TW201430360A - Electronic component operating device and detection equipment using the same - Google Patents

Abstract

Disclosed is an electronic component operating device, including: a testing mechanism; a strengthening unit; and a positioning unit. The testing mechanism is provided with at least one bearer for placing a circuit board having an electronic component. At least one probe set and testing board are provided to one side of the bearer for testing an electronic component. The strengthening unit is provided with at least one reinforcing device. The reinforcing device is provided with at least one bonding portion adhered to the circuit board, and at least one receiving portion for receiving an electronic component. The positioning unit is provided with at least one alignment part for aligning the circuit board to one side of the reinforcing device for lamination, and for urging the probe set of the testing mechanism to be in contact with contacts of the circuit board in order to implement a testing process. The circuit board is reinforced by being adhered to the bonding portion of the reinforcing device for reducing deformation. The receiving portion contains the electronic component on the circuit board so as to prevent from damaging the electronic component. The probe set is driven to precisely contact the contacts of the circuit board so as to achieve the practical effects for improving the testing quality.

Description

Electronic component operating device and testing device thereof

The invention provides a working device which can reduce the deformation of the circuit board and make the probe set accurately contact the contact points of the circuit board, thereby improving the test quality.

Nowadays, electronic components such as memory cards and ICs are packaged on the back-end packaging process by placing a plurality of well-tested wafers on a circuit board for bonding work, soldering and packaging, and cutting/forming, and finally testing. In order to ensure the quality of the electronic components, the manufacturer performs separate testing operations after the wire bonding operation and the sealing operation to screen out defective products. For example, the memory card 10 is referred to the first drawing and the subsequent packaging process. The wire bonding operation carries a plurality of wafers 12 on the strip-shaped circuit board 11, and a bonding wire is placed between the circuit board 11 and each of the wafers 12, so that the circuit of the circuit board 11 can be electrically connected to the wafer 12. The signal is transmitted. Therefore, each of the wafers 12 and the bonding wires are exposed on the circuit board 11. The packaging operation is performed on the outer covering of the wafer 12 to prevent the wafer 12 from being damaged, and then cut/formed into individual single memory cards. 10 finished products.

However, the current memory card test machine performs a test operation on a memory card that has completed the colloidal package; please refer to FIG. 2, the test machine is equipped with a plurality of test devices 20 on the machine table, and each test device 20 is provided with a plurality of test devices 20 The test board 21 of the test stand 22 is used for testing the memory card 10 with a colloidal package. Each test stand 22 has a plurality of probes 221 and is respectively connected to a card reader 23 for reading the memory card 10 to be tested. The data card reader 23 is further connected to a controller 24 (the controller can be a computer with a detection program, a control program, etc.) for detecting whether the memory card 10 is damaged or not, and in order to make the contact of the memory card 10 True electrical The probe 221 of the contact test seat 22 is respectively provided with a lower pressing mechanism above each test device 20, and each pressing mechanism is provided with a pressing rod driven by the driving source 25 for the first direction (such as the Z direction). 26, and the lower pressing head 27 is assembled at the end of the pressing lever 26, and the memory card 10 to be tested is pressed by the following; therefore, when the test socket 22 is built into the memory card 10 to be tested, the pressing mechanism is controlled The driving source 25 drives the lower pressing rod 26 to be displaced downward in the first direction, and the lower pressing rod 26 drives the lower pressing head 27 to press down the memory card 10 to be tested, so that the contact point of the memory card 10 to be tested is indeed with the test seat 22. The probe 221 is in contact with the test operation; however, since the packaged memory card 10 is coated with a colloid on the outside to protect the internal wafer and the bonding wire, when the test device 20 presses the indenter 27 under the pressing mechanism When the memory card 10 is pressed against the glue of the memory card 10, the wafer and the bonding wire are not damaged, but for the unpackaged semi-finished memory card, the wafer and the bonding wire on the circuit board are exposed, and No colloid protection, if the indenter 27 under the pressing mechanism of the test device 20 directly presses the unpackaged half When the memory card is pressed, the wafer and the bonding wire are pressed, and the wafer and the bonding wire are damaged. Therefore, the test device 20 cannot test the circuit board with the chip.

