201002639 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種脆性材料基板之加工方法，係對脆 性材料基板掃描雷射以進行局部加熱，其次沿加熱部位進 行冷卻，藉此利用於基板表面與基板内部之間產生的熱應 力形成有限深度之裂痕。本發明係關於下述之脆性材料基 板之加工方法，沿設定於基板之劃線預定線照射第一次之 雷射光束’於基板上形成由有限深度之裂痕構成的劃線， 其-人照射第2次之雷射光束，以使劃線更深地滲透或完全 地斷開。 二此處之脆性材料基板係指玻璃基板、燒結材料之陶 变、單結晶石夕、半導體晶圓、藍寶石基板、陶究基板等。 【先前技術】201002639 VI. Description of the Invention: [Technical Field] The present invention relates to a method for processing a brittle material substrate by scanning a laser for a brittle material substrate for local heating, and then cooling the portion along the heating portion, thereby utilizing the substrate The thermal stress generated between the surface and the interior of the substrate forms a crack of limited depth. The present invention relates to a method for processing a brittle material substrate, which is characterized in that a laser beam of a first time is irradiated along a predetermined line of a scribe line of a substrate to form a scribe line formed by a crack of a limited depth on a substrate, which is irradiated by a person. The second laser beam is used to make the scribe line penetrate deeper or completely. 2. The brittle material substrate herein refers to a glass substrate, a ceramic material of a sintered material, a single crystal stone, a semiconductor wafer, a sapphire substrate, a ceramic substrate, and the like. [Prior Art]
若使用對玻璃基板等之脆性材料基板照射雷射光束、 知#田形成於基板上井 立即噴吹減進μ加熱後 屬m二使其冷卻的雷射劃線加工方法，即能使碎 局之產生較使用刀輪箄機 千 面強度。 戒式加工更為減低’且能提升端 之破璃基板等所 ^ 在分割以平面面板顯示器 商的各種製程中，# 你知用雷射劃線加 ，係設定欲從該處分割之 藉由刀輪等於劃線預定線 ，從形成於開始端之初期 3 —奴而言，雷射劃線加工令 假想線（稱為劃線預定線）。接著， 之開始端即基板端形成初期龜裂 201002639 龜裂的位置沿劃線預定線掃描光束點及冷卻點（喷射冷媒之 區域）。此時’在基於劃線預定線附近所產生之溫度分布而 產生應力梯度的結果，即會形成線狀之裂痕（參照專利文獻 1、專利文獻2、專利文獻3)。 此外’藉由對脆性材料基板掃描雷射光束而形成之線 狀裂痕中’有裂痕之深度方向之前端未到達基板背面之「有 限深度之裂痕」、以及裂痕到達基板背面而使基板一次斷 開的「貫通裂痕」（參照例如專利文獻2)。 藉由如者之「有限深度之裂痕」而形成之切痕稱為劃 線，後者之貫通裂痕之分割線稱為全割斷線。此等係藉由 不同之方式形成。 3 圖7係以示意方式顯示形成有限深度之方式之基板的 =面圖。亦即，藉由先進行之雷射加熱，而如圖7(a)所示於 基板GA產生壓縮應力HR。其次，藉由加熱後之冷卻，而 示於基板表面產生拉伸應力CR。此時因熱之移 咖。其結果，即如圖7二干1形成内部之應力場 而形成裂痕Cr。 “度方向之應力梯度， 藉由上述方式形成裂痕Cr的條件中 於基板内部之壓縮應力場Hln往裂痕J 了阻止存在 渗透，裂痕係、在基板内部之'^ "之^木又方向進-步 理上裂痕Cr即形 ，'很應力％ mn前停止，原 I心成有限深度。因 在形成裂痕Cr之古’為了使基板完全斷開， u之有限深度之劃緩 處理。另一方面，裂#^垂 後，必須進一步進行裂斷 々r之釗線之加工端面非常漂亮（表面 201002639 凹凸小）且直進性優異，作 圖8孫、：乍為加工端面為理想狀態。 圖8係以示意方戎嚭- 〜 丁〜万式顯不形成貫通裂痕之 立體圖（圖8(a))與俯視圖（圖 ^ 、 之位置掃描之雷射光束之L())。亦即藉由從初期龜裂tr 應力HR。/ 束點批，使基板表面產生壓縮 應刀HR。同時，藉由位於 « ^ ^ ^ BS後方之冷卻點cS，使 基板表面產生拉伸應力CR。1社里 ^ L , w, , /、、，、。果，於掃描線上（劃線預定 广)形“後方向之應力梯度，藉由此應力梯度，產生 A知描線方向使基板左右裂開之 藉以使基板斷開。 $而开4貝通裂痕， 形成此「貫通裂痕」之情 达、 n^ 具有在不進行裂斷處理 之情況下即能使基板斷開（全 U王切斷）的優點，依加工用途之不 同雖亦有使用此方式之齡 断汗1車父it的情形，然而與上述劃線 之加工端面相較，有時會有 曰另王切畊線之加工端面之直進性 受損的情形’X’全切斷線之端面之漂亮程度（表面之凹凸） 與上述劃線相較其品質亦較差。 此外’藉*雷射劃線加工形成劃線或全切斷、線，係取 ，於加熱條件(雷射波長、照射時間、輸出功率、掃描速度 等)、冷卻條件(冷媒溫度、喷吹量、喷吹位置等)、基板之 板厚等。一般而言，玻璃基板之板厚較薄之情形與較厚之 情形相較’較容易成為全切斷線，能形成劃線之加工條件 之製程容許度較為狹窄。又，有越是急遽加熱基板或急遽 冷卻基板之越極端的條件，即越容易形成全切斷線之傾向。 土於上it h事’當欲對玻璃基板等進行端面品質優異 之y刀割加工時，係選擇不形成全切斷線而形成劃線之方式 201002639 的加熱條件、洽久卩狄μ 在雷㈣/ 雷射劃線，其後進行裂斷處理。 、s $加工後進行之裂斷處理方法，有利用機村 式之裂斷處理，亦gR收μ ^ ^ 即將裂斷具等緊壓於劃線以施加彎曲力 矩。在機械式裂斷^丨田+ 刀 力矩時即會產生碎： 當對基板施加較…曲 碎屬。因此，在須避免碎屑產生之製程中， 而儘可能地形成深童丨丨46 H ’並僅施加較小彎曲力矩來進w 心“因此，以往係進行以下之雷射裂斷處理：沿透過雷射 劃線加工形成之劏诗％/ 、由射 一 J線進仃弟二次之雷射照射，使有限 =更深地渗透(此時係進行再度裂斷處理)或使裂痕； 八斷4 (>知例如專利文獻1〜專利文獻3)。 文獻1 :日本特開2001 — 130921號公報 專利文獻2:日本特開2006- 256944號公報 專利文獻3: W〇2〇〇3/〇〇8352號公報 【發明内容】 述氣由第丨次之雷射照射進行用以形成書彳線之 雷射劃線加工，其次藉由筮7 &而& —]線之 藉㈣2次之㈣照射進行雷射裂斷 :里’即能實現可抑制碎肩產生之斷開加工。然； =線加卫、亦即藉由帛1次之雷射照射而形成之書4線: 即難以藉由其後之f射裂斷處理使裂痕到達基 此’«由雷射裂斷處理使基板完全 雷射劃線加工時先形成較深之劃線。 /員在 又’即使透過雷射裂斷處理不完全使基板斷開的情 201002639 形，在雷射劃線加工先形成較深之劃線，亦能在其後之雷 射裂斷處理中較容易地形成更深之劃線，因此非常理邦。田 此外，當欲藉由雷射劃線加工形成較以往技術深^ 線，則須變更以往形成劃線時之加熱條件或冷卻條件。具 體而言，需提高雷射輸出以增大加熱之熱輸入量，或增^ 冷卻時之冷媒噴吹量，設定成較以往更容易產生深度^向 差的極端條件，以增大於基板產生之深度方向的應 :而，若按照以往雷射劃線加工之加工步 增大應力梯度之加熱條件、A 丁主 r令部條件，即無法藉由 之雷射照射形成較深_的畫丨丨綠 至开n到㈣裂痕會貫通基板（移行 至形成貝通裂痕之方式），而 合妯，登姐+ 6玉 仏成王切斷線。亦即，藉由適 田^田i WJ線加工時之加熱條件^ ^ ^ 易地形成淺劃線，然而即使欲开m Pir、件耗車父各 件或冷卻停件…/使“成較爾’而將加熱條 件，即會有 用之條件稍微極端的條 虿了 t、5又疋之加熱條件或 或即使存在作可#执定夕~阁 丨惊件之耗圍不存在 定，導致突;二：爾輕容許度)亦狹窄而不穩 欲之較深劃線。 、、’“n卞件’而難以形成所 再者，除了移行至全切斷線 產生「弃弁7M外，亦會產生易 先订」現象的問題。所謂广 约 在劃線預定線L之開# 」’係指圖9所示， TR被開始端附近，形成於開 被先束點BS加熱時，在以光束點“龜裂 朝向光束點前$ < i > 加熱區域為起點 ⑴力^無法控制的方向 成裂痕K的現象。當 201002639 產生「先行」現象時，即盔 .....士， “，、法形成沿著劃線預定線L·之劃 線，劃、.泉之直進性顯著受損。 - 在欲形成較深劃線而卩 / s 踝而將加熱條件或冷卻條件調整至較 以往更極端之加埶條桦赤 主軍乂 ，、条件或冷卻條件時，上述「先行」現I 產生之頻率亦增高。 4尤订」現象 因此，本發明夕笛 1 。， *1| ί% ^ 4A Jl 的在於，提供能將有限深度之 里J，·泉所構成的劃線形成為 工 七^ 人~平乂白知技術具有充分深度的加 万法。 提供非透過全切斷線、而係能擴 或冷卻條件的製程容許度，能穩 又’第2目的在於， 大能形成劃線之加熱條件 定地形成劃線的加工方法 現象之劃 又，第3目的在於，提供不易產生「先行 線的加工方法。 又’本發明之目的在於提供-種脆性材料基板之加工 線：'I其能穩定地執行透過雷射劃線加工於基板形成劃 而雷射㈣處理使基板完全斷開或形成較深之 其:艮、加工。再者’本發明之目的在於提供-種脆性材料 暴板之力υ τ 士，-t +J. _ n / ’ “匕穩定地執行加工端面之端面品質優 "、的斷開加工。 法，為解決上述課題，本發明之脆性材料基板之加工方 線，係對脆性材料基板設定以基板端為開始端之劃線預定 對劃並沿劃線預定線形成有限深度之裂痕，其特徵在於·· 八缺線預定線之該開始端附近且自開始端往基板内侧方向 -J線預定線上的位置，壓接刀輪以形成與開始端分 201002639 離之初』龜4，其-欠，使藉由雷射照射而形成於基板面之 光束點 邊從開始端通過該初期龜裂上、一邊沿劃線預 定線相對移動，,Ι_μ ,、，u ,, 猎此W軟化溫度以下之溫度進行局部加 豸’ 2著藉由冷卻局部加熱後之區域之後方近處，以沿劃 線預疋線开v <以初自龜裂之位置為起點之有⑯深度的裂 痕。When a laser beam is irradiated onto a substrate such as a glass substrate, a laser beam is formed on the substrate, and immediately after the film is heated and reduced by μ, the laser scribe line is cooled. Produces a thousand face strength compared to the use of a knife wheel. The ring-type processing is further reduced, and the glass substrate of the end can be raised. In the various processes of dividing the flat panel display manufacturer, # you know to use the laser line to add, which is to set the direction to be separated from there. The cutter wheel is equal to the predetermined line of the scribe line, and from the initial stage of the formation of the start end, the laser scribe line is an imaginary line (referred to as a scribe line). Then, the initial end of the substrate end is formed with an initial crack. 201002639 The position of the crack is scanned along the line of the scribe line to scan the beam spot and the cooling point (the area where the refrigerant is ejected). At this time, as a result of the stress gradient generated in the vicinity of the predetermined line of the scribe line, a linear crack is formed (see Patent Document 1, Patent Document 2, and Patent Document 3). In addition, 'the crack in the depth direction of the crack in the linear crack formed by scanning the laser beam on the brittle material substrate does not reach the "limited depth crack" on the back surface of the substrate, and the crack reaches the back surface of the substrate to break the substrate once. "through crack" (see, for example, Patent Document 2). A cut formed by a "crack of a limited depth" is called a scribe line, and a dividing line of the latter through a crack is called a full cut line. These are formed in different ways. 3 Figure 7 is a schematic diagram showing the = surface of the substrate in a manner that forms a finite depth. That is, the compressive stress HR is generated on the substrate GA as shown in Fig. 7(a) by the laser heating performed first. Next, tensile stress CR is generated on the surface of the substrate by cooling after heating. At this time, it is because of the heat. As a result, a crack Cr is formed by forming an internal stress field as shown in Fig. 7 . "The stress gradient in the direction of the direction, the compressive stress field Hln in the substrate is formed in the condition of forming the crack Cr by the above-mentioned method, and the crack is prevented from being infiltrated, and the crack is formed in the inside of the substrate. - The crack on the step is the shape of the Cr, 'very stress% mn before stopping, the original I heart becomes a finite depth. Because of the formation of the crack Cr ancient 'in order to completely break the substrate, the finite depth of u is treated gently. Another On the other hand, after the crack #^ 垂, the machining end face of the 々 钊 必须 必须 必须 非常 非常 非常 非常 非常 非常 非常 非常 非常 非常 非常 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工By means of the schematic box - ~ Ding ~ Wan type does not form a perspective view of the through crack (Fig. 8 (a)) and the top view (Fig. ^, the position of the laser beam L ()). Cracking tr stress HR. / beam point batch, the surface of the substrate is compressed by the knife HR. At the same time, by the cooling point cS located behind the « ^ ^ ^ BS, the tensile stress CR is generated on the surface of the substrate. w, , /,,,,., fruit, on the scan line (dash The predetermined "longitudinal" stress gradient, by which the stress gradient is generated, causes the substrate to be split to the left and right to break the substrate. $4 cracks are opened, and the "through crack" is formed, and n^ has the advantage of being able to break the substrate (all U-cut) without cracking, depending on the processing purpose. Although there is a case in which the age of the sweating 1 car is used in this way, compared with the processed end face of the above-mentioned scribing, there is a case where the straightness of the processed end face of the other cutting line is damaged. The degree of beauty of the end face of the X' full cut line (concavity on the surface) is also inferior to the above-mentioned scribe line. In addition, 'lending* laser scribing processing to form a scribe line or a full cut, line, draw, under heating conditions (laser wavelength, irradiation time, output power, scanning speed, etc.), cooling conditions (refrigerant temperature, injection volume) , the position of the blowing, etc.), the thickness of the substrate, and the like. In general, when the thickness of the glass substrate is thin, it is easier to become a full cutting line than the case where it is thicker, and the process tolerance for forming the processing conditions of the scribe line is relatively narrow. Further, the more extreme the conditions of heating the substrate or rapidly cooling the substrate, the more likely the formation of the full cutting line is. In the case of the y-knife cutting process which is excellent in the end surface quality of the glass substrate, etc., the heating condition of the method of forming the scribe line without forming the full cutting line is selected, and the heating condition of the 201002639 is negotiated. (4) / Laser scribing, followed by cracking. , s $ processing after the crack treatment method, there is the use of the machine-type crack treatment, gR close μ ^ ^ is about to break the crack and so on the line to apply the bending moment. Fragmentation occurs when the mechanical split + field + knife torque is generated: when the substrate is applied to the genus. Therefore, in the process of avoiding the generation of debris, the deep virgin H 46 H ' is formed as much as possible and only a small bending moment is applied to enter the center of the heart. Therefore, in the past, the following laser rupture treatment was performed: Through the laser scribing process, the formation of the poems %/, by shooting a J line into the second generation of the laser, so that the finite = deeper penetration (in this case, re-cracking treatment) or cracks; 4 (Patent Document 1 to Patent Document 3). Document 1: JP-A-2001-130921 Patent Document 2: JP-A-2006-256944 Patent Document 3: W〇2〇〇3/〇 〇8352号 [Summary of the Invention] The gas is processed by the laser irradiation of the third time to form the laser scribing line of the book line, and secondly by the 筮7 &&-] line (4) 2 times (4) Irradiation for laser cracking: in the middle, it can realize the breaking process that can suppress the generation of broken shoulders. However, the line is added, that is, the book 4 line formed by the laser irradiation of 1 time: it is difficult By the subsequent f-split treatment, the crack reaches the base, and the substrate is completely laser-marked by the laser cracking treatment. The working line first forms a deeper line. / In the case of the 201002639 shape, which is not completely broken by the laser cracking process, the deeper scribing is formed in the laser scribing process. In the subsequent laser cracking process, it is easier to form a deeper scribe line, so it is very ethical. In addition, when it is desired to form a deeper line than the prior art by laser scribing, it is necessary to change the past to form a scribe line. Heating conditions or cooling conditions at the time. Specifically, it is necessary to increase the laser output to increase the heat input amount of heating, or increase the amount of refrigerant blowing during cooling, and set it to be more prone to the depth of the difference than before. The condition is to increase the depth direction of the substrate: if the heating condition of the stress gradient is increased according to the processing steps of the conventional laser scribing process, and the