TW201202035A - Mould release film - Google Patents

Abstract

Provided is a mould release film that has embedding characteristics superior to previous PBT-type mould release films while preventing clinging between the circuit exposure film of a mould release layer and a cover lay (CL) film and between mould release layers, when the CL film is adhered to the circuit exposure film. The disclosed mould release film (100) is provided with a release layer (110) that includes, at least, a polybutylene terephthalate homopolymer (A) and a polybutylene terephthalate (PBT)/polytetramethylene glycol (PTMG) copolymer (B).

Description

201202035 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a release film (hereinafter also referred to as a laminated film). [Prior Art] Conventionally, there has been proposed a "release film" having a release layer composed of a polybutylene terephtha ate resin (hereinafter referred to as "PBT (polybutylene terephthalate)" Butadiene ester) release film ")" (for example, refer to International Publication No. 05/030466, etc.). When such a release film is used to produce a flexible printed circuit board (hereinafter referred to as "Fpc"), the FPC is a cover film (c〇veriay mm, hereinafter referred to as "cl film" by hot pressing. ”) It is produced by adhering a flexible film (hereinafter referred to as “circuit exposed film”) exposed to the circuit via an adhesive. Further, in such a release film, when the CL film is adhered to the circuit to expose the film, the release layer can be prevented from adhering to the circuit exposed film and the CL film, and the release layer can be prevented from sticking to each other, thereby exhibiting better burying. Intrusion (fitness (compatibility) to the portion of the circuit pattern (concave portion) not covered by the film), the circuit can be exposed to the amount of exudation of the adhesive between the film and the CL film to the portion of the circuit pattern, thereby suppressing Within the allowable range. [Prior Art Document] (Patent Document) Patent Document 1: International Publication No. 05/030466, Handbook 201202035 [Disclosure] [Problems to be Solved by the Invention] However, in such an FPC (flexible printed circuit board) In the field of circuit board manufacturing, it is highly desirable to have a release film which is more excellent in embedding. An object of the present invention is to provide a release film which can prevent the release layer from adhering to the circuit exposed film and the CL film while preventing the release layer from sticking to each other while adhering the CL thin film to the circuit to expose the film. The PBT-based release film is more excellent in embedding. [Technical means for solving the problem] 0) The release film of the present invention comprises a release layer as a surface layer of at least one side. Further, the release film may be formed only of the release layer. The release layer is a blend of polybutylene terephthalate homopolymer (A) and a copolymer of polybutylene terephthalate and polytetramethylene glycol (B). main ingredient. The release film of the present invention comprises a polybutylene terephthalate homopolymer (A) and a copolymer of polybutylene terephthalate and polytetradecylene glycol in the release layer ( B), as in the case of the prior release film, the amount of the adhesive of the CL film to the portion of the circuit pattern can be reduced, and the adhesion to the adhesive can be suppressed to further improve the mold release property. (2) In the release film of the above (1), the weight ratio (A/B) of the polybutylene terephthalate homopolymer (A) to the copolymer (B) in the release layer is a/b=25/75 201202035 or more and 80/20 or less is preferred. (3) The weight ratio (A/B) of the poly(p-phenylene terephthalate) homopolymer (A) to the copolymer (B) in the release layer of the above-mentioned (2), It is preferably a/b=25/75 or more and 50/50 or less. (4) In the release film of any one of the above (1) to (3), the copolymerization ratio of the poly(p-butylene dicarboxylate) component and the polytetramethylene glycol component in the copolymer (B) (PBT) /PTMG)' It is better to use PBT/PTMG= 80/20 or more and 90/10 or less. (5) In any of the release films of the above (1) (4), it is preferred to have a buffer layer. (6) In the release film of the above (5), the thickness of the release layer is preferably ι 5 μm or less. (7) The release film of the present invention comprises a release layer as a surface layer of at least one side. Further, the release film may be formed only of the release layer. The release layer is formed of a resin containing a polyether ester block copolymer as a main component. The polyether ester block copolymer ' is mainly composed of a polyether segment and a polyester segment. When the release layer is formed of a resin having a polyether ester block copolymer as a main component, the release film ′ can prevent the release layer from adhering to the circuit exposed film and the CL film as in the case of the prior ruthenium release film, and The release layer 201202035 is prevented from sticking to each other, and the amount of the adhesion of the adhesive between the film exposed film and the CL film to the portion of the circuit pattern can be reduced more than the previous PBT release film. (8) The release film of the present invention comprises a release layer as a surface layer of at least one side. Further, the release film may be formed only of the release layer. The release layer is formed of a resin containing a polybutylene terephthalate resin as a main component. Further, the thickness of the release layer is more than 0 μm and is not more than 5 μm. The release film as described above can prevent the release layer from adhering to the circuit-exposed film and the CL film, and prevent the release layer from sticking to each other, and can be further reduced from the prior PBT-based release film, as in the prior bismuth release film. The circuit exposes the amount of adhesion of the adhesive between the film and the CL film to its circuit pattern portion. Further, if the mold release layer is thin, the release layer is more likely to be cracked under load stress. However, the release sheet of the present invention does not cause cracking even when the load is applied. Further, the release film of the present invention has a thickness of the release layer of more than ΐμηη and 15 μΐη or less and is thinner than the release layer of the prior ρΒΤ-based release film. Therefore, the release film of the present invention can reduce the amount of the resin used in forming the release layer more than the conventional ruthenium release film. Therefore, the release film of the present invention can contribute to reduction in environmental load and manufacturing cost. (9) In the release film of the above (8), the thickness of the release layer is preferably more than Ομηη and less than ημηι. (10) 6 201202035 In the above (8) or (9) In the release film, the poly(p-butyl phthalate) resin is preferably a polybutylene terephthalate resin. (11) In the release film of the above (8) or (9), it is polymerized. It is preferred that the styrene dicarboxylic acid butyl vinegar resin is a poly(S) block copolymer. The poly(p-block) block is mainly composed of a polyether segment and a polyester segment. In the release film of the above (7) or (11), the weight ratio of the polyester segment to the aforementioned polyether segment is preferably in the range of 80:20 to 90:1 Torr. (13) In the above In the release film of (13), the constituent unit of the polyether segment is preferably an oxygen-extended butyl unit, and the constituent unit of the polyester segment is mainly an ester unit represented by the following chemical formula (1). Better for:

[Efficacy] In the CL film adhered to the circuit exposed thin

The film is more well embedded. The release film of the present invention 201202035 [Embodiment] [Preferred Embodiment of the Invention] - First Embodiment As shown in Fig. 1, the laminated film 1 of the i-th embodiment of the present invention is mainly composed of The mold layer 110 and the buffer layer 20 are formed. In the present embodiment, the thickness of the build-up film 100 is preferably 25 μm or more and 3 μm or less. Hereinafter, the layers will be described in detail. <Detailed Description of the Layer of the Laminate Film> 1. The release layer release layer 110' is composed of a polybutylene terephthalate homopolymer (yttrium) and a poly(p-butylene butyrate) component. It is formed with a resin of a copolymer of polytetramethylene glycol component (Β). The weight ratio (Α/Β) of the homopolymer (Α) to the copolymer (Β) in the release layer 110 is preferably A/B=l〇/90 or more and 90/10 or less, and is preferably Α/Β. It is preferably 20/80 or more and 80/20 or less, and more preferably Α/Β = 25/75 or more and 80/20 or less. When Α/Β = 1〇/9〇 or more and 9〇/1〇 or less, the release layer 110 is not excessively bonded to the CL adhesive, so the mold release property is not lowered, and CL can be prevented. The amount of exudation of the adhesive increases. In particular, from the viewpoint of improving the embedding property, it is preferable that A/B = 25/75 or more and 5 〇 / 5 〇 or less.

The copolymerization ratio (pbt/ptmg) of the polybutylene terephthalate component and the polytetramethylene glycol component in the copolymer (B) contained in the release layer 110 is PBT/PTMG=80/20 The above is preferably 90/10 or less. When pBT/pTMG 201202035 ' prevents the adhesion of the CL adhesive from getting worse. = 80/20 or more and 9 〇 / 1 〇 or less, and the amount of the release layer other than the CL adhesive homopolymer (4) and the copolymer (8) can be prevented from being opened into the resin. 'For example, an elastomer resin, a polyolefin resin, a polystyrene-based tree g, a g-based resin, a polyamine-based resin, a polyphenylene ether, or a polyphenylene sulfide resin (tetra)) may be mentioned. Further, these resins may be used singly or in combination of two or more. Further, examples of the elastomer resin include natural rubber, polybutadiene, polyisoprene, polyisobutadiene, neoprene, polythioether rubber, and polythio rubber (thiokol). Rubber), acrylic rubber, urethane rubber, neodymium rubber, surface alcohol rubber, styrene butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer (seb) , styrene-butadiene-styrene-based copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer ( SIR), hydrogenated styrene-isoprene block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), hydrogenated styrene-isoprene-styrene block Copolymer (SEPS), olefin rubber such as ethylene propylene rubber (EPM), ethylene propylene diene gum (EPDM), linear low-density polystyrene elastomer, or butadiene- Acrylonitrile-styrene-core shell rubber (ABS), methyl methacrylate-butadiene-styrene-core shell rubber (MBS), mercaptopropyl Methyl ester-butyl acrylate-styrene-core shell rubber (MAS), octyl acrylate-butadiene-styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene- Core-shell rubber such as core-shell rubber (AABS), butyl succinyl-styrene-core shell rubber (SBR), methyl methacrylate 201202035 - butyl vinegar tetrabutyl oxane, etc. The particulate elastic body or the rubber modified by the above. As a polythene-based tree, it is exemplified by a linear high-density polyethylene, a linear low-density polyethylene, a high-pressure low-density polyethylene, an is〇tactic polypropylene, and a row. (Syndi〇taCtic) polypropylene, block polypropylene, random polypropylene, polyene, 1,2-polybutadiene, poly(4-methylsulfonium)' cyclic polyolefin, and the like A copolymer (for example, an ethylene/methyl methacrylate copolymer or the like) or the like. Examples of the polystyrene resin include, for example, atacic (atcUc) polystyrene, the same row of polystyrene, high impact polystyrene (Hips), and acrylonitrile butadiene-styrene copolymer (ABS). , propylene guess styrene copolymer (Μ), stupid ethylene-methacrylic acid copolymer 1 ethylene_methacrylic acid methyl vinegar copolymer, styrene-methacrylic acid propylene glycol copolymer, styrene Dilute acid copolymerization, styrene-acrylic acid copolymer, styrene-maleic acid copolymer, styrene-fumaric acid copolymer, and the like. The polyester resin may, for example, be polycarbonate or polyethylene terephthalate. For example, nylon (registered trademark) 6, and resistant to polyolefin resin (registered trademark) 6, 6 and the like. The release layer forms an antiblocking agent in the resin, an antioxidant plasticizer, a mold release agent, a flame retardant, and various additives such as a nucleating agent, an antistatic agent, a flame retardant auxiliary, a pigment, and the like. : Anti-caking processing oil, and then 'as an anti-caking agent or organic particles. Inorganic particles,

