200822852 九、發明說明 【發明所屬之技術領域】 本發明關於用來冷卻所通過的液體之散熱器及冷卻系 統。 【先前技術】 例如，發熱的CPU (熱源）的冷卻系統，其基本構成 要件爲抵接於CPU並奪取熱之冷卻液罩；散熱器；及在 此冷卻液罩與散熱器之間使冷卻液循環之液體泵，針對各 要件，可搭載於如筆記型電腦這種小型的機器地，如以下 的習知文獻所記載，謀求小型化與高可靠性。 [專利文獻1]日本特開平6-97338號公報 [專利文獻2]美國公開公報US2004/0042 1 7 1 [專利文獻3]美國公開公報US2002/0195238 但，以往以來所習知的散熱器不易搭載於筆記型電腦 這種小型薄型的機器，或無法期待充分之散熱性。 【發明內容】 本發明之目的在於提供，可收納於狹窄的空間，小型 薄型且散熱性佳的散熱器。又，本發明的另一目的在於提 供，冷卻性能優良之冷卻系統。 本發明的散熱器，其特徵爲：具有：被冷卻液的入口 管與出口管；及並列且相互地隔著間隔地連接在此入口管 與出口管之間，具備有由該入口管返回至出口管的液流路 200822852 之複數個流路單元。 各流路單元，具體而言例如，將形成有折彎成至少1 次u字狀的液流路之一對流路板與層積結合而形成，在此 一對流路板，連接於入口管與出口管並構成該入口管與出 口管的一部分之入口孔與出口孔。 構成各流路單元之一對流路板是對重疊面，呈對稱的 面對稱形狀，設有平面U字狀之流路凹部；及形成於此流 路凹部的一端部與另一端部之上述入口孔與出口孔。 又，在構成各流路單元之一對流路板，設有在入口孔 與出口孔部分朝外側突出之間隔件部，使重疊的流路單元 之間隔件部相互抵接，在流路單元的剩餘部構成空氣通過 空間。 實際上，所層積的複數個流路單元的入口孔與出口孔 是相互地連通，在該入口孔與出口孔分別連接入口管與出 口管。 又，在構成各流路單元之一對流路板，與上述入口孔 與出口孔部分之間隔件部不同地，一體形成有：當相互重 疊時相互地抵接而在各流路單元之間確保空間之間隔件突 起。 以上的散熱器可使用於：具備朝此散熱器的流路單元 送風之風扇、抵接於熱源而奪取該熱源的熱之冷卻液罩、 及在此冷卻液罩與散熱器之間使冷卻液循環的液體泵之冷 卻系統。在本發明的冷卻系統，散熱器是以對風扇的送風 口，入口管成爲出口管更遠的姿勢配置著。又，風扇爲朝 -6 - 200822852 離心方向送風的離心風扇，當朝流路單元送風時，& ^ 該流路單兀的設有入口管及出口管之一端側，在由人□胃 朝出口管折返之另一端側風量變大的姿勢加以配置著。 【發明內容】 圖9爲以C P U 1作爲熱源加以顯示之本發明的冷卻系 統（水冷系統）的槪念圖。CPU 1是接觸於作爲受熱塊的 CPU罩（冷卻液罩）10。由液體泵12供給至CPU罩10 的冷卻液流動於c P U罩1 0內的流路，由c P U 1奪取熱。 在CPU罩10昇溫的冷卻液是在流動於散熱器20內的冷 卻液流路2 1之間，接收來自於（；：冷卻風扇22之冷卻風而 被冷卻，再返回至液體泵1 2，以後反復進行此循環。 圖1是顯示本發明的散熱器20的基本槪念之圖。被 冷卻液的入口管23與出口管24是相互平行。複數個流路 單元3 0是在此入口管（入口流路）2 3與出口管（出口流 路）24之間相互地隔著間隔而並列地連接著。即，各流路 單元30具備有連接（連通）於入口管23之入口孔31、連 接（連通）於出口管24之出口孔3 2、及形成於此入口孔 3 1與出口孔3 2之間的冷卻液流路2 1，層積狀態的複數個 流路單元3 0至少在冷卻液流路2 1部分相互地分離。入口 管23與出口管24，在圖9的冷卻系統之例子，分別連接 於CPU罩10與液體泵12。 以上的散熱器20，當將流動於入口管23與出口管24 之流量設爲A，將流路單元3 0的數量設爲η時’可將流 200822852 動於各流路單元3 0之流量作成A/n。因此，對流動於入口 及出口管2 3、2 4之一定的流量，增加流路單元的數量， 可縮小流動於各流路之流量’藉此可獲得充分之冷卻效 果。 圖2至圖8是顯示散熱器2 0更具體的實施形態。在 圖2至圖6的例子，流路單元3 0爲5段層積，各流路單 元3 0，除了最下段的流路單元3 0以外，其餘爲相同構 造。 各流路單元3 0是藉由重疊而結合的一對流路板3 4U 與3 4L所構成。流路板34U與34L是由例如傳熱性佳的 金屬材料的沖壓成形品所構成，對於接合面（將流路板相 互接合的面）呈對稱的形狀（相同的單體形狀）。圖7、 圖8顯示流路板3 4 U ( 3 4 L )的單體形狀。流路板3 4 U (3 4 L )呈細長形狀，在平坦的接合面3 5具有平面U字狀 的流路凹部3 6。U字狀流路凹部3 6的兩端部（U字狀折 返部的相反側之端部），開孔設有入口孔3 1與出口孔 32 ° 此入口孔3 1與出口孔3 2是形成於：由U字狀流路凹 部3 6部分突出而形成於流路板3 4 U ( 3 4 L )之間隔件部3 7 與間隔件3 8部。又，在流路板3 4 U ( 3 4 L )，設有：位於 間隔件部3 7 ( 3 8 )的相反側，具有與該間隔件部3 7 (3 8 )相同高度之另外之間隔件突起3 9。 以上的流路板3 4 U與3 4 L是以流路凹部3 6朝向外側 之方式’方向相反地重疊，而接合面3 5彼此藉由例如軟 -8- 200822852 銲予以接合。於是，藉由上下朝相互相反方向突出之u字 狀流路凹部3 6，形成冷卻液流路2。此冷卻液流路2 1是 如圖5所示，呈扁平形狀。又，上下的流路單元3 0之間 隔件部3 7 ( 3 8 )彼此抵接，而上下的流路單元3 0的入口 孔3 1彼此、出口孔3 2彼此分別連通’構成入口管2 3的 一部分及出口管2 4的一部分。在最下段的流路單元3 0的 下方之流路板34L之間隔件部3 7 ( 3 8 )，未設有入口孔 3 1 (出口孔3 2 )(圖6 )。在圖7中，以虛線描繪入口孔 31與出口孔32，在兩孔31、32未設有孔，而獲得最下方 之流路板34L。上下的流路單元30之間隔件突起39是當 上下的流路單元3 0之間隔件部3 7 ( 3 8 )彼此抵接時，同 時抵接，而在上下的流路單元3 0的U字狀流路凹部3 6 (冷卻液流路2 1 )之間構成冷卻空氣通過空間S。 如以上所重疊之5段的流路單元3 0藉由流路塊40所 連接結合。流路塊40具有：具備入口管23與出口管24 之上主體4 1 ;及在與此上主體4 1之間，夾持保持5段的 流路單元30之下主體42。在上主體41，形成有承接最上 段的流路單元3 0之間隔件部3 7 ( 3 8 )的一對環狀凹部 4 3，在此環狀凹部4 3，間隔件部3 7 ( 3 8 )與〇型環4 4同 時被揷入而保持液密（圖6 )。上主體41與下主體4 2的 鎖緊距離是間隔件脚4 1 S所限制。 以上的散熱器2 G ’由入口管2 3所供給的被冷卻液被 分配至各流路單元3 0。即，由各流路單元3 〇的入口孔3】 供給至冷卻液流路2 1，再由出口孔3 2返回至出口管2 4。 -9- 200822852 在上下的流路單元3 0之間，形成有冷卻空氣通過空間 S，通過該空間之通過的空氣可與流路板34U ( 34L )進行 熱交換，而將冷卻液流路2 1內的被冷卻液加以冷卻。藉 由並列設置流路單元3 0，可增大流路單元3 0的總和流路 剖面積，因此，可降低流速來進行充分的冷卻作用，又， 藉由選擇流路單兀3 0的層積段數，可自由地進行冷卻能 力的設定。 在本實施形態，於流路單元3 0 (流路板3 4 U (3 4 L ))形成1個U字狀流路，但亦可形成S字狀、或 複數次折返狀的流路。又，間隔件突起3 9是對流路板 34U ( 34L )的長度方向設置於間隔件部3 7 ( 3 8 )的相反 側’故’可均等地保持流路單兀3 0之間隔，但，亦可在 其他的部分設置間隔件突起，若可保持流路單元3 〇之間 隔的話，亦可不設置間隔件突起3 9。 其次，參照圖9〜圖1 1，說明關於本發明的冷卻系 統。 本冷卻系統L爲水冷系統’其是由上述的散熱器 20、朝散熱器20的冷卻液流路21送風的冷卻風扇22、抵 接於作爲熱源之CPU1用以奪取熱的CPU罩（冷卻液罩） 1 〇、及在此C P U罩1 0與散熱器2 0之間使冷卻液循環之 液體泵1 2。被冷卻液的入口管2 3與出口管2 4，是將接近 冷卻風扇2 2的側作爲出口管2 4，將遠離的側作爲入口管 23 ° 冷卻風扇22爲在離心方向的一部分具有送風口 22a 10- 200822852 之多翼式離心風扇，將送風口 22a朝向散熱器20，以比起 散熱器20的設有入口管23及出口管24之一端側20a，在 由入口管23朝出口管24折返的另一端側20b送風量多之 方向加以配置。圖1 〇爲顯示冷卻風扇2 2之外觀圖，圖1 1 顯示冷卻風扇22的風量分布。此風量分布是於在使冷卻 風扇22的表面朝上的狀態，於送風口 22a附近，位置不 同地設置複數個風速感測器S 1〜S 7 (參照圖1 0 )，測定 各位置之風速。當進行此測定時，冷卻風扇2 2的旋轉方 向爲逆時鐘方向，風速感測器S 1〜S 7的位置是將送風口 2 2 A的圖示下側（圖1 0的下側）作爲零來加以顯示。冷 卻風扇22是當將其表面做成朝上時，風由圖1〇的左下朝 右上，以數十度的大角度流動，故，如圖1 1所示，在送 風口 2 2 A的圖示上側（圖1 0的上側）風速變大，送風口 22A的圖示下側（圖1 0的下側）風速變小。在因應這樣 的送風口 22a內的位置而風量不同之冷卻風扇，在使其表 裏面相反之情況，伴隨此表裏相反，風量分布也反轉。 即，在冷卻風扇22的裏面做成朝上之狀態，風由圖1 〇的 左上朝右下，以大角度流動，故，在送風口 22A的圖示下 側，風速變大，在送風口 22A的圖示上側，風速變小。在 本冷卻系統L，亦考量後述的理由，將、冷卻風扇22的 表面朝上加以配置，使得在與散熱器20的一端側20a (入 口管23及出口管24側）對向之送風口 22A的圖示下側， 風速變小，在與散熱器20的另一端側20b (折返側）對向 的送風口 22A的圖示上側，風速變大。 -11 - 200822852 以下’對本冷卻系統L (圖9 )的冷卻性能進行評 價。 圖1 2是作爲冷卻系統L的比較例，顯示空冷系統A 的結構。空冷系統A，在將CPU1作爲熱源之情況，以經 由CPU罩1 0 ’從CPU 1奪取熱之加熱管111;插通與加熱 管1 1 1的CPU 1接觸的授熱部！ n a相反側之端部（散熱部 1 1 1 b )的散熱器1 2 0 ;朝此散熱器〗2 〇送風之冷卻風扇 1 22所構成。在加熱管〗丨丨內封裝有熱媒體，當此熱媒體 在授熱部Π 1 a接收來自於CPU 1之熱時，則會沸騰而成爲 氣體’與熱一同朝散熱部1 1 1 b移動，當在散熱部1 1 1 b， 受到散熱器20所冷卻時，則會凝縮而成爲液體，返回至 授熱部1 1 1 a，以後反復進行此循環，藉由來冷卻c P U 1。 在此空冷系統A，成爲熱源之CPU1及冷卻風扇122採用 與冷卻系統L相同者。 在表1，比較顯示冷卻系統L (實施例）與空冷系統 A (比較例）的冷卻性能。 -12- 200822852 [表i] 冷卻性能 實施例 (液冷） 比較例 (空冷） a01 熱源(CPU) W 42.8 42.8 a02冷卻風扇的尺寸 mmxmm 12.5x45 12.5x45 a03冷卻風扇(電源DC5V)送風口送出時的風速 m/s 4.0 4.0 a04由散熱器送出時的風速 m/s 2.8 1.5 a05室溫 Ta°C 25.4 25.4 a06由散熱器送出的風之溫度 rc 41.0 74.5 a07熱源(CPU)的溫度 T°C 72.8 99.6 a08在CPU罩的入口側的冷卻液的溫度 rc 59.9 — a09在CPU罩的出口側的冷卻液的温度 T°c 65.6 93.1 alO散熱器的入口側之被冷卻液的溫度 rc 65.6 83.1 all散熱器的出口側之被冷卻液的溫度 rc 60.7 — al2 CPU罩的入口側與出口側的溫度差 ^T°c ^5.1 ZI6.5 散熱器與CPU罩的入口側之冷卻液的溫度差/ * 1 〇 ατ°γ A(\ O yi 1 Λ Π 散熱器與CPU罩的入口側之冷卻液的溫度差 Z] U.o ZJ 1U.U al4散熱器的入口側與出口側的溫度差 aTC AA.9 — al5由散熱器所送出的風的溫度與室溫之差 ZT〇C Δ\5.6 ΔΑ9Λ al6在CPU罩之熱抵抗値 °c/w 0.17 (0.15) al7在加熱管之熱抵抗値 °c/w — (0.23) al8在散熱器之熱抵抗値 °c/w 0.94 (1.35) al9在系統所有的之熱抵抗値 °c/w 1.11 1.73 在表1中，第1項目al爲 熱源1 〔CPU1) 1的功率 [W]。