Nothing Special   »   [go: up one dir, main page]

TW200644004A - Multilayer ceramic electronic device and method of production of the same - Google Patents

Multilayer ceramic electronic device and method of production of the same

Info

Publication number
TW200644004A
TW200644004A TW095110546A TW95110546A TW200644004A TW 200644004 A TW200644004 A TW 200644004A TW 095110546 A TW095110546 A TW 095110546A TW 95110546 A TW95110546 A TW 95110546A TW 200644004 A TW200644004 A TW 200644004A
Authority
TW
Taiwan
Prior art keywords
ingredient
multilayer ceramic
production
electronic device
same
Prior art date
Application number
TW095110546A
Other languages
English (en)
Inventor
Shuichi Miura
Kazuhiko Oda
Tetsuji Maruno
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200644004A publication Critical patent/TW200644004A/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
    • A47G25/12—Cane or umbrella stands or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
    • A45B25/00—Details of umbrellas
    • A45B25/28—Drip receptacles for umbrellas; Attaching devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B67/00—Apparatus or devices facilitating manual packaging operations; Sack holders
    • B65B67/02—Packaging of articles or materials in containers
    • B65B67/04—Devices facilitating the insertion of articles or materials into bags, e.g. guides or chutes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
TW095110546A 2005-03-31 2006-03-27 Multilayer ceramic electronic device and method of production of the same TW200644004A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005103509 2005-03-31
JP2006010339A JP4513981B2 (ja) 2005-03-31 2006-01-18 積層セラミック電子部品及びその製造方法

Publications (1)

Publication Number Publication Date
TW200644004A true TW200644004A (en) 2006-12-16

Family

ID=37070116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110546A TW200644004A (en) 2005-03-31 2006-03-27 Multilayer ceramic electronic device and method of production of the same

Country Status (5)

Country Link
US (1) US7817402B2 (zh)
JP (1) JP4513981B2 (zh)
KR (1) KR20060105585A (zh)
CN (1) CN1841598B (zh)
TW (1) TW200644004A (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201002038D0 (en) * 2010-02-09 2010-03-24 Bae Systems Plc Electrostatic capacitors
TW201135766A (en) * 2010-04-01 2011-10-16 Chien-Chiang Chan Energy storage device
KR20130007301A (ko) * 2011-06-30 2013-01-18 삼성전기주식회사 적층 세라믹 전자부품 및 그의 제조방법
KR101862396B1 (ko) * 2011-09-08 2018-05-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR101823160B1 (ko) * 2012-04-26 2018-01-29 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR20140024584A (ko) * 2012-08-20 2014-03-03 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR102057911B1 (ko) * 2013-06-19 2019-12-20 삼성전기주식회사 적층 세라믹 전자부품
DE102013017350B4 (de) * 2013-10-17 2020-07-09 Tdk Electronics Ag Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements
JP2014239204A (ja) * 2014-01-31 2014-12-18 株式会社村田製作所 電子部品及び電子部品の実装構造体
KR102217288B1 (ko) * 2018-08-16 2021-02-19 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102147408B1 (ko) * 2018-08-23 2020-08-24 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102351181B1 (ko) * 2018-08-23 2022-01-14 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR102140622B1 (ko) * 2018-08-23 2020-08-03 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
JP7493322B2 (ja) * 2019-11-13 2024-05-31 株式会社村田製作所 積層セラミックコンデンサ
KR20230062024A (ko) * 2021-10-29 2023-05-09 삼성전기주식회사 커패시터 부품

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU870383A1 (ru) * 1979-03-12 1981-10-07 Предприятие П/Я Х-5425 Паста дл металлизации керамики
JPS59114703A (ja) * 1982-12-21 1984-07-02 太陽誘電株式会社 焼付型導電性ペ−スト
JPS63201079A (ja) * 1986-10-02 1988-08-19 日本タングステン株式会社 セラミツク焼結体用メタライズペ−スト及びそのメタライズ法
JPS6481106A (en) * 1987-09-22 1989-03-27 Sumitomo Metal Mining Co Composition for forming conductive film
JPH02106808A (ja) * 1988-10-17 1990-04-18 Hitachi Ltd 導電ペーストおよびそれを用いた電子回路部品並びにその製法
JPH0374819A (ja) * 1989-08-16 1991-03-29 Matsushita Electric Ind Co Ltd 積層セラミック部品の製造方法
JP2991527B2 (ja) * 1991-05-22 1999-12-20 第一工業製薬株式会社 セラミックコンデンサー電極用導体ペースト
JPH05205969A (ja) * 1992-01-29 1993-08-13 Sumitomo Metal Mining Co Ltd 積層コンデンサ内部電極用ペースト
JPH05226179A (ja) * 1992-02-10 1993-09-03 Daido Steel Co Ltd 導電ペースト用粉末
JPH06236707A (ja) * 1993-02-09 1994-08-23 Murata Mfg Co Ltd 導電ペースト
JPH06290985A (ja) * 1993-03-30 1994-10-18 Taiyo Yuden Co Ltd 内部電極ペースト
JPH07211132A (ja) * 1994-01-10 1995-08-11 Murata Mfg Co Ltd 導電性ペーストおよびこれを用いた積層セラミックコンデンサの製造方法
JPH07197103A (ja) * 1994-01-10 1995-08-01 Murata Mfg Co Ltd 金属粉末表面への金属化合物被覆方法
JPH08255509A (ja) * 1995-03-16 1996-10-01 Toshiba Corp 導電ペースト及び積層セラミック電子部品
JP3039403B2 (ja) * 1996-12-06 2000-05-08 株式会社村田製作所 積層セラミックコンデンサ
JP3527822B2 (ja) * 1997-01-31 2004-05-17 京セラ株式会社 導電性ペースト
JP3874041B2 (ja) * 1997-08-18 2007-01-31 Ｔｄｋ株式会社 Ｃｒ複合電子部品とその製造方法
JP3534999B2 (ja) * 1997-12-19 2004-06-07 京セラ株式会社 導電性ペースト
JP2000269073A (ja) * 1999-03-19 2000-09-29 Taiyo Yuden Co Ltd 積層セラミックコンデンサとその製造方法
JP4548897B2 (ja) * 2000-03-31 2010-09-22 京セラ株式会社 導電性ペーストおよび積層型電子部品並びにその製法
JP2001307941A (ja) * 2000-04-21 2001-11-02 Shoei Chem Ind Co 端子電極ペーストおよび積層セラミックコンデンサの製造方法
TW504719B (en) * 2000-05-30 2002-10-01 Tdk Corp Multilayer ceramic capacitor and production method thereof
JP2002060877A (ja) * 2000-08-16 2002-02-28 Kawatetsu Mining Co Ltd 導電ペースト用Ｎｉ合金粉
US20020139457A1 (en) * 2001-04-02 2002-10-03 Coppola Vito A. Method of suppressing the oxidation characteristics of nickel
JP3900248B2 (ja) * 2001-03-30 2007-04-04 ハリマ化成株式会社 多層配線板およびその形成方法
JP3736802B2 (ja) * 2002-11-25 2006-01-18 Ｔｄｋ株式会社 導電性組成物とセラミック電子部品
JP4403705B2 (ja) * 2003-02-17 2010-01-27 Ｔｄｋ株式会社 誘電体磁器組成物および電子部品
JP3947118B2 (ja) * 2003-03-03 2007-07-18 Ｊｆｅミネラル株式会社 表面処理金属超微粉、その製造方法、導電性金属ペースト及び積層セラミックコンデンサ
JP4337501B2 (ja) * 2003-10-27 2009-09-30 株式会社村田製作所 導電性ペーストおよび積層セラミック電子部品
US20060169389A1 (en) * 2005-01-31 2006-08-03 Barber Daniel E Electrode paste for thin nickel electrodes in multilayer ceramic capacitors and finished capacitor containing same

Also Published As

Publication number Publication date
CN1841598A (zh) 2006-10-04
KR20060105585A (ko) 2006-10-11
JP4513981B2 (ja) 2010-07-28
CN1841598B (zh) 2011-06-15
US7817402B2 (en) 2010-10-19
US20060221547A1 (en) 2006-10-05
JP2006310760A (ja) 2006-11-09

Similar Documents

Publication Publication Date Title
TW200644004A (en) Multilayer ceramic electronic device and method of production of the same
TW200705481A (en) Method of production of multilayer ceramic electronic device
TW200802441A (en) Ceramic capacitor mounting structure and ceramic capacitor
EP1156498A3 (en) Multi-layer ceramic electronic device and method for producing same
EP1353343A3 (en) Electronic device with external terminals and method of production of the same
TW200644007A (en) Electronic component and electronic apparatus
TWI268524B (en) Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure
EP1965397A4 (en) THERMALLY HARDENING CONDUCTIVE PASTE AND MULTILAYER CERAMIC COMPONENT WITH EXTERNAL ELECTRODE THAT IS MADE BY USING SUCH A THERMAL CURING CONDUCTIVE PASTE
TW201129995A (en) Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof
TW200612447A (en) Electronic device and the production method
WO2008129704A1 (ja) 多層プリント配線板及びその製造方法
WO2006094280A3 (en) Metal-insulator-metal capacitor manufactured using etchback
EP1696698A3 (en) Condenser microphone and method for manufacturing the same
WO2006099538A3 (en) Devices with ultrathin structures and method of making same
EP1879202A3 (en) Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof
WO2006009463A8 (en) Electrical via connection and associated contact means as well as a method for their manufacture
ATE434823T1 (de) Elektrisches bauelement, verfahren zu dessen herstellung und dessen verwendung
EP1839336A4 (en) ELECTRONIC EQUIPMENT WITH CONDUCTIVE LINES CONNECTING ELECTRODES TO OTHER CONDUCTIVE LINES IN A SUBSTRATE AND PROCESSES FOR PRODUCING THE ELECTRONIC EQUIPMENT
TW200701309A (en) Structure of substrate integrated embedded passive component and method of forming the same
TW200636769A (en) Laminated ceramic electronic component and method for manufacturing same
US9653213B2 (en) Multilayer ceramic capacitor and board having the same
WO2009018586A3 (en) Electronic assemblies without solder and methods for their manufacture
TW200738905A (en) Metal material for electrical/electronic component, manufacturing method therefor, and the electrical/electronic component using the metal material
TW200746382A (en) Integrated circuit devices including metal-insulator-metal capacitors and methods of fabricating the same
TW200725698A (en) MIM capacitor structure and method of manufacturing the same