201237159 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種應用於表面黏著錫膏印刷裝置之水 基溶液自動清洗方法。 【先前技術】 表面黏著科技(SMT)是指直接將封裝化電子零件以錫膏 焊接在印刷基板表面之焊點(PAD)上，採用表面黏著零件之 印刷電路板(PCB)的實作方法被稱為表面黏著技術(SMT), 該種表面黏著零件對印刷電路板的黏著是藉由：將錫膏塗 佈於印刷電路板的接合區(land)，再將配合表面黏著零件之 知子的零件搭載於s亥接合區並利用錫膏的黏著力使零件保 持於基板上後，利用回銲(reflow)爐對印刷電路板加熱促使 錫膏熔融，而將表面黏著零件錫銲於印刷電路板的方式執 行。表面黏著技術(SMT)對於近年來電子機器的小型化、高 性能化、高密度化、低成本化的實現有極大的貢獻。 早年不論SMT或波焊(wave solder)全部都使用氟氣碳化 物(CFCs)為溶劑，以清洗助焊劑(f]ux)，由於氟氣碳化物 (CFCs)經證實會破壞地球臭氧層，依據蒙特婁議定書，全 球自1996年1月1日禁用CFCs後，目前在SMT製程上所使用 之錫膏主要分為尺八(清洗型）及RMA(免洗型），這兩種錫膏 主要之最大差異，在於錫膏當中之助焊劑其活性的強弱來 區分，一般來說，由於RA型錫膏需經過清洗之動作，因此 活性較強，焊錫性也較好；反之，RMA型錫膏因無需清 洗而為了保持產品可靠度，不被焊後殘留之殘渣所腐 3 201237159 敍’所以其活性較弱，焊錫性也較差。 但复夕數業者基於職意識高漲，相繼轴RMA型錫膏， 絕緣Γ焊能力不能太強，否齡增加兩個相近零件之表面 運作且而使漏電流變大，導致整個電子系統無法正常 ’嚴重者可能會腐關點，所以使用統助焊劑之 A型錫膏於SMT時鎖要執行表面絕緣阻抗(SLR)的測 。為了保持產品可靠度及提高產品的良率，多數SMT業 在焊接過程中，使用熱氮氣㈣進行加熱，以減少待焊金 屬表面的氧化情形，但其亦大幅度增加製造成本。 在使用錫膏時，其鋼板(Stencil)在使用過程中需要經當 擦栻’使用後、上架前更必須清洗乾淨，以利確保下次使 用時仍可保原有狀態或潔淨度。 目刖市上錫膏印刷機的清洗不論是手擦拭，或是錫膏 ^刷機自動清潔，使用的清洗劑大多為揮發性石油系有機 冷劑’不僅溶劑本身所散發出的味道刺鼻難聞，且皆有低 #火點易揮發的特性(不論其基本材料為異丙醇(IPA)、碳 虱化合物或石油系混合溶劑甚至是氣化溶劑），尤其使用於 錫膏_機時，不僅因為洗劑容易揮發，造成王作人員與 =廠曝露工安危險風时（如輯/：L作人貞吸人洗劑蒸 氣）’更因此暴增清洗劑㈣耗量，大大提高清洗鋼板成 本。 身又而π»，在上述習用SMT製程清洗過程中，會使用 到例如_、酒精、異丙醇(IPA)、石油醚(去潰油」、石油 系混合有機溶劑等污染物質。 201237159 事實上，目前部份表面黏著業者為降低鋼板清洗成 本，不僅將改用乙醇(工業酒精)清洗鋼板，甚至使用回收的 溶劑作為洗劑’惟這錄低基本域本的方法，卻無法避 免石油 > 張價帶來的洗劑成本提升’以及可能被課徵v〇c(揮 發性有機物)空污稅(約為12元/公斤），t終將使鋼板清洗成 本可能提升。 石油系的有機混合溶劑，除本身具易燃性外，其氣味 具有一定之吸入性的傷害’並且會伴隨蒸發時，產生 v〇c(有機化合物）’這些有機混合溶劑，本身也是石油提煉 過程中的石化衍生品，當國際原油被大量使用時，將會加 速資源的耗竭，此時原油價格將高不可攀，使用者將會增 加生產成本。 【發明内容】 本發明之目的即在於提供一種應用於表面黏著錫膏印 刷裝置之水基溶液自動清洗方法，其係使用不含氣化溶劑 及溴化溶劑之1 〇 〇 %水溶性清洗劑均喷佈於一高耐磨及吸收 丨生佳的水針無塵布上，藉以擦拭及清潔Smt鋼板，針對錫 膏在印刷後殘留在SMT鋼板的助焊劑予以溶除，且在清洗 後，已分解的助焊劑和錫粉顆粒不會再附著在SMT鋼板的 表面。 本發明之次一目的係在於提供一種應用於表面黏著錫 膏印刷裝置之水基溶液自動清洗方法，其可以提高SMT電 子製品的產品良率，同時亦可降電子製品的製造成 〇 5 201237159 本發明之另-目的係在於提供-種應用於表面黏著錫 膏印刷裝置之水基清洗溶液，藉以取代傳統制石油系溶 劑，其使用生物可分解配方，可經由廢水處理廠内的生物 分解池，將清洗後廢水做100%淨化處理。 本發明之又-目的係在於提供一種應用於表面黏著锡 膏印刷裝置之水基清洗溶液，各成份均為高軸(化叱）， 無閃火點之疑慮，安全性高。 本發明之再-目的係在於提供一種應用於表面黏著锡 膏印刷裝置之水基驗自動清洗方法，因使賴G%水溶性 清洗劑，故在清洗驗巾可財效減少SMT製程中所產生 的各種污染物質；且不會產生揮發性有毒氣體，對操作人 員的身體健康不會造成不良的影響。 可達成上述發明目的之應用於表面黏著錫膏印刷裝置 U基溶液自動清洗方法，包括有下列步驟：使用及儲存 一不含氯化賴聽化溶狀觸％水難清洗劑；將該水 溶性清洗劑均㈣佈於一水針無塵布上；連續單向捲動該 水針無塵布以及錢該水針無塵轉拭清賴表面黏著錫 膏印刷裝置之一鋼板者。 在本發明-較佳實施例中，該應用於表面黏著锡膏印 刷裝置之水基洛液自動清洗方法’更包括有下列步驟：橫 向往復移_水針無塵布贿拭清潔該鋼板者。 在本發明-較佳實施例中，該水溶性清洗劑為一含水 t水基溶液。 在本發明-較佳實施财，該水溶性清洗劑包括有下 201237159 列成分：0-30%二丙二醇衍生物、5_15%丙二醇衍生物、^ 5%直鍊可被分解聚乙二醇酯界面活性劑以及50-94%水。 在本發明一較佳實施例中，該水溶性清洗劑包括有下 列成分：0-20%聚氧烯烷基醚類非離子界面活性劑、〇_9〇% 脂肪族炭氫化合物類以及0-70°/。水。 【實施方式】 ^請同時參閱圖1及圖2，本發明所提供之應用於表面黏 著錫膏印刷裝置之水基溶液自動清洗方法，主要包括有下 列步驟：儲存不含氣化溶劑錢化溶劑之則％水溶性清洗 劑12於一溶劑槽11内；使用—喷嘴13將該水溶性清洗劑12 均勻喷佈於一以輥輪組14輸送的連續單向捲動水針無塵布 15上；以及使用該水針無塵布15擦拭清潔該表面黏著錫膏 印刷裝置10之一鋼板16者。 '未使用的水針無塵布15係被捲繞儲存於一側輥輪内， 並在進行誠她丨6工料，由雜敝丨4賴單向捲動 該水針無塵布15，使已擦拭鋼板16而被沾污的水針無塵布 15被帶動捲繞儲存於另—侧輥輪内，令該已沾污的水針無 塵布15不被重覆使用者。 該輥輪組14、噴嘴13及水針無塵布I5，可被整组安裝 於作-如圖2帽騎稀向往復運_移動機台口上，使 該水針無塵布15得轉拭清雜油板16者。 以該水溶性清洗劑12清洗SMT鋼板16時，得使用但 限於下列方式或魏合：肢、纽騎音波清洗。— 本發明的主要作法㈠為以半水洗清洗船％其含水量 201237159 為1%〜99%) ’清洗劑12内容物所含的其他化學成分，均為 安全性的物質也絕非致癌物質與GHS所列之管制物質，使 用上是相當安全’時量作允許濃度(TLV/TWA)也非常的 低’並不會造成吸人性的傷害，也不會有易燃的問題，清 洗劑12内的化學成分均屬於生物可分解的條件，因此也不 會產生大量的廢溶液，徒增困擾。此外半水洗清洗劑12， 可以依據客戶的相關製程條件，做化學成分濃度與水分含 量的調整，以滿足客戶在生產清洗與成本上，可以得到較 佳的成效。主要作法(二），以超吸水性水針無塵布15搭配， 由上述作法(一）的半水洗清洗劑12，搭配吸油性的水針無塵 布15 ’對SMT鋼板16進行清洗。 上述水溶性清洗劑12，包括有下列成分：0-30%二丙二 醇衍生物、5-15%丙二醇衍生物、1_5%直鍊可被分解聚乙 二醇酯界面活性劑以及5〇_94%水。其中’丙二醇衍生物在 短時間時量平均容許濃度為3〇〇ppm ’最高容許濃度則為 600ppm。 上述水溶性清洗劑12的物理及化學性質如表一所示： 201237159 物質狀態：液體 形狀：液體 顏色：無 氣味：略帶氯仿味 PH 值：11±〇.5(豨釋4 倍後約為11) —--- 沸點/沸點範圍：100°C 分解溫度：200°C以上 閃火點：無 測試方法：閉杯 自燃溫度：無 爆炸界限：下限（LEL): not list 上限（UEL):not list 蒸氣壓：9.5 mm/Hg pal (at25〇C) 蒸氣密度：3.11 (空氣=1) 密度：1 水溶解度：100% (complete) ---- 表一 上述水溶性清洗劑12的安定性及反應性如表二所示： 安定性：鈍性化學物 特殊狀況下可能之危害反應:避免高溫產生水蒸氣灼傷 應避免之狀況：避免高溫，不良的通風設備。 應避免之物質：強氧化劑、點火源、熱、火焰。 危害分解物：無 ' —-- 表二 上述水溶性清洗劑12為一不含氣化溶劑及溴化溶劑之 100%水溶性及可生物分解配方的清洗劑，可經由廢水處理 廠内的生物分解池，將清洗後廢水做100%淨化處理，對於 環境及生態無不良的影響。 201237159 上述之水針無塵布15具有高耐磨性及高吸收性’可充 分吸收殘留於該§]^丁鋼板16上的水溶性清洗劑12，將該 SMT鋼板16完全地擦拔乾淨。該水針無塵布15的物理性質 如表三所示： 項目 方法 結果 基重(g /m2) ASTM D-3776 67.8 厚度(mils) ASTM D-5729 13 縱向乾拉力MD(lbs.) ASTM D-5034 27 橫向乾拉力CD(lbs.) ASTM D-5034 18 縱向溼拉力MD(lbs.) ASTM D-5034 21 橫向溼拉力CD(lbs.) ASTM D-5034 13 吸收性 INDA 1ST 10.4-02 2.5 吸收量(％) — 470 耐磨強度(cycles) ASTM D-3884 ------ 50 抗張測試張數:1 -PL Y 抗張測試條1 —~. 牛:紙··__〉4’丨χ6η —----J 表三 本發明水溶性清洗劑12另一實施例，包括有下列 分：0-20%聚輯燒細_離子界面活㈣、q_9收脂 族炭氫化合物類以及G-7G%水。其巾，聚氧烯絲喊類非 子界面活性劑及脂肪族炭氫化合物_時量平均容許遭户 201237159 (TWA)為lOOppm ’在短時間時量平均容許濃度為丨娜帅。 上述水溶性清洗劑12另一實施例的物理及化學性質如 表四所示： 物質狀態：液體 形狀i喊、無色 ~~~~ 顏色：無色 氣味:醚味 ~~ PH值：中性 沸點/沸點範匱：180 °C 分解溫度：一 閃火點：75°C ' 測試方法：（）開杯（▽)閉 杯 自燃溫度：無資料 爆炸界限： 下限（LEL):無資料 上限（UEL):無資料 蒸氣壓.0.4 mm Hg @ 25 °C 蒸氣密度：〜5.1 (空氣=1) 密度：0·95 (水=1) 溶解度：完全互溶（對水1^ 解度） 表四 上述水溶性清洗劑12另一 實施例的安定性及反應性如 表五所示： 安定性：安定鈍性化— 況下可能之危害 fSii況：丨.不^備。了系電、火花、火 硝酸鹽、過氣酸 表五 本發明提供之應用於表面黏著錫膏印刷裝置之水基溶 液自動清洗方法，具有優良的SMT鋼板清洗效果以及下列 201237159 功效： h使用不含氣化溶劑㈣化轉之1GG%水雜清洗劑12清 洗SMT鋼板16 ’碰用高耐磨及吸收性的水針無塵布進 行擦拭；藉以針賴膏在印概触在鋼板的助嬋劑予 以/谷除，且在清洗後，已分解的助焊劑不會再附著在 SMD表面。 2. 可以提高SMTf子製品的產品良率，同時亦可降低謝 電子製品的製造成本。 3. 使用生物可分解配方’可經由廢水處理廠内的生物分解 池，將清洗後廢水做100%淨化處理。 4. 該水基清洗劑各祕均為高雜沖吻，無閃火點之 疑慮，安全性高。 5. 使用刚％水雜清洗劑，故在清洗過程巾可以有效減少 SMT製程巾所產生的各種污雜質；且不會產生揮發性 有毒氣體，對操作人員的身體健康不會造成不良的影 響。 ’ 上列詳細說明係針對本發明之一可行實施例之具體說 明’惟該實施例並_以關本發明之專利範圍，凡未脫 離本發明技㈣神所為之實施或變更，均應包含於本 案之專利範圍中。 【圖式簡單說明】 圖1為本發明應用於表面黏著錫膏印刷裝置之水基溶液 連續清洗方法之流程圖；以及 圖2為本發明應用於表面黏著錫膏印刷裝置之水基溶液 12 201237159 連續清洗方法之一清洗裝置結構示意圖。 【主要元件符號說明】 10錫膏印刷裝置 11溶劑槽 12水溶性清洗劑 13喷嘴 14輥輪組 15水針無塵布 16鋼板 17移動機台 ,3 13201237159 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an automatic cleaning method for a water-based solution applied to a surface-adhesive solder paste printing apparatus. [Prior Art] Surface Adhesion Technology (SMT) refers to the direct soldering of encapsulated electronic parts to solder joints (PAD) on the surface of printed boards, and the implementation of printed circuit boards (PCBs) with surface-adhesive parts. Known as Surface Adhesion Technology (SMT), the adhesion of the surface-adhesive parts to the printed circuit board is achieved by applying solder paste to the land of the printed circuit board, and then bonding the surface to the surface of the part. After being mounted on the sig junction area and using the adhesion of the solder paste to hold the parts on the substrate, the reflow furnace is used to heat the printed circuit board to promote the solder paste melting, and the surface adhesive parts are soldered to the printed circuit board. Way to execute. Surface adhesion technology (SMT) has greatly contributed to the realization of miniaturization, high performance, high density, and low cost of electronic equipment in recent years. In the early years, both SMT and wave solder used fluorine gas carbides (CFCs) as solvents to clean the flux (f]ux), as fluorine gas carbides (CFCs) proved to destroy the Earth's ozone layer, according to Monte娄 Protocol, since the global ban on CFCs on January 1, 1996, the solder pastes currently used in the SMT process are mainly divided into shakuhachi (cleaning type) and RMA (no-clean type), the two main types of solder paste The difference lies in the strength of the flux in the solder paste to distinguish it. Generally speaking, since the RA type solder paste needs to be cleaned, the activity is stronger and the solderability is better; otherwise, the RMA type solder paste is not needed. In order to maintain the reliability of the product, it is not rotted by the residual residue after welding. Therefore, its activity is weak and the solderability is also poor. However, the Fuxi number industry is based on a high level of professional awareness. The continuous shaft RMA solder paste can not be too strong. The age of the two adjacent parts is increased and the leakage current is increased, resulting in the failure of the entire electronic system. Severe cases may be eroded, so the use of flux A type solder paste for SMT locks to perform surface insulation resistance (SLR). In order to maintain product reliability and improve product yield, most SMT industries use hot nitrogen (4) for heating during the soldering process to reduce the oxidation of the surface to be soldered, but it also significantly increases manufacturing costs. When using solder paste, the steel plate (Stencil) needs to be cleaned after use, and must be cleaned before use, so as to ensure the original state or cleanliness can be guaranteed when using it next time. I saw the cleaning of the tin paste printing machine in the city, whether it is hand wiping, or the solder paste brush machine is automatically cleaned. Most of the cleaning agents used are volatile petroleum organic refrigerants. Not only the smell of the solvent itself is pungent. And all have low volatile characteristics of the fire point (whether the basic material is isopropyl alcohol (IPA), carbon-based compound or petroleum-based mixed solvent or even gasification solvent), especially when used in solder paste Because the lotion is easy to volatilize, causing the Wang Zuo personnel and the factory to expose the dangerous weather (such as the series /: L for people to suck the lotion vapor), so the consumption of cleaning agent (four) is increased, greatly improving the cost of cleaning steel. . In addition to π», in the above-mentioned conventional SMT process cleaning process, pollutants such as _, alcohol, isopropyl alcohol (IPA), petroleum ether (de-slumping oil), petroleum-based mixed organic solvents, etc. are used. At present, some surface adhesives are not only going to use ethanol (industrial alcohol) to clean steel plates, but also using recycled solvents as a lotion to reduce the cost of steel plate cleaning. However, this method of recording low basic domains cannot avoid oil. The cost of the lotion brought by the price increase' and may be subject to v〇c (volatile organic matter) air pollution tax (about 12 yuan / kg), t will eventually make the cost of steel plate cleaning may increase. The solvent, in addition to its own flammability, its odor has a certain inhalation damage 'and will produce v〇c (organic compound)' organic mixed solvent with evaporation, itself is also a petrochemical derivative in the petroleum refining process. When international crude oil is used in a large amount, it will accelerate the depletion of resources. At this time, the crude oil price will be unattainable, and the user will increase the production cost. The purpose is to provide an automatic cleaning method for a water-based solution applied to a surface-adhesive solder paste printing device, which uses a 1%% water-soluble cleaning agent containing no vaporizing solvent and a brominating solvent to be sprayed on a high abrasion resistance. And absorbing the good water needle dust-free cloth, in order to wipe and clean the Smt steel plate, the flux remaining on the SMT steel plate after the solder paste is dissolved, and after the cleaning, the decomposed flux and the tin powder The particles are no longer attached to the surface of the SMT steel sheet. The second object of the present invention is to provide a water-based solution automatic cleaning method for a surface-adhesive solder paste printing device, which can improve the product yield of the SMT electronic product, and also Manufacture of degradable electronic articles 5 201237159 Another object of the present invention is to provide a water-based cleaning solution for a surface-adhesive solder paste printing apparatus, which replaces a conventional petroleum-based solvent, which uses a biodegradable formula, The cleaned wastewater can be subjected to 100% purification treatment through a biological decomposition pool in the wastewater treatment plant. The present invention is further intended to provide an application to the table. The water-based cleaning solution of the adhesive solder paste printing device has high-axis (chemical enthalpy), no doubt about the flash point, and high safety. The second objective of the present invention is to provide a surface-adhesive solder paste printing. The water-based automatic cleaning method of the device relies on the G% water-soluble cleaning agent, so the cleaning of the towel can reduce the various pollutants generated in the SMT process; and it does not generate volatile toxic gases to the operator. The health of the body does not cause adverse effects. The U-based solution automatic cleaning method for the surface-adhesive solder paste printing device can achieve the above-mentioned objects, including the following steps: use and storage of a non-chlorinated lysing solution % water-resistant cleaning agent; the water-soluble cleaning agent is (four) clothed on a water-free needle-free cloth; continuous one-way rolling of the water needle dust-free cloth and money, the water needle dust-free wiping, surface-adhesive solder paste printing One of the devices is a steel plate. In the preferred embodiment of the present invention, the method for automatically cleaning a water-based liquid solution applied to a surface-adhesive solder paste printing apparatus further comprises the following steps: lateral reciprocating movement - water needle dust-free cloth wiping and cleaning the steel sheet. In a preferred embodiment of the invention, the water soluble cleaning agent is an aqueous t water based solution. In the present invention - preferably, the water-soluble cleaning agent comprises the following 201237159 column components: 0-30% dipropylene glycol derivative, 5_15% propylene glycol derivative, ^ 5% linear chain decomposable polyethylene glycol ester interface Active agent and 50-94% water. In a preferred embodiment of the present invention, the water-soluble cleaning agent comprises the following components: 0-20% polyoxyalkylene ether type nonionic surfactant, 〇_9〇% aliphatic hydrocarbons and 0 -70°/. water. [Embodiment] Please refer to FIG. 1 and FIG. 2 simultaneously. The method for automatically cleaning a water-based solution applied to a surface-adhesive solder paste printing device according to the present invention mainly comprises the following steps: storing a solvent containing no gasification solvent Then, the water-soluble cleaning agent 12 is in a solvent tank 11; the water-soluble cleaning agent 12 is evenly sprayed on the continuous one-way rolling water needle dust-free cloth 15 conveyed by the roller set 14 by using the nozzle 13 And cleaning the surface of the steel plate 16 of the solder paste printing device 10 by using the water needle dust-free cloth 15. 'Unused water needle dust-free cloth 15 is wound and stored in one side of the roller, and is carried out by Cheng Zhu 6 materials, which is unidirectionally rolled by the miscellaneous shovel 4 to make the water needle clean cloth 15 The water needle dust-free cloth 15 which has been wiped by the steel sheet 16 is wound and stored in the other side roller so that the contaminated water needle dust-free cloth 15 is not overlaid by the user. The roller set 14, the nozzle 13 and the water needle dust-free cloth I5 can be installed in the whole group - as shown in Figure 2, the cap riding lean reciprocating _ moving machine table mouth, so that the water needle dust-free cloth 15 can be wiped Clear oil board 16 people. When the SMT steel sheet 16 is washed with the water-soluble cleaning agent 12, it is used but limited to the following methods or Weihe: limb, New Zealand sound wave cleaning. - The main method of the present invention (1) is to wash the ship with a half-water washing water having a water content of 201237159 of 1% to 99%) "The other chemical components contained in the contents of the cleaning agent 12 are safe substances and are not carcinogenic substances. The controlled substances listed in GHS are quite safe to use. The allowable concentration (TLV/TWA) is also very low. It does not cause inhalation injury, and there is no flammable problem. The chemical composition is all biodegradable, so it does not produce a large amount of waste solution. In addition, the semi-washing cleaning agent 12 can be adjusted according to the customer's relevant process conditions to adjust the chemical composition concentration and moisture content to meet the customer's production cleaning and cost, and can obtain better results. The main method (2) is to use a super-absorbent water-needle clean cloth 15 to clean the SMT steel sheet 16 by the semi-washing cleaning agent 12 of the above-mentioned method (1), together with the oil-absorbing water needle dust-free cloth 15'. The above water-soluble cleaning agent 12 comprises the following components: 0-30% dipropylene glycol derivative, 5-15% propylene glycol derivative, 1-5% linear decomposable polyethylene glycol ester surfactant, and 5〇_94% water. Wherein the 'propanediol derivative has an average allowable concentration of 3 〇〇ppm in a short time period' and a maximum allowable concentration of 600 ppm. The physical and chemical properties of the above water-soluble cleaning agent 12 are shown in Table 1: 201237159 Material state: liquid shape: liquid color: odorless: slightly chloroform taste PH value: 11±〇.5 (after release of 4 times 11) —--- Boiling point / boiling point range: 100 ° C Decomposition temperature: above 200 ° C flash point: no test method: closed cup auto-ignition temperature: no explosion limit: lower limit (LEL): not list upper limit (UEL): Not list Vapor pressure: 9.5 mm/Hg pal (at25〇C) Vapor density: 3.11 (air = 1) Density: 1 Water solubility: 100% (complete) ---- Table 1 The stability of the above water-soluble cleaning agent 12 And the reactivity is shown in Table 2: Stability: Possible hazardous reactions under special conditions of blunt chemicals: Avoid the situation of high temperature water vapor burns should be avoided: avoid high temperature, poor ventilation equipment. Substances to avoid: strong oxidants, ignition sources, heat, flames. Hazardous Decomposition Products: None'—-- Table 2 The above water-soluble cleaning agent 12 is a 100% water-soluble and biodegradable formula cleaning agent containing no gasification solvent and bromination solvent, and can be passed through the wastewater treatment plant. Decomposition pool, 100% purification treatment of cleaned wastewater, no adverse effects on the environment and ecology. 201237159 The above-mentioned water-cleaning cloth 15 has high abrasion resistance and high absorbency. The water-soluble cleaning agent 12 remaining on the steel plate 16 can be sufficiently absorbed, and the SMT steel sheet 16 is completely wiped clean. The physical properties of the water-cleaning cloth 15 are shown in Table 3: Item Method Results Basis Weight (g / m2) ASTM D-3776 67.8 Thickness (mils) ASTM D-5729 13 Longitudinal Dry Tension MD (lbs.) ASTM D -5034 27 Transverse Dry Tensile CD (lbs.) ASTM D-5034 18 Longitudinal Wet Tension MD (lbs.) ASTM D-5034 21 Transverse Wet Tension CD (lbs.) ASTM D-5034 13 Absorbent INDA 1ST 10.4-02 2.5 Absorption (%) — 470 abrasion resistance (cycles) ASTM D-3884 ------ 50 Tensile test sheets: 1 -PL Y Tensile test strip 1 —~. Cow: Paper··__〉4 '丨χ6η—----J Table 3 Another embodiment of the water-soluble cleaning agent 12 of the present invention includes the following points: 0-20% poly-sintered ionic interface (4), q_9 aliphatic-type hydrocarbons And G-7G% water. Its towel, polyoxyalkylene-like non-surfactant and aliphatic hydrocarbons _ hourly average allowable households 201237159 (TWA) is lOOppm ‘in a short time, the average allowable concentration is 丨娜帅. The physical and chemical properties of another embodiment of the above water-soluble cleaning agent 12 are shown in Table 4: Material state: liquid shape i shout, colorless ~~~~ Color: colorless odor: ether flavor ~~ PH value: neutral boiling point / Boiling point range: 180 °C Decomposition temperature: one flash point: 75 °C 'Test method: () open cup (▽) closed cup auto-ignition temperature: no data explosion limit: lower limit (LEL): no data upper limit (UEL): No data vapor pressure. 0.4 mm Hg @ 25 °C Vapor density: ~5.1 (air = 1) Density: 0·95 (water = 1) Solubility: completely miscible (1^ solution for water) Table 4 above water-soluble cleaning The stability and reactivity of another embodiment of the agent 12 are shown in Table 5: Stability: dim-passiveness - possible hazard fSii condition: 丨. The utility model relates to an electric cleaning method for a water-based solution applied to a surface adhesive solder paste printing device, which has the advantages of excellent SMT steel plate cleaning effect and the following 201237159. Containing gasification solvent (4) Turning 1GG% water miscellaneous cleaning agent 12 Cleaning SMT steel plate 16' Use a high-wear and absorbable water-needle dust-free cloth for wiping; The agent is applied/divided, and after cleaning, the decomposed flux does not adhere to the surface of the SMD. 2. It can improve the product yield of SMTf sub-products, and at the same time reduce the manufacturing cost of Xie electronic products. 3. Use the biodegradable formula to clean the post-cleaning wastewater 100% through the biodegradation tank in the wastewater treatment plant. 4. The secrets of the water-based cleaning agent are high-mixing kisses, no doubts about the flash point, and high safety. 5. The use of water-only cleaning agent can effectively reduce all kinds of dirt and impurities generated by SMT process towel; it will not produce volatile toxic gas, and will not cause adverse effects on the health of operators. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) The detailed description of one of the possible embodiments of the present invention is intended to cover the scope of the invention, and is not intended to be The patent scope of this case. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a method for continuously cleaning a water-based solution applied to a surface-adhesive solder paste printing device according to the present invention; and FIG. 2 is a water-based solution for a surface-adhesive solder paste printing device of the present invention 12 201237159 A schematic diagram of the structure of a cleaning device in one of the continuous cleaning methods. [Main component symbol description] 10 solder paste printing device 11 solvent tank 12 water-soluble cleaning agent 13 nozzle 14 roller group 15 water needle dust-free cloth 16 steel plate 17 mobile machine, 3 13