200815746 九、發明說明： 【發明所屬之技術領域】 本發明係關於電路在製造期間之檢驗，更具體而言，係關於減 少在印刷電路板檢驗期間誤測之缺陷。 - 【先前技術】 自動化光學檢驗（AOI)系統已眾所習知，且可自包括位於以色 列Yavne之0rbotech有限公司在内之各出售商購得。傳統上需要 驗證AOI系統所制到之候選缺陷係為實際之缺陷還是被誤判為 缺陷，通常係、藉由操作人員查看候選缺陷之影像來驗證。本發明 用以提供自動驗證㈣缺陷係真正為缺陷還是被誤判為缺陷之處 理系統。 【發明内容】 本發明力圖提供-種適用於在檢驗印刷電路板過程中減少缺陷 誤測數量之光學檢驗系統。 因此，根據本發明之—實施例提供—種用於電路裝置之光學檢 驗系統包含光學檢驗功能，提供—所檢驗電路裳置上至少一區域 之一光學檢驗輸出；算法檢驗功能，提供該至少一區域之一算法 檢驗輸出，該算法檢驗輸出指示於該至少一區域處存在一可能之 缺陷；一顯示器，根據該光學檢驗輸出向一操作員提供該至少一 區域之一視覺感應顯示；以及一顯示控制器，可因應指示於該至 少一區域處未識別出一缺陷之所感測操作員行為、以及因應指示 於该至少〆區域處存在一可能缺陷之該算法檢驗輸出，使該顯示 6 200815746 提供對在自该所感測操作員行為獲知存在之缺陷與該至少一區域 之该异法檢驗輸出間存在不一致性之一適當指示。此不一致性之 適當指不包含第二次提供對該至少一區域之一視覺感應顯示。 根據本發明之一實施例，該算法檢驗功能包含螢光檢驗功能， 舉例而言，採用會觸發一所檢驗基板發出螢光之深紫色光或紫外 線（uv)照明。另外或者另—選擇為，該算法檢驗功能包含不同 於在該光學檢驗功能t所用檢驗功能之至少—檢驗功能。較佳方 式是該至少-檢驗功能包含—螢光檢驗功能，—暗場檢驗功能， -亮場檢驗功能，-uv檢驗功能以及_高度檢驗功能至少其中 之一。 根據本發明之另—實施例，該光學檢驗功能包含—反射檢驗功 能。另外或者另-選擇為，該光學檢驗系統更包含—缺陷分析器， 用以接收該至少-區域之該光學檢驗輸出以及該至少—區域之至200815746 IX. INSTRUCTIONS: TECHNICAL FIELD OF THE INVENTION The present invention relates to the inspection of circuits during manufacture, and more particularly to the reduction of defects that are misdetected during inspection of printed circuit boards. - [Prior Art] Automated Optical Inspection (AOI) systems are well known and are commercially available from various vendors including 0rbotech Co., Ltd. of Yavne, Israel. Traditionally, it is necessary to verify whether the candidate defect made by the AOI system is an actual defect or is misjudged as a defect, and is usually verified by the operator viewing the image of the candidate defect. The present invention is used to provide an automatic verification (4) whether the defect is truly defective or misidentified as a defect management system. SUMMARY OF THE INVENTION The present invention seeks to provide an optical inspection system suitable for reducing the number of false positives in the inspection of printed circuit boards. Accordingly, an optical inspection system for a circuit arrangement according to the present invention includes an optical inspection function for providing an optical inspection output of at least one region of the inspection circuit, and an algorithm verification function for providing the at least one One of the regions of the algorithm checks the output, the algorithm checks that the output indicates that there is a possible defect at the at least one region; a display that provides an operator with a visually sensed display of the at least one region based on the optical inspection output; and a display The controller may provide the display 6 200815746 in response to the sensed operator behavior indicating that the defect is not identified at the at least one region, and the algorithm verification output indicating that there is a possible defect at the at least one region An appropriate indication of an inconsistency between the defect that is known to be experienced by the sensed operator and the output of the heterogeneous test of the at least one region. The appropriateness of this inconsistency does not include providing a second visually responsive display of one of the at least one region. In accordance with an embodiment of the present invention, the algorithm verification function includes a fluorescence inspection function, for example, using deep purple or ultraviolet (uv) illumination that triggers the illumination of a test substrate. Alternatively or additionally, the algorithm verification function includes at least an inspection function that is different from the inspection function used in the optical inspection function t. Preferably, the at least-test function includes at least one of a fluorescent inspection function, a dark field inspection function, a bright field inspection function, a -uv inspection function, and a _ height inspection function. According to another embodiment of the invention, the optical inspection function includes a reflection detection function. Additionally or alternatively, the optical inspection system further includes a defect analyzer for receiving the optical inspection output of the at least region and the at least region
少一參考影像，並向該算法檢驗功能與該光學檢驗功能之至少其 中之-提供對朗檢驗電路裝置巾候選缺陷 較佳方式是該至少-參考影像係自至少 根據本發明之又一實施例，該至少—電腦參考構案包含至少一 二進位制影像。較佳方式是該至少—參考影像係自在該電路裝置 之設計或製造中所用之-CAD或CAM構案取得。視需要，該至 少一電腦參考構案係自至少-已知無缺陷之印刷電路板操取。 根據本發明之再一實施例，該視覺感應顯示包含該至少一區域 ㈣影像。較㈣式是簡感測操作員行為包含以不到 &持續時間查看該視覺感應顯示H該預定持續時間係 200815746 小於五秒鐘，並可小於二秒鐘。另一選擇為，該所感測行為包含 一分類操作，例如按下一適當之電腦按鍵。 根據本發明之另一實施例，亦提供一種用於對電路裝置進行光 學檢驗之方法，包含提供一所檢驗電路裝置上至少一區域之一光 學檢驗輸出·，提供該至少-區域之—算法檢驗輸出，該算法檢驗 輸出指示於該至少—區域處存在—可能之缺陷；根據該光學檢驗 輸出向-操作員提供該至少一區域之一視覺感應顯示；以及因應 指不於該至少-區域處未識別出—缺陷之所感測操作員行為、以 ==指示於該至少—區域處存在—可能缺陷之該算法檢驗輸 ▲使_讀供對在自朗感測操作員行為獲知存在之缺陷與 δ亥至少—區域之該算法檢驗輸出間存在不—致性之—適當指示了 ::㈣當指示包含第二次提供對該至少-區域之；感 光實施例’該提供一算法檢驗輸出包含提供-勞 例而言’提供因應會觸發-適當之可感覺榮光響 二=(uv)照明。另外或者另-選擇為，該提 含提供== 方式是該提供至少-檢驗輸出包 UV檢驗輪:::暗場檢驗輸出’-亮場檢驗輸出，-出乂及一南度檢驗輸出至少其中之一。 根據本發明之另—實施例，該提供 反射檢輪。㈣咖樹⑽=包含提供— 光學檢驗輸出；接收該至少-區域之至少—來區域之該 /亏〜像；以及提供 8 200815746 對該所檢驗電路裝置中候選缺陷之位置之輸出指示。 ，根據本發明之又_實施例，該接收該至少—參考影像包含自至 >、一電腦參考播案中獲得該至少—參考影像。另外或者另— 為，该接收該至少一灸者与德 、 路杯… ，考〜像包含自至少-已知無缺陷之印刷電 路板擷取5亥至少一參考影像。 根據本發明之再一實施例，該提供一視覺感應顯示 域之至少—反射影像。較佳方式是該所感測操作員^ 匕3以不到―預定持續時間查相視覺感應顯* 三 持續時間係為小於五秒於，，认 D亥預疋 ^ n並可小於mu擇為，該所 感測操作員行為包含-適當之標記，例如按下一適當之電腦按鍵。 【實施方式】 〜見弟1圖’其係、為根據本發明—實施例構造而成及運作之光 子核驗系統之一簡化局部示意性方塊圖。 八㈣康本發明之—實施例，—種用於電路裝置之光學檢驗系統包 2先學檢驗功能，其提供—所檢驗電路裝置上至少—區域之光 =驗輪^算法檢驗功能，其提供該至少—區域之—算法檢驗 —5亥异法檢驗輸出指示於該至少-區域處存在一可能之缺 顯示器，、其根據該光學檢驗輸出向—操作員提供該至少一 至:?見覺感應顯示；以及一顯示控制器，其可因應指示於該 _ =區域處未識別出—缺陷之所感測操作貢㈣、以及因應指 =该至少-區域處存在—可能缺陷之該算法檢驗輸出，使該顯 =對在_感測操作M行為與該至少—區域之該算法檢驗輸 曰子在一不-致性之一適當指示。此不_致性之適當指示包含 9 200815746 第二次提供該至少一區域之一視覺感應顯示。該所感測操作員行 為係指示存在或不存在一實際缺陷。 如第1圖中所示，一光學檢驗系統100包含用於擷取影像之至 少一第一檢驗站110,該影像包含所要檢驗之一第一電路114之一 或多個區域之一或多個反射影像112。反射影像112可藉由例如掃 描第一電路114來擷取。较佳的檢驗站110係為一 DiscoveryTW光 學檢驗系統，其可自位於以色列Yavne之Orbotech有限公司購得， 儘管亦可採用任何其他適合之檢驗站。 反射影像112被提供至一缺陷分析器子系統120,缺陷分析器子 系統120包含偵測處理功能以及驗證處理功能。此偵測處理功能 以及驗證處理功能可分別由單獨之CPU支援，或者其可採用同一 CPU。該偵測處理功能接收反射影像112，並另外接收對應於第一 電路114之一參考影像122。適合之參考影像可自電腦參考檔案（圖 未示）獲得，而電腦參考檔案又可自CAM檔案以及自已知無缺陷 之印刷電路板擷取之影像獲得。根據本發明之一實施例，該電腦 參考檔案包含一二進位制影像。視需要，該電腦參考檔案包含對 應於所要檢驗之電路之一輪廓（即導體與基板間之邊緣）圖。 缺陷分析器子系統120之偵測處理功能係用以對一反射影像112 進行自動光學檢驗，比較反射影像112與參考影像122,並輸出對 第一電路114上候選缺陷之指示。一旦完成光學檢驗，便將每一 電路向下游傳遞至一驗證站130，例如一 VeriSmartTM缺陷驗證系 統（其可自位於以色列Yavne之Orbotech有限公司購得），以在此 處執行缺陷驗證及/或校正。應瞭解在第1圖中，接受光學檢驗之 10 200815746 第一電路114係位於檢驗站no中，而先前經過檢驗之一第二電 路132係位於一驗證站130中。儘管圖中將驗證站130顯示為一 獨立之驗證站’然而未必必需如此。 先前經過檢驗之電路132已在檢驗站110中經過自動光學檢 驗’且缺陷分析器子系統12〇之偵測處理功能已識別出其上面之 至少一候選缺陷。電路132上候選缺陷之位置通常不同於在同一 類型之其他經檢驗電路上所發現缺陷之位置，儘管某些候選缺陷 亦可能相似並可能在同一類型之各連續電路重現於該位置上。 一與驗證站130進行運作通信之驗證控制器（圖未示）接收到 對候選缺陷126之指示，該等候選缺陷126係對應於在先前經過 檢驗之電路132上所識別之候選缺陷。 檢驗站110與驗證站130可為獨立之單元，如於第1圖中所示。 獨立驗證站130之一實例係為VeriSmart™缺陷驗證系統，其可自 位於以色列Yavne之Orbotech有限公司購得。獨立光學檢驗系統 之一實例係為DiscoveryTW光學檢驗系統，其亦可自位於以色列 Yavne之Orbotech有限公司購得。某些配置形式之DiscoveryTW光 學檢驗系統另外設置有一視訊影像擷取系統，用以擷取嫌疑缺陷 之所選視訊影像，該等影像可用於在一適合之下游校正站中進行 才父正之如人工過濾、某些嫌疑缺陷。另一選擇為，檢驗站11 〇與驗 證站130可為一體成形，例如在Spiron™光學檢驗系統（亦可自 位於以色列Yavne之Orbotech有限公司購得）一樣。 驗證站130較佳方式是包含一照相機140以及一照相機定位器 142，照相機定位器142用以根據驗證控制器之一輸出來循序定位 11 200815746 …目機〗40’以循序查看候選缺陷146之位置。該驗證控制器之輪 =提ί、缺析nm m之彳貞測處理功能所識別候選缺陷之 幾何位置之指示’且定位器142將照相機14〇移動至所指示位置。 在第1圖所示之實施例中，照相機定位器142用關立控制照相 機140之Χ_γ位置，儘#此處不一定必须如此。舉例而言，定位 态142亦可在一極座標系中控制照相機14〇之定位。 根據本發明之一實施例，在電路132上所循序查看之每—候選 • 缺^位置⑷上，位4 !46以適合提供一光學檢驗輸出之光照明， 較佳方式是該光學檢驗輸出對操作員顯示候選缺陷位置146之視 見影像。另外，以適合提供—適用於其算法分析之影像之不同照 明配置對候選缺陷位置146進行照明，舉例而言，以至少一種其 他波長之光或以不同入射角提供之光對候選缺陷位置照明。 在本發明之一實施例中，照相機14〇擷取候選缺陷位置M3之 一反射影像15G以及對適合波長之光之螢光響應之—榮光影像 W2,例如對深紫色或UV照明之響應顯示之一影像。除了—螢光 • 影像152之外或者替代螢光影像152,照相機140亦可掏取—暗場 影像亮場影像’- UV影像，- IR影像，一不同頻譜之影像 以及採用—高度感測器擷取之一影像中之一或多種影像。螢光影 像152與反射影像15〇通常係在接近重叠之時間間隔期間擷取。 在第1圖所示之實施例中，—旦在一第一缺陷位置146處擷取 到驗證影像⑼及⑸，缺陷分析器子系統m之驗證處理功能便 對一螢光影像152實施算法評價，例如在背景下執行。將照相機 140重新定位於下一候選缺陷位置處（下一候選缺陷之位置係由驗 12 200815746 證控制為之輸出提供），並在择 森作貝對位置146之適合影像（例如 其-反射影们50)進行評價之同時，在該下—位置榻取一或多個 驗證影像。在本發明之一宭尬点 霄％例中，對驗證影像150及152之榻 取係以一設定之影像齡速率進行，㈣操作員通常以較慢步調 進订之箱無關。因此，對每—位置進行娜驗證影像⑼，健存 於一記憶體（圖未示）中並隨後在需要時提供給操作員。對所選 位置進㈣取螢級證影像152，並在背景下崎算法檢驗，算法Preferably, the reference image is less than one of the algorithm and the at least one of the optical inspection function is provided The at least one computer reference structure includes at least one binary image. Preferably, the at least - reference image is obtained from a CAD or CAM configuration used in the design or manufacture of the circuit device. As needed, at least one computer reference architecture is operated from at least a known defect-free printed circuit board. According to still another embodiment of the present invention, the visual sensing display includes the at least one region (four) image. The (4) is a simple sensing operator behavior that includes viewing the visual sensing display H for less than <> duration for the predetermined duration of 200815746 less than five seconds and may be less than two seconds. Alternatively, the sensed behavior includes a sorting operation, such as pressing an appropriate computer button. According to another embodiment of the present invention, there is also provided a method for optically verifying a circuit device, comprising providing an optical inspection output of at least one region of a verification circuit device, providing an at least-region-algorithm test Output, the algorithm verifies that the output indicates that there is a possible defect at the at least region; the optical inspection output provides the operator with a visually sensed display of the at least one region; and the response indicates that the at least region is not Identifying - the operator's behavior of sensing the defect, indicating that there is a defect at the at least - region - = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = At least the region - the algorithm checks for the existence of non-saturation between the outputs - the appropriate indication:: (d) when the indication contains the second provision for the at least - region; the photosensitive embodiment 'provides an algorithm to verify the output contains the provided - In the case of labor, 'providing that the trigger should be triggered - the appropriate feeling can be felt glory 2 = (uv) lighting. Alternatively or additionally - the selection is that the offer provides == mode is to provide at least - test output package UV inspection wheel::: dark field test output '- bright field test output, - exit and one south test output at least one. According to another embodiment of the invention, the reflective inspection wheel is provided. (4) The coffee tree (10) = includes providing - an optical inspection output; receiving at least the at least - region of the region / the deficient image; and providing an output indication of the position of the candidate defect in the verified circuit device. According to still another embodiment of the present invention, the receiving the at least-reference image includes obtaining the at least-reference image from a computer reference broadcast. In addition or in addition, the receiving of the at least one moxibustor and the German, the road cup ..., the test ~ image containing at least one reference image from the at least - known defect-free printed circuit board. In accordance with still another embodiment of the present invention, the at least one reflected image of a visually sensitive display field is provided. Preferably, the sensing operator 匕3 does not have a predetermined duration of time to observe the visual sensing display. The three durations are less than five seconds, and the DH is less than and can be less than mu. The sensor operator behavior includes - appropriate markings, such as pressing an appropriate computer button. [Embodiment] The simplification of the partial schematic block diagram of one of the photon verification systems constructed and operated in accordance with the present invention is shown. VIII (4) Kang Ben invention - an embodiment, an optical inspection system package for a circuit device 2 pre-test function, which provides - at least - region light = inspection wheel ^ algorithm check function on the circuit device to be tested, which provides The at least-area-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- And a display controller that can inspect the output in response to the sensing operation (4) indicating that the defect is not recognized at the _= region, and the possible defect is determined by the finger=the at least-region exists </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; An appropriate indication of this non-conformity includes 9 200815746 providing a visually sensitive display of one of the at least one area for the second time. The sensed operator behavior indicates the presence or absence of an actual defect. As shown in FIG. 1, an optical inspection system 100 includes at least one first inspection station 110 for capturing images, the image including one or more of one or more regions of the first circuit 114 to be inspected. The image 112 is reflected. The reflected image 112 can be captured by, for example, scanning the first circuit 114. The preferred inspection station 110 is a Discovery TW optical inspection system available from Orbotech, Inc. of Yavne, Israel, although any other suitable inspection station may be employed. The reflected image 112 is provided to a defect analyzer subsystem 120, which includes a detection processing function and a verification processing function. This detection processing function and verification processing function can be supported by separate CPUs, or they can use the same CPU. The detection processing function receives the reflected image 112 and additionally receives a reference image 122 corresponding to the first circuit 114. Suitable reference images are available from computer reference files (not shown), and computer reference files are available from CAM files and images captured from known defect-free printed circuit boards. According to an embodiment of the invention, the computer reference file contains a binary image. The computer reference file contains, as needed, a map corresponding to one of the outlines of the circuit to be inspected (i.e., the edge between the conductor and the substrate). The detection processing function of the defect analyzer subsystem 120 is for performing an automatic optical inspection of a reflected image 112, comparing the reflected image 112 with the reference image 122, and outputting an indication of candidate defects on the first circuit 114. Once the optical inspection is completed, each circuit is passed downstream to a verification station 130, such as a VeriSmartTM defect verification system (available from Orbotech, Inc., Yavne, Israel) to perform defect verification and/or here. Correction. It should be understood that in Fig. 1, the optical circuit 10 10, 915, 746, the first circuit 114 is located in the inspection station no, and the previously tested one of the second circuits 132 is located in a verification station 130. Although the verification station 130 is shown as a separate verification station in the figure, it may not be necessary. The previously verified circuit 132 has undergone an automated optical inspection in the inspection station 110 and the defect detection subsystem 12 has detected at least one candidate defect thereon. The locations of candidate defects on circuit 132 are typically different from the locations of defects found on other tested circuits of the same type, although some candidate defects may be similar and may reappear at that location in successive circuits of the same type. A verification controller (not shown) in operational communication with verification station 130 receives an indication of candidate defects 126 that correspond to candidate defects identified on previously verified circuit 132. The inspection station 110 and the verification station 130 can be separate units, as shown in FIG. An example of an independent verification station 130 is the VeriSmartTM Defect Verification System, which is commercially available from Orbotech, Inc. of Yavne, Israel. An example of an independent optical inspection system is the DiscoveryTW optical inspection system, which is also available from Orbotech, Inc. of Yavne, Israel. In some configurations, the DiscoveryTW optical inspection system is additionally provided with a video image capturing system for capturing selected video images of suspected defects, and the images can be used for manual filtering in a suitable downstream correction station. Some suspected defects. Alternatively, the inspection station 11 and the verification station 130 may be integrally formed, such as in the SpironTM optical inspection system (also available from Orbotech, Inc. of Yavne, Israel). The verification station 130 preferably includes a camera 140 and a camera positioner 142 for sequentially positioning 11 200815746 ... camera 40' according to one of the verification controller outputs to sequentially view the position of the candidate defect 146. . The wheel of the verification controller = an indication of the geometric position of the candidate defect identified by the measurement processing function, and the positioner 142 moves the camera 14 to the indicated position. In the embodiment shown in Fig. 1, the camera positioner 142 controls the Χ γ position of the camera 140 with the illuminator, which is not necessarily the case here. For example, the positioning state 142 can also control the positioning of the camera 14 in a polar coordinate system. In accordance with an embodiment of the present invention, on each of the candidate-missing locations (4) of the sequentially viewed circuit 132, bits 4! 