200917305 九、發明說明 【發明所屬之技術領域】 本發明是關於溫度熔絲，作爲組裝於二次電池保護電 路所使用的具電阻的溫度熔絲有用者。 【先前技術】 作爲溫度熔絲，公知有在絕緣基板的一面上設置一對 熔絲元件連接用膜電極，在此些膜電極全面地藉由焊接來 接合熔絲元件，而在各熔絲元件連接用膜電極藉由焊接或 錫焊來接合引線導體，在熔絲元件塗佈焊劑，而以環氧樹 脂層密封該焊劑塗佈熔絲元件（例如，專利文獻1的第5 圖、第6圖）。被保護機器的異常發熱時，藉由該發生熱 熔斷熔絲元件俾遮斷對於機器的饋電。 對於上述基板型溫度熔絲，在基板附設膜電阻，而在 被保護機器異常時，通電發熱膜電阻，以該發生熱熔斷熔 絲元件俾遮斷對於機器的饋電的具電阻的溫度熔絲也公知 (例如，專利文獻2)。 專利文獻1 :日本特開平3-43925號公報 專利文獻2 :日本特開平2003 -2 1 74 1 6號公報 在基板型溫度熔絲或具電阻的基板型溫度熔絲中，大 都裝載於印刷配線基板而被使用著，被要求儘量地小型化 本體部。例如，在具電阻的基板型溫度熔絲中，被組裝於 二次電池保護用電路板之外被收容於電池包裝內而被使用 的情形，收容室間上被要求小型化。 -4- 200917305 【發明內容】 在上述溫度熔絲，具電阻的溫度熔絲中，藉由焊接進 行各膜電極與熔絲元件的接合，而藉由錫焊或焊接進行各 膜電極與引線導體的接合。然而若縮短從熔絲元件與膜電 極的焊接部位一直到引線導體與膜電極的接合部位的距 離’則藉由錫焊進行引線導體的接合的時候，成爲焊錫濕 潤擴大膜電極上而會接觸到熔絲元件。 又’膜電極與熔絲元件的焊接是藉由雷射焊接，回流 焊接等所進行，若縮短從熔絲元件與膜電極的焊接部位一 直到引線導體與膜電極的接合部位爲止的距離，則在焊接 部位的熔絲元件熔融合金會濕潤擴大在膜電極上，成爲該 溶絲兀件溶融合金接觸到引線導體接合焊錫。若引線導體 的接合藉由點焊接等的焊接所進行的時候，成爲會產生引 線導體前端部與熔融熔絲元件合金的接觸。 如此地，若產生熔絲元件合金與引線導體接合焊錫的 接觸或熔絲元件合金與引線導體前端部的鍍錫的接觸，則 產生焊錫成分元素對熔絲元件的遷移或上述錫對於熔絲元 件的遷移’使得熔絲元件的熔融特性變化，有產生作動失 常之虞。 因此’在縮短上述膜電極的熔絲元件的焊接部位與引 線導體的接合部位之間的距離以謀求基板型溫度熔絲的本 體部或具電阻的基板型溫度熔絲的本體部的縮小化上有問 題。 -5- 200917305 本發明的目的是在基板一面設置熔絲元件連接用膜電 極，而在該膜電極藉由焊接橋設熔絲元件，而在各膜電極 接合引線導體所成的基板型溫度熔絲或再附設膜電阻的具 電阻的基板型溫度熔絲中，無障礙地縮短熔絲元件的焊接 部位與引線導體接合部位之間的距離，以謀求基板型溫度 熔絲的本體部或具電阻的基板型溫度熔絲的本體部的縮小 化。 申請專利範圍第1項之所述第1項的溫度熔絲，其特 徵爲：在基板的一面上具有熔絲元件連接用膜電極，在此 些膜電極全面地焊接有熔絲元件，而在各膜電極藉由錫焊 接合有引線導體，在各膜電極的熔絲元件焊接部位與引線 導體錫焊接合部位之間設有對於上述錫焊時的熔融焊錫或 熔絲元件焊接時熔融合金的濕潤擴大遮斷障壁。 申請專利範圍第2項的溫度溶絲，其特徵爲：在基板 的一面上具有熔絲元件連接用膜電極，在此些膜電極全面 地焊接有熔絲元件，而在各膜電極藉由焊接接合有引線導 體，在各膜電極的熔絲元件焊接部位與引線導體焊接接合 部位之間設有上述熔絲元件焊接時對於熔融合金的濕潤擴 大遮斷障壁。 申請專利範圍第3項的溫度熔絲是在申請專利範圍第 1項的溫度熔絲中，在基板的另一面設有膜電阻，爲其特 徵者。 申請專利範圍第4項的溫度熔絲，是在申請專利範圍 第2項的溫度熔絲中，在基板的另一面設有膜電阻，爲其 -6- 200917305 特徵者。 申請專利範圍第5項的溫度熔絲，是在申請專利範圍 第1項的溫度溶絲中，帶狀引線導體的錫焊溫度作成比熔 絲元件的融點還高溫，爲其特徵者。 申請專利範圍第6項的溫度熔絲，是在申請專利範圍 第3項的溫度溶絲中，帶狀引線導體的錫焊溫度作成比熔 絲元件的融點還高溫，爲其特徵者。 申請專利範圍第7項的溫度熔絲，是在申請專利範圍 第1項的溫度熔絲中，障壁的融點比焊錫的融點及熔絲元 件的融點還高溫，爲其特徵者。 申請專利範圍第8項的溫度熔絲，是在申請專利範圍 第2項的溫度熔絲中，障壁的融點比熔絲元件的融點還高 溫，爲其特徵者。 申請專利範圍第9項的溫度熔絲，是在申請專利範圍 第3項的溫度熔絲中，障壁的融點比焊錫的融點及熔絲元 件的融點還高溫，爲其特徵者。 申睛專利範圍第1 0項的溫度熔絲，是在申請專利範 圍第4項的溫度熔絲中’障壁的融點比熔絲元件的融點還 筒溫’爲其特徵者。 申請專利範圍第Π項的溫度熔絲，是在申請專利範 圍弟5項的溫度熔絲中’障壁的融點比焊錫的融點及熔絲 兀件的_點還高溫，爲其特徵者。 申_專利範圍第1 2項的溫度熔絲，是在申請專利範 圍弟6項的溫度熔絲中，障壁的融點比焊錫的融點及熔絲 200917305 元件的融點還高溫，爲其特徵者。 申請專利範圍第1 3項的溫度熔絲，是在申請專利範 圍第3項至第1 2項中任一項所述的溫度熔絲中，引線導 體C對於膜電阻的長度方向熱電阻比引線導體對於溶絲元 件的長度方向熱電阻作成還高，爲其特徵者。 申請專利範圍第1 4項的溫度熔絲，是在申請專利範 圍弟1 3項的溫度熔絲中，引線導體c對於膜電阻的材暂 作爲鐵系，引線導體對於熔絲元件的材質作爲銅系，爲其 特徵者。 在熔絲元件與膜電極的焊接部位與對於同膜電極的引 線導體接合部位之間的膜電極部位設置遮斷焊錫的濕潤擴 大’或是熔絲元件的焊接時熔融合金的濕潤擴大的障壁之 故’因而可防止引線導體接合焊錫對於熔絲元件的接觸， 或是熔絲元件焊接對於引線導體接合部位時的熔融合金的 接觸。這時候，可將熔絲元件與膜電極的焊接部位及對於 胃fl莫電極的引線導體接合部位之間的距離作成附設障壁上 m必需的最小限距離。在此種短距離下，也可排除熔絲元 ##金與引線導體接合焊錫之接觸或是熔絲元件合金與引 '線_體前端部的鍍錫之接觸可避免焊錫成分元素對於熔絲 元件的遷移或上述S η的熔絲元件的遷移所致的熔絲元件 的溶融特性的變化，而可保證穩定的作動特性。 【實施方式】 以下，參照圖式針對於本發明的實施例加以說明。 -8 - 200917305 第1圖是表示本發明的溫度熔絲的一實施例的局部切 缺俯視圖。 在第1圖中，1是耐熱性熱傳導性優異的絕緣基板， 例如可使用陶瓷板。a，b是形成於基板的一面的一對熔絲 元件連接用膜電極，藉由導體糊例如銀糊的印刷，印相可 加以設置。A, B是帶狀引線導體，將陶瓷板1的厚度作成 25〇μιη〜400μηι的極薄，藉由錫焊接合於熔絲元件連接用 膜電極。在250μιη〜400μιη的極薄陶瓷板，進行焊接例如 點熔接引線導體’有陶瓷板的裂痕損壞之顧慮，惟依照錫 焊也可排除此種不利。3是熔絲元件連接用膜電極間全面 地焊接的熔絲元件，將該熔絲元件的融點作成比上述焊錫 的融點還低，來選定焊錫。f是焊劑。 6a，6b是設於膜電極a，b的引線導體Α,Β的錫焊部位 與熔絲元件3的焊接部位之間的障壁，用以遮斷引線導體 的錫焊時的熔融焊錫的濕濕擴大及熔絲元件焊接時的焊接 部位的熔融熔絲元件的濕潤擴大者。該障壁的形狀是可作 成堤壩或濕潤性不好的膜，而平面上，除了圖示的直線狀 之外’也可作成圓弧狀、半月狀。設置覆蓋基板1 一面的 絕緣密封物，例如環氧樹脂塗佈層，惟未加以圖示。 在上述中，進行引線導體Α,Β與膜電極a，b之錫焊接 合之後，才進行熔絲元件3對於膜電極a,b的焊接。 錫焊接合時，熔融焊錫爲了其表面張力而欲濕潤擴 大’惟在障壁部位被遮斷濕潤擴大。 又，熔絲元件對於膜電極的焊接時（可使用雷射焊 -9 - 200917305 接’回流焊接等），焊接部位的熔融熔絲元件爲了其表面 張力而欲濕潤擴大，惟在障壁部位被遮斷濕潤擴大。 