Therefore, how to provide a circuit board capable of testing a chip, and considering that the circuit board is a flexible board, can reduce the amount of deformation of the board caused by the top of the probe, so as to avoid the work device affecting the test operation, That is the standard designed by the industry.

An object of the present invention is to provide an electronic component working device, comprising a testing mechanism, a reinforcing unit and a positioning unit, wherein the testing mechanism is provided with at least one socket for receiving a circuit board and is disposed on one side of the socket. At least one probe set and a test board for testing the circuit board, the reinforcing unit is provided with at least one reinforcing device, and the reinforcing device is provided with at least one bonding portion attached to the circuit board, and the positioning unit is provided with At least one positioning component for positioning the circuit board on one side of the reinforcing device for bonding, and performing testing on the contact of the probe set of the testing mechanism against the contact of the circuit board During the test operation, the bonding part of the reinforcing device can be placed on the circuit board to strengthen the circuit board to reduce the deformation amount, so that the probe set can accurately contact the contact points of the circuit board, thereby achieving the practical benefit of improving the test quality.

A second object of the present invention is to provide an electronic component working device, comprising a testing mechanism, a reinforcing unit and a positioning unit, wherein the bearing mechanism of the testing mechanism is provided with a circuit board having electronic components, and at least one of the sockets is provided The probe set and the test board are used for testing the electronic component, and the reinforcing unit of the reinforcing unit is provided with at least one receiving portion for accommodating the electronic component, and the receiving portion has a small gap with the electronic component for the testing mechanism When the probe group is in contact with the contact of the circuit board, the electronic component can be buffered and placed on the accommodating portion, thereby preventing the electronic component from being damaged, thereby achieving the practical benefit of reducing the damage rate of the electronic component.

A third object of the present invention is to provide an electronic component working device, wherein when one of the circuit boards masks the first contact and the other contact has the second contact, the reinforcing unit of the working device is connected to the corresponding circuit of the reinforcing device. The second contact position of the board is provided with a through hole, and the test mechanism electrically contacts the first contact of the circuit board with a probe set, and electrically contacts the circuit board with the other probe set penetrating the through hole of the reinforcing device. The second contact further enables the test mechanism to be applied to test different types of circuit boards with double-sided contacts, thereby achieving practical benefits of improving test performance.

A fourth object of the present invention is to provide a detecting device for applying an electronic component working device, which is provided with a loading device, a conveying device, a working device and a central control device, wherein the conveying device is provided with at least one stage To support the circuit board to be tested outputted by the loading device, the reinforcing unit of the working device takes out the circuit board to be tested on the stage with the reinforcing device, and transfers it to the testing mechanism to perform the testing operation. After the test is completed, Transfer the detected circuit board to the stage, the stage transports the detected circuit board to the loading device, and the central control device controls and integrates the operation of each device to perform the automation operation and achieve the lifting operation. Practical benefits of performance.

[study]

