201015505 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種包含顯示面板之影像顯示系 統，特別有關於一種針對薄化基板處理之顯示面板。 【先前技術】 近年來對顯示器的需求已經逐漸朝向輕質化發展，通 常係藉由將顯示面板中的玻璃基板薄化，以提供重量較輕 Φ 的顯示器。傳統上係利用機械研磨的方式將玻璃基板薄 化，使得顯示面板的重量減輕，然而，薄化後的基板強度 會降低，於製程中需要特別小心地搬動，因此通常將兩片 玻璃基板組立後才進行研磨製程薄化基板。 傳統上玻璃基板的薄化製程係使用兩階段的機械研 磨步驟，第一階段為粗研磨步驟，其係將玻璃基板的厚度 減薄至所需厚度，此時玻璃基板表面的粗糙度變大，使得 玻璃基板的光穿透度下降而變得不透明；接著再利用第二 φ 階段的研磨步驟將玻璃基板表面的粗糙度降低，以提高玻 璃基板的透明度。然而，因為薄化後的玻璃基板強度減弱， 容易在第二階段的研磨過程中破裂，因此玻璃基板可薄化 的厚度會受到限制，此外，經過第二階段的研磨步驟後， 玻璃基板表面的粗糙度仍無法降至最低。 在美國專利號US 7294373中提及利用金屬氧化物薄 膜覆蓋於薄化的玻璃基板表面，以解決液晶顯示面板在薄 化過程中引起的問題，然而其仍需要兩道研磨步驟以薄化 玻璃基板。 0773-A33894TWF_P2008035 3 201015505 面 有鑑於此，業界亟愛一 板，其可以改善上述^種針對薄化基板處理之顯示 【發明内容】 一 提^ Γ包含顯示面板之影像顯示系統，該顯 第置:基极’具有第-外表面；第二基板與第 土 » ^ Γμ/γ級立後具有一總厚度，具有第二外表 面；以及透明的壓克六多 喚Λ ^ ^ . 力糸或環氧樹脂型高分子薄膜覆蓋於 面上，其中該總厚度經由薄化製程減薄產 生。 此外，本發明還提供—種顯示面板之製造方法，包 括.提供第-基板，具有第一外表面；提供第二基板，具 有第-外表面·該第二基板與該第一基板對向組立後具有 一第一總厚度’對第—基板和第二基板進行薄化製程，該 第一總厚度減薄，產生第二總厚度；以及提供壓克力^ 環氧樹脂型高分子材料，塗佈於第一及第二外表面上1 ❹形成透明的壓克力系或環氧樹脂型高分子薄膜。 為了讓本發明之上迷目的、特徵、及優點能更明顯易 懂，以下配合所附圖式，作詳細說明如下： 【實施方式】 本發明係針對顯示面板中薄化基板的表面進行處 理’利用壓克力系或環氧樹脂型高分子薄膜覆蓋於薄化基 板的外表面上’以修補基板在薄化過程中產生的表面缺 陷，並提高薄化基板的強度。 0773-A33894TWF_P2008035 4 201015505 明m 其為依據本發明—實施例之有機電激 mlΓ板2()()的剖面示意圖。有機電激發光顯示面板 '、 土板100 ’以及對向設置的第二基板102，中間夾 設有機電激發光屉1n>1 L ^ Λ +丄 增104 ’以形成有機電激發光顯示面板 ° 技術7貝域中具有通常知識者當可瞭解，於第一與 第-基板的内面上還可具有其他元件或結構，例如電極 層筹> 色;處光片層等，為了簡化圖式，在此省略未緣出。 參 第-與第二基板係經過薄化製程處理後的基板，其組 立後的總厚度經過薄化製程處理後至少可減少約2〇%，例 如第一與第二基板組立後的總厚度於薄化前約為1mm，薄 化後成為總厚度約〇.2〜G,8mm的面板。薄化製程可以是機 械研磨、化學钱刻或其他方式，經由薄化製程之化學或物 理方式處理後’第-基板的第—外表面廳與第二基板的 第二外表面102a成為粗㈣的表面，其粗链度(R以至牴點， RPeakt〇vaney)約為0.25//m以上，同時在外表面1〇〇&和1〇2& 上還會產生表面缺陷，例如點狀凹陷（dimple)、條狀刮傷 ❹（snatch)、點狀突起(Pimple)或前述之組合，使得第一基 板100與第二基板102的透明度下降且強度亦減弱。 因此，依據本發明一實施例，在第一基板的第一外表 面100a與第二基板的第二外表面1〇2a上分別覆蓋高分子 薄膜106和108，高分子薄膜可以是透明的壓克力系或環 氧樹脂型高分子’經由高分子薄膜覆蓋後，第一與第二外 表面100a和102a的粗糙度可明顯改善，降低至少約5〇%。 此外，第一與第二外表面l〇〇a和l〇2a上的表面缺陷之·寬 度、深度和高度也可以明顯減小。請參閱第2A圖，其係 0773-A33894TWF P2008035 5 201015505 顯示第1圖中虛線區域2A的局部放大圖，第二外表面i〇2a 上的點狀凹陷110經由高分子薄膜1〇8覆蓋後，其表面缺 陷112的深度及寬度明顯減小。另外，請參閱第2B圖，其 係顯示第1圖中虛線區域2B的局部放大圖，第二外表面 102a上的點狀突起111經由高分子薄膜ι〇8覆蓋後，其表 面缺陷113的高度明顯減小。因此，薄化基板1〇〇和1〇2 的表面粗糙度可藉由高分子薄膜降低。另外，高分子薄膜 還可以提升薄化基板的強度，在一實施例中，薄化基板的 ❹ 強度可藉由高分子薄膜增加至少約35%。 在本發明之一實施例中’高分子薄膜1〇6和ι〇8的厚 度可約為1.5〜10ym之間，且其光穿透度與第一和第二基 板相當，例如，第一與第二基板的光穿透度約7〇〜9〇%， 而高分子薄膜106和108的光穿透度則約為98〜1〇〇%。在 本發明之一實施例中，高分子薄膜的組成可以是寡聚物 (Oligomer)、反應性稀釋單體(Reacfive monomer) '光起始 劑(Photoinitiator)與其他添加物之混合物，其中寡聚物約為 ^ l〇~80wt〇/o，例如丙烯酸聚酯寡聚物（polyester acrylic oligomer)、丙烯酸環氧樹脂寡聚物(ep〇Xy acryHc 〇iig〇mer) 或丙婦酸聚氣S日券聚物(polyurethane acrylic oligomer);反 應性稀釋單體約為1 〇~50wt% ，例如多功能型丙烯酸醋 (Multifunctional acrylate);光起始劑約為 0 5〜10wt% ;其他 添加物約為0〜l〇wt%，例如二氧化碎（si〇2)。 接著，請參閱第3圖，其為依據本發明一實施例之液 晶顯示器的剖面示意圖。液晶顯示器3〇〇包含顯示面板 200,其與第1圖之有機電激發光顯示面板的差別在於第一 0773-A33894TWF^P2008035 6 201015505 基板100和第二基板102之間夾設液晶層114。上述第_ 基板100例如為陣列基板，第二基板102例如為彩色遽光 片基板。另外，在高分子薄膜106和108上分別設置下偏 光板118與上偏光板116，並在下偏光板ία及顯示面板 200下方設置背光源120，以完成液晶顯示器3〇〇。 請參閱第4A至4C圖，其為依據本發明一實施例之液 晶顯示面板的製造方法剖面示意圖。請參閱第4a圖，首 先提供第一基板100與第二基板102對向組立，第一與第 ❹二基板例如為玻璃基板，在兩個基板之間夾設液晶層114， 此時第一基板與第二基板尚未薄化，其組立後的總厚度可 約為1 mm。 