conditions of the A main ring, the laser irradiation cannot be performed by the laser irradiation Forming a deeper _ painting green to open n to (four) cracks will penetrate the substrate (moving to the way to form Betong cracks), and the combination, Dengjie + 6 Yuxi Cheng Wang cut line. That is, by Heating conditions for the processing of the Wada line of the Tiantian ^ Tian ^ ^ ^ A light scribe line is formed, but even if you want to open m Pir, the pieces of the car, or the cooling stop parts.../"Make the ball", the heating conditions, the conditions that will be useful are slightly extreme, t, 5 The heating condition of the 疋 或 或 或 或 或 执 执 执 执 执 执 执 执 ~ 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨It is difficult to form a "n" piece. In addition to moving to the full cutting line, the problem of "preempting the order of 7M is also easy to order". The so-called broadly defined line L is open # ”', which means that the TR is near the beginning end, and is formed when the opening is heated by the pre-beam point BS, and the beam point is “cracked toward the beam spot”. < i > The heating zone is the starting point (1) force ^ can not be controlled in the direction of the crack K. When 201002639 produces the "first" phenomenon, that is, the helmet ..... Shi, ",, the law is formed along the line The straight line of the line L·, the stroke, and the spring is significantly impaired. - In the case of a deeper line, 卩 / s 踝 and the heating or cooling conditions are adjusted to be more extreme than ever. When the main army, conditions, or cooling conditions, the frequency of the above-mentioned "first move" is also increased. 4 special order phenomenon. Therefore, the present invention eve flute 1 . , *1| ί% ^ 4A Jl lies in the ability to form a scribe line formed by a limited depth of J,··································· Providing a process tolerance that is not a full-cut line, but capable of expanding or cooling conditions, and can be stabilized. 'The second purpose is to create a process for forming a scribe line by heating conditions that can form a scribe line. A third object is to provide a processing method that is less prone to "preemptive lines." The object of the present invention is to provide a processing line for a brittle material substrate: 'I can stably perform laser scribe line processing on substrate formation. The laser (4) treatment completely breaks the substrate or forms a deeper one: 艮, processing. Furthermore, the purpose of the present invention is to provide a force for a brittle material υ 士 , , -t +J. _ n / ' "The 匕 stable processing of the end face of the machined end face is excellent". In order to solve the above problems, the processing square wire of the brittle material substrate of the present invention is characterized in that a crack is formed on the brittle material substrate with a scribe line at the beginning of the substrate end and a finite depth is formed along the predetermined line of the scribe line. In the vicinity of the beginning end of the eight-definition line and from the starting end to the inboard direction-J line on the predetermined line, the cutter wheel is crimped to form the starter end 201002639 from the beginning of the turtle 4, which - owed The beam spot formed on the substrate surface by laser irradiation is relatively moved along the predetermined line from the start end through the initial crack, and Ι_μ , , u , , , , , , , , , , , The temperature is locally twisted' 2 by cooling the area after the local heating, to open the v-line along the scribe line, and there is a 16-depth crack starting from the position of the crack.
根據本發明，當於劃線預定線上形成初期龜裂時，初 龜4之形成位置並非脆性材料基板之基板端而係自基板 端稍往基板内側方向分離之位置，以使初期龜裂與基板端 刀離初期龜裂’係藉由將刀輪往劃線預定線之方向塵接 而形成，初期龜裂之方向係朝向劃線預定線之線方向。並 次，使光束點沿劃線預定線相對移動，藉此從劃線預定線 之開始端通過初期龜裂上而局部加熱基板。進而，冷卻局 部加熱後之區域的後方近處。此時，由於在基板端不存^ 初期龜裂，因此裂痕不會自基板端行進。接著，使光束點 =基=前進，將稍微分離之位置之初期龜裂上 =嶋面產生㈣應力而使龜裂不會行進)，進而稍 在已冷卻初期龜裂上之時點(此時因於初期龜裂表 、生拉伸應力而於初期龜裂内部產生壓縮應力）， 初期龜裂為起點之有限深度的裂痕。 y 此時’即使於基板端附近形成前後方向（劃線預定線方 :應力分布而產生往左右拉斷之力(誘導全切斷線之 於在基板端未形成有初期龜裂，因此 板端行進之全切斷線。接著，-旦形成以初期二I: 9 201002639 之有線深度之裂痕後，其後即隨著光束點之掃描在劃線預 定線上連續形成有限深度之裂痕，而形成所欲之劃線。如 上述，由於營造了-種不易形成全切斷線的狀況，因此即 使不將光束點之加熱條件或冷卻條件變更為較以往更極端 的條件，亦不會移行至全切斷線，取而代之地係形成 之劃線。 根據本發明，在進杆雪射查丨φ 選仃雷射釗線時，不易形成全切斷線， 且能擴大能形成有限深度之裂痕所構成之劃線的製程容許 度（可供設定之加熱條件或冷卻條件之範圍）。其 定地形成劃線。 此^ 又’根據本發明’即使不將雷射劃線之 Μ、冷卻條件）變更為較以往更極端㈣件，㈣㈣: 全切斷線，而能形成劃線。其处 σ 肊形成較以往深之劃 線。再者，由於不於基板端形成裂痕，因此 現象之產生。 j无订」 上述發明令’亦可使用於刀尖形成有週期槽之且槽部 刀輪來作為刀輪。 < 僧4 X ’上述發明中，劃線 分齙辟雜」線預足線之開始端至初期龜裂的 刀離距離亦可為2nini〜7mm 0 又，為解決上诚4里eg + # 边诔4之其他脆性材料基板之加工方 法’係沿设定於腺姓分利_苴化 脆〖生材枓基板之第丨基板 之劃線預定線，以下诚牛“ 2隸"而 進行加工。 ^驟進行二度雷射照射以對該基板 ()、執仃第1初期龜裂形成步驟’係於第i基板端 10 201002639 附近之劃線預定線上，以與"基板端分離之方式於基板 内側形成第i初期龜^。⑻其次執行雷射劃線步驟，使第 1次雷射照射之光束點自第i基板端側沿劃線預定線相對移 動至第2基板端’而將基板以軟化溫度以下之溫度加熱， 且對光束點通過後之部位立即噴吹冷媒以使其冷卻，藉以 利用產生於劃線預定線之深度方向之應力梯度沿劃㈣定 線形成有限深度的劃線。 f 此時，藉由適當地選擇光束點之加熱條件、冷卻點之 々部條件，而能形成基 度方向之應力梯度形成之有限 :度的裂痕所構成的劃線’而不致形成全切斷線。具體而 二T於設定使基板表面之溫度差變為極端之加熱條件 (舍!如增大雷射輸出）或冷卻條件（例如增大冷媒噴射量），即 有^劃線更容易形成為全叫線的傾向，因此係 或冷卻條件較成過於極端之條件。不㉟，由於在 成初期4裂’因此不易產生從基 之全切斷線，而能選擇 # ^ 1私谷δ午度增大，因此能以溫度 力:熱:條件、冷卻條件進行雷射劃線加工。 第丨Α ;、人執饤第2初期龜裂形成步驟’於第1基板端或 弟1基板端與第1初期龜 者形成第2初期龜裂。…“間之劃線預定線之至少任一 進方内的七：在人雷射裂斷步驟時將用以誘導裂痕之行 Γ向的切痕先形成於第1基板端附近。 (d)其次執行雷射穸 點沿則線自第〗其此、V驟，使第2次雷射照射之光束 基板端相對移動至第2基板端，而使劃線 201002639 進一步滲透或完全地斷開。 藉此，能使裂痕自笫1 A 4 民目弟1基板端行進至第2基 確實地形成裂痕，且能誘導藉由t 而而 守和田弟2初期龜裂而形 基板端附近的裂痕之行淮大A :第1 《仃進方向，因此能防止形成 現象之無法控制的裂痕。 无仃」 根據本發明，能將雷射查丨丨# 土 宙射劃線步驟所形成之劃 較深的劃線，或能簡單地進行斷開加工。 成為 又，在進行雷射劃線加工時，由於能擴大可 製程容許度（作為加卫條件能以的範圍），因此能使用= 往極端之加熱條件、冷卻條件形成較深的劃線。又，^ 形成較深之劃線，❼能使 容許度（作為加工條件能設定的範 衣 〜）乾图）擴大，可在不移 :斷之狀態下穩定地將劃線形成為較深或穩定地完全: 上述⑷之第2初期龜裂形成步驟中，第2初期龜裂係 沿該劃線預定線"1基板端連續形成至第！初期龜裂：' 精此，藉由在次-雷射裂斷步驟時，使裂痕沿劃線預 疋線U1基板端行進至第1初期龜裂，巾能完全解決先 行現象。 a又，上述發明中，帛1初期龜裂及第2初期龜裂亦可 藉由壓接刀輪而形成。#此，即使在與基板端分離之基板 面上，亦可確實地形成細切痕的初期龜裂。 特別是，藉由使用於刀尖形成有週期槽之刀輪，在刀 板面變得不易滑動’而於與基板端分離之位置形成 12 201002639 初期，裂時’能僅滾動較短之距離（1_〜2_左右㈣實 地形=穩疋之初期龜裂。作為於刀尖形成有 具體而言可使用三星鑽石工業股份有限公司製之 南^ P刪Τ」（註冊商標）或厂州〇」（註冊商標）。 护成，第2述第1初期龜裂亦可藉由壓接刀輪而 :成…期龜裂亦可藉由…初期龜裂上朝向第〗 基板鈿側之雷射的部分地照射而形成。 細切上之第1初期龜裂可藉由刀輪罐實地形成 Γ 期龜裂。又，關於第2初期龜裂，由於已形成 第I初期龜裂’因此能藉由自第"刀期龜裂上朝向 板端側之雷射的部分地照射 土 初期龜裂。 使裂襄仃進，藉以誘導第2 助森又i上述發明中，第2初期龜裂亦可形成為較第1初 刀輪=接=體而言’只要在形成例如第2初期龜裂時之 的壓接力較形成第1初期龜裂時強即可。 痕二：能在接著進行之雷射裂斷步驟中簡單地加深裂 【實施方式】 以'下’根據圖式說明本發明之實施形態。 之基板加 μ教初’ §兒明實施本發明之加工方法時所使用 工裝置一例。 圖1係能 的概略構成圖 實施本發明之加工方法之基板加工裝置[μ 。此處雖以加工玻璃基板之情形為例進行說 13 201002639 明’但石夕基板等之脆性材料基板亦相同。 首先’說明基板加工裝置LS1 於水平架台！