201222569 六、發明說明： 【發明所屬之技術領域】 本發明係關於形成有可用 器等之電極，或用於可做為電磁:觸：面板、各種顯示 電性薄骐。 皮w敝圖案導體圖案的導 【先前技術】 以往，用於觸控面板等的 將含有導電粒子及黏合劑樹脂的體，，係藉由 酯(PET)薄膜等的基材上 糊灰聚對酞酸乙二 —左右溫度乾燥而= =須考慮使導體圖案的導體寬度細== 導電=糊中所含有之導電粒子微細化是必要的广 ”、、、而，用含有微細的導電粒子 體圖案，導體寬度雖細，卻糊所形成的導 表示導電性糊巾所含有的導電^電性低。圖7為 體圖案的比電阻之關俜的曲綠固的平均粒徑(D50)和導 宏…岔 關係的曲線圖。此曲線圖中的導體圊 案二係僅使印刷於基材上的導電性糊導j 施行後述的錄敷，燒結或押壓 魂^ 、> =使導電粒子微細化則導體圖案的比電阻會择加。 由，s忍為係由於隨著導電粒子 曰 八 覆導電粒子的表面，因為』使得黏合劑樹脂被 此祕雜+ 4 4δ _脂而妨礙導電粒子彼 有著互係如此，導體寬_ 敷觸=導種於印刷含有非_ 屬#姐 十其％仃非電解鍍敷處理以形成金 屬曰糾軸比電阻低的導體圖案之方法(參照例如專利 4/29 201222569 文獻1)。 一又於在基材上印刷導電性糊之後’使其在25〇〇c以上 的局溫進行燒結，藉以去除導電粒子間的黏合劑樹脂之方 法也被使用著。 又，也在開發著一種含有藉由在透明基材上用導電性 f印刷以形成網格圖案的步驟和押壓步驟而成的電磁波遮 ’ ⑤用丨材的製造方法(參照例如專利文獻2)。 ' 〔先前技術文獻〕 . 〔專利文獻〕 • 〔專利文獻1〕日本特開平11-170420號公報 〔專利文獻2〕日本特開2009-164Π號公報 【發明内容】 〔發明所欲解決之課題〕 然而，於藉由專利文獻丨的鍍敷處理之情況，會有因 所使用的鍍敷液而導致基材劣化之顧慮。 • a又，於藉由燒結之情況，基材也會被加熱至高溫，故 不能使用耐熱性非常高的基材。 又，於如專利文獻2所述在透明基材上直接形成網格 f案的情況，當進行押㈣，網格圖案的導體寬度會有變 寬的顧慮。且藉由押壓之壓合雖可某程度地改善網格圖案 對透明基材的密接性，但由於透明基材和網格圖案為平面 接觸’故無法期待大幅度改善密接性。 _本發明7H!於上述問題點岭成，目的在於提供 不=斷線，並可兼顧導體寬度的微細化和低電阻化，而且 不卿基材的種類皆可形成導體圖案的密接性高的導電性 膜。 碍 5/29 201222569 〔用以解決課題之手段〕 關於本發明之導電性薄膜，其特徵為具有：基材；設 置於削述基材上之接受層；及將含有平均粒徑(D5〇)為2μιη 以下之導電粒子及黏合劑(binder)樹脂之導電性糊印刷於前 述接受層而形成的導體寬度為30μηι以下之導體圖案;前述 導體圖案之至少一部分係於前述導體圖案的厚度方向嵌入 於前述接受層中。 在前述導電性薄膜中，較佳為前述導體圖案的導體厚 度之10%以上係嵌入於前述接受層中。 在前述導電性薄膜中，較佳為前述導體圖案係藉由對 印刷於前述接受層而成之前述導電峡行熱壓而形成。 在前述導電性薄财，較佳為前述接受層之厚度為 圖案的頂部和前 電粒子之平均粒 在前述導電性薄膜，較佳為前述導體 述接受層的表面之高低差為 ΙΟμπι以下。 在前述導電性薄膜中，較佳為前述導 控：(D50)為lnm以上。 較佳為前述黏合劑樹脂的玻璃 在前述導電性薄膜中 轉化溫度(Tg)為_10〜25(rc 較佳為前述接受層係以熱可塑 性樹脂的玻璃轉化溫度(Tg)為 在前述導電性薄膜中， 性樹脂形成，前述熱可塑 -10〜250。(：。 在前述導電性薄膜中’較佳為前述接受層係以敎硬化 性觸形成’前賴硬化性難的硬化溫度為6〇〜3贼。 硬化’酬前爾料以電子線 6/29 201222569 〔發明之效果〕 依據本發明，藉由使用含有微 糊’可形成不會斷線的微細的導體粒：的導電性 【實施方式】 於接又層中’故可大幅提高密接性。 以下，就本發明的實施形態進行說明。 關於本發明之導電性_，如圖1所示，係 接受層ό與導體圖案3而形成。 一肴土材1、 做為基材1，只要是有絕緣性者 利用於光學領域的用柄 有透明枓去。且邮而马至乂在可見先區域 乙- 6旨(PEm :之^ ’做為基材1 ’例如，除了聚對駄酸 -酉曰(PET)錢之外，可用由甲基㈣ =酸樹脂、聚雜酸乙二g|、聚軸酸丁H 酸酸乙二醋等之聚黯樹脂、以取(股 「ARTON」為代表的降乒掄糸谢押 丄衣之商口口名 的口味「ττ_ * H手'树月曰、以由東曹（股)公司製 二二_」為代表的稀烴順脂等_ =有_脂基體、以麵形成的玻璃基體、 開平08-148829號公翱由4 e β^ 秋 不夺寸 者！。咖旨基材等的片狀或板狀 口 ‘、’、土^ 1 ’較佳為使用例如捲繞成輥狀的形態 、、要疋此種形態’可—邊使基材捲出，—邊如後述 圖4般用凹版印刷機〗Q連續地印刷導電性糊2 ?匕圖_P刷導電性糊2後，利用.昆％押壓。於 :進刷她糊2、或進行連續押屋之特別必要 又，其1用預先切斷為矩形等特㈣狀的形態者。 H交佳為〜20mm，更佳為10μηι~1ιηηι， 攻佳為25μηι〜200μηι。 7/29 201222569 又，接受層6係設置在笑 學領域的用途的情況，較^ ㈣表面者。於利用於光 域有透明性者6 層6係至少於可視光領 樹脂、熱硬化性樹脂或電子線硬匕列如將熱可塑性 用之溶劑進行調配而調製接受~=月r及視需要所使 布於基材1的表面，對1進θ 將此溶液塗 形成。賴可塑性樹脂、熱電== 樹脂，可關如··環氧伽、m H電子線硬化性 .，^ θ乙烯树脂、聚酯樹脂、丙烯 月曰、此專樹脂的衍生物、缓甲基纖维素、乙酿: 素、纖維素乙酸酯丁酸酯等 -土 '、-· ,,,.▲夂〇日寺的纖維素何生物等。做為溶劑， ’ f醇、乙醇、異丙醇(IPA)、甲 丁酮(酿)、甲笨'乙酸乙，、環己鲷Λ甲丄：t =乙㈣酸S旨 '二丙二醇單㈣、H2_甲氧基_2_乙基乙 氧土）-2-丙醇、丙二醇單甲鍵乙酸_及水等，可單獨使用， 亦可任意比例混合而使用。 於以熱可塑性樹脂形成接受層6的情況，較佳為熱可 ，性樹脂的玻璃轉移溫度(Tg)為_1〇〜25〇。〇。藉由熱可塑性 树脂的玻璃轉移溫度(丁幻為-⑺它以上，可使接受層形成用 /容液各易做成為糊狀。又，藉由熱可塑性樹脂的玻璃轉移 溫度(Tg)為250。(：以下，熱押壓時不會因熱而損傷基材j而 可使接受層6軟化，可於印刷後的導電性糊2的寬度不會 變寬之下’使此導電性糊2嵌入接受層6中。 於以熱硬化性樹脂形成接受層6的情況，較佳為接受 層形成用溶液於25°C之黏度為0.5〜l〇〇〇〇〇Ocps，較佳為熱 硬化性樹脂的硬化溫度為60〜350〇C。藉由熱硬化性樹脂的 硬化溫度為6(TC以上，於通常使用時(尤其是夏季之使用時) 8/29 201222569 應於未經控制下開始進行。χ，藉由熱硬化 t月 溫度為靴以下，除了耐熱性極低的基材！ 之外’可使用的基材1之選擇範圍可較擴大。 較佳為以電子線硬化性樹削彡成接受層6。此情況下， 由2要對塗布於基材】表關接受層形成用溶液照射紫 外線寻電子線即可形成接受層6，無須特別進行加熱，可抑 制基材1因熱而損傷。 較佳為接受層6的厚度為〇.〗〜300μΓη下，更佳為 Ο.ΜΟμιη。藉由接受層6的厚度為〇1μιη以上，可容易地 使導體urn人接受層6巾。接受層6的厚度，宜考慮 將導體寬度微細化為30陴以下之導體圖案3的實用尺寸而 设定。惟，於接受層6的厚度超過3〇〇μιη的情況，就嵌入 至導體圖案3的功能而言厚度為過厚，以對基材丨的性能 的影響考量為不佳。 又，導體圖案3，如圖1所示般，可藉由將導電性糊2 印刷在接受層6表面，再使所印刷之導電性糊2的至少一 部分嵌入至接受層6中而形成。 做為導電性糊2 ’係使用含有導電粒子及黏合劑樹脂 者。 做為導電粒子，係使用平均粒徑(D50)為2μηι以下者。 就容易地形成導電性高的導體圖案3考量，較佳為使用平 均粒徑(D50)為lnm以上2μπι(2000ηΐΏ)以下者，更佳為使用 平均粒徑(D50)為l〇nm以上800nm以下者。此處，導電粒 子的平均粒控：(〇 5 0) ’係指於藉由雷射繞射法等所測定得到 的導電粒子的粒徑分布中，累積質量達50%的粒徑。導電 粒子的平均粒徑(D50)若未滿lnm，於糊化時黏度會過高， 9/29 201222569 於印刷使用會有困難。反之，導電粒子的平均粒徑(D50)若 超過2μιη ’雖可降低導體圖案3的比電阻、提高導電性， 但要形成導體寬度為30μιη以下的微細導體圖案3會有困 難。尤其，若使用平均粒徑(；D5〇)為800nm以下的導電粒 子’可抑制熱押壓後之導體圖案3中所產生的缺陷。 具體而言，做為導電粒子，只要是平均粒徑(D5〇)為2μιη 以下者皆可，無特別限定，可使用由例如：金屬粒子、金 屬氧化物、石墨、碳黑等。其中、做為金屬粒子、可用例 如、銀粒子、銅粒子、鎳粒子、鋁粒子、鉄粒子、鎂粒子、 此等之合金粒子、於此等金屬粒子上被覆丨層以上的他種 金屬而成者之中所選出者。又，做為金屬氧化物，可用自 銻-錫氧化物、銦-錫氧化物等所選出者。又，此等導電粒子 的合里，相對於導電性糊2全量而言，較佳為1〇 〇〜99 9質 量％ ’更佳為50.0〜99.9質量％，最佳為6〇.〇〜98 〇質量％。 又，做為黏合劑樹脂，較佳為使用玻璃轉移溫度(Tg) 為10 250 c者’更佳為〇〜2〇〇〇c者。藉由黏合劑樹脂的玻 ，轉移溫度(Tg)為_1(rc以上，可容㈣做成為糊狀。又， 藉由黏合綱觸麵轉移溫度⑽為25(rc以下，導電性 糊2可容易=動’且亦可容易溶解於後述的溶劑中。 .具二而5 ’做為黏合劑樹脂，沒有特別I5艮制，可用例 、聚§旨樹脂、㈣酸樹脂等於此等樹脂中有 3 * COO-骨架等之衍生物、射基纖維素，乙酿 基纖維素’纖維素乙_旨丁 _旨等之纖維素衍生物等。但， 並非限定於此等。 導電性糊2，可用μ、+. > # & 調製 + 、 上述之導電粒子及黏合劑樹脂調配而 '、可進而°周配添力σ劑、溶劑等。 10/29 201222569 做為添加劑，可用例如：BYK Japan(股）公司製 FBYK333(矽酮油）」等之消泡劑_平滑劑，其含量，相對於 導毛性_ 2全量而言，較佳為〇〜1〇質量％。 又，做為溶劑，例如，甲醇，乙醇，異丙醇(IPA)，甲 基乙酮(ΜΕΚ)，曱基異丁酮(ΜΙΒΚ)，曱苯，乙酸乙酯，環 己酮—甲笨，一乙二醇單乙_乙酸酯，二丙二醇單曱鱗， (二甲氧基-2·乙基乙氧基)·2-丙醇，丙二醇單曱_乙酸醋及 水等，可分別單獨使用，或以任意比例混合而成的混合溶 州使用。又，於使用此等溶劑的情況，較佳為調配溶劑使 導電性糊2的黏度成為50〜5000dPa.s。 ·卜 又’導電性薄膜，可如後述製造。 首疋，如圖1(a)及圖2(a)，在基材1表面形成接受厚 得到附接受層的基材。 又曰6 接著，如圖1⑼及圖2(b) ’在接受層6表面以導電性糊 2印刷成特疋开>狀。此處，印刷於基材]的接受層6之形狀， 別限定’可舉出例如:如圖3的格子狀;網目狀C網 ^狀)荨。但，為了形成導體寬度L為3()帅以下的微 =3’較佳為，事先以導電性糊2印刷使其寬度成為 〇μΐΏ。如此須將導電性糊2的寬度做成為30μηι以下 理由在於，因後述的押壓會使寬度擴大若干程度之故。、、 =黏合劑樹脂的玻璃轉移溫度(Tg)高的溫度下進行押斤於 情況，可於所印刷的導電性糊2的寬度不會擴大之I的 押壓’故可事先以最大3〇μηι❺寬度印刷導電性糊2。進行 較佳為印刷的導電性糊2的厚度為〇.01〜3〇μηι。又，^又， 法並無特觀定，可使關如：網版印刷 ^刷方 版(offset)印刷等。兹就其中之凹版印刷做說明 ’ 1 ㈡4係表 11/29 201222569 示凹版印刷機ίο的一例，其係設置有圓筒狀的版胴12及 壓胴13而形成，印刷用凹版14之凹部15係設置 側並捲附在版胴12上。又，一邊使版胴12旋轉ί邊對^ 外表面的凹部15供給與填充導電性糊2，並且將多餘的導 電性糊2以刮刀16的壓力刮落。形成有導體圖案3的基材 1，藉由和版胴12逆向旋轉的壓胴13而通過版胴12二壓 胴13之間，以壓胴13壓力使版胴12的凹部15之導^ 糊2轉移到基材1的接受層0表面而被印刷。 电 ⑽’將即刷於基材i的霞增6表面上的導電怡铜 f 5〇〜峨、0·!〜_分鐘的條件τ加魅使其乾燥，择 使至少-料料祕糊2如圖丨(_由触顧入L =層6中形成導體圖案3。於圖】(e)中，η為導體圖荦” 層外部突出部分的高度 受層6表姑㈣以的部分以 _ 3 全_ 度(_度），W , 於在導體圖案3的厚度方向中 匕、J，中1 係嵌入接受層6中(即，，故可得 層6的高密接性。難為導體圖案^^ 3和接受 以上(上限為職)係嵌入接受；6 :導體t之1⑽ ο.】τ謂印，可得到物_ θ 6 此情況下係成為 性。若使導體圖案3的η σ $層6的更高密接 部和接受層“面的高:差=大/， 層6表面的高低駿3㈣部和接受 薄膜的平滑_，難為上簡。H更加㈣導電性 丨巧產Η為2μηι以下。雖 12/29 201222569 於圖示中省略，導體圖案3全部嵌入接受層6中亦可。此 :成:=—)，接受層6表面和導體圖㈣ 具體而言’如圖物導體圖案3，可藉由將導電性糊 2印刷於接受層6表面，使其乾燥後對其進行熱押壓而形成。 亦即，如® 2(a)，在基材】表面設置接受層6，如圖 士 MM接Ϊ層6的表面將導電性糊2印刷成特定形狀後， 如圖2⑷，使用加熱加壓裝置4對其 如此所得之導電性Si 接总馬Α猎此，可詖向導體圖案3對 .二:、岔妾性。此處，加熱加縣置4，可用且備有接 =相隔開且相向面係形成為平坦的—對油仏4 導❾==的導體圖案3，藉由押璧而被壓縮，存在 此的接觸=劑：=z，使導電粒子彼 電阻★合隊把 足度即使為30jum以下，比 5。〜靴 分的條件下進行g⑽_kPa〜19.6MPa.)、o.L 狀態下以水冷二『二於加熱力，終了後，於保持塵力之 40〇c i 5 "，a"x 30 110〇c^^ 進行押壓時，亦可T?的墨縮狀態上是有效的。又，於 1和加熱加卿置^^^可在印刷有導電性糊2的基材 裝置4的各熱盤4a，4b之ph3 #仏 仃。做為此離型片5，可 =間^者離型片5進 酮樹月旨等之_心 賴、在聚㈣膜上塗布石夕 等。細劑而設置剝_層所成者、公知的偏^ 13/29 201222569 二案3，亦可#由在印刷導電性糊 亦即，如圖5(a)在基材〗表面設置接受層 電性糊2印刷成特定職。然後，使 ^ 分嶋下力♦使其乾 ^ ^ 1 ；"Γ'Κ^(ίΚ)^ 12〇^50〇C^^^ 圖^ ^ 層6及導電性糊2在溫熱的狀態下，如 :圖二押壓裝置31以輥3〇進行押壓，藉此，可製造 二將其ί導電性薄膜。如此般’於以輥3 〇進行押壓之前， =將基材卜接受層6及導電性糊2加熱著，使接受層6 术2化’於以輥30押壓時，所印刷的導電性糊2不會擴大， 可得到導體寬度狹窄的導體圖案3,而可達成低電曰阻化。 又，可連續進行用以乾燥的加熱和其後的加熱，亦可先進 仃用以乾燥的加熱，使其放置冷卻後再度進行加熱。此處， 做為輥押壓裝置31，可用例如：由可旋轉的2滾筒輥3〇平 行相向配置而形成者。各親3〇，其尺寸無特別限定，較佳 為以橡膠輥或鋼製輥等形成的加熱輥。又，可藉由以輥3〇 押壓，使印刷有導電性糊2的長行的基材1連續移送通過2 滾筒輥30之間。較佳為，於剛要以輥30押壓之前，使印 刷有導電性糊2的基材1在60〜400°C(更佳為7〇〜2〇〇。〇， 〇.5秒〜1小時（更佳為5秒〜30分鐘)的條件下進行加熱，使 其溫熱。。又，較佳為設定成：以輥30進行加熱的溫度為 60〜400°C(更佳為70〜200。〇、加壓的壓力為0.1〜4〇〇kgf/cm2 (〇‘〇1 〜39.2MPa)(更佳為 0.5〜200kgf/cm2(0.05〜l9.6MPa))、基 材】通過2滾筒親30之間的速度為0.5〜30ηχ/分鐘。以輕30 進行加熱的溫度若低於60T：，會有導電性糊2無法充分硬 14/29 201222569 化的顧慮，反之，若上述溫度超過4〇〇°C，會有基材i Λ 熱才貝告的顧慮。又，若以親30進行加壓的壓力為才、 〇.5kgf/Cm2(〇.〇5MPa)，會有導體圖案3的表面電阻無法 充分低的顧慮，反之，若上述壓力超過4〇〇hf/c ^ (39.2MPa)，導體圖案3的導體寬度會擴大太多，於必 保絕緣的情況’相鄰的導體圖案3彼此會有相接觸的顧廣^1 又’若基材1通過2滾筒親30之間的速度未滿〇 5m/分=， 會有無法快速形成導體圖案3的顧慮，反之，若上;屯、亲 超過30m/分鐘，加壓的時間會過短，會有導體圖案 面电阻热法達到充分低的顧慮。又，2滾筒輥3〇的間隙二 宜適當地調整使能以上述壓力加壓。 ，、’ 又’如上述所形成的導體圖案3，藉由以幸昆3〇進 堡而被壓縮’金屬粉等之導電性微粒子間的接觸面積〜 故與以往的導體圖案相比，表面電阻會變低而導^ 而且’此情況下的押壓，並非藉由圖2所示 :人式的加熱加壓裝置4關歇地進行，而是藉 :壓=不間斷地進行，故可快速形成導體圖案：： 於以=Γ、Γ恤綠、電魏賴料的製妓度。又， 才;的情況，亦可在印刷有導糊2的基 可用。⑽示省略)而進行。此離型片， 設置剝離劑層者、公知的偏光板等。㈣剝離劑而 又圖1 (c)之導體圖案3，於印刷導電性 3® t 3 5 £ 壓此押壓裝置31進行多次的以輥之押 此處，夕段式親押壓裝置32，可用例如：由可旋轉的 15/29 201222569 第1幸昆30a ’第2幸昆30h «货· 2 μ 使第1輥30Mat ^第 所成的3滾筒輥30,201222569 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an electrode in which an usable device or the like is formed, or to an electromagnetic: touch panel, various display electrical thin rafts. Convention of the present invention, a body containing a conductive particle and a binder resin for a touch panel or the like is formed by a paste on a substrate such as an ester (PET) film.酞 乙 — — 左右 左右 左右 左右 左右 左右 左右 左右 左右 左右 左右 左右 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Pattern, although the width of the conductor is fine, the conductivity formed by the paste indicates that the conductivity of the conductive paste is low. Figure 7 shows the average particle size (D50) of the green-green solid of the specific resistance of the body pattern. A graph showing the relationship between the macro and the 。. The conductor pattern in this graph is only for the conductive paste j printed on the substrate to be subjected to recording as described later, sintering or pressing the pressure ^, > When the particle is miniaturized, the specific resistance of the conductor pattern is increased. Since s is forbearing, the surface of the conductive particles is covered with the conductive particles, because the binder resin is hindered by the impurity + 4 4δ _ grease. The particle has a mutual relationship, the conductor width _ the touch = guide A method of printing a conductor pattern having a non-electrolytic plating treatment to form a metal crucible with a low axial resistance is printed (refer to, for example, Patent No. 4/29 201222569, document 1). After the conductive paste, a method of sintering at a local temperature of 25 〇〇c or more to remove the binder resin between the conductive particles is also used. Further, a method of developing on a transparent substrate is also being developed. A method for producing an electromagnetic wave for forming a grid pattern by a step of forming a grid pattern and a pressing step (see, for example, Patent Document 2). '[Previous Technical Literature] . [Patent Literature] • [ [Patent Document 1] Japanese Laid-Open Patent Publication No. H11-170420 (Patent Document 2) Japanese Laid-Open Patent Publication No. 2009-164 No. In this case, there is a concern that the substrate may be deteriorated due to the plating solution used. • A, the substrate is also heated to a high temperature by sintering, so that a substrate having a very high heat resistance cannot be used. also In the case where the mesh f case is directly formed on the transparent substrate as described in Patent Document 2, when the (4) is performed, the width of the conductor of the mesh pattern may be widened, and the pressing may be performed by pressing. Although the adhesion of the mesh pattern to the transparent substrate is improved to some extent, since the transparent substrate and the mesh pattern are in planar contact, it is not expected to greatly improve the adhesion. _ The present invention 7H! In addition, it is possible to provide a non-breaking wire, and it is possible to achieve both the miniaturization and the low-resistance of the conductor width, and it is possible to form a conductive film having high adhesion of the conductor pattern without the type of the substrate. 5/29 201222569 [To solve The conductive film of the present invention is characterized by comprising: a substrate; a receiving layer provided on the substrate; and a conductive particle and a binder having an average particle diameter (D5〇) of 2 μm or less a conductor pattern in which a conductive paste of a resin is printed on the receiving layer and has a conductor width of 30 μm or less; at least a part of the conductor pattern is embedded in the receiving layer in a thickness direction of the conductor pattern . In the above conductive film, it is preferable that 10% or more of the conductor thickness of the conductor pattern is embedded in the receiving layer. In the above conductive film, it is preferable that the conductor pattern is formed by hot pressing the conductive gorge which is printed on the receiving layer. In the above-mentioned conductive thinness, it is preferable that the thickness of the top of the receiving layer and the average particle of the front electrode are in the conductive film, and preferably the height difference of the surface of the receiving layer of the conductor is ΙΟμπι or less. In the above conductive film, the above-mentioned guide: (D50) is preferably 1 nm or more. Preferably, the glass of the binder resin has a conversion temperature (Tg) of _10 to 25 in the conductive film (rc is preferably such that the receiving layer is based on a glass transition temperature (Tg) of the thermoplastic resin. In the film, the resin is formed, and the thermoplastic resin is -10 to 250. (In the conductive film, it is preferable that the receiving layer is formed by the hardening property of the crucible.) ~3 thief. Hardened 'Where's material is electronic wire 6/29 201222569 [Effect of the invention] According to the present invention, by using a micro-paste, it is possible to form a fine conductor particle that does not break the wire: In the following, the adhesion can be greatly improved. In the following, an embodiment of the present invention will be described. The conductivity of the present invention is as shown in Fig. 1, and the layer is formed by receiving the layer and the conductor pattern 3. A dish of soil material 1, as a substrate 1, as long as it is insulated, the handle used in the field of optics has a transparent stalk. And the mail is in the visible area first B- 6 (PEm: ^ 'As substrate 1', for example, except polypyruic acid-酉In addition to 曰 (PET) money, it can be obtained by using a poly(p-resin) such as methyl (tetra) = acid resin, poly(dioxalate) or poly(diethyl phthalate). The taste of the ping-pong 抡糸 抡糸 丄 之 之 「 「 τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ τ 稀 稀 稀 稀 稀 稀 稀 稀 稀 稀 稀 稀_Alkyl base, a glass base formed by a surface, Kaiping 08-148829, a public 翱 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Preferably, for example, in a form of being wound into a roll shape, the substrate is wound up, and the conductive paste 2 is continuously printed by a gravure printing machine Q as described later with reference to FIG. Fig._P After brushing the conductive paste 2, use the .Kun% to press. In: brushing her paste 2, or performing a special escrow, it is necessary to cut the shape into a rectangle (four). H cross is preferably ~20mm, more preferably 10μηι~1ιηηι, and the attack is 25μηι~200μηι. 7/29 201222569 In addition, the acceptance layer 6 is set in the field of the use of laughter, more than ^ (4) surface. For the light-domain transparency, the 6-layer 6-series is at least