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TW201407698A - Sheet sticking device and sticking method - Google Patents

Sheet sticking device and sticking method Download PDF

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Publication number
TW201407698A
TW201407698A TW102123153A TW102123153A TW201407698A TW 201407698 A TW201407698 A TW 201407698A TW 102123153 A TW102123153 A TW 102123153A TW 102123153 A TW102123153 A TW 102123153A TW 201407698 A TW201407698 A TW 201407698A
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TW
Taiwan
Prior art keywords
frame
sheet
frame member
wafer
accommodating
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TW102123153A
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Chinese (zh)
Inventor
Yoshiaki Sugishita
Original Assignee
Lintec Corp
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Publication date
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Publication of TW201407698A publication Critical patent/TW201407698A/en

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)

Abstract

A sheet sticking device (1) comprises: frame receiving means (3A, 3B) for receiving a frame member (RF) integrated with an attaching body (WF) via an adhering sheet; a supporting means (6) for at least supporting the frame member (RF) and the frame member (RF) in the attaching body (WF); a transporting means (7) for transporting the frame member (RF) from the frame receiving means (3A, 3B) to the supporting means (6); and a sticking means (9) for allowing the adhering sheet to abut against and stick on the frame member (RF) supported by the supporting means (6), or the frame member (RF) and the attaching body (WF). The frame receiving means (3A, 3B) include movement means (40A, 40B). The movement means (40A, 40B) can be self-propelled between a predetermined supplying position with respect to the transporting means (7) and a supplementing position (SP) for supplementing the frame member (RF) to the frame receiving means (3A, 3B).

Description

片材黏貼裝置及黏貼方法 Sheet sticking device and pasting method

本發明係關於黏貼接著片材之片材黏貼裝置及黏貼方法。 The present invention relates to a sheet sticking device and a pasting method for adhering a sheet.

習知,已知有如下之片材黏貼裝置:於半導體製造步驟中,將接著片材黏貼於半導體晶圓(以下,有僅稱為晶圓之情形)或環狀框架之片材黏貼裝置(例如,參照文獻1:日本特開2005-33119號公報)。 Conventionally, there has been known a sheet sticking device which is a sheet sticking device which adheres a sheet to a semiconductor wafer (hereinafter, referred to simply as a wafer) or a ring frame in a semiconductor manufacturing step ( For example, refer to Document 1: Japanese Patent Laid-Open Publication No. 2005-33119.

文獻1所記載之片材黏貼裝置,係以如下方式構成:具備:貼附(mount)手段,係將作為接著片材之貼附用片材黏貼於晶圓及環狀框架;台車(wagon),係收容有複數個環狀框架,且於底部設置有腳輪(caster);以及搬送手段,係將環狀框架從台車搬送往貼附手段;一旦收容於台車之環狀框架用完,則使該台車從片材黏貼裝置分離,補充環狀框架之後,再次將該台車配置於片材黏貼裝置內。 The sheet sticking device described in Document 1 is configured to include a mounting means for attaching a sheet for attaching a sheet to a wafer and a ring frame, and a wagon. a plurality of annular frames are housed, and a caster is provided at the bottom; and the transport means transports the annular frame from the trolley to the attaching means; once the annular frame housed in the trolley is used up, The trolley is separated from the sheet sticking device, and after the annular frame is replenished, the cart is again placed in the sheet sticking device.

然而,在如文獻1所記載之習知的片材黏貼裝置中,由於台車無法自走,因此,當收容於該台車之環狀框架已用完時,必須利用人力使台車移動,將新的環狀框架補充至台車,並使該台車再次移動至裝置為止。因此,存在如下不良之問題:用以將環狀框架補充至台車之操作員必須一直等待,而且操作員之作業負擔增加。 However, in the conventional sheet sticking apparatus as described in Document 1, since the trolley cannot be self-propelled, when the ring frame accommodated in the trolley has been used up, it is necessary to use the human power to move the trolley, and the new one will be used. The annular frame is replenished to the trolley and the trolley is moved to the device again. Therefore, there is a problem that the operator who is to replenish the ring frame to the trolley must wait all the time, and the operator's work load increases.

本發明之目的,在於提供可減輕操作員之作業負擔的片材黏 貼裝置及黏貼方法。 The object of the present invention is to provide a sheet stick which can reduce the workload of an operator. Sticking device and pasting method.

本發明之片材黏貼裝置,其特徵在於,具備:框架收容手段,係可收容透過接著片材而與黏附體一體化之框架構件;支持手段,係至少支持該框架構件及該黏附體中的框架構件;搬送手段,係將該框架構件從該框架收容手段搬送往該支持手段;以及黏貼手段,係使該接著片材抵接並黏貼於支持於該支持手段之框架構件、或框架構件及黏附體;該框架收容手段,具備移動手段,該移動手段係可於相對於該搬送手段之既定之供給位置、與將該框架構件補充至該框架收容手段之補充位置之間自走。 A sheet sticking device according to the present invention is characterized by comprising: a frame accommodating means for accommodating a frame member that is integrated with the adherend through the sheet; and a supporting means for supporting at least the frame member and the adherend a frame member; a conveying means for conveying the frame member from the frame housing means to the supporting means; and a bonding means for abutting and adhering the bonding sheet to the frame member or the frame member supported by the supporting means and The frame housing means includes a moving means for self-propelling between a predetermined supply position with respect to the conveying means and a replenishing position for replenishing the frame member to the frame housing means.

在本發明之片材黏貼裝置中,較佳為:該移動手段,具有可識別框架收容手段之位置的測位手段。 In the sheet sticking apparatus of the present invention, it is preferable that the moving means has a positioning means capable of recognizing the position of the frame housing means.

在本發明之片材黏貼裝置中,較佳為:該框架收容手段,設置複數個,且該搬送手段設置成可選擇性地將該框架構件從複數個框架收容手段搬送往該支持手段。 In the sheet sticking apparatus of the present invention, preferably, the frame accommodating means is provided in plurality, and the transport means is provided to selectively transport the frame member from the plurality of frame accommodating means to the support means.

在本發明之片材黏貼裝置中,較佳為:該框架收容手段,具備收容多餘構件之多餘構件收容手段,且設置成可透過該移動手段而往廢棄該多餘構件之廢棄位置移動。 In the sheet sticking apparatus of the present invention, it is preferable that the frame accommodating means includes an excess member accommodating means for accommodating the unnecessary member, and is provided to be movable to a waste position at which the unnecessary member is discarded by the moving means.

本發明之片材黏貼方法,其特徵在於:將透過接著片材而與黏附體一體化之框架構件,從配置於既定之供給位置之框架收容手段搬送往支持手段;使該接著片材抵接並黏貼於支持於該支持手段之框架構件、或框架構件及黏附體;在該框架收容手段的框架構件已用完時,使該框架收容手段從該供給位置自走往補充該框架構件之補充位置;使已補充該框架構件之框架收容手段從該補充位置自走往該供給位置。 A sheet sticking method according to the present invention is characterized in that a frame member that is integrated with a sticker by passing through a sheet is conveyed to a support means from a frame housing means disposed at a predetermined supply position; and the sheet is brought into contact with And adhering to the frame member supported by the supporting means, or the frame member and the adhesive body; when the frame member of the frame receiving means has been used up, the frame receiving means is self-propelled from the supply position to supplement the frame member a position; the frame receiving means that has been supplemented with the frame member is self-propelled from the replenishing position to the supply position.

根據如上所述之本發明,在將框架構件補充至框架收容手段時,框架收容手段可於相對於搬送手段之既定之供給位置、與補充框架構件之補充位置之間自走,因此,無需使操作員一直等待,或無需利用人力使框架收容手段移動等,可減輕操作員之作業負擔。 According to the invention as described above, when the frame member is replenished to the frame housing means, the frame housing means can be self-propelled between the predetermined supply position with respect to the conveying means and the replenishing position of the supplementary frame member, so that it is not necessary to The operator has been waiting for it, or it is not necessary to use manpower to move the frame housing means, etc., which can reduce the operator's work load.

於本發明中,若設置測位手段,則可識別出框架收容手段之位置,因此,可確實地使該框架收容手段於供給位置與補充位置之間自走。 According to the present invention, since the positioning means is provided, the position of the frame housing means can be recognized. Therefore, the frame housing means can be surely moved between the supply position and the replenishing position.