上平行配置之一對導軌3、4:成。設有沿著 方向（以下稱為Y方向)上往復移動的滑動广紙面前後 於兩導軌3、4之間沿著前後方向配置有導：2。且形成為: 螺桿5上螺合有固定於滑動台2之固定件桿於該導 (未圖示）使導螺桿5正、反轉動，使，並藉由以馬達 4往復移動於γ方向上。 0 2沿著導軌3 ' 於滑動台2上配置有沿著導軌8往復 右方向（以下稱為.X方向）之水平台座7移於動二圖，左 上之支架10a上貫通螺合有以馬達9轉動 疋：。座7 由導螺桿1()正、反轉動，使台座7沿著導轨:、干1〇，藉 X方向。 導轨8在後移動於 °又置有以旋囀機構11轉動之旋轉a 12 玻璃基板Λ在水平$# 心奴轉。12’. 隹Κ千之狀惡下安裝於該旋轉台12上。 基板Α係例如用热t t 上 Θ玻: ;切出較小單位基板之母基 11係使旋轉二达+ 士 甘基板。钛轉機: 寻α 1 2、、’凡垂直之查由綠棘 i形士 形成為可以相對於. 置成為任意旋轉角声$古_^隹名击· 藉由吸m门 轉。又，玻璃基板 由及引失碩固定於旋轉台12上。 於疑轉台12之上方，雷射裝置13與光學保持器14 持於安裝框架15上。 ° 雷射辦：® 1 ο 、， ’作為脆性材料基板之加工用途，使用通 常之雷射裝置即可’具體而言，使用準分子雷射、雷 射、一軋化碳雷射或一氡化碳雷射等。於玻璃基板Α之加 14 201002639 工中，較佳為使用可振盪出# 之 '念且 匕 遘出破螭材料之能量吸收效率較大 之波長之光的二氧化碳雷射。 大 自雷射裝置13射出之命如业 光束點驻古田之田射先束，其預先設定之形狀之 ,iD„ 乃正先束形狀之透鏡光學系統的光 :=14照射至破瑪基板“。關於光束點之形狀，雖 輛之形請圓形、長圓形等）可沿著劃線預定線 二：地進行加熱這-方面較為優異，但只要可在低於軟 化 >皿度之溫度下進行加埶 …、之形狀，光束點之形狀並無特別 限…實施形態中係形成搞圓形狀之光束點。 於安裝框架15,接近光學保持器14設置有冷卻嘴μ。 “由冷Μ 16進行噴射。冷媒可使用冷卻水、壓縮空氣、 氦乳、二氣化碳等，於本實施形態中係喷射麼縮空氣。從 冷αρ觜16噴射出之冷卻媒體朝向自光束點之左端稍微分離 的位置’ II以於玻璃基板Α表面形成冷卻點。 红又，於安裝框架15透過升降機構17安裝有具週期槽 部之刀：18。該刀輪18係在於玻璃基板A形成初期心 ΤΓ時，從破螭基板A上方暫時地下降而使用。 圖j係具週期槽部之刀輪的示意圖，圖2(a)係前視圖， 圖2(b)係側硯圖。此具週期槽部之刀輪1 8係沿刀尖〖8a週 Ή生地形成有槽部1 8b(此外，圖2中為了方便說明，係將 於刀j 18a之槽部丨8b的大小較實際更為誇張地插繪）。具 體而σ係按照1〜2〇mm之刀輪徑，在20# m〜200 # m的矿 圍没f槽間矩。又，槽深為2# m〜2500 /i m。 — 起用上述特殊刀尖之刀輪’不僅能形成較不具槽 15 201002639 二地Γ透的裂痕’且刀尖不易於基板面滑動， 左右)時，能僅㈣較^距離（―〜2麵 、土板面確貫地形成初期龜裂。 又’於基板加工與罢r 基板A上之用於〜\ .、 搭載有可檢測刻印於玻璃 ^ m 20 ;疋之對準標記的攝影機20，可自藉由攝 衫機20所檢測出之 柯w馎 ^ ^ . 子皁私3己之位置求出設定於基板A上之 位置與旋轉台12的對應位置關係，並正確地 =77輪18之下降位置或雷射光束之照射位置可到達劃 線預定線上。 運sj 繼而’就上述基板加工裝置LS1之加工動作進行說明。 圖3係顯示藉由第i次雷射照射而形成有限深度之劃線為 止之雷射劃線加之加工動作步驟的圖，圖4係顯示藉由 第2次雷射照射而進行雷射裂斷處理為止之加工動作步驟 的圖。此外，圖3、圖4中僅圖示圖i之主要部位。乂 首先，如圖3(a)所示，將玻璃基板a載置於旋轉台a 之上，且以吸引夾頭固定。藉由攝影機2〇(圖1}檢測出刻印 於玻璃基板A之對準標記（未圖示），並根據其檢測結果，建 立劃線預定線、旋轉台12、滑動台2、台座7之位置關係。 之後’使;5疋轉台12以及滑動台2作動，以將位置調敕成'刀 輪1 8之刀尖方向與劃線預定線之方向一致。 其次，如圖3(b)所示，使台座7(圖1}作動以使旋轉台 12移動，以使刀輪18來到玻璃基板a中將形成第i初期^ 裂之第1基板端A1附近且與第1基板端A1分籬夕a "哗 < 位置的 上方。 16 201002639 其次，如圖3(c)所示，使升降機構17作動而使刀輪η 下降。接著使刀尖壓接於基板A以形成第i初期龜裂二卜 此時使台座7移動2mm左右而在基板上使刀輪18滾動Γ，藉 以確實地形成穩定之第1初期龜裂ΤΠ。 曰 其次，如圖3(d)所示，使升降機構π及旋轉台丨2返 回原來的位置（圖3⑷之位置），並使雷射袭置13作動以昭 射雷射光束。且自冷卻嘴16嘴射冷媒。此時照射之雷射輸According to the present invention, when the initial crack is formed on the predetermined line, the initial position of the initial turtle 4 is not the substrate end of the brittle material substrate but is separated from the substrate end toward the inner side of the substrate, so that the initial crack and the substrate The end knife is formed from the initial cracks by dusting the cutter wheel in the direction of the line to be scribed, and the direction of the initial crack is directed toward the line of the predetermined line. Then, the beam spot is relatively moved along the predetermined line of the scribe line, whereby the substrate is locally heated by passing the initial crack from the beginning end of the predetermined line of the scribe line. Further, the rear portion of the region after the local heating is cooled is cooled. At this time, since there is no initial crack at the substrate end, the crack does not travel from the substrate end. Next, the beam point = base = forward, the initial crack at the position where the separation is slightly = the (four) stress is generated on the surface, and the crack does not travel), and the time is slightly at the initial cracking of the cooling (at this time) In the initial crack table, the tensile stress is generated in the initial crack, and the initial crack is a crack of a limited depth at the starting point. y At this time, even if the front-back direction is formed near the end of the substrate (the predetermined line is drawn: the stress is distributed and the force is pulled to the left and right) (the initial cut line is induced to form an initial crack at the substrate end, so the plate end The full cut line of the travel. Then, after the crack of the wire depth of the initial two I: 9 201002639 is formed, the crack of the finite depth is continuously formed on the line of the scribe line as the beam spot scans, and the formation is formed. As described above, since it is difficult to form a full cutting line, it is not possible to move to full cutting without changing the heating conditions or cooling conditions of the beam spot to more extreme conditions than before. The broken line is replaced by a line formed by the ground. According to the present invention, when the snow ray is selected, the full cutting line is not easily formed, and the crack which can form a limited depth can be enlarged. The process tolerance of the scribe line (the range of heating conditions or cooling conditions that can be set). The scribe line is formed in a predetermined manner. This is further modified according to the present invention, even if the laser scribe line and the cooling condition are not changed. More To the more extreme (four) pieces, (four) (four): Fully cut the line, and can form a line. The σ 肊 forms a deeper line than the previous one. Moreover, since no crack is formed at the end of the substrate, the phenomenon occurs. The above invention can also be used as a cutter wheel in which a groove groove is formed in a blade groove. < 僧4 X ' In the above invention, the start end of the line pre-foot line is crossed. The distance from the knife to the initial crack can also be 2nini~7mm 0. In order to solve the processing method of the other brittle material substrate of Shangcheng 4li eg + #边诔4, the system is set to the gland name and distribution. The line of the ruthenium of the 丨 〖 枓 枓 , , , , , , , , , 诚 诚 诚 诚 诚 诚 诚 诚 诚 诚 诚 诚 诚 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The forming step is performed on the scribe line near the i-th substrate end 10 201002639, and the i-th initial turtle is formed on the inner side of the substrate so as to be separated from the substrate end. (8) Next, the laser scribing step is performed to make the first time The beam spot of the laser irradiation is relatively moved from the end side of the i-th substrate along the predetermined line of the scribe line to the second base At the end of the plate, the substrate is heated at a temperature lower than the softening temperature, and the refrigerant is immediately blown to the portion where the beam spot passes to be cooled, whereby the stress gradient generated in the depth direction of the predetermined line is drawn along the line (4). A scribe line having a finite depth is formed. f At this time, by appropriately selecting the heating condition of the beam spot and the crotch condition of the cooling point, the formation of the stress gradient in the direction of the base can be formed: the scribe line formed by the crack of the degree 'Do not form a full cut line. Specifically, the second T is set to a heating condition that causes the temperature difference of the substrate surface to become extreme (for example, to increase the laser output) or to cool the condition (for example, to increase the amount of refrigerant injection), that is, It is easier to form a line as a full line, so the system or cooling conditions are more extreme. It is not 35, because it is 4 cracks at the beginning of the formation, so it is not easy to produce a full cut line from the base, and it is possible to select #^1 private valley δ midday increase, so laser can be performed with temperature force: heat: condition, cooling condition Scribing processing. In the second initial crack formation step, the second initial crack is formed at the first substrate end or the first substrate end and the first initial turtle. "Seven of the at least one of the predetermined lines of the line between the two lines: in the human laser cracking step, the incision for inducing the crack is formed in the vicinity of the first substrate end. (d) Secondly, the laser beam is executed along the line, and the beam substrate end of the second laser beam is relatively moved to the second substrate end, so that the scribe line 201002639 is further penetrated or completely disconnected. Thereby, the crack can be surely formed from the substrate end of the 1A 4 Minmu 1 base to the second base, and the crack can be induced by the t and the initial crack of the Tiandi 2 and the crack near the end of the substrate can be induced. Xinghuai A: No. 1 "In the direction of advancement, it is possible to prevent uncontrollable cracks in the formation of phenomena. Innocent" According to the present invention, it is possible to form a deeper stroke by the laser scribing step The scribing, or simply can be broken. In addition, when the laser scribing process is performed, the allowable process tolerance (the range which can be used as the urging condition) can be expanded, so that it is possible to form a deep scribe line using the extreme heating conditions and cooling conditions. In addition, ^ forms a deeper scribe line, and the 容许 can enlarge the allowability (the stencil as a processing condition can be set), and can stably form the scribe line to be deep or in the state of no change: Stablely complete: In the second initial crack forming step of the above (4), the second initial cracking system is continuously formed along the predetermined line of the scribe line "1; Initial cracking: 'In this case, by the step of the secondary-laser cracking step, the crack is advanced along the scribe line U1 substrate end to the first initial crack, and the towel can completely solve the first phenomenon. Further, in the above invention, the initial crack of the crucible 1 and the second initial crack may be formed by crimping the cutter wheel. #This, even in the surface of the substrate separated from the substrate end, the initial crack of the fine cut can be surely formed. In particular, by using a cutter wheel having a periodic groove formed in the cutting edge, the blade surface becomes less slidable, and at the position separated from the substrate end, 12 201002639 is initially formed, and the crack can be rolled only by a short distance ( 1_~2_左右(4) Real terrain = initial crack of the stable. As a specific form of the tool tip, you can use the South Diamond Factory Co., Ltd. (registered trademark) or the factory. (registered trademark). Protection, the first initial crack can also be obtained by crimping the cutter wheel: the crack can also be caused by the initial crack on the side of the substrate. It is formed by partial irradiation. The first initial crack on the fine cut can be formed in the turf crack by the cutter wheel can. In the second initial crack, since the first initial crack is formed, it can be used. In the first part of the invention, the second initial crack can also be used to induce the second crack in the first part of the invention. Formed to be smaller than the first knives=connection body' as long as the formation of, for example, the second initial crack The relay can be stronger than when the first initial crack is formed. Trace 2: It can be simply deepened in the subsequent laser cracking step. [Embodiment] The embodiment of the present invention will be described with reference to the drawings. An example of a work apparatus used in carrying out the processing method of the present invention is shown in Fig. 1. Fig. 1 is a schematic view showing a substrate processing apparatus for performing the processing method of the present invention [μ. Here, a processed glass substrate is used. For example, it is said that 13 201002639 ′′, but the brittle material substrate such as the Shishi substrate is the same. First, the substrate processing apparatus LS1 is arranged in parallel with the horizontal rails! The front surface of the sliding paper that reciprocates in the direction (hereinafter referred to as the Y direction) is disposed in the front-rear direction between the two guide rails 3 and 4, and is formed as follows: The screw 5 is screwed and fixed to the slide table 2 The stator rod rotates the lead screw 5 forward and reverse in the guide (not shown), and reciprocates in the γ direction by the motor 4. 0 2 is arranged along the guide rail 3' on the slide table 2 The guide rail 8 reciprocates to the right direction ( The water platform seat 7 called the "X direction" moves to the second figure, and the upper left bracket 10a is screwed with the motor 9 to rotate. The seat 7 is rotated forward and reverse by the lead screw 1 () so that the pedestal 7 is along Guide rail: dry 1 〇, by X direction. The guide rail 8 is moved behind at the same time and is rotated with the rotation of the rotary mechanism 11 a 12 glass substrate 水平 at the level $# heart slave. 