For example, the inorganic particles may be, for example, IA group, πα group, IVA 201202035 group, VIA group, VIIA group, VIIIA group, IB group, hb group, ιπΒ group, group IVB element oxide, hydrogen. Oxides, sulfides, nitrides, halides, carbonates, sulfates, acetates, phosphates, squarates, organic carboxylates, citrates, titanates, borates and hydrates thereof And composites and natural mineral particles centered on these. Specific examples of such inorganic particles include IA group element compounds such as lithium fluoride and butterfly sand (sodium sulphate condensate); carbonic acid, magnesium acetate, magnesium oxide (magnesium oxide), magnesium chloride, and magnesium acetate. , magnesium fluoride, magnesium titanate, magnesium citrate, magnesium silicate hydrate (talc), calcium carbonate, calcium phosphate, calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, hydroxide IIA elemental compound such as calcium, calcium citrate, calcium fluoride, calcium titanate, barium titanate, barium carbonate, barium phosphate, barium sulfate, barium sulfite; titanium dioxide (titanium oxide), titanium oxide, titanium nitride, Compounds of group IVA such as dioxins (wrong oxygen) and zirconium oxide; compounds of group VIA such as molybdenum dioxide, molybdenum trioxide and molybdenum sulfide; compounds of group VIIA such as chlorinated and acetic acid; v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v Acid, kaolin, kaolinite, etc. Compounds; Group IVB element compounds such as oxidized stone eve (Shi Xishi, Shi Xijiao), graphite, carbon, graphite (graphite), broken glass; carnallite (9) (four) (four), potash salt climbing, mica (mica stone, phlogopite) Particles of natural minerals such as rose and red ore. The organic particles may, for example, be a fluororesin, a melamine-based resin, a present ethylene-diethylbenzene copolymer, an acrylic acid resin, and an average particle of the above-mentioned inorganic particles and organic particles of 201202035. The diameter is preferably ο- or more and 1 〇, and the amount of addition is preferably 重量1% by weight or more and 15% by weight or less. Further, these anti-caking agents may be used singly or in combination of two or more. Examples of the antioxidant include phosphorus-based antioxidants, various antioxidants, sulfur-based antioxidants, and acrylic acid 2_[(1-based 3,5-di-tri-pentyl)ethyl]_4,6 - Two or three-stage pentylbenzene g, etc. These antioxidants may be used singly or in combination of two or more. As the nucleating agent, for example, di(p-terinobutyl benzoic acid) is used as a tempering gold; | salt, methylene bis (2, 4 • 2-3 butyl (tetra)) acid lin Further, the gold 4 salt of the acid acid or the like, the slippery salt, and the halogen derivative p may be used alone or in combination of two or more. The plasticizers may, for example, be polyethylene glycol, polyamine oligomers, sulphate, phthalic acid vinegar, polyethylene oligomers, polyethylene waxes, eucalyptus oils and the like. Further, the plasticizers may be used singly or in combination of two or more. The release agent may, for example, be a polyethylene butterfly H long (tetra) acid or a key retardation metal salt. Further, the release agents may be used singly or in combination of two or more. The processing oil may, for example, be a paraffinic oil, a ring-burning or an oily aromatic oil. Further, among these, it is preferable that the carbon number associated with the stone (linear) calculated by the n-d-M method is a paraffinic oil having a percentage of the total carbon number of A 60% CP or more. 12 201202035 The viscosity of the processing oil is preferably 4 (the dynamic viscosity of rc is 600 cc or less, more preferably 15 cs or more and 5 〇〇 cs or less. Further, 100 parts by weight of the resin is formed with respect to the release layer. , processing to θ 八 ^ 疋 疋 疋 〇 〇 〇 〇 〇 〇 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且More preferably, the processing oil is used in combination with two or more types. 2. Buffer layer: In the present embodiment, the buffer layer 12' is made of ethylene and A. The methyl methacrylate copolymer as a main component of the resin (the hummus buffer layer forms a tree 曰) is formed by a pound. Further, the buffer layer forms a resin, which can be formed only by a methyl methacrylate methyl ester copolymer. In the buffer layer forming resin, in order to achieve better adhesion to the mold release layer 110, a wax having the same composition as the above (4) mold layer forming resin is added. The buffer layer is formed: fat 'In addition, in order to prevent the outflow during heating, the polyolefin tree moon 曰 can be added. 'As the polyolefin-based resin, for example, a linear high-density polyethylene, a linear low-density polyethylene, a high-pressure low-density polyethylene, a polypropylene, a polypropylene, a polypropylene , atactic polypropylene, polybutene, 1'2-polybutadiene, poly(4-methylpentene), cyclic polyalkylene, and the like, and the like, in the present embodiment, The thickness of the buffer layer 120 is preferably 3 times or more the thickness of the release layer 110, more preferably 5 times or more, and 8 ° ^. In the present embodiment, when the release layer 110 and the buffer layer 120 are adhered to each other. In the case of poor performance, a pinned layer or a primer layer (adhesive layer) may be interposed between the layers. 13 201202035 Furthermore, in the formation of the buffer layer resin, the object of the present invention is not impaired. In the above-mentioned range, the above-mentioned primer resin and the additive may be blended as needed. <Method for Producing Laminated Film> The laminated film 100 of the present embodiment can be formed by a co-extrusion method or a squeeze layer method. Co-extrusion method is to use a feed bl〇ck, mUltimanifold die The mold layer 11〇 is simultaneously pressed with the buffer layer 12〇 to produce a laminated film 1〇〇. Further, the co-extrusion method, as shown in Fig. 3, guides the melt M passing through the mold 21 to the ith roll. 23〇, the first roll 23 is cooled until it is detached from the first roll 230, and the laminated film 100 is produced. Then, the laminated film 1 is transported to the film by the second roll 24〇. The direction (refer to the arrow of Fig. 3) is on the downstream side, and finally, it is taken up by a take-up roll (not shown). In addition, at this time, the temperature of the 帛i roll 23〇 is preferably 3 generations or more and 100 C or less. The peripheral speed ratio of the second roll 24A to the i-th roll 23〇 is preferably 0.99 G or more and 〇.998 or less. Further, a touch roll may be provided in the vicinity of the first roller as needed. The extrusion lamination method is performed by setting the temperature of the extrusion cylinder to 225. [The above 25 (hereinafter, the release layer 11 is extruded under TC, and the release layer ιι is brought into contact with the buffer layer 120 to laminate the release layer 11 () with the buffer layer (10) to produce a laminated film. In addition, as shown in FIG. 3, the melted material μ which forms the resin by the release layer of the mold 210 is guided to the first roll 230' until it is separated from the first roll 23G. The release film F is formed by cooling the first roll 230. Then, the release film F, 14 201202035 is transported by the second roll 240 to the downstream side in the film feeding direction (see the arrow in Fig. 3). Then, a melt (not shown) of the resin blend forming the buffer layer 12 is brought into contact with the release layer film F conveyed to the downstream side in the film feeding direction, and F-formed with the release layer film to produce a laminate. In addition, the laminated crucible 1GG' obtained in this way is wound up by a winding (not shown) provided on the downstream side in the film feeding direction. Further, at this time, the second winding 23〇 The temperature is 3 〇 or more and 100. (The following is preferable, and the peripheral speed ratio of the second roll 24 〇 to the first roll 23 以 is 0.990 or more and 0998. In the following, it is preferable to provide a roller in the vicinity of the first roller as needed. Further, when it is difficult to form the release layer 11 较 to be thin by the above method, a forming method such as a solution flooding molding method can be used. Forming a release layer by forming a resin solution from the release layer. <Example of using a laminated film> In order to adhere the film to the exposed film of the circuit when the CL film is adhered to the film, the film is bonded to the uneven portion of the circuit diagram (4) The laminated film 1'' of the embodiment of the present invention is placed in a manner of coating the CL_film, and the circuit is exposed to the film and the CL film by a pressurizing device. Specifically, the laminated film is 〇〇, as in the fourth As shown in the figure, in a manner such that the release layer 11 is opposed to each other, the film exposed film and the CL film are temporarily fixed by an adhesive, and then Teflon (registered trademark) sheet 330 is sequentially applied. The rubber cushion 32 and the stainless steel plate 3 10 are clamped and pressurized by the heating plate 3 (refer to the white arrow in Fig. 4). Further, the heating by the heating plate 3 The method is as shown in Figure 5. In other words, heating 3〇〇, after starting the pressurization, the temperature is raised from the normal temperature in 15 minutes to maintain the temperature at 35 minutes 15 201202035. Then the 'heating plate 300 takes 50 minutes to cool from 170 ° C to the normal temperature. The pressurization performed by the heating plate 300 is "released at the point of 〇 minute" at the point of 100 minutes. Further, the pressure at this time is appropriately adjusted within a range of 5 MPa or more and 