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SG11201408001YA - Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system - Google Patents

Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Info

Publication number
SG11201408001YA
SG11201408001YA SG11201408001YA SG11201408001YA SG11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA
Authority
SG
Singapore
Prior art keywords
heat
international
computer system
heat pipe
parts
Prior art date
Application number
SG11201408001YA
Inventor
John Alexander Wilson
Robert Haden Garrett
Original Assignee
Razer Asia Pacific Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Razer Asia Pacific Pte Ltd filed Critical Razer Asia Pacific Pte Ltd
Publication of SG11201408001YA publication Critical patent/SG11201408001YA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 6 March 2014 (06.03.2014) WIPOIPCT (10) International Publication Number WO 2014/035362 A1 (51) International Patent Classification: G06F1/16 (2006.01) G06F1/20 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/US2012/052424 27 August 2012 (27.08.2012) English English (71) Applicant (for all designated States except US): RAZER (ASIA-PACIFIC) PTE. LTD. [SG/SG]; 514 Chai Chee Lane, #07-05, Singapore 469029 (SG). (72) Inventors; and (75) Inventors/Applicants (for US only)-. WILSON, John, Al­ exander [CA/US]; 110 Moreland Street, San Francisco, CA 94131 (US). GARRETT, Robert, Haden [US/US]; 1204 19th Street, San Francisco, CA 94107 (US). (84) AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). (74) Agent: JOHNSON, Michael; C/o Viering, Jentschura & Published: Partner, 3770 Highland Ave, Suite 203, Manhattan Beach, CA 90266 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, with international search report (Art. 21(3)) (54) Title: COMPUTER SYSTEMS, PARTS OF A HOUSING FOR A COMPUTER SYSTEM, HEAT EXCHANGERS, AND METHODS FOR ASSEMBLING PARTS OF A COMPUTER SYSTEM if ™ 00 El FIG 9 900 J CJ m m o o CJ o & 902 (57) Abstract: According to various embodiments, computer a system may be provided. The computer system may include: hous a - ing with protrusion; heat generating device; heat exchanger; and heat a a a a pipe configured to transfer heat from first a end of the heat pipe to a second end of the heat pipe. The first end of the heat pipe may be coupled to the heat generating device. The second end of the heat pipe may be coupled the to heat exchanger. The second end of the heat pipe may be arranged in the protrusion of the housing.
SG11201408001YA 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system SG11201408001YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/052424 WO2014035362A1 (en) 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Publications (1)

Publication Number Publication Date
SG11201408001YA true SG11201408001YA (en) 2015-01-29

Family

ID=50184009

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408001YA SG11201408001YA (en) 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Country Status (7)

Country Link
US (1) US9665139B2 (en)
EP (1) EP2888640A4 (en)
CN (1) CN104412196B (en)
AU (1) AU2012388764B2 (en)
SG (1) SG11201408001YA (en)
TW (1) TWI621940B (en)
WO (1) WO2014035362A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201609165QA (en) * 2014-05-20 2016-12-29 Razer Asia Pacific Pte Ltd Housing for a computer system, parts of a housing for a computer system, and methods for increasing an airflow in a housing of a computer system
CN105357937A (en) * 2015-11-30 2016-02-24 英业达科技有限公司 Electronic device
CN107102710A (en) * 2017-06-28 2017-08-29 昆山特酷信息科技有限公司 The cooling system of notebook computer
USD901485S1 (en) * 2018-02-05 2020-11-10 Huawei Technologies Co., Ltd. Computer
US11503743B2 (en) * 2021-03-12 2022-11-15 Baidu Usa Llc High availability fluid connector for liquid cooling
CN113107885B (en) * 2021-04-08 2022-04-12 合肥联宝信息技术有限公司 Heat dissipation structure and heat dissipation method for bottom surface of notebook computer

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US6352103B1 (en) 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US6288895B1 (en) 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US5986882A (en) 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
US6122167A (en) * 1998-06-02 2000-09-19 Dell Usa, L.P. Integrated hybrid cooling with EMI shielding for a portable computer
US6353536B1 (en) 1998-06-25 2002-03-05 Kabushiki Kaisha Toshiba Electronic equipment system and extension device for expanding the functions of electronic equipment
US6181553B1 (en) * 1998-09-04 2001-01-30 International Business Machines Corporation Arrangement and method for transferring heat from a portable personal computer
US6141215A (en) 1999-01-12 2000-10-31 Dell Usa, L.P. Hybrid cooling heat exchanger fin geometry and orientation
US6266241B1 (en) 1999-09-29 2001-07-24 Hewlett-Packard Company Notebook computer with ergonomic stand
JP3634825B2 (en) * 2002-06-28 2005-03-30 株式会社東芝 Electronics
US20040201958A1 (en) 2003-04-14 2004-10-14 Lev Jeffrey A. System and method for cooling an electronic device
US20050145371A1 (en) 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
JP4377742B2 (en) 2004-04-30 2009-12-02 株式会社東芝 Electronic device having a radiator, a cooling device, and a cooling device
CN100530616C (en) * 2005-09-23 2009-08-19 富准精密工业(深圳)有限公司 Radiating module
TWI267346B (en) 2005-09-23 2006-11-21 Foxconn Tech Co Ltd Thermal module
US7529085B2 (en) 2006-06-30 2009-05-05 Lenovo (Singapore) Pte. Ltd. Thermal docking fansink
WO2009043240A1 (en) 2007-09-29 2009-04-09 Biao Qin Flat heat pipe radiator and application thereof
US7969730B1 (en) * 2008-02-08 2011-06-28 Motion Computer, Inc. Portable computer with thermal control and power source shield
US9754857B2 (en) 2009-03-23 2017-09-05 Hewlett-Packard Development Company, L.P. Folded fin heat transfer device
US20110292605A1 (en) 2010-06-01 2011-12-01 Kuan-Chih Chen Heat-dissipating hinge and a portable electronic device with the same
JP5254416B2 (en) * 2011-09-30 2013-08-07 株式会社東芝 Electronics

Also Published As

Publication number Publication date
CN104412196A (en) 2015-03-11
EP2888640A4 (en) 2016-01-20
TW201409215A (en) 2014-03-01
EP2888640A1 (en) 2015-07-01
US20150170993A1 (en) 2015-06-18
CN104412196B (en) 2019-04-30
AU2012388764A1 (en) 2015-01-29
WO2014035362A1 (en) 2014-03-06
AU2012388764B2 (en) 2016-02-18
TWI621940B (en) 2018-04-21
US9665139B2 (en) 2017-05-30

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