12'. The substrate is mounted on the rotating table 12. The substrate is made of, for example, hot tt; the mother substrate 11 of the smaller unit substrate is cut to rotate the two + sigan substrates. Titanium transfer: α α 1 2,, 'Where the vertical check is formed by the green spine i-shaped can be relative to. Set to become an arbitrary rotation angle sound $ ancient _ ^ 隹 name hit · by sucking m door turn. Further, the glass substrate is fixed to the turntable 12 by the light guide. Above the suspected turntable 12, the laser device 13 and the optical holder 14 are held on the mounting frame 15. ° Laser Office:® 1 ο , , 'As a processing substrate for brittle materials, use a conventional laser device. Specifically, use excimer lasers, lasers, a rolled carbon laser or a glimpse Carbon laser and so on. In the case of the glass substrate 14 14 201002639, it is preferable to use a carbon dioxide laser which can oscillate the light of the wavelength of the energy of the rupture material. The large self-powered laser device 13 shoots out the life beam point in Gutianzhitian to shoot the first beam, its pre-set shape, iD„ is the light of the lens optical system of the first beam shape:=14 is irradiated to the broken matrix . Regarding the shape of the beam spot, although the shape of the beam is round, oblong, etc., it can be heated along the line 2: ground heating, but it can be used at a temperature lower than the softening degree. The shape of the beam is not particularly limited. In the embodiment, a beam spot having a round shape is formed. In the mounting frame 15, the proximity optical holder 14 is provided with a cooling nozzle μ. "The jetting is performed by the cold heading 16. The cooling medium can use cooling water, compressed air, mashed milk, carbon dioxide, etc., in the present embodiment, the air is injected. The cooling medium ejected from the cold αρ觜16 is directed toward the self-beam. The position where the left end of the dot is slightly separated 'II is to form a cooling point on the surface of the glass substrate. Red, a knife having a periodic groove portion is attached to the mounting frame 15 through the lifting mechanism 17. 18. The cutter wheel 18 is a glass substrate A. When the initial palpitations are formed, they are temporarily lowered from above the broken substrate A. Fig. j is a schematic view of a cutter wheel having a periodic groove portion, Fig. 2(a) is a front view, and Fig. 2(b) is a side view. The cutter wheel 18 having the periodic groove portion is formed with a groove portion 18b along the blade edge 8a (in addition, in FIG. 2, for convenience of explanation, the size of the groove portion 8b of the knife j 18a is actually larger than the actual size. More exaggeratedly inserted). Specifically, σ is according to the cutter wheel diameter of 1~2〇mm, and there is no f-slot moment in the mine of 20#m~200#m. Also, the groove depth is 2#m~2500 /im. — The cutter wheel that uses the above special tool tip can not only form a crack that is less than the slot 15 201002639. When it is not easy to slide the substrate surface, the left and right sides can be used to form the initial crack only on the surface of the substrate and the surface of the substrate. The camera 20 equipped with an alignment mark that can be detected and printed on the glass can be obtained from the position of the ke w馎^^. The positional relationship between the position on the substrate A and the rotary table 12, and correctly = the falling position of the 77 wheel 18 or the irradiation position of the laser beam can reach the predetermined line of the scribe line. Then sj and then the processing of the above substrate processing apparatus LS1 Fig. 3 is a view showing a laser scribing process in which a stencil of a finite depth is formed by the i-th laser irradiation, and a processing operation step, and Fig. 4 shows a second laser irradiation. Fig. 3 and Fig. 4 show only the main parts of Fig. i. First, as shown in Fig. 3(a), the glass substrate a is placed on the rotation. Above the table a, and fixed by the suction chuck. The image is detected by the camera 2〇 (Fig. 1) The alignment mark (not shown) of the glass substrate A is used, and based on the detection result, the positional relationship between the predetermined line of the scribe line, the rotary table 12, the slide table 2, and the pedestal 7 is established. Then, the 疋 turntable 12 and the slide are slid. The table 2 is actuated to adjust the position to the direction of the cutting edge of the 'cutter wheel 18' which coincides with the direction of the predetermined line of the scribe line. Next, as shown in Fig. 3(b), the pedestal 7 (Fig. 1} is actuated to rotate The stage 12 is moved so that the cutter wheel 18 comes to the vicinity of the first substrate end A1 where the i-th initial crack is formed in the glass substrate a, and is spaced apart from the first substrate end A1 by a "哗< 16 201002639 Next, as shown in Fig. 3(c), the lifting mechanism 17 is actuated to lower the cutter wheel η. Then, the blade edge is pressed against the substrate A to form the i-th initial crack. At this time, the pedestal 7 is moved by about 2 mm to roll the cutter wheel 18 on the substrate, thereby reliably forming a stable first initial crack. Next, as shown in Fig. 3(d), the elevating mechanism π and the rotary table 2 are returned to the original position (the position of Fig. 3 (4)), and the laser beam 13 is actuated to illuminate the laser beam. And the refrigerant is sprayed from the nozzle of the cooling nozzle 16. Laser exposure at this time
