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SG41939A1 - Epoxy resin composition for semiconductor encapsulation - Google Patents

Epoxy resin composition for semiconductor encapsulation

Info

Publication number
SG41939A1
SG41939A1 SG1995001492A SG1995001492A SG41939A1 SG 41939 A1 SG41939 A1 SG 41939A1 SG 1995001492 A SG1995001492 A SG 1995001492A SG 1995001492 A SG1995001492 A SG 1995001492A SG 41939 A1 SG41939 A1 SG 41939A1
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
semiconductor encapsulation
encapsulation
semiconductor
Prior art date
Application number
SG1995001492A
Other languages
English (en)
Inventor
Atsuhito Hayakawa
Yasuyuki Murata
Yoshinori Nakanishi
Norio Tohriiwa
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26814094A external-priority patent/JP3415292B2/ja
Priority claimed from JP26814194A external-priority patent/JP3415293B2/ja
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of SG41939A1 publication Critical patent/SG41939A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG1995001492A 1994-10-07 1995-10-05 Epoxy resin composition for semiconductor encapsulation SG41939A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP26814094A JP3415292B2 (ja) 1994-10-07 1994-10-07 半導体封止用エポキシ樹脂組成物
JP26814194A JP3415293B2 (ja) 1994-10-07 1994-10-07 半導体封止用エポキシ樹脂組成物
US08/566,574 US5739186A (en) 1994-10-07 1995-11-28 Epoxy resin composition for semiconductor encapsulation

Publications (1)

Publication Number Publication Date
SG41939A1 true SG41939A1 (en) 1997-08-15

Family

ID=27335611

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995001492A SG41939A1 (en) 1994-10-07 1995-10-05 Epoxy resin composition for semiconductor encapsulation

Country Status (3)

Country Link
US (1) US5739186A (fr)
EP (1) EP0705856A2 (fr)
SG (1) SG41939A1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3734602B2 (ja) * 1997-05-29 2006-01-11 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂組成物
JP3479827B2 (ja) * 1998-04-27 2003-12-15 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6297306B1 (en) 1998-05-15 2001-10-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
JP3388537B2 (ja) * 1998-05-15 2003-03-24 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6291556B1 (en) 1999-03-26 2001-09-18 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin composition and semiconductor device
TW538482B (en) 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
US7319131B2 (en) 2003-03-07 2008-01-15 Angus Chemical Company Phenolic resins
US7317063B2 (en) * 2003-03-07 2008-01-08 Angus Chemical Company Phenolic resins
US20040116647A1 (en) 2002-12-04 2004-06-17 Swedo Raymond J. Novel phenolic resins
US7317064B2 (en) 2003-03-07 2008-01-08 Angus Chemical Company Phenolic resin systems for fiber reinforced composite manufacture
JP4433368B2 (ja) * 2003-04-08 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂粒状化物及びその製造方法
KR101148332B1 (ko) * 2003-04-30 2012-05-25 크리, 인코포레이티드 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지
KR101312419B1 (ko) * 2005-01-06 2013-09-27 니폰 가야꾸 가부시끼가이샤 액정 실링제 및 이것을 사용한 액정표시 셀
US8089062B2 (en) * 2005-03-23 2012-01-03 Xerox Corporation Wax encapsulated electronic devices
CN101198632B (zh) * 2005-05-10 2010-06-09 新日铁化学株式会社 环氧树脂组合物以及固化物
WO2007144408A1 (fr) * 2006-06-16 2007-12-21 Huntsman Advanced Materials (Switzerland) Gmbh Système de revêtement
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
US20080205023A1 (en) * 2007-02-27 2008-08-28 International Business Machines Corporation Electronic components on trenched substrates and method of forming same
EP2220156A4 (fr) * 2007-11-09 2013-01-23 Pacific Polymers Pty Ltd Modification hydrophobe de matières de charge minérales et systèmes polymères mixtes
EP3375811A1 (fr) 2017-03-17 2018-09-19 Airbus Operations S.L. Barrière de diffusion multifonctionnelle

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137275A (en) * 1976-04-27 1979-01-30 Westinghouse Electric Corp. Latent accelerators for curing epoxy resins
US4113791A (en) * 1977-03-03 1978-09-12 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators
JPS55124730A (en) * 1979-03-22 1980-09-26 Ube Ind Ltd Preparation of dihydroxydiphenylmethane
US4360649A (en) * 1980-04-30 1982-11-23 Sumitomo Chemical Company, Limited Curable composition
JPS60112813A (ja) 1983-11-24 1985-06-19 Dainippon Ink & Chem Inc 成形材料用エポキシ樹脂組成物
JPS60248725A (ja) * 1984-05-24 1985-12-09 Nitto Electric Ind Co Ltd エポキシ樹脂粉体組成物
JPS6147725A (ja) 1984-08-16 1986-03-08 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
US4710429A (en) * 1985-04-15 1987-12-01 The Dow Chemical Company Laminates from epoxidized phenol-hydrocarbon adducts
US4701481A (en) * 1985-08-26 1987-10-20 The Dow Chemical Company Durable epoxy resin
JPS62201923A (ja) 1985-10-31 1987-09-05 Sanyo Kokusaku Pulp Co Ltd エポキシ樹脂組成物
US4798761A (en) * 1987-11-03 1989-01-17 The Dow Chemical Company Epoxy resin compositions for use in low temperature curing applications
EP0397860B1 (fr) * 1988-11-30 1999-03-03 Mitsubishi Rayon Co., Ltd. Resine epoxyde
US5006611A (en) * 1989-01-20 1991-04-09 Ciba-Geigy Corporation Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups
US5162437A (en) * 1989-03-15 1992-11-10 Sanyo Chemical Industries, Ltd. Epoxy resin composition with hydrogenated diene glycidyl ether
US5213846A (en) * 1989-09-27 1993-05-25 Dai Nippon Toryo Co., Ltd. Corrison resistant coating composition
JPH04103616A (ja) * 1990-08-24 1992-04-06 Dow Chem Nippon Kk エポキシ樹脂組成物
DE4039715A1 (de) * 1990-12-13 1992-06-17 Basf Ag Epoxidharzmischungen fuer faserverbundwerkstoffe
JPH05287219A (ja) * 1992-04-03 1993-11-02 Nippon Kayaku Co Ltd エポキシ樹脂系粉体塗料
JPH06135872A (ja) * 1992-10-27 1994-05-17 Asahi Organic Chem Ind Co Ltd ビスフェノールの製造方法

Also Published As

Publication number Publication date
EP0705856A3 (fr) 1996-05-01
EP0705856A2 (fr) 1996-04-10
US5739186A (en) 1998-04-14

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