201144681 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種照明裝置，尤其涉及一種發光二極體燈 具。 [0002] 【先前技術】 發光二極體（LED)具有體積小、效率高、不含汞及壽命長 等優點，故能夠取代習知的螢光燈或者白熾燈，減少能 源的消耗及二氧化碳的排放量。惟，發光二極體在工作 時會產生大量的熱，尤其是在應用於結構比較緊湊的室 内燈中的情況下，散熱不佳會影響發光二極體的發光效 率甚至導致發光二極體損毁。 [0003] 【發明内容】 有鑒於此，有必要提供一種散熱效率較高的發光二極體 燈具。 [0004] 〇 一種發光二極體燈具，包括一散熱器及設於該散熱器上 的至少一發光二極體元件，該散熱器包括一基板、自該 基板延伸出的一筒體及設於該筒體的外表面上的複數散 熱鰭片，該基板包括一第一表面及與該第一表面相對的 一第二表面，所述發光二極體元件設於該第一表面上， 所述筒體由基板的第二表面延伸，所述散熱鰭片自筒體 的外表面沿該筒體的徑向向外呈曲線形延伸。 [0005] 該發光二極體燈具的散熱器上設有向外呈曲線形延伸的 散熱鰭片，每一散熱鰭片具有較大的散熱面積，從而使 該散熱器具有較高的散熱效率，發光二極體元件工作時 產生的熱量可被該散熱器迅速散發至外界，進而確保該 099118988 表單編號A0101 第3頁/共14頁 0992033625-0 201144681 發光二極體燈具穩定工作。 【實施方式】 [0006] 下面參照附圖，結合實施例對本發明作進一步說明。 [0007] 請參閱圖1及圖2，本發明一實施例的發光二極體燈具100 包括一燈座10、固定於該燈座10上的一散熱器20、設於 該散熱器20上的複數發光二極體元件30及設於該散熱器 20上且罩設於所述發光二極體元件30上的一燈罩40。 [0008] 該燈座10用於與外部電源電連接來為該發光二極體燈具 100供電。該燈座10為標準件，從而使該發光二極體燈具 100可直接置換傳統的白熾燈泡。 [0009] 該散熱器20採用高導熱且耐高溫材料一體製成，如金屬 材料及陶竟材料。優選地，該金屬材料選自銅、銘及其 合金，陶瓷材料選自氧化鋁及氮化鋁，其中，氧化鋁或 氮化鋁製成的散熱器20還可兼顧絕緣的效果。本實施例 中，該散熱器20由較易成型的鋁材製成。該散熱器20包 括一基板21、自基板21的周緣向上延伸的一環形的安裝 部22、自該基板21的周緣向下延伸的一縱長的筒體23、 及自該安裝部22及筒體23的外表面向外延伸的複數散熱 鰭片24。 [0010] 請參照圖3及圖4，該基板21包括一第一表面211及與該第 一表面211相對的一第二表面212，該基板21設有貫穿該 第一表面211及該第二表面212的複數通孔213。所述通 孔21 3將該基板21的第一表面211—側的氣流與該基板21 的第二表面21 2—側的氣流導通。 099118988 表單編號A0101 第4頁/共14頁 0992033625-0 201144681 [0011] 該安裝部22自該基板的第一表面211的周緣向上凸伸， 该安裝部22的頂端設有向該安裝部22内側凸伸的四卡合 部221 ’所述四卡合部221沿該安裝部22的圓周方向呈弧 衫條狀且等距離間隔分佈，每一卡合部221與該基板21之 間形成一卡槽222。所述卡合部221及卡槽222用以與燈 蕈4〇配合以將燈罩固定於該基板21的第一表面211的 /侧。 [0012] Ο 该筒體23自該基板21的第二表面212的周緣向下延伸。該 筒體23呈圓筒狀，其内部形成一收容空間231，該收容空 間231用於收容一驅動電路模組5〇，該驅動電路模組5〇與 所述發光二極體元件30及燈座10電性連接。該筒體23遠 離該基板21的一端形成一開口 232，該燈座1〇對接於該開 2 3 2 處。 [0013] 所述散熱鰭片24圍繞筒體23呈放射狀設置。每—散熱鰭 片24沿該筒體23的轴向呈長條狀。請參圖3，每—散熱鰭 片2 4由該筒體2 3先沿該筒體2 ^的徑向向外延伸形成—第 〆直線段241、再朝*徑向的一側f折延伸形成一弯折段 243、最後再沿徑向向外延伸形成一第二直線段，所 述彎折段243連接在第一直線段241與第二直線段245之 間，從而使每一散熱鰭片24從該筒體23向外延伸呈曲線 形。每一散熱鰭片24沿該筒體23的轴向自該安裝部22的 外表面向該筒體23的外表面延伸，且該散熱韓片24自該 筒體23向外延伸的高度自該安裝部22所在的—端向該筒 體23所在的一端逐漸減小，即自靠近所述發光二極體元 件30的一端向遠離所述發光二極體元件30的—端逐斩咸 099118988 表單編號A0101 第5頁/共14頁 0992033625-0 201144681 小，從而可以充分利用該散熱鰭片24的有限面積並減小 該發光二極體燈具100的體積。所述散熱鰭片24兩兩成對 設置，每一對散熱鰭片24靠近安裝部22及筒體23的内侧 相互靠近，每一對散熱鰭片24遠離安裝部22及筒體23的 外側相互遠離，以充分利用該散熱器20的外圍空間。 [0014] 所述發光二極體元件30固定於該基板21的第一表面211上 ，且所述發光二極體元件30藉由導線（圖未示）穿過該 基板21上的通孔213與該驅動電路模組50電性連接。 [0015] 該燈罩40採用透光材料製成，如玻璃、塑膠等。該燈罩 40為一中空碗狀體。該燈罩40對接於該散熱器20的安裝 部22上，並將所述發光二極體元件30罩於其内。 [0016] 該發光二極體燈具100工作時，發光二極體元件30產生的 熱量中，一部分熱量藉由該散熱器20的基板21直接傳遞 至散熱鰭片24上，另一部分熱量藉由該基板21上的通孔 213熱對流至該筒體23内，然後藉由該筒體23傳至該散熱 鰭片24上，最終，所述發光二^極體元件30產生的熱量藉 由所述散熱鰭片24散發至周圍環境中去。另外，該驅動 電路模組50產生的熱量亦藉由該散熱器20的筒體23傳至 所述散熱鰭片24上並最終散發至周圍環境中。該發光二 極體燈具100的散熱器20上的散熱鰭片24向外呈曲線形延 伸，每一散熱鰭片24具有較大的散熱面積，從而使該散 熱器20具有較高的散熱效率，該發光二極體燈具100工作 時產生的熱量可被該散熱器20迅速散發至外界，進而確 保發光二極體燈具100穩定工作。 099118988 表單編號A0101 第6頁/共14頁 0992033625-0 201144681 [0017] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0018] 圖1所示為本發明一實施例的發光二極體燈具的立體組裝 圖。 [0019] 圖2所示為圖1中的發光二極體燈具的立體分解圖。 [0020] 圖3所示為圖2中的發光二極體燈具中的散熱器的俯視圖 [0021] 圖4所示為圖2中的發光二極體燈具中的散熱器的剖視圖201144681 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a lighting device, and more particularly to a light emitting diode lamp. [0002] [Prior Art] Light-emitting diodes (LEDs) have the advantages of small size, high efficiency, no mercury, and long life, so that they can replace conventional fluorescent lamps or incandescent lamps, and reduce energy consumption and carbon dioxide. Emissions. However, the light-emitting diode generates a large amount of