10‧‧‧ memory card

11‧‧‧ boards

12‧‧‧ wafer

13‧‧‧ colloid

20‧‧‧Testing device

21‧‧‧ boards

22‧‧‧ test seat

221‧‧‧ probe

23‧‧‧Card Reader

24‧‧‧ Controller

25‧‧‧ drive source

26‧‧‧lower bar

27‧‧‧Under the indenter

〔this invention〕

30‧‧‧Working device

31‧‧‧Test institutions

311‧‧ ‧ socket

3111‧‧‧Holding Department

3112‧‧‧Bevel

3113‧‧‧through hole

312‧‧‧ drive source

313‧‧‧ Probe Set

314‧‧‧ test board

32‧‧‧Strengthening unit

321‧‧‧Reinforcement

3211‧‧‧Fitting Department

3212‧‧‧ 容 部

3213‧‧‧Drawing Department

3214‧‧‧Exhaust line

3215‧‧‧Locating pin

322‧‧‧Power source

33‧‧‧ Alignment inspection agency

331‧‧‧Image source

30A‧‧‧Working device

34A‧‧‧Testing agency

341A‧‧‧First probe set

342A‧‧‧First test board

343A‧‧‧First drive source

344A‧‧‧Second probe set

345A‧‧‧Second test board

346A‧‧‧second drive source

35A‧‧‧Strengthening unit

351A‧‧‧First Reinforcer

3511A‧‧ First First Department

3512A‧‧‧First Housing

3513A‧‧‧First suction department

3514A‧‧‧First pumping line

3515A‧‧‧First locating pin

3516A‧‧‧First perforation

352A‧‧‧First Power Source

353A‧‧‧Second Reinforcer

3531A‧‧‧Second Placing Department

3532A‧‧‧Second Accommodation

3533A‧‧‧Second suction department

3534A‧‧‧Second suction line

3535A‧‧‧Second locating pin

3536A‧‧‧Second perforation

354A‧‧‧second power source

36A‧‧‧ Alignment inspection agency

361A‧‧‧first image source

362A‧‧‧second image source

363A‧‧‧ Third image source

364A‧‧‧ fourth image source

41‧‧‧ boards

411‧‧‧ wafer

412‧‧‧Contacts

413‧‧‧Positioning holes

42, 42A‧‧‧ circuit board

421, 421A‧‧‧ wafer

422, 422A‧‧‧ first contact

423, 423A‧‧‧second joint

424‧‧‧Positioning holes

50‧‧‧Feeding device

60‧‧‧Conveyor

61‧‧‧ stage

Figure 1: Schematic diagram of the memory card and the memory card of the package.

Figure 2: Schematic diagram of the use of a conventional test device.

Figure 3 is a schematic view showing a first embodiment of the working device of the present invention.

Figure 4 is a schematic view showing the use of the first embodiment of the working device of the present invention (I).

Fig. 5 is a schematic view showing the use of the first embodiment of the working device of the present invention (2).

Figure 6 is a schematic view showing the use of the first embodiment of the working device of the present invention (3).

Figure 7 is a schematic view showing the use of the first embodiment of the working device of the present invention (4).

Figure 8 is a schematic view (1) of a second embodiment of the working device of the present invention.

Figure 9 is a schematic view (2) of a second embodiment of the working device of the present invention.

Fig. 10 is a schematic view showing the use of the second embodiment of the working device of the present invention (1).

Figure 11 is a schematic view showing the use of the second embodiment of the working device of the present invention (2).

Fig. 12 is a schematic view showing the configuration of the working device of the present invention applied to the detecting device.

