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TW200729372A - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component

Info

Publication number
TW200729372A
TW200729372A TW095147893A TW95147893A TW200729372A TW 200729372 A TW200729372 A TW 200729372A TW 095147893 A TW095147893 A TW 095147893A TW 95147893 A TW95147893 A TW 95147893A TW 200729372 A TW200729372 A TW 200729372A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
electronic component
mounting electronic
unit
inverting
Prior art date
Application number
TW095147893A
Other languages
Chinese (zh)
Other versions
TWI328265B (en
Inventor
Masanori Hashimoto
Yuichi Sato
Yukihiro Ikeya
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200729372A publication Critical patent/TW200729372A/en
Application granted granted Critical
Publication of TWI328265B publication Critical patent/TWI328265B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01093—Neptunium [Np]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

An apparatus for mounting an electronic component is provided with the followings: one wafer stage for supplying a semiconductor chip; a first inverting unit and a second inverting unit, which pick up the semiconductor chip on the wafer stage and then invert the semiconductor chip; a first mounting unit, which receives the semiconductor chip inverted by the first inverting unit and mounts the semiconductor chip on a board; and a second mounting unit, which receives the semiconductor chip inverted by a second inverting pickup tool and mounts the semiconductor chip on the board.
TW095147893A 2005-12-22 2006-12-20 Apparatus and method for mounting electronic component TW200729372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005369515 2005-12-22

Publications (2)

Publication Number Publication Date
TW200729372A true TW200729372A (en) 2007-08-01
TWI328265B TWI328265B (en) 2010-08-01

Family

ID=38188495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147893A TW200729372A (en) 2005-12-22 2006-12-20 Apparatus and method for mounting electronic component

Country Status (5)

Country Link
JP (1) JP4713596B2 (en)
KR (1) KR101014293B1 (en)
CN (1) CN101341587B (en)
TW (1) TW200729372A (en)
WO (1) WO2007072714A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12089340B2 (en) 2019-05-21 2024-09-10 Hallys Corporation Electronic component mounting device for mounting electronic components at certain intervals

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030843B2 (en) * 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP5104685B2 (en) * 2008-09-19 2012-12-19 パナソニック株式会社 Parts pickup device
US9966247B2 (en) * 2012-09-06 2018-05-08 Fuji Machine Mfg. Co., Ltd. Control system and control method for component mounting machine
KR101460626B1 (en) * 2013-06-28 2014-11-13 한미반도체 주식회사 Supplying Apparatus of Semiconductor Materials
WO2015072593A1 (en) * 2013-11-14 2015-05-21 (주)정원기술 Chip supply apparatus of laser chip bonding machine
JP6692376B2 (en) * 2016-02-01 2020-05-13 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method, and package component manufacturing method
JP6717630B2 (en) * 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 Electronic component mounting equipment
JP6942829B2 (en) * 2016-03-29 2021-09-29 芝浦メカトロニクス株式会社 Electronic component mounting device
US11232960B2 (en) 2016-05-13 2022-01-25 Asml Netherlands B.V. Pick-and-place tool having multiple pick up elements
CN107887295B (en) * 2016-09-30 2019-07-23 上海微电子装备（集团）股份有限公司 A kind of chip bonding device and bonding method
KR101939343B1 (en) * 2017-02-28 2019-01-16 (주) 예스티 Apparatus for fabricating semi-conductor
KR101944355B1 (en) * 2017-02-28 2019-01-31 (주) 예스티 Apparatus for fabricating semi-conductor
KR101939347B1 (en) * 2017-02-28 2019-01-16 (주) 예스티 Apparatus for fabricating semi-conductor
JP6781677B2 (en) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 Electronic component mounting equipment and mounting method, and package component manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207595A (en) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2808824B2 (en) * 1990-05-17 1998-10-08 松下電器産業株式会社 Electronic component mounting equipment
US6171049B1 (en) * 1996-02-29 2001-01-09 Alphasem Ag Method and device for receiving, orientating and assembling of components
JP3747054B2 (en) * 2001-12-04 2006-02-22 Ｔｏｗａ株式会社 Bonding apparatus and bonding method
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12089340B2 (en) 2019-05-21 2024-09-10 Hallys Corporation Electronic component mounting device for mounting electronic components at certain intervals

Also Published As

Publication number Publication date
CN101341587B (en) 2010-10-27
JP4713596B2 (en) 2011-06-29
KR101014293B1 (en) 2011-02-16
TWI328265B (en) 2010-08-01
KR20080068876A (en) 2008-07-24
CN101341587A (en) 2009-01-07
JPWO2007072714A1 (en) 2009-05-28
WO2007072714A1 (en) 2007-06-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees