having a pattern which becomes the pattern wiring 14 shown in FIG. 2 is placed on the dry film of the composition 1, and an ultraviolet light (Ultraviolet, UV) lamp deep ultraviolet lamp (Deep UV Lamp) is used across the mask. ) (made by Ushio) for exposure. Then, development was carried out by immersing in a 1% by mass aqueous sodium carbonate solution at 40 ° C for 5 minutes to obtain a substrate including a patterned plated layer. The obtained substrate was immersed for 5 minutes in a sample obtained by diluting only MAT-2A of Pd catalyst-imparting liquid MAT-2 (manufactured by Uemura Kogyo Co., Ltd.) to 5 times, and washed twice with pure water. Then, it was immersed in a reducing agent MAB (manufactured by Uemura Industrial Co., Ltd.) at 36 ° C for 5 minutes, and washed twice with pure water. Then, it was immersed in an electroless plating solution Thru-Cup PEA (manufactured by Uemura Industrial Co., Ltd.) for 60 minutes at room temperature, and washed with pure water to obtain a plating method in which a mesh-like wiring was formed. The conductive film of Example 1. Here, the mesh wiring pattern has a wiring width of 4.5 μm, a diameter Da (see FIG. 3) of 200 μm, and a pitch P (see FIG. 3) of 140 μm.

(Example 2) 0.25 g of blocked polyisocyanate (Duranate (registered trademark) SBN-70D, manufactured by Asahi Kasei Chemicals Co., Ltd.) and acrylic resin for isocyanate curing (DIC) 1.2 g of Acrydic (registered trademark) A-817) was dissolved in 4.0 g of methyl ethyl ketone to obtain a hardening prepolymer solution. To the solution, 0.1 g of Pd (HPS-NOct ₃ Cl), 3-aminopropyltrimethoxydecane (manufactured by Tokyo Chemical Industry Co., Ltd.), and 0.5 g of a tackifier were produced by a method described later. Polyvinylpyrrolidone (polyvinylpyrrolidone K90 manufactured by Tokyo Chemical Industry Co., Ltd., viscosity average molecular weight: 630,000) 1.5 g of a solution prepared by dissolving 1.5 g of n-propanol. This was stirred until it became uniform, and a catalyst ink having a solid content concentration (the ratio of the solute component (other than methyl ethyl ketone and n-propanol as a solvent) in the solution) was 39% by mass. The viscosity of the obtained ink was 3.6 × 10 ³ mPa·s. The ink was printed on the A4300 (trade name: Toyobo Co., Ltd.) having a thickness of 100 μm by using a straw to form the pattern wiring 14 as shown in FIG. The PET film was dried for 5 minutes by a hot plate at 80 ° C, and further heated by a hot plate at 150 ° C for 30 minutes to obtain a PET film having an electroless plating underlayer. The obtained PET film was immersed in an electroless plating solution prepared as described later heated to 80 ° C for 180 seconds. Thereafter, the taken-out film was washed with water to obtain a conductive film of Example 2 by a plating method in which a metal plating film was formed.

<Preparation of Electroless Nickel Plating Solution> To a 1 liter flask, Melplate (registered trademark, the same below) NI-6522LF1 (manufactured by Meltex) 50 mL, Merpe was added. Melplate NI-6522LF2 (manufactured by Mesquite) 150 mL and Melplate NI-6522LF Additive (manufactured by Meite) 5 mL, and then add pure water to make the total amount of the solution Become 1 liter. To the solution, a 10% by volume aqueous sulfuric acid solution was added to adjust the pH of the solution to 4.6 to prepare an electroless plating solution.