第2項目a2爲冷卻風扇的尺寸，以送風口的內寸法 [mmxmm]顯示。第3項目a3爲由冷卻風扇（電源DC5V) 的送風口送出時的風速[m/S]，第4項目a4爲由散熱器送 出時的風速[m/S]，第5項目a5爲室溫[Ta°C ]。第6項目 a6爲由散熱器送出的風之溫度[Tt ]，第7項目a7爲熱源 -13- 200822852 (CPU 1 )的溫度[T°c]。第8項目a8及第9項目a9爲在 冷卻系統L，在CPU罩1 〇的入口側及出口側的冷卻液的 溫度，但在空冷系統A，將加熱管1 1 1的授熱部Π 1 a (圖 1 2的測定點a9 )的溫度作爲在CPU罩1 0的出口側之溫度 加以記載。第10項目al〇及弟11項目all是在冷卻系統 L，在散熱器2 0的入口側及出口側之被冷卻液的溫度， 但，在空冷系統A，將插通於散熱器1 20內之加熱管1 1 j 的散熱部附近（圖1 2的測定點al 0 )的溫度作爲散熱器的 入口側的溫度加以記載。第1 2項目a 1 2，在冷卻系統L 爲CPU罩10的入口側與出口側的溫度差[△ Tt ]，在空冷 系統A爲CPU 1與加熱管1 Π的授熱部1 Π A的溫度差[ △ T°C]。第13項目al3，在冷卻系統L爲在散熱器20的 出口側與CPU罩1 0的入口側之冷卻液的溫度差[△ Tt ]， 在空冷系統A，爲在散熱器120的入口側與CPU罩10的 出口側之冷卻液的溫度差，即，加熱管η 1的授熱部1 1 1 a 與散熱部附近之溫度差[△Tt：]。第14項目al4爲冷卻系 統L之散熱器20的入口側與出口側的溫度差[△ T°C ]，第 15項目al5爲由散熱器20、120所送出的風的溫度與室溫 之差[ΔΊΤί：]。第16項目al6爲在CPU罩10之熱抵抗値 [°C /W]，第17項目al7爲在加熱管111之熱抵抗値[°C /W]，第18項目al8爲在散熱器20、120之熱抵抗値[°〇 /W]，第1 9項目al 9爲在系統所有的之熱抵抗値[°C /W]。 冷卻性能可藉由系統所有的的熱抵抗値之大小進行評價， 熱抵抗値越小，則冷卻性能越佳。系統所有的的熱抵抗可 -14 - 200822852 藉由（熱源之溫度a7-室溫a5) /熱源之功率al算出。 由表1可得知，本冷卻系統L，其熱抵抗値1 · 1 1 [ t /W]較空冷系統A的熱抵抗値1.73[°C/W]小，具有較該空 冷系統A更優良之冷卻性能。 接著，在表2，針對將被冷卻液的入口管2 3配置於遠 離冷卻風扇22之側、將出口管24配置於接近冷卻風扇22 之側的冷卻系統L (實施例）；與將被冷卻液的出口管24 配置於遠離冷卻風扇22之側、將入口管23配置於接近冷 卻風扇22之側的第2的冷卻系統（比較例），比較冷卻 性能加以顯示。第2的冷卻系統，除了入口管23及出口 管2 4的配置不同外，其餘結構與圖9所示的冷卻系統L 相同。表2之項目al〜ai6、al8、al9爲與表1的項目al 〜al6、al8、al相同，故省略其説明。 -15- 200822852200822852 IX. Description of the Invention [Technical Field] The present invention relates to a radiator and a cooling system for cooling a passing liquid. [Prior Art] For example, a cooling system of a heat-generating CPU (heat source) whose basic constituent elements are a coolant cover that abuts against the CPU and captures heat; a heat sink; and a coolant between the coolant cover and the heat sink The circulating liquid pump can be mounted on a small machine such as a notebook computer for each element, and is described in the following conventional documents, and is intended to be small in size and high in reliability. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. 6-97338 [Patent Document 2] US Publication No. US2004/0042 1 7 1 [Patent Document 3] US Published Publication No. US2002/0195238 However, conventionally known heat sinks are not easily mounted. In a small and thin machine such as a notebook computer, it is impossible to expect sufficient heat dissipation. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink which can be housed in a narrow space and which is small and thin and has excellent heat dissipation properties. Further, another object of the present invention is to provide a cooling system excellent in cooling performance. The heat sink of the present invention is characterized in that: an inlet pipe and an outlet pipe to be cooled; and a parallel connection between the inlet pipe and the outlet pipe in parallel with each other, and is provided with the inlet pipe returning to the inlet pipe A plurality of flow path units of the liquid flow path 200822852 of the outlet pipe. Specifically, for example, one of the liquid flow paths formed by bending into at least one U-shape is formed by laminating the flow path plates, and the pair of flow path plates are connected to the inlet pipe and The outlet tube and the inlet and outlet apertures that form part of the inlet and outlet tubes. One of the flow path units is a pair of flow path plates having a symmetrical plane symmetry with respect to the overlapping surface, and is provided with a planar U-shaped flow path concave portion; and the above-mentioned entrance formed at one end portion and the other end portion of the flow path concave portion Hole and outlet hole. Further, in one of the flow path units, the flow path plate is provided with a spacer portion that protrudes outward at the inlet hole and the outlet hole portion, and the spacer portions of the overlapping flow path units are in contact with each other, and the flow path unit is in contact with each other. The remaining portion constitutes an air passage space. Actually, the inlet hole and the outlet hole of the plurality of stacked flow path units are in communication with each other, and the inlet pipe and the outlet pipe are connected to the inlet port and the outlet port, respectively. Further, in the flow path plate constituting one of the flow path units, unlike the spacer portion of the inlet hole and the outlet hole portion, the flow path plate is integrally formed to be mutually abutted when overlapping each other, and is ensured between the flow path units. The spacer of the space protrudes. The above heat sink can be used for a fan that supplies air to the flow path unit of the heat sink, a coolant liquid that abuts the heat source to take the heat source, and a coolant between the coolant cover and the heat sink. The cooling system of the circulating liquid pump. In the cooling system of the present invention, the radiator is disposed in a posture in which the air inlet of the fan and the inlet pipe are further away from the outlet pipe. In addition, the