heat during operation, especially in the case of an indoor lamp with a relatively compact structure, the poor heat dissipation may affect the luminous efficiency of the light-emitting diode and even cause the light-emitting diode to be damaged. . SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode lamp with high heat dissipation efficiency. [0004] A light-emitting diode lamp includes a heat sink and at least one light-emitting diode component disposed on the heat sink, the heat sink including a substrate, a cylinder extending from the substrate, and a plurality of heat dissipation fins on the outer surface of the cylinder, the substrate includes a first surface and a second surface opposite to the first surface, and the LED component is disposed on the first surface The cylinder extends from a second surface of the substrate, and the heat dissipation fins extend in a curved shape from the outer surface of the cylinder in a radial direction outward of the cylinder. [0005] The heat sink of the light-emitting diode lamp is provided with heat-dissipating fins extending outward in a curved shape, and each heat-dissipating fin has a large heat-dissipating area, so that the heat sink has high heat-dissipating efficiency. The heat generated by the operation of the LED component can be quickly dissipated to the outside by the heat sink, thereby ensuring that the 099118988 form number A0101 page 3/14 page 0992033625-0 201144681 the light-emitting diode lamp is stable. Embodiments [0006] Hereinafter, the present invention will be further described with reference to the accompanying drawings. [0007] Referring to FIG. 1 and FIG. 2, a light-emitting diode lamp 100 includes a lamp holder 10, a heat sink 20 fixed on the lamp holder 10, and a heat sink 20 disposed on the heat sink 20. A plurality of light-emitting diode elements 30 and a lamp cover 40 disposed on the heat sink 20 and covering the light-emitting diode element 30. The lamp holder 10 is for electrically connecting to an external power source to supply power to the LED device 100. The lamp holder 10 is a standard member, so that the light-emitting diode lamp 100 can directly replace a conventional incandescent light bulb. [0009] The heat sink 20 is integrally formed of a high thermal conductivity and high temperature resistant material, such as a metal material and a ceramic material. Preferably, the metal material is selected from the group consisting of copper, Ming and its alloys, and the ceramic material is selected from the group consisting of alumina and aluminum nitride, wherein the heat sink 20 made of alumina or aluminum nitride can also achieve the effect of insulation. In this embodiment, the heat sink 20 is made of an aluminum material that is relatively easy to mold. The heat sink 20 includes a substrate 21, an annular mounting portion 22 extending upward from the periphery of the substrate 21, an elongated tubular body 23 extending downward from the periphery of the substrate 21, and the mounting portion 22 and the barrel A plurality of fins 24 extend outwardly from the outer surface of the body 23. [0010] Referring to FIG. 3 and FIG. 4, the substrate 21 includes a first surface 211 and a second surface 212 opposite to the first surface 211. The substrate 21 is disposed through the first surface 211 and the second surface. A plurality of through holes 213 of the surface 212. The through hole 213 electrically conducts the airflow on the side of the first surface 211 of the substrate 21 and the airflow on the side of the second surface 21 2 of the substrate 21. 