200844369 t 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種利用發光二極體晶片的光源，尤其是 有關於一種利用發光二極體晶片提供二種以上照射角度的光 源。 【先前技術】 本說明書所稱的「光源」（light source)是指像是白織燈 ^ 泡、日光燈管等將電能轉換為光能之裝置。絕大多數的光源 提供的是各個方向的光線，因此通常有極為廣泛的照射範圍。 在某些需要將光線集中在一定照射角度範圍内的應用 下，就會以結合適當的燈罩、反射鏡、聚光鏡的方式，將這 些光源包裝成各種型式的燈具(lamp)，像是檯燈、手電筒、或 是路燈等。 還有一些應用，則是需要能提供二種以上的照射角度， 、 像是手術燈、車燈等，以便能分別提供照射角度小、小範圍 聚光的照明、以及照射角度大的大範圍的照明。這些應用也 通常是要結合適當的燈罩、反射鏡、聚光鏡、以及相當複雜 的控制機制（例如改變反射鏡的角度）才能達成，也因此這 些應用的燈具的成本通常相當高。 【發明内容】 本發明提出一種新穎的光源，利用發光二極體（light 200844369 ♦ emitting diode，LED )晶片（chip )本身即具有一定出光角度 的特性，來構成能提供至少二種以上照射角度的光源。 本發明至少包含複數顆、分為至少二組的發光二極體晶 片、以及一個輸電開關。第一組發光二極體晶片的出光角度 為;第二組發光二極體晶片的出光角度為02，而且eeei。 第一組發光二極體晶片是電氣連結在一起，第二組發光二極 體晶片也是電氣連結在一起而置於第一組發光二極體晶片的 外圍。這二組發光二極體晶片再分別並聯到輸電開關。輸電 開關可以選擇單獨供電點亮所有居中的小出光角度的第一組 發光二極體晶片、或是單獨供電點亮外圍的大出光角度的第 二組發光二極體晶片。 茲配合所附圖示、實施例之詳細說明及申請專利範圍， 將上述及本發明之其他目的與優點詳述於後。然而，當可了 解所附圖示純係為解說本發明之精神而設，不當視為本發明 〜 範疇之定義。有關本發明範疇之定義，請參照所附之申請專 利範圍。 【實施方式】 本發明至少包含至少二組、每組至少一顆的發光二極體 晶片。第一組發光二極體晶片的出光角度為;第二組發光 二極體晶片的出光角度為θ2，而且θβθ!。換言之，第二組所 選用的發光二極體晶片的出光角度都要大於第一組所選用的 200844369 發光二極體晶片。請注意到，一般發光二極體晶粒在封裝成 晶片後，其發光或出光角度就被固定下來了，這也是發光二 極體晶片重要的規格參數之一。除此以外，本發明對於發光 二極體晶片所採用的發光技術、光色、亮度、瓦數、以及封 裝方式等均不特別設限。 第1圖所示係本發明之電路示意圖。如圖所示，第一組 10和第二組20的發光二極體晶片12、22是各自獨立並聯在 一起。每一組發光二極體晶片的電氣連接方式也可以是串 聯、或是串聯並聯混合。其重點在於同一組的發光二極體晶 片可以在供電時同時點亮。這兩組發光二極體晶片接著再分 別並聯到輸電開關30(可以是一個機械開關、一個電子開關、 或是一個控制晶片）。輸電開關30控制一直流電源40施加到 這兩組發光二極體晶片。如圖所示，輸電開關30可以選擇單 獨供電點亮所有第一組10的發光二極體晶片12、或是單獨 供電點亮所有第二組20發光二極體晶片22。此外，稍加變 化，輸電開關30可以增加一個同時供電給第一、二組10、 20發光二極體晶片12、22的選擇。 第2a、2b圖所示係本發明之一第一實施例之正視與剖視 圖。如圖所示，第一組10的小出光角度的發光二極體晶片 12是設置於圓形基板50上，第二組20的大出光角度的發光 二極體晶片22則是設置於環形基板52上而圍繞於第一組10 7 200844369 t 的發光二極體晶片12之外。將發光二極體晶片分布於多個基 板有助於降低維修的成本。基板50、52通常是採用金屬材質 (例如銅或鋁）以提供良好的散熱，並塗佈有適當的絕緣層 以及提供電氣連接的線路，為了簡化起見，絕緣層與線路在 圖中被省略了。請注意到，基板的材質、片數、幾何形狀、 排列方式可以有多種變化，而非以圖示者為限，例如基板50、 52也可以是電路板。其重點在於至少有一組大出光角度的發 光二極體晶片22是設置於一組小出光角度的發光二極體晶 片12之外圍（未必是環繞）。 如第2b圖所示，經由輸電開關30 (未圖示）的控制， 當居中的小出光角度的發光二極體晶片12被點亮時，本發明 的光源提供的是一聚光的小角度的照射範圍（如圖中虛線所 示）；而當外圍的大出光角度的發光二極體晶片22被點亮 時，本發明的光源提供的則是一泛光的大角度的照射範圍。 第3a、3b圖所示係本發明之一第二實施例之正視與剖視圖。 本實施例和前一實施例基本上完全相同，唯一的差別是基板 50、52之間有一個相對的傾斜角度φ，以適用於類似車燈、 有近光與遠光的應用。例如，當外圍的大出光角度的發光二 極體晶片22被點亮時，泛光的大角度的照射範圍是涵蓋接近 光源之處，而當中央的小出光角度的發光二極體晶片12被點 亮時，聚光的小角度的照射範圍則是投射朝向前方。 8 200844369 i 第4a、4b圖所示係本發明之一第三實施例之正視與剖視 圖。在此實施例中，第一組10的小出光角度的發光二極體晶 片12是設置於圓形基板54的中央，而第二組20的大出光角 度的發光二極體晶片22則是設置於同一基板54上而圍繞於 第一組10的發光二極體晶片12之外。其中，每一個發光二 極體晶片12、22是完全容置於一個凹槽56内。凹槽56的深 度與幾何形狀並非重點，重點是在凹槽56的内壁相對於位於 凹槽56底部的發光二極體晶片12、22的角度。藉由適當的 控制内壁的傾斜角度，發光二極體晶片12、22所發出光線的 角度可以進一步受到限制與調整。凹槽56的内壁可以進一步 塗佈有反射性的材料（未圖示），例如白塗裝，以增加聚光的 效果。 本發明尚有一實施例係在單獨點亮外圍大出光角度的發 光二極體晶片時，同時點亮中間至少一顆小出光角度的發光 二極體晶片以避免照射範圍的中央出現陰影。這可以藉由適 當的連接這些發光二極體晶片到輸電開關來達成。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描 述本發明之特徵與精神，而並非以上述所揭露的較佳具體實 施例來對本發明之範疇加以限制。相反地，其目的是希望能 涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範 圍的範疇内。 9 200844369 t 【圖式簡單說明】 第1圖所示係本發明之電路示意圖。/ 第2a、2b圖所示係本發明之一第一實施例之正視與剖視圖。 第3a、3b圖所示係本發明之一第二實施例之正視與剖視圖。 第4a、4b圖所示係本發明之一第三實施例之正視與剖視圖。 【主要元件符號說明】 10 第一組發光二極體晶片 12 發光二極體晶片 20 第二組發光二極體晶片 22 發光二極體晶片 30 輸電開關 40 直流電源 50 基板 52 基板 54 基板 56 凹槽BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a light source utilizing a light-emitting diode wafer, and more particularly to a light source that provides two or more illumination angles using a light-emitting diode wafer. [Prior Art] The term "light source" as used in this specification refers to a device that converts electric energy into light energy, such as a white woven lamp, a fluorescent tube, or the like. Most light sources provide light in all directions, so there is usually an extremely wide range of illumination. In some applications where the light needs to be concentrated within a certain range of illumination angles, these light sources are packaged into various types of lamps, such as desk lamps and flashlights, in combination with appropriate shades, mirrors, and condensers. Or street lights, etc. There are also some applications that require more than two types of illumination angles, such as surgical lights, lights, etc., to provide illumination with a small illumination angle, a small range of illumination, and a wide range of illumination angles. illumination. These applications are often combined with appropriate shades, mirrors, concentrators, and fairly complex control mechanisms (such as changing the angle of the mirror), and the cost of the luminaires for these applications is typically quite high. SUMMARY OF THE INVENTION The present invention provides a novel light source, which utilizes a light-emitting diode (light), which has a certain light-emitting angle, to provide at least two illumination angles. light source. The present invention comprises at least a plurality of light emitting diode chips divided into at least two groups, and a power transmission switch. The light exit angle of the first group of light-emitting diode chips is; the light output angle of the second group of light-emitting diode chips is 02, and eeei. The first set of light emitting diode chips are electrically connected together, and the second set of light emitting diode chips are also electrically connected together to be placed on the periphery of the first group of light emitting diode chips. The two sets of light emitting diode chips are respectively connected in parallel to the power transmission switch. The power switch can be selected to individually power up the first set of light-emitting diode chips that illuminate all of the centered light exit angles, or the second set of light-emitting diode chips that are individually powered to illuminate the peripheral large exit angles. The above and other objects and advantages of the present invention will be described in detail with reference to the accompanying drawings and claims. However, it is to be understood that the appended drawings are purely illustrative of the spirit of the invention, and are not considered as a definition of the invention. For the definition of the scope of the invention, please refer to the attached patent application. [Embodiment] The present invention comprises at least two sets of at least one light-emitting diode wafer per set. The light exit angle of the first group of light-emitting diode chips is; the light exit angle of the second group of light-emitting diode chips is θ2, and θβθ!. In other words, the light-emitting diodes selected for the second group have a higher light-emitting angle than the 200844369 light-emitting diode chips selected for the first group. Please note that after the LED die is packaged into a wafer, the light-emitting or light-emitting angle is fixed, which is one of the important specifications of the LED chip. In addition, the present invention is not limited to the illuminating technology, light color, brightness, wattage, and packaging method employed in the light-emitting diode wafer. Figure 1 is a schematic diagram of the circuit of the present invention. As shown, the LEDs 12, 22 of the first set 10 and the second set 20 are each independently connected in parallel. The electrical connection of each set of LEDs can also be in series or in series and parallel. The main point is that the same group of LEDs can be illuminated at the same time when power is supplied. The two sets of light emitting diode chips are then further connected in parallel to power switch 30 (which may be a mechanical switch, an electronic switch, or a control chip). The power switch 30 controls the DC power source 40 to be applied to the two sets of light emitting diode chips. As shown, the power switch 30 can select either a single power supply to illuminate all of the first set 10 of LED chips 12, or a separate power supply to illuminate all of the second set of 20 LED chips 22. In addition, with a slight variation, the power switch 30 can add a choice of simultaneously supplying power to the first and second sets of 10, 20 LED chips 12, 22. 2a and 2b are front and cross-sectional views showing a first embodiment of the present invention. As shown in the figure, the light-emitting diode chips 12 of the first group 10 having a small light-emitting angle are disposed on the circular substrate 50, and the light-emitting diode chips 22 of the second group 20 having a large light-emitting angle are disposed on the annular substrate. 