46 are adapted to provide illumination for an optical inspection output, preferably by optical inspection output pair. The operator displays the viewing image of the candidate defect location 146. In addition, candidate defect locations 146 are illuminated in different illumination configurations suitable for providing images suitable for their algorithm analysis, for example, illumination of candidate defect locations by light of at least one other wavelength or light provided at different angles of incidence. In one embodiment of the invention, the camera 14 captures a reflected image 15G of one of the candidate defect locations M3 and a luminosity image W2 of the fluorescent response to light of a suitable wavelength, such as a response to deep purple or UV illumination. An image. In addition to or instead of the fluorescent image 152, the camera 140 can also capture - dark field image bright field image '-UV image, - IR image, a different spectrum image and adopt - height sensor Capture one or more images from one of the images. The fluorescent image 152 and the reflected image 15 are typically captured during a time interval that is close to overlap. In the embodiment shown in FIG. 1, the verification image (9) and (5) are captured at a first defect location 146, and the verification processing function of the defect analyzer subsystem m performs an algorithm evaluation on a fluorescent image 152. , for example, executed in the background. The camera 140 is repositioned at the next candidate defect location (the location of the next candidate defect is provided by the test 12 200815746 control output), and the appropriate image is selected at the location 146 (eg, its reflection 50) At the same time as the evaluation, one or more verification images are taken at the lower position. In one example of the present invention, the evaluation of the images 150 and 152 is performed at a set image age rate, and (iv) the operator is usually unrelated to the slower pace of the ordering box. Therefore, the verification image (9) is performed for each position, and is stored in a memory (not shown) and then provided to the operator when needed. Enter the (4) fire level certificate image 152 for the selected position, and test the algorithm in the background.
檢驗結果由操作員根據需要用於對缺陷驗證進行嫁認。 較佳方式是將-候選缺陷位置146之反射影像15〇顯示給靠近 缺陷分㈣子系統12〇之操作員，以供其審查。通f，操作員檢 查反射影像150，並決定該影像是否包含一實際缺陷。若包含，則 操作員通常修復電路132中之缺陷，或者若缺陷無法修復，則對 電路U2進行適當標記。#f彡像15()顯轉在非缺陷之誤測時， 操作員通常在審查當前候選缺陷位置之後立即（通常在卜2秒内， 且平常在小於5秒内）繼續檢查下一候選缺陷位置146之影像， 儘管系統亦可設定成提供-更長或更短之時間間隔對—候選缺陷 位置進打人工審查。在本發明之一實施例中，—旦斷定一第一嫌 疑缺陷位置係被誤測’操作員便按下—電腦按鍵來命令電腦顯示 下-嫌疑缺陷位置之影像，從而藉由㈣來提供該第—嫌疑缺陷 位置係被誤測之功能指示。 與操作員分析反射影像152同時或在此之前，將候選缺陷位置 ，螢光影像152提供至缺陷分析好线m之驗證處理功能。 該子系統對每-螢絲像152實施自動算法分析，以藉由算法來 13 200815746 驗祖其中所包含之’選缺關—實際缺陷、還是非缺陷情形之 誤测。算法檢驗通常係、與操作員執行人工缺陷驗證同時地或在此 之前實施於一設定缺陷位置，且在操作員完成驗證之後立即加以 ，用，以對#作員驗證之正確性予以確認。—種適合之自動驗證 算法目前執行在SpiW%統中，此系統可自位於以色列γ㈣ 之Orbotech有限公司購得。其他適合之算法驗證系統以及方法鬧 述於本發明者同在Μ中之第_93,224號以及第11/254,756號 美國專射明案中，該等專财請案之揭示内容則I用方式併入 本文中。 . ㈣本發日月之—實_，缺时析訂线120包含-顯示控 制為（圖未不），該顯示控制器可因應指示在候選缺陷位置刚處 未識別出-實際缺陷之所感測操作員行為（例如檢查一實際缺陷 〜像不到一㈣里並因應指示在候選缺陷位置】46處存在或 ::二夕之异法檢驗輸出。萬-在-算法結果與對應於 夺木作貝订為之一驗證指示問在太 ^ ^ — 存在不—致性，便提示並通常顯示此 =致Γ發:月之一實施例中，萬一在算法與操作_ H50在曹:弟一次向操作員顯示候選缺陷位置146之反射 Γ梅㈣以雨_作員此前已 審查過違缺陷位置之一特定指示。 胃=Γ示，將一候選缺陷位置顯示A給操作員，由操作 =私查之。位置A未被操作員指示為包含一直正缺" 才 候選缺陷位置A之後數秒鐘内顯示下-候選缺陷位置 在圖中顯不為候選缺陷位置 '' 在候選位置BS，存在一真正缺 14 200815746The test results are used by the operator to marry the defect verification as needed. Preferably, the reflected image 15 of the - candidate defect location 146 is displayed to an operator near the defective sub-system 12 for review. Passing f, the operator checks the reflected image 150 and determines if the image contains an actual defect. If included, the operator typically repairs the defect in circuit 132 or, if the defect cannot be repaired, properly marks circuit U2. #f彡像15() indicates that in the case of non-defective misdetection, the operator usually continues to check the next candidate defect immediately after reviewing the current candidate defect location (usually within 2 seconds, and usually