visible in the visible light-collar resin, thermosetting resin, or electron-line hard-line array, such as the solvent for the thermoplasticity, and is prepared and received by ~= month r and as needed. On the surface of the substrate 1, the solution is formed by applying 1 θ. The plastic resin, thermoelectric == resin, can be closed, such as epoxy gamma, m H electron sclerosing, θ vinyl resin, poly Ester resin, propylene ruthenium, derivative of this special resin, slow methyl cellulose, acetylene, cellulose acetate butyrate, etc. - soil ', -·,,,. ▲夂〇日寺Cellulose and other organisms. As a solvent, 'f alcohol, ethanol, isopropanol (IPA), methyl ethyl ketone (brewed), a stupid 'acetic acid B, hexamethylene guanidine: t = ethyl (tetra) acid S for 'dipropylene glycol single (four) And H2_methoxy-2-ethylethoxylate)-2-propanol, propylene glycol monomethyl acetate acetic acid, and water, etc., may be used singly or in any ratio. In the case where the receiving layer 6 is formed of a thermoplastic resin, it is preferred that the glass transition temperature (Tg) of the heat-resistant resin is from 1 to 25 Å. Hey. The glass transition temperature (Tg) of the thermoplastic resin can be easily made into a paste by the glass transition temperature of the thermoplastic resin (the illusion is - (7) or more. Further, the glass transition temperature (Tg) of the thermoplastic resin is 250. (: In the following, when the heat is pressed, the substrate j is not damaged by heat, and the receiving layer 6 can be softened, and the width of the conductive paste 2 after printing can be made wider without making the conductive paste 2 In the case where the receiving layer 6 is formed of a thermosetting resin, it is preferred that the solution for forming a receiving layer has a viscosity at 25 ° C of 0.5 to 1 〇〇〇〇〇 Ocps, preferably thermosetting. The curing temperature of the resin is 60 to 350 〇 C. The curing temperature of the thermosetting resin is 6 (TC or more, and it is used under normal use (especially during summer use) 8/29 201222569 should be started without control. χ, by heat hardening the temperature of t month is below the boot, in addition to the substrate with extremely low heat resistance! The selection range of the substrate 1 that can be used can be expanded. It is preferably an electron beam hardening tree. The receiving layer 6 is formed. In this case, the coating solution for forming the receiving layer is applied to the substrate. The ultraviolet ray-seeking electron beam can form the receiving layer 6, and it is possible to suppress damage of the substrate 1 due to heat without special heating. Preferably, the thickness of the receiving layer 6 is 〇. 〜300 μΓη, more preferably Ο.ΜΟμιη. When the thickness of the receiving layer 6 is 〇1 μm or more, the conductor urn can easily receive the layer 6. The thickness of the receiving layer 6 should be considered in consideration of the practical size of the conductor pattern 3 in which the conductor width is made finer to 30 Å or less. However, in the case where the thickness of the receiving layer 6 exceeds 3 μm, the thickness is too thick in terms of the function of being embedded in the conductor pattern 3, so that the influence on the properties of the substrate 考 is not considered. As shown in FIG. 1, the pattern 3 can be formed by printing the conductive paste 2 on the surface of the receiving layer 6 and embedding at least a part of the printed conductive paste 2 in the receiving layer 6. For the paste 2', a conductive resin and a binder resin are used. The conductive particles have an average particle diameter (D50) of 2 μm or less. It is easy to form a conductive pattern 3 having high conductivity, and it is preferable to use an average. Particle size (D50) is 1 nm or more 2 In the case of μπι (2000ηΐΏ) or less, it is more preferable to use an average particle diameter (D50) of from 10 nm to 800 nm. Here, the average particle size of the conductive particles: (〇5 0) ' means that the laser is wound by a laser In the particle size distribution of the conductive particles measured by the shooting method, etc., the cumulative mass is 50%. If the average particle diameter (D50) of the conductive particles is less than 1 nm, the viscosity will be too high during gelatinization, 9/29 201222569 It is difficult to use it for printing. On the other hand, when the average particle diameter (D50) of the conductive particles exceeds 2 μm, the specific resistance of the conductor pattern 3 can be lowered and the conductivity can be improved. However, the fine conductor pattern 3 having a conductor width of 30 μm or less is formed. There will be difficulties. In particular, when the conductive particles having an average particle diameter (; D5 〇) of 800 nm or less are used, the defects generated in the conductor pattern 3 after the hot pressing can be suppressed. Specifically, the conductive particles are not particularly limited as long as the average particle diameter (D5〇) is 2 μm or less, and for example, metal particles, metal oxides, graphite, carbon black, or the like can be used. Among them, as metal particles, for example, silver particles, copper particles, nickel particles, aluminum particles, cerium particles, magnesium particles, alloy particles thereof, or the like, the metal particles are coated with other metals of the cerium layer or more. Among the selected ones. Further, as the metal oxide, it can be selected from bismuth-tin oxide, indium-tin oxide, and the like. Further, the total amount of the conductive particles is preferably from 1 to 99% by mass, more preferably from 50.0 to 99.9% by mass, and most preferably from 6 to 99.9% by mass, based on the total amount of the conductive paste 2. 〇% by mass. Further, as the binder resin, it is preferred to use a glass transition temperature (Tg) of 10 250 c, more preferably 〇~2〇〇〇c. By the glass of the adhesive resin, the transfer temperature (Tg) is _1 (rc or more, and can be made into a paste.), the transfer temperature (10) by the bonding interface is 25 (rc or less, and the conductive paste 2 can be used. It is easy to move and can be easily dissolved in the solvent described below. It has two and 5' as the binder resin, and there is no special I5 tantalum. The usable example, the polystyrene resin, and the (iv) acid resin are equivalent to these resins. 