SG11201602207QA - Multi-layered polishing pads - Google Patents
Multi-layered polishing padsInfo
- Publication number
- SG11201602207QA SG11201602207QA SG11201602207QA SG11201602207QA SG11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing pads
- layered polishing
- layered
- pads
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| US201361918369P | 2013-12-19 | 2013-12-19 | |
| US201462019068P | 2014-06-30 | 2014-06-30 | |
| PCT/US2014/056966 WO2015048011A1 (en) | 2013-09-25 | 2014-09-23 | Multi-layered polishing pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201602207QA true SG11201602207QA (en) | 2016-04-28 |
Family
ID=52744387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201602207QA SG11201602207QA (en) | 2013-09-25 | 2014-09-23 | Multi-layered polishing pads |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10071459B2 (en) |
| EP (1) | EP3050082B1 (en) |
| JP (1) | JP6703939B2 (en) |
| KR (1) | KR102252673B1 (en) |
| CN (1) | CN105579194B (en) |
| SG (1) | SG11201602207QA (en) |
| TW (1) | TWI699257B (en) |
| WO (1) | WO2015048011A1 (en) |
Families Citing this family (41)
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| SG11201602206PA (en) * | 2013-09-25 | 2016-04-28 | 3M Innovative Properties Co | Composite ceramic abrasive polishing solution |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| KR102630261B1 (en) | 2014-10-17 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | Cmp pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| TWI689406B (en) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | Polishing pad and method of fabricating the same |
| KR20180008555A (en) * | 2015-05-13 | 2018-01-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polishing pads and systems and methods using them |
| CN106281219A (en) * | 2015-05-22 | 2017-01-04 | 江苏益林金刚石工具有限公司 | A kind of double dissolubility diamond multiple grinding cream of water oil and preparation method thereof |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| KR102629800B1 (en) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | Porous Chemical Mechanical Polishing Pads |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| KR20180112004A (en) * | 2016-02-16 | 2018-10-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polishing system, method of making and method of using same |
| US10773509B2 (en) | 2016-03-09 | 2020-09-15 | Applied Materials, Inc. | Pad structure and fabrication methods |
| JP6901297B2 (en) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | Polishing composition |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| EP3623402A4 (en) * | 2017-05-12 | 2021-06-23 | Kuraray Co., Ltd. | CHAIN EXTENSION, POLYURETHANE AND MODIFICATION PROCESS FOR IT, POLISHING LAYER, POLISHING PAD AND POLISHING PROCESS |
| US20210162559A1 (en) * | 2017-07-11 | 2021-06-03 | 3M Innovative Properties Company | Abrasive articles including conformable coatings and polishing system therefrom |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| CN111032284B (en) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | Microreplicated polished surfaces with enhanced coplanarity |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
| JP7273796B2 (en) | 2017-08-25 | 2023-05-15 | スリーエム イノベイティブ プロパティズ カンパニー | surface protrusion polishing pad |
| CN107639554B (en) * | 2017-11-10 | 2024-12-20 | 江苏瑞和磨料磨具有限公司 | A double-sided frosting cloth that can be used for rough grinding and polishing in one go |
| KR20200108098A (en) | 2018-02-05 | 2020-09-16 | 어플라이드 머티어리얼스, 인코포레이티드 | Piezoelectric endpointing for 3D printed CMP pads |
| US11826876B2 (en) | 2018-05-07 | 2023-11-28 | Applied Materials, Inc. | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
| US11738423B2 (en) * | 2018-07-31 | 2023-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and method |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| JP7420728B2 (en) * | 2018-09-28 | 2024-01-23 | 株式会社フジミインコーポレーテッド | Polishing pad and polishing method using it |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| KR102803330B1 (en) | 2019-09-04 | 2025-05-07 | 에스케이이노베이션 주식회사 | Etching composition, method for etching insulating layer of semiconductor devices using the same and method for preparing semiconductor devices |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| CN112429803A (en) * | 2020-11-02 | 2021-03-02 | 湖南长科诚享石化科技有限公司 | Emulsion breaking reactor |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN115157111B (en) * | 2022-07-13 | 2024-03-15 | 安徽禾臣新材料有限公司 | Polishing pad for glass processing and preparation method thereof |
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| KR102350350B1 (en) * | 2014-04-03 | 2022-01-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Polishing pads and systems and methods of making and using the same |
-
2014
- 2014-09-23 KR KR1020167010339A patent/KR102252673B1/en active Active
- 2014-09-23 US US14/915,650 patent/US10071459B2/en active Active
- 2014-09-23 SG SG11201602207QA patent/SG11201602207QA/en unknown
- 2014-09-23 JP JP2016516918A patent/JP6703939B2/en active Active
- 2014-09-23 EP EP14848991.7A patent/EP3050082B1/en active Active
- 2014-09-23 CN CN201480052077.1A patent/CN105579194B/en active Active
- 2014-09-23 WO PCT/US2014/056966 patent/WO2015048011A1/en active Application Filing
- 2014-09-24 TW TW103133088A patent/TWI699257B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3050082B1 (en) | 2021-05-05 |
| JP6703939B2 (en) | 2020-06-03 |
| TW201532731A (en) | 2015-09-01 |
| US20160229023A1 (en) | 2016-08-11 |
| WO2015048011A1 (en) | 2015-04-02 |
| JP2016538139A (en) | 2016-12-08 |
| EP3050082A4 (en) | 2017-05-17 |
| TWI699257B (en) | 2020-07-21 |
| CN105579194A (en) | 2016-05-11 |
| KR102252673B1 (en) | 2021-05-18 |
| KR20160060691A (en) | 2016-05-30 |
| US10071459B2 (en) | 2018-09-11 |
| CN105579194B (en) | 2019-04-26 |
| EP3050082A1 (en) | 2016-08-03 |
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