(Production of Pd[HPS-NOct ₃ Cl]) To a one-liter two-necked flask, 4.3 g of palladium acetate (Kawaken Fine Chemicals Co., Ltd.) and 200 g of chloroform were added, and the mixture was stirred until it became uniform. . A solution obtained by dissolving HPS-NOct ₃ Cl 18.0 g produced in [Synthesis Example 2] described in JP-A-2014-159620 in 200 g of chloroform was added to the solution using a dropping funnel. . Into the dropping funnel, 100 g of ethanol was used to rinse into the reaction flask. The mixture was stirred at 60 ° C for 17 hours. After the liquid temperature was cooled to 30 ° C, the solvent was distilled off. The obtained residue was dissolved in 300 g of tetrahydrofuran and cooled to 0 °C. This solution was added to 6,000 g of isopropanol at 0 ° C for reprecipitation purification. The precipitated polymer was subjected to filtration under reduced pressure, and vacuum-dried at 60 ° C to obtain a complex of a highly branched polymer having an ammonium group at the molecular terminal and a Pd particle in the form of a black powder (Pd[HPS-NOct _3] Cl]) 19.9 g. The Pd content of the obtained Pd[HPS-NOct3Cl] was 11% by mass based on the results of luminescence analysis by Inductively Coupled Plasma (ICP). In addition, according to a Transmission Electron Microscope (TEM) image, the Pd particle size is approximately 2 nm to 4 nm.

(Example 3) (Preparation of silver halide emulsion) The following two liquids and three liquids were simultaneously added to the following one liquid which was kept at 38 ° C and pH 4.5 while stirring for 20 minutes. The amount of % forms a nuclear particle of 0.16 μm. Then, the following four liquids and five liquids were added over 8 minutes, and the remaining 10% of the following two liquids and three liquids were added over 2 minutes, and it grew to 0.21 micrometer. Further, 0.15 g of potassium iodide was added, and after aging for 5 minutes, particle formation was completed.

1 liquid: water 750 ml gelatin 9 g sodium chloride 3 g 1,3-dimethylimidazolidin-2-thione 20 mg sodium thiobenzenesulfonate 10 mg citric acid 0.7 g 2 solution: water 300 ml silver nitrate 150 g 3 liquid: water 300 ml sodium chloride 38 g potassium bromide 32 g hexachloroantimonate (III) potassium (0.005% KCl 20% aqueous solution) 8 ml ammonium hexachloroantimonate (0.001% NaCl 20% aqueous solution) 10 ml 4 liquid: water 100 ml silver nitrate 50 g 5 liquid: water 100 ml sodium chloride 13 g potassium bromide 11 g Yellow blood salt 5 mg

Thereafter, water washing is carried out by a flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C, and sulfuric acid was used to lower the pH to a silver halide precipitate (range of pH 3.6 ± 0.2). Then, about 3 liters of the supernatant was removed (first water wash). Further, after adding 3 liters of distilled water, sulfuric acid was added until precipitation of silver halide. Again, about 3 liters of supernatant was removed (second wash). Further, the same operation as the second water washing (the third water washing) was repeated once, and then the water washing and desalting step was ended. The washed and desalted emulsion was adjusted to pH 6.4, pAg7.5, gelatin 3.9 g, sodium thiobenzenesulfonate 10 mg, sodium thiobenzenesulfinate 3 mg, sodium thiosulfate 15 mg and chlorogold Chemically sensitized with 10 mg of acid at 55 ° C for optimal sensitivity, then added 1,3,3a,7-tetraazaindene 100 mg as a stabilizer, and Plockel as a preservative (Proxel) (trade name, manufactured by ICI Co., Ltd.) 100 mg. The emulsion obtained finally contained 0.08 mol% of silver iodide, the ratio of silver chlorobromide was 70 mol% of silver chloride, 30 mol% of silver bromide, the average particle diameter was 0.22 μm, and the coefficient of variation was 9%. Silver iodochlorobromide cube particle emulsion.

(Preparation of a composition for forming a silver salt emulsion layer) To the emulsion, 1,3,3a,7-tetraazaindene 1.2 × 10 ^-4 mol / mol Ag, hydroquinone 1.2 × 10 ^- was added to the emulsion. ² mol/mol Ag, citric acid 3.0×10 ⁻⁴ mol/mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g/mol Ag, The pH of the coating liquid was adjusted to 5.6 with citric acid to obtain a composition for forming a silver salt emulsion layer.

