SG189919A1 - Method of producing solder balls - Google Patents

Method of producing solder balls Download PDF

Info

Publication number: SG189919A1
Authority: SG; Singapore
Prior art keywords: adhesive layer; layer; substrate; solder; solder balls
Prior art date: 2010-10-27

Application number

SG2013029020A

Other languages

English (en)

Inventor

Takashi Shoji

Takekazu Sakai

Original Assignee

Showa Denko Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-10-27

Filing date

2011-10-20

Publication date

2013-06-28

2011-10-20 Application filed by Showa Denko Kk filed Critical Showa Denko Kk

2013-06-28 Publication of SG189919A1 publication Critical patent/SG189919A1/en

Links

229910000679 solder Inorganic materials 0.000 title claims abstract description 368
238000000034 method Methods 0.000 title claims abstract description 177
239000012790 adhesive layer Substances 0.000 claims abstract description 231
239000011162 core material Substances 0.000 claims abstract description 225
239000000758 substrate Substances 0.000 claims abstract description 163
239000010410 layer Substances 0.000 claims abstract description 141
239000002245 particle Substances 0.000 claims abstract description 136
229910052751 metal Inorganic materials 0.000 claims description 89
239000002184 metal Substances 0.000 claims description 89
239000000463 material Substances 0.000 claims description 62
150000001875 compounds Chemical class 0.000 claims description 60
239000000853 adhesive Substances 0.000 claims description 41
230000001070 adhesive effect Effects 0.000 claims description 40
238000012546 transfer Methods 0.000 claims description 16
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
229910052721 tungsten Inorganic materials 0.000 claims description 7
239000010937 tungsten Substances 0.000 claims description 7
230000008569 process Effects 0.000 description 37
239000000243 solution Substances 0.000 description 29
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 27
239000010949 copper Substances 0.000 description 22
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 21
230000008018 melting Effects 0.000 description 18
238000002844 melting Methods 0.000 description 18
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
229910052802 copper Inorganic materials 0.000 description 17
TZYWCYJVHRLUCT-VABKMULXSA-N N-benzyloxycarbonyl-L-leucyl-L-leucyl-L-leucinal Chemical compound CC(C)C[C@@H](C=O)NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CC(C)C)NC(=O)OCC1=CC=CC=C1 TZYWCYJVHRLUCT-VABKMULXSA-N 0.000 description 15
238000000576 coating method Methods 0.000 description 15
239000011248 coating agent Substances 0.000 description 14
239000000203 mixture Substances 0.000 description 14
125000000217 alkyl group Chemical group 0.000 description 12
125000004435 hydrogen atom Chemical group [H]* 0.000 description 12
230000004907 flux Effects 0.000 description 11
239000012298 atmosphere Substances 0.000 description 10
239000007788 liquid Substances 0.000 description 10
238000004519 manufacturing process Methods 0.000 description 8
235000011054 acetic acid Nutrition 0.000 description 7
230000000694 effects Effects 0.000 description 7
238000010438 heat treatment Methods 0.000 description 7
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
125000003545 alkoxy group Chemical group 0.000 description 6
125000003277 amino group Chemical group 0.000 description 6
239000007864 aqueous solution Substances 0.000 description 6
125000004432 carbon atom Chemical group C* 0.000 description 6
125000004093 cyano group Chemical group *C#N 0.000 description 6
239000011521 glass Substances 0.000 description 6
125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
239000012299 nitrogen atmosphere Substances 0.000 description 6
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
238000007796 conventional method Methods 0.000 description 5
-1 for example Substances 0.000 description 5
239000004065 semiconductor Substances 0.000 description 5
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 4
239000004642 Polyimide Substances 0.000 description 4
239000000919 ceramic Substances 0.000 description 4
229910052759 nickel Inorganic materials 0.000 description 4
229920001721 polyimide Polymers 0.000 description 4
239000002002 slurry Substances 0.000 description 4
125000006850 spacer group Chemical group 0.000 description 4
229910052718 tin Inorganic materials 0.000 description 4
HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 3
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
239000000956 alloy Substances 0.000 description 3
229910045601 alloy Inorganic materials 0.000 description 3
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
239000012964 benzotriazole Substances 0.000 description 3
229910052799 carbon Inorganic materials 0.000 description 3
239000004020 conductor Substances 0.000 description 3
IOJUPLGTWVMSFF-UHFFFAOYSA-N cyclobenzothiazole Natural products C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 3
235000014113 dietary fatty acids Nutrition 0.000 description 3