099118988 Form No. A0101 Page 4 of 14 0992033625-0 201144681 [0011] The mounting portion 22 protrudes upward from the periphery of the first surface 211 of the substrate, and the top end of the mounting portion 22 is provided to the inside of the mounting portion 22 The four engaging portions 221 of the protruding portion are formed in a strip shape along the circumferential direction of the mounting portion 22 and are equally spaced apart, and a card is formed between each engaging portion 221 and the substrate 21. Slot 222. The engaging portion 221 and the latching groove 222 are configured to cooperate with the lamp holder 4 to fix the lamp cover to the / side of the first surface 211 of the substrate 21. [0012] The barrel 23 extends downward from the periphery of the second surface 212 of the substrate 21. The cylindrical body 23 is formed in a cylindrical shape, and a receiving space 231 is formed therein. The receiving space 231 is configured to receive a driving circuit module 5, the driving circuit module 5 and the LED component 30 and the lamp. The seat 10 is electrically connected. The end of the barrel 23 away from the substrate 21 forms an opening 232 which is butted against the opening 2321. [0013] The heat dissipation fins 24 are radially disposed around the cylindrical body 23. Each of the heat radiating fins 24 has an elongated shape in the axial direction of the cylindrical body 23. Referring to FIG. 3, each of the heat dissipating fins 24 is extended from the cylindrical body 2 3 along the radial direction of the cylindrical body 2 ^ - the second straight line segment 241, and then extended to the side of the * radial direction Forming a bent section 243 and finally extending radially outward to form a second straight line segment, the bent section 243 being connected between the first straight line section 241 and the second straight line section 245, thereby making each heat sink fin 24 extends outward from the barrel 23 in a curved shape. Each of the heat dissipation fins 24 extends from the outer surface of the mounting portion 22 toward the outer surface of the cylindrical body 23 along the axial direction of the cylindrical body 23, and the height of the heat dissipation Korean sheet 24 extending outward from the cylindrical body 23 is self-installed. The end of the portion 22 is gradually reduced toward the end where the cylindrical body 23 is located, that is, from the end near the light-emitting diode element 30 to the end away from the light-emitting diode element 30, the number is 099118988. A0101 page 5/14 pages 0992033625-0 201144681 is small, so that the limited area of the heat dissipation fins 24 can be fully utilized and the volume of the light-emitting diode lamp 100 can be reduced. The heat dissipation fins 24 are disposed in pairs, and each pair of heat dissipation fins 24 are close to each other near the mounting portion 22 and the inner side of the cylinder 23, and each pair of heat dissipation fins 24 is away from the mounting portion 22 and the outer side of the cylinder 23 Keep away from the peripheral space of the heat sink 20. The light emitting diode element 30 is fixed on