此外,若選擇性地將框架構件從複數個框架收容手段搬送往支持手段,則即使為了補充框架構件而使框架收容手段從該片材黏貼裝置分離,亦可繼續將框架構件從其他之框架收容手段供給至支持手段,因此,可防止因補充框架構件而導致該片材黏貼裝置之每單位時間的處理能力下降。 Further, if the frame member is selectively transported from the plurality of frame accommodating means to the supporting means, the frame member can be continuously received from the other frame even if the frame accommodating means is separated from the sheet sticking means in order to replenish the frame member. Since the means is supplied to the supporting means, it is possible to prevent the processing ability per unit time of the sheet sticking device from being lowered due to the addition of the frame member.

進一步地,若構成為可使設置有多餘構件收容手段之框架收容手段自走往廢棄位置,則無需由操作員使多餘構件收容手段移動往廢棄位置,可進一步減輕操作員之作業負擔。 Further, if the frame accommodating means provided with the excess member accommodating means can be moved to the disposal position, the operator does not need to move the excess member accommodating means to the disposal position, and the work load of the operator can be further reduced.

1‧‧‧片材黏貼裝置 1‧‧‧Sheet Adhesive Device

2‧‧‧晶圓收容手段 2‧‧‧ Wafer containment means

3A‧‧‧第1框架收容手段 3A‧‧‧1st frame containment means

3B‧‧‧第2框架收容手段 3B‧‧‧2nd frame containment means

5A‧‧‧第1檢測手段 5A‧‧‧1st means of detection

5B‧‧‧第2檢測手段 5B‧‧‧Second detection means

5C‧‧‧第3檢測手段 5C‧‧‧3rd means of detection

6‧‧‧支持手段 6‧‧‧Support means

7‧‧‧搬送手段 7‧‧‧Transportation means

8‧‧‧固定手段 8‧‧‧Fixed means

9‧‧‧黏貼手段 9‧‧‧Adhesive means

10‧‧‧框架口 10‧‧‧Frame mouth

11‧‧‧框架 11‧‧‧Frame

12‧‧‧定位孔 12‧‧‧Positioning holes

13‧‧‧剝離手段 13‧‧‧Dissipation means

21‧‧‧晶圓匣 21‧‧‧ Wafer

31A、31B‧‧‧多餘構件收容手段 31A, 31B‧‧‧Removal components containment means

32A、32B、64‧‧‧線性馬達 32A, 32B, 64‧‧‧ linear motors

33A、63‧‧‧滑件 33A, 63‧‧‧Sliding parts

34A‧‧‧支持構件 34A‧‧‧Support components

35A‧‧‧桿 35A‧‧‧ pole

40A、40B‧‧‧移動手段 40A, 40B‧‧‧ mobile means

41A、41B‧‧‧腳輪 41A, 41B‧‧‧ casters

42A、42B‧‧‧台車 42A, 42B‧‧‧Trolley

43A、43B‧‧‧車輪 43A, 43B‧‧‧ wheels

44A、44B、95‧‧‧旋轉馬達 44A, 44B, 95‧‧‧ rotating motor

45A、45B‧‧‧轉向手段 45A, 45B‧‧‧ steering means

46A、46B‧‧‧保持部 46A, 46B‧‧‧ Keeping Department

47A、47B‧‧‧定位銷 47A, 47B‧‧‧ Locating Pin

48A‧‧‧測位手段 48A‧‧‧ Positioning means

61‧‧‧支持面 61‧‧‧Support surface

62‧‧‧載台 62‧‧‧Package

71‧‧‧多關節機械臂 71‧‧‧Multi-joint robotic arm

71A‧‧‧前端部 71A‧‧‧ front end

72‧‧‧保持手段 72‧‧‧Retention means

73‧‧‧凹部 73‧‧‧ recess

74‧‧‧保持框架 74‧‧‧ Keep the frame

74A‧‧‧面 74A‧‧‧ face

75‧‧‧XY載台 75‧‧‧XY stage

76‧‧‧輸出部 76‧‧‧Output Department

77‧‧‧吸附板 77‧‧‧Adsorption plate

78‧‧‧吸附孔 78‧‧‧Adsorption holes

79‧‧‧吸附面 79‧‧‧Adsorption surface

81、452A‧‧‧輸出軸 81, 452A‧‧‧ output shaft

82、451A、451B‧‧‧直動馬達 82, 451A, 451B‧‧‧ Direct drive motor

91‧‧‧支持輥 91‧‧‧Support roll

92‧‧‧導引輥 92‧‧‧ Guide roller

93‧‧‧剝離板 93‧‧‧ peeling board

94‧‧‧按壓輥 94‧‧‧Press roller

96‧‧‧驅動輥 96‧‧‧ drive roller

97‧‧‧夾送輥 97‧‧‧Pinch roller

98‧‧‧回收輥 98‧‧‧Recycling roller

411A‧‧‧軸 411A‧‧‧Axis

471A、471B‧‧‧孔 471A, 471B‧‧ hole

481A、481B‧‧‧接收手段 481A, 481B‧‧‧ Receiving means

AA‧‧‧符號 AA‧‧ symbol

AD‧‧‧接著劑層 AD‧‧‧ adhesive layer

AR‧‧‧箭頭 AR‧‧‧ arrow

AS‧‧‧接著片材 AS‧‧‧Next sheet

BS‧‧‧基材片材 BS‧‧‧Substrate sheet

DP‧‧‧廢棄位置 DP‧‧‧Discarded location

OP‧‧‧發送手段 OP‧‧‧ means of transmission

PS‧‧‧保護片材 PS‧‧‧Protected sheet

RF‧‧‧環狀框架 RF‧‧‧ ring frame

RF1‧‧‧開口部 RF1‧‧‧ openings

RF2‧‧‧凹槽 RF2‧‧‧ groove

RL‧‧‧剝離片材 RL‧‧‧ peeling sheet

RS‧‧‧捲材 RS‧‧‧ coil

SP‧‧‧補充位置 SP‧‧‧Additional location

WF‧‧‧晶圓 WF‧‧‧ wafer

WK‧‧‧晶圓支持體 WK‧‧‧ wafer support

X、Y、Z‧‧‧軸 X, Y, Z‧‧‧ axes

圖1,係本發明之一實施形態之片材黏貼裝置之俯視圖。 Fig. 1 is a plan view showing a sheet sticking apparatus according to an embodiment of the present invention.

圖2,係片材黏貼裝置的框架收容手段之側視圖。 Fig. 2 is a side view of a frame housing means of the sheet sticking device.

圖3,係片材黏貼裝置的黏貼手段之側視圖。 Fig. 3 is a side view showing a bonding means of the sheet sticking device.

以下,依據圖式說明本發明的一實施形態。 Hereinafter, an embodiment of the present invention will be described based on the drawings.

另外,本實施形態中之X軸、Y軸、Z軸,處於各自正交之 關係,X軸及Y軸為水平面內之軸,Z軸為與水平面正交之軸。而且,於本實施形態中,以從與Y軸平行之箭頭AR方向進行觀察之情形為基準,於表示有方向之情形,「上」為Z軸之箭頭方向,「下」為「上」之反方向,「左」為X軸之箭頭方向,「右」為「左」之反方向,「前」為Y軸之箭頭方向,「後」為「前」之反方向。 Further, in the present embodiment, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other. Relationship, the X-axis and the Y-axis are axes in the horizontal plane, and the Z-axis is an axis orthogonal to the horizontal plane. Further, in the present embodiment, the observation is made from the direction of the arrow AR parallel to the Y-axis, and when the direction is indicated, "upper" is the direction of the arrow of the Z-axis, and "down" is the "upper". In the opposite direction, "Left" is the direction of the arrow of the X-axis, "Right" is the opposite direction of the "Left", "Front" is the direction of the arrow of the Y-axis, and "Rear" is the opposite direction of the "Front".

