TW200909552A - Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding - Google Patents

Abstract

Disclosed is an optical adhesive for substrate bonding, which enables to prevent separation and maintain excellent adhesion at the interface between a panel and a protective substrate regardless of temperature change in the environment in which a display device is used, thereby enabling the display device to have excellent display quality. Also disclosed is an optical adhesive cured body for substrate bonding, which is obtained by curing the optical adhesive for substrate bonding. Specifically disclosed is an optical adhesive for substrate bonding, which contains a curable resin represented by the general formula (1-1) below, a cationically polymerizable monomer and a cationic polymerization initiator.; (1-1) In the general formula (1-1), l, m and n respectively represent a number of 1-500; R1 represents H and/or CH3; R2 represents a linear or branched chain alkylene group having 1-6 carbon atoms; A represents a benzene ring or a cyclohexane ring; X represents CR2, O, S(O2) or S; Y represents an epoxy group, an oxetanyl group or an alicyclic epoxy group; Y' represents a ring-opened structure of an epoxy group, an oxetanyl group or an alicyclic epoxy group; and R represents H and/or CH3.

Description

200909552 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to an optical adhesive for substrate bonding, which is not affected by temperature changes in a device use environment, and is on an interface with a panel and a protective substrate. It is possible to maintain excellent adhesion without peeling off, and it is possible to produce a display device having excellent display quality. Further, the present invention relates to an optical adhesive curing agent for substrate bonding, which is obtained by curing the optical bonding agent for substrate bonding. Further, the present invention relates to a substrate bonding optical used in bonding a liquid crystal panel of a liquid crystal display device which is an information communication device, particularly a portable communication device, and a protective substrate for protecting the liquid crystal panel from external impact. The optical adhesive for substrate bonding which is cured by an optical adhesive for bonding a substrate for bonding a liquid crystal panel and a protective substrate; and the present invention relates to an optical adhesive for substrate bonding And an optical adhesive cured body for substrate bonding, which is not affected by temperature changes in the environment in which the liquid crystal display device is used, and does not peel off at the interface between the adhesive cured body and the liquid crystal panel and the protective substrate, thereby maintaining excellent performance. The 'ability' can be made into a liquid crystal display device with excellent display quality. The present invention also relates to an optical adhesive for substrate bonding used in an entire surface between a protective substrate and a substrate, and an optical adhesive cured body for substrate bonding. [Prior Art] In recent years, portable information communication devices such as mobile phones, PDAs (Personal Data Assistance, 200909552 Personal Data Assistant) and notebook computers have been rapidly popularized. In addition to being small and lightweight, these portable information communication devices are required to have an impact resistance and transparency, and in particular, a loss of impact resistance and transmittance of a portion of a liquid crystal display device which is usually required to be used as a display device. It is less and has excellent transparency. ~ As a method of improving the impact resistance of a liquid crystal display device, for example, a conventional method of snagging a squatting method, a liquid crystal panel having a structure in which a liquid crystal is sealed between a pair of transparent substrates and surrounded by a 'shoushan sealant', An air gap (air layer) is provided between the protective substrates for protecting the liquid crystal panel from external impact. ',', as shown in FIG. 2, the liquid crystal display device 2' having such an air layer 23 is stacked and overlapped by materials having different refractive indices of the liquid crystal panel 21, the air layer 23, and the protective substrate 22. The structure is such that external light such as sunlight or a part of light from the backlight is reflected to cause scattering of light, resulting in a problem that the brightness or contrast of the displayed image is lowered. Further, the arrow in Fig. 2 indicates the state of reflection of light. In order to solve such a problem, for example, in the patent document, a transparent elastic resin is interposed between a liquid crystal panel and a transparent member instead of an air layer, and the liquid crystal panel and the transparent member are joined by the transparent elastic resin. Here, portable information communication devices such as mobile phones are sometimes used in a wide temperature range such as -30 to 60 ° C, so that good display quality must be maintained within such a temperature range. However, the Patent Literature Institute. The liquid crystal panel and the transparent member are connected by a transparent elastic resin, and the information communication device of 200909552 is used in such a wide temperature range, and there are liquid crystal panels and transparent members due to temperature changes in the use environment. Peeling occurs at the interface with the cured product of the transparent elastic resin, which causes a problem that the display quality of the liquid crystal display device is lowered. In view of the above circumstances, it is an object of the present invention to provide an optical adhesive for substrate bonding that is not subject to temperature changes in the environment in which the display device is used. The influence "can not be peeled off at the interface with the panel and the protective substrate, and excellent adhesion can be maintained, and a display device excellent in display quality can be obtained. Moreover, another object of the present invention is to provide an optical adhesive for a substrate bonding, which is cured by an optical adhesive for bonding a substrate. The invention is characterized by the following formula (1 - 1) An optical adhesive for substrate bonding of a curable cationically polymerizable monomer and a cationic polymerization initiator. One 2 hu__^2

(1 one 1

In the general formula (1-1), 1 * CH - 1, m ' n is 1 to 500, and R1 represents 直 and/or 亍 represents a straight chain of a carbon number of 1 to 6 and is a county. %% or cyclomethoxazole 70裒, x represents CR2, 0, s(o2) or S, γ represents a ring & oxetan A deca-butyl or hb cycloepoxy, γ represents an epoxy The ring and the oxygen heterocycle exhibit an open-ring structure of an epoxy group, and R represents deuterium and/or CH3. 200909552 Further, the present invention relates to an optical adhesive hardening body for substrate bonding, which is a cured body obtained by using the optical bonding agent for substrate bonding of the present invention, and has a storage elastic modulus of ι χ1〇9 pa at -30C. In the following, the storage elastic modulus of the substrate is 1 X1 06 Pa or more. The present invention will be described in detail below. The inventors of the present invention have an optical system for bonding a substrate to which a panel of a display device and a substrate for protection are bonded. In the case of the hardening of the following agent, it has been found that if the optical adhesive curing system for substrate bonding contains a curable resin having a specific structure, the optical bonding agent for substrate bonding is cured, In the display device, the temperature of the environment is changed, and peeling occurs at the interface between the substrate-bonding optical adhesive hardened body and the panel and the protective substrate, and a good bonding state can be maintained, which is excellent in the display device. In addition, after further efforts, it was found that the optical adhesive for hardening of the substrate for bonding the panel: the protective substrate is a specific error. In the case of the elastic modulus, peeling occurs at the interface between the substrate bonding optical adhesive hardened body and the panel and the protective substrate without changing the ambient temperature of the display device, and a good bonding state can be maintained. The present invention has been completed by the display device. The optical adhesive contains a curable resin resin represented by the above formula (hereinafter, also referred to as the curable property of the present invention, the substrate bonding 1). The lower limit of the factory "η" is 1, the upper limit is 5〇〇, preferably the 200909552 limit is 200, and the preferred upper limit of "m "-"n" is 5〇. The number of bits "is the above formula (M) The repeating unit of the polyoxy 7-membering skeleton in the middle::", the number of repeating units composed of the double-shaped epoxy skeleton, and the repeating unit composed of the poly-stone skeleton and the double-fold epoxy skeleton In the above range, the display device in which the panel and the protective substrate are bonded to the cured body of the photoreceptor for substrate bonding of the present invention is in the hardened body and the panel due to the change in the temperature of the material. also In the above formula (H), R» represents or CH3, and R2 represents a linear or branched alkyl group having a carbon number of 1 to 6, and A represents an exfoliation at the interface of the substrate. a benzene ring or a cyclohexane ring, X represents CR2, hydrazine, S(〇2) or S, Y represents an epoxy group, an oxetanyl group or an alicyclic epoxy group, and γ represents an epoxy group or an oxo group. The ring-opening structure of a butyl or alicyclic epoxy group, and R represents hydrazine and/or CH3. Specific examples of the above X, Y, and Y include the following formulas (1_2) to (1-4). Representer ch3 ch3 x: CHr—, —Ό*, —A— , —o— —*s- ch„ A (1-2)

9 200909552 - In the above formula (1-2) to (1_4), r3, r4, r5_m 虱 or a linear or branched alkyl group having 1 to 6 carbon atoms. In the above-mentioned general formula (^), when A is a % and X is a Cl, the bisphenol epoxy resin and the polyoxyxylene resin can be produced, for example, by a known method. The weight average molecular weight of the curable resin of the present invention is not particularly limited, but a preferred lower limit is 3 Å, and a preferred upper limit is 1,000,000. The curability of the present invention is as described above. When the weight average molecular weight of the resin is less than 3 Å, the amount of unreacted monomers may increase. If the weight average molecular weight of the curable resin of the present invention exceeds 1,000,000, the viscosity may be too high, or may be different. The lower limit of the weight average molecular weight of the curable resin of the present invention is preferably 10,000, and the upper limit is more preferably 50,000. As the commercial product of the above-mentioned double-type epoxy resin, for example, Out: Epikote 828, Epikote 1〇04 (both manufactured by Japan Ep〇xy Resins), bisphenol A type epoxy resin; Epik〇te 8〇6, Epik〇te 4〇〇4 (both Japan Epoxy Resins) Bisphenol F type Oxygen resin; a bisphenol e-type epoxy resin such as R-71 0, etc. Further, as the commercial product of the curable resin of the present invention, for example, an epoxy polyoxyl copolymer manufactured by Nanoresins Co., Ltd. may be mentioned. The trade names "296", "348", "χρ544", "712", etc. of the "ALBIFLEX" series. Further, in addition to the above-described curable resin of the present invention, modified polyfluorene oxygen represented by the following formula (2) may be further blended. Furthermore, the substrate adhesive 200909552 of the present invention containing the modified polyfluorene represented by the following general formula (2), the optical adhesive "can exhibit a stable adhesive force even when the use environment changes" No peeling occurs at the interface with the adherend.

(an integer of 2 to 100, 〇 represents an integer of 0 to 100. At least one of R3, R4, R5, and R6 represents the following general formula (3-1), the following general formula (3-2) or The general formula (3-3), the rest represents H, CH3, . (4-1), -ir or c2h5, or any one of at least one of which represents a passage of a -ί* H, or C2H5, a general formula (4- 2) or the following general formula (4-3), the remaining formula n ^ ^ 1), and the following general formula (5- or any of at least one of them represents the following general formula (5-1 ' ^ C^Hs ° 3 - 1) 2) or the following formula (5-3), the rest denotes Η, L 3 / -fCHaO-^-OCH2 - C^ - ί - eCHj-)r-0 - CHa 3 2)

200909552

(4-1) (4-2)

(5 - 3) Further, in the above formulae (3-1) to (5-3), q represents ib representing 1-3, and R7 represents hydrazine and/or CH3 ' R33 represents hydrogen or a broken linear chain. Or a branched alkyl group 'A1' represents a benzene ring or a cyclohexane ring. In the compound represented by the above formula (2), 3, r 1 to 6 frame portion 12 200909552 The number of repeating units of the knife "p" A preferred lower limit is 1 and a preferred upper limit is 100. By setting the number of repeating units of the polyoxazine skeleton portion to the above range, the epoxy modification represented by the above formula (2) is added. Poly-oxyxene oxetane-modified polychlorinated oxygen as a photo-cationic polymerizable compound, the optical adhesive for substrate mounting of the present month, 'even when the environment is changed, can be stabilized Then, the force 'will not cause peeling at the interface with the adherend. As for the compound having the structure represented by the above formula (2), specifically, the case D can be modified by Shin-Etsu Chemical Co., Ltd. Oxygenated oil, as for epoxy type, "X_22_343", "KF_101", KF-1001"' "x_22_9〇〇2j, etc. As for the alicyclic type, it can be mentioned as follows: "X-22·2046", (the above two are manufactured by Shin-Etsu Milk Co., Ltd.). As for the oxetane type, it can be mentioned as follows: ""X_SQ "〇X,-H", "ΟΧ-SQ Qin 20", "si_〇x", OX SC" (all of the above are manufactured by Toagosei Co., Ltd.), etc. The following agent is not particularly limited as long as it is a polymerizable monomer having a cationically polymerizable functional group in the molecule, and has at least one epoxy in the molecule. a compound having a thioxanyl group, an ethyl bromide group, an episulfide group, a methionine group, a cation group, etc., wherein the photocationic polymerity is high, and even a small amount of light can be efficiently used. The above-mentioned hardening 2 hardening of the present invention can be suitably used in the molecule to ... = 13 200909552 (hereinafter, also referred to as "the epoxy compound is one compound having one oxetanyl group (hereinafter, ―, There is a compound j) in the knives. In the case of the photopolymerizable monomer for substrate bonding of the present invention, it is also possible to use the photopolymerizable monomer in the substrate of the present invention. a compound of the structure represented by the following formula f (6-2).

(6-2) In the formula U-1) and the formula (6·2), p is γ represents an epoxy group, an oxetanyl group or an alicyclic epoxy group, and R1 represents hydrazine and/or CH3, R2 has any one selected from the group consisting of the following general formula (7-1), the following general formula C7-2), and the following general formula (7-3);

14 200909552 In the general formula (7_1), q is 1 to 3, in the general formula C 7-2 ), r is 1 to 3, in the general formula (7-3), R3 is + ττ ^ l ” / or CH3, A1 represents a benzene ring or a % hexane ring. The compound represented by the above formula (6-1) and eb, s ^ ^ ^ and the above formula (heart 2), polyoxyl The weight of the skeleton part is u, and the lower limit of the number of heart soaps "P" is 1, and the upper limit is 1 (9). By setting the number of repeating units of the upper armor layer of the upper armor to the above-mentioned circumference, the panel and the protective substrate are bonded together by the hardened body of the optical bonding agent for substrate bonding of the present invention. The display device is more suitable for preventing the production of 4 4, 丨 MW, U-stripping, and the display quality at the interface between the hardened body and the panel and the protective substrate due to the change in the ambient temperature. Excellent. The preferred lower limit of the number of re-pleased iPA chambers in the poly-oxygen skeleton portion is 3, and the upper limit is 50. The above formula (6_丨) is represented by the formula (6_2): 'specifically, for example, a modified Shishi oil manufactured by Shin-Etsu Chemical Co., Ltd.; For the type, "Μ·, lamp-105", "Χ_22_163 hair", "(4)8", "X-22-163C", etc." As for the alicyclic type, "22" or the like can be cited.牛出.U169AS", "χ_ As for the above oxetanyl compound, there is no particular limitation, for example, phenoxymethyloxetan, 3,3, methoxymethyl) oxaepene (? phenoxymethyl) oxetane, 3_ethyl · Guan ^ ^ its cyclobutyl, 3_ethyl_3♦ ethylhexyloxymethyl) oxirane _ /-3_ί[3_(Diethoxy oxalate)propoxy]methyl}oxetan^-[ethyloxetanyl]]methyl scale, oxetanyl sesquiterpene 15 200909552 Oxygen uxetanyl silsesquioxane), benzene age _ tree gambling oxetane 1,4-double {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, etc. The heterocyclic butyl-based compound may be used singly or in combination of two or more kinds thereof. The epoxy compound and the oxetanyl compound may be used alone or in combination of both. In the combined optical adhesive, the cationically polymerizable monomer is preferably a compound represented by the following formula (8) or the following formula (9) (hereinafter, also referred to as an epoxy compound and/or Oxetane compound) R10— _X (8) XO-^-R17—〇·^~-Χ (9) In the above formula (8) and the above formula (9), Ri6 and Rl7 represent a straight bond or a branch having a carbon number of 4 to 18. Saturated hydrocarbon, η represents an integer of 1 to 5 Å 'X represents the following general formula (10), the following general formula (11), or the following general formula (12): -CH2 - CH - CH2