fan is a centrifugal fan that blows air toward the -6 - 200822852 centrifugal direction. When the air is blown toward the flow path unit, & ^ the flow path unit is provided with one end side of the inlet pipe and the outlet pipe, and is in the stomach The position at the other end side of the outlet pipe retracting is increased. SUMMARY OF THE INVENTION Fig. 9 is a view showing a cooling system (water cooling system) of the present invention shown by using C P U 1 as a heat source. The CPU 1 is in contact with a CPU cover (cooling liquid cover) 10 as a heat receiving block. The coolant supplied to the CPU cover 10 by the liquid pump 12 flows into the flow path in the c P U cover 10, and heat is taken up by c P U 1 . The coolant heated by the CPU cover 10 flows between the coolant flow paths 21 flowing in the radiator 20, receives cooling air from the cooling fan 22, is cooled, and returns to the liquid pump 12, This cycle is repeated thereafter. Fig. 1 is a diagram showing the basic concept of the heat sink 20 of the present invention. The inlet pipe 23 and the outlet pipe 24 of the coolant are parallel to each other. The plurality of flow path units 30 are the inlet pipes therein. The (inlet flow path) 2 3 and the outlet pipe (outlet flow path) 24 are connected in parallel with each other with an interval therebetween. That is, each flow path unit 30 is provided with an inlet hole 31 that is connected (connected) to the inlet pipe 23 . And connecting (connecting) the outlet hole 32 of the outlet pipe 24, and the coolant flow path 2 formed between the inlet hole 31 and the outlet hole 3, and at least a plurality of flow path units 30 in a stacked state The coolant flow path 2 1 is partially separated from each other. The inlet pipe 23 and the outlet pipe 24 are respectively connected to the CPU cover 10 and the liquid pump 12 in the example of the cooling system of Fig. 9. The above radiator 20 will flow when The flow rate of the inlet pipe 23 and the outlet pipe 24 is set to A, and the number of the flow path cells 30 is set to η. At the time of 'flow 200822852, the flow rate of each flow path unit 30 can be made A/n. Therefore, by increasing the number of flow path units for a certain flow rate flowing through the inlet and outlet pipes 23, 24, the flow can be reduced. A sufficient cooling effect can be obtained by the flow rate of each flow path. Fig. 2 to Fig. 8 show a more specific embodiment of the heat sink 20. In the example of Figs. 2 to 6, the flow path unit 30 is 5 segments. In the stacking, each flow path unit 30 has the same structure except for the flow path unit 30 of the lowermost stage. Each flow path unit 30 is composed of a pair of flow path plates 3 4U and 3 4L which are joined by overlapping. The flow path plates 34U and 34L are formed of a press-formed product of a metal material having good heat conductivity, for example, and have a symmetrical shape (the same single shape) with respect to the joint surface (the surface on which the flow path plates are joined to each other). 7. Figure 8 shows the single-shaped shape of the flow path plate 3 4 U ( 3 4 L ). The flow path plate 3 4 U (3 4 L ) has an elongated shape and has a flat U-shaped flow on the flat joint surface 35. The recessed portion 36. The both end portions of the U-shaped flow path concave portion 36 (the end portion on the opposite side of the U-shaped folded portion), and the opening hole is provided with the inlet hole 3 1 and the outlet hole 32. The inlet hole 3 1 and the outlet hole 3 2 are formed in the spacer portion 3 which is formed by the U-shaped flow path concave portion 36 and is formed in the flow path plate 3 4 U ( 3 4 L ). 7 and the partition member 38. Further, the flow path plate 3 4 U ( 3 4 L ) is provided on the opposite side of the spacer portion 3 7 ( 3 8 ), and has the spacer portion 3 7 (3) 8) The other spacer protrusions 39 of the same height. The above flow path plates 3 4 U and 3 4 L are oppositely overlapped in such a manner that the flow path recesses 63 face outward, and the joint faces 35 are mutually For example, soft-8-200822852 welding is joined. Then, the coolant flow path 2 is formed by the u-shaped flow path concave portion 3 6, which protrudes upward and downward in mutually opposite directions. This coolant flow path 2 1 has a flat shape as shown in Fig. 5 . Further, the spacer portions 3 7 ( 3 8 ) of the upper and lower flow path units 30 abut each other, and the inlet holes 3 1 and the outlet holes 3 2 of the upper and lower flow path units 30 are respectively connected to each other 'constituting the inlet tube 2 A portion of 3 and a portion of the outlet tube 24. In the spacer portion 3 7 ( 3 8 ) of the flow path plate 34L below the lowermost flow path unit 30, the inlet hole 3 1 (outlet hole 3 2 ) is not provided (Fig. 6). In Fig. 7, the inlet hole 31 and the outlet hole 32 are depicted by broken lines, and the holes are not provided in the two holes 31, 32, and the lowermost flow path plate 34L is obtained. The spacer protrusions 39 of the upper and lower flow path units 30 are simultaneously abutted when the spacer portions 3 7 ( 3 8 ) of the upper and lower flow path units 30 abut each other, and the U of the upper and lower flow path units 30 A cooling air passage space S is formed between the word passage recesses 36 (the coolant passages 2 1 ). The flow path unit 30 of the five stages overlapped as described above is joined by the flow path block 40. The flow path block 40 has a main body 42 including an inlet pipe 23 and an outlet pipe 24, and a lower main body 42 of the flow path unit 30 which is sandwiched and held between the upper main body 4 and the upper main body 41. The upper main body 41 is formed with a pair of annular recesses 4 3 that receive the spacer portions 3 7 ( 3 8 ) of the uppermost flow path unit 30, where the annular recesses 4 3 and the spacer portions 3 7 (3) 8) Keep in liquid tightness with the 〇-type ring 4 4 at the same time (Fig. 6). The locking distance of the upper body 41 and the lower body 42 is limited by the spacer foot 4 1 S. The above-mentioned radiator 2 G ' is supplied to the flow path unit 30 by the coolant to be supplied from the inlet pipe 23. That is, the inlet hole 3 of each flow path unit 3 is supplied to the coolant flow path 2 1, and the outlet hole 3 2 is returned to the outlet pipe 24. -9- 200822852 Between the upper and lower flow path units 30, a cooling air passage space S is formed, and air passing through the space can exchange heat with the flow path plate 34U (34L), and the coolant flow path 2 The coolant in 1 is cooled by the coolant. By providing the flow path unit 30 in parallel, the total flow path sectional area of the flow path unit 30 can be increased, so that the flow rate can be reduced to perform sufficient cooling, and the layer of the flow path unit 30 can be selected. The number of stages can be set freely for cooling capacity. In the present embodiment, one U-shaped flow path is formed in the flow path unit 30 (the flow path plate 3 4 U (3 4 L )), but a flow path of an S-shape or a plurality of fold-backs may be formed. Further, the spacer protrusions 39 are disposed on the opposite side of the spacer portion 3 7 ( 3 8 ) in the longitudinal direction of the flow path plate 34U ( 34L ), so that the flow path unit 30 can be equally spaced. The spacer projections may be provided in other portions, and the spacer projections 39 may not be provided if the flow path unit 3 is spaced apart. Next, a cooling system according to the present invention will be described with reference to Figs. 9 to 1 1. The cooling system L is a water-cooling system, which is a cooling fan 22 that blows air from the above-described radiator 20 to the coolant flow path 21 of the radiator 20, and a CPU cover that abuts against the CPU 1 as a heat source to take heat (coolant) Cover 1 1 and a liquid pump 1 2 for circulating a coolant between the CPU cover 10 and the radiator 20. The inlet pipe 2 3 and the outlet pipe 24 of the coolant are the side close to the cooling fan 22 as the outlet pipe 24, and the side away from the inlet pipe 23°. The cooling fan 22 has a blower port in a part of the centrifugal direction. The multi-blade centrifugal fan of 22a 10-200822852 has the air supply port 22a facing the radiator 20 so as to be opposite the one end side 20a of the radiator 20 and the outlet pipe 23 and the outlet pipe 24, from the inlet pipe 23 toward the outlet pipe 24 The other end side 20b of the folded-back is arranged in a direction in which the amount of air blows is large. Fig. 1 is an external view showing the cooling fan 22, and Fig. 11 shows the air volume distribution of the cooling fan 22. The air volume distribution is such that the surface of the cooling fan 22 faces upward, and a plurality of wind speed sensors S 1 to S 7 are provided at different positions in the vicinity of the air blowing port 22a (see FIG. 10), and the wind speed at each position is measured. . When this measurement is performed, the rotation direction of the cooling fan 22 is the counterclockwise direction, and the positions of the wind speed sensors S1 to S7 are the lower side of the air supply port 2 2 A (the lower side of FIG. 10). Zero to display. When the cooling fan 22 is formed with its surface facing upward, the wind flows from the lower left to the upper right of FIG. 1A at a large angle of several tens of degrees, so that the air supply port 2 2 A is as shown in FIG. The upper side (upper side of FIG. 10) has a larger wind speed, and the lower side of the air supply port 22A (the lower side of FIG. 10) has a lower wind speed. In the case where the cooling fan having a different air volume at the position in the air supply port 22a is reversed in the table, the air flow distribution is reversed in the opposite direction. In other words, the inside of the cooling fan 22 is placed upward, and the wind flows from the upper left to the lower right of FIG. 1 to the lower right and flows at a large angle. Therefore, on the lower side of the air supply port 22A, the wind speed is increased, and the air is blown at the air supply port. On the upper side of the 22A, the wind speed becomes smaller. In the present cooling system L, the reason why the surface of the cooling fan 22 faces upward