201007073 -九、發明說明： 【發明所屬之技術領域】 本發明涉及一種照明裝置’尤其涉及一種散熱性能較 * 穩定之照明裝置。 【先前技術】 目前’發光二極體（Light Emitting Diode，LED)因具光 質佳及發光效率高等特性而逐漸取代螢光燈（Fluorescent Lamp)，成為照明裝置中之發光元件，具體可參閱Michael S. ❹ Shur 等人於文獻 Proceedings of the IEEE, Vol. 93，No. 10 (2005 年 10 月）中發表之 “Solid-State Lighting: Toward Superior Illumination”一文。 發光二極體於使用過程中之穩定性容易受周圍溫度之 影響，例如，當溫度過高時，發光二極體之發光強度容易 發生衰減，從而導致其使用壽命變短。於先前技術中，發 光二極體通常安裝於電路板上，該電路板藉由散熱膠、如 銀膠等黏附於散熱裝置上並與散熱裝置熱性連接，發光二 ❹極體發光時所發出之熱量藉由電路板、散熱膠傳導至散熱 裝置上進行散熱，從而使發光二極體保持於正常之溫度下 進行工作。惟，由於散熱膠之化學及物理性質所限，其經 由長時間使用後將發生老化現象（ageing phenomenon)，即 散熱膠蒸發、流失、彈性缺乏，從而使得電路板與散熱裝 置之間之連接出現鬆動。當該電路板與該散熱裝置之間由 於連接鬆動而出現空氣間隙或氣泡時，該電路板與該散熱 裝置之間之熱性連接將被破壞，發光二極體發出之熱量傳 6 201007073 導至電路板上後’其難以進—步料至散熱裝置上進行散 熱。 • 有鑒於此，提供一種散熱性能較穩定之照明裝置實為 必要。 【發明内容】 下面將以實施例說明一種散熱性能較穩定之昭明裝 置。 一種照明裝置，包括一散熱裝置、一電路板、至少一 固態光源及至少一彈性元件。該散熱裝置包括一本體及複 數個由該本體延伸出來之散熱片。該電路板設置於該散熱 裝置之本體上，並藉由散熱膠與該本體熱性連接。該至少 一固態光源設置於該電路板之遠離該本體之一側。該至少 一彈性元件與該散熱裝置及該電路板相連接，以使該散熱 裝置及該電路板分別與該散熱膠相貼合。 相對於先前技術，該照明裝置藉由設置彈性元件連接 ❿散熱裝置及電路板，以使該散熱裝置與該電路板藉由散熱 膠相貼合’其可保證至少一固態光源發出之熱量藉由電路 板、散熱膠傳導至散熱裝置上進行散熱，從而保障照明裝 置之發光特性。 【實施方式】 下面將結合圖式對本發明實施例作進一步之詳細說 明。 請參閱圖1 ’本發明第一實施例提供之一種照明裝置 ’其包括至少一固態光源11、一電路板13、一散熱裝置 7 201007073 -15及至少一彈性元件17。 該至少一固態光源11可為複數個發光二極體，且該複 數個發光二極體可為白色發光二極體或彩色發光二極體， 如紅、綠、藍發光二極體等。 該電路板13可為陶瓷電路板、玻璃纖維（FR4)電路板， 或優選地為金屬核心電路板(Metal Core PCB，MCPCB)。該 至少一固態光源11設置於該電路板13上，且與該電路板 13形成電性連接。藉由外接電源，該電路板13可對該至少 ❹一固態光源11供電，以點亮該固態光源11。 該散熱裝置15包括一本體150及複數個散熱片152。 具體地，該本體150呈圓柱體結構，該複數個散熱片152 由該本體150之外表面150a並沿著圓柱體結構之軸心方向 延伸出來。該本體150包括一第一表面150b、以及一與第 一表面相對150b且遠離該至少一固態光源11之第二表面 150c，該外表面150a位於該第一表面150b及該第二表面 ❹150c之間。 該電路板13設置於該本體150之第一表面150b上， 且可覆蓋該第一表面150b，該本體150與該電路板13之間 藉由散熱膠（未標示），如金屬相變導熱片（phase change metal alloy)、散熱膏（Thermal Grease)、導熱石夕膠墊（Silicon Gap Filler)或係導熱絕緣膠進行黏合，從而使該電路板13 與該本體150之間形成熱性連接。工作時，該至少一固態 光源11於發光之同時散發熱量，其所發出之熱量藉由電路 板13、散熱膠傳導至散熱裝置15之本體150上，進而藉由 201007073 由本體150延伸出來之散熱片152散發至外界。由此，該 至少一固態光源11可保持於正常之工作溫度下工作，從而 有效保障其發光特性，如演色性等。 該至少一彈性元件17用於連接該散熱裝置15及該電 路板13。於本實施例中，該彈性元件17為螺旋彈簧（圖1 示出其數目為四個），每個螺旋彈箐17包括兩個端部170 及位於該兩個端部170之間之一彈性部172。 該照明裝置10進一步包括一背板18，該背板18設置 ❿於該本體150之第二表面150c上，且可覆蓋該第二表面 150c。 該電路板13、背板18之面積分別較該本體150沿垂直 於其軸心之橫截面大，且其分別延伸出該本體150。該電路 板13、背板18上開設分別對應於該複數個螺旋彈簧17之 複數個第一通孔130，以及複數個第二通孔180。另，該電 路板13、背板18上分別設置對應於該複數個螺旋彈簧17 參之複數個第一凸柱132、以及複數個第二凸柱182。 請一起參閱圖2,拉伸該螺旋彈簧17,使其穿過該第 一通孔130及該第二通孔180，其中，該螺旋彈簧17之兩 個端部170分別卡扣於與其對應之第一凸柱132及第二凸 柱182上，該彈性部172位於該複數個散熱片152之間之 間隙處，且該螺旋彈簧17之彈性部172處於拉伸狀態。 該螺旋彈簧17可對該電路板13及該本體150施加一 彈性預緊力，當該散熱膠蒸發、流失、彈性缺乏時，該螺 旋彈簧17可隨時調節該電路板13及該本體150之間之距 201007073 離，使得該電路板13與該本體150藉由該散熱膠相貼合， 即該電路板13與該本體150分別與該散熱膠緊密接觸，從 而保證固態光源11發出之熱量可藉由電路板13、散熱膠傳 導至該散熱裝置15上進行散熱。 當設置於該本體150之第一表面150b上之電路板13 較小，其未能完全或僅僅剛好覆蓋該第一表面150b時，該 背板18可被省略，作為替換方案，此時該第二通孔180可 沿著本體150之軸心方向開設於該本體150上（圖未示），該 ❹第二凸柱182可對應設置於本體150之第二表面150c上， 當螺旋彈簧17穿過該本體150之第二通孔180，其兩個端 部170分別卡扣於該第一、第二凸柱132、182時，同樣可 達到使該電路板13及該本體150藉由該散熱膠相貼合目 的，且此時螺旋彈簧17之彈性部172套設於該第二通孔180 内。 當然，該螺旋彈簀17與該散熱裝置15亦可藉由焊接 Φ等其他固接方式進行連接，另，該彈性元件17除了採用本 實施例之螺旋彈簧17外，還可採用其他彈性元件，如橡皮 筋、彈性夾等進行實施，並不局限於具體實施例。 請參閱圖3,本發明第二實施例提供之一種照明裝置 30，其與本發明第一實施例提供之照明裝置10基本相同， 差別僅在於：散熱裝置35之本體350呈板狀結構，複數個 散熱片352由本體350之第二表面350c延伸出來。 本實施例中，螺旋彈簧37之其中一端部370與該複數 個散熱片352 —起位於該本體350之同一侧，其並不影響 201007073 本發明之實施，同樣可實現利用彈性元件37來連接該散熱 ^ 裝置35與該電路板33,以使該散熱裝置之本體350與該電 路板33藉由散熱膠36相貼合之目的。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 ®【圖式簡單說明】 圖1係本發明第一實施例提供之照明裝置之分解結構 示意圖。 圖2係本發明第一實施例提供之照明裝置組裝後之剖 面示意圖。 圖3係本發明第二實施例提供之照明裝置之剖面示意 圖。 @【主要元件符號說明】 照明裝置 10、30 固態光源 11 電路板 13 ' 33 散熱裝置 15 ' 35 彈性元件 17 ' 37 散熱膠 36 第一通孔 130 第一凸柱 132 本體 150、350 π 201007073 背板 18 散熱片 152、 352 ' 端部 170、 370 • 彈性部 172 第二通孔 180 第二凸柱 182 外表面 150a 第一表面 150b 第二表面 150c 、350c _ 12201007073 - IX. Description of the Invention: [Technical Field] The present invention relates to a lighting device', and more particularly to a lighting device having a relatively stable heat dissipation performance. [Prior Art] At present, the Light Emitting Diode (LED) has gradually replaced the Fluorescent Lamp due to its high light quality and high luminous efficiency, and has become a light-emitting component in lighting devices. For details, please refer to Michael. S. ❹ Shur et al., "Solid-State Lighting: Toward Superior Illumination", published in Proceedings of the IEEE, Vol. 93, No. 10 (October 2005). The stability of the light-emitting diode during use is susceptible to ambient temperature. For example, when the temperature is too high, the luminous intensity of the light-emitting diode is easily attenuated, resulting in a shortened service life. In the prior art, the light-emitting diode is usually mounted on a circuit board, and the circuit board is adhered to the heat sink by a heat-dissipating glue, such as silver glue, and is thermally connected to the heat-dissipating device, and is emitted when the light-emitting diode is illuminated. The heat is radiated to the heat sink by the circuit board and the heat sink to dissipate heat, so that the light emitting diode is kept at a normal temperature for operation. However, due to the chemical and physical properties of the heat-dissipating glue, the ageing phenomenon will occur after long-term use, that is, the heat-dissipating glue evaporates, loses, and lacks elasticity, so that the connection between the circuit board and the heat sink appears. Loose. When an air gap or air bubble occurs between the circuit board and the heat sink due to loose connection, the thermal connection between the circuit board and the heat sink device is destroyed, and the heat generated by the light emitting diode is transmitted to the circuit. After the board, it is difficult to get into the heat sink for heat dissipation. • In view of this, it is necessary to provide a lighting device with stable heat dissipation performance. SUMMARY OF THE INVENTION Hereinafter, an exemplary device having a relatively stable heat dissipation performance will be described by way of embodiments. A lighting device includes a heat sink, a circuit board, at least one solid state light source, and at least one resilient member. The heat sink comprises a body and a plurality of heat sinks extending from the body. The circuit board is disposed on the body of the heat dissipating device and is thermally connected to the body by a heat dissipating glue. The at least one solid state light source is disposed on a side of the circuit board remote from the body. The at least one elastic component is coupled to the heat sink and the circuit board such that the heat sink and the circuit board respectively adhere to the heat sink. Compared with the prior art, the illumination device is connected to the heat sink and the circuit board by providing an elastic component, so that the heat sink and the circuit board are adhered by the heat-dissipating glue, which can ensure the heat generated by the at least one solid-state light source. The circuit board and the heat-dissipating glue are transmitted to the heat sink for heat dissipation, thereby ensuring the light-emitting characteristics of the lighting device. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the drawings. Referring to FIG. 1 , a lighting device provided by a first embodiment of the present invention includes at least one solid state light source 11 , a circuit board 13 , a heat sink 7 201007073 -15 , and at least one elastic member 17 . The at least one solid-state light source 11 can be a plurality of light-emitting diodes, and the plurality of light-emitting diodes can be white light-emitting diodes or color light-emitting diodes, such as red, green, and blue light-emitting diodes. The circuit board 13 can be a ceramic circuit board, a fiberglass (FR4) circuit board, or preferably a metal core circuit board (MCPCB). The at least one solid state light source 11 is disposed on the circuit board 13 and electrically connected to the circuit board 13. The circuit board 13 can supply power to the at least one solid state light source 11 to illuminate the solid state light source 11 by an external power source. The heat sink 15 includes a body 150 and a plurality of fins 152. Specifically, the body 150 has a cylindrical structure, and the plurality of fins 152 extend from the outer surface 150a of the body 150 and along the axial direction of the cylindrical structure. The body 150 includes a first surface 150b and a second surface 150c opposite to the first surface 150b and away from the at least one solid state light source 11. The outer surface 150a is located between the first surface 150b and the second surface 150c . The circuit board 13 is disposed on the first surface 150b of the body 150 and covers the first surface 150b. The heat dissipation adhesive (not labeled), such as a metal phase change heat conduction sheet, is disposed between the body 150 and the circuit board 13. A phase change metal alloy, a Thermal Grease, a Silicon Gap Filler or a thermally conductive insulating adhesive is bonded to form a thermal connection between the circuit board 13 and the body 150. In operation, the at least one solid-state light source 11 emits heat while emitting light, and the heat generated by the solid-state light source 11 is transmitted to the body 150 of the heat sink 15 through the circuit board 13 and the heat-dissipating glue, and is further radiated by the body 150 by 201007073. The sheet 152 is distributed to the outside world. Thereby, the at least one solid-state light source 11 can be operated at a normal operating temperature, thereby effectively securing its illuminating characteristics such as color rendering. The at least one elastic member 17 is for connecting the heat sink 15 and the circuit board 13. In the present embodiment, the elastic members 17 are coil springs (the number of which is shown in FIG. 1 is four), and each of the spiral magazines 17 includes two end portions 170 and one of the elasticities between the two end portions 170. Part 172. The illumination device 10 further includes a backing plate 18 disposed on the second surface 150c of the body 150 and covering the second surface 150c. The area of the circuit board 13 and the back board 18 is larger than the cross section of the body 150 perpendicular to the axis thereof, and respectively extends out of the body 150. The circuit board 13 and the back board 18 are provided with a plurality of first through holes 130 corresponding to the plurality of coil springs 17, and a plurality of second through holes 180. In addition, the circuit board 13 and the back board 18 are respectively provided with a plurality of first protrusions 132 and a plurality of second protrusions 182 corresponding to the plurality of coil springs 17 . Referring to FIG. 2 together, the coil spring 17 is stretched to pass through the first through hole 130 and the second through hole 180, wherein the two end portions 170 of the coil spring 17 are