the first surface 211 of the substrate 21, and the light emitting diode element 30 passes through a through hole 213 on the substrate 21 by a wire (not shown). The driving circuit module 50 is electrically connected. [0015] The lampshade 40 is made of a light transmissive material such as glass, plastic, or the like. The lamp cover 40 is a hollow bowl. The lamp cover 40 is butted against the mounting portion 22 of the heat sink 20, and the light emitting diode element 30 is housed therein. [0016] When the LED device 100 is in operation, a portion of the heat generated by the LED component 30 is directly transmitted to the heat dissipation fins 24 by the substrate 21 of the heat sink 20, and another portion of the heat is utilized by the The through hole 213 of the substrate 21 is thermally convected into the cylindrical body 23, and then transferred to the heat dissipation fin 24 by the cylindrical body 23. Finally, the heat generated by the light emitting diode element 30 is generated by the The heat sink fins 24 are radiated to the surrounding environment. In addition, the heat generated by the driving circuit module 50 is also transmitted to the heat dissipating fins 24 through the barrel 23 of the heat sink 20 and finally radiated to the surrounding environment. The heat dissipation fins 24 of the heat sink 20 of the LED device 100 are outwardly curved, and each of the heat dissipation fins 24 has a large heat dissipation area, so that the heat sink 20 has high heat dissipation efficiency. The heat generated by the LED device 100 during operation can be quickly dissipated to the outside by the heat sink 20, thereby ensuring stable operation of the LED device 100. 099118988 Form No. A0101 Page 6 of 14 0992033625-0 201144681 [0017] In summary, the present invention complies with the requirements of the invention patent, and patents are filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a perspective assembled view of a light-emitting diode lamp according to an embodiment of the present invention. 2 is an exploded perspective view of the light emitting diode lamp of FIG. 1. 3 is a plan view of a heat sink in the light-emitting diode lamp of FIG. 2 [0021] FIG. 4 is a cross-sectional view of the heat sink in the light-emitting diode lamp of FIG.
[0022] [0023] [0024] [0025] [0026] [0027] [0028] [0029] [0030] 099118988 【主要元件符號說明】 發光二極體燈具：100 燈座：10 散熱器：20 基板：21 第一表面：211 第二表面：212 通孔：213 安裝部：22 卡合部：221[0024] [0023] [0023] [0025] [0025] [0027] [0030] [0030] 099118988 [Main component symbol description] LED lamp: 100 lamp holder: 10 heat sink: 20 substrate : 21 First surface: 211 Second surface: 212 Through hole: 213 Installation: 22 Engagement: 221
表單編號Α0101 第7頁/共14頁 0992033625-0 201144681 [0031] 卡槽：222 [0032] 筒體：23 [0033] 收容空間：231 [0034] 開口 ： 232 [0035] 散熱鰭片：24 [0036] 第一直線段：241 [0037] 彎折段：243 [0038] 第二直線段：245 [0039] 發光二極體元件：30 [0040] 燈罩：40 [0041] 驅動電路模組：50 099118988 表單編號A0101 第8頁/共14頁 0992033625-0Form No. 1010101 Page 7 of 14 0992033625-0 201144681 [0031] Card slot: 222 [0032] Cylinder: 23 [0033] Containment space: 231 [0034] Opening: 232 [0035] Heat sink fins: 24 [ 0036] First straight line segment: 241 [0037] Bending segment: 243 [0038] Second straight line segment: 245 [0039] Light-emitting diode element: 30 [0040] Lamp cover: 40 [0041] Drive circuit module: 50 099118988 Form No. A0101 Page 8 / Total 14 Page 0992033625-0