within less than 5 seconds) The image of position 146, although the system can also be set to provide - longer or shorter time interval pairs - candidate defect locations for manual review. In an embodiment of the present invention, if it is determined that the first suspected defect location is misdetected, the operator presses the computer button to command the computer to display the image of the suspect-defective defect location, thereby providing the (4) The first-suspect defect location is a function indication that is misdetected. Simultaneously or prior to the analysis of the reflected image 152 by the operator, the candidate defect location, the fluorescent image 152 is provided to the verification processing function of the defect analysis line m. The subsystem performs an automated algorithm analysis on each of the flutter images 152 to detect the deficiencies contained in the primaries, the actual defects, or the non-defective conditions. The algorithm check is usually performed at the same time as or before the operator performs the manual defect verification, and is performed immediately after the operator completes the verification, to confirm the correctness of the #management verification. A suitable automatic verification algorithm is currently implemented in the SpiW% system, which is available from Orbotech Ltd., located in Israel γ (4). Other suitable algorithm verification systems and methods are described in the inventor's _93, 224 and 11/254, 756 US special shots in the case of the inventors, and the disclosure contents of the special funds are in the form of Into this article. (4) The date of the present day--the real-time, the time-definition line 120 contains-display control (picture is not), the display controller can respond to the indication that the candidate defect position is not recognized - the actual defect is sensed Operator behavior (for example, checking an actual defect ~ like less than one (four) and responding to the indication at the candidate defect location] 46 exists or:: Erxi's different method test output. Wan-in-algorithm results and corresponding to the wood Beacon is one of the verification instructions to ask if it is too ^^- there is no-sexuality, it will prompt and usually show this = cause burst: one of the months in the embodiment, in case of algorithm and operation _ H50 in Cao: brother once The operator is shown the reflection of the candidate defect location 146 (4) in the rain _ the employee has previously reviewed a specific indication of the defect location. Stomach = Γ, a candidate defect location is displayed A to the operator, by operation = private Check that position A is not indicated by the operator as containing the all-or-nothing " candidate defect position A is displayed within a few seconds - the candidate defect position is not shown as candidate defect position in the figure '' at the candidate location BS, there is one Really lacking 14 200815746
陷=而操作員校正之。當操作員完成檢查且校正候選缺陷位置B 处之貝IV、缺時（在此處顯示為在顯示缺陷候選位置B之後需要 四十秒鐘，儘管也可能f要不同之時間段來實_㈣ <校正& 修復），顯示下一候選位置C。在審查位置C且指示位置C未包含 、之後纟數移4里内顯不下一影像。在本實例中，下一影像對 應於第二次顯示之候選缺陷A。 應庄忍的疋，在本發明之—實施例中，於操作員檢查候選缺陷 :置的同時’顯示控制器接收對候選缺陷位置A、B及C之算法 为析之輸出，算法分析係於背景下執行且根據檢驗算法指示一候 選缺陷位置是否係—實際缺陷。在第1圖所示之實施例中’該算 法:析.位置A係—缺陷，其最初未鶴作員制到；位置 B。係一真正之缺陷’此對應於操作員之_結果；而位置C則為 誤測，其亦被操作員_為誤測。在本發明之—實施例中，曾法 結果與操作員結果（藉由操作㈣候選缺陷位置Α僅評價幾:鐘 之订為來感測）間之不—致性使得候選缺陷位置A之參考影像將 顯示給操作M。應瞭解亦可採用用於指示操作員結果盘—曾如士 果間之不-致性之方法，而非重新顯示對應於該不—致^位口 =考影像。舉例而言，可藉由產生一不—致性的報告並 作貝返回並重新分析所選缺陷位置之選項來指示—不—致性。鬥、 樣地應瞭解’所感測之操作員行為對應於所感測之將—位二 為有缺陷之時間間隔、或者其他所感測行為，例如按下―電腦： 鍵將-特定位置歸㈣包含缺陷或誤測。 自女 參見第2圖，其係為一種根據本發明—實施例運作且採用第1 15 200815746 圖所示光學檢驗系統之光學檢驗方法之一簡化流程圖。 根據本發明之一實施例，在如檢驗站11〇 (第1圖）處擷取一所 檢驗電路之—反射影像。在如缺陷分析器子系統120(第1圖）處 對孩反射衫像進行自動光學檢驗及分析，以識別所檢驗電路中之 候込缺在该步驟中，不同之候選缺陷已被識別出來，且需要 驗a "亥等候選缺陷係為實際缺陷還是非缺陷之誤測。