is also considered, so that the air supply port 22A is opposed to the one end side 20a (the side of the inlet pipe 23 and the outlet pipe 24) of the radiator 20. On the lower side of the figure, the wind speed is reduced, and the wind speed is increased on the upper side of the air supply port 22A facing the other end side 20b (return side) of the radiator 20. -11 - 200822852 The following 'evaluation of the cooling performance of this cooling system L (Fig. 9). Fig. 12 is a comparative example of the cooling system L, showing the structure of the air cooling system A. In the air cooling system A, when the CPU 1 is used as a heat source, the heating pipe 111 that takes heat from the CPU 1 via the CPU cover 10' is inserted; the heat receiving portion that is in contact with the CPU 1 of the heating pipe 1 1 1 is inserted! The heat sink 1 2 0 at the end of the opposite side (the heat dissipating portion 1 1 1 b ); the cooling fan 1 22 which is supplied to the radiator 2 2 〇. The heat medium is packaged in the heating tube, and when the heat medium receives the heat from the CPU 1 in the heating unit a 1 a, it will boil and become a gas 'moving together with the heat toward the heat dissipating portion 1 1 1 b When the heat radiating portion 1 1 1 b is cooled by the heat sink 20, it is condensed and becomes a liquid, and returns to the heat receiving portion 1 1 1 a. Thereafter, the cycle is repeated to cool the c PU 1 . In the air cooling system A, the CPU 1 and the cooling fan 122 which are the heat sources are the same as the cooling system L. In Table 1, the comparison shows the cooling performance of the cooling system L (Example) and the air cooling system A (Comparative Example). -12- 200822852 [Table i] Cooling performance example (liquid cooling) Comparative example (air cooling) a01 Heat source (CPU) W 42.8 42.8 a02 Cooling fan size mmxmm 12.5x45 12.5x45 a03 Cooling fan (power supply DC5V) When the air supply port is sent out Wind speed m/s 4.0 4.0 a04 Wind speed m/s when sent by radiator 2.8 1.5 a05 room temperature Ta°C 25.4 25.4 a06 Temperature of wind sent by radiator rc 41.0 74.5 a07 Heat source (CPU) temperature T°C 72.8 99.6 a08 Temperature of the coolant on the inlet side of the CPU cover rc 59.9 — a09 Temperature of the coolant on the outlet side of the CPU cover T°c 65.6 93.1 Temperature of the coolant on the inlet side of the alO radiator rc 65.6 83.1 all Temperature of the coolant to be cooled on the outlet side of the radiator rc 60.7 — al2 Temperature difference between the inlet side and the outlet side of the CPU cover ^T°c ^5.1 ZI6.5 Temperature difference of the coolant on the inlet side of the radiator and the CPU cover / * 1 〇ατ°γ A(\ O yi 1 Λ 温度 Temperature difference between the heat sink and the coolant on the inlet side of the CPU cover Z] Uo ZJ 1U.U al4 The temperature difference between the inlet side and the outlet side of the radiator is aTC AA. 9 — al5 The difference between the temperature of the wind sent by the radiator and the room temperature ZT〇C Δ\5.6 ΔΑ9Λ Al6 heat resistance in the CPU cover 値°c/w 0.17 (0.15) al7 heat resistance in the heating tube 値°c/w — (0.23) al8 thermal resistance in the heat sink 値°c/w 0.94 (1.35) al9 in All the heat resistance of the system 値°c/w 1.11 1.73 In Table 1, the first item a1 is the power [W] of the heat source 1 [CPU1) 1. The second item a2 is the size of the cooling fan and is displayed by the inner inch method [mmxmm] of the air supply port. The third item a3 is the wind speed [m/S] when the air blower of the cooling fan (power supply DC5V) is sent out, the fourth item a4 is the wind speed [m/S] when the radiator is sent out, and the fifth item a5 is the room temperature. [Ta°C]. The sixth item a6 is the temperature [Tt] of the wind sent by the radiator, and the seventh item a7 is the temperature [T°c] of the heat source -13- 200822852 (CPU 1). The eighth item a8 and the ninth item a9 are the temperature of the coolant on the inlet side and the outlet side of the CPU cover 1 in the cooling system L. However, in the air cooling system A, the heat receiving unit 加热 1 of the heating pipe 1 1 1 The temperature of a (measurement point a9 of Fig. 12) is described as the temperature on the outlet side of the CPU cover 10. The tenth item alt and the eleventh item all are the temperature of the coolant to be cooled in the cooling system L on the inlet side and the outlet side of the radiator 20, but in the air cooling system A, the radiator 1 is inserted into the radiator 110. The temperature in the vicinity of the heat radiating portion of the heating pipe 1 1 j (measuring point a0 in Fig. 12) is described as the temperature on the inlet side of the heat sink. In the first item 2 a 1 2, the cooling system L is the temperature difference [Δ Tt ] between the inlet side and the outlet side of the CPU cover 10, and the air cooling system A is the heating unit 1 Π A of the CPU 1 and the heating pipe 1 Temperature difference [ △ T ° C]. In the thirteenth item a13, the cooling system L is a temperature difference [ΔTt] between the coolant on the outlet side of the radiator 20 and the inlet side of the CPU cover 10, and in the air cooling system A, on the inlet side of the radiator 120. The temperature difference of the coolant on the outlet side of the CPU cover 10, that is, the temperature difference between the heat receiving portion 1 1 1 a of the heating pipe η 1 and the vicinity of the heat radiating portion [ΔTt:]. The 14th item a14 is the temperature difference [Δ T ° C ] between the inlet side and the outlet side of the radiator 20 of the cooling system L, and the 15th item a5 is the difference between the temperature of the wind sent by the radiators 20 and 120 and the room temperature. [ΔΊΤί:]. The 16th item al6 is the heat resistance 値 [°C /W] in the CPU cover 10, the 17th item a7 is the heat resistance 加热 [°C / W] in the heating pipe 111, the 18th item a8 is the heat sink 20, 120 heat resistance 値 [°〇 / W], the 19th item al 9 is the thermal resistance 値 [°C / W] in the system. The cooling performance can be evaluated by the heat resistance of the system. The smaller the heat resistance, the better the cooling performance. All thermal resistance of the system can be calculated by (heat source temperature a7 - room temperature a5) / heat source power a. It can be seen from Table 1 that the cooling system L has a thermal resistance 値1 · 1 1 [ t /W] which is smaller than the air resistance of the air cooling system A 値 1.73 [° C / W], and is superior to the air cooling system A. Cooling performance. Next, in Table 2, the inlet pipe 2 3 to be cooled is disposed on the side away from the cooling fan 22, and the outlet pipe 24 is disposed on the side closer to the side of the cooling fan 22 (Example); and will be cooled The liquid outlet pipe 24 is disposed on the side away from the cooling fan 22, and the inlet pipe 23 is disposed on the second cooling system (comparative example) close to the side of the cooling fan 22, and is displayed in comparison with the cooling performance. The second cooling system is the same as the cooling system L shown in Fig. 9 except that the arrangement of the inlet pipe 23 and the outlet pipe 24 is different. The items a1 to ai6, a8, and al9 in Table 2 are the same as the items a1 to al6, al8, and al in Table 1, and therefore their descriptions are omitted. -15- 200822852
液冷性能 散熱器的入口管 實施例 比較例 (距離風 (距離風 扇遠） 扇近） a01 熱源(CPU) W 40.4 40.4 a02冷卻風扇的尺寸 mmxmm 8.5x45 8.5x45 a03冷卻風扇(電源DC5V)送風口送出時的風速 m/s 6.1 6.1 a04由散熱器送出時的風速 m/s 3.4 3.4 a05室溫 Ta°C 25.0 25.0 a06由散熱器送出的風之溫度 T°C 34.0 34.2 a07熱源(CPU)的溫度 T°C 64.1 65.0 a08在CPU罩的入口側的冷卻液的溫度 T°C 53.3 54.0 a09在CPU罩的出口側的冷卻液的溫度 T°C 58.3 59.1 alO散熱器的入口側之被冷卻液的溫度 T°C 58.3 59.1 all散熱器的出口側之被冷卻液的溫度 T°C 54.0 54.8 al2 CPU罩的入口側與出口側的溫度差 ATC ZI5.0 ^5.1 散熱器與CPU罩的入口側之冷卻液的溫度差/ al3 散熱器與CPU罩的入口側之冷卻液的溫度差 ATC 虞7 」0.8 al4散熱器的入口側與出口側的溫度差 ATC ^4.3 Z14.3 al 5由散熱器所送出的風的溫度與室溫之差 ATC Δ9Λ Δ92 al 6在CPU罩之熱抵抗値 °c/w 0.14 0.15 al 8在散熱器之熱抵抗値 °c/w 0.82 0.84 al9在系統所有的之熱抵抗値 °c/w 0.97 0.99 由表2可得知，將被冷卻液的入口管2 3配置於遠離 冷卻風扇22之側、將出口管24配置於接近冷卻風扇22 之側的冷卻系統L (實施例），其熱抵抗値爲0 · 97pC /W]，較第2的冷卻系統（比較例）的熱抵抗値0 · 99[t /W]小，比起將被冷卻液的出口管24配置於遠離冷卻風扇 22之側、將入口管23配置於接近冷卻風扇22之側的情 -16- 200822852 況，可提高冷卻性能。 依此入口管23及出口管24的配置形態的不同’在冷 卻性能上產生差異，這是由於使溫度最低的冷風接觸出D 管24側，可使冷卻液有效地冷卻之冷卻系統L (實施 例），在第2的冷卻系統（比較例），當一旦被冷卻之冷 卻液通過出口管24側的流路時，接觸到因通過入口管23 側的流路之熱的冷卻液所加熱的溫風，造成冷卻効率劣化 之故。 接著，在表3，比較顯示：以比起散熱器20的一端側 (入口管23及出口管24側）20a，朝另一端側（折返 側）20b送風較多之朝向，配置冷卻風扇22之冷卻系統L (實施例）的冷卻性能；和以比起散熱器20的另一端側 2 0 b，朝一端側2 0 a送風較多之朝向，配置冷卻風扇2 2之 第3冷卻系統（比較例）的冷卻性能。第3冷卻系統，除 了冷卻風扇22的朝向（方向）不同外，其餘與圖9的冷 卻系統L相同結構。表3之項目a 1〜a 1 6、a 1 8、a 1是與 表1的項目al〜al6、al8、al9相同，故在此省略其説 明。 -17- 200822852Example of inlet tube embodiment of liquid-cooled heat sink (distance from wind (far from fan) fan) a01 Heat source (CPU) W 40.4 40.4 a02 Cooling fan size mmxmm 8.5x45 8.5x45 a03 cooling fan (power supply DC5V) air supply port Wind speed m/s when sent out 6.1 6.1 a04 Wind speed m/s when sent by radiator 3.4 3.4 a05 room temperature Ta°C 25.0 25.0 a06 Temperature of wind sent by radiator T°C 34.0 34.2 a07 heat source (CPU) Temperature T°C 64.1 65.0 a08 Temperature of the coolant on the inlet side of the CPU cover T°C 53.3 54.0 a09 Temperature of the coolant on the outlet side of the CPU cover T°C 58.3 59.1 The coolant on the inlet side of the alO radiator Temperature T°C 58.3 59.1 All the temperature of the coolant on the outlet side of the radiator T°C 54.0 54.8 al2 Temperature difference between the inlet side and the outlet side of the CPU cover ATC ZI5.0 ^5.1 Radiator and inlet side of the CPU cover The temperature difference of the coolant / al3 The temperature difference between the radiator and the coolant on the inlet side of the CPU cover ATC 虞7 ” 0.8 al4 The temperature difference between the inlet side and the outlet side of the radiator ATC ^4.3 Z14.3 al 5 by the radiator The difference between the temperature of the sent air and the room temperature ATC Δ9Λ Δ92 Al 6 heat resistance in CPU cover 値°c/w 0.14 0.15 al 8 Thermal resistance in heat sink 値°c/w 0.82 0.84 al9 All thermal resistance in the system 値°c/w 0.97 0.99 Available from Table 2 It is understood that the inlet pipe 2 3 to be cooled is disposed on the side away from the cooling fan 22, and the outlet pipe 24 is disposed on the side closer to the side of the cooling fan 22 (Example), and the heat resistance 値 is 0 · 97 pC / W] is smaller than the heat resistance 値0 · 99 [t /W] of the second cooling system (comparative example), and the inlet pipe 23 is disposed on the side away from the cooling fan 22 than the outlet pipe 24 to be cooled. The cooling performance can be improved by being placed close to the side of the cooling fan 22, in the case of -16-22822. According to the difference in the arrangement form of the inlet pipe 23 and the outlet pipe 24, the difference in cooling performance is caused by the cooling system L which enables the cooling liquid to be effectively cooled by bringing the cold air having the lowest temperature out of the D pipe 24 side. In the second cooling system (comparative example), when the cooled cooling liquid passes through the flow path on the outlet pipe 24 side, it is heated by the coolant which is heated by the flow path passing through the inlet pipe 23 side. The warm wind causes the cooling efficiency to deteriorate. Next, in Table 3, it is shown that the cooling fan 22 is disposed in a direction in which a large amount of air is blown toward the other end side (the return side) 20b than the one end side (the inlet pipe 23 and the outlet pipe 24 side) 20a of the heat sink 20 The cooling performance of the cooling system L (in the embodiment); and the third cooling system in which the cooling fan 22 is disposed in a direction in which the air is supplied to the one end side 20 a more than the other end side 20 b of the radiator 20 (comparison) Example) Cooling performance. The third cooling system has the same structure as the cooling system L of Fig. 9 except that the direction (direction) of the cooling fan 22 is different. The items a 1 to a 1 6 of the table 3, a 1 8 and a 1 are the same as the items a1 to al6, a8, and a9 of Table 1, and therefore the description thereof will be omitted. -17- 200822852
液冷性能 冷卻風扇的表裏 實施例比較例 读） （裏） a01 熱源(CPU) W 40.4 40.4 a02冷卻風扇的尺寸 ηιηιχηιηι 8.5x45 8.5x45 a03冷卻風扇(電源DC5V)送風口送出時的風速 m/s 6.1 6.1 a04由散熱器送出時的風速 m/s 3.4 3.4 a05室溫 Ta°C 25.0 25.0 a06由散熱器送出的風之溫度 T°C 34.0 35.4 a07熱源(CPU)的溫度 T°C 64.1 65.9 a08在CPU罩的入口側的冷卻液的溫度 T°C 53.3 55.1 a09在CPU罩的出口側的冷卻液的溫度 T°C 58.3 60.1 alO散熱器的入口側之被冷卻液的溫度 T°C 58.3 60.1 all散熱器的出口側之被冷卻液的溫度 T°C 54.0 55.8 al2 CPU罩的入口側與出口側的溫度差 ^T°C ZI5.0 Δ5Λ 散熱器與CPU罩的入口側之冷卻液的溫度差/ 1 〇 a(\ 1 ac\ η 散熱器與CPU罩的入口側之冷卻液的溫度差 Zll 1 U U· / LI · / al4散熱器的入口側與出口側的溫度差 zlT°C ^4.3 ^4.3 al 5由散熱器所送出的風的溫度與室溫之差 ATC Z19.0 ^10.4 al 6在CPU罩之熱抵抗値 °c/w 0.14 0.14 al 8在散熱器之熱抵抗値 °c/w 0.82 0.87 al9在系統所有的之熱抵抗値 °c/w 0.97 1.01 由表3可得知，在來自於冷卻風扇22之風，比起散 熱器20的一端側20a，對另一端側20b送風較多之冷卻系 統L (實施例），其熱抵抗値爲0 · 97PC /W]，較第3冷 卻系統（比較例）的熱抵抗値1 . 〇 1 [ °C / W]小，比起來自於 冷卻風扇22之風比起散熱器20的另一端側20b，對一端 側2 0a送風較多之情況，可提高冷卻性能。 -18- 200822852 因此冷卻風扇22的朝向之不同，在冷卻性能上產生 差異，這是因在散熱器2〇的構造上，設有入口管23及出 口管24之一端側20a比起另一端側20b ’風的通道狹窄’ 以及由冷卻風扇22所送出的風對送風口 22a並非呈直 角，而是如上述圖1 0及圖1 1所作的說明般，在旋轉方向 上具有大角度所產生之故。即，在第3冷卻系統（比較 例），來自於冷卻風扇2 2之風由散熱器2 0的另一端側 2 0b之圖示左側朝一端側20A的圖示右側被送風，故因冷 卻風扇2 2所產生之風會受到流路塊4 0所遮斷，造成風之 壓力損失增大。因此’實際上接觸到散熱器2 0之冷風量 變少，冷卻效果下降。相對於此，在本冷卻系統L (實施 例），由於圖9中來自於冷卻風扇22之風由散熱器20的 一端側20A的圖示左側朝另一端側20b的圖示右側被送 風，在另一端側20b，遮斷風之部分比起端側20a較小， 故，比起第3冷卻系統（比較例），風的通過變得良好， 風之壓力損失減少。其結果，實際上接觸到散熱器20之 冷風量，比起第3冷卻系統變得更多。藉此，在本冷卻系 統L，可獲得較第3冷卻系統更優良之冷卻效果。又，冷 卻效果是大幅依存於冷風之溫度與対象物的溫度之差，故 亦可考量爲下述理由。在本冷卻系統L，冷風的溫度最低 而最低接近室溫之冷風會接觸到冷卻液的溫度最低且與冷 風之溫度差大的部分（出口管24)，故當最冷的冷風接觸 到此部分時，則出口的液溫下降，因此，冷卻效果變高。 相對於此，在第3冷卻系統，在散熱器20的一端側20a -19- 200822852 一旦被暖化之風會接觸到散熱器20出口附近的受到冷卻 液冷卻成最冷之部分（出口管24 )，故，在冷卻液的出口 附近，冷卻液的溫度不會下降。 【圖式簡單說明】 圖1是顯示本發明的散熱器的基本槪念之斜視圖。 圖2是顯示本發明的散熱器的一實施形態之分解斜視 圖。 圖3是同平面圖。 圖4是沿著圖3的IV-IV線之斷面圖。 圖5是沿著圖3的V-V線之斷面圖。 圖6是圖3的一部分之放大斷面圖。 圖7是使用於圖2至圖6的散熱器之流路板單體的平 面圖。 圖8是同流路板單體之斷面圖。 圖9是包含本發明的散熱器之冷卻系統的構成圖。 圖10是圖9的冷卻風扇的外觀圖。 圖11是顯示同冷卻風扇的風量分布之圖表。 圖1 2是以往的空冷系統之構成圖。 [Ϊ要元件符號說明】 1 ： CPU 10 ： CPU 罩 1 2 :液體泵 -20- 200822852 20,1 20 :散熱器 2 1 :冷卻液流路 22，122 :冷卻風扇 22a :送風口 23 :入口管 24 :出口管 3 0 :流路單元 3 1 :入口孔 3 2 :出口孔 34U?34L ：流路板 3 5 :接合面 3 6 :流路凹部 3 7,3 8 :間隔件部 3 9 :間隔件突起 4 0 :流路塊 41 :上主體 4 1 S :間隔件脚 42 :下主體42 43 :環狀凹部 4 4 : Ο型環 1 1 1 :加熱管 1 1 1 a :授熱部 1 1 1 b :散熱部 5 :冷卻空氣通過空間 -21Comparison of the example of the liquid cooling performance cooling fan in the table) (in) a01 heat source (CPU) W 40.4 40.4 a02 cooling fan size ηιηιχηιηι 8.5x45 8.5x45 a03 cooling fan (power supply DC5V) wind speed when the air outlet is sent out m/s 6.1 6.1 a04 Wind speed m/s when sent by radiator 3.4 3.4 a05 room temperature Ta°C 25.0 25.0 a06 Temperature of wind sent by radiator T°C 34.0 35.4 a07 Heat source (CPU) temperature T°C 64.1 65.9 a08 The temperature of the coolant on the inlet side of the CPU cover T°C 53.3 55.1 a09 The temperature of the coolant on the outlet side of the CPU cover T°C 58.3 60.1 The temperature of the coolant on the inlet side of the alO radiator T°C 58.3 60.1 Temperature of the coolant on the outlet side of the all radiator T°C 54.0 55.8 al2 Temperature difference between the inlet side and the outlet side of the CPU cover ^T°C ZI5.0 Δ5Λ The temperature of the coolant on the inlet side of the radiator and the CPU cover Poor / 1 〇a (\ 1 ac\ η Temperature difference between the radiator and the inlet side of the CPU cover Zll 1 UU· / LI · / al4 Temperature difference between the inlet side and the outlet side of the radiator zlT°C ^4.3 ^4.3 al 5 The difference between the temperature of the wind sent by the radiator and the room temperature ATC Z19. 