In order to make the present invention further understand the present invention, a preferred embodiment will be described in detail with reference to the following: The working device of the present invention can be applied to a circuit board or a circuit board with electronic components, see 3 is a first embodiment of the working device of the present invention. The working device 30 includes a testing mechanism 31, a reinforcing unit 32 and a positioning unit. The testing mechanism 31 is provided with at least one socket for receiving a circuit board or a device. In the present embodiment, the socket 311 is provided with at least one receiving portion 3111 for receiving a circuit board having electronic components, and the opening side of the mounting portion 3111 is provided. The guiding inclined surface 3112 is configured to guide the circuit board to be inserted, and the through hole 3113 is defined in the bottom surface of the receiving portion 3111, and the testing mechanism 31 is disposed on one of the sockets 311 to have at least one probe set and a test board. Used to test boards or with electronic components Further, the test mechanism 31 is provided with a driving source for driving the probe set and the test board to be displaced in at least one direction, so that the probe set electrically contacts the contact of the circuit board, and the testing mechanism 31 also Or the probe set and the test board are fixed in a frame, and the circuit board carrying the electronic component is displaced in at least one direction by the socket, so that the contact of the circuit board is electrically contacted with the probe set, in this embodiment. The testing mechanism 31 is provided with a driving source 312 for driving the probe set 313 and the test board 314 for the first, second and third directions (such as Z, X, Y direction) displacement; the strengthening unit 32 is provided with at least one The reinforcing device 321 is provided with at least one bonding portion attached to the circuit board for reinforcing the circuit board, and further, if the circuit board has electronic components, the reinforcing device 321 can be disposed on the reinforcing device 321 There is at least one accommodating portion for accommodating the electronic component for preventing the electronic component from being damaged. In the embodiment, the reinforcing unit 32 is formed by the bottom surface of the reinforcing member 321 as the bonding portion 3211, and is corresponding to the circuit board. Each electronic component is recessed with a receiving portion 3212 for accommodating the electronic component The reinforcing member 321 of the reinforcing unit 32 can be mounted on one side of the bearing 311 of the testing mechanism 31 for reinforcing the circuit board or mounted on a power source, and the power source drives the reinforcing device 321 to be placed on the circuit board. For reinforcing the circuit board, wherein the power source can be independently configured on the machine to drive the 321 displacement, or the 321 can be assembled to the power source of other related devices to drive the 321 displacement. In the embodiment, the reinforcing unit 32 is disposed above the socket 311 of the testing mechanism 31 to provide a power source 322 for driving the reinforcing device 321 for the first and second directions, and temporarily storing the testing mechanism 31 and the pick-and-place material. Transferring the circuit board between the zones; the positioning unit is provided with at least one positioning component for positioning the circuit board during the test operation, the positioning component may be a suction part or a clamping part, and further, the positioning unit may be a reinforcing unit The reinforcing device is provided with at least one suction portion or clamping portion for positioning the circuit board during the test operation, or at least one suction portion or clamping portion at the bearing seat of the testing mechanism for testing operation Positioning board In this embodiment, the positioning unit based communication with a plurality of suction portion 3214 of the exhaust line 3213 to the bottom surface 321 of the reinforcement, with To locate and position the circuit board, the positioning unit is provided with at least one positioning pin 3215 of the positioning circuit board at the bottom of the reinforcing device 321; further, the working device 30 can accurately contact the probe group 313 for electrical contact with the circuit board. The contact of the board further includes a matching inspection mechanism 33 having at least one image source for taking the contact of the circuit board, or the contact of the circuit board and the probe set 313 of the testing mechanism 31, in this embodiment The image capturing source 331 of the alignment inspection mechanism 33 includes a prism group and a CCD image picker, and can be moved to a position between the probe set 313 and the circuit board. The image capturing source 33 of the alignment inspection mechanism 33 of the present invention. Since the prism group is installed, the probe group 313 and the circuit board can be simultaneously imaged by the prism group, and the image of the lens group is taken by the CCD imager to obtain the image data. The image data is transmitted to a central control device (not shown) for comparison. If the comparison result exceeds the error value, the central control device can control the driving source 312 of the testing mechanism 31 to drive the probe group 313 to perform position correction adjustment. The probe set 313 can be accurately connected to the circuit board .