Sink = and the operator corrects it. When the operator completes the inspection and corrects the candidate defect position B at the position IV, the absence (which is shown here as 40 seconds after displaying the defect candidate position B, although it is also possible that f is different for the time period _ (4) <Correction & Repair, showing the next candidate position C. After the position C is examined and the position C is not included, the next image is displayed within 4 increments. In this example, the next image corresponds to the candidate defect A displayed for the second time. In the embodiment of the present invention, in the embodiment of the present invention, the operator checks the candidate defect: while the display controller receives the output of the candidate defect positions A, B, and C as an output, and the algorithm analysis is performed. Performed in the background and in accordance with the inspection algorithm indicates whether a candidate defect location is an actual defect. In the embodiment shown in Fig. 1, the algorithm: the position A system is a defect, which was initially not made by the crane; position B. It is a real defect 'this corresponds to the operator's result; and the position C is misdetected, which is also misidentified by the operator. In the embodiment of the present invention, the result of the method and the result of the operator (by operating (4) candidate defect position Α only evaluate a few: the time of the clock is to sense) the reference to the candidate defect position A The image will be displayed to operation M. It should be understood that it is also possible to use a method for indicating the operator's result disc--------------------------------------------------------------------------------- For example, the indication can be indicated by generating an inconsistent report and returning and reanalysing the selected defect location. Bucket, sample plot should understand that 'the sensed operator behavior corresponds to the sensed sense - bit two is the time interval of the defect, or other sensed behavior, such as pressing the "computer: key - specific position (4) contains defects Or mistest. See Figure 2, which is a simplified flow diagram of one of the optical inspection methods of an optical inspection system operating in accordance with the present invention and using the 1 15 200815746 diagram. In accordance with an embodiment of the present invention, a reflected image of a test circuit is captured at, for example, the inspection station 11 (Fig. 1). Automatic optical inspection and analysis of the child's shirt image, such as the defect analyzer subsystem 120 (Fig. 1), to identify the candidate in the circuit being verified. In this step, different candidate defects have been identified. It is also necessary to check whether the candidate defects such as a "Hai are actual or non-defective.
根據本發明之一實施例，對指示所檢驗電路上每一候選缺陷之 輸出進行處理，以渡除重覆性候選缺陷。該等重覆性候選缺陷 例如包括重覆出現於—系列類似電路上之幾何候選缺陷。重新出 候k缺(其在一系列類似電路板上一個板接一個板地在同 一:置上重覆出現）如果被判定不構成實際缺陷，則可將其濾、除， 儘管其為重覆出現之幾何缺陷，如在本中請者/受讓者之同在申請 中之第11/G72,235號美國專财請案中更詳細之說明。 提供-指示每-需要驗證之候選缺陷之輸出至一驗證站，例如 =站UG (第1圖）。對於每—候選缺陷位置，皆反射影 像亚將其提供給驗證站操作員進行檢查。 例如在驗證站13〇(第1圄、_ + & ^ 弟图）處亦擷取候選缺陷位置之一第-與 像，通常係一螢光影像。較佳方六1兮— 弟一〜 射影像之今π々、十， 工疋°"弟一影像一般係在擷取反 光H 1 、之後、抑或同時進行擷取。較佳方式是該螢 先衫像包含該候選缺陷以及環銬 、疋〆螢 參考圖（例如自- CAM槽宰丨1、^之*部分區域。一 別。在背㈣咐_彳\=) ^㈣分也被識 候選缺，實 16 200815746 算法闊述於本申請者/受讓者之同在申請中之第ι〇 11/254,756號美國專利申請案之苴 ，唬”弟 請案之揭示内容以引用方式併入本文中 、’申 候選缺陷係—實際缺陷還是對—非朴"式是將其指示該 二给一驗證顯示控制器’較佳方式是該驗證顯示控制器構: 缺fe为析器子系統120 (第丨圖）之一部分。 若該候選缺陷藉由算法分析被識別為一實際缺陷，則 示控制器檢查操作員是否亦ο3·''ά 役朴丄 兀將5_缺陷識別為-實際缺陷。此 ;猎由如確㈣作員是否肯定地識別出―缺 =電腦按鍵），或者藉由檢查操作員查看或檢查該候選缺陷 像日寸之歷時來達成。舉例而言，若該歷時相對較短，例如小於五/ 秒鐘且通常小於二秒鐘，職驗證顯補制^卩決定操作員未識 ==選缺陷為-實際缺陷。若在該算法結果與操作員驗證結 果間存在不一致性，則提供一搞告- 適萄之指不。該適當之指示可僅係 =操作員重新顯示該候選缺陷之反射影像，以使操作員進-步檢 厂亥缺。反射衫像之重新顯示可能天衣無縫且不會為操作員所 知曉。視需要’ mm控制目的可提供並視需要記錄對該 不一致性之警告。 二此程序之2’、對所期望的—組候選缺陷中每—缺陷之驗證即 口几成。一旦完成驗證，便可向前傳遞電路以進行進一步處理 :例而言’可將—其中所有缺陷皆被確認為誤測缺陷之電路向前 傳遞，以進行進-步之電路製作作業，例如透過微型加工。 而其中某些候選缺陷已被識別為實際缺陷、或者其中自動驗證 17 200815746 而無定論之電路，則可能需要進行額外之缺陷驗證或者一修復作 業。 熟習此項技術者應瞭解，本發明並不受限於上述具體顯示及說 明之内容。而是，本發明之範圍既包含上述各種特徵之組合及子 組合，亦包含熟習此項技術者在閱讀上文說明後所將想到且在先 前技術中所不存在之其變化及修改形式。 【圖式簡單說明】 # 第1圖係為根據本發明一實施例構造而成及運作之光學檢驗系 統之一簡化部分示意部分方塊圖；以及 第2圖係為顯示一種根據本發明一實施例運作且採用第1圖所 示光學檢驗系統之光學檢驗方法之一簡化流程圖。 