出或冷媒噴射量等之加熱條件、冷卻條件，係設定在合 於第1初期龜裂Trl之位置彦咮曰 屋生貝通裂痕（亦即不成為全切 斷）的範圍内。 ^ '入叩、印1泰板端A1)分 離而形成於基板内側位置，因此即使於第i基板端 往左右拉裂的力（使之成為全切斷狀態之力），第 A1、仍係難以產生裂痕的狀態，因此與預先於基板端二形 成初期龜裂之情形相較，不易成 ^ 取局王切断。又，關於所昭 射之雷射輸出或冷媒喷射量等加 、…、 擇不致成為全切斷之條件的製程容 選 ^ °午度係增加。因此，作 為所汉疋之加熱條件或冷卻條件， -a- 1 t, 疋可遙擇較初期龜裂开名 成於基板端扦更極端之條件、亦即 甘A , J也成更味劃線的條件。 其二人，如圖3(e)所示，使台座 A上之+射伞7移動，以使形成於基板 A上之雷射先束的光束點及來自 做 沿劃線預定線掃描。 鳥之冷媒的冷卻點The heating conditions and the cooling conditions such as the amount of the refrigerant to be ejected or the like are set within the range of the position of the first initial crack Tr1, which is the position of the Yantong House, which is not completely cut. ^ 'Input 叩, 印 1 Thai plate end A1) is separated and formed at the inner side of the substrate, so even if the force is pulled to the left and right at the i-th substrate end (to make it the force of the fully-cut state), the first A1 is still Since it is difficult to generate a crack, the initial crack is not formed in comparison with the case where the initial crack is formed in advance at the substrate end. In addition, the process selection of the laser output or the amount of refrigerant injection, etc., which is not the result of the full cut, is increased. Therefore, as the heating condition or cooling condition of the sputum, -a- 1 t, 疋 can be selected to be more extreme than the initial crack, which is the condition that the substrate is more extreme, that is, Gan A, J is also more delicious. Line conditions. The two, as shown in Fig. 3(e), move the +-shooting umbrella 7 on the pedestal A to cause the beam spot of the laser beam formed on the substrate A to be scanned from the predetermined line along the scribe line. Cooling point of bird's refrigerant
藉由以上動作，於基板A m ^ ,, 现乂弟1初期龜裂Tr】> 4置為起點之由有限深度之裂 之 、Γ所構成的劃線。接著， 17 201002639 在不致成為貫通裂痕之範圍内適當地選擇 ::斷::Γ:極端條件)雷射之加熱條件或二= 卩 板Α之第]… 成的較深劃線。此外，於基 '之第^期龜裂Trl側之基板端(第】基板端 未形成有裂痕Cr的區域。 ）子在 其次，說明雷射裂斷處理。 之位=4⑷所不’使旋轉纟12返回原來的位置（圖3(a) ，並使升降機構17作動以使刀輪18下降。 其次，如圖4(b)所示，使基板 接近，使刀輪18抿接於莖…”刀輪18移動成彼此 2初期龜裂Tr2。此時亦可# # μ ^ 々珉第 .%亦可使旋轉台丨2持續移動，使第2 初期龜裂丁r2連續形成至第1初期龜裂Trl。 弟 又，亦可藉由改變壓接力將第2初期 :。1初期龜…。此時，能如後述將裂痕簡單地= 其次，如圖4(c)所示，使升降機構η 座7)返回原來位置（圖3⑷之你^ Ah疋轉〇12(台 、口 j(a)之位置），使雷射裝置〗 照射雷射光束。此時昭射帝 後述。 、、田射輸出等之加熱條件，留待 其次，如圖4⑷所示’使基板A移動，以將形成於基 板A上之光束點沿劃線 、 丄裏從弟1基板立而A1朝向第2基板端 田曰，由於以第2初期龜裂Tr2(亦即第i美板 A1)為起點使較深裂痕心2沿 反而 化W痕Cr(劃線）仃進，因此 較以往深之劃線形成至第2基板端八2。 了將 18 201002639 此處，說明雷射裂斷處理時之加熱條件。雷射輸出等 之加熱條件，雖亦可與帛i次雷射照射時相同，但最好係 設定成如下。 在雷射裂斷處理中，係設定成使掃描速度較第1次雷 射”?、射時更快’縮短在劃線上之各點的加熱時間（雷射輸出 α又疋成車又同），且對劃線表層僅加熱短時間。其理由在於， 如此可在基板表層與基板内部之間形成用以使裂痕Cr深入 滲透的應力梯度。 圖5，係以示意方式顯示將在雷射裂斷處理時形成之應 力梯度的截面圖。短時間加熱基板表層而形成加熱區域Η。 接著，於基板表層形成較大壓縮應力HR，受到其影響使基 板内P產生相反之拉伸應力CR。當於基板内部存在裂痕。 時，拉伸應力即集中於裂痕Cr前端，其結果，裂痕。可 更深地滲透。 若逐漸增長基板表層之加熱時間，熱即傳遞至基板内 部使產生於深度方向之溫度差變小。其結果使深度方向之 應力梯度變弱。因，b，在雷射裂斷處理中，為了設定易於 基板表層形成壓縮應力、於基板内部形成拉伸應力之加執 條件、冷卻條件，最好選擇在基板不敕化之溫度範圍内於 短時間内強烈加熱的加熱條件…亦可藉由在加熱前預 先噴吹冷媒先予以冷卻’即能使深度方向之溫度差變大， 以較容易於基板内部產生拉伸應力。 又，說明藉由將第2初期龜裂形成為較第"刀期 即能簡單地形成更深之劃線的理由。 ’ 19 201002639 乂垠成於第1基板端A】附近^ ^ ^ ^ ^ 裂m作為雷射裂斷處理的開#，以2初期龜 痕前端之初期位晋…開始〜、將拉伸應力集中之裂 雷射照射，藉此深位置。在此狀態下進行 拉伸應力集層強烈之㈣力。藉此， 端之距離越長至苹二'前端，基板表面至裂痕前 力里（力矩）作用於拉斷 乂大 地滲透。 之方向’因此能使裂痕簡單 士上述，在雷射裂斷處理時， 端之第2初期龜裂朝^ 肖由^成於弟1基板 乃_碳朝向弟2基板端照射第 而能形成較以往更深 之田射'、、'射， 衣取irz所構成的書丨丨綠， 也 痕Cr2深達背面時即 一 虽4 藉由此方切/ 斷處理使基板完全斷開。 , 工^成之斷開面非常漂亮且直進性優異，你 為加工端面為理想狀態。 、乍 其次，說明本發明之第2實施形態之加 藉由雷射照射形成第2初期龜裂此處’ 形態之加工方法之雷射裂斷步驟之加實施 外，至雷射劃線㈣為止均與圖3相同 藉由與至圖3(e)為止之步驟相同 /月。 板Α形成以第"刀期龜裂Trl之位置為 之裂痕&所構成的劃線。在此狀態下移行菜度 如圖6⑷所示’使旋轉台12稍微送回 广理。 龜裂Trl來到光學保持器14下方。 使弟ί初期 其次》如圖6(b)戶/f + ^ hx y. ()戶“，使雷射裝置13作動以照射雷射 20 201002639 光束，藉以加熱第i初期龜裂Trl，且使旋轉台台座7) 移動，使光束點往第丨基板端A1側移動。 = 第丄初期龜㈣朝向第丨基板端A1行進，而將^ = 龜裂Tr2從第1基板端A1連續形成至第}初期龜裂。 其次，如圖6(c)所示，使旋轉台12(台座7)返回原來的 位置（圖3(a)之位置），並使f射裝置13作動以照射雷射光 束。 f 其次，如圖6(d)所示’使基板A移動，以將形成於基 、 板A上之光束點沿劃線從第1基板端A1朝向第2基板端 A2掃描。藉此’由於以第2初期龜裂加(亦即第】基板端 A1)為起點使較深裂痕Cr2沿裂痕Cr(劃線）行進，因此可將 卓父深之劃線形成至第2基板端A2。 此外，上述兩個實施形態中’雖均係第2初期龜裂連 續形成至第1初期龜裂，但只要初期龜裂彼此接近至某程 度，即使在未連續的情形下進行雷射裂斷處理，其結果仍 I 能形成連續的劃線。又，即使將第2初期龜裂Tr2僅形成 於第1基板& ’只要至第1初期龜裂為止的距離充分近， 即能形成連續的劃線。 本發明’能利用於將較深劃線形成於玻璃基板等之脆 性材料基板之加工’或利用於使之完全斷開的加工。 【圖式簡單說明】 圖1係在實施本發明之基板加工方法時所使用之基板 加工裝置的概略構成圖。 21 201002639 槽部之刀輪構成的圖。 一實施形態之加工方法之動 —實施形態之加工方法之動 射裂斷處理時形成之應力梯 另—實施形態之加工方法之 圖2(a)及（b)係顯示具週期 圖3(a)〜（e)係顯示本發明 作步驟一部分的圖。 圖4(a)〜（d)係顯示本發明 作步驟一部分的圖。 圖5係示意地顯示將在雷 度的截面圖。 圖6(a)〜（d)係顯示本發明 動作步驟一部分的圖。 圖7(a)〜（c)係以示意方式顯示形成有限深度之方式的 截面圖。 圖8⑷及（b)係以示意方式顯示形成全切斷線之方式之 基板的立體圖及俯視圖。 圖9係顯示在基板端產生之先行現象的圖。 【主要元件符號說明】 2 滑動台 7 台座 12 旋轉台 13 雷射裝置 16 冷卻嘴 17 升降機構 18 具週期槽部之刀輪 A 玻璃基板（脆性材料基板） 22 201002639 BS 光束點 CS 冷卻點 Cr 裂痕 Crl 深裂痕 Cr2 裂痕 Tr 初期龜裂By the above operation, on the substrate A m ^ , the initial crack of the younger brother 1 is Tr] > 4 is a starting line which is formed by a finite depth crack and a scribe line. Then, 17 201002639 is appropriately selected within the range that does not become a through crack. :: Break::Γ: extreme conditions) The heating condition of the laser or the second line of the second board. Further, a region where the crack Cr is not formed at the substrate end (the first substrate end) of the crack Tr1 side of the base period of the base period is shown. Next, the laser cracking treatment will be described. The position = 4 (4) does not return the rotary cymbal 12 to its original position (Fig. 3 (a), and the lifting mechanism 17 is actuated to lower the cutter wheel 18. Next, as shown in Fig. 4 (b), the substrate is brought close, The cutter wheel 18 is spliced to the stem..." The cutter wheel 18 is moved into the initial crack Tr2 of each other. At this time, ##μ^ 々珉.% can also cause the rotary table 持续 2 to continuously move, so that the second initial turtle The cracker r2 is continuously formed to the first initial crack Tr1. In addition, the second initial stage: 1.1 initial turtle can be changed by changing the pressure contact force. At this time, the crack can be simply described later = second, as shown in Fig. 4. (c), return the lifting mechanism n seat 7) to its original position (Fig. 3 (4), you ^ Ah疋 turn 12 (the position of the table, port j (a)), so that the laser device illuminates the laser beam. The time after the introduction of the Emperor Zhao Zhao, the heating conditions of the field emission output, etc., is left to be followed, as shown in Fig. 4 (4), to move the substrate A to separate the beam spot formed on the substrate A along the scribe line When A1 is directed toward the second substrate end, the deep cracked core 2 is reversed by the second initial crack Tr2 (i.e., the i-th board A1), and the W mark (line) is reversed. This deeper scribing is formed to the second substrate end 八2. 