因此’可防止引線導體接合焊錫對於熔絲元件的接 觸’或是熔絲元件焊接時熔融合金對於引線導體接合部位 的接觸’可將熔絲元件與膜電極之焊接部位與對於同膜電 極的引線導體接合部位之間的距離作成附設障壁所必需的 最小限距離。在此種短距離下，也可排除熔絲元件合金與 引線導體接合焊錫的接觸，可避免焊錫成分元素對於熔絲 元件的遷移所致的熔絲元件的熔融特性的變化，而可保證 穩定的作動特性。 陶瓷板比上述厚度（250μιη〜400μιη)還厚的時候，藉 由點焊接等的焊接也可進行引線導體與膜電極的接合。 這時候，可防止熔絲元件焊接時對於引線導體前端部 位的熔融合金的接觸，可避免引線導體表面的鍍錫對於熔 絲元件的遷移所致的熔絲元件的熔融特性的變化，而可保 證穩定的作動特性。 作爲上述障壁的材質，使用對於熔融焊錫或熔融熔絲 元件具穩定（耐熱性）者，而可使用玻璃（二氧化矽）、氧化 鋁或锆等的陶瓷，耐熱性樹脂，鎳（Ni)等的濕潤性不好的 金屬。 第2圖是表示具電阻的溫度熔絲的實施例，第2(a)圖 是表示省略絕緣密封物予以圖示的俯視圖，第2(b)圖是表 示背面圖’第2(c)圖是表示第2(a)圖的C-C斷面圖。 在第2(a)圖中，丨是耐熱性、熱良傳導性的絕緣基 -10- 200917305 板，例如陶瓷板。a，b是形成於絕緣基板1的一面1 0 1的 兩側的膜電極，2是中間電極，藉由導體糊例如銀糊的印 刷，印相所形成。3是熔絲元件，橫跨配設於兩側膜電極 a,b及中間膜電極2，焊接膜電極a，b，2之交叉部位。熔絲 元件3是被區分成夾住中間膜電極2的部分η及m。在熔 絲元件塗佈有焊劑，惟其圖示是被省略。A, B是利用錫焊 分別被接合於兩側膜電極a，b的帶狀引線導體，基板的正 前側兩隅被切除，如第2(c)圖所示，在各帶狀引線導體 A，B，位於近接於缺口緣端的位置形成有朝基板的另一面 上昇的階段差e，階段差的上側面對於基板另一面，位於 僅比帶狀引線導體的厚度還高的上側。6a，6b是設於膜電 極a，b的熔絲元件3的焊接部位與帶狀引線導體Α,Β的錫 焊接合部位之間的障壁。 在第2(b)圖中，41，4 2是設於基板1的另一面1〇上的 前後的膜電極，與上述基板一面的膜電極a,b同樣地藉由 導體糊的印刷，印相所設置。r是設於前後膜電極4 1,42 間的膜電阻，藉由電阻糊例如氧化釕粉末糊的印刷，印相 所設置。在膜電阻上設有保護膜例如玻璃印相膜g。前後 的膜電極41，42的一方42，是藉由通孔24被結線於基板 —面的中間膜電極2。c是被附設於前後膜電極4 1,4 2的 另一方4 1的側部，C是帶狀引線導體，前端部以面接合 被接合於上述側部c。5是覆蓋基板一面1 〇 1的絕緣密封 物，例如圖式所示地，在基板一面1 〇 1上與焊劑接觸所配 置的保護薄片51例如陶瓷薄片，玻璃布薄片與該保護薄 200917305 片51及基板一面1 〇 1之間包圍焊劑所固定的硬化性樹脂 例如環氧樹脂5 2所構成。 在本發明的具電阻的溫度熔絲中，如上述地可縮短膜 電極a,b的長度，因此可充分地縮小基板的平面尺寸’而 可縮小絕緣密封物的外廓。 第3圖是表示裝載本發明的具電阻的溫度熔絲的二次 電池保護用電路板，在印刷配線板P安裝過放電防止開關 用FET(M)及過充電防止關用FET(N)，將本發明的具電阻 的溫度熔絲的絕緣密封物朝下側收容於FET間的空間， 並將帶狀引線導體Α,Β乘載於一方的FET上面，又將帶 狀引線導體C乘載於另一方的FET上面，而將各帶狀引 線導體A,B，C連接於印刷配線板Ρ的配線導體的所定位 置。 如上述地，在本發明的具電阻的溫度熔絲中，可減小 絕緣密封物的外廓尺寸之故，因而可變窄兩 FET的間 隔，而可提高安裝密度。 第4圖是表示組裝本發明的具電阻的溫度熔絲Ao的 二次電池保護電路的充電時的等値電路，Μ是過放電防止 開關用EFT，Ν是過充電防止開關用EFT。n,m是本發明 的具電阻的溫度熔絲的熔絲元件部分，r是具電阻的溫度 熔絲的膜電阻，S是1C控制部，Tr是電晶體，E是二次 電池，D是充電源。過放電防止開關用FET，過充電防止 開關用FET，本發明的具電阻的溫度熔絲，1C控制部， 電晶體Tr等是被裝載於上述二次電池保護用電路板。 -12- 200917305 在第4圖中’ A，B是對應於熔絲元件側的引線導體， 而C是對應於膜電阻側的引線導體。在帶狀引線導體 A，B ’經常地流著電路電流之故，因而在銅，銅合金等的通 常導電性材質使用著鍍錫者。僅在異常時（過充電時），藉 由來自1C控制部的訊號使得電晶體開關Tr被導通，把電 流流在引線導體C，膜電阻r會發熱而熔斷熔絲元件部分 m。這時候’在引線導體C爲了防止膜電阻r的發生熱經 由該引線導體C而洩漏。使用熱電阻高的金屬，使用例如 鐵，鐵合金等的鐵系或是鎳等施以鍍錫者，將引線導體C 的長度方向的熱電阻作成比引線導體A或B的長度方向 的熱電阻還高較佳。又，將帶狀引線導體C的寬度作成比 帶狀引線導體A或B的寬度還細小也可以。這時候，也 可將引線導體C的電阻作成比膜電阻r的電阻還充分低， 而可保證二次電池E所致的膜電阻r的高效率的發熱。 【圖式簡單說明】 第1圖是表示本發明的溫度熔絲的一實施例的圖式。 第2(a)圖至第2(c)圖是表示本發明的具電阻的溫度熔 絲的一實施例的圖式。 第3圖是表示裝載本發明的具電阻的溫度熔絲的二次 電池保護電路板的圖式。 第4圖是表示組裝具電阻的溫度熔絲的二次電池保護 電路板的圖式。 -13- 200917305 【主要元件符號說明 1 :基板 a, b :兩側膜電極 3 :熔絲元件 6a,6b ：障壁 5 :絕緣密封物BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature fuse which is useful as a temperature fuse having a resistor used in a secondary battery protection circuit. [Prior Art] As a temperature fuse, it is known to provide a pair of film electrodes for connecting fuse elements on one surface of an insulating substrate, in which the film electrodes are integrally joined by soldering to fuse elements, and in each of the fuse elements The connection film electrode is joined to the lead conductor by soldering or soldering, and the flux is applied to the fuse element, and the flux-coated fuse element is sealed with an epoxy resin layer (for example, FIG. 5 and FIG. 6 of Patent Document 1) Figure). When the protected machine is abnormally heated, the fuse is blown off by the heat-fusing fuse element. In the above-described substrate type temperature fuse, a film resistor is attached to the substrate, and when the protected device is abnormal, the heat generating film resistor is energized, and the heat-fusing fuse element is used to block the temperature-fuse having a resistance to feed the machine. It is also known (for example, Patent Document 2). Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The substrate is used, and it is required to miniaturize the body portion as much as possible. For example, in the case of a substrate type temperature fuse having a resistance, which is incorporated in a battery package and used in addition to the secondary battery protection circuit board, it is required to be miniaturized between the storage chambers. -4- 200917305 SUMMARY OF THE INVENTION In the above-mentioned temperature fuse, the temperature fuse with resistance, the bonding of each film electrode and the fuse element is performed by soldering, and each film electrode and lead conductor are performed by soldering or soldering. Engagement. However, when the distance from the soldered portion of the fuse element to the membrane electrode to the junction between the lead conductor and the membrane electrode is shortened, when the lead conductor is joined by soldering, the solder wets the membrane electrode and contacts it. Fuse element. Further, the welding of the membrane electrode and the fuse element is performed by laser welding, reflow soldering or the like, and shortening the distance from the soldered portion of the fuse element to the membrane electrode to the junction between the lead conductor and the membrane electrode is The fuse element of the fuse element at the soldering portion is wetted and expanded on the membrane electrode, so that the molten iron of the molten filament element contacts the lead conductor bonding solder. When the bonding of the lead conductor is performed by soldering such as spot welding, contact between the tip end portion of the lead conductor and the molten fuse element alloy occurs. Thus, if the contact of the fuse element alloy with the lead conductor bonding solder or the contact of the fuse element alloy with the tin plating of the leading end portion of the lead conductor occurs, the migration of the solder component element to the fuse element or the above-mentioned tin to the fuse element occurs. The migration 'changes the melting characteristics of the fuse element and causes a malfunction. Therefore, the distance between the welded portion of the fuse element of the membrane electrode and the joint portion of the lead conductor is shortened to reduce the size of the main body portion of the substrate-type temperature fuse or the body portion of the substrate-type temperature fuse having resistance. something wrong. -5- 200917305 The object of the present invention is to provide a film electrode for connecting a fuse element on one side of a substrate, and to fuse the substrate element by bonding a lead element to each of the film electrodes by welding a fuse element on the film electrode. In the substrate-type temperature fuse with resistance and the resistance of the film resistor, the distance between the soldered portion of the fuse element and the joint portion of the lead conductor is unobstructed, so that the body portion of the substrate type thermal fuse or the resistor is obtained. The body portion