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SG11201504886SA - Implantable medical device for minimally-invasive insertion - Google Patents

Implantable medical device for minimally-invasive insertion

Info

Publication number
SG11201504886SA
SG11201504886SA SG11201504886SA SG11201504886SA SG11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA
Authority
SG
Singapore
Prior art keywords
minimally
medical device
implantable medical
invasive insertion
invasive
Prior art date
Application number
SG11201504886SA
Inventor
Robert Farra
Original Assignee
Microchips Biotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microchips Biotech Inc filed Critical Microchips Biotech Inc
Publication of SG11201504886SA publication Critical patent/SG11201504886SA/en

Links

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61MDEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M5/00Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests
    • A61M5/14Infusion devices, e.g. infusing by gravity; Blood infusion; Accessories therefor
    • A61M5/168Means for controlling media flow to the body or for metering media to the body, e.g. drip meters, counters ; Monitoring media flow to the body
    • A61M5/172Means for controlling media flow to the body or for metering media to the body, e.g. drip meters, counters ; Monitoring media flow to the body electrical or electronic
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/07Endoradiosondes
    • A61B5/076Permanent implantation
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/48Other medical applications
    • A61B5/4836Diagnosis combined with treatment in closed-loop systems or methods
    • A61B5/4839Diagnosis combined with treatment in closed-loop systems or methods combined with drug delivery
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biomedical Technology (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Medicinal Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Chemical & Material Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Vascular Medicine (AREA)
  • Hematology (AREA)
  • Anesthesiology (AREA)
  • Electrotherapy Devices (AREA)
  • Cardiology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Prostheses (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
SG11201504886SA 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion SG11201504886SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261745086P 2012-12-21 2012-12-21
PCT/US2013/076849 WO2014100555A1 (en) 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion

Publications (1)

Publication Number Publication Date
SG11201504886SA true SG11201504886SA (en) 2015-07-30

Family

ID=49943576

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504886SA SG11201504886SA (en) 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion

Country Status (9)

Country Link
US (1) US9919103B2 (en)
EP (1) EP2934289B1 (en)
JP (1) JP6435272B2 (en)
KR (1) KR102142912B1 (en)
CN (1) CN104869888B (en)
AU (1) AU2013361154B2 (en)
CA (1) CA2895235C (en)
SG (1) SG11201504886SA (en)
WO (1) WO2014100555A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10601121B2 (en) * 2017-05-09 2020-03-24 Verily Life Sciences Llc Slot antenna for in-body ISM-band communication
WO2019103732A1 (en) * 2017-11-22 2019-05-31 Hewlett-Packard Development Company, L.P. Multizonal microfluidic devices
BR112022007471A2 (en) * 2019-11-01 2022-07-12 Dare Mb Inc DEVICE AND METHODS FOR DRUG DISTRIBUTION BY TWO-STAGE MICROCHIP

Family Cites Families (44)

* Cited by examiner, † Cited by third party
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US5782891A (en) 1994-06-16 1998-07-21 Medtronic, Inc. Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body
US5797898A (en) 1996-07-02 1998-08-25 Massachusetts Institute Of Technology Microchip drug delivery devices
US7070590B1 (en) 1996-07-02 2006-07-04 Massachusetts Institute Of Technology Microchip drug delivery devices
US6052623A (en) 1998-11-30 2000-04-18 Medtronic, Inc. Feedthrough assembly for implantable medical devices and methods for providing same
WO2001012157A1 (en) 1999-08-18 2001-02-22 Microchips, Inc. Thermally-activated microchip chemical delivery devices
WO2001035928A1 (en) 1999-11-17 2001-05-25 Microchips, Inc. Microfabricated devices for the delivery of molecules into a carrier fluid
ATE323470T1 (en) 1999-12-10 2006-05-15 Massachusetts Inst Technology MICROCHIP DRUG DELIVERY SYSTEMS AND METHODS OF MANUFACTURING
US6455930B1 (en) 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6551838B2 (en) 2000-03-02 2003-04-22 Microchips, Inc. Microfabricated devices for the storage and selective exposure of chemicals and devices
EP1339312B1 (en) 2000-10-10 2006-01-04 Microchips, Inc. Microchip reservoir devices using wireless transmission of power and data
US6773429B2 (en) 2000-10-11 2004-08-10 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
EP1372602B1 (en) 2001-01-09 2007-04-18 Microchips, Inc. Flexible microchip devices for ophthalmic and other applications
US6973718B2 (en) * 2001-05-30 2005-12-13 Microchips, Inc. Methods for conformal coating and sealing microchip reservoir devices
US6875208B2 (en) 2001-05-31 2005-04-05 Massachusetts Institute Of Technology Microchip devices with improved reservoir opening
CA2451953A1 (en) 2001-06-28 2003-04-24 Microchips, Inc. Methods for hermetically sealing microchip reservoir devices
WO2003048665A1 (en) 2001-12-03 2003-06-12 Massachusetts Institute Of Technology Microscale lyophilization and drying methods for the stabilization of molecules
US6953455B2 (en) * 2002-07-30 2005-10-11 Hospira, Inc. Medicine delivery system
JP4436258B2 (en) 2002-08-16 2010-03-24 マイクロチップス・インコーポレーテッド Controlled release device and method
US7497855B2 (en) 2002-09-04 2009-03-03 Microchips, Inc. Method and device for the controlled delivery of parathyroid hormone
SE0202681D0 (en) 2002-09-10 2002-09-10 Frank Niklaus Hermetic sealing with combined adhesive bonding and sealing rings
AU2003278881A1 (en) 2002-09-23 2004-04-08 Microchips, Inc. Micro-reservoir osmotic release systems and microtube array device
EP1551499A1 (en) 2002-10-04 2005-07-13 Microchips, Inc. Medical device for neural stimulation and controlled drug delivery
EP1551505B1 (en) * 2002-10-04 2010-02-24 Microchips, Inc. Medical device for controlled drug delivery and cardiac monitoring and/or stimulation
US20040186528A1 (en) * 2003-03-20 2004-09-23 Medtronic, Inc. Subcutaneous implantable medical devices with anti-microbial agents for chronic release
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AU2005304910B2 (en) * 2004-11-04 2010-11-18 Microchips, Inc. Compression and cold weld sealing methods and devices
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AU2006209223B2 (en) * 2005-01-27 2012-04-12 Cochlear Limited Implantable medical device
EP1903000B1 (en) * 2006-09-25 2019-09-18 Sorin CRM SAS Implantable biocompatible component including an integrated active element such as a sensor for measuring a physiological parameter, electromechanical microsystem or electronic circuit
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US8285387B2 (en) 2008-12-12 2012-10-09 Microchips, Inc. Wireless communication with a medical implant
US8604810B2 (en) 2009-10-16 2013-12-10 Microchips, Inc. Multi-channel potentiostat for biosensor arrays
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Also Published As

Publication number Publication date
CN104869888A (en) 2015-08-26
EP2934289A1 (en) 2015-10-28
JP6435272B2 (en) 2018-12-05
US20140180262A1 (en) 2014-06-26
AU2013361154B2 (en) 2017-02-02
KR102142912B1 (en) 2020-08-10
CA2895235C (en) 2020-12-29
EP2934289B1 (en) 2018-04-25
AU2013361154A1 (en) 2015-07-02
CN104869888B (en) 2017-12-19
WO2014100555A1 (en) 2014-06-26
KR20150098630A (en) 2015-08-28
US9919103B2 (en) 2018-03-20
JP2016506275A (en) 2016-03-03
CA2895235A1 (en) 2014-06-26

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