(Silver salt emulsion layer forming step) After corona discharge treatment was performed on a 100 μm thick PET film, a gelatin layer having a thickness of 0.1 μm as an undercoat layer was provided on one side of the PET film, and then on the undercoat layer. An antihalation layer containing a dye having an optical density of about 1.0 and decolorized by a base of the developer is provided. The composition for forming a silver salt emulsion layer is applied onto the antihalation layer, and further, a gelatin layer having a thickness of 0.15 μm is provided to obtain a polyethylene terephthalate having a silver salt emulsion layer formed on one side thereof. Diester film. The silver salt emulsion layer formed had a silver content of 6.0 g/m ² and a gelatin amount of 1.0 g/m ² .

(Exposure development step) One side of the PET film was exposed by using a mask having a pattern of the pattern wiring 14 shown in FIG. 2 as parallel light using a high-pressure mercury lamp as a light source. After the exposure, development was carried out by the developer described below, and development treatment was carried out using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fujifilm Co., Ltd.). Further, the mixture was rinsed with pure water and dried to obtain a polyethylene terephthalate film in which a pattern wiring containing silver fine wires and a gelatin layer were formed. Further, the gelatin layer was formed between the fine silver wires, and the amount of silver in the silver fine wires at this time was 5.4 g/m ² according to the fluorescent X-ray analysis. Thus, the conductive film of Example 3 using the silver salt method was obtained.

(Example 4) Next, a 100 μm-thick A4300 (trade name, manufactured by Toyobo Co., Ltd.) was used as a substrate, and copper was vapor-deposited on the surface of the substrate to form a copper foil having a thickness of 8 μm. Then, a negative resist was applied onto the copper foil surface with a thickness of about 6 μm using a roll coater, and dried at 90 ° C for 30 minutes. The negative resist was irradiated with ultraviolet light (UV light) of 100 mJ/cm ² through a mask having a pattern of the pattern wiring 14 shown in Fig. 2 . Then, the negative resist was subjected to development treatment using a 3% aqueous sodium carbonate solution. Thereby, a resist pattern is formed in a portion corresponding to the pattern wiring, and a portion other than the resist is removed. Then, the exposed portion of the copper foil was removed by etching using a ferric chloride solution having a specific gravity of 1.45, and the remaining resist was peeled off. Thereby, the conductive film of Example 4 by the vapor deposition method was obtained.

(Example 5) Production of silver-plated copper powder (acid cleaning) 60 g of dendritic electrolytic copper powder (manufactured by Mitsui Mining & Mining Co., Ltd., trade name "MF-D2", diameter: 10 μm) as a raw material copper powder 100 ml of a sulfuric acid aqueous solution of about 5 mass% as washing water was added, and the mixture was stirred at 20 ° C for 10 minutes, and then filtered and acid-washed. Thereafter, the washing was repeated until the filtrate became neutral. Specifically, 3 L of washing water was used in total for 6 times of acid washing. (1st plating step) Then, the acid-cleaned raw material copper powder was transferred to a plastic container having a volume of 1 liter, and 31.5 g of ammonium carbonate, Ethylene Diamine Tetraacetic Acid (Ethylene Diamine Tetraacetic Acid) was added thereto. An aqueous solution of 63 g of EDTA) and 250 g of water was prepared to prepare a copper dispersion. Then, while stirring, an aqueous solution containing 5.25 g of silver nitrate and 32.4 g of water was added to the copper dispersion, and silver displacement plating was performed. Then, the dispersion liquid after the silver replacement plating was filtered, washed, and dried to obtain a raw material copper powder in which 5 parts by mass of silver was plated with respect to 100 parts by mass of the raw material copper powder. For the raw material copper powder plated with silver as described above, a 50% particle diameter (D50%) was measured using Microtrac HRA (manufactured by Nikkiso Co., Ltd.), and as a result, it was 8.39 μm. Further, the tap density was measured by the following method and found to be 2.99 g/cm ³ .

[Torch tightness] (i) 100 g of raw copper powder (sample) plated with silver was slowly dropped into a 100 ml measuring cylinder using a funnel. (ii) The measuring cylinder was placed on a knock-tightness measuring device, and the sample was compressed by dropping 600 times at a drop distance of 20 mm and 60 times/min. The volume of the sample after compression was measured. (iii) The knocking degree (g/cm ³ ) was calculated by dividing the mass (g) of the sample by the volume (cm ³ ) after compression.

(Pulverization step) Then, 0.1 parts by mass of stearic acid as a lubricant is added to 100 parts by mass of the first-plated copper powder obtained in the first plating step, and pulverized in a ball mill. And obtained a pulverized powder. The pulverization conditions were set to 20 ° C, the number of revolutions: 30 rpm, and carried out for 60 minutes. Further, with respect to the pulverized powder obtained in the manner described above, a 50% particle diameter (D50%) was measured using Microtrac HRA (manufactured by Nikkiso Co., Ltd.), and as a result, it was 8.04 μm. Further, the knocking degree was measured by the method described above, and as a result, it was 3.85 g/cm ³ . (Second plating step) Then, the pulverized powder obtained in the pulverization step is transferred to a plastic container having a volume of 1 liter, and silver displacement plating is performed in the same manner as the first plating step. Obtained silver-plated copper powder. In addition, in the second plating step, 10 parts by mass of silver was plated with respect to 100 parts by mass of the raw material copper powder. The silver-plated copper powder finally obtained in the above manner was plated with 15 parts by mass of silver relative to 100 parts by mass of the raw material copper powder.

(Production of the conductive paste (dispersion step)) 100 parts by mass of the silver-plated copper powder produced as described above, and 18 parts by mass of the polyester resin as a binder resin (Toyo Textile Co., Ltd., trade name) "Vylon 550"), a hardening agent of 4.5 parts by mass in terms of solid content (closed isocyanate (manufactured by Nippon Polyurethane Industry, trade name "Coronate 2516") And 47 parts by mass of butyl cellosolve acetate as a solvent (abbreviated as BCA (Butyl Cellosolve Acetate) in the table), and pre-mixed so that the silver-plated copper powder is mixed with other components. Thereafter, the pre-mixture was dispersed by a three-roll mill to obtain a conductive paste.

<Preparation of a laminate] A conductive paste having a thickness of 100 μm (manufactured by Toyobo Co., Ltd.) was used as a substrate on the surface of the substrate, and the conductive paste was formed into a pattern wiring as shown in FIG. 2 by a printing method. 14 pattern. Then, the substrate was held in a thermostat at a temperature of 150 ° C for 30 minutes to harden the conductive paste and dry it. Thus, the conductive film of Example 5 by the printing method was obtained.

(Embodiment 6) The sixth embodiment is the same as the first embodiment except that the first wavy line 14a is in contact with the second wavy line 14b as shown in Fig. 7, and therefore the configuration is the same as that of the first embodiment. Detailed descriptions thereof are omitted. In Example 6, the diameter Da (refer to Fig. 7) was 200 μm, and the pitch P (refer to Fig. 7) was 200 μm.

(Comparative Example 1) The comparative example 1 is the same as the first embodiment except that the pattern wiring 90a shown in Fig. 29 is formed, and the detailed description thereof will be omitted. As shown in FIG. 30, the pattern wiring 90a of Comparative Example 1 has a rhombic pattern and is formed by a straight line 92 having a width of 0.9 μm. The size of the opening is 400 μm × 500 μm.

(Comparative Example 2) Comparative Example 2 is the same as that of the first embodiment except that the pattern wiring 90b shown in Fig. 31 is formed, and therefore detailed description thereof will be omitted. As shown in FIGS. 32 and 33, the pattern wiring 90b of Comparative Example 2 is formed of a wavy line 94 having a width of 0.9 μm. The wavy line 94 is formed by connecting a plurality of arcs 96 of a plurality of 90 degrees. An opening is formed by four wavy lines 94. The size of the opening is 400 μm × 500 μm.

[Table 1]

As shown in Table 1, no spots were produced in Examples 1 to 6. On the other hand, Comparative Example 1 is a diamond-shaped lattice and spots are generated. In Comparative Example 2, although the pattern of the circular arc was used, the arc was 90°, and thus spots were generated.