接著’請參閱第4B圖’將組立後的第一與第二基板 薄化，在本發明之一實施例中，薄化製程係使用氫氟酸(HF) 對玻璃基板進行濕式蝕刻以薄化基板，經薄化後，第一基 與第二基板組立的總厚度減至0.8 mm，其外表面i〇〇a和 102a為粗縫化表面’且具有多個表面缺陷，例如刮傷、點 ❿狀凹陷或點狀凸起。上述實施例係針對組立後的兩個基板 進行薄化，在另一實施例中，也可以將兩個基板分別薄化 後再進行組立。 請參閱第4C圖，將壓克力系或環氧樹脂型高分子材 料塗佈於第一基板的外表面l〇0a與第二基板的外表面 102a上，接著以紫外光照射以及/或加熱方式使高分子材料 硬化，形成透明的高分子薄膜106和1〇8，以完成本發明 之顯示面板。上述塗佈方式可以是旋轉塗佈（spin c〇ating)、 刮刀塗佈（scrubber coating)、滾輪塗佈(r〇ller c〇ating)或其 0773-A33894TWF P2008035 7 201015505 他塗佈方式，加熱溫度較佳為低於160〇C，紫外光照射的 總能量視高分子材料而定，通常約為2000毫焦耳(mj)。 依據本發明之一實施例，顯示面板之基板薄化僅需要 一道蝕刻步驟即可完成’接著再利用高分子薄膜覆蓋於薄 化基板的外表面上，即可修補因薄化所造成的表面缺陷， 降低基板表面的粗糙度，提升基板透明度，並且還可以增 加薄化基板的強度。此外，相較於傳統的基板薄化製程， 本發明可以節省一道研磨製程，進而降低生產成本。 ❿ 以下列舉本發明各實施例與比較例之薄化基板的特 性，其中實施例與比較例皆為兩片玻璃基板組立後的總厚 度由1mm薄化至0.8mm，於各實施例中覆蓋不同厚度的高 分子薄膜，而比較例則未覆蓋高分子薄膜。利用白光散射 儀(SNU)與表面斷差分析儀(KT-profiler)量測高分子薄膜塗 佈前後的表面缺陷尺寸，並以雙軸向抗折破壞測試 (ring-on-ring，簡稱RoR)量測薄化基板的破裂強度’結果 如下表1所列： 表1各實施例與比4 交例之薄化基? 的特性 表面缺 陷種類 壓克力系 高分子薄 膜厚度 (μιη) 缺陷深度(μπι) 缺陷寬度(μπι) RoR測 試破裂 強度 (N) 薄膜塗 佈前 薄膜塗 佈後 薄膜塗 佈前 薄膜塗 佈後 實施例1 點狀 2.26 4.90 1.48 250 160 36.04 實施例2 點狀 2.80 7.31 0.84 131 186 36.03 比較例1 點狀 0 4.80 一 4.33 — 19.11 實施例3 刮傷 2.82 4.05 0 91 0 69.3 實施例4 刮傷 3.09 7Λ2 0.89 123 122 140.44 比較例2 刮傷 0 6.01 — 159 — 51.06 0773-A33894TWF P2008035 8 201015505 由表1的結果可得知，於本發明各實施例中，利用高 分子薄膜可將薄化基板表面之點狀凹陷的寬度減少至少約 36%，深度減少至少約7〇%，強度增加至少約88%。另外， 可使得薄化基板表面之刮傷的寬度減少至少約1%，深度 減少至少約87%，而且強度可增加至少約35%。 綜上所述’本發明之顯示面板具有多項優點，不僅可 以修補薄化基板表面的缺陷、強化薄化基板的強度，還可 以節省薄化製程中的研磨費用，降低成本。 ⑩ 接著請參閱第5圖，其為依據本發明之包含顯示面板 之影像顯示系統500的配置示意圖，其中包含顯示器300 , 顯示器具有本發明所述之顯示面板2〇〇 ,顯示器300例如 為液晶顯示器或有機電激發光顯示器等（〇rganic light emitting device)’其可為電子裝置的一部份。一般而言，影 像顯示系統500包含顯示器3〇〇及控制單元4〇〇，控制單 元與顯示器300耦接，以傳輸訊號至顯示器，使顯示器顯 不影像。上述之電子裝置可為行動電話、數位相機、個人 ❹數位助理(PDA)、筆記型電腦、桌上型電腦、電視、車用顯 示器、數位相框、全球定位系統或可攜式DVD播放機。 雖然本發明已揭露較佳實施例如上，然其並非用以限 定本發明，任何熟悉此項技藝者，在不脫離本發明之精^ 和範圍内，當可做些許更動與潤飾，因此本發明之保 圍當視後附之申請專利範圍所界定為準。 ^鞑 【圖式簡單說明】 第1圖係顯示依據本發明一實施例之有機電激發光顯 0773-A33894TWF_P2008035 〇 201015505 示面板的剖面示意圖。 第2A圖係顯示第1圖中虛線區域2A的局部放大圖。 第2B圖係顯示第1圖中虛線區域2B的局部放大圖。 第3圖係顯示依據本發明一實施例之液晶顯示器的剖 面示意圖。 第4A〜4C圖係顯示依據本發明一實施例之顯示面板 的製造方法之剖面示意圖。 第5圖係顯示依據本發明一實施例之包含顯示面板的 ❹ 影像顯示系統的配置示意圖。 【主要元件符號說明】 100〜第一基板； 100a1〜第一外表面； 102〜第二基板； 102a〜第二外表面； 104〜有機電激發光層； ❿ 106、108〜壓克力系高分子薄膜； 110〜薄化基板的點狀凹陷； 111〜薄化基板的點狀突起； 112〜高分子薄膜覆蓋後的點狀凹陷； 113〜高分子薄膜覆蓋後的點狀突起； 114〜液晶層； 116〜上偏光板； 118〜下偏光板； . 120〜背光源； 0773-A33894TWF P2008035 10 201015505201015505 VI. Description of the Invention: [Technical Field] The present invention relates to an image display system including a display panel, and more particularly to a display panel for thinned substrate processing. [Prior Art] In recent years, the demand for displays has gradually progressed toward lightness, and it is generally provided by thinning a glass substrate in a display panel to provide a display having a light weight Φ. Conventionally, the glass substrate is thinned by mechanical polishing, so that the weight of the display panel is reduced. However, the strength of the thinned substrate is lowered, and the process needs to be carried out with special care. Therefore, two glass substrates are usually assembled. After the polishing process is performed, the substrate is thinned. Conventionally, the thinning process of the glass substrate uses a two-stage mechanical polishing step, and the first stage is a coarse grinding step of thinning the thickness of the glass substrate to a desired thickness, at which time the roughness of the surface of the glass substrate becomes large. The light transmittance of the glass substrate is lowered to become opaque; then the roughness of the surface of the glass substrate is lowered by the second φ stage polishing step to increase the transparency of the glass substrate. However, since the thinned glass substrate is weakened and easily broken during the second-stage grinding process, the thickness of the glass substrate which can be thinned is limited, and further, after the second-stage grinding step, the surface of the glass substrate Roughness still cannot be minimized. It is mentioned in U.S. Patent No. 7,294,373 that a metal oxide film is used to cover the surface of a thinned glass substrate to solve the problems caused by the thinning process of the liquid crystal display panel, however, it still requires two grinding steps to thin the glass substrate. . 0773-A33894TWF_P2008035 3 201015505 In view of this, the industry loves one board, which can improve the above-mentioned display for thinned substrate processing. [Invention] The image display system including the display panel is provided. The base 'has a first-outer surface; the second substrate and the soil»^ Γμ/γ have a total thickness, having a second outer surface; and a transparent squeezing hexagram ^ ^ . force or ring An oxygen-based polymer film is coated on the surface, wherein the total thickness is generated by thinning process. In addition, the present invention also provides a method of manufacturing a display panel, comprising: providing a first substrate having a first outer surface; providing a second substrate having a first outer surface; the second substrate is opposite to the first substrate And having a first total thickness ′ to thin the first substrate and the second substrate, the first total thickness is thinned to produce a second total thickness; and the acrylic material is provided, and the epoxy resin type polymer material is coated. The cloth is formed on the first and second outer surfaces to form a transparent acrylic or epoxy polymer film. In order to make the above-mentioned features, features, and advantages of the present invention more comprehensible, the following description will be made in detail with reference to the accompanying drawings: [Embodiment] The present invention is directed to the processing of the surface of a thinned substrate in a display panel. Covering the outer surface of the thinned substrate with an acrylic or epoxy polymer film to repair surface defects generated during thinning of the substrate and to increase the strength of the thinned substrate. 0773-A33894TWF_P2008035 4 201015505 A m is a schematic cross-sectional view of an organic electrophoresis ml plate 2()() according to the present invention. The organic electroluminescence display panel ', the earth plate 100' and the oppositely disposed second substrate 102 are provided with an electromechanical excitation light drawer 1n > 1 L ^ Λ + 丄 104 104 to form an organic electroluminescent display panel. It is understood by those skilled in the art that there may be other elements or structures on the inner faces of the first and first substrates, such as electrode layer color, light layer, etc., in order to simplify the drawing, The reason for this is omitted here. The total thickness of the substrate after the thinning process of the substrate with the second substrate and the second substrate is reduced by at least about 2% after the thinning process, for example, the total thickness of the first and second substrates after assembly It is about 1 mm before thinning, and becomes a panel with a total thickness of about 2.2~G, 8mm after thinning. The thinning process may be mechanical polishing, chemical etching or other means, after the chemical or physical treatment of the thinning process, the first outer surface of the first substrate and the second outer surface 102a of the second substrate become thick (four) The surface, its thick chain (R and even 牴, RPeakt〇vaney) is about 0.25 / / m or more, while surface defects such as point depressions (dimple) on the outer surface 1 〇〇 & 1 〇 2 & ), a strip-shaped snatch, a point, or a combination thereof, such that the transparency of the first substrate 100 and the second substrate 102 is lowered and the intensity is also weakened. Therefore, according to an embodiment of the invention, the first outer surface 100a of the first substrate and the second outer surface 1〇2a of the second substrate are respectively covered with the polymer films 106 and 108, and the polymer film may be transparent. After the force or epoxy type polymer is covered by the polymer film, the roughness of the first and second outer surfaces 100a and 102a can be remarkably improved by at least about 5%. Further, the width, depth, and height of surface defects on the first and second outer surfaces 10a and 11a can also be significantly reduced. Please refer to FIG. 2A, which is 0773-A33894TWF P2008035 5 201015505. A partial enlarged view of the broken line region 2A in FIG. 1 is shown. After the dot-shaped recess 110 on the second outer surface i〇2a is covered by the polymer film 1〇8, The depth and width of the surface defects 112 are significantly reduced. In addition, referring to FIG. 2B, which is a partial enlarged view showing the broken line region 2B in FIG. 1, the height of the surface defect 113 after the dot-like protrusion 111 on the second outer surface 102a is covered by the polymer film ι8 Significantly reduced. Therefore, the surface roughness of the thinned substrates 1A and 1〇2 can be lowered by the polymer film. In addition, the polymer film can also increase the strength of the thinned substrate. In one embodiment, the strength of the thinned substrate can be increased by at least about 35% by the polymer film. In one embodiment of the present invention, the thickness of the polymer films 1〇6 and ι8 may be between about 1.5 and 10 μm, and the light transmittance thereof is comparable to that of the first and second substrates, for example, the first The light transmittance of the second substrate is about 7 〇 to 9 〇%, and the light transmittance of the polymer films 106 and 108 is about 98 〜1 〇〇%. In one embodiment of the present invention, the composition of the polymer film may be a mixture of an oligomer (Oligomer), a reactive diluent monomer (Reacfive monomer), a photoinitiator, and other additives, wherein the oligomer is oligomerized. The material is about 〇~80wt〇/o, such as polyester acrylic oligomer, acrylate epoxy oligomer (ep〇Xy acryHc 〇iig〇mer) or propylene fo while gas S Polyurethane acrylic oligomer; reactive diluent monomer is about 1 〇 ~ 50wt%, such as multi-functional acrylate; photoinitiator is about 0 5~10wt%; other additives are about 0 to l 〇 wt%, for example, sulphur dioxide (si 〇 2). Next, please refer to FIG. 3, which is a cross-sectional view of a liquid crystal display according to an embodiment of the present invention. The liquid crystal display panel 3 includes a display panel 200 which differs from the organic electroluminescent display panel of FIG. 1 in that a liquid crystal layer 114 is interposed between the substrate 100 and the second substrate 102 in the first 0773-A33894TWF^P2008035 6 201015505. The first substrate 100 is, for example, an array substrate, and the second substrate 102 is, for example, a color light-emitting substrate. In addition, a lower polarizing plate 118 and an upper polarizing plate 116 are disposed on the polymer films 106 and 108, respectively, and a backlight 120 is disposed under the lower polarizing plate ία and the display panel 200 to complete the liquid crystal display. 4A to 4C are cross-sectional views showing a method of manufacturing a liquid crystal display panel according to an embodiment of the present invention. Referring to FIG. 4a, first, the first substrate 100 and the second substrate 102 are oppositely disposed. The first and second substrates are, for example, glass substrates, and the liquid crystal layer 114 is interposed between the two substrates. The second substrate is not thinned, and the total thickness after assembly can be about 1 mm. Next, 'see FIG. 4B' to thin the first and second substrates after assembly. In one embodiment of the present invention, the thinning process wet etches the glass substrate with hydrofluoric acid (HF) to thin After the substrate is thinned, the total thickness of the first substrate and the second substrate assembly is reduced to 0.8 mm, and the outer surfaces i〇〇a and 102a are rough-slit surfaces and have a plurality of surface defects, such as scratches, A point-like depression or a point-like projection. In the above embodiment, the two substrates