15 MPa or less. (Variation) (A) In the first embodiment, the second embodiment or the third embodiment to be described later, 'the laminated film 100' in which the release layer 11 is provided only on one side of the buffer layer 120 is described. As shown in Fig. 2, the laminated film 1a having the release layers 110a and 110b on both sides of the buffer layer 120 is also included in the embodiment of the present invention. In the following, the release layer of the symbol 丨i 0a is referred to as a "first release layer". The release layer of the symbol 11 〇b is referred to as a "second release layer". The first release layer 110a has the same structure as the above-mentioned release layer 11'. On the other hand, the second release layer 11 〇b may have the same structure as the first release layer 110a, and may have a structure different from that of the first release layer 110a. When the second release layer 11 〇b has the same structure as the first release layer ii 〇 a, the thickness of the second release layer 11 〇 b is preferably more than 〇μηη and is Ι5 μηι or less, and exceeds Ομηι and It is preferably 12 μm or less, more preferably more than 〇μηη and less than 1 Ομηη, more preferably more than Ομ^ and less than 8 μηη, more preferably more than Ομπι and less than 6 μπι, more preferably than 〇μιη and less than 5 μιη, More preferably, it is more than μμηη and is 4 μm or less, more preferably more than Ομηι and more than 3 μΓη, and more preferably more than 〇μηη and not more than 2 μηη, more preferably more than 〇μηη and less than 1 μηη. When the second release layer η〇b has a structure different from the first release layer η〇a 201202035, the second release layer 11Qb is, for example, a polypropylene resin 'polymethylpentene tree A pentylene-α hydrocarbon copolymer or a resin having a polystyrene-based resin having a aligned structure as a main component. Further, polymethyl pentyl sulphate or methyl pentane _ olefin copolymer has been sold by Mitsui Chemicals Co., Ltd. under the trade name 注册 (registered trademark). In addition, the polystyrene resin '6 having the alignment structure is sold by Idemitsu Kosan Co., Ltd. under the trade name XAREC (registered trademark). At this time, the adhesion between the second release layer 11b and the buffer layer 120 is lowered. At this time, the fixed layer (adhesive layer) and the undercoat layer (adhesive layer) can be placed in the second release. Between the mold layer 丨丨叽 and the buffer layer 120. Further, when the second release layer 110b is formed of a resin containing a polypropylene resin as a main component, since the adhesion between the buffer layer 12A and the second release layer 11b is good, it is not necessary to fix the layer or An undercoat layer (adhesive layer) is interposed between the layers. Further, in this case, the thickness of the second release layer 丨1 is preferably 5 μm or more, and more preferably 1 〇μηι or more. (Β) In an example of the laminated film of the first embodiment or the second embodiment or the third embodiment to be described later, the Teflon is sequentially sandwiched between the laminated film 1〇〇 and the heating plate 3〇〇. (registered trademark) sheet 33〇, rubber cushion 32〇 and stainless steel plate 310, but Teflon (registered trademark) sheet 33〇, rubber cushion 320 and stainless steel plate 31〇 may be omitted. [Examples] Hereinafter, the present invention will be described in more detail by way of examples and reference examples. (Example 1) 17 201202035 1. Production of laminated film (1) Raw material of the first release layer As a raw material of the first release layer, a polybutylene terephthalate homopolymer (A) and copolymerization were used. The polymerization ratio (A/B) of the substance (B) is a resin composition of a/b = 8 〇 / 2 。. Poly(p-phenylene terephthalate) homopolymer (A): NOVADURAN 5020 made from Mitsubishi Engineering_piasUcs — ροή—, polybutyric acid, butyl diacetate and polytetramethylene glycol Copolymer of component (B).—5505S made by Ling Engineering Plastic Co., Ltd. (copolymerization ratio: PBT component / ρτΜ (} component = 9〇/ι〇) (2) Raw material buffer layer of buffer layer is used as raw material 7,|&gt;矣w# inch 疋 用 乙烯 _ _ _ _ 甲基 甲基 ( ( ( 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 甲基 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 ACRYFT (registered trademark) WDl 〇 6) 0) Raw material of the second release layer _ The raw material of the second release layer is polypropylene (NOBLEN FS2011 DG2 manufactured by Sumitomo Chemical Co., Ltd.). (4) The adhesive layer furnace forms a tree raft which is used to bond the first release layer and the buffer layer, and is modified using polyethylene (MODIC (registered trademark) F515A manufactured by Mitsubishi Chemical Corporation). In the production of the imaginary (5) laminated film, a laminated film having the first release layer 201202035 and the second release layer inside and outside the buffer was produced by a co-extrusion method (see FIG. 2). Furthermore, 'specifically' use a shunt block, a manifold mold, a polybutylene terephthalate/polytetramethylene glycol block copolymer, a modified polyethylene, a vinyl-methyl methacrylate The ester copolymer and the polypropylene are simultaneously extruded to form a laminated film. In this case, the apparatus shown in Fig. 3 is used, but the temperature of the i-th stick 230 is 60 ° C. The second roller 240 is relative to the first one. The peripheral speed ratio of the roller 230 is 1. The thickness of the first release layer of the laminated film is 12 pm, the thickness of the adhesive layer is ΙΟμιη', the thickness of the buffer layer is 88 μm, and the thickness of the second release layer is ΙΟμιη 〇 2. The CL film adhesion test is continually a circuit in which a CL film is temporarily fixed with an adhesive to expose a film 'in such a manner that the first release layer and the circuit expose the film are opposed to each other' by the above-mentioned laminated film, and are pressed by the heating plate, and The heating mode shown in Fig. 5 is heated and pressurized. As a result, the amount of adhesion of the adhesive between the film and the CL film to the circuit pattern was less than 90 μm (refer to Table 1). Further, the laminated film can be easily peeled off from the circuit and the peeling failure of the laminated film after heating and pressing (the film remains on the circuit (flaking loss)) is less than 1.0% (refer to Table 1). 3 · Peel test according to CL adhesive The first release layer was directly bonded to the CL adhesive layer formed on the polyimide film, and subjected to pressure treatment at 170 ° C and 4 MPa for 10 minutes. . Then, by peeling off the bonded films, it was confirmed whether or not the first release layer and the CL adhesive were easily peeled off. As a result, it was easily peeled off at 201202035, and no peeling loss of the release film occurred (refer to Table 10 (Example 2). In addition to the raw material of the i-th release layer, polybutylene terephthalate was used for homopolymerization. A laminate film was produced in the same manner as in Example 1 except that the polymerization ratio (A/B) of the product (A) and the copolymer (B) was A/B = 7 Å / 30, and the laminate was formed. The film was evaluated in the same manner as in Example 1. The circuit exposed the adhesive between the film and the CL film to the circuit pattern was not in the amount of 9 〇μηι (see the table... In addition, the laminated film after heating and pressurization can be easily The film was peeled off from the circuit, and the occurrence rate of the mold release defect was less than 1·0/ (refer to Table i). ^About the peel test from the CL adhesive, the film peeled off easily and no mold release occurred. Peeling loss of the film (refer to Table 1). (Example 3) The polymerization ratio of the polybutylene terephthalate homopolymer (A) and the copolymer (B) was used as the raw material of the first release layer ( A/B) was carried out in the same manner as in Example 1 except that the resin composition of a/b=5〇/5〇 was produced to produce a laminated film 'and The laminated film was evaluated in the same manner as in Example 1. The amount of bleeding of the adhesive between the exposed film and the CL film to the circuit pattern was less than 80 μm (see Table 1). Further, the laminated film can be easily peeled off from the circuit. 'The occurrence rate of mold release defects after heating and pressing is less than 1.0% (refer to Table 1). The peeling test from CL adhesive is 'easy to peel off' and no peeling of the release film occurs. Loss (refer to Table 1). (Example 4) 201202035 In addition to the raw material of the first release layer, the polymerization ratio of the polybutylene terephthalate homopolymer (A) and the copolymer (b) was used (A) /B) except for the resin composition of a/B = 25/75, the rest was carried out in the same manner as in Example 1, and a laminated film was produced, and the laminated film was evaluated in the same manner as in Example 1. The circuit was discharged. The amount of adhesion of the adhesive between the CL films to the circuit pattern is less than 80 μm, which is superior to the previous pbt release film (see Table 1). In addition, the 'layered film can be easily peeled off from the circuit and heated and pressurized. The occurrence rate of the mold release film is less than 1% It is as good as the previous ruthenium release film (see Table). The separation test from the C]L adhesive can be easily peeled off, and the peeling loss of the release film does not occur (refer to Table 1). (Reference Example 1) In addition to the material used as the first release layer, only a copolymer of a polybutylene terephthalate component and a polytetramethylene glycol component (B) was used (Mitsubishi Engineering Plastics Co., Ltd.)