The observation results of Example 1 are shown in Fig. 34, and the observation results of Comparative Example 1 are shown in Fig. 35. As shown in FIG. 34, no spots were observed in Example 1. On the other hand, as shown in Fig. 35, in Comparative Example 1, streak-like reflected light was generated and spots were generated. [Embodiment 2]

In the present embodiment, the touch panel sensors of Embodiments 10 to 17 are fabricated, and the driving and spotting of the touch panel sensor are evaluated. Spots were evaluated by the evaluation criteria. The driving of the touch panel sensor is evaluated by whether the contact can be detected after the finger actually touches the touch panel sensor. The case where the contact can be detected is "A", and the case where the contact cannot be detected is "B".

(Embodiment 10) In the tenth embodiment, the first conductive layer 60 and the first terminal portion 62 of the touch panel sensor 50 shown in Fig. 22 are formed on the surface of the first substrate, as compared with the first embodiment. Pattern wiring of the pattern of the first wiring 64 and the connector portion 66, and pattern wiring of the pattern of the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76 on the back surface of the second substrate As shown in FIG. 11 , the first substrate and the second substrate are stacked differently, and the touch panel sensor is mounted by using the connection wiring 55 to form a touch panel sensor. 1 is produced in the same way.

(Example 11) Example 11 was produced in the same manner as in Example 10 except that the first substrate and the second substrate were laminated in the same manner as in Example 10 except that the laminate angle was changed as shown in Fig. 12 .

(Example 12) Example 12 was produced in the same manner as in Example 10 except that the first substrate and the second substrate were laminated in the same manner as in Example 10 except that the laminate angle was changed as shown in Fig. 13 .

(Embodiment 13) In the third embodiment, the first conductive layer 60 and the first terminal portion 62 of the touch panel sensor 50 shown in Fig. 22 are formed on the surface of the first substrate, as compared with the second embodiment. Pattern wiring of the pattern of the first wiring 64 and the connector portion 66, and pattern wiring of the pattern of the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76 on the back surface of the second substrate As shown in FIG. 11 , the first substrate and the second substrate are stacked differently, and the touch panel sensor is mounted by using the connection wiring 55 to form a touch panel sensor. 2 is produced in the same way.

(Embodiment 14) In the fourth embodiment, the first conductive layer 60 and the first terminal portion 62 of the touch panel sensor 50 shown in Fig. 22 are formed on the surface of the first substrate, as compared with the third embodiment. Pattern wiring of the pattern of the first wiring 64 and the connector portion 66, and pattern wiring of the pattern of the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76 on the back surface of the second substrate As shown in FIG. 11 , the first substrate and the second substrate are stacked differently, and the touch panel sensor is mounted by using the connection wiring 55 to form a touch panel sensor. 3 is made in the same way.

(Embodiment 15) In the fifteenth embodiment, the first conductive layer 60 and the first terminal portion 62 of the touch panel sensor 50 shown in Fig. 22 are formed on the surface of the first substrate, as compared with the fourth embodiment. Pattern wiring of the pattern of the first wiring 64 and the connector portion 66, and pattern wiring of the pattern of the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76 on the back surface of the second substrate As shown in FIG. 11 , the first substrate and the second substrate are stacked differently, and the touch panel sensor is mounted by using the connection wiring 55 to form a touch panel sensor. 4 is made in the same way.

(Embodiment 16) In the sixth embodiment, the first conductive layer 60 and the first terminal portion 62 of the touch panel sensor 50 shown in Fig. 22 are formed on the surface of the first substrate, as compared with the fifth embodiment. Pattern wiring of the pattern of the first wiring 64 and the connector portion 66, and pattern wiring of the pattern of the second conductive layer 70, the second terminal portion 72, the second wiring 74, and the connector portion 76 on the back surface of the second substrate As shown in FIG. 11 , the first substrate and the second substrate are stacked differently, and the touch panel sensor is mounted by using the connection wiring 55 to form a touch panel sensor. 5 is made in the same way.

(Example 17) Example 17 is different from Example 10 except that the diameter Da (see Fig. 7) is 200 μm and the pitch P (see Fig. 7) is 200 μm. 10 is made in the same way.

[Table 2]

As shown in Table 2, Examples 10 to 17 are those that can detect contact and function as a touch panel sensor. Further, no spots were generated. As such, the composition of the present invention can obtain a touch panel sensor in which generation of spots is suppressed.