of the substrate type temperature fuse is shrunk. The temperature fuse according to the first aspect of the invention, characterized in that the membrane electrode for connecting a fuse element is provided on one surface of the substrate, and the fuse element is integrally soldered to the membrane electrode. Each of the membrane electrodes is provided with a lead conductor by soldering, and a molten solder or a molten alloy at the time of soldering of the fuse element is provided between the fuse element soldering portion of each film electrode and the lead conductor solder joint portion. Wet enlargement blocks the barrier. The temperature-soluble filament of the second aspect of the patent application is characterized in that a membrane electrode for connecting a fuse element is provided on one surface of the substrate, and the fuse electrode is integrally welded to the membrane electrode, and the membrane electrode is welded by the membrane electrode. A lead conductor is bonded, and a gap between the fuse element soldering portion of each film electrode and the lead conductor solder joint portion is increased, and the insulating layer of the molten alloy is expanded to block the barrier. The temperature fuse according to item 3 of the patent application is a temperature fuse according to item 1 of the patent application, and a film resistor is provided on the other surface of the substrate, which is a special feature. The temperature fuse of the fourth application patent is in the temperature fuse of the second application of the patent scope, and the film resistor is provided on the other side of the substrate, which is characterized by -6-200917305. The temperature fuse of the fifth application patent is in the temperature-soluble wire of the first application of the patent scope, and the soldering temperature of the strip-shaped lead conductor is made higher than the melting point of the fuse element. The temperature fuse of claim 6 is the temperature-soluble wire of the third application of the patent scope, and the soldering temperature of the strip-shaped lead conductor is made higher than the melting point of the fuse element. The temperature fuse of the seventh application of the patent scope is characterized by the fact that in the temperature fuse of claim 1, the melting point of the barrier is higher than the melting point of the solder and the melting point of the fuse element. The temperature fuse of claim 8 is the temperature fuse of the second application of the patent scope, and the melting point of the barrier is higher than the melting point of the fuse element. The temperature fuse of the ninth application patent is in the temperature fuse of the third application of the patent scope, and the melting point of the barrier is higher than the melting point of the solder and the melting point of the fuse element. The temperature fuse of the 10th item of the patent application is characterized by the fact that the melting point of the barrier is higher than the melting point of the fuse element in the temperature fuse of the fourth application patent. The temperature fuse of the third paragraph of the patent application is characterized by the fact that the melting point of the barrier is higher than the melting point of the solder