3 * a derivative such as a COO-skeleton, a cellulose-based cellulose, a cellulose derivative such as an ethyl cellulose, or a cellulose derivative, etc. However, the conductive paste 2 is not limited thereto. It can be mixed with μ, +. >#& modulation +, the above-mentioned conductive particles and binder resin, and can be further mixed with σ agent, solvent, etc. 10/29 201222569 As an additive, for example: BYK The amount of the antifoaming agent _smoothing agent such as FBYK333 (anthraquinone oil) manufactured by Japan Co., Ltd. is preferably 〇1 to 1% by mass based on the total amount of the hair styling property _ 2 . Solvents, for example, methanol, ethanol, isopropanol (IPA), methyl ethyl ketone (oxime), mercapto isobutyl ketone (oxime), benzene, Ethyl acetate, cyclohexanone-methyl stupid, monoethylene glycol monoethyl acetate, dipropylene glycol monoterpene scale, (dimethoxy-2-ethyloxy) 2-propanol, propylene glycol曱_acetic acid vinegar, water, etc., may be used singly or in a mixed state in any ratio. Further, in the case of using such a solvent, it is preferred to prepare a solvent so that the viscosity of the conductive paste 2 becomes 50. ~5000dPa.s · · · · Conductive film, can be produced as follows. First, as shown in Figure 1 (a) and Figure 2 (a), on the surface of the substrate 1 to form a substrate that receives a thick receiving layer. Further, next, as shown in Fig. 1 (9) and Fig. 2 (b), the shape of the receiving layer 6 printed on the surface of the receiving layer 6 is printed by the conductive paste 2, and the shape of the receiving layer 6 is printed on the substrate. The definition 'is, for example, a lattice shape as shown in Fig. 3; a mesh shape C mesh shape) 荨. However, in order to form a conductor width L of 3 (), the micro = 3' is preferably a conductive paste. (2) printing is made to have a width of 〇μΐΏ. The reason why the width of the conductive paste 2 is 30 μm or less is that the width is increased by a certain degree due to the pressing force described later. , = = the temperature at which the glass transition temperature (Tg) of the adhesive resin is high, and the pressure of the printed conductive paste 2 does not increase. The conductive paste 2 is printed in a width of μηι❺. The thickness of the conductive paste 2 which is preferably printed is 〇.01~3〇μηι. Also, ^, the method is not specially determined, and can be closed as: screen printing ^ An offset printing or the like. For the gravure printing, a description will be given of an example of a gravure printing machine ίο, which is provided with a cylindrical plate 12 and a pressure pin 13 Formed, the concave portion 15 of the intaglio 14 for printing is placed on the side and wound on the plate 12. Further, the conductive paste 2 is supplied and filled to the concave portion 15 of the outer surface while the plate 12 is rotated, and the excess conductive paste 2 is scraped off by the pressure of the blade 16. The substrate 1 on which the conductor pattern 3 is formed is passed between the plate 12 and the press 13 by the press 13 which is rotated counter-rotating with the plate 12, and the pressure of the pressure 13 is applied to cause the concave portion 15 of the plate 12 to be pasted. 2 is transferred to the surface of the receiving layer 0 of the substrate 1 to be printed. Electric (10)' will be brushed on the surface of the substrate i Xia Zeng 6 on the surface of the conductive copper f 5 〇 ~ 峨, 0 ·! ~ _ minutes τ add charm, make at least - material secret 2 As shown in Fig. 丨 (_ is formed by touching the conductor pattern 3 into the L = layer 6. In the figure (e), η is the conductor pattern 荦" The height of the outer protruding portion of the layer is affected by the layer 6 (4) 3 full _ degrees (_ degrees), W, in the thickness direction of the conductor pattern 3, J, J, 1 is embedded in the receiving layer 6 (that is, the high adhesion of the layer 6 is obtained. It is difficult to be a conductor pattern ^ ^ 3 and accept the above (upper limit) is embedded acceptance; 6: conductor t 1 (10) ο.] τ preprint, available _ θ 6 in this case is the nature. If the conductor pattern 3 η σ $ layer The higher adhesion part of the 6 and the receiving layer "height of the surface: difference = large /, the height of the surface of the layer 6 (3) and the smoothness of the receiving film _, it is difficult to simplify. H more (four) conductivity is less than 2μηι Although 12/29 201222569 is omitted from the illustration, the conductor pattern 3 may be entirely embedded in the receiving layer 6. This: into: =-), the surface of the receiving layer 6 and the conductor pattern (4) Specifically, the figure conductor pattern 3 Can borrow The conductive paste 2 is printed on the surface of the receiving layer 6, dried, and then hot pressed. Thus, as in the case of ® 2 (a), a receiving layer 6 is provided on the surface of the substrate. After the surface of the interface layer 6 is printed with the conductive paste 2 into a specific shape, as shown in Fig. 2 (4), the conductive Si obtained by the heating and pressing device 4 is used to sculpt the main shovel. 2: 岔妾. Here, the heating plus county 4, available and provided with the connection = phase and the opposite surface is formed flat - the conductor pattern 3 of the oil 仏 4 guide ❾ = = by 璧And the compression, the presence of this contact = agent: = z, so that the conductive particles of the resistance ★ team to the full degree of 30jum or less, than 5 ~ ~ boots under the conditions of g (10) _ kPa ~ 19.6MPa.), oL state It is effective to use the water-cooled two "two heating power, after the end, in the 40 ci 5 ", a " x 30 110 〇 c ^ ^ to maintain the dust pressure, but also T? . Further, ph3 #仏 各 of each of the hot plates 4a, 4b of the substrate device 4 on which the conductive paste 2 is printed can be applied to the heating and heating. For this release sheet 5, it can be replaced by a ketone tree, etc., and coated on the poly (four) film. For the fine agent, the peeling layer is formed, and the known partiality is 13/29 201222569. The third case can also be set by receiving a conductive paste, that is, as shown in Fig. 5(a) on the surface of the substrate. The paste 2 is printed into a specific job. Then, make ^ 嶋 嶋 ♦ ♦ ♦ ^ ^ 1 ; " Γ Κ ^ ( Κ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Next, as shown in Fig. 2, the pressing device 31 is pressed by the roller 3, whereby the conductive film can be manufactured. In this way, before the pressing is performed by the roll 3 =, the substrate receiving layer 6 and the conductive paste 2 are heated, and the receiving layer 6 is doubled. When printed by the roller 30, the printed conductivity is printed. The paste 2 is not enlarged, and the conductor pattern 3 having a narrow conductor width can be obtained, and low electric resistance can be achieved. Further, the heating for drying and the subsequent heating may be continuously performed, or the heating for drying may be advanced, and the mixture may be cooled and then heated again. Here, as the roller pressing device 31, for example, it may be formed by the parallel arrangement of the rotatable 2 roller rollers 3〇. The size of each member is not particularly limited, and is preferably a heating roll formed of a rubber roll or a steel roll. Further, the long-length substrate 1 on which the conductive paste 2 is printed can be continuously transferred between the two roll rollers 30 by pressing with a roll 3 。. Preferably, the substrate 1 on which the conductive paste 2 is printed is placed at 60 to 400 ° C (more preferably 7 〇 to 2 〇〇. 〇, 〇. 5 seconds 〜1) just before the pressing of the roller 30. Heating is carried out under the conditions of an hour (more preferably 5 seconds to 30 minutes). Further, it is preferably set such that the temperature at which the roller 30 is heated is 60 to 400 ° C (more preferably 70 to 70). 