52 is on the outside of the first set of 10 7 200844369 t light-emitting diode chips 12 . Distributing the LED array across multiple substrates helps reduce the cost of maintenance. The substrates 50, 52 are typically made of a metal material (such as copper or aluminum) to provide good heat dissipation, and are coated with a suitable insulating layer and a circuit for providing electrical connections. For the sake of simplicity, the insulating layer and the wiring are omitted in the figure. It is. Please note that the material, the number of sheets, the geometry, and the arrangement of the substrate may be variously changed, and not limited to those illustrated. For example, the substrates 50 and 52 may be circuit boards. The important point is that the light-emitting diode chip 22 having at least one set of large light-emitting angles is disposed on the periphery (not necessarily surrounded) of the light-emitting diode chip 12 of a small set of light-emitting angles. As shown in FIG. 2b, the light source of the present invention provides a small angle of collecting light when the light-emitting diode chip 12 having a small light-emitting angle is illuminated by the control of the power transmission switch 30 (not shown). The illumination range (shown by the dashed line in the figure); and when the peripheral large-angle light-emitting diode chip 22 is illuminated, the light source of the present invention provides a flooded large-angle illumination range. 3a and 3b are front and cross-sectional views showing a second embodiment of the present invention. This embodiment is substantially identical to the previous embodiment, the only difference being that there is a relative tilt angle φ between the substrates 50, 52 for applications similar to vehicle lights, low beam and high beam. For example, when the peripheral large-angle light-emitting diode chip 22 is illuminated, the large-angle illumination range of the floodlight is to cover the vicinity of the light source, and the light-emitting diode wafer 12 when the central small light-emitting angle is When lighting, the illumination range of the small angle of the concentrated light is projected toward the front. 8 200844369 i Figures 4a and 4b show a front view and a cross-sectional view of a third embodiment of the present invention. In this embodiment, the light-emitting diode chips 12 of the first group 10 having a small light-emitting angle are disposed at the center of the circular substrate 54, and the light-emitting diode chips 22 of the second group 20 having a large light-emitting angle are disposed. On the same substrate 54 and surrounding the light-emitting diode wafer 12 of the first group 10. Each of the LED chips 12, 22 is completely housed in a recess 56. The depth and geometry of the recess 56 are not critical, with an emphasis on the angle of the inner wall of the recess 56 relative to the LED arrays 12, 22 located at the bottom of the recess 56. The angle of the light emitted by the LED chips 12, 22 can be further limited and adjusted by appropriately controlling the inclination angle of the inner wall. The inner wall of the recess 56 may be further coated with a reflective material (not shown), such as a white coating, to increase the effect of concentrating light. In still another embodiment of the present invention, when a light-emitting diode wafer having a peripheral large light-emitting angle is separately illuminated, at least one light-emitting diode wafer having a small light-emitting angle is simultaneously illuminated to avoid shadowing at the center of the illumination range. This can be achieved by properly connecting these light-emitting diode chips to the power switch. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the invention as claimed. 9 200844369 t [Simple description of the diagram] Fig. 1 is a schematic diagram of the circuit of the present invention. / Figures 2a, 2b are front and cross-sectional views of a first embodiment of the present invention. 3a and 3b are front and cross-sectional views showing a second embodiment of the present invention. 4a and 4b are front and cross-sectional views showing a third embodiment of the present invention. [Main component symbol description] 10 first group of light-emitting diode chips 12 light-emitting diode chip 20 second group of light-emitting diode chips 22 light-emitting diode chip 30 power switch 40 DC power supply 50 substrate 52 substrate 54 substrate 56 concave groove