於圖1中,片材黏貼裝置1,具備:晶圓收容手段2,係可收容複數個作為黏附體之晶圓WF;作為框架收容手段之第1框架收容手段3A及第2框架收容手段3B,係分別可收容複數個透過接著片材AS(圖3)而與晶圓WF一體化之作為框架構件之環狀框架RF;支持手段6,係至少支持環狀框架RF及晶圓WF中的環狀框架RF;搬送手段7,係選擇性地將環狀框架RF從第1框架收容手段3A及第2框架收容手段3B搬送往支持手段6;固定手段8(圖2),係將第1及第2框架收容手段3A、3B中的至少一方固定於該片材黏貼裝置1;以及黏貼手段9,係使接著片材AS抵接並黏貼於支持於支持手段6之環狀框架RF、或環狀框架RF及晶圓WF;上述片材黏貼裝置1,支持於形成有框架口10之框架11,該框架口10係成為相對於搬送手段7之既定之供給位置。 In FIG. 1, the sheet sticking apparatus 1 includes a wafer accommodating means 2 for accommodating a plurality of wafers WF as an adherend, and a first frame accommodating means 3A and a second frame accommodating means 3B as frame accommodating means. Each of the plurality of annular frames RF as a frame member integrated with the wafer WF through the sheet AS (Fig. 3) can be accommodated; the support means 6 supports at least the annular frame RF and the wafer WF. The ring frame RF; the transport means 7 selectively transports the ring frame RF from the first frame housing means 3A and the second frame housing means 3B to the support means 6; and the fixing means 8 (Fig. 2) is the first And at least one of the second frame housing means 3A, 3B is fixed to the sheet sticking device 1; and the bonding means 9 is such that the sheet AS is abutted and adhered to the ring frame RF supported by the supporting means 6, or The ring frame RF and the wafer WF; the sheet sticking device 1 is supported by a frame 11 on which the frame port 10 is formed, and the frame port 10 is a predetermined supply position with respect to the transport means 7.

晶圓收容手段2,由晶圓匣(cassette)21構成,且支持成可相對於框架11分離,該晶圓匣21可於上下方向多段地收容晶圓WF,該晶圓WF係於表面黏貼有作為多餘構件之保護片材PS(圖3)。 The wafer accommodating means 2 is composed of a cassette 21 which is supported to be detachable from the frame 11. The wafer cassette 21 can accommodate the wafer WF in a plurality of stages in the vertical direction. The wafer WF is attached to the surface. There is a protective sheet PS (Fig. 3) as a redundant member.

第1框架收容手段3A,具備:移動手段40A,係構成為可自走;多餘構件收容手段31A,係設置於該第1框架收容手段3A中所收容之環狀框架RF的開口部RF1內,且收容形成為上部開口下部閉塞型之筒狀 的保護片材PS;兩個線性馬達32A,係支持於移動手段40A;支持構件34A,係支持於線性馬達32A的滑件33A並支持環狀框架RF;以及桿(pole)35A,係與環狀框架RF外緣之4個部位相接,並進行該環狀框架RF之定位;上述第1框架收容手段3A,設置成可於框架口10、將環狀框架RF補充至各框架收容手段3A、3B之補充位置SP、及廢棄保護片材PS之廢棄位置DP之間移動。 The first frame housing means 3A includes a moving means 40A configured to be self-propellable, and the excess member housing means 31A is provided in the opening portion RF1 of the annular frame RF accommodated in the first frame housing means 3A. And the housing is formed into a cylindrical shape in which the upper opening is closed at the lower part Protective sheet PS; two linear motors 32A supported by the moving means 40A; a supporting member 34A supported by the slider 33A of the linear motor 32A and supporting the annular frame RF; and a pole 35A, a ring and a ring The four outer portions of the outer edge of the frame frame RF are in contact with each other, and the positioning of the annular frame RF is performed. The first frame housing means 3A is provided to be able to replenish the annular frame RF to the frame receiving means 3A at the frame opening 10. The replenishment position SP of 3B and the discarding position DP of the discarding protective sheet PS move between.

如圖2所示,移動手段40A,具備有:台車42A,係於下面4個角落設置有4個頭擺自如之腳輪41A;4個旋動馬達44A,係支持於各腳輪41A,且係驅動該腳輪41A的車輪43A之驅動機器;4個轉向手段45A,係使各腳輪41A轉向;保持部46A,係設置於台車42A,且可由搬送手段7保持;定位銷47A,係以從台車42A突出之方式設置;以及測位手段48A,係可識別出第1框架收容手段3A之位置。 As shown in FIG. 2, the moving means 40A is provided with a bogie 42A, and four swinging casters 41A are provided at four corners below; four rotating motors 44A are supported by the casters 41A, and the driving is performed. The driving device of the wheel 43A of the caster 41A; the four steering means 45A steer each caster 41A; the holding portion 46A is provided in the trolley 42A and can be held by the transport means 7; the positioning pin 47A is protruded from the trolley 42A. The mode setting means and the positioning means 48A recognize the position of the first frame housing means 3A.

轉向手段45A,具備直動馬達451A,該直動馬達451A係支持於台車42A成可擺動之驅動機器;各直動馬達451A的輸出軸452A,可旋轉地與從各腳輪41A伸出之軸411A連結。 The steering device 45A includes a linear motion motor 451A that supports a driving device in which the trolley 42A is swingable, and an output shaft 452A of each linear motion motor 451A rotatably and a shaft 411A that protrudes from each caster 41A. link.

定位銷47A,設置成前端變細之形狀,且插入於形成於框架口10之定位孔12,藉此,可將第1框架收容手段3A定位固定於既定位置。 The positioning pin 47A is provided in a shape in which the tip end is tapered, and is inserted into the positioning hole 12 formed in the frame opening 10, whereby the first frame housing means 3A can be positioned and fixed at a predetermined position.

測位手段48A,利用設置於台車42A之接收手段481A,接收發送手段OP所發送之電波、音波、磁場等既定之訊號,且對由該接收手段481A所接收到的既定訊號之資訊或偏移等進行既定處理,藉此,接收手段481A識別出自身之當前位置,上述發送手段OP係設置於既定之複數個部位(圖1中為兩個部位)。作為該測位手段48A,除了可例示GPS(Global Positioning System)或與此類似者外,亦可例示如下之手段:發送手段OP接收接收手段481A所發送之既定訊號,且該發送手段OP將該訊號或基於該訊號之訊號再次發送往接收手段481A,對由該接收手段481A所接收之既定訊號進行既定處理,藉此,接收手段481A識別出自身之當前位置。 The positioning means 48A receives the predetermined signal such as a radio wave, an acoustic wave, and a magnetic field transmitted by the transmitting means OP by the receiving means 481A provided in the bogie 42A, and the information or offset of the predetermined signal received by the receiving means 481A. The predetermined processing is performed, whereby the receiving means 481A recognizes its current position, and the transmitting means OP is provided at a predetermined plurality of locations (two locations in FIG. 1). As the positioning means 48A, in addition to GPS (Global) The positioning means may be exemplified by the following means: the transmitting means OP receives the predetermined signal transmitted by the receiving means 481A, and the transmitting means OP transmits the signal or the signal based on the signal to the receiving means 481A again. The predetermined signal received by the receiving means 481A is subjected to predetermined processing, whereby the receiving means 481A recognizes its current position.

如圖1所示,第2框架收容手段3B,係與第1框架收容手段3A為同樣之構成,且可藉由將第1框架收容手段3A末尾A的記號替換為B而進行說明,因此省略其說明。 As shown in FIG. 1, the second frame housing means 3B has the same configuration as the first frame housing means 3A, and can be described by replacing the symbol at the end A of the first frame housing means 3A with B. Its description.

另外,於第1及第2框架收容手段3A、3B的後方,設置有由光學感測器或接觸感測器或者攝影手段等構成之第1檢測手段5A、第2檢測手段5B;該第1檢測手段5A、第2檢測手段5B,係偵測最上部之環狀框架RF的上面且將該最上部之環狀框架RF定位於既定位置。 Further, a first detecting means 5A and a second detecting means 5B each composed of an optical sensor, a contact sensor, an imaging means, and the like are provided behind the first and second frame housing means 3A, 3B; The detecting means 5A and the second detecting means 5B detect the upper surface of the uppermost annular frame RF and position the uppermost annular frame RF at a predetermined position.