Referring to FIG. 4, the working device 30 of the present invention can be applied to test a circuit board 41 (for example, an unpackaged semi-finished memory card) having a plurality of wafers 411, one of which has a plurality of wafers 411 on one side and the other side on the other side. The plurality of contacts 412 are provided with at least one positioning hole 413. The circuit board 41 can be transferred to the socket 311 of the testing mechanism 31 by using other loading mechanisms (not shown), or by the reinforcing unit 32. The reinforcing device 321 transfers the circuit board 41 to the socket 311. In the embodiment, the positioning unit is provided with a plurality of suction portions 3213 on the reinforcing member 321 of the reinforcing unit 32, and the reinforcing device 321 can be used first. The positioning pin 3215 is inserted into the positioning hole 413 of the circuit board 41, and the circuit board 41 having the plurality of wafers 411 is sucked by the plurality of suction portions 3213, so that the bonding portion 3211 of the reinforcing member 321 is placed on the circuit board 41. The plurality of accommodating portions 3212 accommodate the wafer 411 on the circuit board 41. The accommodating portion 3212 and the wafer 411 have a small gap for buffering, and then the power source 322 drives the 321 to be displaced. The circuit board 41 of the chip 411 is transferred to the upper portion 311 of the testing mechanism 31. Referring to FIG. 5, the reinforcing unit 32 drives the reinforcing device 321 to be displaced in the first direction by the power source 322, and has a plurality of wafers 411. The circuit board 41 is placed on the receiving portion 3111 of the socket 311. Referring to FIG. 6, in order to ensure that the probe set 313 of the testing mechanism 31 can accurately face the contact point 412 of the circuit board 41, the alignment inspection mechanism The image source 331 of 33 is displaced to the position between the circuit board 41 and the probe set 313, and the contact point 412 of the circuit board 41 and the probe set 313 of the test mechanism 31 are taken, and the image data is transmitted to the central control. The central control device can control the driving source 312 of the testing mechanism 31 to drive the probe set 313 for displacement adjustment, or the reinforcing unit 321 of the reinforcing unit 32 to perform displacement adjustment, so that the probe set 313 accurately pairs the contacts on the circuit board 41. 412; Referring to FIG. 7, after the image inspection of each of the contacts 412 on the circuit board 41 is completed, the alignment inspection mechanism 33 is reset, and the driving source 312 of the testing mechanism 31 drives the probe set 313 to be located in the circuit. The contact point 412 of the board 41 drives the probe set 313 and the test board 314 as the first side. The displacement of the probe set 313 through the through hole 3113 of the socket 311 causes the probe set 313 to abut against the contact 412 of the circuit board 41, and the bonding portion 3211 of the reinforcing member 321 is attached to the circuit board 41. The wafers 411 of the circuit board 41 are placed in the accommodating portion 3212, and the reinforcing device 321 is attached to the supporting circuit board 41 and the respective wafers 411, thereby reinforcing the circuit board 41 to reduce the probe group of the circuit board 41. 313 pushes the amount of deformation generated by the 313, and causes the wafer 411 to be buffered and placed on the accommodating portion 3212, thereby preventing the wafer 411 from being damaged, so that the probe set 313 of the testing mechanism 31 is electrically connected to the circuit board 41. A test job is performed at point 412.