10, 10a, 10b, 10c‧‧‧ conductive film
11, 11a, 11b‧‧‧ conductive sheet
12, 100‧‧‧ substrate
12a, 18a‧‧‧ surface
12b‧‧‧Back
14‧‧‧ pattern wiring
14a‧‧‧1st wavy line
14b‧‧‧2nd wavy line
15‧‧‧Electrical thin wires
16‧‧‧Next layer
17a, 17b, 96‧‧‧ arc
17c‧‧‧End
18‧‧‧Protective layer
19‧‧‧ imaginary circle
20‧‧‧ openings
21a, 21b, 23‧‧‧ intersection
22‧‧‧Overlapping areas
32‧‧‧Photosensitive layer
32a‧‧‧Exposure area
32b‧‧‧Unexposed areas
34‧‧‧1st patterned coating
36‧‧‧Laminated body with patterned coating
38‧‧‧metal layer
40a, 40b, 40c, 40d, 40e‧‧‧ wiring
42, 42a, 46‧‧‧ live lines
44, 44a, 44b, 48, 102‧‧‧ areas
45, 47‧‧‧ outline
46a‧‧‧Polygonal area
46b‧‧‧Line area
50‧‧‧Touch panel sensor
52‧‧‧Touch panel
52a‧‧‧Sensor Department
52b‧‧‧Circuit wiring department
54‧‧‧ Controller
55‧‧‧Connecting wiring
60‧‧‧1st conductive layer
62‧‧‧1st terminal part
64‧‧‧1st wiring
66, 76‧‧‧ Connector Department
70‧‧‧2nd conductive layer
72‧‧‧2nd terminal section
74‧‧‧2nd wiring
90a, 90b‧‧‧ pattern wiring
92‧‧‧ Straight line
94‧‧‧ wavy line
104‧‧‧Light source
108‧‧‧Reflected light
B‧‧‧ line
C‧‧‧ center line
C ₁ , C ₂ ‧‧‧ line
Da‧‧‧diameter
H, V‧‧ Direction
L‧‧‧Exposure light
O‧‧ Center
P‧‧‧ spacing
Pc‧‧‧ distance γ‧‧‧ angle θ‧‧‧ central angle
f‧‧‧Arrangement angle

FIG. 1 is a schematic view for explaining reflection of stripe-shaped light. Fig. 2 is a schematic plan view showing a conductive film according to an embodiment of the present invention. Fig. 3 is a plan view showing an enlarged conductive film according to an embodiment of the present invention. 4 is a schematic view showing a conductive thin wire constituting a pattern of a conductive film according to an embodiment of the present invention. Fig. 5 is a schematic view showing a conductive thin wire constituting a pattern of a conductive film according to an embodiment of the present invention. Fig. 6 is a schematic view for explaining a pattern of a conductive film according to an embodiment of the present invention. Fig. 7 is a schematic view showing another example of the conductive film according to the embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing a configuration of a conductive film according to an embodiment of the present invention. FIG. 9 is a schematic plan view showing a configuration of a conductive film according to an embodiment of the present invention. FIG. 10 is a schematic plan view showing a configuration of a conductive film according to an embodiment of the present invention. FIG. 11 is a schematic plan view showing another example of the configuration of the conductive film according to the embodiment of the present invention. FIG. 12 is a schematic plan view showing another example of the configuration of the conductive film according to the embodiment of the present invention. FIG. 13 is a schematic plan view showing another example of the configuration of the conductive film according to the embodiment of the present invention. Fig. 14 is a schematic cross-sectional view showing a method of manufacturing a conductive film in order of steps. Fig. 15 is a schematic cross-sectional view showing a method of manufacturing a conductive film in order of steps. Fig. 16 is a schematic cross-sectional view showing a method of manufacturing a conductive film in order of steps. Fig. 17 is a schematic view showing a first example of the wiring of the embodiment of the present invention. Fig. 18 is a schematic view showing a second example of the wiring of the embodiment of the present invention. Fig. 19 is a schematic view showing a third example of the wiring of the embodiment of the present invention. Fig. 20 is a schematic view showing a fourth example of the wiring of the embodiment of the present invention. Fig. 21 is a schematic view showing a fifth example of the wiring of the embodiment of the present invention. Fig. 22 is a schematic view showing a touch panel sensor according to an embodiment of the present invention. Fig. 23 is a schematic cross-sectional view showing the touch panel sensor of the embodiment of the present invention shown in Fig. 22; Fig. 24 is a schematic cross-sectional view showing the touch panel sensor of the embodiment of the present invention shown in Fig. 22; Figure 25 is a schematic cross-sectional view of the touch panel sensor of the embodiment of the present invention shown in Figure 22 . Figure 26 is a schematic cross-sectional view of the touch panel sensor of the embodiment of the present invention shown in Figure 22 . Figure 27 is a schematic cross-sectional view of the touch panel sensor of the embodiment of the present invention shown in Figure 22 . Figure 28 is a schematic cross-sectional view of the touch panel sensor of the embodiment of the present invention shown in Figure 22 . 29 is a schematic view showing the configuration of Comparative Example 1. FIG. 30 is a schematic view showing an enlarged configuration of Comparative Example 1. FIG. 31 is a schematic view showing the configuration of Comparative Example 2. FIG. 32 is a schematic view showing an enlarged configuration of Comparative Example 2. FIG. Fig. 33 is a schematic view showing the wiring of Comparative Example 2 in detail. Fig. 34 is a drawing substitute photograph showing the result of Example 1. Fig. 35 is a schematic substitute photograph showing the result of Comparative Example 1.