after thinning are thinned, and in another embodiment, the two substrates may be thinned separately and then assembled. Referring to FIG. 4C, an acrylic or epoxy type polymer material is coated on the outer surface 10a of the first substrate and the outer surface 102a of the second substrate, followed by ultraviolet light irradiation and/or heating. The method hardens the polymer material to form transparent polymer films 106 and 1 to complete the display panel of the present invention. The coating method may be spin coating, scrub coating, roller coating or its 0773-A33894TWF P2008035 7 201015505 coating method, heating temperature Preferably, it is less than 160 〇C, and the total energy of ultraviolet light irradiation depends on the polymer material, and is usually about 2000 millijoules (mj). According to an embodiment of the present invention, the substrate thinning of the display panel can be completed by only one etching step. Then, the polymer film is coated on the outer surface of the thinned substrate to repair the surface defects caused by thinning. , reducing the roughness of the substrate surface, increasing the transparency of the substrate, and also increasing the strength of the thinned substrate. In addition, the present invention can save a grinding process and reduce the production cost compared to the conventional substrate thinning process. The characteristics of the thinned substrate of each embodiment and the comparative example of the present invention are listed below. In the embodiment and the comparative example, the total thickness of the two glass substrates after assembly is reduced from 1 mm to 0.8 mm, and the coverage is different in each embodiment. The polymer film was thick, and the comparative example did not cover the polymer film. The surface defect size of the polymer film before and after coating was measured by a white light scattering instrument (SNU) and a surface strain analyzer (KT-profiler), and the ring-on-ring (RoR) was tested. The results of measuring the fracture strength of the thinned substrate are shown in Table 1 below: Table 1 Corresponding to the thinning basis of each example and the ratio of the surface of the surface. The surface defect type Acrylic polymer film thickness (μιη) Depth depth ( Μπι) Defect width (μπι) RoR test burst strength (N) Film coating before film coating Film coating before film coating Example 1 Spot 2.26 4.90 1.48 250 160 36.04 Example 2 Point 2.80 7.31 0.84 131 186 36.03 Comparative Example 1 Dot 0 4.80 A 4.33 - 19.11 Example 3 Scratch 2.82 4.05 0 91 0 69.3 Example 4 Scratch 3.09 7Λ2 0.89 123 122 140.44 Comparative Example 2 Scratch 0 6.01 — 159 — 51.06 0773-A33894TWF P2008035 8 201015505 It can be seen from the results of Table 1 that in various embodiments of the present invention, the width of the dot-like recess on the surface of the thinned substrate can be reduced by at least about 36% and the depth is reduced by at least about 7〇% by using the polymer film. Increase