(10) (11) (12) In the above formula (ίο), the above formula (11), and the above formula (12), "Han 18,! 119, 1^ represents hydrogen or a linear or branched form of carbon number 1 to 0. 16 200909552. The optical bonding agent for substrate bonding of the present invention, an oxygen compound and/or an oxetane compound, can be emulsified by the epoxidation of the epoxidized person and the innocuous transparency. The material and the oxetane compound also have a function as a diluent in the optical bonding agent for substrate bonding of the present invention and the sterilizing agent. r is not particularly limited to the above-mentioned general formula (8) and the above formula (9) +, and the saturated hydrocarbon represented by R" and r17 is not particularly limited, but as r16, butyl, 2-ethylhexyl, and new are preferable. And a pentyl group, a lauryl group, etc., as Rl7, preferably a tetramethylene group, a neopentyl group, a hexamethylene group or the like. The epoxy compound represented by the above formula (8) or the above formula (9) 'There is no particular limitation', for example, butyl glycidol is called (product name "DY-PY", manufactured by Sibu City Synthetic Co., Ltd.)"_Ethylhexyl glycidol (product name "Den(10)i Εχ•(4)" , called 咖^咖^ Company manufacture), (poly) butanediol (2) glycidol (product name "sr_i6h", manufactured by Sakamoto Pharmaceutical Co., Ltd.), (poly) hexanediol (2) glycidol shout (production mouth) "Denacol EX-121", manufactured by Nagase chemteX), (poly) neopentyl glycol (2) glycidol shunt (product name "Denacol EX_221", manufactured by Nagase). Among them, since it has high flexibility and high reactivity, it is preferable to use 2-ethylhexyl glycidol. The oxetane compound represented by the above formula (8) or the above formula (9) is not particularly limited, and examples thereof include: 3-ethyl-3-(2-ethylhexyloxyfluorenyl) Oxetane (product name r Ar〇n〇xetane 〇χτ_212, manufactured by Toagosei Co., Ltd.), 3-ethyl_3·transmethyloxybutane (produced 17 200909552, product name “Ar〇noxetane” OXT_101", manufactured by East Asia Synthetic Co., Ltd.). Among them, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane is preferred because of its softness and high reactivity. Among the above cationically polymerizable monomers, when the compound represented by the above formula (6-2) and the compound represented by the above formula (8) are blended with each other, excellent transparency can be obtained. The compounding ratio of the oxime to the compound represented by the above formula (8) is not particularly limited, and is preferably expressed in terms of the above formula (Μ). The compound represented by the above formula (8) is 5 (% by weight or more) based on the total amount of the compound represented by the above formula (1). As the cationically polymerizable monomer, the viscosity of the obtained substrate-attached light-adhesive agent is based on the following ionic polymerizable monomer. In the case of the above-mentioned other cationically polymerizable monomer, it is not particularly limited as long as it is a m-form in the molecule, and lj has at least one selected one in the molecule. Λ- Αί _ US, 7^ 1 fluorenyl, oxetanyl, terrane 3, thiol, sub-ethyl functional compounds. In particular, it is preferable that the diamine "first cationically polymerizable ^ Dan T is a nucleus-based compound. As for the above-mentioned j-oxygen-based compound, I < 丨Μ #双龄..., particularly limited to, for example, ^ • Latex compound, bisphenol F-type oxygenated compound; phenol_type epoxidation ° <bisphenol-type cyclic compound, cresol novolac type ring servant phenolic epoxy compound, naphthalene 1 oxidation Oral compound, 胃胃1, σ, aliphatic epoxy oxime epoxy compound, heterocyclic porphine compound, biphenyl type epoxy compound, glycidyl, glucosamine glycoether type epoxidation 18 200909552 Compound, glycidol-growth epoxy compound, glycidylamine-type epoxy compound, hydrogenated bisphenol A-type epoxy resin, alcohol-based epoxy compound such as latex compound, halogenated ring such as brominated cyclic emulsion compound Oxygen compound, rubber modified epoxy compound, urethane modified hydroxy compound, epoxidized polybutylene, epoxidized styrene _: styrene "copolymer", epoxy compound containing epoxy compound , π: mercapto group ♦ urethane compound, containing An epoxy group-containing compound or the like. Among them, the field water θ is more suitable for photohardening because it is more polymerized first, so that it can be used more efficiently, so it is suitable to use a compound of a bismuth compound, a naphthalene type epoxy compound, or an alicyclic ring. Epoxy compounds such as oxygen may be used singly or in combination of two or more. The alicyclic epoxy compound is not particularly limited, and examples thereof include W epoxide, 4 ethethylene ring diluted monooxide, ethylene dioxide, and methylated ethylene. Cyclohexyloxydioxoloxycyclohexyl)f-based _3,4_epoxycyclohexanoic acid vinegar, bis(3,4_epoxycyclohexyl) adipic acid vinegar, double (3,4_epoxy Cyclohexylmethylene) adipate 酉 环 环 环 环 、 、 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( a cycloaliphatic group having at least one of the acid groups in the molecule and having at least one molecule in the molecule, such as a solid or a solid compound. The alicyclic epoxy compounds can be used alone to form a chemical group. The above-mentioned epoxy-based compound is not particularly limited. The product name of Japan Epoxy Resins Co., Ltd., for example, 807", "Epikote 828", "Epikote i〇〇i" "Plkoie made by Dainippon Ink Chemical Industry Co., Ltd." ^ Epiclon 19 200909552 HP-4032" and other "., . P n" series, · Manufacturer of Daicel Chemical industries The "CeU〇xide" series, such as "Cell〇xide 2〇21", etc. In the optical adhesive for substrate bonding of the present invention, the content of the cationically polymerizable monomer is not particularly limited, and the present invention is not limited thereto. The curable tree has a weight of about 1 00, preferably a lower limit of 5 parts by weight, and a preferred upper limit is a part by weight. If the content of the above cationically polymerizable monomer is less than 5 parts by weight, the substrate of the present invention is attached to the surface. The hardening property of the hardened material of the oral learner may be changed. The lower limit of the content of the above cationically polymerizable monomer is ι〇 reset, and the upper limit is preferably 3 〇〇. The optimum lower limit of the content of the above cationically polymerizable monomer is 3 〇 (4). The upper limit of Μ is 25 〇. The optical adhesive for substrate bonding of the present invention contains a cationic polymerization agent. ° As for the above cationic polymerization initiator and 7 A right There is no particular limitation on the case where the shellfish acid or Lewis acid is produced by the irradiation of light, for example, the dilute complex, the sulphur diazonium (az. (A. . ^ aromatic rust rust -, aromatic record) (Sul-salt 2 (PyHdinium) 'Scho's complex/shixiol , drawing the appearance of the base = biological, trifluoromethyl acid _N- oxime imimine vinegar derivatives, stupid #,, Heamine ester derivatives, methanesulfonic acid - N_ 醯 imine Yin ' _ N_ 醯 醯Derivatives, etc. Amines, which are commercially available from the above-mentioned cation polymerization initiators, are exemplified by 〇pt〇mer-SP-150, Optomer.sp_17〇J. . are manufactured by Adeka Corporation 20 200909552, manufactured by UVE-1014 (manufactured by General Electronics), Irgacure-261 (manufactured by Ciba Specialty Chemicals), San-Aid SI-60L, San-Aid SI- 80L, San-Aid SI-100L (all three are manufactured by Sanxin Chemical Industry Co., Ltd.), UVI-6990 (manufactured by Union Carbide), 681_102, 881-103, 14? 1-103, Ding? 8·103, DTS-103, NAT-103, NDS-103, RP2074 (manufactured by Green Chemical Co., Ltd.), San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), CI-2064, CI-2639 , CI-2624, CI-2481 (the above four are manufactured by Sakamoto Co., Ltd.), RHODORSIL PHOTOINITIATOR 2074 (manufactured by Rhodia Co., Ltd.), CD-1012 (manufactured by Sartomer Co., Ltd.), WPI-1 13 (manufactured by Wako Pure Chemical Co., Ltd.), etc. . These cationic polymerization initiators may be used singly or in combination of two or more. The cationic polymerization initiator is preferably a cationic polymerization initiator which is composed of an onium salt represented by the following formula (13).

In the formula (13), R", R12 represents hydrogen, a linear alkyl group having 1 to 2 carbon atoms, a branched alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and a tooth. a sulfonium atom, an -OH group, a _c〇〇h group, or a _COO-alkyl aryl group having a carbon number of 1 to 20. R11 and R12 may be different or the same. In the formula (13), X- represents pf6-, Asf5-, bf4- or a boronic acid represented by the following chemical formula (14). 200909552 The above-mentioned cationic polymerization initiator is not particularly limited as long as it is 100% with respect to the above-mentioned sclerosing resin and the above-mentioned cations. Preferably, the lower limit is 〇"heavily, and the upper limit of ν χ is preferably 1 ο重量 X. If the content of the cationic polymerization initiator is less than U ^ part, the above-mentioned curable resin of the present invention may be The cation combination of the cationically polymerizable monomer may not proceed sufficiently, or the hardening reaction may become too slow. When the content of the above cationic polymerization initiator exceeds ig ^ parts, the hardening reaction of the curable resin of the present invention and the cationically polymerizable monomer may deteriorate the workability or become a cured product of the unevenness. A more preferred lower limit of the content of the above cationic polymerization initiator is 〇3 parts by weight, more preferably 5 parts by weight. In the case where the cationic polymerization initiator is a cationic polymerization initiator composed of a tungsten salt represented by the above formula (丨3), it is preferably further contained by the following formula (15). A sensitizer composed of a diphenyl ketone derivative. Us) In the formula (15), R13 and R14 represent hydrogen, the following formula (16-1), and the following formula (16-2). R13 and RJ4 may be different or the same. (16-1) —(16 - 2) In the formula (16-1) and the formula (16-2), R15 represents a linear alkyl group having a hydrogen number of 1 20 and a plurality of branches of 1 to 2 Å. Chain alkyl group, carbon number 1 to 22 200909552 20 alkoxy group, halogen atom, _OH group, _c〇〇H group, or a carbon number ～20-COO-alkyl ester group. In the case of using the cation polymerization initiator and the sensitizer in combination in the case of using the cation polymerization initiator and the sensitizer in combination, the optical adhesive for substrate bonding of the present invention is suitable for use in the subsequent step of optical parts. In general, the photocationic polymerization initiator reacts due to a makeup such as ultraviolet rays, so that the conjugate system is developed and the absorption wavelength shifts toward a long wavelength. Therefore, if there is absorption at 300 to 400 nm, the absorption wavelength shifts toward the visible light region, and it is liable to turn yellow. In the case of an initiator having an absorption wavelength of a wavelength of 3 〇〇 nm or less, even if the absorption wavelength shifts toward a long wavelength, the absorption wavelength does not move toward the visible light region, and the discoloration is less. Specific examples of the sensitizer represented by the above formula (15) include diphenyl hydrazine, 2,4-dichlorodiphenyl ketone, and o-benzhydryl benzoic acid methyl vinegar, and 4 , 4,-bis(diamido)diphenyl ketone, benzoyl fluorenyl _4, _ methyl diphenyl sulfide. The content of the sensitizer is not particularly limited, and the lower limit of the cationic polymerization initiator constituting the cerium salt represented by the above formula (13) is preferably 0.05 parts by weight, and the upper limit is preferably 3 parts by weight. If the content of the above sensitizer is less than 0_05 parts by weight, the sensitizing effect may be weak. When the content of the above sensitizer exceeds 3 parts by weight, the absorption may be excessive and light may not be transmitted to the deep portion. A more preferred lower limit of the content of the above sensitizer is parts by weight, and a more preferred upper limit is 1 part by weight. The optical adhesive for substrate bonding of the present invention preferably further contains a hardening retarder having a structure represented by the following formula (17). 23 200909552 By including such a hardening retarder, the pot life can be extended and the operability can be improved. Further, since it is possible to perform bonding after briefly irradiating light, it is also possible to use light to carry out the subsequent damage-prone member. The hardening retarder having the structure represented by the above formula (17) does not impair the transparency of the composition even when used in combination with the above-mentioned epoxy modified polyoxoxime.