支持手段6,具備有:載台62,係具有可藉由未圖示之減壓泵或真空抽氣器(ejector)等之吸引手段而吸附保持晶圓WF及環狀框架RF之支持面61;以及作為驅動機器之線性馬達64,係利用滑件63(圖3)支持載台62。 The support means 6 includes a stage 62 having a support surface 61 capable of adsorbing and holding the wafer WF and the ring frame RF by means of a suction means such as a vacuum pump or an ejector (not shown). And as the linear motor 64 for driving the machine, the stage 62 is supported by the slider 63 (Fig. 3).

搬送手段7,具備作為驅動機器之多關節機械臂(robot)71、與裝卸自如地設置於該多關節機械臂71的前端部71A之保持手段72,且構成為可藉由多關節機械臂71而搬送保持手段72所保持之晶圓WF或環狀框架RF。多關節機械臂71,係於6個部位具有可旋轉之關節之所謂的6軸機械臂,且構成為可於該多關節機械臂71之作業範圍內,將保持手段72所保持之晶圓WF或環狀框架RF於任何位置、亦以任何角度移動。如從圖1中的符號AA所示之AR方向所見之圖所示般,保持手段72,具備:於一面 74A具有凹部73之圓盤狀的保持框架74、配置於凹部73內之XY載台75、以及支持於XY載台75的輸出部76之吸附板77;構成為可使吸附板77在沿著保持框架74的面74A之平面內之正交之兩個軸方向移動,且可使吸附板77在該平面內旋轉。吸附板77,具有設置有複數個吸附孔78之吸附面79,且與多關節機械臂71連接,藉此,與未圖示之減壓泵或真空抽氣器等吸引手段連接,從而可吸附保持晶圓WF或環狀框架RF。此外,吸附板77,存在兩個系統,即,吸附保持晶圓WF之系統、與吸附保持環狀框架RF之系統。另一方面,設置於各台車42A、42B之保持部46A、46B,藉由未圖示之光學感測器或攝影手段等檢測手段、或測位手段48A,檢測其位置,而關節機械臂71,設置成可代替保持手段72而以前端部71A保持保持部46A、46B。 The transport means 7 includes a multi-joint robot 71 as a drive device, and a holding means 72 that is detachably provided to the distal end portion 71A of the multi-joint robot 71, and is configured by a multi-joint robot 71. The wafer WF or the ring frame RF held by the holding means 72 is transported. The multi-joint robot 71 is a so-called 6-axis robot arm having a rotatable joint at six locations, and is configured to hold the wafer WF held by the holding means 72 within the working range of the multi-joint robot 71. Or the annular frame RF moves at any position and at any angle. As shown in the diagram seen in the AR direction indicated by the symbol AA in FIG. 1, the holding means 72 has: 74A has a disc-shaped holding frame 74 having a recessed portion 73, an XY stage 75 disposed in the recessed portion 73, and an adsorption plate 77 supported by the output portion 76 of the XY stage 75; the adsorption plate 77 is configured to be along The two axial directions orthogonal to each other in the plane of the face 74A of the holding frame 74 are moved, and the suction plate 77 can be rotated in the plane. The adsorption plate 77 has an adsorption surface 79 provided with a plurality of adsorption holes 78, and is connected to the multi-joint robot 71, thereby being connected to a suction means such as a vacuum pump or a vacuum aspirator (not shown) to be adsorbed. Maintain wafer WF or ring frame RF. Further, the adsorption plate 77 has two systems, that is, a system for adsorbing and holding the wafer WF, and a system for adsorbing and holding the annular frame RF. On the other hand, the holding portions 46A and 46B provided in the respective carts 42A and 42B are detected by a detecting means such as an optical sensor or a photographing means (not shown) or the positioning means 48A, and the joint robot 71 is Instead of the holding means 72, the holding portions 46A, 46B are held by the front end portion 71A.

另外,於搬送手段7的左方,設置有由光學感測器或攝影裝置等構成之第3檢測手段5C;該第3檢測手段5C,可檢測晶圓WF的外緣位置、形成於晶圓WF之未圖示之V形凹槽(notch)或定向平面等方位標記、電路圖案、痕道(street)、或者環狀框架RF的外緣及內緣位置、設置於環狀框架RF的外周之凹槽RF2等。 Further, on the left side of the transport means 7, a third detecting means 5C composed of an optical sensor or an imaging device is provided. The third detecting means 5C can detect the outer edge position of the wafer WF and be formed on the wafer. An outer orientation and an inner edge position of a V-shaped groove (notch) or an orientation plane, such as an unillustrated WF, which is not shown, a circuit pattern, a street, or an annular frame RF, is provided on the outer circumference of the annular frame RF The groove RF2 and the like.

固定手段8,具備作為驅動機器之直動馬達82(圖2),且構成為藉由將輸出軸81插入於孔471A、471B,而可將各框架收容手段3A、3B定位固定於框架11;上述作為驅動機器之直動馬達82,係構成為可將輸出軸81朝向定位孔12突出或縮回;上述孔471A、471B,分別設置於插入於定位孔12之定位銷47A、47B。 The fixing means 8 includes a linear motion motor 82 (Fig. 2) as a driving device, and is configured to position and fix each of the frame housing means 3A, 3B to the frame 11 by inserting the output shaft 81 into the holes 471A, 471B; The linear motion motor 82 as the drive device is configured such that the output shaft 81 can be protruded or retracted toward the positioning hole 12; and the holes 471A and 471B are respectively provided to the positioning pins 47A and 47B inserted into the positioning holes 12.

如圖3所示,黏貼手段9,具備有:支持輥91,係支持捲材 RS,該捲材RS係由在基材片材BS的一面具有接著劑層AD之接著片材AS,透過該接著劑層AD而暫時附著於帶狀之剝離片材RL的一面;複數個導引輥92,係對捲材RS進行導引;剝離板93,係使捲材RS折返,藉此從剝離片材RL剝離接著片材AS;按壓輥94,係使經由剝離板93剝離之接著片材AS抵接並黏貼於晶圓WF及環狀框架RF;驅動輥96,係由作為驅動機器之旋動馬達95驅動;夾送輥97,係於與驅動輥96之間夾入剝離片材RL;以及回收輥98,係由未圖示之驅動機器驅動而回收剝離片材RL。 As shown in FIG. 3, the pasting means 9 is provided with a support roller 91 and a support coil. RS, the coil RS is temporarily adhered to one side of the strip-shaped release sheet RL by the adhesive sheet AD having the adhesive layer AD on one surface of the base sheet BS, and a plurality of guides The take-up roll 92 guides the web RS; the peeling plate 93 folds the web RS, thereby peeling off the succeeding sheet AS from the release sheet RL; and pressing the roll 94 to peel off via the peeling sheet 93 The sheet AS abuts and adheres to the wafer WF and the annular frame RF; the driving roller 96 is driven by a rotary motor 95 as a driving machine; the pinch roller 97 is inserted between the driving roller 96 and the peeling piece. The material RL and the recovery roller 98 are driven by a driving machine (not shown) to recover the release sheet RL.

另外,於本實施形態之情形,併設有將黏貼於晶圓WF之保護片材PS剝離之剝離手段13,例如可例示日本特願2008-285228或日本特願2011-55508等之剝離裝置先前文獻所記載者。 In addition, in the case of the present embodiment, a peeling means 13 for peeling off the protective sheet PS adhered to the wafer WF is provided, and for example, a peeling device of Japanese Patent Application No. 2008-285228 or Japanese Patent Application No. 2011-55508 can be exemplified. Recorded.

在以上之片材黏貼裝置1中,說明接著片材AS黏貼於晶圓WF及環狀框架RF之順序。 In the above-described sheet sticking apparatus 1, the order in which the sheet AS is adhered to the wafer WF and the ring frame RF will be described.

