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SG150377A1 - Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor - Google Patents

Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor

Info

Publication number
SG150377A1
SG150377A1 SG200406394-7A SG2004063947A SG150377A1 SG 150377 A1 SG150377 A1 SG 150377A1 SG 2004063947 A SG2004063947 A SG 2004063947A SG 150377 A1 SG150377 A1 SG 150377A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
manufacturing
adhesive sheet
method therefor
therewith
Prior art date
Application number
SG200406394-7A
Inventor
Takeshi Satou
Akinori Sei
Nobuhiro Hashimoto
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of SG150377A1 publication Critical patent/SG150377A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE THEREWITH, AND MANUFACTURING METHOD THEREFOR An adhesive sheet (10) being strippably adhered to the lead frame or the wiring board, for manufacturing a semiconductor device of the present invention, which includes the heat-resistant base material and the adhesive layer (12) on one surface of the heat-resistant base material, wherein the adhesive layer (12) contains the thermosetting resin (a) and the strippability imparting component (b).
SG200406394-7A 2003-11-07 2004-11-03 Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor SG150377A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003378118A JP4319892B2 (en) 2003-11-07 2003-11-07 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
SG150377A1 true SG150377A1 (en) 2009-03-30

Family

ID=34688606

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200406394-7A SG150377A1 (en) 2003-11-07 2004-11-03 Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor

Country Status (6)

Country Link
JP (1) JP4319892B2 (en)
KR (1) KR100618640B1 (en)
CN (1) CN1300845C (en)
MY (1) MY140213A (en)
SG (1) SG150377A1 (en)
TW (1) TWI249222B (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100635053B1 (en) 2005-06-21 2006-10-16 도레이새한 주식회사 Adhesive tape for electronic components
JP4538398B2 (en) * 2005-10-31 2010-09-08 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
JP4505644B2 (en) * 2006-02-17 2010-07-21 フジコピアン株式会社 Fixed sheet
JP4505645B2 (en) * 2006-02-17 2010-07-21 フジコピアン株式会社 Affixing the fixed sheet
JP4505646B2 (en) * 2006-02-20 2010-07-21 フジコピアン株式会社 Fixed sheet
JP4505649B2 (en) * 2006-03-23 2010-07-21 フジコピアン株式会社 Fixed sheet
JP5067927B2 (en) * 2007-03-27 2012-11-07 日東電工株式会社 Adhesive film for semiconductor device manufacturing
KR100910672B1 (en) * 2007-08-03 2009-08-04 도레이새한 주식회사 Heat-resistant adhesive sheet
KR101073698B1 (en) 2009-09-07 2011-10-14 도레이첨단소재 주식회사 Lamination method of adhesive tape and lead frame
JP2011134851A (en) * 2009-12-24 2011-07-07 Hitachi Chem Co Ltd Semiconductor device, method for manufacturing the same, wiring base material for connecting semiconductor device, wiring board for mounting semiconductor device, and method for manufacturing the same
JP2011134960A (en) * 2009-12-25 2011-07-07 Hitachi Chem Co Ltd Semiconductor device, method for manufacturing the same, wiring base material for connecting semiconductor element, wiring board for mounting semiconductor device, and method for manufacturing the same
KR20110087547A (en) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 Manufacturing method of semiconductor device using a heat-resistant adhesive sheet
CN102386105B (en) * 2010-09-01 2016-02-03 群成科技股份有限公司 Four limit flat non-connection pin method for packing and the structure made thereof
CN104658923B (en) * 2010-09-01 2018-08-14 群成科技股份有限公司 Four side flat non-connection pin packaging methods and its manufactured structure
CN102386104B (en) * 2010-09-01 2014-11-12 群成科技股份有限公司 Quadrilateral flat pin-free encapsulation method
TWI510155B (en) * 2011-04-26 2015-11-21 Adl Engineering Inc Semiconductor package structure and method for fabricating the same
JP5687230B2 (en) * 2012-02-28 2015-03-18 信越化学工業株式会社 Wafer processing body, wafer processing member, wafer processing temporary adhesive, and thin wafer manufacturing method
JP5925560B2 (en) * 2012-04-02 2016-05-25 株式会社巴川製紙所 Mask sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
JP5824402B2 (en) * 2012-04-02 2015-11-25 株式会社巴川製紙所 Mask sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
KR101557841B1 (en) 2012-12-07 2015-10-06 제일모직주식회사 Anisotropic conductive film
JP6322026B2 (en) * 2014-03-31 2018-05-09 日東電工株式会社 Die bond film, die bond film with dicing sheet, semiconductor device, and method for manufacturing semiconductor device
CN105720021B (en) * 2016-01-25 2020-02-11 苏州日月新半导体有限公司 Integrated circuit package and method of manufacturing the same
JP6956492B2 (en) 2017-02-02 2021-11-02 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
WO2018159418A1 (en) * 2017-02-28 2018-09-07 住友ベークライト株式会社 Adhesive tape of use in processing of semiconductor substrate, and method for manufacturing semiconductor device
JP6909171B2 (en) 2018-02-12 2021-07-28 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
JP7187906B2 (en) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 Semiconductor device manufacturing method
JP7447647B2 (en) * 2020-04-06 2024-03-12 株式会社レゾナック Temporary protective film for semiconductor encapsulation molding and its manufacturing method, lead frame with temporary protective film, encapsulating molded body, and method for manufacturing a semiconductor package
CN115699273A (en) 2020-05-26 2023-02-03 株式会社巴川制纸所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
KR20230146529A (en) 2021-02-16 2023-10-19 가부시키가이샤 도모에가와 세이시쇼 Adhesive sheet for manufacturing semiconductor devices and method of manufacturing semiconductor devices using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093830A (en) * 2000-09-14 2002-03-29 Sony Corp Manufacturing method of chip-like electronic component, and manufacturing method of pseudo-wafer used for the manufacturing method
JP4173346B2 (en) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ Semiconductor device
US20030190466A1 (en) * 2002-04-03 2003-10-09 Katsuji Nakaba Adhesive sheet for producing semiconductor devices

Also Published As

Publication number Publication date
TWI249222B (en) 2006-02-11
MY140213A (en) 2009-11-30
JP2005142401A (en) 2005-06-02
TW200522252A (en) 2005-07-01
CN1300845C (en) 2007-02-14
JP4319892B2 (en) 2009-08-26
KR20050044259A (en) 2005-05-12
CN1617332A (en) 2005-05-18
KR100618640B1 (en) 2006-09-06

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