200. The pressure of 〇 and pressurization is 0.1~4〇〇kgf/cm2 (〇'〇1~39.2MPa) (more preferably 0.5~200kgf/cm2 (0.05~l9.6MPa)), the substrate] passes 2 rolls The speed between the pro 30 is 0.5 to 30 χ χ / min. If the temperature for heating at 30 is less than 60 T:, the conductive paste 2 may not be sufficiently hard 14/29 201222569, and if the temperature exceeds 4 〇〇°C, there will be concerns about the substrate i Λ heat. In addition, if the pressure of pressing with the pro 30 is 、.5kgf/Cm2 (〇.〇5MPa), there will be conductor pattern 3 The surface resistance cannot be sufficiently low. On the contrary, if the above pressure exceeds 4 〇〇hf/c ^ (39.2 MPa), the conductor width of the conductor pattern 3 is enlarged too much, and the adjacent conductor pattern 3 is inevitable. There will be mutual Gu Guang ^1 of the touch and 'If the speed of the substrate 1 passing through the 2 roller pro 30 is less than 5 m / min =, there may be a concern that the conductor pattern 3 cannot be formed quickly. On the contrary, if it is above; /min, the pressurization time will be too short, and there will be a concern that the conductor pattern surface resistance heat method is sufficiently low. Moreover, the gap 2 of the 2 roller rolls 3〇 should be appropriately adjusted to be pressurized with the above pressure. Further, the conductor pattern 3 formed as described above is compressed by the contact area between the conductive fine particles of the metal powder or the like by the fortune of the fortune, so that the surface resistance is lower than that of the conventional conductor pattern. And the pressing force in this case is not shown in FIG. 2: the human-type heating and pressing device 4 is performed in a closed manner, but by pressing: pressing without interruption, the conductor pattern can be quickly formed. :: In the case of = Γ, Γ 绿 green, electric wei lai material. In addition, the situation can also be printed on the basis of the guide paste 2 (10) omitted. , a release agent layer, a known polarizing plate, etc. (4) a release agent and the conductor pattern 3 of Figure 1 (c), for printing Electrical 3® t 3 5 £ Pressing this pressure-pressing device 31 to perform multiple times of roll-on, here-stage pro-pressure device 32, available for example: by rotatable 15/29 201222569 1st Xingkun 30a 'Second lucky Kun 30h «goods · 2 μ 3 rolls 30 made of the first roll 30Mat ^,
第二行地相向W 3㈣質並無特別限定，較佳為各輥 第之=首先將印刷有導電性糊2的長形的基 棍麟乂輥，二約=="则通過第1 圈，以該狀態通過第2 2 上約半 繞於.第職之間，接著捲 示，基材^之捲繞於二T :進仃。又如圖6所 ^ ’與印刷有導電性糊2的面 為相反側的面係和第1幸昆3如的外周面接觸而進行，錢 材1之捲繞於第2輕3〇b，印刷有導電性糊2的面則係^ 2親3%的外周面接觸而進行，基材1之捲繞於第3報30c， 則和捲繞於弟1輕3Ga係同樣地，係與印刷有導電性糊2 的，為相反側的面接觸而進行。藉此，可於使 。溫度若未保持為即使對印刷= $電性糊2進行押壓，只會破壞而無法達成低電阻化。較 佳係設定為：來自各輥30之加熱溫度為6〇〜4〇 7〇〜20叱），加壓的壓力為⑽ (〇.5〜20〇kgW⑼^观叫），基材i通過2 之間的速度為0.5〜30m/分鐘。來自μ夕Λ # ί述溫度若超過·。c，會有基材】受到熱損傷的顧慮。又’， 來自各親30之加襲麼力若低於〇 ikgf/cm2 (〇.〇1娜 有無法使導義案3的表©電阻達到充分低的顧慮，反之θ 上述屋力若超過碰giW(39.2MPa)，導體圖案。3的導體 »6/29 201222569 寬度會過寬，於必須確保絕緣的情況，會有相鄰的導體圖 案3彼此接觸的顧慮。又，基材】通過2滾筒輥3〇之間的 速度若低於G.5m/分鐘，會有無法快速軸導體_ 3的顧 慮，反之，上述速度若超過3〇m/分鐘，加壓的時間會過短， ^有無法使導翻案3的表面電阻充分低_慮。又，2滚 筒輥30的間隙，宜調整為能以上述壓力進行加壓的程度。 又，於多段式輕押壓裝置32中，幸昆3〇的滾筒數並非限定 為3滾筒亦可為4滾筒以上。 —’於上述情況下’以輥3〇之押壓，係於第】輥撤 和=2較30b之間進行）次，於第2幸昆鳥和第3輕撕 之間進仃1次，合計進行2次。如此所形成的導體圖幸3， 由吨30之押壓而多次壓縮，金屬粉等的導電性微 ^子間之接觸面積更增加之故，和藉由錢3〇之押壓缓】 =縮所形成的導體圖案3相比，其表面電阻更低、導電 二。而且’此情況下之押壓，也非藉由如圖2的批次 熱加壓裝置4間歇地進行，而是藉由連續式之多段 圖宰匕3甲昼因裝而置斷地進行’因此，可快速地形成導體 :二：Γ線板、電磁波遮蔽材等的製造 #D| ^ 也可在印刷有導電性糊2的基材1 隔著離型片（圖示省略）。此離型片可用聚醋薄 者、公知的偏光:板等0 : ~、' ~ ^ * 又’於使帛上述任法所製造的導電 仏為導體圖案3的導體厚戶:之1〇0/ '、 又 至接总届“子度之10/0以上（上限為100%)嵌入 可提安如此，藉由導體圖案3之嵌入接受層6中， 3對接受層6的密接性。又，藉由使導體 17/29 201222569 圖案3嵌入接受層6中 導體圖案3的頂部和接受> 膜^表面會接近平滑， 於對導電性薄膜表面藉：向低差會變小，因而 的情況，可容易地“ 濺鍍：塗敷等而進行成膜 薄膜表面用感壓型黏合劑或:熔於導電性 薄膜、或形成機能相情^‘、、、^接者解來黏合機能性 薄膜和機能性薄臈或機二之生氣泡進入導電性 所得到的導電性薄膜，尤i適二又’如上述 之有機半導體所成的裝置十。使用在用另璣激光元件等 於上述之本發明中，藉％ 體圖案3的至少_部分嵌入至接^圖案以，一由料 接性。又，導安 又S 中可大幅提咼岔 L案3亦可藉由對印刷 性糊2進行熱押壓㈣成，此時若 f，)高的溫度下進行熱押壓，可在= 狀態下使導電性糊2嵌人接〜6孝人化的 的導H以㈣。v 接&層中’可抑制導體圖案3 -A 1見。’即使導電性糊2中含有微細導電粒 卞’由於此導電性糊2•受押壓之故，導電性糊2中的導電 冰子間之齡·m會被歸⑽導電粒子彼此相接觸， 可導體圖案3的比電阻降低’導電性增高。再者，由於導 體圖案3僅藉由對導電性糊2進行押壓而嵌入接受層^中 而可形成為高密接性，故不會對基材i施予過度負荷，而 可不拘使㈣基材1之麵i而，即使是㈣品性低而 難以用鑛敷法等來形成導體_ 3的基材卜酬熱性低而 難以用燒結法等來形成導體圖案3的基材丨，亦可使用於本 發明之導電性薄膜的製造。 18/29 201222569 的面以圖不’但亦可對基材1之形成有導體圖案3 破覆。此被覆片可用由乙稀-醋酸乙稀共聚物 析m曰日PET (PET'G) ’附有透明黏合劑層的PET等 所形成者。 〔實施例] ^ 下’針對本發明以實施例具體地說明。 (貫施例1) 後述所㈣的銀粒子做為導餘子。首先，將 7f)n 5ml加入至銀離子濃度1〇g/l的硝酸銀水溶液 =㈣銀銨錯塩水溶液。雜，調整此水溶液的液 二為C，於-邊攪拌下在3G秒間加人遇甲酸水溶液 使銀粒子析出而得到含銀粒子漿液。接著，於此聚 ^中加入對銀粒子全量而言為i質量％的油酸，授摔⑺分 鐘。然^，以布夫納漏斗過濾此漿液，經水洗後’於60t、 =空㈣下絲24小時’藉此得到銀粒子。如此所得銀 粒子的平均粒徑(D5〇)為〇 7μηι。 EAS™AN製「纖維素乙酸醋丁酸醋 -551-0.2」（玻璃轉移溫度(T_rc)做為黏合劑樹脂。 然後’藉由調配：上述導電粒子、上 。劑樹脂5質量％'三菱化學(股)公司製「碳黑㈣〇」3質量 2質;:1::::)1° f !%、二乙二醇單乙鱗乙酸_ 2貝1/“周衣成導電性糊2。此導電性糊2的黏度為侧& *s ° 減方面生使用如後述所得之附接受層之pet薄膜做 為基材1。百先，料魏量平均分子量為7_的纖 乙酸醋丁酸酯(EASTMAN製「cab_381_2 、美 19/29 201222569 異丁S同(MIBK)中’調製得8質量。/。的接受層形成用溶液。 接著，將此溶液塗布於PET薄膜之東洋紡績(股)公司製 「Cosmoshine A4300」（厚度ΐ〇〇μιη)的表面。此塗布係用 微凹版塗布機(micro gravure coater)，凹版版號#70，於旋轉 數115rpm、PET薄膜移送速度i.5m/分鐘的條件下進行。 然後，使塗布有接受層形成用溶液的PET薄膜通過溫度12〇 C、長12m的溫風乾燥爐内而加熱乾燥，藉此得到附接受 層的PET薄膜。此基材丄的接受層6的厚度，以Keyence(股） 公司製數位微測計(Digital Microscope)做截面測量為5.1 /z m ° 又，於形成導體圖案3之際，首先，吊如圖4所示之 凹版印刷機10 ’在基材1的接受層6表面以導電性糊2印 刷成圖3所不的格子狀或網目狀。此時係用線(L)/間距(p) 為23 // m/250 # m的印刷用凹版14進行印刷。 然後’使印刷於基材1的接受層6表面的導電性糊2 在120 C、30分的條件下加熱使其乾燥。 接著’將印刷有導電性糊2的基材1使用圖2所示般 的加熱加壓裝置 4 ’ ，於 2 54kgf/cm2i249kPa)、5〇 分 條件下進行押壓，藉此形成導體圖案3。 (實施例2) 做為導電粒子，係用平均粒徑(〇5〇)為12阿的d〇wa Ebonics (股)公司製的銀粒子「勝2]」，不改變甲基異 丁酮(MIBK)及—乙二醇單乙趟乙酸關質量比下降低此等 的調配量以將導電性糊2的黏度調整為650dPa.s，除此之 外係與實關1同樣地形成導體圖案3。 (實施例3) 20/29 201222569 導笔粒子係用平均粒抱（D5〇)為1.2μηι之DOWA Electronics(股)公司製銀粒子「AG-2-1」’將導電性糊2的黏 度調整調整為400dPa»s，除此之外，係與實施例1同樣地 形成導體圖案3。 (實施例4) 用平均粒徑(D50)為 1.2μηι 之 DOWA Electronics(股)公 司製銀粒子1 AG-2-1」做為導電粒子，用EASTMAN製「纖 維素乙酸S旨丁酸酯CAB-551 -0.01」（玻璃轉移溫度(Tg)85) 做為黏合劑樹脂除此之外，係與實施例〗同樣地形成導體 圖案3。又，導電性糊2的黏度為4〇〇ciPa.s。 (比較例1) 用平均粒t(D50)為 2·1μηι 之 DOWA Electronics(股)公 司製銀粒子「AG-5-16L」做為導電粒子，並將導電性糊2 的黏度调整為400dPa.s ’除此之外，係與實施例1同樣地 形成導體圖案3。 (比較例2) 做為基材1係用PET薄膜之東洋紡績（股）公司製 「Cosmoshine A4300」（厚度1〇〇//m)，除了在此基材！上 未設置接受層6之外’係與實施例丨同樣地形成導體圖案3。 於下述表1顯示出導電性糊2中所含有的導電粒子的 平均粒树D5〇)、導電性糊2的黏度、押壓前導電性糊2的 厚度(線高hg)、寬度(線寬Wq)、嵌入深度Dq及導體厚度 T〇Hi〇+D())及比電阻’以及押壓後導體圖案3的導體厚度 (線同H)、導體寬度（線寬w)、嵌入深度D，導體厚度 T(=H+D)、比電阻及每長度20#m的平均缺陷數。 又上述押壓如後的線高H〇及Η，意指自接受層6表 21 / 29 201222569 面往外部突出的部分之高度，上述押壓前後的嵌入深度D〇 及D，意指自接受層6表面往内部嵌入部分的深度。因而， 押壓前的線高H〇與嵌入深度Do的和係成為印刷後導電性 糊2全體的厚度τ〇’押壓後的線高H與嵌入深度D的和係 成為形成後導體圖案3全體的厚度τ。此處，依據下述表J， 有關實施例1〜4及比較例1，與印刷後導電性糊2全體的厚 度τ〇相比較，形成後的導體圖案3全體的厚度τ的一方為 較厚(即，τ0<τ)。理由在於，藉由押壓，相較於自接受層6 表面往外部如的部分的寬度，自接受層6表面往内部喪 入部分的寬度的-方為較細，故以該相差的部/分而較深入。 又，上述押壓前後的線寬w，意指最寬部分的寬 h比電阻，係如後述算出。亦即，有關實施例卜4 車又例1，係在基材1的接受層6表面形成5mmx3〇nim 她體圖案3 ’測定此端部的電阻俊並求出此導體圖案3的 出比電阻。又’有關比較例2，係在基材i表面直 ^ί 5_X3Gmm的導體圖案3 ’測定此端部的電阻値， …出此導體圖案3的體積，算出比電阻。 #in/：2W表面電阻，對於經印刷以形成線(L)/間距(P)為23 測圖案3,係利一之電阻 又導體圖案3的密接极r ^ 的棋盤目密接性士心 仏稭由依據ns D0202-1988 格的乾λ ，不於下述表1係以（未剝離的殘留棋盤 裕的數目)/㈣體圖案⑽ 目）的形十本- ”成處所刻畫的棋盤格的全部的數 / j〜式表不。例如，戈 右為80/100 ’係1〇〇個棋盤格中有 22/29 201222569 80個棋盤格未剝離而殘留。愈接近100/100為密接性良好。 