Referring to Figures 8 and 9, a second embodiment of the working device 30A of the present invention, the testing mechanism 34A of the working device 30A is provided with a first probe set 341A and a first test board 342A, and the first probe Group 341A electrically contacts the first side of the board The first driving source 343A is further configured to drive the first probe set 341A and the first test board 342A to perform first direction displacement (such as Z direction) and angle adjustment, and the testing mechanism 34A is coupled to the first probe. A second probe set 344A and a second test board 345A are disposed above the group 341A, and the second probe set 344A electrically contacts the second contact of the other side of the circuit board, and the second drive source 346A is further disposed. The second probe set 344A and the second test board 345A are driven to perform first, second, and third direction displacements (such as Z, X, and Y directions) and angle adjustment; and the first probe set 341A of the test mechanism 34A is enhanced. The reinforcing device unit 35A is provided with a relative position adjustment, and the second probe group 344A of the testing mechanism 34A and the reinforcing unit of the reinforcing unit 35A are relatively positioned. In this embodiment, the reinforcing unit 35A is provided. The first reinforcing device 351A is provided with a first bonding portion 3511A that can be attached to the circuit board on the bottom surface, and is provided with a plurality of first receiving portions 3512A for accommodating the wafer, and the other A reinforcing device 351A is provided with a first through hole 3516A at a second contact position of the corresponding circuit board for piercing The probe set 344A, the reinforcing unit 35A is provided with a first power source 352A for driving the first reinforcing device 351A to perform displacement in the second and third directions (such as X and Y directions), and the positioning unit is coupled to the first reinforcing device 351A. The bottom surface is provided with a plurality of first suction portions 3513A connected to the first air suction conduit 3514A for picking up and positioning the circuit board, and is provided with at least one first positioning pin 3515A of the positioning circuit board, and the reinforcing unit 35A is further The second reinforcing device 353A is disposed on the bottom surface of the second bonding portion 3531A that can be attached to the other circuit board, and is provided with a plurality of second receiving portions 3532A for accommodating the wafer. The second reinforcing device 353A is provided with a second through hole 3536A at a second contact position of the corresponding circuit board for penetrating the second probe set 344A, the reinforcing unit 35A and at least one second power source 354A. The second reinforcing device 353A is used for the second and third direction displacement (such as the X and Y directions), and the positioning unit is disposed on the bottom surface of the second reinforcing device 353A with a plurality of connected second suction lines 3534A. The second picking portion 3533A is configured to pick up and position the circuit board, and is provided with at least one second positioning pin 3535A of the positioning circuit board. Further, the working device 30A further includes a matching check with at least one image capturing source. The mechanism 36A is configured to take the first and second contacts of the circuit board. In the embodiment, the alignment inspection mechanism 36A is provided with the first of the two CCD imagers on one side of the first reinforcing device 351A. Taking the image source 361A and the second image capturing source 362A for respectively capturing the first and second contacts of the circuit board, and transmitting the image capturing data to the central control device (not shown), and the alignment checking mechanism 36A The third image capturing source 363A and the fourth image capturing source 364A of the two CCD imagers are disposed on one side of the second reinforcing device 353A for respectively capturing the first and second contacts of the other circuit board. The image data is transmitted to the central control unit.

Referring to FIG. 10, the working device 30A of the present invention is applied to test another type of circuit board 42 having one of a plurality of wafers 421 on one side and a plurality of first contacts 422 on the other side. A plurality of second contacts 423 are disposed on the peripheral side of the wafer 421, and the circuit board 42 is provided with at least one positioning hole 424. The working device 30A drives the first reinforcing device 351A as the second and third by the first power source 352A. Directional displacement, and the circuit board 42 to be tested can be taken out from a feeding temporary area (not shown), and the circuit board 42 to be tested is transferred to the first image capturing source 361A and the second image capturing source. Between the 362A, the first image capturing source 361A of the alignment inspection mechanism 36A is taken from the first contact 422 of the image board 42 because the first reinforcing 351A is at the second contact 423 of the corresponding circuit board 42. A first through hole 3516A is opened, and the second image capturing source 362A can be used to take the second contact point 423 of the circuit board 42 via the first through hole 3516A, and then the first image capturing source 361A and the second image capturing source 362A are taken. The image data is transmitted to the central control device, but while the circuit board 42 performs the image capturing operation, when the second reinforcing device 353A is transferred 42A taken by the board of the third and fourth image source 363A 364A imaging source imaging has been completed, since the third and fourth image-taking source 363A 364A imaging source imaging system will transmit the data to the central control apparatus The central control device can control the second power source 354A to drive the second reinforcing device 353A to perform the second and third directions of displacement, and transfer the circuit board 42A to the testing mechanism 34A, and is located in the first probe group 341A and the second probe. Between the needle sets 344A, the central control device takes image data, and the first driving source 343A of the control testing mechanism 34A drives the first probe set 341A and the first test board 342A to adjust the position of the first direction and the angle of the angle. The second bonding portion 3531A of the second reinforcing device 353A is placed on the circuit board 42A, and the wafers of the circuit board 42A are placed on the circuit board 42A. The 421A is placed in the second receiving portion 3532A, so that the second reinforcing device 353A can be attached to the supporting circuit board 42A and the respective wafers 421A, thereby reinforcing the circuit board 42A to reduce the top of the circuit board 42A by the first probe group 341A. The amount of deformation generated is pushed to prevent the wafer 421A from being damaged due to excessive deformation, so that the first probe set 341A of the test mechanism 34A is in electrical contact with the first contact 422A of the circuit board 42A, and the test mechanism 34A is second. The driving source 346A drives the second probe set 344A first The second and third directions of displacement and angle adjustment are accurately located on the second contact 423A of the circuit board 42A, and the second driving source 346A drives the second probe set 344A to be displaced in the first direction to the second reinforcing 353A. The second via 3536A is electrically connected to the second contact 423A of the circuit board 42A so that the first contact 422A and the second contact 423A of the circuit board 42A and the first probe set 341A of the test mechanism 34A, respectively. The second probe set 344A is electrically contacted to perform a test operation. Referring to FIG. 11, after the test of the circuit board 42A, the second power source 354A drives the second supplement 353A to perform the second and third directions of displacement. The circuit board 42A is transferred out of the test mechanism 34A, and can be transferred to the receiving device (not shown). After the first and second contacts 422 and 423 of the other circuit board 42 are imaged, The first power source 352A drives the first reinforcing device 351A and the circuit board 42 to be displaced in the second and third directions between the first probe group 341A and the second probe group 344A. The control device is configured to take the image data, and the first driving source 343A of the control testing mechanism 34A drives the first probe group 341A to perform the first direction displacement and the position correction adjustment of the angle, and accurately aligns and abuts against the circuit board 42. The first contact portion 422 of the first reinforcing member 351A is placed on the circuit board 42 and the wafers 421 of the circuit board 42 are placed in the first receiving portion 3512A. The first reinforcing device 351A can be attached to the supporting circuit board 42 and the respective wafers 421, thereby reinforcing the circuit board 42 to reduce the amount of deformation of the circuit board 42 caused by the pushing of the first probe group 341A, so that the first probe group The 341A accurately contacts the first contact 422 of the circuit board 42, and the second driving source 346A drives the second probe set 344A for the second and third direction displacement and angle adjustment, and the exact pair is located at the second interface of the circuit board 42. Point 423, the second driving source 346A drives the second probe set 344A to firstly displace the first through hole 3516A of the first reinforcing device 351A to electrically contact the second contact 423 of the circuit board 42. The first contact 422 and the second contact 423 of the circuit board 42 are respectively made to the test mechanism 34A. The first probe set 341A and the second probe set 344A are electrically contacted to perform a test operation. Therefore, the first and second reinforcing members 351A and 353A of the reinforcing unit 35A can respectively transfer the circuit boards 42 and 42A to the alignment check. The image capturing operation and the test operation are alternately performed between the mechanism 36A and the testing mechanism 34A.

Referring to FIG. 12, a schematic diagram of a working device 30 according to a first embodiment of the present invention is applied to a detecting device. The detecting device is provided with a plurality of loading devices 50, a conveying device 60, a working device 30 and a central control on the machine table. The conveying device 60 is respectively provided with a loading table 61 corresponding to each of the loading devices 50, so that the loading device 50 respectively transfers the circuit board to be detected to the corresponding loading table 61, and the working device 30 is strengthened. The unit 32 takes out a circuit board to be detected on the stage 61 by a plurality of reinforcing members 321 respectively, and then transfers the load to the testing mechanism 31 to perform a test operation. After the test is completed, the detected circuit board is transferred to the test board. The stage 61 and the stage 61 transport the detected circuit board to the loading device 50 for central control. The system is used to control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving operational efficiency.

31‧‧‧Test institutions

311‧‧ ‧ socket

3113‧‧‧through hole

312‧‧‧ drive source

313‧‧‧ Probe Set

314‧‧‧ test board

321‧‧‧Reinforcement

3211‧‧‧Fitting Department

3212‧‧‧ 容 部

33‧‧‧ Alignment inspection agency

41‧‧‧ boards

411‧‧‧ wafer

412‧‧‧Contacts

Claims (10)

An electronic component working device includes: a testing mechanism: at least one probe set and a test board for testing electronic components on at least one circuit board or circuit board; and a strengthening unit: at least one reinforcing device is disposed The reinforcing device has at least one bonding portion attached to the circuit board for supporting the reinforcing circuit board during the testing operation; the positioning unit is provided with at least one positioning component for positioning the circuit board in the reinforcing unit Reinforcement side. The electronic component working device according to claim 1, wherein the reinforcing unit of the reinforcing unit has at least one accommodating portion for accommodating the electronic component when the bonding portion is placed on the circuit board. The electronic component working device according to claim 1 or 2, wherein the testing mechanism is provided with at least one socket for receiving a circuit board, and at least one probe is disposed on one side of the socket Groups and test boards for testing boards or electronic components. The electronic component working device according to claim 1 or 2, wherein the testing mechanism is provided with at least one first probe set and a first test board for abutting against the first contact of one side of the circuit board Pointing at least one second probe set and a second test board for abutting against a second contact on the other side of the circuit board, the reinforcing unit of the reinforcing unit being tied to the second contact of the corresponding circuit board The position is provided with a perforation for the second probe set to be placed against the second contact of the circuit board. The electronic component working device according to claim 4, wherein the first probe set of the testing mechanism and the reinforcing unit of the strengthening unit are relatively positioned, and the second probe set of the testing mechanism is strengthened. The reinforcer between the units is adjusted for relative position. The electronic component working device according to claim 1 or 2, further comprising a device At least one image source alignment inspection mechanism is used to take the contact of the circuit board or the contact point of the circuit board and the probe set of the test mechanism. The electronic component working device according to claim 6, wherein the alignment inspection mechanism is provided with a corresponding set of first and second image capturing sources and a corresponding set of third and fourth image capturing sources. The test mechanism is provided with a first driving source and a second driving source, wherein the first driving source drives the first probe set and the first test board to perform at least one direction displacement and angle adjustment, and the second driving source is driven The second probe set and the second test board are configured to perform at least one direction displacement and angle adjustment. The reinforcement unit is provided with first and second reinforcing devices, and the first reinforcing device is coupled to drive the second and third direction displacements. a power source, the first power source drives the first reinforcing device to transfer the electronic components and the circuit board to the position between the first and second image capturing sources, and drives the first reinforcing device after the image capturing is completed. Performing a test operation at a position between the carrier circuit board and the first and second probe sets, the second reinforcement device is coupled to drive a second power source for second and third direction displacement, and the second power source system drives the second reinforcement device Transfer electronic components and circuit boards to third and fourth The image is taken from the position between the image source, and after the image capturing is completed, the second reinforcing device is transferred to the position between the first and second probe groups to perform the test operation. The electronic component working device according to claim 1 or 2, wherein the testing mechanism is provided with a driving source for driving the probe set and the test board to be displaced in at least one direction, and the reinforcing unit is powered The source is used to drive the reinforcing device to perform displacement in at least one direction. The electronic component working device according to claim 1 or 2, wherein the positioning unit is provided with at least one positioning component as a suction portion or a clamping portion on the reinforcing device for picking up and positioning the circuit board. . A detecting device for applying an electronic component working device, comprising: a machine table; a feeding device: configured on the machine table for accommodating at least one circuit board with electronic components; The conveying device is disposed on the machine platform for conveying the circuit board with electronic components; at least one electronic component working device according to the first application of the patent scope; the central control device is for controlling and integrating the operation of each device, To perform automated work.