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TW200303895A - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

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Publication number
TW200303895A
TW200303895A TW92104626A TW92104626A TW200303895A TW 200303895 A TW200303895 A TW 200303895A TW 92104626 A TW92104626 A TW 92104626A TW 92104626 A TW92104626 A TW 92104626A TW 200303895 A TW200303895 A TW 200303895A
Authority
TW
Taiwan
Prior art keywords
acid
photosensitive resin
resin composition
polyester
fluorenyl
Prior art date
Application number
TW92104626A
Other languages
English (en)
Chinese (zh)
Inventor
Hideyuki Katagi
Toshizumi Yoshino
Yasuyuki Kurisaki
Hidekazu Kondou
Masayoshi Joumen
Satou Kuniaki
Hirayama Takao
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200303895A publication Critical patent/TW200303895A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
TW92104626A 2002-03-06 2003-03-05 Photosensitive resin composition TW200303895A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002060361 2002-03-06
JP2002116542 2002-04-18

Publications (1)

Publication Number Publication Date
TW200303895A true TW200303895A (en) 2003-09-16

Family

ID=27790984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92104626A TW200303895A (en) 2002-03-06 2003-03-05 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP3928620B2 (ja)
AU (1) AU2003211755A1 (ja)
TW (1) TW200303895A (ja)
WO (1) WO2003075095A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424266B (zh) * 2007-12-18 2014-01-21 Asahi Kasei Emd Corp A method for producing a resist hardener using a negative photosensitive resin laminate, a method for using a negative photosensitive resin laminate, and a negative photosensitive resin laminate
CN104428322A (zh) * 2013-06-28 2015-03-18 太阳油墨制造株式会社 光固化性组合物以及其固化物

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006267441A (ja) * 2005-03-23 2006-10-05 Kyocera Chemical Corp 感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板
JP2007248846A (ja) * 2006-03-16 2007-09-27 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、永久パターン、及びプリント基板
JP2010113241A (ja) 2008-11-07 2010-05-20 Taiyo Ink Mfg Ltd 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5620656B2 (ja) * 2009-08-19 2014-11-05 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5495297B2 (ja) * 2009-09-01 2014-05-21 太陽ホールディングス株式会社 アルカリ現像性の光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5982798B2 (ja) * 2011-12-01 2016-08-31 三菱レイヨン株式会社 ポリエステル（メタ）アクリレートの製造方法
JP5540165B1 (ja) * 2013-06-28 2014-07-02 太陽インキ製造株式会社 光硬化性樹脂組成物、その硬化物およびプリント配線板
JP2013225151A (ja) * 2013-07-09 2013-10-31 Taiyo Holdings Co Ltd 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP7363036B2 (ja) * 2019-01-25 2023-10-18 東亞合成株式会社 （メタ）アクリレートの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912654A (ja) * 1995-06-26 1997-01-14 Nippon Kayaku Co Ltd エネルギー線硬化性樹脂組成物及びその硬化物
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JPH11288087A (ja) * 1998-04-03 1999-10-19 Hitachi Chem Co Ltd 感光性樹脂組成物
JP2002023363A (ja) * 2000-07-13 2002-01-23 Dainippon Ink & Chem Inc フォトリソグラフィー用樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424266B (zh) * 2007-12-18 2014-01-21 Asahi Kasei Emd Corp A method for producing a resist hardener using a negative photosensitive resin laminate, a method for using a negative photosensitive resin laminate, and a negative photosensitive resin laminate
CN104428322A (zh) * 2013-06-28 2015-03-18 太阳油墨制造株式会社 光固化性组合物以及其固化物
CN104428322B (zh) * 2013-06-28 2016-04-06 太阳油墨制造株式会社 光固化性组合物以及其固化物

Also Published As

Publication number Publication date
WO2003075095A1 (fr) 2003-09-12
AU2003211755A1 (en) 2003-09-16
JPWO2003075095A1 (ja) 2005-06-30
JP3928620B2 (ja) 2007-06-13

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