and the temperature of the fuse element in the temperature fuse of the patent application. The temperature fuse of the first paragraph of the patent scope is the temperature fuse of the six patent applications. The melting point of the barrier is higher than the melting point of the solder and the melting point of the fuse 200917305. By. The temperature fuse of claim 13 of the patent application, in the temperature fuse according to any one of claims 3 to 12, the lead conductor C has a longitudinal resistance to the film resistance. The conductor is characterized by a high thermal resistance in the longitudinal direction of the melting element. The temperature fuse of the patent application category 14 is in the temperature fuse of the patent application scope, the lead conductor c is temporarily used as the iron for the film resistance, and the material of the lead conductor for the fuse is used as the copper. Department, is its characteristic. A wet expansion of the soldering electrode is provided between the soldering portion of the fuse element and the film electrode and the bonding portion of the lead conductor of the same film electrode; or the barrier of the molten alloy is expanded when the fuse element is soldered. Therefore, it is thus possible to prevent the lead conductor from joining the solder to the fuse element, or the fuse element to solder the contact with the molten alloy at the joint of the lead conductor. At this time, the distance between the welded portion of the fuse element and the membrane electrode and the joint portion of the lead conductor for the stomach electrode can be made a minimum distance necessary for attaching the barrier m. In such a short distance, it is also possible to eliminate the contact between the fuse element ##金 and the lead conductor bonding solder or the contact of the fuse element alloy with the tin plating of the leading end portion of the lead wire to avoid the solder component element to the fuse. A change in the melting characteristics of the fuse element due to the migration of the element or the migration of the fuse element of the above S η ensures stable operation characteristics. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. -8 - 200917305 Fig. 1 is a partially cutaway plan view showing an embodiment of the temperature fuse of the present invention. In Fig. 1, reference numeral 1 denotes an insulating substrate excellent in heat resistance and heat conductivity, and for example, a ceramic plate can be used. a, b are a pair of film electrodes for connecting the fuse element formed on one surface of the substrate, and printing can be performed by printing a conductor paste such as a silver paste. A and B are strip conductors, and the thickness of the ceramic board 1 is made extremely thin at 25 〇 to 400 μm, and is bonded to the membrane electrode for fuse element connection by soldering. In an extremely thin ceramic plate of 250 μm to 400 μm, soldering, for example, a spot-welded lead conductor, has the concern of cracking of the ceramic plate, but this disadvantage can be eliminated by soldering. 