18 201002639 Here, the heating conditions during the laser splitting process are explained. The heating conditions such as the laser output can be compared with the 帛i thunder. The same is true for the irradiation, but it is preferably set as follows. In the laser cracking process, it is set so that the scanning speed is faster than the first laser "?, and the firing time is shorter" to shorten the heating at each point on the scribe line. The time (the laser output α is again the same as that of the vehicle), and the scribe line layer is heated only for a short time. The reason is that a stress gradient for deep penetration of the crack Cr can be formed between the surface layer of the substrate and the inside of the substrate. Fig. 5 is a cross-sectional view showing, in a schematic manner, a stress gradient to be formed at the time of laser cracking treatment. The surface layer of the substrate is heated for a short time to form a heating region Η. Next, a large compressive stress HR is formed on the surface layer of the substrate, which is affected by The opposite tensile stress CR is generated in the substrate P. When there is a crack inside the substrate, the tensile stress concentrates on the front end of the crack Cr, and as a result, the crack can penetrate deeper. If the surface layer is heated gradually During the heat transfer to the inside of the substrate, the temperature difference generated in the depth direction becomes small. As a result, the stress gradient in the depth direction is weakened. b, in the laser cracking process, in order to set the compressive stress on the surface layer of the substrate. In the case where the tensile stress is applied to the inside of the substrate, the cooling condition is preferably selected, and the heating condition is strongly heated in a short time in the temperature range in which the substrate is not degraded, and the refrigerant may be pre-sprayed before heating. By cooling, the temperature difference in the depth direction can be increased, and tensile stress can be easily generated inside the substrate. Further, it can be explained that the second initial crack can be formed to be deeper than the first period. The reason for the slashing. ' 19 201002639 乂垠 于 第 第 第 第 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The laser is concentrated by a tensile stress that is concentrated by tensile stress, thereby taking a deep position. In this state, the tensile stress layer is strongly (four) force. Thereby, the longer the distance between the ends is to the front end of the apple, the surface of the substrate to the front of the crack (torque) acts on the breakage and infiltrate. The direction 'is therefore able to make the cracks simple. As described above, in the case of laser cracking, the second initial crack of the end is formed by the second substrate, and the second substrate is irradiated with the second substrate. In the past, the deeper field shots ', ' shots, and the book made of irz made green, and the Cr2 was traced to the back side, that is, the substrate was completely cut off by the cutting/breaking process. The break surface of the work is very beautiful and the straightness is excellent. You are ideal for machining the end face. Next, the second embodiment of the present invention will be described with the addition of a laser cracking step in which the second initial crack is formed by laser irradiation, and the laser cutting line (four) is applied. The same as FIG. 3 is the same as the step up to FIG. 3(e)/month. The slab is formed by a scribe line formed by the position of the crack of the knive period Trrl. In this state, the shifting degree is as shown in Fig. 6 (4), and the rotary table 12 is slightly returned to the wide area. The crack Tr1 comes below the optical holder 14. In the beginning, the younger brother, as shown in Fig. 6(b), /f + ^ hx y. () household, causes the laser device 13 to act to illuminate the laser beam 20 201002639, thereby heating the i-th initial crack Tr1 and The rotary pedestal 7) moves to move the beam spot toward the second substrate end A1 side. = The first turtle (4) travels toward the second substrate end A1, and the ^= crack Tr2 is continuously formed from the first substrate end A1 to the first } Initial cracking. Next, as shown in Fig. 6(c), the rotating table 12 (the pedestal 7) is returned to the original position (the position of Fig. 3 (a)), and the f-emitting device 13 is actuated to illuminate the laser beam. f. Next, as shown in Fig. 6(d), the substrate A is moved to scan the beam spot formed on the substrate and the plate A along the scribe line from the first substrate end A1 toward the second substrate end A2. Since the deep crack Cr2 travels along the crack Cr (scribe line) starting from the second initial crack addition (that is, the first substrate end A1), the deep scribe line can be formed to the second substrate end A2. Further, in the above two embodiments, the second initial crack is continuously formed to the first initial crack, but the initial cracks are close to each other, even if they are not continuous. In the case of the laser cracking treatment, the result is that the second initial crack Tr2 is formed only on the first substrate & 'the distance from the first initial crack to the first initial crack. The present invention can be used to form a deep scribe line. The present invention can be used for forming a deep scribe line on a substrate of a brittle material such as a glass substrate or a process for completely breaking it. Fig. 1 is a schematic configuration diagram of a substrate processing apparatus used in carrying out the substrate processing method of the present invention. 21 201002639 A diagram of a cutter wheel structure of a groove portion. A processing method according to an embodiment - a processing method of an embodiment Fig. 2 (a) and (b) showing the processing method of the embodiment of the present invention. Fig. 2 (a) and (b) are diagrams showing a part of the steps of the present invention. 4(a) to 4(d) are diagrams showing a part of the steps of the present invention. Fig. 5 is a schematic cross-sectional view showing the degree of lightning. Fig. 6(a) to (d) show a part of the operation steps of the present invention. Fig. 7(a)~(c) are shown in schematic form Fig. 8 (4) and (b) show a perspective view and a plan view of a substrate in a manner of forming a full cut line. Fig. 9 is a view showing a leading phenomenon occurring at the substrate end. Explanation of main component symbols] 2 Slide table 7 Base 12 Rotary table 13 Laser device 16 Cooling nozzle 17 Lifting mechanism 18 Cutter wheel with periodic groove A Glass substrate (brittle material substrate) 22 201002639 BS Beam point CS Cooling point Cr Crack Crl Deep crack Cr2 crack Tr initial crack
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