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TW200642552A - Method for producing substrate with copper wiring or bump - Google Patents

Method for producing substrate with copper wiring or bump

Info

Publication number
TW200642552A
TW200642552A TW095112305A TW95112305A TW200642552A TW 200642552 A TW200642552 A TW 200642552A TW 095112305 A TW095112305 A TW 095112305A TW 95112305 A TW95112305 A TW 95112305A TW 200642552 A TW200642552 A TW 200642552A
Authority
TW
Taiwan
Prior art keywords
bump
producing substrate
substrate
copper wiring
metal
Prior art date
Application number
TW095112305A
Other languages
Chinese (zh)
Other versions
TWI380750B (en
Inventor
Kenichi Takahashi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200642552A publication Critical patent/TW200642552A/en
Application granted granted Critical
Publication of TWI380750B publication Critical patent/TWI380750B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The present invention provides a method for producing substrate using the substrate of metal film made by spattering process to form fine copper and bump by semi-additive method. The said method for producing substrate is characterized in that the metal of seed layer could be etched and eliminated quickly; the decrease of the wiring width of the copper wiring could be inhibited; no inappropriateness such as broken line and short circuit etc. happen; the bump metal would not be corroded and has high reliability. The present invention utilizes an etching solution, wherein the said etching solution comprises 0.1~10 wt% of hydrogen peroxide and 0.5~50 wt% of phosphoric acid; the weight ratio of the hydrogen peroxide and phosphoric acid is 0.02~0.3.
TW095112305A 2005-04-08 2006-04-07 Method for producing substrate with copper wiring or bump TWI380750B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005112157A JP4632038B2 (en) 2005-04-08 2005-04-08 Copper wiring board manufacturing method

Publications (2)

Publication Number Publication Date
TW200642552A true TW200642552A (en) 2006-12-01
TWI380750B TWI380750B (en) 2012-12-21

Family

ID=37415058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112305A TWI380750B (en) 2005-04-08 2006-04-07 Method for producing substrate with copper wiring or bump

Country Status (3)

Country Link
JP (1) JP4632038B2 (en)
KR (1) KR20060107349A (en)
TW (1) TWI380750B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN103929890A (en) * 2013-12-31 2014-07-16 中国科学院微电子研究所 Method for manufacturing inner layer circuit of circuit board
CN112609189A (en) * 2020-12-09 2021-04-06 四川富乐德科技发展有限公司 Method for cleaning Open Mask surface magnesium-silver material of OLED Mask

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100936079B1 (en) * 2008-04-01 2010-01-12 삼성전기주식회사 Method for manufacturing PCB
JP7443926B2 (en) 2020-05-15 2024-03-06 株式会社デンソー Semiconductor device and its manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09288358A (en) * 1996-04-22 1997-11-04 Hitachi Ltd Formation of conductor circuit
JP2944518B2 (en) * 1996-07-16 1999-09-06 富山日本電気株式会社 Copper and copper alloy surface treatment agent
JPH116083A (en) * 1997-06-13 1999-01-12 Hitachi Ltd Dissolving liquid for copper or copper alloy, its production, etching, chemical polishing and forming method of copper and copper alloy, and production of printed circuit board
JP4687852B2 (en) * 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 Surface treatment agent for copper and copper alloys
JP3962239B2 (en) * 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ Etching composition and pattern forming method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN103491732B (en) * 2013-10-08 2016-08-17 华进半导体封装先导技术研发中心有限公司 A kind of manufacture method of circuit board layer reinforced structure
CN103929890A (en) * 2013-12-31 2014-07-16 中国科学院微电子研究所 Method for manufacturing inner layer circuit of circuit board
CN103929890B (en) * 2013-12-31 2017-08-29 中国科学院微电子研究所 Method for manufacturing inner layer circuit of circuit board
CN112609189A (en) * 2020-12-09 2021-04-06 四川富乐德科技发展有限公司 Method for cleaning Open Mask surface magnesium-silver material of OLED Mask

Also Published As

Publication number Publication date
TWI380750B (en) 2012-12-21
JP4632038B2 (en) 2011-02-16
KR20060107349A (en) 2006-10-13
JP2006294797A (en) 2006-10-26

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