respectively buckled corresponding thereto. The first protruding post 132 and the second protruding post 182 are located at a gap between the plurality of fins 152, and the elastic portion 172 of the coil spring 17 is in a stretched state. The coil spring 17 can apply an elastic preload force to the circuit board 13 and the body 150. When the heat dissipating rubber evaporates, loses, and lacks elasticity, the coil spring 17 can adjust between the circuit board 13 and the body 150 at any time. The distance from the 201007073 is such that the circuit board 13 and the body 150 are adhered by the heat-dissipating glue, that is, the circuit board 13 and the body 150 are in close contact with the heat-dissipating glue respectively, thereby ensuring that the heat generated by the solid-state light source 11 can be borrowed. The circuit board 13 and the heat-dissipating glue are conducted to the heat sink 15 for heat dissipation. When the circuit board 13 disposed on the first surface 150b of the body 150 is small, and the cover plate 18 is not completely or only covers the first surface 150b, the back plate 18 may be omitted. The second through hole 180 can be disposed on the body 150 (not shown) along the axial direction of the body 150. The second protrusion 182 can be correspondingly disposed on the second surface 150c of the body 150 when the coil spring 17 is worn. The second through hole 180 of the body 150, when the two end portions 170 are respectively latched to the first and second protrusions 132 and 182, can also achieve the heat dissipation of the circuit board 13 and the body 150. The rubber phase is affixed to the second through hole 180. Of course, the spiral magazine 17 and the heat dissipating device 15 can also be connected by other fixing methods such as welding Φ. In addition, the elastic member 17 can adopt other elastic members in addition to the coil spring 17 of the embodiment. Implementations such as rubber bands, elastic clips, and the like are not limited to the specific embodiments. Referring to FIG. 3, a lighting device 30 according to a second embodiment of the present invention is substantially the same as the lighting device 10 provided by the first embodiment of the present invention, except that the body 350 of the heat dissipating device 35 has a plate-like structure. The heat sink 352 extends from the second surface 350c of the body 350. In this embodiment, one end portion 370 of the coil spring 37 and the plurality of fins 352 are located on the same side of the body 350, which does not affect the implementation of the present invention, and the elastic member 37 can also be used to connect the same. The device 35 and the circuit board 33 are disposed so that the body 350 of the heat sink and the circuit board 33 are adhered by the heat sink 36. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded view of a lighting device according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing the assembly of the lighting device according to the first embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing a lighting device according to a second embodiment of the present invention. @[Main component symbol description] Lighting device 10, 30 Solid state light source 11 Circuit board 13 ' 33 Heat sink 15 ' 35 Elastic element 17 ' 37 Heat sink 36 First through hole 130 First stud 132 Body 150, 350 π 201007073 Back Plate 18 heat sink 152, 352 'end 170, 370 • resilient portion 172 second through hole 180 second stud 182 outer surface 150a first surface 150b second surface 150c, 350c _ 12