3 is a fuse element which is integrally welded between the film electrodes for fuse element connection, and the melting point of the fuse element is made lower than the melting point of the solder to select the solder. f is a flux. 6a, 6b are barrier bars provided between the lead conductors 膜 of the film electrodes a, b, the soldered portions of the ytterbium and the soldered portions of the fuse element 3, for blocking the wet soldering of the soldering of the lead conductors during soldering Expanding the wetness of the molten fuse element of the welded portion at the time of welding the fuse element. The shape of the barrier is a dam or a film having poor wettability, and the plane may be formed in an arc shape or a half moon shape in addition to the linear shape shown in the drawing. An insulating seal covering one side of the substrate 1, such as an epoxy coating layer, is provided, but is not shown. In the above, after the lead conductor Α is bonded to the tin of the film electrodes a and b, the fuse element 3 is soldered to the film electrodes a and b. When tin soldering is combined, the molten solder is intended to be wetted and expanded for the surface tension thereof, but the barrier portion is blocked and wetted. Further, when the fuse element is soldered to the membrane electrode (laser welding can be performed by using laser welding -9 - 200917305), the molten fuse element of the welded portion is intended to be wetted and expanded for the surface tension, but is shielded at the barrier portion. The wetting is enlarged. Therefore, 'the contact of the lead conductor to the solder for the fuse element can be prevented' or the contact of the molten alloy with the lead conductor when the fuse element is soldered' can weld the fuse element to the film electrode and the lead to the same film electrode The distance between the conductor joints is the minimum distance necessary to attach the barrier. In such a short distance, the contact between the fuse element alloy and the lead conductor bonding solder can also be excluded, and the change in the melting characteristics of the fuse element due to the migration of the solder component element to the fuse element can be avoided, and stable stability can be ensured. Actuation characteristics. When the ceramic plate is thicker than the above thickness (250 μm to 400 μm), the lead conductor and the film electrode can be joined by soldering such as spot welding. At this time, it is possible to prevent the contact of the molten alloy at the front end portion of the lead conductor when the fuse element is soldered, and to avoid the change in the melting characteristics of the fuse element due to the transfer of the tin on the surface of the lead conductor to the fuse element, and it is ensured. Stable actuation characteristics. As the material of the barrier rib, it is stable (heat resistance) for molten solder or a molten fuse element, and ceramics such as glass (ceria), alumina or zirconium, heat resistant resin, nickel (Ni), etc. can be used. A poorly wet metal. Fig. 2 is a view showing an example of a temperature fuse having resistance, Fig. 2(a) is a plan view showing the insulating seal omitted, and Fig. 2(b) is a rear view 'Fig. 2(c) This is a CC cross-sectional view showing the second (a) figure. In the second (a) diagram, bismuth is a heat-resistant, thermally conductive insulating substrate - -10-200917305 plate, such as a ceramic plate. a, b are film electrodes formed on both sides of one surface 10 of the insulating substrate 1, and 2 are intermediate electrodes, which are formed by printing with a conductor paste such as a silver paste. 