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TW200711773A - Laser beam machining method and apparatus - Google Patents

Laser beam machining method and apparatus

Info

Publication number
TW200711773A
TW200711773A TW095120968A TW95120968A TW200711773A TW 200711773 A TW200711773 A TW 200711773A TW 095120968 A TW095120968 A TW 095120968A TW 95120968 A TW95120968 A TW 95120968A TW 200711773 A TW200711773 A TW 200711773A
Authority
TW
Taiwan
Prior art keywords
irradiating
laser
laser beam
beam machining
machining method
Prior art date
Application number
TW095120968A
Other languages
Chinese (zh)
Other versions
TWI367800B (en
Inventor
Toshiaki Matsuzawa
Tatsuya Nakamura
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005178286A external-priority patent/JP4429974B2/en
Priority claimed from JP2005187829A external-priority patent/JP5036144B2/en
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200711773A publication Critical patent/TW200711773A/en
Application granted granted Critical
Publication of TWI367800B publication Critical patent/TWI367800B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/198—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors with means for adjusting the mirror relative to its support

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

Laser beam machining method according to the present invention includes: irradiating laser beams L2 and L3, which are generated by a laser oscillator, to a micromirror array in which a plurality of micromirrors are regularly arranged; modulating the laser beams into modulated beam LM which has a cross section corresponding to a machining pattern applied to a work to be machined; carrying out laser beam machining by irradiating the modulated beam to the work through an irradiating optical system; and causing an optical axis of the irradiating optical system to be substantially coincident with diffraction directions of diffraction beams generated by the micromirror array in response to the laser beams L2 and L3.
TW095120968A 2005-06-17 2006-06-13 Laser beam machining method and apparatus TWI367800B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005178286A JP4429974B2 (en) 2005-06-17 2005-06-17 Laser processing method and apparatus
JP2005187829A JP5036144B2 (en) 2005-06-28 2005-06-28 Laser processing equipment

Publications (2)

Publication Number Publication Date
TW200711773A true TW200711773A (en) 2007-04-01
TWI367800B TWI367800B (en) 2012-07-11

Family

ID=37811998

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120968A TWI367800B (en) 2005-06-17 2006-06-13 Laser beam machining method and apparatus

Country Status (3)

Country Link
KR (1) KR101287982B1 (en)
CN (1) CN101722364B (en)
TW (1) TWI367800B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405633B (en) * 2007-05-01 2013-08-21 Olympus Corp Laser processing device
TWI456255B (en) * 2012-08-16 2014-10-11 Univ Nat Central Microscopy imaging structure with phase conjugated mirror and the method thereof
TWI642970B (en) * 2016-08-30 2018-12-01 日商佳能股份有限公司 Optical apparatus, machining apparatus, and article manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100761238B1 (en) * 2007-03-13 2007-09-27 에스엔유 프리시젼 주식회사 Device for processing materials by laser beam
US7977602B2 (en) * 2007-03-21 2011-07-12 Photon Dynamics, Inc. Laser ablation using multiple wavelengths
CN103170733B (en) * 2013-04-01 2015-12-23 深圳市木森科技有限公司 A kind of coaxial laser organisation of working
KR101528346B1 (en) * 2013-11-12 2015-06-11 한국기계연구원 Substrate crystallizing appratus using laser and substrate crystallizing method using thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174242A (en) * 1994-12-22 1996-07-09 Sanyo Electric Co Ltd Method and device for laser beam machining
JPH09323184A (en) * 1996-06-03 1997-12-16 Olympus Optical Co Ltd Laser beam machine
KR20030095313A (en) * 2002-06-07 2003-12-18 후지 샤신 필름 가부시기가이샤 Laser annealer and laser thin-film forming apparatus
JP2004163652A (en) 2002-11-13 2004-06-10 Olympus Corp Light controlling device
JP2006227198A (en) 2005-02-16 2006-08-31 Olympus Corp Laser machining apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405633B (en) * 2007-05-01 2013-08-21 Olympus Corp Laser processing device
TWI456255B (en) * 2012-08-16 2014-10-11 Univ Nat Central Microscopy imaging structure with phase conjugated mirror and the method thereof
TWI642970B (en) * 2016-08-30 2018-12-01 日商佳能股份有限公司 Optical apparatus, machining apparatus, and article manufacturing method
US10845589B2 (en) 2016-08-30 2020-11-24 Canon Kabushiki Kaisha Optical apparatus, machining apparatus, and article manufacturing method

Also Published As

Publication number Publication date
CN101722364B (en) 2013-09-18
KR101287982B1 (en) 2013-07-18
CN101722364A (en) 2010-06-09
KR20060132461A (en) 2006-12-21
TWI367800B (en) 2012-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees