201222895 六、發明說明： 【發明所屬之技術領威】 [0001] 本發明涉及一種光源模組，特別是以發光二極體作為光 源的光源模組° 【先前技術】 [00〇2] 相比於傳統的發光源’發光二極體（Light Emitting Diode，LED)具有重量輕、體積小、污染低、壽命長等 優點’其作為/種新型的發光源，已經被越來越多地應 ^ 用到各領域當中，如路燈、交通燈、信號燈、射燈及裝 飾燈等等。以發光二極體模組作為光源模組的照明裝置 ，其通常是將發光二極體元件以焊錫的方式固定於燈條 或燈板的電路結構層並與之形成電佳連接。 [0003] 然而，若該照明裝置中有一顆發光二極體元件損壞，又 因為用焊錫方式的連接不容易拆卸，則整個燈條或燈板 即無法使用，拆分單個發光二極體元件又很麻煩，由此 造成極大的不便。 〇 【發明内容】 [0004] 有鑒於此，本發明旨在提供一種容易替換的發光二極體 模組結構。 [0005] —種發光二極體模組，包括基板，裝設於基板上的發光 二極體元件，該發光二極體元件左右兩邊分別伸出電極 ’以及鋪設於基板上表面並與該發光二極體元件電連接 的電路結構，該基板左右兩邊沿各向内伸出—個彈性懸 臂’與基板上表面構成夾式結構，所述發光二極體元件 的電極夾在該彈性懸臂内》 099140465 表單編號A0101 第3頁/共12頁 〇< 201222895 [0006] [0007] [0008] [0009] [0010] 099140465 裝入發光二極體S件時只需打開夾式基板，將發光二極 體元件的電極壓置於電極上即可完成電連接和固定，避 免採用錫膏，簡化安裝和拆卸過程。 下面參照附圖’結合具體實施例對本發明作進_步的描 述。 【實施方式】 請參考圖1和圖2 ’該發光二極體模組包括基板1〇，鋪設 於基板10上的電路結構20，以及裝設於該基板1〇上並與 電路結構20電性連接的發先二極體元件3〇。 請同時參閱圖3，所述基板1〇呈長條形，具有平坦的底板 12，該底板12具有上表面14，該基板1〇的左右兩長邊沿 向上延伸後向内彎曲各形成一個彈性懸臂〗6，該彈性懸 臂16也呈長條狀。該彈性懸臂16具有一個與底板丨2平行 的自由端161，自由端161與底板12之間具有一個預設距 離d。該基板10採用彈性較_蛘的材料製成，如金屬材料鋁 合金等。該彈性懸臂16與塞板1〇的底板12形成一個夾式 結構’向上拉動彈性懸臂16的自由端161，可使距離d增 大。 所述電路結構20鋪設於基板1〇的上表面14 ’在本實施例 中，該電路結構20為一電路板，其中間具有一段間隔21 使該電路結構20呈兩條長條狀平鋪於底板12的左右兩側 ，將基板10的上表面14露出一部分，所述發光二極體兀 件30貼設於基板1〇露出的上表面14上。該電路結構20可 以為高熱導係數鋁基板，配合前述基板10 ’以使該發光 二極體模組具有更高的散熱效率。當然，在其他實施例 0992070456 表單編號A0101 第4頁/共12頁 201222895 中读電路結構20也可以為傳統的PCB板等。在其他實施 ttj ^ . ^ 根據s亥電路結構2〇的佈線不同，其也可為—整塊 條形板狀結構平鋪於底板12上，中間無間隔，所述發光 一槌體元件30貼設於該電路結構20上。此外，該電路結 冓2〇可以直接於基板1〇的底板12上表面進行蝕刻並佈線 形成，而不需另外裝設電路板於基板10上。 [0011] ο 該發光二極體元件3〇是發光二極體封裝結構包括封裝 基板31，設置於該封裝基板31上的電極犯，裝設於封裝 土板31上並與電極32電連接的發先二極體晶片μ，形成 於封裝基板31上的殼體35以及封裂於殼體35内、覆蓋發 光一極體晶片33和封裝基板31的封裝層34。該發光二極 體元件30裝設於前述電路結構2〇之間;露出的基板1〇的上 表面14。該左右電極32為金屬導線架，從封裝基板31左 右兩邊向外伸出，並彎折向下形成伸出端321用於與前述 電路結構20接觸。該電極32的伸出端321被彈性懸臂16 的自由端161壓持，由此達:到發光二極體元件3〇的固定與 ο 電連接。在其他實施例中，若重路結構2〇為整塊板狀結 構，中間不具有間隔，則發光二極體元件3〇可直接貼設 於電路結構20上，發光二極體元件3〇的電極32同樣從左 右兩邊伸出，與電路結構20電連接。前述彈性懸臂16與 底板12的預設距離d小於該電極32和電路結構2〇兩者厚度 之和。备發光二極體元件30裝入該基板後，彈性懸臂 16與底板12的距離d’等於電極32與電路結構2〇厚度之 和，利用彈性懸臂16的夾緊力牢固固定發光二極體元件 30 〇 099140465 表單編號A0101 第5頁/共12頁 0992070456-0 201222895 [0012] [0013] [0014} 该發光二極體模組在安裝時，先將基板1〇左右兩邊的彈 性懸臂16的自由端161向上辦開，從側面（如圖！箭頭績 向）將發光一極體元件的.電極32的伸出端32〗置於 彈性懸臂16之下並推人該基板1G，此時電極㈣伸出端 321在電路結構2{)上向内滑動，到達預設位置後鬆開自由 端16卜使彈性懸臂16將電極32壓緊，完成該發光二極體 凡件3〇的安裝。另外，由於電路結構2G連續地分佈於基 板1〇的兩側’故可以任意調整發光二極體元件30的間距 ’通過改變I設的發光二極體元件3G的疏密程度，從而 I不同的發光效果。此結構同時也避免了重新設計新 、有不同谷置發光二極體元件30間隔的基板結構。 兩需更換該發光二極體模組的發光：極體元件30時，只 而掰開基板10的自由端161，同時將發光二極體元件繼 貝’向推出，再置換新的發光二極體元件3〇即可。 =所述本發明確6符合侧卿之齡，遂依法提 出專利申諸。，也 ▲ ，以上所述者僅為本發明之較佳實施方 ^枯I不心此限制本案之巾請專魏圍。舉凡熟悉本 ' "士援依本發明之精神所作之等效修飾或變化 ’皆應涵蓋於料利範圍内。 【圖式簡單說明】 [0015] 圖1為本發明—者# / , 實施例的發光二極體模組的俯視示意圖。 [0016] 圖2為本發明—| ^ , 實施例的發光二極體模組沿圖1中的線11 - 11的剖面示意圖。 [0017] 099140465 圖3為本發明1施例的發光二極體模組基板的剖視示意 表單編號A0101 第 6 頁/共 12 頁 0992070456-0 201222895 圖。 【主要元件符號說明】 [0018]基板：10201222895 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a light source module, particularly a light source module using a light-emitting diode as a light source. [Prior Art] [00〇2] The traditional light source 'Light Emitting Diode (LED) has the advantages of light weight, small size, low pollution, long life, etc.' as a new type of light source, it has been more and more ^ Used in various fields, such as street lights, traffic lights, signal lights, spot lights and decorative lights. An illumination device using a light-emitting diode module as a light source module generally fixes a light-emitting diode element to a circuit structure layer of a light bar or a light board by soldering and forms an electrical connection with the light-emitting diode element. [0003] However, if one of the lighting device has a light-emitting diode element and the soldering connection is not easy to disassemble, the entire light bar or the light board cannot be used, and the single light-emitting diode element is split. It is very troublesome and causes great inconvenience. SUMMARY OF THE INVENTION [0004] In view of the above, the present invention is directed to an easily replaceable light emitting diode module structure. [0005] A light-emitting diode module includes a substrate, a light-emitting diode element mounted on the substrate, and the left and right sides of the light-emitting diode element respectively protrude from the electrode and are disposed on the upper surface of the substrate and are coupled to the light-emitting diode a circuit structure in which the diode elements are electrically connected, and the left and right sides of the substrate protrude inwardly from each other—the elastic cantilever 'and the upper surface of the substrate form a clip structure, and the electrodes of the light emitting diode element are sandwiched in the elastic cantilever 099140465 Form No. A0101 Page 3 of 12 〇 < 201222895 [0006] [0007] [0008] [0009] [0010] 099140465 When the light-emitting diode S is mounted, it is only necessary to open the clip substrate, and the light will be illuminated. The electrode of the polar body element is pressed onto the electrode to complete the electrical connection and fixing, avoiding the use of solder paste, simplifying the installation and disassembly process. The invention will now be described in conjunction with the specific embodiments. [Embodiment] Please refer to FIG. 1 and FIG. 2 'The LED module includes a substrate 1 , a circuit structure 20 laid on the substrate 10 , and mounted on the substrate 1 and electrically connected to the circuit structure 20 . Connected first diode elements 3〇. Referring to FIG. 3, the substrate 1 is elongated and has a flat bottom plate 12. The bottom plate 12 has an upper surface 14. The left and right long edges of the substrate 1 are extended upward and then bent inward to form an elastic cantilever. 6, the elastic cantilever 16 is also elongated. The resilient cantilever 16 has a free end 161 that is parallel to the bottom plate 2 and has a predetermined distance d between the free end 161 and the bottom plate 12. The substrate 10 is made of a material having a higher elasticity than a metal material such as a metal alloy aluminum alloy. The resilient cantilever 16 forms a clip-on structure with the bottom plate 12 of the plug 1' and pulls the free end 161 of the resilient cantilever 16 upwardly to increase the distance d. The circuit structure 20 is laid on the upper surface 14' of the substrate 1'. In the embodiment, the circuit structure 20 is a circuit board having a space 21 therebetween, so that the circuit structure 20 is laid in two strips. On the left and right sides of the bottom plate 12, a portion of the upper surface 14 of the substrate 10 is exposed, and the light-emitting diode element 30 is attached to the upper surface 14 of the substrate 1 exposed. The circuit structure 20 can be a high thermal conductivity aluminum substrate, and the substrate 10 ′ is matched to make the LED module have higher heat dissipation efficiency. Of course, in other embodiments 0992070456 Form No. A0101 Page 4 / Total 12 Page 201222895 The read circuit structure 20 can also be a conventional PCB board or the like. In other implementations, ttj ^ . ^ according to the wiring of the sHai circuit structure 2〇, it may also be - a whole strip-shaped plate-like structure is laid on the bottom plate 12 without gaps in the middle, the light-emitting body element 30 is attached It is disposed on the circuit structure 20. In addition, the circuit structure can be etched and formed directly on the upper surface of the substrate 12 of the substrate 1 without the need to separately mount the circuit board on the substrate 10. [0011] The light emitting diode device 3A is a light emitting diode package structure including a package substrate 31, and an electrode disposed on the package substrate 31 is mounted on the package earth plate 31 and electrically connected to the electrode 32. The first diode wafer μ is formed on the package substrate 31, and the package layer 34 is sealed in the case 35 and covers the light-emitting monopole wafer 33 and the package substrate 31. The light-emitting diode element 30 is mounted between the circuit structures 2A; the exposed upper surface 14 of the substrate 1A. The left and right electrodes 32 are metal lead frames extending outward from the left and right sides of the package substrate 31, and are bent downward to form a projecting end 321 for contacting the circuit structure 20. The projecting end 321 of the electrode 32 is pressed by the free end 161 of the elastic cantilever 16, thereby achieving a fixed connection to the light-emitting diode element 3'. In other embodiments, if the heavy-duty structure 2 is a single plate-like structure and there is no space in the middle, the light-emitting diode element 3 can be directly attached to the circuit structure 20, and the light-emitting diode element 3 The electrodes 32 also extend from the left and right sides and are electrically connected to the circuit structure 20. The predetermined distance d between the elastic cantilever 16 and the bottom plate 12 is smaller than the sum of the thicknesses of the electrode 32 and the circuit structure 2'. After the light-emitting diode element 30 is mounted on the substrate, the distance d' between the elastic cantilever 16 and the bottom plate 12 is equal to the sum of the thickness of the electrode 32 and the circuit structure 2, and the light-emitting diode element is firmly fixed by the clamping force of the elastic cantilever 16. 30 〇099140465 Form No. A0101 Page 5 / Total 12 Page 0992070456-0 201222895 [0013] [0014] When installing the LED module, firstly, the freedom of the elastic cantilever 16 of the left and right sides of the substrate 1 The end 161 is opened upwards, and the protruding end 32 of the electrode 32 of the light-emitting one element is placed under the elastic cantilever 16 and pushed to the substrate 1G from the side (as shown in the figure!). The protruding end 321 slides inward on the circuit structure 2{). After reaching the preset position, the free end 16 is loosened, so that the elastic cantilever 16 presses the electrode 32 to complete the installation of the light-emitting diode. In addition, since the circuit structure 2G is continuously distributed on both sides of the substrate 1', the pitch of the light-emitting diode elements 30 can be arbitrarily adjusted, by changing the degree of density of the light-emitting diode elements 3G provided by I, so that I is different. Luminous effect. This structure also avoids redesigning new substrate structures with different valley-mounting LED elements 30 spacing. The two light-emitting diode modules need to be replaced: when the polar body component 30 is used, only the free end 161 of the substrate 10 is opened, and the light-emitting diode component is pushed out, and the new light-emitting diode is replaced. The body element can be 3 〇. = The invention is indeed in accordance with the age of the prince, and the patent application is filed according to law. , ▲, the above is only the preferred implementation of the present invention. I have no intention to limit the case of this case, please Wei Wei. All equivalent modifications or variations made by the applicant in accordance with the spirit of the invention should be covered by the scope of the material. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is a top plan view of a light emitting diode module of the present invention. 2 is a cross-sectional view of the light emitting diode module of the embodiment of the present invention taken along line 11-11 of FIG. 099140465 FIG. 3 is a cross-sectional view of a substrate of a light-emitting diode module according to a first embodiment of the present invention. Form No. A0101 Page 6 of 12 0992070456-0 201222895. [Main component symbol description] [0018] Substrate: 10
[0019] 底板：12 [0020] 上表面：14 [0021] 彈性懸臂：16 [0022] 自由端：161 [0023] 電路結構：20 [0024] 間隔：21 [0025] 發光二極體元件 ：30 [0026] 封裝基板：31 [0027] 電極：32 [0028] 伸出端：321 [0029] 發光二極體晶片 ：33 [0030] 封裝層：34 [0031] 殼體：35 099140465 表單編號A0101 第7頁/共12頁 0992070456-0[0019] Base plate: 12 [0020] Upper surface: 14 [0021] Elastic cantilever: 16 [0022] Free end: 161 [0023] Circuit structure: 20 [0024] Interval: 21 [0025] Light-emitting diode element: 30 Package substrate: 31 [0027] Electrode: 32 [0028] Projection end: 321 [0029] Light-emitting diode wafer: 33 [0030] Package layer: 34 [0031] Case: 35 099140465 Form No. A0101 7 pages / total 12 pages 0992070456-0