0 ^10.4 al 6 thermal resistance in the CPU cover 値°c/w 0.14 0.14 al 8 thermal resistance in the heat sink 値°c/w 0.82 0.87 al9 all thermal resistance in the system 値°c/w 0.97 1.01 by table 3, it can be seen that the wind from the cooling fan 22 is larger than the one end side 20a of the radiator 20, and the cooling system L (in the embodiment) which supplies a large amount of air to the other end side 20b has a thermal resistance of 0.97 PC / W], compared with the third cooling system (comparative example), the thermal resistance 値1. 〇1 [ °C / W] is small, compared to the wind from the cooling fan 22 than the other end side 20b of the radiator 20, one end When the side 20a has a large amount of air supply, the cooling performance can be improved. -18- 200822852 Therefore, the difference in the orientation of the cooling fan 22 causes a difference in cooling performance because the inlet pipe is provided in the structure of the radiator 2〇. 23 and one end side 20a of the outlet pipe 24 are narrower than the other end side 20b 'the passage of the wind' and the wind sent by the cooling fan 22 is not at right angles to the air supply port 22a, but is as shown in Fig. 10 and Fig. 1 above. As explained, there is a large angle in the direction of rotation. That is, in the third cooling system (comparative example) The wind from the cooling fan 22 is blown by the left side of the other end side 20b of the radiator 20 to the right side of the one end side 20A, so that the wind generated by the cooling fan 22 is affected by the flow path block. 40 0 is blocked, causing an increase in the pressure loss of the wind. Therefore, the amount of cold air actually contacting the radiator 20 is reduced, and the cooling effect is lowered. On the other hand, in the cooling system L (in the embodiment), the wind from the cooling fan 22 in Fig. 9 is blown by the right side of the one end side 20A of the radiator 20 toward the right side of the other end side 20b, and is On the other end side 20b, the portion for blocking the wind is smaller than the end portion 20a. Therefore, the passage of wind is better than that of the third cooling system (comparative example), and the pressure loss of the wind is reduced. As a result, the amount of cold air actually coming into contact with the radiator 20 becomes more than that of the third cooling system. Thereby, in the present cooling system L, a cooling effect superior to that of the third cooling system can be obtained. Further, the cooling effect is largely dependent on the difference between the temperature of the cold air and the temperature of the object, and therefore the following reason can also be considered. In the present cooling system L, the cold air having the lowest temperature of the cold air and the lowest temperature close to the room temperature is in contact with the portion where the temperature of the coolant is the lowest and the temperature difference from the cold air is large (the outlet pipe 24), so when the coldest cold air contacts the portion At the time, the liquid temperature at the outlet drops, and therefore, the cooling effect becomes high. On the other hand, in the third cooling system, on the one end side 20a -19- 200822852 of the radiator 20, once the warmed wind comes into contact with the portion near the outlet of the radiator 20, the coolant is cooled to the coldest portion (the outlet pipe 24). Therefore, the temperature of the coolant does not decrease near the outlet of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a basic concept of a heat sink of the present invention. Fig. 2 is an exploded perspective view showing an embodiment of the heat sink of the present invention. Figure 3 is the same plan view. Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3 . Figure 5 is a cross-sectional view taken along line V-V of Figure 3 . Figure 6 is an enlarged cross-sectional view of a portion of Figure 3. Figure 7 is a plan view of a flow path plate unit used in the heat sink of Figures 2 through 6. Figure 8 is a cross-sectional view of the same flow channel plate unit. Fig. 9 is a configuration diagram of a cooling system including the heat sink of the present invention. Fig. 10 is an external view of the cooling fan of Fig. 9; Fig. 11 is a graph showing the air volume distribution of the same cooling fan. Fig. 1 is a configuration diagram of a conventional air cooling system. [Key element symbol description] 1 : CPU 10 : CPU cover 1 2 : Liquid pump -20- 200822852 20, 1 20 : Radiator 2 1 : Coolant flow path 22, 122 : Cooling fan 22a : Air supply port 23 : Entrance Tube 24: outlet pipe 3 0 : flow path unit 3 1 : inlet hole 3 2 : outlet hole 34U to 34L : flow path plate 3 5 : joint surface 3 6 : flow path concave portion 3 7, 3 8 : spacer portion 3 9 : spacer protrusion 4 0 : flow path block 41 : upper body 4 1 S : spacer foot 42 : lower body 42 43 : annular recess 4 4 : Ο type ring 1 1 1 : heating tube 1 1 1 a : heat Part 1 1 1 b : heat sink 5 : cooling air through space - 21