229930195729 fatty acid Natural products 0.000 description 3
239000000194 fatty acid Substances 0.000 description 3
230000007257 malfunction Effects 0.000 description 3
238000007747 plating Methods 0.000 description 3
238000007650 screen-printing Methods 0.000 description 3
229910052710 silicon Inorganic materials 0.000 description 3
239000010703 silicon Substances 0.000 description 3
229910017518 Cu Zn Inorganic materials 0.000 description 2
229910017752 Cu-Zn Inorganic materials 0.000 description 2
229910017943 Cu—Zn Inorganic materials 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
229910017910 Sb—Zn Inorganic materials 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
230000002378 acidificating effect Effects 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
239000006185 dispersion Substances 0.000 description 2
230000005611 electricity Effects 0.000 description 2
238000007772 electroless plating Methods 0.000 description 2
238000009713 electroplating Methods 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
229910052739 hydrogen Inorganic materials 0.000 description 2
230000010354 integration Effects 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
150000007524 organic acids Chemical class 0.000 description 2
239000004033 plastic Substances 0.000 description 2
229920000642 polymer Polymers 0.000 description 2
238000007639 printing Methods 0.000 description 2
238000012545 processing Methods 0.000 description 2
230000003068 static effect Effects 0.000 description 2
NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical group CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 1
BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
229910017944 Ag—Cu Inorganic materials 0.000 description 1
229910015363 Au—Sn Inorganic materials 0.000 description 1
229910016331 Bi—Ag Inorganic materials 0.000 description 1
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
229910017770 Cu—Ag Inorganic materials 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
229910020159 Pb—Cd Inorganic materials 0.000 description 1
229910017802 Sb—Ag Inorganic materials 0.000 description 1
229910020816 Sn Pb Inorganic materials 0.000 description 1
229910020836 Sn-Ag Inorganic materials 0.000 description 1
229910020830 Sn-Bi Inorganic materials 0.000 description 1
229910020922 Sn-Pb Inorganic materials 0.000 description 1
229910020935 Sn-Sb Inorganic materials 0.000 description 1
229910020994 Sn-Zn Inorganic materials 0.000 description 1
229910020988 Sn—Ag Inorganic materials 0.000 description 1
229910018726 Sn—Ag—Sb Inorganic materials 0.000 description 1
229910018731 Sn—Au Inorganic materials 0.000 description 1
229910018728 Sn—Bi Inorganic materials 0.000 description 1
229910018956 Sn—In Inorganic materials 0.000 description 1
229910008783 Sn—Pb Inorganic materials 0.000 description 1
229910008757 Sn—Sb Inorganic materials 0.000 description 1
229910009069 Sn—Zn Inorganic materials 0.000 description 1
229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
238000007792 addition Methods 0.000 description 1
230000002776 aggregation Effects 0.000 description 1
238000004220 aggregation Methods 0.000 description 1
BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
229910000147 aluminium phosphate Inorganic materials 0.000 description 1
238000005452 bending Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
230000005496 eutectics Effects 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000012530 fluid Substances 0.000 description 1
235000019253 formic acid Nutrition 0.000 description 1
239000008187 granular material Substances 0.000 description 1
239000002440 industrial waste Substances 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
239000004310 lactic acid Substances 0.000 description 1
235000014655 lactic acid Nutrition 0.000 description 1
239000001630 malic acid Substances 0.000 description 1
235000011090 malic acid Nutrition 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
125000000896 monocarboxylic acid group Chemical group 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
235000006408 oxalic acid Nutrition 0.000 description 1
239000000843 powder Substances 0.000 description 1
235000019260 propionic acid Nutrition 0.000 description 1
IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
230000009467 reduction Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000002904 solvent Substances 0.000 description 1
235000002906 tartaric acid Nutrition 0.000 description 1
239000011975 tartaric acid Substances 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

SG2013029020A 2010-10-27 2011-10-20 Method of producing solder balls SG189919A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2010241029A JP5690554B2 (ja)	2010-10-27	2010-10-27	はんだボールの製造方法
PCT/JP2011/074099 WO2012056977A1 (ja)	2010-10-27	2011-10-20	はんだボールの製造方法

Publications (1)

Publication Number	Publication Date
SG189919A1 true SG189919A1 (en)	2013-06-28

Family

ID=45993690

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG2013029020A SG189919A1 (en)	2010-10-27	2011-10-20	Method of producing solder balls

Country Status (6)

Country	Link
JP (1)	JP5690554B2 (ja)
KR (1)	KR101422425B1 (ja)
CN (1)	CN103189159B (ja)
SG (1)	SG189919A1 (ja)
TW (1)	TWI505382B (ja)
WO (1)	WO2012056977A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US10588214B2 (en)	2017-05-09	2020-03-10	Unimicron Technology Corp.	Stacked structure and method for manufacturing the same
CN112313031A (zh) *	2018-06-26	2021-02-02	昭和电工材料株式会社	焊料粒子及焊料粒子的制造方法
JP7400465B2 (ja) *	2019-12-27	2023-12-19	株式会社レゾナック	コアシェル型はんだ粒子、コアシェル型はんだ粒子の製造方法、異方性導電フィルム、及び異方性導電フィルムの製造方法
JP6767665B1 (ja) *	2020-06-10	2020-10-14	千住金属工業株式会社	バンプ電極基板の形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63212094A (ja) *	1987-02-26	1988-09-05	Tanaka Kikinzoku Kogyo Kk	金属球を核とした微小はんだ球の製造方法
JPH08141785A (ja) *	1994-11-24	1996-06-04	Matsushita Electric Works Ltd	Ｃｕコア半田ボールの製造方法
JPH10277774A (ja) *	1997-04-03	1998-10-20	Fujitsu Ten Ltd	ハンダ粒子、ハンダペースト、ハンダ粒子の作製方法、及び回路基板へのデバイスの実装方法
JP3314269B2 (ja) *	1998-12-28	2002-08-12	株式会社アライドマテリアル	複合マイクロボールとその製造方法
DE60325620D1 (de) *	2002-09-27	2009-02-12	Neomax Materials Co Ltd	Lotbeschichtete kugel und verfahren zu ihrer herstellung und verfahren zur bildung einer halbleiterverbindungsstruktur
JP4175858B2 (ja) *	2002-10-03	2008-11-05	株式会社Ｎｅｏｍａｘマテリアル	はんだ被覆ボールの製造方法
CN100483699C (zh) *	2003-10-24	2009-04-29	国际整流器公司	使用自傲互连材料的半导体器件封装
US7504331B2 (en) *	2005-07-27	2009-03-17	Palo Alto Research Center Incorporated	Method of fabricating self-assembled electrical interconnections
JP4749791B2 (ja) *	2005-07-29	2011-08-17	新日鉄マテリアルズ株式会社	はんだボールの製造方法
KR100863772B1 (ko)	2007-09-14	2008-10-15	한국과학기술원	솔더볼 및 공동이 형성된 몰드를 이용한 솔더볼의 제조방법
CN101246828B (zh) *	2008-03-14	2010-06-02	中国科学院上海微系统与信息技术研究所	一种基板可重复使用的制备微小焊球的方法
CN101745763B (zh) *	2009-12-22	2012-04-25	北京有色金属研究总院	一种精密焊球的高效制备方法

2010
- 2010-10-27 JP JP2010241029A patent/JP5690554B2/ja not_active Expired - Fee Related
2011
- 2011-10-20 WO PCT/JP2011/074099 patent/WO2012056977A1/ja active Application Filing
- 2011-10-20 CN CN201180051311.5A patent/CN103189159B/zh not_active Expired - Fee Related
- 2011-10-20 KR KR1020137009198A patent/KR101422425B1/ko not_active IP Right Cessation
- 2011-10-20 SG SG2013029020A patent/SG189919A1/en unknown
- 2011-10-25 TW TW100138653A patent/TWI505382B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
JP5690554B2 (ja)	2015-03-25
KR101422425B1 (ko)	2014-07-22
TWI505382B (zh)	2015-10-21
TW201227852A (en)	2012-07-01
CN103189159A (zh)	2013-07-03
KR20130052026A (ko)	2013-05-21
CN103189159B (zh)	2015-07-08
WO2012056977A1 (ja)	2012-05-03
JP2012091208A (ja)	2012-05-17

Publication	Publication Date	Title
TWI418277B (zh)	2013-12-01	電路基板之製造方法
US8123111B2 (en)	2012-02-28	Production method of solder circuit board
US20100038411A1 (en)	2010-02-18	Method of producing conductive circuit board
EP2082630B1 (en)	2012-01-25	Slurry discharge device
CN105122957B (zh)	2018-03-16	焊料电路基板的制造方法、焊料电路基板和电子部件的安装方法
KR101193264B1 (ko)	2012-10-19	회로 기판의 제조 방법
SG189919A1 (en)	2013-06-28	Method of producing solder balls
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