首先,以如圖3所示之方式設置捲材RS,將晶圓匣21設置於圖1所示之位置。然後,當於補充位置SP,將既定數量之環狀框架RF補充至支持構件34A上,移動手段40A驅動接收手段481A,接收發送手段OP所發送之既定訊號而進行既定處理,藉此,接收手段481A一邊識別自身之當前位置,一邊驅動旋動馬達44A及直動馬達451A,使第1框架收容手段3A位於圖1所示之框架口10的既定位置。接著,固定手段8驅動直動馬達82,於輸出軸81卡止定位銷47A,從而將第1框架收容手段3A定位固定於框架11。之後,與上述同樣地,將第2框架收容手段3B設置於框架口10的既定位置並加以定位固定。 First, the coil RS is set as shown in FIG. 3, and the wafer cassette 21 is placed at the position shown in FIG. Then, at the replenishment position SP, a predetermined number of annular frames RF are replenished to the support member 34A, and the moving means 40A drives the receiving means 481A to receive the predetermined signal transmitted by the transmitting means OP to perform predetermined processing, whereby the receiving means The 481A drives the swing motor 44A and the linear motor 451A while recognizing the current position of the self, and the first frame housing means 3A is positioned at a predetermined position of the frame port 10 shown in FIG. Next, the fixing means 8 drives the linear motor 82, and the positioning pin 47A is locked to the output shaft 81, whereby the first frame housing means 3A is positioned and fixed to the frame 11. Thereafter, in the same manner as described above, the second frame housing means 3B is placed at a predetermined position of the frame opening 10 and positioned and fixed.

另外,亦可一旦第1及第2框架收容手段3A、3B接近框架 口10,則由搬送手段7驅動多關節機械臂71,從前端部71A取出保持手段72,且一邊利用該前端部71A保持台車42A、42B的保持部46A、46B,一邊將各台車42A、42B拉入至框架口10。藉此,可確實地使第1及第2框架收容手段3A、3B位於框架口10的既定位置。 In addition, once the first and second frame housing means 3A, 3B are close to the frame In the port 10, the multi-joint robot 71 is driven by the transport means 7, and the holding means 72 is taken out from the front end portion 71A, and the respective carts 42A, 42B are held while holding the holding portions 46A, 46B of the carts 42A, 42B by the front end portion 71A. Pull in to the frame opening 10. Thereby, the first and second frame housing means 3A, 3B can be surely positioned at a predetermined position of the frame opening 10.

然後,各框架收容手段3A、3B驅動線性馬達32A及32B,使積層之環狀框架RF上升,第1及第2檢測手段5A、5B在既定位置偵測到位於最上部之環狀框架RF,線性馬達32A、32B停止驅動。 Then, each of the frame housing means 3A, 3B drives the linear motors 32A and 32B to raise the laminated ring frame RF, and the first and second detecting means 5A, 5B detect the ring frame RF located at the uppermost position at a predetermined position. The linear motors 32A, 32B stop driving.

一旦以如上述之方式完成各構件之設置,搬送手段7驅動多關節機械臂71,使保持手段72插入於晶圓匣21的內部而使吸附面79與晶圓WF接觸之後,驅動未圖示之吸引手段,吸附保持該晶圓WF。接著,搬送手段7驅動多關節機械臂71,使晶圓WF移動往可被第3檢測手段5C檢測之位置,驅動XY載台75,使晶圓WF旋轉既定角度。藉此,第3檢測手段5C對晶圓WF的外緣位置與未圖示之V形凹槽位置進行檢測,且將該等各資料輸出至未圖示之控制手段。一旦將晶圓WF的各資料輸入至未圖示之控制手段,則計算出晶圓WF的中心位置,且搬送手段7驅動XY載台75及多關節機械臂71,使晶圓WF的中心位置與未圖示之V形凹槽位置成為既定位置,而將該晶圓WF載置於載台62的支持面61上。 When the respective members are installed as described above, the transport means 7 drives the multi-joint robot 71, and the holding means 72 is inserted into the inside of the wafer cassette 21, and the suction surface 79 is brought into contact with the wafer WF, and then the drive is not shown. The attraction means is to adsorb and hold the wafer WF. Next, the transport means 7 drives the multi-joint robot 71 to move the wafer WF to a position detectable by the third detecting means 5C, and drives the XY stage 75 to rotate the wafer WF by a predetermined angle. Thereby, the third detecting means 5C detects the outer edge position of the wafer WF and the V-shaped groove position (not shown), and outputs the respective materials to a control means (not shown). When the data of the wafer WF is input to a control means (not shown), the center position of the wafer WF is calculated, and the transport means 7 drives the XY stage 75 and the multi-joint robot 71 to center the wafer WF. The V-shaped groove position (not shown) is set to a predetermined position, and the wafer WF is placed on the support surface 61 of the stage 62.

接著,搬送手段7驅動多關節機械臂71,使保持手段72移動往第1框架收容手段3A的上方,使吸附面79與定位於既定位置之位於最上部之環狀框架RF接觸之後,驅動未圖示之吸引手段,吸附保持該環狀框架RF。接著,搬送手段7驅動多關節機械臂71,使環狀框架RF移動至可被第3檢測手段5C檢測之位置,由第3檢測手段5C進行與檢測上述晶 圓WF時同樣之動作,之後,達到使環狀框架RF的開口部RF1的中心位置與載台62上所支持之晶圓WF的中心位置一致之狀態,且達到使環狀框架RF的V形凹槽RF2朝向既定方向之狀態,而將該環狀框架RF載置於載台62的支持面61上。另外,搬送最上部之環狀框架RF,一旦在位於該最上部之緊鄰下方之環狀框架RF成為最上部之環狀框架RF,第1框架收容手段3A驅動線性馬達32A,第1檢測手段5A在既定位置偵測到該位於最上部之環狀框架RF,線性馬達32A停止驅動。 Next, the transport means 7 drives the multi-joint robot 71 to move the holding means 72 to the upper side of the first frame housing means 3A, and the suction surface 79 is in contact with the annular frame RF located at the uppermost position at a predetermined position, and then the drive unit 79 is driven. The illustrated attraction means adsorbs and holds the annular frame RF. Next, the transport means 7 drives the multi-joint robot 71 to move the ring frame RF to a position detectable by the third detecting means 5C, and the third detecting means 5C performs detection and detection of the crystal. The same operation is performed in the case of the circular WF, and thereafter, the center position of the opening portion RF1 of the annular frame RF is aligned with the center position of the wafer WF supported on the stage 62, and the V-shape of the annular frame RF is achieved. The groove RF2 is placed in a predetermined direction, and the annular frame RF is placed on the support surface 61 of the stage 62. In addition, the first frame housing means 3A drives the linear motor 32A, and the first detecting means 5A, when the annular frame RF located at the uppermost portion is the uppermost annular frame RF. The uppermost annular frame RF is detected at a predetermined position, and the linear motor 32A stops driving.

接著,支持手段6驅動線性馬達64,使載台62往左方向移動,一旦未圖示之偵測手段偵測出晶圓WF及環狀框架RF已到達既定位置,則黏貼手段9與載台62之移動同步地驅動旋動馬達95,且送出捲材RS。藉此,利用剝離板93剝離接著片材AS,且藉由按壓輥94將已剝離之接著片材AS黏貼於晶圓WF及環狀框架RF,如圖3中以兩點鏈線所示般,形成晶圓支持體WK。一旦形成晶圓支持體WK,由未圖示之偵測手段偵測出,支持手段6停止線性馬達64之驅動。然後,搬送手段7驅動多關節機械臂71,將晶圓支持體WK抬起並上下反轉,交付至具有與支持面61相對向之吸附支持面之未圖示之交付手段,該交付手段使晶圓支持體WK下降而再次載置於支持面61。藉此,晶圓支持體WK於使保護片材PS朝向上方之狀態下支持於支持面61。 Next, the support means 6 drives the linear motor 64 to move the stage 62 to the left direction. When the detecting means (not shown) detects that the wafer WF and the ring frame RF have reached a predetermined position, the bonding means 9 and the stage The movement of 62 drives the rotary motor 95 synchronously and feeds the coil RS. Thereby, the succeeding sheet AS is peeled off by the peeling plate 93, and the peeled succeeding sheet AS is adhered to the wafer WF and the ring frame RF by the pressing roller 94, as shown by the two-dot chain line in FIG. Forming a wafer support WK. Once the wafer support WK is formed, it is detected by a detection means not shown, and the support means 6 stops the driving of the linear motor 64. Then, the transport means 7 drives the multi-joint robot 71, lifts the wafer support WK upside down, and delivers it to a delivery means (not shown) having an adsorption support surface facing the support surface 61. The wafer support WK is lowered and placed on the support surface 61 again. Thereby, the wafer support WK is supported by the support surface 61 with the protective sheet PS facing upward.

接著,支持手段6驅動線性馬達64,使載台62往左方向移動。一旦未圖示之偵測手段偵測出晶圓支持體WK已到達既定位置,則剝離手段13將未圖示之剝離用帶材黏貼於保護片材PS,拉引該剝離用帶材而從晶圓WF剝離保護片材PS(細節參照剝離裝置先前文獻)。一旦從晶圓 WF剝離保護片材PS,則搬送手段7驅動多關節機械臂71,使吸附面79與已剝離之保護片材PS接觸,並驅動未圖示之吸引手段,吸附保持該保護片材PS而將其收容於多餘構件收容手段31A。然後,藉由未圖示之搬送手段,將已剝離保護片材PS之晶圓支持體WK搬送至其他步驟,載台62返回至圖1中以實線所示之位置,之後反覆進行與上述同樣之動作。 Next, the support means 6 drives the linear motor 64 to move the stage 62 in the left direction. When the detecting means (not shown) detects that the wafer support WK has reached the predetermined position, the peeling means 13 adheres the peeling tape (not shown) to the protective sheet PS, and pulls the peeling strip from the strip. The wafer WF peels off the protective sheet PS (for details, refer to the peeling device prior literature). Once from the wafer When the WF peels off the protective sheet PS, the transport means 7 drives the multi-joint robot 71, and the adsorption surface 79 comes into contact with the peeled protective sheet PS, and drives a suction means (not shown) to adsorb and hold the protective sheet PS. It is housed in the excess member accommodation means 31A. Then, the wafer support WK from which the protective sheet PS has been peeled off is transported to another step by a transport means (not shown), and the stage 62 is returned to the position shown by the solid line in FIG. 1, and then repeatedly performed as described above. The same action.

此處,一旦藉由第1檢測手段5A偵測出第1框架收容手段3A的所有環狀框架RF已用完,則搬送手段7開始進行將環狀框架RF從第2框架收容手段3B往支持手段6搬送之動作。然後,固定手段8驅動直動馬達82,解除已將第1框架收容手段3A定位固定之輸出軸81與定位銷47A之卡合。接著,與上述同樣地,移動手段40A驅動接收手段481A,接收發送手段OP所發送之既定訊號而進行既定處理,藉此,接收手段481A一邊識別自身之當前位置,一邊驅動旋動馬達44A及直動馬達451A,使第1框架收容手段3A位於廢棄位置DP。藉此,當將新的環狀框架RF補充至第1框架收容手段3A時,即使第1框架收容手段3A與框架口10分離,搬送手段7亦可繼續將環狀框架RF從第2框架收容手段3B供給至支持手段6,於環狀框架RF之補充時或保護片材PS之廢棄時,無需使片材黏貼裝置1之作業停止,可防止該片材黏貼裝置1之每單位時間之處理能力下降。 When the first detecting means 5A detects that all the annular frames RF of the first frame housing means 3A have been used up, the conveying means 7 starts to support the annular frame RF from the second frame housing means 3B. The action of means 6 transfer. Then, the fixing means 8 drives the linear motion motor 82 to release the engagement between the output shaft 81 that has positioned and fixed the first frame housing means 3A and the positioning pin 47A. Then, similarly to the above, the moving means 40A drives the receiving means 481A, receives the predetermined signal transmitted by the transmitting means OP, and performs predetermined processing, whereby the receiving means 481A drives the rotary motor 44A and the straight while recognizing the current position of itself. The motor 451A moves the first frame housing means 3A to the disposal position DP. Thereby, when the new annular frame RF is replenished to the first frame housing means 3A, even if the first frame housing means 3A is separated from the frame opening 10, the conveying means 7 can continue to receive the annular frame RF from the second frame. The means 3B is supplied to the support means 6, and when the ring frame RF is replenished or the protective sheet PS is discarded, the operation of the sheet sticking apparatus 1 does not need to be stopped, and the processing per unit time of the sheet sticking apparatus 1 can be prevented. Decrease in ability.

然後,未圖示之廢棄手段從第1框架收容手段3A取出收容有保護片材PS之多餘構件收容手段31A,且將新的多餘構件收容手段31A載置於第1框架收容手段3A。之後,與上述同樣地,使第1框架收容手段3A位於補充位置SP,將新的複數個環狀框架RF補充至第1框架收容手段3A,且再次將第1框架收容手段3A設置於框架口10的既定位置。另外, 一旦由第2檢測手段5B偵測出第2框架收容手段3B的所有環狀框架RF已用完,則搬送手段7開始進行將環狀框架RF從第1框架收容手段3A往支持手段6搬送之動作,並且與上述同樣地,將新的環狀框架RF補充至第2框架收容手段3B,且再次設置於框架口10的既定位置。 Then, the unnecessary means accommodating means 31A in which the protective sheet PS is accommodated is taken out from the first frame accommodating means 3A, and the new excess member accommodating means 31A is placed on the first frame accommodating means 3A. Then, in the same manner as described above, the first frame housing means 3A is placed at the replenishing position SP, the new plurality of annular frames RF are replenished to the first frame housing means 3A, and the first frame housing means 3A is again placed at the frame opening. The established position of 10. In addition, When the second detecting means 5B detects that all the annular frames RF of the second frame housing means 3B have been used up, the conveying means 7 starts the transfer of the annular frame RF from the first frame housing means 3A to the supporting means 6. In the same manner as described above, the new annular frame RF is replenished to the second frame housing means 3B, and is again set at a predetermined position of the frame opening 10.

如此,每當環狀框架RF用完時,只要將新的環狀框架RF補充至各框架收容手段3A、3B,則搬送手段7可選擇性地從各框架收容手段3A、3B搬送出環狀框架RF,可繼續進行利用片材黏貼裝置1之接著片材AS之黏貼動作。 As described above, each time the ring frame RF is used up, the new ring frame RF is replenished to each of the frame housing means 3A, 3B, and the conveying means 7 can selectively carry out the ring shape from each of the frame housing means 3A, 3B. The frame RF can continue the pasting operation using the sheet AS of the sheet sticking device 1.

根據如上所述之本實施形態,具有如下所述之效果。 According to the embodiment described above, the following effects are obtained.

亦即,將環狀框架RF補充至各框架收容手段3A、3B時,各框架收容手段3A、3B可於框架口10與補充環狀框架RF之補充位置SP之間自走,因此,無需使操作員一直等待,或無需利用人力使各框架收容手段3A、3B移動,可減輕操作員之作業負擔。 That is, when the annular frame RF is replenished to each of the frame housing means 3A, 3B, each of the frame housing means 3A, 3B can be self-propelled between the frame opening 10 and the complementary position SP of the supplementary annular frame RF, so that it is not necessary to The operator waits for a long time or does not need to manually move the frame housing means 3A, 3B, thereby reducing the operator's work load.

此外,可減少如下之繁雜性,即,操作員因擔心片材黏貼裝置1之處理能力下降,而必須急速地將環狀框架RF供給至該片材黏貼裝置1。 Further, it is possible to reduce the complication that the operator has to supply the ring frame RF to the sheet sticking device 1 rapidly because of the fear that the processing ability of the sheet sticking device 1 is lowered.

如上所述,用以實施本發明之最佳構成、方法等,雖已揭示於上述記載中,但本發明並不限定於此。亦即,本發明主要針對特定之實施形態而特別地圖示且說明,但可在不脫離本發明的技術思想及目的之範圍,由本領域技術人員對以上所述之實施形態在形狀、材質、數量及其他細部之構成之方面加以做各種之變形。此外,對上述已揭示之形狀、材質等進行了限定之記載,係為了使本發明易於理解而例示性地記載者,並不 對本發明進行限定,因此,藉由除去該等之形狀、材質等之限定的一部分或全部限定後的構件名稱之記載,係包含於本發明中。 As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited thereto. In other words, the present invention has been particularly shown and described with respect to the specific embodiments. However, the embodiments described above can be applied to the shapes, materials, and the like by those skilled in the art without departing from the scope of the invention. Various modifications are made to the aspects of the quantity and other details. In addition, the description of the shapes, materials, and the like disclosed above is exemplarily described in order to make the present invention easy to understand, and is not Since the present invention is limited to the above, it is included in the present invention by removing the description of the part or all of the defined member names that are limited by the shape, material, and the like.

例如,亦可僅將環狀框架RF載置於載台62,將接著片材AS黏貼於該環狀框架RF。 For example, only the annular frame RF may be placed on the stage 62, and the subsequent sheet AS may be adhered to the annular frame RF.

此外,可代替按壓輥94而採用由葉片材(blade material)、橡膠、樹脂、海綿等構成之按壓構件,亦可採用藉由噴氣而進行按壓之構成。 Further, instead of the pressing roller 94, a pressing member made of a blade material, a rubber, a resin, a sponge or the like may be used, and a pressing by a jet may be employed.

進一步地,亦可代替剝離板93而採用由輥等構成之剝離構件。 Further, instead of the peeling plate 93, a peeling member made of a roller or the like may be used.

此外,各移動手段40A、40B中的旋動馬達44A、44B,亦可為如下構成:作為兩個(two-body)或一個(one-body)而驅動2個車輪43A、43B。 Further, the swing motors 44A and 44B in the respective moving means 40A and 40B may be configured to drive the two wheels 43A and 43B as two-body or one-body.

進一步地,各移動手段40A、40B中的轉向手段45A、45B的直動馬達451A、451B,亦可為如下構成:作為兩個或一個而使2個腳輪41A、41B轉向。 Further, the linear motors 451A and 451B of the steering devices 45A and 45B in the respective moving means 40A and 40B may be configured to steer the two casters 41A and 41B as two or one.

此外,只要可使各框架收容手段3A、3B自走,則腳輪41A、41B的數量亦可為任意個。 Further, as long as each of the frame housing means 3A, 3B can be self-propelled, the number of the casters 41A, 41B can be any.

進一步地,發送手段OP只要可由接收手段481A、481B識別出自身之當前位置,則可設置於一個部位,亦可設置於3個以上之部位。 Further, the transmission means OP may be provided in one part or may be provided in three or more parts as long as the current position of the transmission means OP 481A can be recognized by the receiving means 481A, 481B.

進一步地,亦可設置對多餘構件收容手段31A、31B中的保護片材PS之收容狀態進行偵測之偵測手段,根據該偵測手段之偵測結果,使各框架收容手段3A、3B移動往廢棄位置DP。 Further, a detecting means for detecting the storage state of the protective sheet PS in the excess member housing means 31A, 31B may be provided, and the frame receiving means 3A, 3B are moved according to the detection result of the detecting means. Go to the abandoned location DP.

此外,亦可為如下構成:於廢棄位置DP,從多餘構件收容 手段31A、31B內僅取出保護片材PS。 Further, it may be configured as follows: at the disposal position DP, from the redundant member Only the protective sheet PS is taken out in the means 31A, 31B.

進一步地,多餘構件收容手段31A、31B,亦可設置於收容在第1及第2框架收容手段3A、3B之環狀框架RF的開口部RF1之外部。 Further, the excess member accommodation means 31A, 31B may be provided outside the opening portion RF1 of the annular frame RF of the first and second frame accommodation means 3A, 3B.

此外,在片材黏貼裝置1如日本特願平10-231608般,具備將已黏貼於黏附體之接著片材切斷成既定形狀之切斷手段之情形,亦可將切斷後之接著片材的多餘部分收容於各多餘構件收容手段31A、31B。 In addition, the sheet sticking apparatus 1 has a cutting means for cutting a sheet to be bonded to a fixed body into a predetermined shape as in the case of Japanese Patent Application No. Hei 10-231608, and the sheet after cutting may be used. The excess portion is housed in each of the excess member housing means 31A, 31B.

進一步地,晶圓收容手段2,可設置複數個,亦可將複數個晶圓收容手段2,藉由與各框架收容手段3A、3B同樣之構成,而構成為可與框架11分離。 Further, a plurality of wafer accommodating means 2 may be provided, and a plurality of wafer accommodating means 2 may be configured to be separated from the frame 11 by the same configuration as each of the frame accommodating means 3A, 3B.

此外,框架收容手段,可設置一個亦可設置3個以上,只要框架收容手段為可於框架口10與補充位置SP之間自走之構成即可。 Further, three or more frame accommodation means may be provided, as long as the frame accommodation means is configured to be self-propellable between the frame opening 10 and the supplementary position SP.

進一步地,亦可為如下之構成:將第1及第2框架收容手段3A、3B中的一方設為主側,將另一方設為子側,一直由搬送手段7將環狀框架RF從主側搬送往支持手段6,僅在該主側之環狀框架RF已用完,直至補充新的環狀框架RF並再次位於框架口10為止之期間,搬送手段7將環狀框架RF從子側搬送往支持手段6。 Further, a configuration may be adopted in which one of the first and second frame housing means 3A, 3B is the main side, and the other is the sub side, and the ring frame RF is always driven by the transport means 7 from the main The side is transported to the support means 6, and only the annular frame RF of the main side has been used up until the new annular frame RF is replenished and is again located in the frame opening 10, and the transport means 7 removes the annular frame RF from the sub-side. Transfer to support means 6.

此外,亦可為如下之構成:在操作員利用手動操作驅動直動馬達82,解除輸出軸81與定位銷47A、47B之卡止,且搬送手段7使取出中的第1及第2框架收容手段3A、3B中的一方從框架口10分離之情形,搬送手段7開始進行將環狀框架RF從第1及第2框架收容手段3A、3B中的另一方搬送往支持手段6之動作。 Further, a configuration may be adopted in which the operator drives the linear motor 82 by manual operation to release the locking of the output shaft 81 and the positioning pins 47A and 47B, and the conveying means 7 accommodates the first and second frames that are being taken out. When one of the means 3A and 3B is separated from the frame opening 10, the transport means 7 starts the operation of transporting the annular frame RF from the other of the first and second frame housing means 3A, 3B to the support means 6.

進一步地,亦可為如下之構成:固定手段8可進行互鎖 (interlock),使得操作員無法利用手動操作使第1及第2框架收容手段3A、3B兩方均從框架口10分離。 Further, it may be configured as follows: the fixing means 8 can be interlocked (interlock), the operator cannot separate the first and second frame housing means 3A, 3B from the frame opening 10 by manual operation.

此外,本發明中的黏附體及接著片材AS的種類或材質等並無特別限定,例如,接著片材AS,可為於基材片材BS與接著劑層AD之間具有中間層者、或於基材片材BS的上面具有覆蓋層等之3層以上者,進一步地,亦可為如能夠從接著劑層AD剝離基材片材BS之所謂的雙面接著片材般之接著片材,作為如此之雙面接著片材,亦可為具有單層或複數層之中間層者、或無中間層之單層或複數層者。進一步地,黏附體係半導體晶圓,而接著片材AS亦可為保護片材、切割帶材(singulation tape)、黏著薄膜(die attach film)等。此時,半導體晶圓,可例示矽半導體晶圓或化合物半導體晶圓等,而黏貼於如此之半導體晶圓的接著片材AS,並不限於上述接著片材,可應用任意之片材、薄膜、帶材等任意用途、形狀之接著片材等。進一步地,黏附體係光碟(disc)之基板,而接著片材AS亦可為具有構成記錄層之樹脂層者。如上所述,作為黏附體,不僅可為玻璃板、鋼板、陶器、木板或樹脂板等其他黏附體,亦可以任意形態之構件或物品等作為對象。 Further, the type and material of the adherend and the sheet AS in the present invention are not particularly limited. For example, the sheet AS may be an intermediate layer between the base sheet BS and the adhesive layer AD. Alternatively, three or more layers of the cover layer or the like may be provided on the upper surface of the base material sheet BS, and further, a so-called double-sided sheet-like sheet which can peel the base sheet BS from the adhesive layer AD may be used. The material, as such a double-sided back sheet, may also be an intermediate layer having a single layer or a plurality of layers, or a single layer or a plurality of layers having no intermediate layer. Further, the system semiconductor wafer is adhered, and then the sheet AS may be a protective sheet, a singulation tape, a die attach film, or the like. In this case, the semiconductor wafer may be exemplified by a semiconductor wafer or a compound semiconductor wafer, and the subsequent sheet AS adhered to such a semiconductor wafer is not limited to the above-described succeeding sheet, and any sheet or film may be applied. , such as strips, and other shapes and shapes of the following sheets. Further, the substrate of the system disc is adhered, and then the sheet AS may be a resin layer constituting the recording layer. As described above, the adhesive body may be not only a glass plate, a steel plate, a ceramics, a wood board, a resin board or the like, but also a member or an article of any form.

進一步地,上述實施形態中的驅動機器,可採用旋動馬達、直動馬達、線性馬達、單軸機械臂、多關節機械臂等電動機器、以及氣缸、液壓缸、無桿汽缸及旋轉汽缸等之致動器等,而且亦可採用直接或間接地將該等加以組合而成者(亦具有與在實施形態中所例示之機器重複者)。 Further, in the drive device according to the above-described embodiment, an electric motor such as a rotary motor, a linear motion motor, a linear motor, a single-axis robot arm, or a multi-joint robot arm, and an air cylinder, a hydraulic cylinder, a rodless cylinder, a rotary cylinder, or the like may be used. The actuators and the like may be combined directly or indirectly (also having the same as those exemplified in the embodiment).

1‧‧‧片材黏貼裝置 1‧‧‧Sheet Adhesive Device

2‧‧‧晶圓收容手段 2‧‧‧ Wafer containment means

3A‧‧‧第1框架收容手段 3A‧‧‧1st frame containment means

3B‧‧‧第2框架收容手段 3B‧‧‧2nd frame containment means

5A‧‧‧第1檢測手段 5A‧‧‧1st means of detection

5B‧‧‧第2檢測手段 5B‧‧‧Second detection means

5C‧‧‧第3檢測手段 5C‧‧‧3rd means of detection

6‧‧‧支持手段 6‧‧‧Support means

7‧‧‧搬送手段 7‧‧‧Transportation means

8‧‧‧固定手段 8‧‧‧Fixed means

9‧‧‧黏貼手段 9‧‧‧Adhesive means

10‧‧‧框架口 10‧‧‧Frame mouth

11‧‧‧框架 11‧‧‧Frame

12‧‧‧定位孔 12‧‧‧Positioning holes

13‧‧‧剝離手段 13‧‧‧Dissipation means

21‧‧‧晶圓匣 21‧‧‧ Wafer

31A、31B‧‧‧多餘構件收容手段 31A, 31B‧‧‧Removal components containment means

32A、32B、64‧‧‧線性馬達 32A, 32B, 64‧‧‧ linear motors

34A‧‧‧支持構件 34A‧‧‧Support components

35A‧‧‧桿 35A‧‧‧ pole

40A、40B‧‧‧移動手段 40A, 40B‧‧‧ mobile means

42A、42B‧‧‧台車 42A, 42B‧‧‧Trolley

46A、46B‧‧‧保持部 46A, 46B‧‧‧ Keeping Department

47A、47B‧‧‧定位銷 47A, 47B‧‧‧ Locating Pin

48A‧‧‧測位手段 48A‧‧‧ Positioning means

61‧‧‧支持面 61‧‧‧Support surface

62‧‧‧載台 62‧‧‧Package

71‧‧‧多關節機械臂 71‧‧‧Multi-joint robotic arm

71A‧‧‧前端部 71A‧‧‧ front end

72‧‧‧保持手段 72‧‧‧Retention means

73‧‧‧凹部 73‧‧‧ recess

74‧‧‧保持框架 74‧‧‧ Keep the frame

74A‧‧‧面 74A‧‧‧ face

75‧‧‧XY載台 75‧‧‧XY stage

76‧‧‧輸出部 76‧‧‧Output Department

77‧‧‧吸附板 77‧‧‧Adsorption plate

78‧‧‧吸附孔 78‧‧‧Adsorption holes

79‧‧‧吸附面 79‧‧‧Adsorption surface

481A、481B‧‧‧接收手段 481A, 481B‧‧‧ Receiving means

AA‧‧‧符號 AA‧‧ symbol

AR‧‧‧箭頭 AR‧‧‧ arrow

DP‧‧‧廢棄位置 DP‧‧‧Discarded location

OP‧‧‧發送手段 OP‧‧‧ means of transmission

RF‧‧‧環狀框架 RF‧‧‧ ring frame

RF1‧‧‧開口部 RF1‧‧‧ openings

RF2‧‧‧凹槽 RF2‧‧‧ groove

SP‧‧‧補充位置 SP‧‧‧Additional location

WF‧‧‧晶圓 WF‧‧‧ wafer

X、Y、Z‧‧‧軸 X, Y, Z‧‧‧ axes

Claims (4)

一種片材黏貼裝置,其特徵在於,具備:框架收容手段,係可收容透過接著片材而與黏附體一體化之框架構件;支持手段,係至少支持該框架構件及該黏附體中的框架構件;搬送手段,係將該框架構件從該框架收容手段搬送往該支持手段;以及黏貼手段,係使該接著片材抵接並黏貼於支持於該支持手段之框架構件、或框架構件及黏附體;該框架收容手段,具備移動手段,該移動手段係可於相對於該搬送手段之既定之供給位置、與將該框架構件補充至該框架收容手段之補充位置之間自走。 A sheet sticking device comprising: a frame receiving means for accommodating a frame member integrated with the adhesive body through the sheet; and a supporting means for supporting at least the frame member and the frame member in the adhesive body The conveying means transports the frame member from the frame housing means to the supporting means, and the bonding means for abutting and adhering the bonding sheet to the frame member supported by the supporting means, or the frame member and the adhering body The frame housing means includes a moving means for self-propelling between a predetermined supply position with respect to the conveying means and a replenishing position for replenishing the frame member to the frame housing means. 如申請專利範圍第1項之片材黏貼裝置,其中,該移動手段,具有可識別框架收容手段之位置的測位手段。 The sheet sticking device of claim 1, wherein the moving means has a positioning means for recognizing a position of the frame housing means. 如申請專利範圍第1或2項之片材黏貼裝置,其中,該框架收容手段,具備收容多餘構件之多餘構件收容手段,且設置成可透過該移動手段而往廢棄該多餘構件之廢棄位置移動。 The sheet sticking device according to claim 1 or 2, wherein the frame accommodating means includes an excess member accommodating means for accommodating the excess member, and is provided to be movable to a waste position of the waste member by the moving means . 一種片材黏貼方法,其特徵在於:將透過接著片材而與黏附體一體化之框架構件,從配置於既定之供給位置之框架收容手段搬送往支持手段;使該接著片材抵接並黏貼於支持於該支持手段之框架構件、或框架構件及黏附體;在該框架收容手段的框架構件已用完時,使該框架收容手段從該供給 位置自走往補充該框架構件之補充位置;使已補充該框架構件之框架收容手段從該補充位置自走往該供給位置。 A sheet sticking method is characterized in that a frame member that is integrated with an adhesive body through a sheet is conveyed to a support means from a frame housing means disposed at a predetermined supply position; and the sheet is brought into contact with and adhered a frame member supported by the support means, or a frame member and an adhesive body; when the frame member of the frame receiving means has been used up, the frame receiving means is supplied from the supply The position is self-propelled to supplement the complementary position of the frame member; the frame receiving means that has supplemented the frame member is self-propelled from the replenishing position to the supply position.
TW102123153A 2012-07-24 2013-06-28 Sheet sticking device and sticking method TW201407698A (en)

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JP6302765B2 (en) * 2014-06-25 2018-03-28 株式会社ディスコ Tape sticking device
JP6906674B1 (en) * 2020-12-11 2021-07-21 リンテック株式会社 Frame accommodating device and frame accommodating method

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JP4090416B2 (en) * 2003-09-30 2008-05-28 日東電工株式会社 Separation method and separation device for workpiece with adhesive tape
JP2007214357A (en) * 2006-02-09 2007-08-23 Nitto Denko Corp Method of supporting work by sticking, and device for supporting work by sticking using same method
KR20090107512A (en) * 2007-01-25 2009-10-13 파나소닉 주식회사 Apparatus and method for supplying piling tray and apparatus and method for mounting component

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