R32 R

20 The above alkyl group may also be selected from a linear or branched carbon number of 丨~2〇 alkoxy group, a halogen atom, a 0h group, a _c〇〇H group and a _c〇〇alkyl ester group ( Wherein, the alkyl moiety is a linear or branched carbon group having 1 to 2 carbon atoms, and the group consisting of 0 or more functional groups is substituted, and further, adjacent

Rn and Rn + 丨 (where n represents a number of 1 to η, and a number of π | 丄丄i) may also form a ring-shaped skeleton. Among the hardening retarders having the structure represented by the above formula (17), those having at least one cyclohexyl group are preferred. By having a cyclohexyl group, the compatibility with the polyoxin resin can be improved, and the transparency can be improved. The hardening retarder having a structure represented by the above formula (17) having a cyclohexyl group is specifically, for example, a bicyclohexane represented by the following chemical formula 24 200909552 (18) and a crown of -18 _6_ ether. %

It is considered that a compound having a structure represented by the above chemical formula (18) has 18 guanidine groups at a position which is linearly symmetrical with respect to a line passing through the center of the 18-crown-6-ether molecule, so that it is in the 18-crown _ The deformation of the 6_ether molecule does not occur on the skeleton, and the effect of improving the compatibility is increased. The content of the hardening retarder is not particularly limited. However, the total lower limit is 0 to 05 parts by weight, and the upper limit is preferably 5 parts by weight based on 1 part by weight of the total of the curable resin and the cationically polymerizable monomer. If the content of the above-mentioned hardening retarder is less than 0.05 part by weight', it may not be sufficient: This: The optical adhesive for substrate bonding provides a retardation effect. When the content of the hardening retarder exceeds 5.0 parts by weight, the escaping gas generated during the curing of the optical adhesive of the present invention may be affected by the escape gas, and the material may be greatly affected by the evolved gas. It is difficult to use the optical adhesive for substrate bonding of the present invention. A more preferable lower limit of the content of the above hardening retarder is 0.1 part by weight, and a still more preferred upper limit is 3 parts by weight. The optical adhesive for substrate bonding of the present invention is preferably a hardener. The substrate to be cured according to the present invention is not particularly limited as long as it contains heat, and the thermal curing agent is provided by the optical adhesive for bonding, and the heat curing agent is not particularly limited. For example, 丨, 3- 25 200909552 A hydrazide compound such as bis[nonylcarbonylethyl-5-isopropylhydantoin], dicyandiamide, guanidine derivative, cyanoethyl-2-benzene Imidazole, N_[2_(2-f-yl-indolyl)ethyl]urea, n-diamino-6-[2,-methylimidazolyl(Γ)]-ethyl-s-triazine, Ν,Ν·_bismethyl-1-imidazolylethyl)urea, N,N,_(2-methyl-oxime-imidazolylethyl)hexanediamine, 2-phenyl-4-methyl Imidazole derivatives such as _5-hydroxymethylimidazole, 2-phenyl-7,5-dihydroxymethylimidazole, modified aliphatic polyamine, tetrahydrophthalic anhydride, ethylene glycol-bis(phenylene) An acid anhydride such as a tristearate or an addition product of various amines and an epoxy resin. These may be used alone or in combination of two or more. In the case of containing the above-mentioned thermosetting agent, the content thereof is not particularly limited, and a preferred lower limit is 〇5 parts by weight based on 100 parts by weight of the total of the curable resin and the cationically polymerizable monomer of the present invention. The upper limit is 30 parts by weight. When the content of the above-mentioned thermosetting agent is less than 5 parts by weight, the thermal curability of the substrate for bonding of the substrate of the present invention may not be provided. When the content of the thermal curing agent exceeds 3 parts by weight, the storage stability of the optical bonding agent for substrate bonding of the present invention may become unstable, and the optical bonding agent for substrate bonding of the present invention may be hardened. The moisture resistance of the material may become insufficient. A more preferred lower limit of the content of the above-mentioned thermosetting agent is 1 part by weight, and a more preferred upper limit is i 5 parts by weight. The optical adhesive for substrate bonding of the present invention preferably further contains an oxime coupling agent. The above-mentioned decane coupling agent mainly functions as a good adhesion aid for the optical adhesive for the substrate bonding of the present invention and the protective substrate. 26 200909552 As for the above-mentioned money coupling agent, it is preferred to use an epoxy-based or oxetane-based sulphur coupling agent. Specific examples include, for example, aglylpropyl group; milk base money, dimercaptopropyl trimethoxy sulphate, p-glycidyl propyl propyl trimethoxy oxalate, and isocyanatopropyl methacrylate Oxygen oxime = 3 (diethoxymercaptopropyloxymethyl) oxetane and the like. 4 The stone stagnation coupler may be used singly or in combination of two or more. As a commercially available person among the money coupling agents, for example, diglycidoxypropyl trimethyl sulfonium ruthenium ruthenium, ruthenium tert- decyl decane (trade name "manufactured by 越越化学公司"), 3_B ΑΓ _ 7 w 仏 仏 仏 ( ( (trade name "TES ^ # 烧 基 propyloxymethyl), ... mouth name TESOX" manufactured by East Asia Synthetic Company). The content of the V Μ ° 并无 并无 , , , , , , , , , , , , , , 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 上述 合 合 合 合 合 合 合 合 合 合 合 合. If the content of the above decane coupling agent is not enough 〇 m ^ ^ ^ Serious injury may be almost impossible to effect the mr coupling agent. If the content of the above-mentioned Shi Xi Xuan coupling agent is over-read, it is possible to generate bubbles due to the escape of gas. The above parts by weight. More preferably, the lower limit is 4 ° '5 parts by weight, and the upper limit is 5 '. Further, the transparentness is not affected, for example, talc, bentonite, carbonic acid #5, titanium carbonate, magnesium hydroxide, calcium strontium sulfate, strontium Mica Active The filler is contained in the range of optical adhesive properties for substrate bonding of the present invention. The filler is not particularly limited, asbestos, cerium oxide, diatomaceous earth, bentonite, magnesium, alumina, microcrystalline kaolinite, magnesia, alumina, glass beads, barium sulfate, gypsum, 27 200909552 clay Or inorganic fillers; or organic fillers such as polyester microparticles, polyurethane microparticles, ethylene polymer microparticles, and acrylic polymer microparticles. Further, the viscosity of the optical bonding agent for substrate bonding of the present invention is not particularly limited, and a preferred lower limit is 〇·〇3 Pa.s, and a preferred upper limit is 300 Pa·s. When the viscosity of the optical bonding agent for substrate bonding of the present invention is less than 3 pa.s, the viscosity is too low. For example, when the display device is manufactured using the optical bonding agent for substrate bonding of the present invention, sometimes The adhesive layer formed on the surface of the panel or the protective substrate cannot flow and maintain its shape. When the viscosity of the optical bonding agent for substrate bonding of the present invention exceeds 300 Pa.s, the viscosity is too high. For example, in the substrate bonding method using the 纟 invention, it is possible to manufacture a display device. Or the thickness of the adhesive layer formed on the surface of the protective substrate may be uneven. The lower limit of the viscosity of the optical adhesive for substrate bonding of the present invention is 〇"Pa.s, and the upper limit is more preferably i〇〇 pa s. In addition, in the present specification, the viscosity is a £-type viscometer (manufactured by Toeiji Industries Co., Ltd., TV_22 type). ^ The value measured by the main J at 25 C, 5 rpm. Further, the optical adhesive for substrate bonding of the present invention preferably has an upper limit of the curing shrinkage ratio of 5%. When the curing shrinkage ratio is more than 5%, for example, when the optical adhesive for substrate bonding of the present invention is cured by polymerization, the shrinkage is increased when the display device is manufactured by using the optical bonding agent for substrate bonding of the present invention. The thickness of the adhesive layer formed on the surface of the panel or the substrate and cured by polymerization may cause unevenness. A better upper limit is 4%. The method for producing an optical adhesive for substrate bonding of the present invention is not limited to 28 200909552. For example, the following methods can be used: a homogenizer, a homomixer, a universal mixer, a planetary agitator, and a planetary type. The curable resin, the cationically polymerizable monomer, the cationic polymerization initiator, and optionally the heat hardener, the breaker coupling agent, and the like of the present invention are mixed by a mixer such as a stirrer, a kneader or a second view. Since the optical adhesive for substrate bonding of the present invention contains a curable resin having a structure represented by the above formula (1-1), the cured body which has been cured by the optical bonding agent for substrate bonding of the present invention will be The display device in which the panel is bonded to the protective substrate does not peel off at the interface between the cured body and the panel and the protective substrate due to a change in the use environment temperature, and is excellent in display quality. Fig. 1 is a cross-sectional view showing an example of a liquid crystal display device in which an optical adhesive for substrate bonding of the present invention is used. As shown in FIG. ,, the liquid crystal display device 10 is a structure in which the liquid crystal panel u and the protective substrate are bonded to each other by the hardened body 13 which is cured by the optical bonding agent for substrate bonding of the present invention, and is incident by an arrow. In the liquid crystal display device, light such as sunlight in the crucible is not reflected by the portion of the protective substrate 12, and the light is scattered. Therefore, the display quality of the liquid crystal display device 1 is different. The optical adhesive for substrate bonding of the present invention can be suitably used, for example, as an adhesive for bonding a substrate to which a panel and a protective substrate are bonded. Among them, it can be suitably used as a bonding adhesive for bonding the entire surface between the substrate and the substrate. The above-mentioned panel is not particularly limited as long as it has a structure in which at least liquid crystal is sandwiched between a pair of transparent substrates such as a pair of 200909552 glass substrates and is sealed with a sealant, and is not particularly limited, and may be exemplified. Previously known. The protective substrate is a member for protecting the panel from external impact, and (4), if the cured product can pass through the visible light and has a sufficient degree of impact (for example, when the mobile phone is dropped) The strength of the impact of the degree of application is not particularly limited, and examples thereof include glass, acrylic resin, polycarbonate resin, urethane resin, and epoxy resin. Further, the optical adhesive for substrate bonding which is cured by the optical bonding agent for substrate bonding of the present invention is also one of the inventions. The optical adhesive hardening body for substrate bonding of the present invention is at _3 (the upper limit of the storage elastic modulus of rc is lxl 〇 9 Pa, at 6 (the lower limit of the storage modulus of rCi storage is lxlO6 Pa. If _3储存c has a storage elastic modulus of more than 贝9 Å, and the display device for bonding the panel to the compliant substrate by the optical adhesive hardening body for substrate bonding of the present invention is used because of the temperature I of the use environment. The interface between the optical adhesive hardener for bonding the substrate of the present invention and the panel and the substrate for shyness is peeled off, resulting in deterioration of display quality of the display device. Further, if the storage elastic modulus at 60 ° C exceeds lxlO6 Pa In the optical adhesive for the substrate bonding of the present invention, the optical adhesive is cured, and the fluidity of the ruthenium is increased. The optical adhesive for the substrate bonding of the present invention cannot maintain the bonding between the panel and the protective substrate. _3 (The preferred upper limit of the storage elastic modulus of rc is 3x10 Pa, and the preferred lower limit of the storage elastic modulus at 6 〇t: is 107 Pa 〇, and the optical adhesive hardening body for substrate bonding of the present invention _5〇艺之30 200909552 Sexual modulus Preferably, the limit is lxl 〇 9pa, and the lower limit of the nucleus of Yusaki is preferably lxl 〇 6Pa. The ruthenium atom of the optical adhesive hardening body for the substrate bonding of the present invention has a preferred lower limit of 3% by weight, preferably The upper limit is 3〇% by weight. If the amount of the Shixia atom 3 is less than 3% by weight, the storage modulus of the substrate-bonded tantalum hardened body of the present invention in the low temperature region may not decrease, and the modulus of the hearing may be When the display device in which the panel and the protective substrate are joined by the substrate bonding agent hardened body of the substrate bonding method of the present invention has a temple low/dish, the optical bonding panel for substrate bonding of the present invention or the protective layer is used. The adhesion of the substrate is lowered, and peeling occurs at the interface Z. The lower limit of the atomic content of the stone is 4% by weight, more preferably the upper limit %. Further, the W content is referred to as the above-mentioned The 7-atom content of the optical bonding agent for the substrate bonding is soft. In addition, the optical adhesive for the substrate bonding of the present invention has a thickness f (the light transmittance in the visible light region is more than 9 G%). The Is2 is less than 9 〇 /. 'The substrate bonding light of the present invention The hardness of the subsequent agent may be insufficient. The display device in which the panel and the protective substrate are joined by the photoreceptor hardener for substrate bonding of the present invention may be lowered. Further, in the present specification, the term "visible light" According to the present invention, it is possible to provide an optical adhesive for substrate bonding, which has the effect of temperature change in the environment in which it is used, and in the panel and the substrate for protection. No peeling occurs on the interface to maintain excellent adhesion. 31 200909552 A display device with excellent display quality can be produced. Further, an optical adhesive hardening body for substrate bonding can be provided, which is an optical adhesive for substrate bonding. It is hardened. [Embodiment] The present invention will be described in more detail by way of the following examples, but the invention is not limited to the embodiments. (Examples 1 to 95, Comparative Examples 1 to 17) The materials shown in the following Tables 1 to 4 were heated to 80 ° C in the proportions (parts by weight) in the table. (Product name "ARE-250" manufactured by Thinky Co., Ltd.) The optical adhesive for substrate bonding of Examples 1 to 95 and Comparative Examples 1 to 17 was produced by mixing for 1 minute. In addition, the names of the manufacturing companies of the materials of the examples and comparative examples shown in Tables 1 to 4 are as follows. (curable resin) 296 (manufactured by Nanoresins) 348 (manufactured by Nanoresins) XP544 (manufactured by Nanoresins) Hydrogenated bisphenol F type epoxy modified polyoxyl resin (Compound A) Hydrogenated bisphenol A type epoxy modified poly Oxygenated Resin (Compound B) Hydrogenated Bisphenol F-Type Epoxy Modified Polyxanthene Resin (Compound A) Synthesis Bisphenol F-type Epoxy Resin Epik〇te 8〇6 (Manufactured by Dainippon Ink Co., Ltd., Epoxy Equivalent) 4 16G) about 12G parts by weight, carbitol modified poly-stone oxygen 32 200909552 Resin KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd., hydroxyl equivalent: 9〇〇g/m〇1) about 300 parts by weight, propylene glycol single About 3 parts by weight of butyl ether, and ethyltriphenylphosphonium aceute as a catalyst relative to 0.2% solid content was placed in a reaction vessel and subjected to a nitrogen gas flow at 1 80 C. The polymerization was carried out for 5 hours to obtain a deuterated bisphenol F-type epoxy-modified polyanthracene resin (Compound a). Synthesis of gasified double-prepared A-type epoxy modified polyoxyl resin (compound b) hydrogenated bisphenol A type epoxy resin γχ8〇〇〇 (made by Japan Ep〇xy ruler (4), epoxy equivalent of 205) About 14 parts by weight, carbitol modified polyoxyl resin KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd., hydroxyl equivalent of 900 g/m〇l), about 300 parts by weight, and propylene glycol monobutyl ether about 3〇〇 The ethyl triphenylphosphonium hydride as a catalyst was placed in a reaction vessel in an amount of 0.2% by weight relative to the solid content of the resin, and polymerization was carried out for 5 hours under a nitrogen gas stream to obtain hydrogenation. Bisphenolphthalein type epoxy modified polyanthracene resin (Compound B). (Cation-polymerizable monomer) KF-105 (manufactured by Shin-Etsu Chemical Co., Ltd.) SR-1 6H (manufactured by Sakamoto Pharmaceutical Co., Ltd.) OXT-212 (manufactured by Toagosei Co., Ltd.) X-22-169AS (Manufactured by Shin-Etsu Chemical Co., Ltd.) (Cational polymerization initiator) Initiator C (chemical formula (丨9) below) 113 (Five gasification disc acid acid salt, manufactured by Wako Pure Chemical Industries, Ltd.) 33 200909552 RP 2〇74 (Ehra salt 'green Manufactured by Chemical Company) SP-170 (diphenyl-4-thiophenyl hydrazine hexafluoroantimonate, manufactured by Adeka Co., Ltd.)

Irgacure 65 1 (manufactured by Ciba Specialty Chemicals)

(delay agent) +

F > (19) One ring has a ''and' 8- 8--6-6 scale (diCyCl〇hexano-1 8-crown-6-ether) (made by Wako Pure Chemical Industries, Ltd.) (sensitizer) BMS (4- Benzoyl-4'-methyldiphenyl sulfide (manufactured by Nippon Kayaku Co., Ltd.) (decane coupling agent) ΚΒΜ·4〇3 (manufactured by Shin-Etsu Chemical Co., Ltd.) TMSOX (manufactured by Toagosei Co., Ltd.)

Epikote 828 (bisphenol-based epoxy resin, manufactured by Ep〇xy)

Epikote 806 (bisphenol F type epoxy resin, manufactured by japan Ep〇xy Resins)

Epikote 4004 (solid bisphenol F epoxy resin, manufactured by japan Ep〇xy Resins) 34 200909552 〇611(^(16 2021?( alicyclic epoxy resin (3,4-epoxycyclohexenylmethyl) -3',4'-epoxycyclohexenecarboxylate), manufactured by Daicel Chemical Co., Ltd.) DCP-A (dicyclopentadiene diacrylate, Kyoeisha Chemical Co., Ltd.)

IBXA (Acrylic Acid Iso Chemical Co., Ltd.) base ester isobornyl acrylate )

Rikacid MH700G Manufacture) Thermo-hardening agent New Japanese physicochemical company 35 200909552 [I i sensitizer 1 BMS ' • • ' ' ' • ' • ' ' • • - ' * ' ' • 1 retarder dicyclohexane And -18·crown-6-ether ' ' - - - • • • ' ' ' ' ' • • ' 矽 偶 coupling TMSOX ' ' 〇〇• * odoo • od ' o' o ' o' 〇• od * o ' o 1 KBM-403 ' 〇c> ' ο O ' • o* 〇• 5 5 * ' 〇oo' o - ooo 〇* • i cationic polymerization initiator SP-170 ' ' • S 〇o' o • ' - ' ooo 1 - ' * • RP2074 ' • do C> ' • ' oo' do ' 1 1 1 • 2 so' o 1 WPI-113J • • • ' • • ' • ' ' • ' 1 ' • 1 • 'i starter c | d 〇5 5 ' * • 5 ooo' • - • • • • - odoo 1 ' • • Cationic polymerizable monomer | , X-22-169AS 500 ' inch' tJ- v〇 • inch • inch v〇 to 1 inch OXT-212 • • • - ' • ' * ' - • • • • - 1 1 SR-16H I * * • • • • ' • < • • • • * - * • ' ' KF-105 ;490 1 inch 1 <N inch • ' (N inch <N • • fS inch - - rs ' < N inch ' <S • | Curing resin j ΧΡ544 ! 705 | ' » * ' • * * • * • ' ' • • * • * ' 〇ooo 2 ooo Compound Β • * • 1 • * 1 ' • ' • • • - - • Compound Α | ' • ' ' • < • * ' , • ' ' ΓΛ I3501 ' - * • 1 oooooooooo 〇o 1 1 1 ) 1 1 1 1 |296| 00 〇〇〇Ο 〇 Ooo 〇o 2 o • 1 - • ' 1 • I 垂 1 1 1 1 • 1 1 1 1 1 Composition | 1 trade name | 1 epoxy equivalent ^ - (N m in VO 00 On o two cs «η Ό 00 Cx (N < N < N w-1 cs \〇 < N 00 fS 〇CM m (S en Example 200909552 - 增 sensitizer BMS • ' • • • * - • > • • - • * - • - retarder ^ vi Λ - • ' • ' • • 1 0.05 1 I 0.025 1 0.05 1 1 0.025 1 0.05 i 1 0.025 1 0.05 1 0.025 1 0.05 i 1 0.025 1 1 0.05 j • * decane coupling agent TMSOX ' ' ' 5 d ' ' 2 2 ' ' 5 ο * ' 3 2 • ' 2 2 ' ' 5 5 « 2 • 5 Ξ • KBM-403 5 Ξ • Ο ο • * 5 ο • Ξ ο - c> 5 5 ο • • ο ο1 1 Ο ο • • 阳离子 Cationic Polymerization Starter SP-170 • 2 Ξ Ξ 5 - - - • • • • 1 • * RP2074 • ' • • • • • • • • • • WPI-113 • σ ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο • - • • - • • • • Cationic polymerizable monomer X-22-169AS 500 ' Ό * • • Ό • ο SO • \0 OXT-212 • ' 'ί· ν〇• * \〇• • 00 • • • Ό ' ο 00 '•Ο SR-16H ' • • • • • • • • • • • • KF-105 490 <N ' * - • • • • • • - • • • • • • • Hardened Resin XP544 705 Ο ο ο Ο • • • • • - • * * • Compound B nitrided A-A skeleton • • • • • • • - * * - ' Compound A i Double F skeleton> • • • • • • • • * - • * • 348 1350 • • • ο Ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο m cn 00 ο, (Λ ο - 5 !ϊ Μ «ο Μ ΙΛ V» s〇Vi 00 •Λ Os «Λ S <s so cn Ό

Li 200909552 [ε sensitizer 1 BMS ' * ' • ' so 0.025 o I 0.025 1 so 0.025 I sd 0.025 | o 0.025 so 0.025 〇0.025 so 0.025 sd 0.025 I o 0.025 ο 0.025 ο 0.025 retarder ι Ί τ • ' * ' • • 1 • - • • 1 • • • i decane coupling agent | TMSOX • • oooo • od 1 oo • o 〇oo • • o ο • ο ο | KBM-403 1 • 5 • 2 5 5 5 ss • 5 s * oooo I ο ο * Cationic Polymerization Starter ι- ; SP-170 - • • • * - - * - ι • • RP2074 • • • • • • • • • • • • • • 'WPI- 113 O oooooooooo 〇ssoooooooooo 5 3 5 ο ο ο s Starting agent C - * • • • • • > • ' - Cationic polymerizable monomer | X-22-169AS Ο inch v〇00 - • VD • inch Ό • For ο OXT-212 o <N inch Ό 00 \〇 inch Ό o rj • inch inch 寸 inch inch v inch inch; SR-16H L_________ - * ' • • v 〇o so 〇1 * - ' 1 ι KF-105 § ' • ' • ♦ • - • • 1 • • • I Hardening Resin XP544 s Bu * * * - • - • • • • • 1 ' * • - • • ι * I Compound B Hydrogenated Double A Skeleton • * * • * • ' • < • • • - • ' oo ο Ο ' • - Compound A Double F Skeleton • - * ' • ' - ' • * 〇〇 Oo - • ' • • μ 1350 〇ooooooo 〇oo 〇〇oooooo • • ι Ο Ο ο ο v〇ON CN 00 • - • • • > • • - • Compose the trade name 4b “ ΦΙ *n O o Ό ίο 00 oo - in oo cs oo 00 ΙΛ 00 v〇oo £ 00 oo 〇\ oo § 5; <Ν Os ο ο 200909552 f,. /.%

I Hardener Diethylenetriamine • • • • • — ' i Rikacid MH700G • • ' - - • • * • • «η d Sensitizer 1 BMS - 0.06 0.06 1 0.06 II 0.06 I 0.06 1 0.06 I 1 0.06 II 0.06 II 0.06 I 1 0.06 I 1 0.06 I • * • Delay system ^ so '1 7 • 5 o' - • • oooo © • • Cationic polymerization initiator Irgacure 651 ' • ' ' - • - • - • ' ' <so SP-I70 • ' * • • <N * RP2074 ' ' - (N r4 d • * ' • 1 WPI-1I3 ' fM 〇(N 〇(N o' (S o' <so * ( N • • * • 1 starting system! C fS d • • ' (N d ' ' * • * Cationic polymerizable monomer | X-22-169AS '———.500 J ' oo 〇> 〇* SR -16H • ooo • 〇- • Hardenable resin [2%) other than IBXA ' • - * • DCP-A • • - * - ' ' • * Ό , CeUoxide 202 IP • • • • ' ' ' ' * ' ' ' * ' Epikote 4004 • ' • • • Yes • • CO ' Epikote 806 • * * • ' • - ! Epikote j 828 • Tf ' • • 〇* m ' , modified poly 矽 ί__^_ 1 490 1 ο • • o • • * * • ' Curable resin 296 * • oa • - Composed of trade name 1 ring equivalent —is </) v 〇 00 On O - fS 2 200909552 (Evaluation) The optical adhesives for substrate bonding prepared in the examples and the comparative examples were evaluated as follows. The results are shown in Tables 5 to 8. (1) Storage elastic modulus The optical bonding agent λ<11_ for the substrate bonding is applied to the glass substrate and transferred to the glass substrate; ^ Λ eight early, spoon For 1 mm '125 mJ with UV light. Thereafter, the reaction was terminated by heating at 8 ° C for 1 Torr, and the reaction was terminated to obtain a cured article of the substrate and the comparative example. Using a viscoelastic spectrometer (manufactured by ιτ Measurement and Control Co., Ltd., DVA-200) manufactured by Ε!, the optical adhesive hardener of the substrate for bonding was stretched at a temperature range of -6 〇 to 12 ° C. Elasticity, the storage elastic modulus was measured under the condition of a vibration number of 10 cycles/second. (2) Optical characteristics (initial light transmittance) The distance between the glass sheets having a thickness of 1 mm is maintained at intervals of 1 Å, and the substrate bonding opticals and coatings produced by the examples and the peaks are added between the glass. After the ray was irradiated, the sample of the examples and the comparative examples were separately prepared by keeping the underlayer at a level to make the adhesive harden. Using the obtained sample, the absorbance at wavelengths of 4 〇〇 nm, 550 nm, and 780 nm was measured using a spectrophotometer (Hitachi, Ltd., "U_3000", condition 300 to 800 nm), and the initial transmittance was calculated. . (Light transmittance after heat resistance test) - The samples of the examples and comparative examples produced by the above method were placed in an oven (model, perfect 〇ven 200909552 PH-201) manufactured by Espec Co., Ltd., 85 C. The heat resistance test was performed for 1 hour. Then, the absorbance of each sample at wavelengths of 4 〇〇 nm, 55 〇 nm, and 78 测定 was measured by a spectrophotometer (manufactured by Hitachi, Ltd., U-3000, conditions: 300 to 800 nm), and the heat resistance test was calculated. Transmittance. (Light transmittance after light resistance test) Use light resistance Weather_〇meter (Suga Dingru) (4) (7) Mail (10) a system w, "Super Xenon Weather Meter (SX75)" The samples of the examples and comparative examples prepared by the method were subjected to a light resistance test for 1 hour. Then, using a spectrophotometer ("U-3000", manufactured by Hitachi, Ltd., condition 3 〇〇 to 8 〇〇 nm)", each sample was measured for light resistance at a wavelength (10), 55 〇 nm, and absorbance at the end. Light transmittance after the test. (3) Peel test The i weight was added to the optical adhesive for substrate bonding manufactured in the examples and the comparative examples. /. The large-sized microparticles of the diameter of 100 (SP-LHH), manufactured by Sekisui Chemical Co., Ltd., were placed on a glass substrate of 1 mm × 100 mm without gaps, and the opposite acrylic sheets were bonded. The ultraviolet irradiation of (10) (10) was carried out, followed by holding for 30 minutes under _ and then terminating the reaction. After that, the test is carried out at -40 ° C (30 minutes) χ 85 ring test (Heat Cycle will not be able to confirm the peeling. (: (30 minutes) conditions, the heat is applied to the test) to visually confirm the presence or absence of peeling. "〇" will confirm the stripper as "χ 41 200909552 ίν.- \ -3⁄4