14a‧‧‧1st wavy line

14b‧‧‧2nd wavy line

15‧‧‧Electrical thin wires

17a, 17b‧‧‧ arc

20‧‧‧ openings

21a, 21b, 23‧‧‧ intersection

22‧‧‧Overlapping areas

B‧‧‧ line

C‧‧‧ center line

C ₁ , C ₂ ‧‧‧ line

Da‧‧‧diameter

H, V‧‧ Direction

P‧‧‧ spacing

Pc‧‧‧ distance

Γ‧‧‧ angle

Φ‧‧‧ alignment angle

Claims (11)

A conductive film comprising: a conductive sheet, wherein the conductive sheet includes a substrate; and a plurality of first wavy lines are disposed on the substrate, and the directions of the semicircular arcs are different from each other And a plurality of second wavy lines disposed on the substrate, the directions of the arcs of the semicircles being different from each other, and being symmetric with respect to the arrangement direction of the first wavy line And arranging the arrangement direction of the circular arcs of each of the first wavy lines in parallel with the arrangement direction of the circular arcs of the respective second wavy lines, and the first wavy lines and the first wavy line Each of the second wavy lines is spaced apart by a predetermined distance, and the arc of each of the opposing first wavy lines is in contact with at least the arc of each of the second wavy lines; The line and the second wavy line comprise a conductive material. The conductive film according to claim 1, wherein the arc of each of the first wavy lines facing each of the first wavy lines and the respective second wavy lines The arcs of the respective second wavy lines overlap. The conductive film according to claim 1 or 2, wherein the conductive material comprises a metal or an alloy. The conductive film according to claim 1 or 2, wherein a plurality of the conductive sheets are laminated. The conductive film according to the first or second aspect of the invention, wherein the conductive sheets are aligned in a direction in which the conductive sheets are aligned, and a plurality of the conductive sheets are laminated. The conductive film according to claim 1 or 2, wherein the substrate is a transparent substrate. The conductive film according to claim 1 or 2, wherein the semicircular arc is an arc having a central angle of 170 to 190. A wiring comprising the conductive film according to any one of claims 1 to 7. The wiring according to claim 8, wherein the conductive film according to any one of items 1 to 7 of the patent application has an absolute value at an angle γ with respect to the arrangement direction. When at least one of the first wavy line and the second wavy line is cut in a range of more than 0° and less than 90° to form a conductive path, the diameter of the circular arc is set to Da. When the interval between the first wavy line and the second wavy line in the direction orthogonal to the array direction is P, the arrangement angle f defined by |tanf|=P/Da The first wavy line and the second wavy line are cut in unison. A touch panel sensor comprising the conductive film according to any one of claims 1 to 7. The touch panel sensor according to claim 10, wherein the conductive film is used for at least one of a sensor portion and a peripheral wiring portion.