A laminated film was produced in the same manner as in Example i except that NOVADURAN 5505S manufactured by GUM Co., Ltd., copolymerization ratio: PBT component / PTMG component = 90/10), and the laminated film was evaluated. Further, the reference examples are merely used to demonstrate the effects of the embodiments, and the examples of the prior art are not shown as the comparative examples.

The amount of adhesion of the adhesive between the exposed film and the thin film of the circuit to the circuit pattern is less than 80 μm (the occurrence rate of the release film of the laminated film after heating and pressing is less than 1.0% (see Table 〇. It is not easy to peel off from the CL adhesive, and peeling loss occurs (refer to Table ]). [Table 1] 21 201202035 Reference Example 1 C3 g Less than 1.0% Not up to 80; ζ ι ι Example 4 LO 〇〇LO Not up to 1. 0%! Not up to 80 ren m Example 3 has not reached 1. 0% has not reached 8〇em Example 2 has not reached 1. 0% 1 has not reached 9〇em Example 1 has not reached 1. 0% has not reached 90 PBT Copolymerization PBT Nen 9 33 Recording.· Κ- 1 CL Adhesive Exudation (μιη) UV Tear D Policy » · r 1,, Component Weight Ratio Evaluation Results in the Release Layer 22 201202035 Furthermore, in Table 1 "Equivalent" means that the polybutylene terephthalate homopolymer "copolymerization" means a copolymer of a polybutylene terephthalate component and a polytetramethylene glycol component. - Second Embodiment The laminated film i 第 according to the second embodiment of the present invention will be described. The laminated film 100 of the second embodiment and the first embodiment described above The main difference between the laminated film and the laminated film 100 of the second embodiment is that the common structure of the laminated film 100 of the second embodiment is appropriately omitted. In the present embodiment, the thickness of the laminated film 100 is preferably 25 μm or more and 300 μΓη or less. Hereinafter, the layers are separately described in detail. The release layer 110 is mainly composed of a polyether ester block copolymer. The composition of the tree sap (hereinafter referred to as "release layer forming resin") is formed. The content of the polyether ester block copolymer in the release layer forming resin is 9% by weight or more, and is 95% by weight or more. Further, the release layer may be formed only of a polyether ester block copolymer. Hereinafter, the constituent components of the release layer-forming resin will be described in detail. (1) Polyether ester block copolymer polymerization The ether Sg block copolymer is mainly composed of a polyether segment and a polyester segment. Further, the weight ratio of the polyester segment to the polyether segment is from 8〇: 2〇 to 90. 1 〇 In the range of the polyether segment, the main component of the polyether segment The (〇xybutylene) unit is preferred, and the constituent unit of the polyester segment is preferably an ester unit mainly represented by the following chemical formula (1). Further, such a polyether ester block copolymer 'has been owned by Mitsubishi Engineering Plastics Co., Ltd. Limited public 23 201202035 Division is sold in the market under the name of NOVADURAN (registered trademark) 5505S, 55 10S.

-T·〇CH2CH2CH2CH2 --(1) (2) Resin other than the polydecyl ester block copolymer, other than the polyether ester block copolymer constituting the release layer forming resin, for example, an elastomer resin, A polyolefin resin, a polystyrene resin, a polyester resin, a polyamide resin, a polyphenylene ether, a polyphenylene sulfide resin (PPS), or the like. Further, a resin such as Xiao can be used alone or in combination of two or more. In addition, examples of the elastomer resin, the polyolefin resin, the polystyrene resin, and the polyamide resin include the same resins as those of the above-described third embodiment. The polyester resin may, for example, be polycarbonate, polyethylene terephthalate or polybutylene terephthalate. (3) In the other release layer-forming resin, various additions such as an anti-caking agent, an antioxidant, a nucleating agent, an antistatic agent, a processing oil, and a plasticizer can be added in the same manner as in the above-described first embodiment. , release agent, flame retardant, flame retardant, pigment, etc. 2. Buffer Layer The buffer layer 120' is formed in the same manner as the above-described embodiment. &lt;Production and Use of Laminated Film&gt; The laminated film 1 of the present embodiment is manufactured and used in the same manner as in the above embodiment E; 24 201202035. [Examples] Hereinafter, the present invention will be described in more detail by way of examples and comparative examples. (Example 1) &quot; 1. Production of laminated film (1) Raw material of the first release layer As a raw material of the first release layer, polybutylene succinate/polytetramethylene was used. Alcohol block copolymer (polybutylene terephthalate constituent unit / polytetradecyl monol constituent unit, 9 parts by weight U0 parts by weight) (NOVADURAN (registered trademark) manufactured by Mitsubishi Engineering Plastics Co., Ltd.) 5505S) ° (2) The raw material of the buffer layer is used as a raw material for the buffer layer. Ethylene-methyl methacrylate copolymer (methyl methacrylate derivative unit content: 5% by weight ACRYFT manufactured by Sumitomo Chemical Co., Ltd.) Trademark) wm〇6). (3) Raw material of the second release layer As the raw material of the second release layer, polypropylene (NOBLEN FS2011DG2 manufactured by Sumitomo Chemical Co., Ltd.) was used. (4) The adhesive layer is used as a tree-shaped enamel for forming an adhesive layer for bonding the first release layer and the buffer layer, and is modified polyethylene (M〇DlC (registered trademark) F515A manufactured by Mitsubishi Chemical Corporation) . (5) Production of laminated film 25 201202035 A laminated film having a ninth release layer and a second release layer inside and outside the buffer layer was produced by a co-extrusion method (see Fig. 2). Furthermore, specifically, a polybutylene terephthalate/polytetramethylene glycol block copolymer, a modified polyethylene, and an ethylene-methyl methacrylate copolymer are used using a split block and a manifold mold. The material and the polypropylene are simultaneously extruded to form a laminated film. Furthermore, the device shown in Fig. 3 is used at this time, but the temperature of the second parent 230 is 6 (rc 'the second roller 24 〇 has a peripheral speed ratio of 1 to the i-th rough coffee. The thickness of the release layer is 28 μη1, the thickness of the adhesive layer is ΙΟμιη, the thickness of the buffer layer is 72 μm, and the thickness of the second release layer is ΙΟμπι. 2. The CL film adhesion test is actually temporarily fixed by an adhesive. The circuit of the film exposes the film so that the 脱1 release layer and the circuit are exposed to face each other, and the laminated film is wrapped from both sides and pressurized by the heating plate to be heated as shown in FIG. The mode was heated and pressurized. As a result, the amount of the adhesive between the film and the CL film exposed to the circuit pattern was less than 80 μm. The PBT release film (refer to Comparative Example 1) was superior (refer to Table 2). Further, the rate of occurrence of mold release failure of the laminated film after heating and pressurization was less than 1.0%, which was as good as that of the PBT release film of the prior (see Table 2). (Example 2) Except as the first release layer The raw material is a polybutylene terephthalate/polytetramethylene glycol block. Polymer (polybutylene terephthalate constitutes monoterpene/polytetramethylene glycol constituent unit, 8 parts by weight by weight K 3 26 201202035 NOVADURAN (registered trademark) 55 10S manufactured by Ling Engineering Plastic Co., Ltd. The other parts were carried out in the same manner as in Example 1, and a laminate was produced, and the laminated film was evaluated. The amount of the adhesive between the film and the CL film to the circuit pattern was less than 80 μm, which was removed from the previous PBT. The mold film (see Comparative Example 1) was more excellent (see Table 2). The occurrence rate of mold release failure of the laminated film after heating and pressurization was less than 1.0%, which was as good as the previous PBT release film (see Table 2). (Comparative Example 1) In addition to the raw material of the first release layer, polybutylene terephthalate (novaduran manufactured by Mitsubishi Engineering Plastics Co., Ltd. (manufactured by a registrar), 5020) was used. The laminate film was evaluated in the same manner as in Example 1 except for the above.

