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SG10202012309RA - Resist composition and method of forming resist pattern - Google Patents

Resist composition and method of forming resist pattern

Info

Publication number
SG10202012309RA
SG10202012309RA SG10202012309RA SG10202012309RA SG10202012309RA SG 10202012309R A SG10202012309R A SG 10202012309RA SG 10202012309R A SG10202012309R A SG 10202012309RA SG 10202012309R A SG10202012309R A SG 10202012309RA SG 10202012309R A SG10202012309R A SG 10202012309RA
Authority
SG
Singapore
Prior art keywords
resist
forming
resist pattern
composition
resist composition
Prior art date
Application number
SG10202012309RA
Inventor
Hirano Tomoyuki
Hirayama Fumitake
NOMURA Kana
KOHNO Shinichi
Nakagawa Yusuke
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of SG10202012309RA publication Critical patent/SG10202012309RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
SG10202012309RA 2019-12-10 2020-12-09 Resist composition and method of forming resist pattern SG10202012309RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019223096A JP7479139B2 (en) 2019-12-10 2019-12-10 Resist composition and method for forming resist pattern

Publications (1)

Publication Number Publication Date
SG10202012309RA true SG10202012309RA (en) 2021-07-29

Family

ID=76234745

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202012309RA SG10202012309RA (en) 2019-12-10 2020-12-09 Resist composition and method of forming resist pattern

Country Status (4)

Country Link
JP (1) JP7479139B2 (en)
KR (1) KR20210073472A (en)
CN (1) CN112946998A (en)
SG (1) SG10202012309RA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118613766A (en) 2022-01-24 2024-09-06 东京应化工业株式会社 Resist composition and resist pattern forming method
JP2023171305A (en) 2022-05-20 2023-12-01 東京応化工業株式会社 Resist composition and resist pattern forming method
JP2024146580A (en) 2023-03-31 2024-10-15 富士フイルム株式会社 Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device
JP2024162550A (en) * 2023-05-10 2024-11-21 東京応化工業株式会社 Resist composition and method for forming resist pattern

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203995B2 (en) * 1993-12-24 2001-09-04 ジェイエスアール株式会社 Radiation-sensitive resin composition
JP3895224B2 (en) 2001-12-03 2007-03-22 東京応化工業株式会社 Positive resist composition and resist pattern forming method using the same
JP4318945B2 (en) 2003-04-07 2009-08-26 東京応化工業株式会社 Chemical amplification type positive photoresist composition for thick film, thick film photoresist laminate, method for producing thick film resist pattern, and method for producing connection terminal
JP6564196B2 (en) 2014-03-20 2019-08-21 東京応化工業株式会社 Chemical amplification type positive photosensitive resin composition for thick film
TWI696891B (en) 2015-12-09 2020-06-21 日商住友化學股份有限公司 Photoresist composition and process for producing photoresist pattern
JP2017116880A (en) 2015-12-25 2017-06-29 富士フイルム株式会社 Active ray sensitive or radiation sensitive resin composition, active ray sensitive or radiation sensitive film, pattern formation method and manufacturing method of electronic device

Also Published As

Publication number Publication date
CN112946998A (en) 2021-06-11
JP7479139B2 (en) 2024-05-08
JP2021092659A (en) 2021-06-17
KR20210073472A (en) 2021-06-18

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