3 is a fuse element which is disposed across the intersection of the membrane electrodes a, b and the intermediate membrane electrode 2, and the welding membrane electrodes a, b, 2. The fuse element 3 is a portion η and m which are divided to sandwich the intermediate film electrode 2. The fuse element is coated with flux, but the illustration is omitted. A and B are strip conductors which are respectively bonded to the film electrodes a and b on both sides by soldering, and the front sides of the substrate are cut off, as shown in Fig. 2(c), in each strip conductor A B is located at a position close to the edge of the notch and has a step e rising toward the other surface of the substrate. The upper side of the step difference is located on the upper side of the other side of the substrate than the thickness of the strip lead conductor. 6a, 6b are barriers between the welded portion of the fuse element 3 of the film electrodes a, b and the strip lead conductor Α, and the tin solder joint portion of the crucible. In the second (b), 41, 4 2 are film electrodes provided on the other surface of the substrate 1 and are printed by the conductor paste in the same manner as the film electrodes a and b on the substrate. The phase is set. r is a film resistance provided between the front and rear film electrodes 41, 42 and is printed by a resist paste such as yttrium oxide powder paste. A protective film such as a glass printing film g is provided on the film resistor. One of the front and rear membrane electrodes 41, 42 is an intermediate membrane electrode 2 which is connected to the substrate by the through hole 24. c is a side portion of the other side 4 1 attached to the front and rear film electrodes 4 1, 4 2 , and C is a strip lead conductor, and the front end portion is joined to the side portion c by surface bonding. 5 is an insulating seal covering one side of the substrate, for example, as shown in the drawing, a protective sheet 51 disposed on the substrate side 1 〇1 in contact with the solder, such as a ceramic sheet, a glass cloth sheet and the protective sheet 200917305 sheet 51 A curable resin such as an epoxy resin 52 that is fixed to the flux is surrounded by the substrate 1 to 1 . In the temperature-resistant fuse having resistance of the present invention, the length of the film electrodes a, b can be shortened as described above, so that the planar size of the substrate can be sufficiently reduced, and the outer shape of the insulating sealing material can be made small. 3 is a circuit board for protecting a secondary battery in which a temperature fuse having a resistance of the present invention is mounted, and an over-discharge prevention switch FET (M) and an overcharge prevention FET (N) are mounted on the printed wiring board P, The insulating sealing material with a resistance temperature fuse of the present invention is housed in a space between the FETs toward the lower side, and the strip-shaped lead conductor Α is carried on the upper surface of one of the FETs, and the strip-shaped lead conductor C is loaded. On the other FET, each of the strip conductors