TW200626038A - Multilayer PCB - Google Patents
Multilayer PCBInfo
- Publication number
- TW200626038A TW200626038A TW094100613A TW94100613A TW200626038A TW 200626038 A TW200626038 A TW 200626038A TW 094100613 A TW094100613 A TW 094100613A TW 94100613 A TW94100613 A TW 94100613A TW 200626038 A TW200626038 A TW 200626038A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- high dielectric
- connects
- multilayer pcb
- layered
- Prior art date
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
This invention relates to a multilayer PCB. The multilayer PCB 10 comprises a mounting portion, a high dielectric constant layer, a first layered electrode, a second layered electrode, a power supply line, and a layered capacitor. The semiconductor device is mounted upon the top surface of the mounting portion 60. It electrically connects with a wiring pattern 32, etc. The layered capacitor portion 40 possesses a high dielectric constant layer 43. It forms ceramic and first and second layer electrodes 41 and 42 that sandwich the high dielectric constant layer 43. One of the first and second layer electrodes 41 and 42 connects with a power supply line of the semiconductor device and the other of the first and second layer electrodes 41 and 42 connects with a ground line. In this multilayer PCB 10, the layered capacitor portion 40 includes high dielectric layer 43 formed of ceramic. It connects with the power supply line and the ground line. The static capacitance of the layered capacitor portion 40 is high. Even though under easily occurring of voltage drops instantaneously, it achieves the adequate decoupling effect.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003407501 | 2003-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200626038A true TW200626038A (en) | 2006-07-16 |
Family
ID=57808749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094100613A TW200626038A (en) | 2003-12-05 | 2005-01-07 | Multilayer PCB |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200626038A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI501715B (en) * | 2012-12-11 | 2015-09-21 | Mitsui Mining & Smelting Co | Multilayer printed circuit board and manufacturing method thereof |
-
2005
- 2005-01-07 TW TW094100613A patent/TW200626038A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI501715B (en) * | 2012-12-11 | 2015-09-21 | Mitsui Mining & Smelting Co | Multilayer printed circuit board and manufacturing method thereof |
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