23/29 201222569 〔表1〕 導電粒子的 平均粒徑 (Ο50)(μτη) 導電性糊的黏度 (dPa.s) 接受層的厚度 (μτη) 實施例1 0.7 400 5.1 實施例2 1.2 650 5.1 實施例3 1.2 400 5.1 實施例4 1.2 400 5.1 比較例1 2.1 400 5.1 比較例2 0.7 400 - 線南 (μΐΏ) 線寬 (μιη) 嵌入深度 (μηι) 導體厚度 (μηι) 押壓前 Η〇 押壓後 Η 押壓前 W〇 押壓後 W 押壓前 D〇 押壓後 D 押壓前 To (=H〇+D〇) 押壓後 T (=H+D) 實施例1 4.751 0.822 22.4 22.1 0.01 4.62 4.76 5.44 實施例2 4.503 0.922 23.3 23.3 0.00 4.10 4.50 5.C2 實施例3 4.348 1.017 23.4 21.2 0.02 4.03 4.37 5.05 實施例4 4.068 1.017 23.1 21.2 0.00 4.05 4.07 5.07 比較例1 4.341 0.428 20.1 18 0.01 4.09 4.35 4.52 比較例2 2.411 0.735 22.5 38.6 0 0 2.41 0.74 比電阻(Ω· cm) 表面電阻(Ω/口） 平均缺陷數 棋盤目 押壓前 押壓後 押壓後 導通評估 (個/20μηι 長） 密着試驗 實施例1 3.46x10'2 9.22x10'6 0.46 良好 0.0 100/100 :良好 實施例2 7.06x10'5 8.93ΧΚΓ6 0.44 良好 4.1 100/100 :良好 實施例3 7.33X10.5 9.07x10'6 0.47 良好 3.3 100/100 :良好 實施例4 7.18X10'5 8.89x10'6 0.48 良好 3.1 100/100 :良好 比較例1 7·18χ10·5 9.91X10-4 無法測定 不良 (局部地斷線） 4.4 (局部地斷線） 100/100 :良好 比較例2 3.33XI0'2 9.89x10'6 0.45 良好 3.5 12/100 :不良 24/29 201222569 由上述表1可確認得知：實施例1的導體圖案係如圖 8(a)所示’既無斷線也無缺陷，故對接受層的密接性高，可 兼顧導體寬度的微細化與低電阻化。 相對於此，經確認得知：實施例2〜4的導體圖案，雖 有缺陷發生，但其可兼顧導體寬度的微細化與低電阻化。 又確認得知：如圖8(b)所示之實施例3的導體圖案，雖有 缺陷發生"但線確實連接著，使用上無問題。又雖省略電 子顯微鏡照相，經確認得知：關於實施例2、4的導體圖案， 雖然有缺陷(孔穴)發生，但線確實連接著，使用上無問題。 又確認得知：於實施例丨〜4中，係使導體圖案嵌入接 受層而形成，故棋盤目密接性試驗結果皆為1〇〇/1〇〇,極為 良好。 ’ 又確認得知：比較例】的導體圖案，雖企圖於導體寬 度的微細化，但如圖8(c)所示，局部地線連接較弱，也有多 數的斷線。 又確認得知：比較例2的導體圖案，雖企圖並達成低 電阻化，但由於係直接形成在基材上，故熱押壓後，線寬 擴大至約I.7倍’無法達成導體寬度賴細化。又也確認得 知其對基材的密接性低。 【圖式簡單說明】 圖1係表不製造導電性薄膜之步驟的一例，⑻至(c)為 將局部擴大顯示的概略截面圖。 圖2係表不製造導電性薄膜之步驟的另一例，⑻至⑷ 為概略截面圖。 圖3係科成料體_的基材(導電性賴)的局部 25/29 201222569 擴大顯示的概略俯視圖。 圖4係表示凹版印刷機的一例的概略截面圖。 圖5係表示製造導電性薄膜之步驟的另一例，（a)至(d) 為概略截面圖。 圖6係表示製造導電性薄膜之步驟的另一例的概略截 面圖。 圖7係表示導電性糊中所含有的導電粒子的平均粒徑 (D50)和導體圖案的比電阻之關係的曲線圖。 圖8(a)為實施例1的導體圖案的電子顯微鏡照像，（b) 為實施例3的導體圖案的電子顯微鏡照像，（c)為比較例1 的導體圖案的電子顯微鏡照像。 【主要元件符號說明】 1 基材 2 導電性糊 3 導體圖案 4 加熱加壓裝置 5 離型片 6 接受層 10 凹版印刷機 12 版胴 13 壓胴 14 凹版 15 凹部 16 刮刀 30 輥 30a 第1輥 26/29 201222569 30b 第2輥 30c 第3輥 31 輥押壓裝置 D (導體圖案的)嵌入深度 H (導體圖案的)線高 T 導體厚度 W 導體寬度 27/29The second row of the W 3 (four) phase is not particularly limited, and it is preferable that each roller is the first = the first base roller with the conductive paste 2 printed thereon, and the second ring ==" In this state, the second half is wound around the first position, and then the substrate is wound around the second T: Further, as shown in Fig. 6, the surface of the opposite side to the surface on which the conductive paste 2 is printed is brought into contact with the outer peripheral surface of the first Xun Kun 3, and the money material 1 is wound around the second light 3〇b. The surface on which the conductive paste 2 is printed is brought into contact with the outer peripheral surface of 3% of the parent, and the substrate 1 is wound around the third report 30c, and is printed and printed in the same manner as the first light 3Ga system. The conductive paste 2 is formed by surface contact on the opposite side. By this, you can make it. If the temperature is not maintained, even if the printing = $electric paste 2 is pressed, it will only break and the resistance cannot be reduced. Preferably, the heating temperature is from 6 〇 to 4 〇 7 〇 to 20 叱 from each roller 30, and the pressure is (10) (〇. 5 〜 20 〇 kg W (9) ^ 叫 )), and the substrate i passes through 2 The speed between 0.5 and 30 m / min. From μ Λ Λ # ί The temperature is over. c, there will be a substrate] the concern of thermal damage. Also, the attack force from each of the pro-30 is lower than 〇ikgf/cm2 (〇.〇1娜 has the problem that the resistance of the guideline of the guideline 3 can be sufficiently low, otherwise the above-mentioned house force exceeds the contact giW (39.2 MPa), conductor pattern. 3 conductor »6/29 201222569 The width will be too wide, in the case of ensuring insulation, there will be concerns that adjacent conductor patterns 3 are in contact with each other. Also, the substrate] passes 2 rollers If the speed between the rollers 3〇 is lower than G.5m/min, there may be a concern that the shaft conductor _3 cannot be fast. On the contrary, if the above speed exceeds 3〇m/min, the pressurization time will be too short. The surface resistance of the turn-over case 3 is sufficiently lowered. Further, the gap of the two roll 30 should be adjusted to the extent that it can be pressurized by the above pressure. Also, in the multi-stage light press device 32, Xing Kun 3〇 The number of rollers is not limited to 3 rollers or 4 rollers or more. - 'In the above case, 'the pressing force of the roller 3〇 is performed between the second roller and the =2 to 30b.) Fortunately, the Kunming bird and the third tearing were smashed once, for a total of 2 times. The conductor pattern thus formed is fortunately 3, compressed by a pressure of 30 tons, and the contact area between the conductive micro-metals of the metal powder is increased, and the pressure is reduced by the money. Compared with the conductor pattern 3 formed by the shrinkage, the surface resistance is lower and the conductivity is two. Moreover, the pressure in this case is not intermittently performed by the batch hot pressurizing device 4 as shown in Fig. 2, but is interrupted by a continuous multi-stage drawing of the scorpion 3 Therefore, the conductor can be formed quickly: 2: manufacturing of the twisted wire plate, electromagnetic wave shielding material, etc. #D| ^ The release sheet (not shown) may be interposed between the substrate 1 on which the conductive paste 2 is printed. The release sheet can be made of a thin vinegar, a well-known polarizer: a plate, etc. 0: ~, '~ ^ * and 'a conductor made of the conductive enamel made by the above method is a conductor of the conductor pattern 3: 1〇0 / ', and then to the total "10/0 or more of the sub-degrees (upper limit is 100%) embedded in the utah, as the conductor pattern 3 is embedded in the receiving layer 6, the adhesion of the three pairs of the receiving layer 6. By causing the conductor 17/29 201222569 pattern 3 to be embedded in the top of the conductor pattern 3 in the receiving layer 6 and receiving the surface of the film, the surface of the film 3 will be smooth, and the surface of the conductive film will be reduced to a low difference. It can be easily "sputtered: coating or the like to form a pressure-sensitive adhesive on the surface of the film-forming film or: melted on the conductive film, or form a function of the same,", and then the adhesive solution to bond the functional film And the functional thin film or the bubble of the machine 2 enters the conductive film obtained by the conductivity, and the device is made of the organic semiconductor as described above. In the invention in which the other laser element is used as described above, at least a portion of the % body pattern 3 is embedded in the pattern to be a material. In addition, the guideline S can greatly improve the case 3 and can also perform hot pressing on the printing paste 2 (four). At this time, if f,) is subjected to hot pressing at a high temperature, the state can be = Next, the conductive paste 2 is embedded in the hexahedral guide H to (4). The v-connected & layer can be suppressed by the conductor pattern 3 -A 1 . 'Even if the conductive paste 2 contains fine conductive particles 卞', the conductive paste 2 is pressed, and the age/m of the conductive ice in the conductive paste 2 is returned to (10) the conductive particles are in contact with each other. The specific resistance of the conductor pattern 3 is lowered, and the conductivity is increased. Further, since the conductor pattern 3 is formed by being pressed into the receiving layer only by pressing the conductive paste 2, it can be formed into high adhesion, so that the substrate i is not excessively loaded, and the (four) basis can be omitted. In the case of the surface i of the material 1, it is difficult to form the conductor _ 3 by the mineral deposit method or the like, and it is difficult to form the substrate 丨 of the conductor pattern 3 by a sintering method or the like. It is used in the production of the conductive film of the present invention. The surface of 18/29 201222569 is not shown, but the conductor pattern 3 may be broken on the substrate 1. The coated sheet may be formed of PET or the like which is coated with a transparent adhesive layer from ethylene-vinyl acetate copolymer. [Examples] The following is a detailed description of the present invention by way of examples. (Example 1) Silver particles (4) described later are used as a guide. First, 5 ml of 7f) n was added to a silver nitrate aqueous solution having a silver ion concentration of 1 〇g/l = (iv) an aqueous solution of silver ammonium hydride. The liquid of this aqueous solution was adjusted to C, and an aqueous solution of formic acid was added to the mixture for 3 G seconds under stirring to precipitate silver particles to obtain a silver-containing particle slurry. Next, oleic acid which is i mass% of the total amount of silver particles was added to the polymerization, and it was dropped for (7) minutes. Then, the slurry was filtered with a Buffner funnel, and after washing with water, the yarn was allowed to stand at 60 t, = empty (four) for 24 hours to obtain silver particles. The average particle diameter (D5〇) of the silver particles thus obtained was 〇 7 μηι. EASTMAN made "Cellulose Acetate Butyrate-551-0.2" (glass transition temperature (T_rc) as binder resin. Then 'by blending: the above conductive particles, the upper resin 5 mass%' Mitsubishi Chemical (Stock) company "carbon black (four) 〇" 3 quality 2 quality; 1: 1::::) 1 ° f !%, diethylene glycol monoethyl squaria acetic acid _ 2 shell 1 / "周衣 into conductive paste 2 The viscosity of the conductive paste 2 is the side & *s ° minus the use of a pet film with a receiving layer obtained as described later as the substrate 1. The first fiber, the fiber having an average molecular weight of 7 _ of acetic acid vinegar Butyric acid ester (a solution for forming a receiving layer of 8 mass% in "cab_381_2, US 19/29 201222569 Isobutyl S (MIBK)" manufactured by EASTMAN. Next, this solution was applied to the Toyo spinning of PET film ( Co., Ltd. The surface of the company "Cosmoshine A4300" (thickness ΐ〇〇μιη). This coating is a micro gravure coater, gravure version #70, at a rotation number of 115 rpm, a PET film transfer speed of i.5 m. Then, the PET film coated with the solution for forming a receiving layer was dried by a warm air having a temperature of 12 〇 C and a length of 12 m. The film was heated and dried in a furnace to obtain a PET film with a receiving layer. The thickness of the receiving layer 6 of the substrate was measured by a digital microscope of Keyence Co., Ltd. to be 5.1 /zm ° Further, when the conductor pattern 3 is formed, first, the gravure printing machine 10' shown in Fig. 4 is printed on the surface of the receiving layer 6 of the substrate 1 by the conductive paste 2 in a lattice shape or a mesh shape as shown in Fig. 3. In this case, the printing intaglio 14 having a line (L)/pitch (p) of 23 // m/250 #m is printed. Then, the conductive paste 2 printed on the surface of the receiving layer 6 of the substrate 1 is placed. It is heated and dried under the conditions of 120 C and 30 minutes. Next, 'the substrate 1 on which the conductive paste 2 is printed is heated and pressurized 4' as shown in Fig. 2 at 2 54 kgf/cm 2i 249 kPa), 5 〇 The pressing is performed under the conditions, whereby the conductor pattern 3 is formed. (Example 2) As the conductive particles, silver particles "Win 2" manufactured by d〇wa Ebonics Co., Ltd. having an average particle diameter (〇5〇) of 12 A were used, and methyl isobutyl ketone was not changed ( The conductor pattern 3 is formed in the same manner as the real-off 1 except that the blending amount of the conductive paste 2 is adjusted to 650 dPa·s in the mass ratio of the ethylene glycol monoacetic acid acetic acid. . (Example 3) 20/29 201222569 The particle size of the conductive paste 2 was adjusted by the silver particle "AG-2-1" made by DOWA Electronics Co., Ltd. with an average particle size (D5〇) of 1.2 μm. The conductor pattern 3 was formed in the same manner as in the first embodiment except that it was adjusted to 400 dPa»s. (Example 4) A silver particle 1 AG-2-1 made by DOWA Electronics Co., Ltd. having an average particle diameter (D50) of 1.2 μm was used as a conductive particle, and "cellulose cellulose S is a butyrate CAB manufactured by EASTMAN. -551 -0.01" (glass transition temperature (Tg) 85) A conductor pattern 3 was formed in the same manner as in the example except that it was a binder resin. Further, the viscosity of the conductive paste 2 was 4 〇〇 ciPa.s. (Comparative Example 1) Silver particles "AG-5-16L" manufactured by DOWA Electronics Co., Ltd. having an average particle size t (D50) of 2·1 μηι were used as conductive particles, and the viscosity of the conductive paste 2 was adjusted to 400 dPa. In the same manner as in the first embodiment, the conductor pattern 3 was formed. (Comparative Example 2) "Cosmoshine A4300" (thickness: 1 〇〇//m) manufactured by Toyobo Co., Ltd., which is a PET film for the base material 1 except for this substrate! The conductor pattern 3 is formed in the same manner as in the embodiment ’ except that the receiving layer 6 is not provided. The average particle size D5 of the conductive particles contained in the conductive paste 2, the viscosity of the conductive paste 2, the thickness (line height hg) of the conductive paste 2 before pressing, and the width (line) are shown in Table 1 below. Width Wq), embedding depth Dq and conductor thickness T〇Hi〇+D()) and specific resistance 'and conductor thickness of conductor pattern 3 after pressing (line is H), conductor width (line width w), embedding depth D , conductor thickness T (= H + D), specific resistance and the average number of defects per length 20 # m. The above-mentioned line heights H〇 and Η, which refer to the height of the part protruding from the surface of the receiving layer 6 on the surface of 21/29 201222569, the embedding depths D〇 and D before and after the pressing, means self-acceptance The depth of the surface of the layer 6 is embedded into the interior. Therefore, the sum of the line height H〇 and the embedding depth Do before the pressing is the thickness of the entire conductive paste 2 after printing τ〇', and the sum of the line height H and the embedding depth D after pressing is formed to form the rear conductor pattern 3. The thickness τ of the whole. Here, according to the following Table J, in the first to fourth embodiments and the comparative example 1, the thickness τ of the entire conductive pattern 2 after the formation is thicker than the thickness τ of the entire conductive paste 2 after printing. (ie, τ0<τ). The reason is that, by pressing, the width of the portion from the surface of the receiving layer 6 to the inside of the receiving layer 6 is thinner than the width of the portion from the surface of the receiving layer 6 to the outside, so that the phase difference is / Divided into more depth. Further, the line width w before and after the pressing is the width-to-resistance of the widest portion, which is calculated as will be described later. That is to say, in the embodiment 4, the vehicle 1 is formed on the surface of the receiving layer 6 of the substrate 1 by 5 mm x 3 〇 nim. The body pattern 3 'measures the resistance of the end portion and determines the specific resistance of the conductor pattern 3 . Further, in Comparative Example 2, the resistance 値 of the end portion was measured on the surface of the substrate i at a distance of 5 _X3 Gmm, and the volume of the conductor pattern 3 was measured to calculate the specific resistance. #in/: 2W surface resistance, for printing to form line (L) / spacing (P) is 23 to measure pattern 3, the resistance of the resistor and the conductor pattern 3 of the close polarity r ^ of the chessboard close contact with the heart The straw is made of dry λ according to ns D0202-1988, not the following table 1 (the number of unpeeled residual chessboards) / (four) body pattern (10)) - the shape of the checkerboard The total number / j ~ formula is not. For example, Ge right is 80/100 '1' in a checkerboard 22/29 201222569 80 checkerboards are not peeled and remain. The closer to 100/100 is good adhesion 23/29 201222569 [Table 1] Average particle diameter of conductive particles (Ο50) (μτη) Viscosity of conductive paste (dPa.s) Thickness of receiving layer (μτη) Example 1 0.7 400 5.1 Example 2 1.2 650 5.1 Example 3 1.2 400 5.1 Example 4 1.2 400 5.1 Comparative Example 1 2.1 400 5.1 Comparative Example 2 0.7 400 - Line South (μΐΏ) Line width (μιη) Embedding depth (μηι) Conductor thickness (μηι) Depressed before pressing After pressing Η before pressing, W 〇 pressing pressure W before pressing pressure D 〇 pressing pressure D before pressing pressure To (=H〇+D〇) After pressing pressure T (=H+D) 1 4.751 0.822 22.4 22.1 0.01 4.62 4.76 5.44 Example 2 4.503 0.922 23.3 23.3 0.00 4.10 4.50 5.C2 Example 3 4.348 1.017 23.4 21.2 0.02 4.03 4.37 5.05 Example 4 4.068 1.017 23.1 21.2 0.00 4.05 4.07 5.07 Comparative Example 1 4.341 0.428 20.1 18 0.01 4.09 4.35 4.52 Comparative Example 2 2.411 0.735 22.5 38.6 0 0 2.41 0.74 Specific resistance (Ω·cm) Surface resistance (Ω/port) Average number of defects Chess board pressure before pressing pressure and pressure measurement after conduction (a/20μηι Length) adhesion test Example 1 3.46x10'2 9.22x10'6 0.46 good 0.0 100/100: good example 2 7.06x10'5 8.93ΧΚΓ6 0.44 good 4.1 100/100: good example 3 7.33X10.5 9.07x10' 6 0.47 Good 3.3 100/100: Good Example 4 7.18X10'5 8.89x10'6 0.48 Good 3.1 100/100 : Good Comparative Example 1 7·18χ10·5 9.91X10-4 Unable to measure badly (partially broken) 4.4 (Locally broken line) 100/100 : Good comparative example 2 3.33XI0'2 9.89x10'6 0.45 Good 3.5 12/100 : Bad 24/29 201222569 It can be confirmed from the above Table 1 that the conductor pattern of the embodiment 1 is As shown in Figure 8(a), there is no disconnection. Since there is no defect, the adhesion to the receiving layer is high, and both the miniaturization and the low resistance of the conductor width can be considered. On the other hand, it was confirmed that the conductor patterns of Examples 2 to 4 were defective, but the thickness of the conductor was reduced and the resistance was reduced. Further, it was confirmed that the conductor pattern of the third embodiment shown in Fig. 8(b) had a defect occurrence, but the line was surely connected, and there was no problem in use. Further, although the electron microscope photographing was omitted, it was confirmed that the conductor patterns of Examples 2 and 4 were defective (cavities), but the wires were surely connected, and there was no problem in use. Further, it was confirmed that in the examples 丨 to 4, since the conductor pattern was formed by being embedded in the receiving layer, the result of the checkerboard adhesion test was 1 〇〇 / 1 〇〇, which was extremely good. Further, it has been confirmed that the conductor pattern of the comparative example is intended to be finer in the width of the conductor. However, as shown in Fig. 8(c), the local ground connection is weak, and there are many disconnections. Further, it was confirmed that the conductor pattern of Comparative Example 2 was attempted to have a low resistance, but since it was formed directly on the substrate, the line width was expanded to about 1.7 times after the hot pressing, and the conductor width could not be obtained. Refining. It was also confirmed that the adhesion to the substrate was low. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an example of a step of not producing a conductive film, and (8) to (c) are schematic cross-sectional views showing a partially enlarged display. Fig. 2 is a view showing another example of the step of not producing a conductive film, and (8) to (4) are schematic cross-sectional views. Fig. 3 is a partial plan view showing a base material (conductivity) of the material forming body _ 25/29 201222569. 4 is a schematic cross-sectional view showing an example of a gravure printing machine. Fig. 5 is a view showing another example of the step of producing a conductive film, and (a) to (d) are schematic cross-sectional views. Fig. 6 is a schematic cross-sectional view showing another example of the step of producing a conductive film. Fig. 7 is a graph showing the relationship between the average particle diameter (D50) of the conductive particles contained in the conductive paste and the specific resistance of the conductor pattern. 8(a) is an electron microscope photograph of the conductor pattern of Example 1, (b) is an electron microscope photograph of the conductor pattern of Example 3, and (c) is an electron microscope photograph of the conductor pattern of Comparative Example 1. [Description of main components] 1 Substrate 2 Conductive paste 3 Conductor pattern 4 Heating and pressurizing device 5 Release sheet 6 Receiving layer 10 Gravure printing machine 12 plate 13 Pressing plate 14 Gravure 15 Concave portion 16 Scraper 30 Roll 30a First roll 26/29 201222569 30b second roller 30c third roller 31 roller pressing device D (conductor pattern) embedding depth H (conductor pattern) line height T conductor thickness W conductor width 27/29