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TW200640608A - Polishing device - Google Patents

Polishing device

Info

Publication number
TW200640608A
TW200640608A TW095105248A TW95105248A TW200640608A TW 200640608 A TW200640608 A TW 200640608A TW 095105248 A TW095105248 A TW 095105248A TW 95105248 A TW95105248 A TW 95105248A TW 200640608 A TW200640608 A TW 200640608A
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
integrating
hairlike bodies
protrusions
Prior art date
Application number
TW095105248A
Other languages
Chinese (zh)
Inventor
Takashi Ujihara
Original Assignee
Tokki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokki Kk filed Critical Tokki Kk
Publication of TW200640608A publication Critical patent/TW200640608A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A polishing apparatus exhibiting extremely excellent practicality in which good polishing can be ensured even if a pattern or a tin film composed of a soft material or a material of low hardness is formed on the surface of a substrate. The apparatus for polishing the surface of a substrate (1) comprises a polishing head (P) provided with a polishing material where a large number of flexible hairlike bodies (32) integrating abrasive grains (31) are formed on a base plane (33). The polishing apparatus is arranged to sharpen the surface of the substrate (1) with the hairlike bodies (32) integrating the abrasive grains (31) by oscillating the polishing material or the substrate (1) while touching the polishing material in the polishing head P to the surface of the substrate (1). The hairlike bodies (32) have a length and flexibility set such that the polishing material can polish not only the top face of protrusions but also the bottom face of recesses when the polishing material is touched to the surface of the substrate (1) having protrusions and recesses.
TW095105248A 2005-05-26 2006-02-16 Polishing device TW200640608A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005153923A JP2006326754A (en) 2005-05-26 2005-05-26 Polishing device

Publications (1)

Publication Number Publication Date
TW200640608A true TW200640608A (en) 2006-12-01

Family

ID=37451880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105248A TW200640608A (en) 2005-05-26 2006-02-16 Polishing device

Country Status (4)

Country Link
JP (1) JP2006326754A (en)
KR (2) KR20060122686A (en)
TW (1) TW200640608A (en)
WO (1) WO2006126455A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100780090B1 (en) * 2006-08-23 2007-11-30 서영정밀주식회사 Valve seat processing method and the jig system of solenoid valve for brake system
JP5360726B2 (en) * 2010-11-26 2013-12-04 株式会社サンシン Plate member polishing equipment
JP5758680B2 (en) * 2011-04-13 2015-08-05 株式会社ミツトヨ Deburring device
JP2013043222A (en) * 2011-08-22 2013-03-04 Disco Corp Polishing pad
JP6280673B2 (en) * 2015-07-17 2018-02-14 株式会社フジミインコーポレーテッド Polishing pad and polishing method
JP6297660B1 (en) * 2016-11-22 2018-03-20 株式会社荏原製作所 Processing apparatus, plating apparatus provided with the same, conveying apparatus, and processing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115793U (en) * 1974-07-23 1976-02-04
JP2517005Y2 (en) * 1989-07-21 1996-11-13 パイオニア株式会社 Video signal expansion circuit
DE19580280C2 (en) * 1994-02-22 2003-11-27 Nippon Micro Coating Kk Abrasive material sheet and method of making the same
JP3367082B2 (en) * 1994-04-11 2003-01-14 日本ミクロコーティング株式会社 Polishing member and method of manufacturing the same
JPH1158205A (en) * 1997-08-25 1999-03-02 Unique Technol Internatl Pte Ltd Electrolytic polishing as well as polishing texture processing device and manufacture thereof and electrolytic polishing as well as polishing texture tapeused thereto
JP2001062696A (en) * 1999-08-24 2001-03-13 Nihon Micro Coating Co Ltd Grinding/polishing/cleaning method and device
JP2001341058A (en) * 2000-03-29 2001-12-11 Nihon Micro Coating Co Ltd Method of machining surface of glass substrate for magnetic disk and abrasive grain suspension for machining
JP2003165045A (en) * 2001-11-29 2003-06-10 Seiko Epson Corp Grinding member, method for manufacturing the same, and grinding method
JP2003273046A (en) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd Polishing device, polishing tape and polishing method
JP2003275951A (en) * 2002-03-20 2003-09-30 Sony Corp Polishing method and polishing device
JP2004322305A (en) * 2003-04-11 2004-11-18 Tokki Corp Substrate surface flattening/cleaning device

Also Published As

Publication number Publication date
KR20060122686A (en) 2006-11-30
JP2006326754A (en) 2006-12-07
KR20080016680A (en) 2008-02-21
WO2006126455A1 (en) 2006-11-30

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