Adhesive between the film to the circuit pattern ~ and Shishi 1 electric power command J tea after heating and pressing the layer of 臈 27 201202035 Comparative Example 1 PBT 00 C'i modified PE Ο EMMA CN Οι 〇120 15 0 Μπι is not far above 1.0% Example 2 〇〇00 〇Η $ Η oo Modified PE ο 1 EMMA 〇Η Oh 〇120 Less than 80μιη Less than 1.0% Example 1 Ο f—Η Ο Ο ON ϋ Η Η CQ Pu 00 &lt;N modified PE ο EMMA CL* 〇120 less than 80μηι under 1.0% resin layer thickness (μιη) resin layer thickness (μιη) resin layer thickness (μιη) I resin layer thickness (μιη) thickness of the laminated film as a whole (μιη) Exudation amount of mold release failure rate First release layer adhesion layer buffer layer second release layer evaluation result 28 201202035 Furthermore, in Table 2, "PBT/PTMG(90/10)j represents poly pairs Butane phthalate / polytetramethylene glycol block copolymer (polybutylene terephthalate segment / polytetramethylene glycol segment, 90 parts by weight / 10 parts by weight), " PBT/PTMG(80/20)" means poly(p-butylene diacetate/polytetramethylene glycol) block copolymer (polybutylene terephthalate segment / poly four) Methyl glycol segment, 80 parts by weight / 20 parts by weight), "PBT" means polybutylene terephthalate, modified PE means modified polyethylene, and "EMMA" means ethylene-methyl methacrylate Copolymer (methyl methacrylate derived unit content: 5% by weight), and "PP" means polypropylene. Third Embodiment First, a laminated film 1 according to a third embodiment of the present invention will be described. The laminated film 100 of the third embodiment differs mainly from the laminated film 100' of the first embodiment and the second embodiment described above in the necessary configuration of the release layer 11A. In addition, the common structure of the laminated film 丨00 of the third embodiment and the laminated film 100 of the above-described first embodiment will be appropriately omitted. In the present embodiment, the thickness of the buildup film 100 is preferably 25 μm or more and 300 μm or less. The following layers are detailed below. &lt;Detailed description of the constituent layer of the laminated film&gt; 1. The release layer release layer 110 is a resin containing a polybutylene terephthalate resin as a main component (hereinafter referred to as "release layer forming resin" ") formed. Further, in the present embodiment, the thickness of the release layer 110 exceeds 0 μm and is 15 μm or less. Further, the thickness of the release layer is more than 0 μm and is 12 μη 1 or less is 29 201202035. Preferably, it is more than Ομηι and is ΙΟμηη or less, more preferably 〇μΓη and 8 μηη or less, and more preferably Ομηη and 6 μιη or less. It is more preferable to exceed 〇μιη and not more than 5 μm, more preferably more than 〇μηη and less than 4 μηη, more preferably more than Ομηη and less than 3 μπι, more preferably more than 0 μηι and less than 2 μηη, more than Ομπι and less than 1 μπι. Better. Further, in paragraph [0052] of the handbook of International Publication No. 05/030466, "the preferred lower limit of the thickness of the above-mentioned release layer is 5 μπι", but only the release layer having a thickness of 2 5 μπ1 is disclosed in the embodiment. . Hereinafter, the constituent components of the release layer forming resin will be described in detail. (1) Polybutylene terephthalate resin The polybutylene terephthalate resin is, for example, a polybutylene terephthalate resin or a butylene terephthalate. A copolymer (see the following chemical formula (1)) as a main component or the like. "Copolymer having a butylene terephthalate unit as a main component", for example, a polyether ester block copolymer 4 'the polydecyl ester block copolymer' is mainly composed of polybutylene terephthalate The ester bond segment and the polyoxybutylene butyl segment are composed. Further, the weight ratio of the polybutylene terephthalate segment to the polyoxybutylene segment is preferably in the range of 8 Å: 20 to 90: 1 Torr. Further, such a polyether ester block copolymer has been commercially sold by Mitsubishi Engineering Plastics Co., Ltd. under the trade name NOVADURAN (registered trademark) 5505S, 5510S.

In the present embodiment, the content of the polybutylene terephthalate S-resin in the release layer-forming resin is 90% by weight or more, and preferably 95% by weight to 30 201202035. Further, the release layer n〇 may be formed only of a polybutylene terephthalate-based resin. (2) A resin other than the polybutylene terephthalate-based resin, which is a polybutylene terephthalate-based resin which forms a resin for forming a release layer, may be exemplified by #: an elastomer resin A polyolefin resin, a polymethine resin, an ester resin, a polyamine resin, a polyphenylene ether, a polyphenylene sulfide (PPS), or the like. Further, these resins may be used singly or in combination of two or more. Further, as the elastomer resin, the poly-smoke resin, the polystyrene resin, and the polyamide resin, for example, the same as the above-described embodiment of the resin. The poly-bulk-based resin may, for example, be polycarbonate or polyethylene terephthalate. (3) Other release layer forms various additives such as antistatic agents, processing oils, and plastic pigments. 'Adjustable configuration is the same as in the first embodiment described above. The anti-caking agent, antioxidant, nucleating agent, chemical agent, mold release agent, flame retardant, flame retardant auxiliary, and buffer layer are formed in the same manner. . In the same manner as in the above embodiment, the buffer layer 120' and the above-described i-th fabrication layer and the laminated layer 1 of the present embodiment are manufactured and used. [Examples] 31 201202035 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples. (Example 1) 1. Production of laminated film (1) Raw material of first release layer The raw material of the first release layer was a polybutylene terephthalate/polytetramethylene glycol block copolymer. (Polybutylene terephthalate constituent unit/polytetramethylene glycol constituent unit, 80 parts by weight/20 parts by weight) (NOVADURAN (registered trademark) 5510S manufactured by Mitsubishi Engineering Plastics Co., Ltd.). (2) The raw material buffer layer of the buffer layer is made of ethylene-methyl methacrylate copolymer (methyl methacrylate derivative unit content: 5% by weight) (ACRYFT (registered trademark) manufactured by Sumitomo Chemical Co., Ltd.) WD106). (3) Raw material of the second release layer The raw material of the second release layer was polypropylene (NOBLEN FS2011DG2, manufactured by Sumitomo Chemical Co., Ltd.). (4) Adhesive layer As a handle for forming an adhesive layer for adhering the first release layer to the buffer layer, modified polyethylene (M0DIC (registered trademark) F515A manufactured by Mitsubishi Chemical Corporation) was used. (5) Production of laminated film A laminated film having an i-th release layer and a second release layer inside and outside the buffer layer was produced by a co-extrusion method (see Fig. 2). Furthermore, specifically, using a splitter block, a manifold mold, a polybutylene terephthalate/polytetramethylene glycol block copolymer, a modified polyethylene 32 201202035 olefin, an ethylene-methyl propylene The dilute acid f vinegar copolymer and polypropylene are simultaneously extruded as a laminate film. Further, at this time, using the apparatus shown in Fig. 3, the temperature of the roller 230 is 6 〇 0 〇, the second light is required, and the second roller 240 has a speed ratio of 1 with respect to the [roll 23]. The thickness of the W-th mold layer of the laminated film is - the thickness of the material layer is 1 〇'', the thickness of the buffer layer is 94 μm, and the thickness of the 脱2 release layer is ΙΟμιη ° 2. The CL film adhesion test actually 'will The circuit in which the CL f-specific film is temporarily fixed via an adhesive exposes the film 'in such a manner that the i-th release layer and the circuit exposed film face each other, and the laminated film is wrapped from both sides and pressurized by the heating plate. Heating and pressurization are performed in the heating mode not shown in Fig. 5. As a result, the amount of bleeding of the adhesive between the film and the CL film to the circuit pattern was 6 〇 μ Γ, which was superior to the previous PBT-based release film (refer to Table 3). Further, the rate of occurrence of mold release failure of the laminated film after heating and pressurization was less than 1% by force, which was as good as the conventional bismuth-based release film (see Table 3). (Example 2) Except that the raw material of the first release layer was polybutylene terephthalate (trademark) 5〇20 (manufactured by "Ling Engineering Plastic Co., Ltd.") 1 was carried out in the same manner, and a laminated film was produced, and the laminated film was evaluated. The amount of adhesion of the adhesive between the exposed film and the CL film to the circuit pattern is 70 μm, which is superior to the previous pBT-based release film (refer to Table 3) » In addition, the mold release failure of the laminated film after heating and pressurization occurs. The rate was not as good as ι 〇33 201202035 %, which was as good as the previous PBT release film (refer to Table 3) (Example 3). In addition to the use as the raw material of the first release layer, polyethylene terephthalate was used. / polytetramethylene glycol block copolymer (polybutylene terephthalate unit / polytetramethylene glycol unit, 9 parts by weight / 1 〇 weight novaduran made by Puli Engineering Plastics Co., Ltd. Registration; (35505S), the rest is performed in the same manner as in Example i, and the laminated film is produced and evaluated. 'The circuit exposes the amount of adhesion of the adhesive between the thin film and the CL film to the circuit pattern. 70μιη, which is superior to the prior PBT-based release film (see Table 3). Moreover, the occurrence rate of mold release defects after heating and pressing is not less than '%, which is as good as the previous PBT-based release film. (Refer to Table 3). (Example 4) In addition to the first off The thickness of the mold layer was changed to 12 μm, and the thickness of the buffer layer was changed to 98, except that the second mold release layer was not provided, and the laminate film was formed in the same manner as in Example t, and the laminate film was evaluated. The amount of the adhesive between the film and the CL film to the circuit pattern is 9 〇μΐπ', which is superior to the previous PBT-based release film (refer to Table 3). Moreover, the release film of the laminated film after heating and pressurization is poor. The occurrence rate was less than 1%, which was as good as the previous PBT-based release film (refer to Table (Example 5) 12 μm, and the thickness of the buffer layer was similarly performed, and the thickness of the first release layer was changed to The film was laminated to the other examples except for the change of 88 μm, and the laminated film was evaluated. 34 201202035 The amount of adhesive between the exposed film and the CL film to the circuit pattern was 9_'related from the previous bribe The film was more excellent (refer to Table 3). The occurrence rate of the release film of the laminated film after heating and pressurization was less than 1%, which was as good as the previous PBT-based release film (see Table &amp; (Example 6)) In addition to the first release The thickness of the layer was changed to 4 μm, the thickness of the buffer layer was changed to 62 mm, the thickness of the second release layer was changed to &gt;, and the thickness of the adhesive layer was changed to 7 μm, and the same was carried out in the examples to prepare a laminate. The film was evaluated, and the laminated film was evaluated. The amount of the adhesive between the exposed film and the CL film to the circuit pattern was 'exceeding better than the previous release film (refer to Table 3W, after heating and pressurization) The occurrence rate of the mold release film of the laminated film was less than 〇%, which was as good as the previous ruthenium release film (see Table 3). (Example 7) In addition to changing the thickness of the i-th release layer to 5_, The thickness of the buffer layer was changed to 79, and the thickness of the second release layer was changed to one, and the thickness of the adhesive layer was changed to 8 μm, and the same procedure as in Example i was carried out to prepare a laminated film 'and the laminated film was formed. to evaluate. The circuit exposes the adhesive between the film and the CL film, and the amount of exudation to the circuit pattern is 70, which is superior to the previous PBT-based release film (refer to Table 3). Further, the rate of occurrence of mold release failure of the laminated film after heating and pressurization was less than '1 to 0%, which was as good as the previous PBT-based release film (see Table [Table 3], S; 35 201202035 Example 7 PBT /PIMG (80/20) LO modified PE oo i &amp; 〇〇g 70 New 1.0% Example 6 PBT/PTMG (80/20) Modified PE EMMA οα CO &amp; § 70^m Secret 1.0% Example 5 PBT/PTMG (80/20) Modified PE c=&gt; Discussion oo oo &amp; CD 90^m Money 1.0% Example 4 PBT/PIMG (80/20) Modified PE CD EMMA oo 1 1 § 90 money 1.0% Example 3 PBT/FfflG (90/10) CO modified PE 〇i 呀 CD &amp; § 70/zm not far 1.0% Example 2 g CO modified PE o Discussion &amp; 70/zm New Zealand 1.0 % Example 1 PBT/FIMG (80/20) CO-modified PE CD _ CJ5 &amp; 〇τ-Η 60/zm Less than 1.0% Resin i 1 layer thickness (#m) Resin layer thickness (em) Resin layer thickness (ym) Resin layer thickness (/zm) Thickness of integrated film (ym) Exudation amount of mold release failure rate First release layer j Adhesive layer buffer layer 2nd die layer evaluation result 36 201202035 Furthermore, in Table 3 , "PBT/PTMG (90/10)" means polybutylene terephthalate / poly four Mercaptodiol block copolymer (polybutylene terephthalate segment/polytetramethylene glycol segment, 90 parts by weight/10 parts by weight), "PBT/PTMG (80/20)" means Polybutylene terephthalate / polytetramethylene glycol block copolymer (polybutylene terephthalate segment / polytetramethylene glycol segment, 80 parts by weight / 20 parts by weight) "PBT" means polybutylene terephthalate, modified PE means modified polyethylene, and "EMMA" means ethylene methyl methacrylate copolymer (methyl methacrylate derivative unit content: 5% by weight) "PP" means polypropylene. [Industrial Applicability] The release film of the present invention has the following feature: similarly to the prior PBT release film, the release layer can be prevented from adhering to the circuit exposed film and the CL film, And preventing the release layers from sticking to each other, and further reducing the amount of leakage of the adhesive between the exposed film and the CL film to the circuit pattern portion thereof compared with the prior PBT release film. Therefore, the release film of the present invention is particularly useful. Used as a release film as follows: in order to adhere the CL film by pressurization When the road film is exposed, so that the uneven portion CL of the adhesive film and circuit pattern 'and the cover so as to be used in the film-coated. As the release film, there are known (1) a user who manufactures a laminate, (2) a user who manufactures a tip composite product, and (3) a user who manufactures a sports/seat product. The release film of the present invention is also used as the release film. In addition, the release film used when manufacturing a laminated board means that it is interposed in order to prevent adhesion between a printed circuit board and a separator or another printed circuit board when performing press molding at the time of manufacture of a multilayer printed circuit board. 201202035 The film between these. The release film used in the manufacture of a tip composite product means that when a prepreg composed of, for example, glass cloth, carbon fiber, or aramid fiber and epoxy resin is cured, various articles are manufactured. The film used. The release film used in the manufacture of sports/leisure articles refers to a roll of a prepreg in a cylindrical shape and a high pressure dad when manufacturing, for example, a fishing rod, a long handle of a golf club, a mast of a windsurfing board, or the like. A film wound on the prepreg during hardening. Further, the release film of the present invention is also used as a release film for an adhesive tape, a double-sided tape, a masking tape, a label, a seal, a sticker, a skin-attaching drug, and the like. The release film of the present invention is also used as a step film for use in the production of a printed circuit board, a ceramic electronic component, a thermosetting resin product, or a cosmetic board. In addition, the term "step film" as used herein refers to a method of manufacturing a printed circuit board, a ceramic electronic component, a thermosetting resin product, or a cosmetic board, etc., so that the metal sheets do not adhere to each other or the resin. a film that is sandwiched between metal sheets or between resins when performing a forming step, particularly when manufacturing a laminated board, when manufacturing a flexible printed board, when manufacturing a cutting-edge composite product, and when manufacturing sports/leisure articles Suitable for use In addition, the 'release film of the present invention' is also used as a packaging film. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view showing a laminated film according to an embodiment of the present invention. 38 201202035 Fig. 2 is a longitudinal sectional view of the laminated film of the modification (A). Fig. 3 is a view showing an example of a manufacturing apparatus of a laminated film according to an embodiment of the present invention. Fig. 4 is a view showing an example of a method of using a laminated film according to an embodiment of the present invention. Fig. 5 is a view showing a heating mode in which hot pressing is performed when the CL film is bonded to the uneven portion of the circuit pattern by using the laminated film of the embodiment of the present invention. [Description of main component symbols] 100, 100A laminated film (release film) 110 Release layer ll〇a First release layer (release layer) ll〇b Second release layer (release layer) 120 Buffer layer 210 Mold 230 First Roller 240 Second Roller 300 Hot Plate 310 Stainless Steel Plate 320 Rubber Cushion 330 Teflon Sheet 340 The circuit is exposed and the CL film is temporarily fixed by an adhesive. F Release film Μ Melting 39

Claims (1)

201202035 VII. Patent Application Range: 1. A release film comprising at least a release layer comprising: polybutylene terephthalate homopolymer (A), and polybutylene terephthalate a copolymer (B) of a diester (PBT) component and a polytetramethylene glycol (PTMG) component. 2. The release film according to claim 1, wherein the weight ratio of the polybutylene terephthalate homopolymer (A) to the copolymer (B) in the release layer (A/B) ) is A/B = 25/75 or more and 80/20 or less. 3. The release film according to claim 2, wherein the weight ratio of the polybutylene terephthalate homopolymer (A) to the copolymer (B) in the release layer (A/) B) is A/B = 25/75 or more and 50/50 or less. 4. The release film according to any one of claims 1 to 3, wherein the polybutylene terephthalate component and the polytetradecyl diol component in the copolymer (B) The copolymerization ratio (PBT/PTMG) is PBT/PTMG = 80/20 or more and 90/10 or less. 5. The release film according to any one of claims 1 to 3, further comprising a buffer layer. 6. The release film according to claim 5, wherein the release layer has a thickness of 15 μm or less. 40 201202035 7. A release film comprising a release layer as a surface layer of at least one side, the release layer being formed of a resin having a polyether ester block copolymer as a main component. The segment copolymer is mainly composed of a polyether segment and a polyester segment. 8 _ a release film comprising a release layer as a surface layer of at least one side, the release layer being formed of a resin having a polybutylene terephthalate resin as a main component and having a thickness of 15 Ιιη below. 9. The release film according to claim 8, wherein the release layer has a thickness of 10 μm or less. 10. The release film according to claim 8 or 9, wherein the polybutylene terephthalate resin is a polybutylene terephthalate resin. 11. The release film according to claim 8 or 9, wherein the aforementioned polybutylene terephthalate resin is a polyether ester block copolymer, and the polyether ester block copolymer is mainly composed of a polyether chain The segment is composed of a polyester segment. The release film according to claim 7, wherein the weight ratio of the aforementioned polyester segment to the aforementioned polyether segment is in the range of 80:20 to 90:1 Torr. The release film according to claim 11, wherein the weight ratio of the aforementioned polyester segment to the aforementioned polyether segment is in the range of 80:20 to 90:1 Torr. The release film according to claim 12, wherein the constituent unit of the polyether segment is mainly an oxygen-extended butyl unit, and the constituent unit of the polyester segment is mainly represented by the following chemical formula (I) Ester unit: The release film according to claim 13, wherein the constituent unit of the polyether segment is mainly an oxygen-terminated butyl unit, and the constituent unit of the polyester segment is mainly represented by the following chemical formula (I) Ester unit: one-〇- CH2CH2CH2CH2 (I) 42