A, B, and C is connected to a predetermined position of the wiring conductor of the printed wiring board. As described above, in the temperature fuse having the electric resistance of the present invention, the outer size of the insulating seal can be reduced, so that the interval between the two FETs can be narrowed, and the mounting density can be improved. Fig. 4 is an isometric circuit showing the charging of the secondary battery protection circuit of the temperature-stable fuse Ao of the present invention, which is an EFT for the over-discharge prevention switch, and is an EFT for the over-charge prevention switch. n, m is the fuse element portion of the temperature fuse having the resistance of the present invention, r is the film resistance of the temperature fuse having resistance, S is the 1C control portion, Tr is the transistor, E is the secondary battery, and D is Charging source. The FET for overdischarge prevention switch, the FET for overcharge prevention switch, the temperature fuse with resistance of the present invention, the 1C control unit, the transistor Tr, and the like are mounted on the secondary battery protection circuit board. -12- 200917305 In Fig. 4, 'A, B is a lead conductor corresponding to the fuse element side, and C is a lead conductor corresponding to the film resistance side. Since the strip-shaped lead conductors A, B' often have a circuit current, a tin-plated person is used for a general conductive material such as copper or a copper alloy. Only in the case of an abnormality (at the time of overcharge), the transistor switch Tr is turned on by the signal from the 1C control unit, and the current flows to the lead conductor C, and the film resistance r generates heat to blow the fuse element portion m. At this time, the lead conductor C leaks through the lead conductor C in order to prevent the occurrence of the film resistance r. When a metal having a high thermal resistance is used, for example, iron or nickel such as iron or iron alloy is used for tin plating, and the thermal resistance in the longitudinal direction of the lead conductor C is made larger than the thermal resistance in the longitudinal direction of the lead conductor A or B. High is better. Further, the width of the strip lead conductor C may be made smaller than the width of the strip lead conductor A or B. At this time, the electric resistance of the lead conductor C can be made sufficiently lower than the electric resistance of the film resistance r, and high-efficiency heat generation of the film resistance r due to the secondary battery E can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an embodiment of a temperature fuse of the present invention. Fig. 2(a) to Fig. 2(c) are views showing an embodiment of the temperature-resistant fuse having the electric resistance of the present invention. Fig. 3 is a view showing a secondary battery protection circuit board on which a temperature fuse having a resistance of the present invention is mounted. Fig. 4 is a view showing a secondary battery protection circuit board in which a temperature fuse having a resistance is assembled. -13- 200917305 [Main component symbol description 1 : Substrate a, b : Membrane electrodes on both sides 3 : Fuse components 6a, 6b : Barrier 5 : Insulation seal