Storage elastic modulus (Pa) I loot 5.0xl06 5·0χ106 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 I 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0 Xl06 5.0xl06 5.0x106 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 1 5.0xl06 5.0xl06 i 5.0xl06 5.0χ106 5.0xl06 1 S 6.0xl06 6·0χ106 6.0xl06 6.0xl06 5.0xl06 6.0x106 7.0xl06 7.0xl08 6.0xl06 7.0xl06 7.0xl06 i 6.0xl06 7.0xl06 5.0xl06 7.0xl06 I 5.0xl06 5.0xl06 1 7.0xl06 ! 7.0xl06 I 6.0xl06 5.0xl06 | 5.0xl06 6.0xl06 5,0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 1 5.0xl06 , 5.0xl06 S .OxlO6 5.0xl06 1 P 7.0xl06 ; 6.0xl06 1 7.0xl06 l.OxlO7 l.OxlO7 7.0xl06 ! l.OxlO7 l.OxlO7 1 I 8.0xl06 I l.OxlO7 l.OxlO7 I l.OxlO7 l.OxlO7 7.0xl06 I l.OxlO7 j 6.0xl06 6.0xl06 1 I l.OxlO7 | l.OxlO7 I l.OxlO7 [6.0x106 I l.OxlO7 8,0xl06 5,0xl06 7.0xI06 6.0xl06 7.0xl06 7.0xl06 ! 7.0xl06 ;6.0xl06 1 ό .ΟχΙΟ6 1 5.0xl06 | 1.0x10s 1 l.OxlO8 L 7Oxl07 | 8.0xl07 1 I 8.0xl07 I 7.0xl07 l.OxlO8 9.0xl07 I l.OxlO7 I 6.0xl07 I 6.0x107 I 7.0xl07 I 7.0xl07 1 5.0xl07 7.0χ107 II 8.0xl07 II 7.0xl07 1 I 1.0x10s , I 1.0x10s I 8.0xl07 I 6.0x107 II 1.0x10s II 7.0xl07 I ! 7.〇xl07 I 1.0x10s I 1.2x10s II 1.0x10s I ! 1.0x10* 1.0x10s , l.lxlO8 I 1 l.OxlO8 I l.OxlO8 | 〇»n 1.0x10® I l.OxlO8 I | 8.0xl07 | 1_ 9.0xl07 1 | 9.0xl07 I 8.0xl07 I 1 1.0x10s I 1 1.0x10s 1 | l.OxlO7 : 1 7.0x107 I 1 6.0x107 II 8.0xl07 I 8.0xl07 j | 6.0x107 | 8.0xl07 1 9.0x107 I 1 8.0xl07 I l.OxlO8 I 1 1.0x10s I | 9.0xl07 | 7.0xl07 | 1 1.0x10s II 8.0xI07 1 8.0xl07 I | 1.2x108 I | 1.3x10s I *x ! 1.0x10s I l.OxlO8 I , _ 1.2xl08 I 1 l.OxlO8 I 1 Peel test 〇o 〇〇〇〇 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇1 Optical properties (transmittance %) | After light resistance test | 400 nm iy*i 〇\ On On Ss &lt;s 〇\ 〇\ ΓΛ (N Os ON o ON \〇〇\ «η ON Ov in 〇\ v〇Os αϊ o 〇\ Os Os os un «η ON 550 nm 1 oooo 〇oo 〇〇O oo 〇〇〇oooooo 〇〇oooooo Ooo 00 s 0\ Ό Qs oo 〇\ S OS 〇\ S\ 1 780 nm ; oooo 〇o 〇ooo 〇〇o 〇ooooooooooo 8 o 〇o O o O | After heat resistance test | 1 400 nm Ό mo 茳ΙΛ ON Ό Os 〇Γ0 os &lt;N Sv Ό o\ 〇 & \ &&lt;N a\ '•O 〇\ cs Cv 荽mo ON no tn Os v〇〇\ VO Os Os s | 550 nm , 〇ooooo 〇〇〇oooooooo 〇o 8 oo 〇〇oooooo OO es σΐ 〇so OO Os σΐ Os Os ON | 780 nm | oooo 〇ooooooooooooooooooo o 8 ooo ο oo • Yun | 400 nm | os On Os 〇\ ON Os Os as On 〇\ 〇\ as On Os 〇\ OS o 〇\ 〇\ o 〇\ 〇\ oo On 〇\ σ\ o Os ON o Os Q\ Os as ON ON σ\ OS OS 〇\ On 0\ 00 σ\ 〇 s \〇OS 00 o ON σϊ σ\ 茳| 550 nm | 〇ooooo 〇oooooo 〇〇oosoooo 〇ooooooooooooo 00 〇\ o\ Ό On ON 00 OS 〇\ o σ\ 1 780 nm | 〇ooo 〇ooooo 〇8 o 8 ooooooooooooooo 〇oo ο o ο cs v〇 oo Os o (N inch o 00 〇 &&lt;s C -4 fS cn &lt;N rl uv &lt;N 〇0 &lt;N On tN 200909552 [9&lt;] Recreational P 〇5.0xl06 5.0xl06 5.Οχ 106 i 5.0χ106 1 5·0χ106 5.0χ106 1 5.0χ106 1 1 5.0χ106 1 5.0χ106 1 5.0χ106 I 'χ ui 1 5.0χ106 1 X «η I 5.0χ106 1 1 5·0χ106 1 5.0χ106 5·0χ106 5.0χ106 I 5.0χ106 1 1 5.0χ106 1 1 5·0χ106 1 1 5.0 Χ106 I 5·0χ106 I 5.0χ106 I 5·0χ106 I 5.0χ106 1 ! 5.0χ106 1 I 5.0χ106 II 5.0χ106 1 5.0χ106 1 5.0χ106 1 5.0χ106 1 PS 'x «η 'xi/S U1 X 'χ &gt ;vi 'χ t&gt; »η υ-ϊ 'χ 卜'Ό *χ ν&gt; iri ό 'χ 'χ 卜· ιτί § 卜· iri 'χ § 卜 · 'χ 卜 · 'χ ό' *χ ιτΐ X Ιη ο &lt;&gt; Bu·· νί I 'χ νί X νί PX Bu·X \ό 'χ IT) 'χ 'χ '•ό X 2 &quot;χ X 'Ό 'χ 'χ οο »ri 'χ卜·· X &quot;χ 'ό &quot;χ 'χ ό' 'χ X 00 XX Bu·· Bu· Bu·· *Χ ν〇P r&lt;p 'x t&gt;- X &quot;χ 00 § § 00卜·· X 'χ &quot;χ οο 1&lt; '•ό § 卜··卜' 1 Loms 1 Γ-· *χ 00 'χ 卜' 'χ 00 'Ο XS 'χ卜' Ϊ́ΐ »Λ 'χ P «η 3&lt; 〇d 卜·1 lo\x〇l I &quot;χ 〇〇 〇〇' 'χ 'χ οο 〇\ *χ οο &quot;χ X σ&lt; 卜^ ΟΟ 1 〇6 〇〇X οο σ\ οο § [9.0x107 卜·S 00 ΟΟ Ϊ Ό* X \ό *χ ΟΟ 〇0 〇〇〇〇〇〇ο 〇〇〇〇Ο ο 〇〇〇〇〇〇〇Ο 〇〇 〇〇〇ο Ο 〇〇Sw/ ±i 袭 3d 1 ο &quot;«r ΓΛ ON ΙΛ 〇 〇 \ V£) 〇\ ν〇〇\ 1/-Ι 〇\ Ό ΟΝ 〇\ ν〇Os 〇\ Ό 〇 \ ON l〇〇\ VD OS ν£3 Ο ΙΛ ο ν〇〇\ Ό Ον σΐ \〇〇Ν 〇\ 00 〇\ ν〇Ο »Λ) Ον 1 1 Wi 〇σΐ ON Os 〇\ ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i 〇\ ΟΝ ν〇ΟΝ νο 〇\ S tN Ο 〇\落Ον σ\ 〇\ 茇«Λ Ο αΐ Ss νο ΟΝ m 〇s Γ Ί ο ο νο 〇s ν〇σ&gt; 〇\ ΟΝ Ο &amp; 1 1 ΙΛ) 〇\ Os c·^ &amp; Ο θ'. Ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο 〇 & 〇 〇 & ΟΝ ΟΝ ΟΝ ΟΝ ΟΝ ΟΝ ΟΝ ΟΝ ΟΝ ο 〇 O O O O 〇 O O O O O OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS OS Os Os OS OS ΟΝ ΟΝ Os 〇 OS ο σ Ο ΟΝ ΟΝ ο os Os 〇 \ 1 1 «ο On Os σΐ &amp; 〇\ σ\ ο Ο Ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ΙΛ m Ό Ρ: οο m ΟΝ ο - IAJ Μ ΐη &lt;Ν ιη m νν ν*ί «Λ Ό «η 00 ο, • S ίο '«Ο VO S ί 5 200909552 ^ £100°C 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0x106 5.0xl06 5.0x10s 5.0x106 5.0x106 5.0xl06 5.0xl06 5.0 X10* 5.0xl06 I | 5.0xl06 I 5.0x106 | 5·0χ106 I ! 5.0xl06 I 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 Storage Elastic Modulus (Pa) P § 7.0x106 7.0xl06 6.0 X106 5.0x10s 5.0xl06 6.0xl06 5.0xl06 7.0xl06 1 5.0xl06 I 7.0x106 5.0xl06 5.0xl06 7.0x106 7.0x106 | e.oxio6 | 5.0xl06 5.0xl06 6.0xl06 5.0xl06 5.0xl06 5.0xl06 6.0x106 | 5.0xl06 I 5.0xl06 5.0xl06 6.0x106 5.0xl06 5.0xl06 5.0xl06 | 6.0x106 I 5.0xl06 P l.OxlO7 7.0x10s 7.0xl06 6.0xl06 l.OxlO7 | 8.0xl06 I 5.0xl06 l.OxlO7 5.0xl06 7.0x10s 7.0xl06 6.0xl06 l.OxlO7 7.0 Xl06 7.0x106 | 6.0x106 I | 7.0x106 I 8.0xl06 5.0xl06 6.0x106 7.0xl06 8.0xl06 5.0xl06 6.0x10s 7.0xl06 8.0xl06 5.0xl06 l.OxlO7 l.OxlO7 | 8.0xl06 I | 5.0xl06 I -30°C 1.0 X10s 5.0xl07 | 5.0xl07 I 6.0x107 7.0xl07 | 7.0xl07 I 7.0xl07 7.0xl07 7.0xl07 5.0xl07 | 5.0xl07 I | 7.0xl07 ] | 1.0x10s I | 5.0xl07 I 5.0xl07 6.0xl07 5.0xl07 5.0xl07 4.0xl07 6.0xl07 5.0xl07 7.0xl07 7.0x107 6.0xl07 5.0xl07 | 5.0xl07 I | 7.0x107 I 7.0xl07 7.0x107 7.0x107 7.0x107 P ο »Τ) 1.0x10* | 6.0xl07 I | 6.0xl07 | | 7.0xl07 I | 8.0xl07 I | 8.0xl07 I | 8.0xl07 I | 8.0xl07 I | 8.0xl07 1 | 6.0xl07 1 | 6.0x107 ] | 8.0xl07 I | 1.0x10s I | 5.6xl07 I | 5.7xl07 I | 6.5xl07 1 | 5.5xl07 I | 5.4xl07 I | 5.8xl07 I | 7.2xl07 I | 6.1xl07 I | 8.2xl07 I | 8.0xl07 I | 6.8xl07 I | 5.7xl07 I | 5.8xl07 I | 8.0xl07 I | 8.0x107 I | 8.0xl07 I | 8.0xl07 I 8.0xl07 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇 〇〇Optical characteristics (transmittance %) 400 nm o 00 Os 00 ON VO C\ iTi Os 00 Os 00 ON Vi ON VO ON ON 〇\ 00 Q\ a\ Os Ό ON 00 OS 〇\ 后\ oo 00 OS ON ON On 00 00 ON 00 On ON VC ON Os 550 nm o 〇〇ooooooooooooooooooooo ooooooooooooo 780 nm oooooooooooooooooo Oooooooooooooo Μ $ί 41 400 nm 〇\ o σ\ 〇\ om σ\ ΓΟ Os αΐ 〇\ 00 ON S\ Si 00 〇\ 00 On 00 〇\ os Os OS ON Os Os 00 OS os 00 ON On 〇\ Os 〇\ 〇\ 00 Os 〇\ 〇\ as Os &lt;N as 〇\ 芸ΓΛ OS 550 nm ooooooooooooooooooo ♦·« ooooooooooooooooo 780 nm ooooooooooooooooooo ooooooooooooooooooo 400 nm ON 〇\ ON ON Os Os ON 〇\ Os O'* Os Q\ON σ\ 〇\ ON ON ON os as a\ Os 〇\ ON 〇\ a\ Os σ\ OS 〇\ 〇\ ON 〇\ Os 〇\ as Os as 〇\ 〇\ ON ON 〇\ 〇\ σ \ ON o On 〇\ ON a\ OS o ON 〇\ Os σ\ Os 550 nm ooooooooooooooo PM ooooooooooooo — ooooo mm o — oooooo 780 nm ooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooooo 00 &lt;N 00 00 s 00 Ό 00 00 00 00 OS 00 § CS Os ON OS Ik 5 200909552 Storage Elastic Modulus (Pa) 100°C 5.0xl04 5.0x L06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 5.0xl06 I 5.0x106 5.0xl06 I 5.0xl06 I 5.0χ106 60°C 7.0x103 6.0xl06 6.0xl06 6.0xl06 6.0xl06 6.0x106 6.0 X10s 6.0xl07 6.0xl07 7.0xl07 5.0xl07 6.0x106 8.0x106 l.OxlO7 l.OxlO7 8.0x106 Ι.ΙχΙΟ7 20°C 1.0x10s 9.0x107 9.0x107 9.0x107 9.0xl07 9.0xl07 9.0xl07 9.0xl07 9.0x10s 8.0xl08 7.0xl07 9.0 Xl06 l.OxlO7 3.0xl07 3.0xl07 9.0xl06 3.6χ107 -30°C 6.0xl07 9.0x109 9.0xl09 9.0xl09 9.0x10s 9.0xl09 | 9.0xl09 9.0x10s l.OxlO10 [l.OxlO10 ! 9.0x10s 8.0xl09 9.0x10s 8.0xl09 | 9.0xl09 I 8.0xl09 l.OxlO10 -50°C 6.0xl07 1 2.0xl010 | 1 2.0xl010 I 2.0xl010 2.0xl010 2.0xl010 2.0xl010 | l.OxlO9 ] | 2.0xl010 I | 2.0xl010 I l.OxlO5 | l.OxlO10 I 2.0xl010 2.0xl010 | 2.0xl010 I | l.OxlO10 I 1 1.8χ10ι° 1 Peel test XXXXXXX 〇XX 〇XXXXXX Optical properties (transmittance %) 400 nm after light resistance test<N CN 00 sm Ό 〇\ s 00 00 S 00 Ό Ό its (N (Ν 〇\ 550 nm 00 00 00 00 o oo Ό 00 00 v〇00 v〇00 &lt ;〇00 00 ON 00 ON 〇\ 〇\ jn 00 VO «»* 00 «Λ Ό ΟΝ 780 nm ooi 100 00 00 00 00 00 00 00 00 00 00 00 00 ooo 100 100 oo 100 o ο ο Ο ο Heat resistance 400 nm 00 00 3 after test (N s 3 S 8 m On (N 00 00 v〇m (N 00 «η 冢550 nm 00 Os 00 ON g ss S s; ss ss 00 ON 00 〇\ 00 ON ss 〇 s 〇 780 780 00 00 00 00 00 00 00 00 00 00 00 00 00 ooooo 〇〇100 〇\ON 〇\ 〇\ Os Os 00 OS 550 nm oo S; 〇\ 00 (N 00 gg § o 〇ooo 100 ooo 100 ο ,780 nm oo 00 oo 00 00 SJ 00 00 00 00 00 00 o 〇oo 100 100 oo ο ο &lt; N m to in VO 00 Os 〇m 'sO 卜 200909552 [Industrial Applicability] According to the present invention, it is possible to provide a substrate-attachment without the display device estimating the sputum agent, The effect of the temperature change of the environment is not directly used, and the boundary of the substrate is protected. L ^ ^ does not peel off with the panel and the support, and the dimensionality can be made into a display, which can be made into a display. Then only Not a device with excellent oral quality. Further, since the board bonding is used for the purpose of curing, the substrate bonding agent is hardened. [Brief Description of the Drawings] FIG. 1 is a cross-sectional view showing an example of a liquid crystal display device using the substrate of the present invention. Fig. 2 is a view showing a conventional liquid crystal display device. [Explanation of main component symbols] 10, 20 LCD display device 11, 21 LCD panel 12, 22 Protective substrate 13 Hardened body 23 Air layer 46

Claims (1)

200909552 X. Patent application: An optical adhesive for substrate bonding, which comprises a curable resin represented by the following general formula (1-1), a cationically polymerizable monomer, and a cationic polymerization. Starting agent, η) I ~v (Bu 1) pass, (Kl), b m, n is 1~5 00, R] means h and / bite CH ^ R is not a carbon number 丨 ~ 6 linear or branched extension Alkyl, a table: benzene% or % hexane ring, X represents CR2, hydrazine, S(02) or S, Y represents an epoxy group, oxetanyl or alicyclic epoxy group, Y represents a ring The ring-opening structure of an oxy group, an oxetanyl group or an alicyclic epoxy group, and R represents hydrazine and/or CH3. 2. The optical adhesive for substrate bonding according to the first aspect of the invention, wherein the cationically polymerizable single system has the following formula (6-1) and/or the following formula (6-2); Structure of compound R1 'R2+ gas 丨-O-^-R2· (6 - 1 The general formula (7-2) and the lower R2 have a iodine selected from the group consisting of the following general formula (7-1) and the following general formula (7-3): 200909552 (CH2°) q (7-1 ) (CH2)r (7-2) In the formula (7_3), R3 represents H and/or CH3, and A1 represents a benzene ring or a cyclohexane ring. 3. The optical adhesive for substrate bonding according to the first aspect of the invention, wherein the cationically polymerizable single system is a compound represented by the following formula (8) or the following formula (9): R15~ΟX (8) X 0—(−R17~〇^-x (9) In the general formula (8) and the general formula (9), R16 and !^7 represent a linear or branched saturated hydrocarbon having a carbon number of 4 to 18, η An integer "X" representing 1 to 50 represents the following general formula (1〇), the following general formula (11) or the following general formula (12) '-CH2-CH-^CH2 (10) V/ R 18 'C H2—C—C ch2-o ch2 R10 (11) 200909552 Formula (ίο), 诵4, /,, Formula (11) and Formula (12) Φ r&gt; 18 R No oxygen or stone anomaly 1~ R, a linear or branched alkyl group. 4. For the patent application, Fan Yi Chu 1 E, the three-layer substrate bonding optical connection is in the general formula (8) or 诵_v... Some of the test agents ' ^ The compound represented by the general formula (9) is 2-ethlyl glycidyl ether and/or 3 faecal has been 3-ethyl-3-(2-ethylhexyloxy) Methyl)oxane. Clothing J ^, as in the scope of claims 1 to 4 of the patent application, the photoconductor for substrate bonding is followed by The ionic polymerization initiator is composed of an onium salt represented by the following formula (13) (13) In the formula (13), R&quot;, R12 represents fluorene, a linear alkyl group having 1 to 2 carbon atoms, a branched alkyl group having 1 to 20 carbon atoms, an alkoxy group having 20 carbon atoms, a halogen atom, an -OH group, a -COOH group, or a C 1 -alkyl group having a carbon number of 1 to 2 Å, and R' and R 12 may be respectively different or the same; I In the formula (13), X- Indicates PF6—, Asf5-, bf4-, or sulfonic acid r FP represented by the following chemical formula (14) The optical adhesive for substrate bonding according to the fifth aspect of the invention, which further comprises a sensitizer 49 composed of a diphenyl derivative represented by the following formula (15) ( 15) (15)200909552 In the formula (15), R13 and rm are hydrogen-bearing, and the following formula (16: the following formula (16-2); R13 and Ri4 may be different' or may be the same In the formula (16-1) and the formula (16-2), Rl5 represents hydrogen, a linear alkyl group having 1 to 20 carbon atoms, a branching group having a carbon number of 1 to 2, and a carbon number of 1 to 2. 20 alkoxy group, halogen atom, -OH group, _COOH group, or a carbon number of 1 to 2 - C Ο Ο - a group of S. The optical adhesive for substrate bonding according to any one of claims 1 to 6, further comprising a hardening retarder having a structure represented by the following formula (17); In the formula (17), at least one of R21 to r32 represents a carbon group, and the rest represents hydrogen. 50 200909552 Adhesive for board bonding. 9. Kind of substrate bonding with a wind I. ^ Oral meta-adhesive hardening body, which is made of the optical bonding agent for substrate bonding according to the cup _ τ Ε τ of the patent scopes 1 to 8 The hardened body is characterized in that: 〇C has a storage elastic modulus of lxlO9 Pa or less, and a storage elastic modulus of 6 〇 °c is lxl 〇 6 Pa or more. '1'. The optical adhesive for substrate bonding according to claim 9 of the patent application, wherein the spleen @^ τ; when the degree is set to 0.1 mm, the light transmittance in the visible light region is 90% or more. XI. Schema: as the next page 51