of at least about 88%. In addition, the width of the scratched surface of the thinned substrate can be reduced by at least about 1%, the depth by at least about 87%, and the strength can be increased by at least about 35%. As described above, the display panel of the present invention has a plurality of advantages, which not only can repair the defects of the surface of the thinned substrate, strengthen the strength of the thinned substrate, but also save the polishing cost and the cost in the thinning process. 10, and then FIG. 5 is a schematic diagram of a configuration of an image display system 500 including a display panel according to the present invention, including a display 300 having a display panel 2 of the present invention, such as a liquid crystal display. Or a 〇rganic light emitting device, etc., which can be part of an electronic device. In general, the image display system 500 includes a display 3 and a control unit 4, and the control unit is coupled to the display 300 to transmit signals to the display to cause the display to display no image. The electronic device described above can be a mobile phone, a digital camera, a personal digital assistant (PDA), a notebook computer, a desktop computer, a television, a car display, a digital photo frame, a global positioning system, or a portable DVD player. Although the present invention has been disclosed in its preferred embodiments, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the patent application is subject to the definition of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an organic electroluminescence display according to an embodiment of the present invention. 0773-A33894TWF_P2008035 〇 201015505. Fig. 2A is a partially enlarged view showing a broken line region 2A in Fig. 1. Fig. 2B is a partial enlarged view showing the broken line region 2B in Fig. 1. Figure 3 is a cross-sectional view showing a liquid crystal display according to an embodiment of the present invention. 4A to 4C are cross-sectional views showing a method of manufacturing a display panel according to an embodiment of the present invention. Fig. 5 is a view showing the configuration of a 影像 image display system including a display panel according to an embodiment of the present invention. [Description of main component symbols] 100 to 1st substrate; 100a1 to 1st outer surface; 102 to 2nd substrate; 102a to 2nd outer surface; 104 to organic electroluminescent layer; ❿106, 108 to acryl high Molecular film; 110~ point-like depression of thinned substrate; 111~ point-like protrusion of thinned substrate; 112~ point-like depression after polymer film covering; 113~ point-like protrusion after polymer film covering; 114~liquid crystal Layer; 116~upper polarizer; 118~lower polarizer; .120~backlight; 0773-A33894TWF P2008035 10 201015505
200〜顯示面板； 300〜顯示器； 400〜控制單元； 500〜影像顯示系統。 0773-A33894TWF P2008035 11200~ display panel; 300~ display; 400~ control unit; 500~ image display system. 0773-A33894TWF P2008035 11