【主要元件符號說明】 100光學檢驗系統 112反射影像 120缺陷分析器子系統 126候選缺陷 132第二電路 142照相機定位器 150反射影像 110第一檢驗站 114第一電路 122參考影像 130驗證站 140照相機 146候選缺陷 152螢光影像 18In accordance with an embodiment of the invention, the output indicative of each candidate defect on the inspected circuit is processed to eliminate repeated candidate defects. Such repetitive candidate defects include, for example, geometric candidate defects that appear repeatedly on a series of similar circuits. Re-issued k-deficient (which is on the same board: one board after the other on the same board: reset). If it is judged that it does not constitute an actual defect, it can be filtered and removed, even though it appears repeatedly. The geometrical defects are described in more detail in the US Treasury Application No. 11/G72, 235 in the application. Provide - Indicates the output of each candidate defect that needs to be verified to a verification station, such as = station UG (Figure 1). For each candidate defect location, the reflected image is provided to the verification station operator for inspection. For example, at the verification station 13 (1st, _ + & ^ brother map), one of the candidate defect positions, the first and the image, is also captured, usually a fluorescent image. The best way is to take a reflection of H 1 , after, or at the same time. Preferably, the flasher shirt image includes the candidate defect and the ring 铐, 疋〆 参考 firefly reference map (for example, the self-CAM slot 丨 丨 1, ^ * * part of the area. One. in the back (four) 咐 _ 彳 \ =) ^(4) is also known as the candidate, the actual 16 200815746 algorithm is described in the application of the applicant / transferee in the application of the ι 〇 / / / / / / / / / / 美国 美国 美国 美国 美国 美国 美国 美国 美国 揭示 揭示 揭示 揭示 揭示 揭示The content is incorporated herein by reference, 'application candidate defect system--actual defect or pair--pure" is to indicate the two to a verification display controller. The preferred way is to verify the display controller structure: Fe is part of the analyzer subsystem 120 (figure map). If the candidate defect is identified as an actual defect by algorithm analysis, then the controller checks whether the operator is also ο3·'' ά 丄兀 丄兀 丄兀 5 _ Defects are identified as - actual defects. This is done by whether the singer (4) determines whether the "absence = computer button" is affirmative, or by checking the operator to view or check the candidate defect like the date of the day. For example, if the duration is relatively short, for example less than five / second Usually less than two seconds, the job verification system ^ ^ determines the operator does not know = = select defects - actual defects. If there is inconsistency between the algorithm results and the operator verification results, then provide a notice - suitable The appropriate indication may be that only the operator re-displays the reflected image of the candidate defect so that the operator can step into the factory. The re-display of the reflective shirt may be seamless and not for the operator. Knowing. As needed, the 'mm control purpose can provide and record the warning of the inconsistency as needed. 2. The 2' of this procedure, the verification of each defect of the desired group of defects is a few. Once the verification is completed. The circuit can be forwarded for further processing: for example, a circuit in which all defects are identified as misdetected defects is forwarded for further step-by-step circuit fabrication operations, such as through micromachining. Where some of the candidate defects have been identified as actual defects, or circuits in which the automatic verification of 17 200815746 is inconclusive, additional defect verification or a repair may be required. It is to be understood by those skilled in the art that the present invention is not limited to the details shown and described. The scope of the present invention includes the combinations and sub-combinations of the various features described above, as well as those skilled in the art. The changes and modifications that will occur to the above description and which are not present in the prior art are read. [Simplified Schematic] #第一图 is an optical inspection system constructed and operated in accordance with an embodiment of the present invention. A simplified partial schematic block diagram; and a second diagram is a simplified flow chart showing one of the optical inspection methods operating in accordance with an embodiment of the present invention and employing the optical inspection system of Figure 1. [Main Component Symbol Description] 100 optical inspection system 112 reflected image 120 defect analyzer subsystem 126 candidate defect 132 second circuit 142 camera locator 150 reflected image 110 first inspection station 114 first circuit 122 reference image 130 verification station 140 camera 146 candidate defect 152 fluorescence Image 18